JP4193415B2 - Optical communication module - Google Patents

Description

[0001]
The present invention relates to an optical communication module.
[0002]
[Prior art]
The optical communication module includes a light emitting element (for example, a laser diode (also referred to as a laser chip)) serving as a light source in optical digital communication, a light receiving element (for example, a photodiode (PD)) for monitoring the light amount of the light emitting element, and a light emitting element drive. For example, and these are mounted on a laser chip carrier. Conventionally, there has been a strong demand for miniaturization of this optical communication module, and Japanese Patent Application Laid-Open No. 2000-91695 proposes an optical communication module that is small in size and excellent in high-speed performance and can be reduced in cost.
[0003]
On the other hand, in the conventional optical communication module, the light emitting element, the light receiving element, and the IC are generally arranged on the same plane of the laser chip carrier, and the optical communication module described in the above publication also adopts such a configuration. is doing.
[0004]
[Problems to be solved by the invention]
However, since it is necessary to arrange the light emitting element and the IC closest to each other to shorten the signal line of the control signal and reduce the inductance, when the light emitting element, the light receiving element, and the IC are arranged on the same plane as described above, for example, As shown in FIG. That is, in the vicinity of the rear end of the light emitting element 90 (the end on the right front side opposite to the optical system (lens 96, lens holding component 98 and fixed component 100) in FIG. 7), a light receiving element 92 for light monitoring, Although it is necessary to arrange the IC 94 for driving the light emitting element, since the IC 94 sufficiently larger than the light emitting element 90 is arranged on the same plane, the light receiving element 92 is opposed to the light emitting element 90 with the IC 94 interposed therebetween. As a result, the distance between the light emitting element 90 and the light receiving element 92 becomes long. Therefore, there is a problem that it is difficult to secure a sufficient amount of light necessary for the light receiving element for monitoring.
[0005]
The present invention has been made to solve the above problems, provided with raising the degree of integration of the peripheral light-emitting element, a light communication module capable of securing a sufficient amount of light required for the light receiving element for monitoring The purpose is to do.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, an optical communication module according to the present invention includes a light emitting element and a light receiving element for receiving monitor light from the light emitting element and monitoring the light quantity of the light emitting element. In an optical communication module configured to include an element, an IC that drives the light emitting element, and a light emitting element mounting member on which the light emitting element, the light receiving element, and the IC are mounted, the light emitting element mounting member has a surface on which the IC is mounted, With respect to the surface on which the light emitting element is mounted, the light emitting element mounting member has a member on which the light receiving element is mounted, and the member is a surface on which the IC is mounted. The light receiving surface of the light receiving element that is erected on and mounted on the member is disposed on the optical path of the monitor light, and is disposed so as to deviate from the vertical direction by a predetermined angle with respect to the optical axis of the monitor light. To do.
[0012]
The present invention can also be understood as an invention relating to the following optical communication module. That is, the optical communication module according to the present invention, as described in claim 2, a light emitting element, a light receiving element for monitoring the light quantity of the received light emitting element monitor light from the light emitting element, a light-emitting element In an optical communication module configured to include an IC to be driven and a light emitting element, a light receiving element, and a light emitting element mounting member on which the IC is mounted, the surface on which the IC is mounted is the surface on which the light emitting element is mounted. In contrast, the light- emitting element mounting member has a housing having a light-receiving element inside, and the housing is a monitor of the inner surface of the housing. The side surface parallel to the optical axis of light has a pair of opposed protrusions, and the pair of protrusions supports a light receiving element arrangement member for arranging the light receiving element, and receives light of the light receiving element arranged by the light receiving element arrangement member. The surface is on the optical path of the monitor light It is disposed, and characterized in that the optical axis of the monitor light is arranged to be shifted a predetermined angle from the vertical.
[0013]
In this case, the surface on which the IC is mounted is inclined at a predetermined angle below the optical axis direction of the monitor light with respect to the surface on which the light emitting element is mounted. The IC and the surface on which the IC is mounted are less susceptible to interference, and a sufficient amount of light can be secured in the light receiving element.
