JP4181112B2 - Substrate height reference point automatic setting method - Google Patents

Description

  The present invention relates to an automatic generation method of height measurement reference point data in an appearance inspection of an electronic product substrate mounted on a circuit board such as a printed circuit board.

  Conventionally, in the appearance inspection after mounting electronic components on a printed circuit board, component displacement from the mounting position of the electronic component, inspection of missing parts, electronic component floating from the printed circuit board surface, solder open, short measurement, printed circuit board The height of the electronic component from the surface is measured.

  The printed circuit board is warped and may not be flat. In measuring the height of an electronic component, to accurately measure the height of the electronic component, a method for setting a reference point for the component height in the vicinity of the electronic component Has been taken. As the reference point setting method, a method of setting a part having a certain luminance or more as a height reference point in an appearance inspection machine for product substrates is adopted.

  This height measurement reference point setting method is a method of recognizing an image of a printed board and extracting an arbitrary point on the board having a certain luminance or more as a height reference point. (For example, refer to Patent Document 1).

FIG. 13 is a flowchart showing a conventional method for creating a substrate height reference point described in Patent Document 1. In the figure, at 31 a component-mounted board is prepared, and at 32, the component-mounted board is image-recognized by an inspection apparatus, so that a place 33 having a certain level of brightness is set as a reference point for board height. Create height reference point data.
Japanese Patent Laid-Open No. 6-11321 (2-3 pages, FIG. 2)

  However, such a height reference point creation method has the following problems. That is, the lead time from the development of the product substrate, design trial manufacture to the start of mass production is required to be further shortened as the product life cycle is shortened.

  However, in the above method, in order to create the height reference point data, a product board on which components are mounted is necessary, and the product board cannot be prepared unless it is close to the start of mass production. Immediately before the start of mass production. In addition, since the height reference point is set based on the product substrate, the reference such as the reference mark for adjusting the printed circuit board or the brightness setting may vary depending on the completion accuracy of the product substrate. As a result, there is a problem that the height reference point needs to be adjusted and the mass production start-up is delayed.

  For this reason, a method of creating board height reference point data using printed circuit board design CAD has been developed before mass production is started. The height reference point is generated many times, and the height reference point is not uniformly generated on the entire printed circuit board. The height reference point is not set on the line having the minimum pattern width, and the recommended area is 0.16 × 0.16. In this case, even if a square ground point having a width of 0.16 mm is set on a line pattern having a width of 0.1 mm as shown in FIG. Since it is as small as 1 × 0.16, there is a problem that sufficient luminance cannot be obtained and erroneous determination is likely to occur.

  In the case of large parts such as QFP and SOP, it is desirable to set a height reference point in the vicinity of the part, but the height reference point is not necessarily set in the vicinity of the part, and is not in the shadow area. There was a problem that the setting might occur.

  The present invention solves the above-described conventional problems, and by automatically generating a height reference point (ground point), the debugging time is shortened, and the design data is used in the reference point data generation, thereby providing a board. It is possible to eliminate the variation of the reference point due to the variation of the operator, to eliminate the inspection variation due to the skill level of the operator, and to set the height reference point to the line pattern of the minimum pattern width, the height reference An object of the present invention is to provide a method for automatically generating a height reference point that can greatly increase the number of points set and can set a height reference point near a large part.

  In order to achieve the above object, the present invention provides an automatic board height reference point setting method for printed circuit board appearance inspection using printed circuit board design CAD data and a component shape library. Design data is acquired from the height reference data generation condition file that defines the attribute information, graphic information and parameters of the board based on the process of acquiring the design data from the design data. It comprises a substrate height reference data automatic generation step for setting a ground point having a defined effective area.

  Further, a board height reference point automatic setting method in printed circuit board appearance inspection using printed circuit board design CAD data and a component shape library, the process of acquiring design data from the printed circuit board design CAD data and the component shape library; Based on the design data, the inspection data creation unit registers the inspection position data, the part shape execution data, and the land shape execution data, and the height standard that defines the attribute information and parameters of the board based on the design data. A board height reference data automatic generation step for acquiring designated attribute information and parameters from a data generation condition file and setting a ground point having a predetermined effective area on the board, and the board height reference data and inspection Acquires position data, component shape execution data, and land shape execution data, and provides visual inspection data for each board. Characterized by comprising the step of forming.