[0014]
On the other hand, since the surface on which the IC is mounted is inclined with respect to the surface on which the light emitting element is mounted, a space is formed above the inclined IC mounting surface. By arranging the light receiving element on the optical path of the monitor light in this space, the light emitting element and the light receiving element can be arranged close to each other. Of course, even if it arrange | positions in this way, it will not become an obstacle to arrange | positioning a light emitting element and IC close.
[0015]
As described above, according to the present invention, the distance between the light emitting element and the light receiving element and the distance between the light emitting element and the IC can be shortened, and the degree of integration around the light emitting element can be increased. Contributes to further miniaturization. At the same time, the interference with the monitor light by the IC and the surface on which the IC is mounted can be reduced, and a sufficient amount of light can be secured in the light receiving element.
[0016]
Here, as described in claim 3 , it is desirable that the predetermined angle is configured to be larger than the emission angle of the monitor light from the light emitting element. The emission angle of the monitor light here is the angle β shown in FIG. 2, that is, the angle β formed by the outer edge portion (for example, the lowermost edge portion) and the optical axis direction A in the entire irradiation range θ of the monitor light. means. As an example, the emission angle β of the monitor light is 10 degrees. In this case, by configuring such that the IC mounting surface 16B of FIG. 2 is an inclination angle α which forms with respect to the mounting surface 16A of the light emitting element is larger than output angle β of the monitor light from the light emitting element 12, emitted from the light emitting element Of the monitor light, the light traveling downward is not subject to interference by the IC and the surface on which the IC is mounted, so that interference can be avoided and a larger amount of light can be secured in the light receiving element.
[0017]
In the optical communication module, as described in claim 4 , the light receiving surface of the light receiving element is arranged on the optical path of the monitor light in the space formed above the inclined IC mounting surface. desirable. In other words, by effectively using the space formed above the inclined IC mounting surface described above and arranging the light receiving element on the optical path of the monitor light in the space, there is a problem in shortening the distance between the light emitting element and the IC. Thus, the distance between the light emitting element and the light receiving element can be shortened.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, with reference to the drawings will be described embodiments of an optical communication module according to the present invention.
[0019]
[First Embodiment]
First, the first embodiment will be described with reference to FIGS.
[0020]
FIG. 1 shows a light emitting element 12 such as a laser diode (LD), an IC 14 for driving the light emitting element 12, and a base 16 on which the light emitting element 12 and the IC 14 are mounted in the optical communication module of the present embodiment. Show. FIG. 2 shows an arrangement state of the light receiving element (for example, photodiode (PD)) 18 for receiving the monitor light from the light emitting element 12 and monitoring the light quantity of the light emitting element 12, the base 16 in FIG. The figure projected from the near side of FIG. 1 is shown, and FIG. 3 shows a configuration for arranging the light receiving element 18.
[0021]
As shown in FIG. 1, the light emitting element 12 is installed on the surface 16 </ b> A, and the IC 14 is installed on the surface 16 </ b> B adjacent to the surface 16 </ b> A so as to be close to the light emitting element 12. Although the control signal line 20 is provided between the light emitting element 12 and the IC 14, the length of the control signal line 20 can be kept short because the light emitting element 12 and the IC 14 are close to each other. 2, the lens 17A, a lens holding component 17B that holds the lens 17A, and a fixing component that fixes the lens holding component 17B to the base 16 are provided on the left side of the base 16 in FIG. 17C, and the laser light from the light emitting element 12 enters the lens 17A through the hole 16C.
[0022]
As is apparent from FIGS. 1 and 2, the surface (IC mounting surface) 16B on which the IC 14 is mounted on the base 16 is compared with the surface (light emitting element mounting surface) 16A on which the light emitting element is mounted. It is configured to be inclined by a predetermined angle α below the optical axis direction (the direction of arrow A in FIG. 2). The predetermined angle α is set to be larger than the emission angle β of monitor light from the light emitting element 12 (for example, 10 degrees).
[0023]
As described above, the IC mounting surface 16B is inclined downward by a predetermined angle α with respect to the light emitting element mounting surface 16A. The interference with the 16B is reduced, and a sufficient amount of light can be secured in the light receiving element 18. In addition, since the predetermined angle α is set to be larger than the emission angle β of the monitor light, the downward light of the monitor light emitted from the light emitting element 12 is not interfered by the IC 14 and the IC mounting surface 16B. Thus, a larger amount of light can be secured in the light receiving element 18.
[0024]
On the other hand, since the IC mounting surface 16B is inclined with respect to the light emitting element mounting surface 16A as described above, a space is formed above the inclined IC mounting surface 16B. Therefore, in this embodiment, as shown in FIG. 2, the light receiving element 18 is arranged on the optical path of the monitor light in this space.
[0025]
Specifically, as shown in FIG. 3, a pair of opposing light receiving element supporting protrusions 24 are provided on the side surface 22A parallel to the optical axis of the monitor light in the inner surface of the housing 22 of the optical communication module 10. By supporting the light receiving element arrangement member 26 by the protruding portion 24, the light receiving element 18 is arranged on the optical path of the monitor light in the space above the IC mounting surface 16B.
[0026]
As described above, the light receiving element 18 is disposed close to the light emitting element 12 by effectively using the space above the inclined IC mounting surface 16B. Of course, even if it arrange | positions in this way, it will not become an obstacle to arrange | position the light emitting element 12 and IC14 closely.
[0027]
As described above, according to the first embodiment, the distance between the light emitting element 12 and the light receiving element 18 can be shortened so as not to hinder the shortening of the distance between the light emitting element 12 and the IC 14. Since the degree of integration around the element 12 can be increased, it contributes to further miniaturization of the optical communication module 10. At the same time, interference with monitor light by the IC 14 and the IC mounting surface 16B can be avoided, and a sufficient amount of light can be secured in the light receiving element 18.
[0028]
In the first embodiment, since the light emitting element 12 and the IC 14 are mounted on the base 16 and the light receiving element 18 is supported and installed by the protruding portion 24 of the housing 22, the base 16 and the housing 22 are installed. And the protrusion part 24 respond | corresponds to the light emitting element mounting member which concerns on this invention.
[0029]
[Second Embodiment]
Next, a second embodiment will be described. In the second embodiment, another embodiment for disposing the light receiving element 18 close to the light emitting element 12 on the IC mounting surface 16B will be described.
[0030]
FIG. 4 shows the light emitting element 12, the IC 14, the light receiving element 18, and the base 16 on which these are mounted in the optical communication module 10 of the present embodiment. FIG. 5 shows a projection of the arrangement state of the light receiving element 18 and the base 16 of FIG. 1 from the front side of FIG. 4, and FIG. 6 shows the shape of the member 28 on which the light receiving element 18 is mounted. 4 and 5, the configuration of the optical system (the lens 17A, the lens holding component 17B, and the fixed component 17C) is the same as the configuration of FIGS. 1 and 2 described above.
[0031]
As shown in FIGS. 4 and 5, the member 28 having the pair of legs 28A shown in FIG. 6 and mounting the light receiving element 18 on the surface 28B is placed on the inclined IC mounting surface 16B as in the first embodiment. Stand up (that is, stand upright with respect to the IC mounting surface 16B). At this time, of course, the light receiving element 18 is arranged so as to be positioned on the optical path of the monitor light. Further, since the leg portion 28A of the member 28 is disposed on both sides of the IC 14 (on the front side and the back side with respect to the IC 14 in FIG. 4), it is possible to avoid an obstacle to the arrangement of the IC 14 on the IC mounting surface 16B. The
[0032]
According to the configuration of the second embodiment, the light receiving element 18 emits light above the IC mounting surface 16B so that the arrangement of the IC 14 for shortening the distance between the light emitting element 12 and the IC 14 is not hindered. It can be placed close to the element 12. Similarly to the first embodiment, the monitor light emitted from the light emitting element 12 does not receive interference by the IC 14 and the IC mounting surface 16B with respect to the downward light, so that interference is avoided and a larger amount of light is obtained. Can be secured in the light receiving element 18.
[0033]
4 and 5, since the member 28 is erected on the inclined IC mounting surface 16B, the light receiving surface of the light receiving element 18 is shifted from the vertical direction by a predetermined angle with respect to the optical axis of the monitor light. Is arranged. Accordingly, the inclined IC mounting surface 16B can be effectively used, and the light receiving surface of the light receiving element 18 can be disposed so as to be deviated from the vertical direction by a predetermined angle with respect to the optical axis of the monitor light with a simple configuration. Reflection from the element 18 to the light emitting element 12 can be avoided.
[0034]
In the second embodiment, the base 16 and the member 28 correspond to the light emitting element mounting member according to the present invention.
[0035]
【The invention's effect】
As described above, according to the present invention, the surface on which the IC is mounted is inclined at a predetermined angle below the optical axis direction of the monitor light with respect to the surface on which the light emitting element is mounted. And the distance between the light emitting element and the IC can be shortened, and a sufficient amount of light can be secured in the light receiving element.
[Brief description of the drawings]
FIG. 1 is a perspective view showing the configuration of a base and the arrangement of light emitting elements and ICs in a first embodiment.
FIG. 2 is a diagram showing a relative arrangement of light emitting elements, light receiving elements, and ICs in the first embodiment.
FIG. 3 is a diagram showing a configuration for arranging light receiving elements in the first embodiment.
FIG. 4 is a perspective view showing a configuration of a base and an arrangement of a light emitting element, a light receiving element, and an IC in a second embodiment.
FIG. 5 is a diagram illustrating a relative arrangement of a light emitting element, a light receiving element, and an IC in a second embodiment.
FIG. 6 is a diagram showing the shape of a member on which a light receiving element is mounted in the second embodiment.
FIG. 7 is a diagram illustrating an arrangement example of a conventional light emitting element, light receiving element, and IC.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Optical communication module, 12 ... Light emitting element, 14 ... IC, 16 ... Base, 16A ... Light emitting element mounting surface, 16B ... IC mounting surface, 16C ... Hole, 17A ... Lens, 17B ... Lens holding component, 17C ... Fixed Components, 18 ... light receiving element, 20 ... control signal line, 22 ... housing, 22A ... side surface, 24 ... projection, 26 ... light receiving element arrangement member, 28 ... member, 28A ... leg part, 28B ... surface, 90 ... light emission Element: 92 ... Light receiving element, 94 ... IC, 96 ... Lens, 98 ... Lens holding component, 100 ... Fixed component.

Claims (4)

A light emitting element, a light receiving element for receiving monitor light from the light emitting element and monitoring the light quantity of the light emitting element, an IC for driving the light emitting element, the light emitting element, the light receiving element, and a light emitting element on which the IC is mounted In an optical communication module configured to include a mounting member,
The light emitting element mounting member is configured such that the surface on which the IC is mounted is inclined at a predetermined angle below the optical axis direction of the monitor light with respect to the surface on which the light emitting element is mounted .
The light emitting element mounting member has a member on which the light receiving element is mounted,
The member is erected on the surface on which the IC is mounted,
The light receiving surface of the light receiving element mounted on the member is disposed on the optical path of the monitor light and is disposed so as to be deviated from the vertical direction by a predetermined angle with respect to the optical axis of the monitor light. Communication module. A light emitting element, a light receiving element for receiving monitor light from the light emitting element and monitoring the light quantity of the light emitting element, an IC for driving the light emitting element, the light emitting element, the light receiving element, and a light emitting element on which the IC is mounted In an optical communication module configured to include a mounting member,
The light emitting element mounting member is configured such that the surface on which the IC is mounted is inclined at a predetermined angle below the optical axis direction of the monitor light with respect to the surface on which the light emitting element is mounted .
The light emitting element mounting member has a housing having the light receiving element therein,
The housing includes a pair of opposed protrusions on a side surface parallel to the optical axis of the monitor light in the inner surface of the housing,
The pair of protrusions support a light receiving element arrangement member for arranging the light receiving elements,
The light receiving surface of the light receiving element arranged by the light receiving element arranging member is arranged on an optical path of the monitor light and arranged so as to be deviated from the vertical direction by a predetermined angle with respect to the optical axis of the monitor light. Optical communication module. Wherein the predetermined angle is, the optical communication module according to claim 1 or 2, wherein greater than the emission angle of the monitor light from the light emitting element. Receiving surface of the light receiving element, optical communication according to claim 1, characterized in that said disposed on an optical path of the monitor light in the tilted formed above the space of the IC mounting surface module.

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