  Also, the height reference data generation condition file includes a solid foil pattern ground point size, pattern boundary deviation tolerance, line pattern minimum pattern width, inspection deviation tolerance, board variation tolerance, ground point occurrence interval, Any one or all of a shadow area of a component, a component deviation allowable value, a distance from the component, and a ground setting distance around a large component are provided.

Further, the substrate height reference data automatic generation step includes a step of generating a square mesh on the substrate, a step of generating a grid for dividing the substrate, and a step of generating a rectangular ground point on the line pattern in the substrate. Selecting all the generated rectangular ground points; generating a square ground point on the solid foil pattern; creating a prohibited area; deleting the generated rectangular and square ground points in the prohibited area; and a grid Selecting the nearest square ground point from the center of the substrate, outputting the selected ground point, generating a square mesh on the substrate, and on the line pattern in the substrate A rectangular ground point is generated on the solid foil pattern, and a rectangular ground point is generated on the solid foil pattern. A step of creating a forbidden area, deleting rectangular and square ground points generated in the prohibited area, a step of generating a grid for dividing the substrate, and a step of selecting all rectangular ground points in the grid. A step of selecting one of the nearest square ground points from the center of the grid, and a step of outputting the selected ground point, and at least two diagonal points in the vicinity of the component on the board. Find the ground point, the individual recognition and obtaining a line L ₁ connecting the mark, through the midpoint of the line L _1, and obtaining a perpendicular line L ₂ to the line L _1, between the straight line parallel to the line L ₂ And a step of obtaining a rectangular region which is set at a maximum allowable distance Lmax from the part, and a step of obtaining a line foil and a solid foil touching the rectangular region A step of generating a square ground in the solid foil area, a step of generating a line ground in the line foil area, a step of deleting the ground of the prohibited area, and a step of outputting a ground point .

  The rectangular ground point generating step generates a rectangular ground point having a width W and a length L obtained by the following equation on the line pattern.

W = Wline−ΔW1 × 2
L = S / W
Wline Line pattern width
△ W1: Inspection tolerance
S: Recommended ground point area (mm ² )
L: Length of the rectangular ground In addition, the square ground point generation process includes the process of setting a solid foil pattern as a candidate area for the board height reference point from the design data, and the external shape and height of the part from the part shape library. Obtaining information, obtaining a shadow area that occurs around the electronic component and its surroundings from the design data, setting a deviation allowable area outside the shadow area, and extracting the shadow area and the deviation allowable area from the reference point candidate area And a step of generating a square ground point close to the outside of the deviation allowable region.

  The rectangular ground point generating step includes generating a ground point at the intersection of the center line of the line pattern and the XY straight line passing through the center of the grid, and separating the predetermined distance from the intersection on the line pattern. The method is characterized by comprising a step of generating a ground point.

  In addition, the rectangular ground point generation step includes obtaining a start point and an end point of the line pattern, generating a ground point at the center thereof, and generating a ground point on the line pattern at a predetermined distance from the center. It is characterized by becoming.

  The square ground point generation step includes a step of generating a square mesh having a predetermined effective area obtained from the substrate height reference data in the substrate height reference point candidate region, a shadow region, a hole, and a land of parts. , Except for meshes that touch silk characters, extracting meshes, generating a maximum number of ground point generation grids in the candidate area, generating square ground points in the grid, and ground in the grid Selecting the nearest square ground point from the center of the grid if the point exceeds the upper limit, selecting all square ground points if the ground point in the grid does not exceed the upper limit, and The method includes a step of outputting the selected ground point.

According to the present invention, since the board height reference point data can be automatically created without using the product board, the lead time from design to production can be greatly reduced, and the design data can be used to generate the reference point data. By using this, it is possible to eliminate the occurrence of variations in the reference points due to variations in the accuracy of the substrate, and also to eliminate variations in inspection due to the skill level of the operator. In addition, since the ground point set on the line pattern or solid foil pattern has an effective luminance at the time of inspection, the erroneous determination occurrence rate at the time of inspection can be greatly reduced,
Furthermore, in the line pattern, the ground point can be accurately set on the line, and in the solid foil pattern, the ground point can be set in the vicinity of the component, so that the inspection accuracy can be improved.

  Furthermore, since a grid that divides the candidate area is generated and the ground point is set in the grid, the ground point can be set evenly over the entire board, and the number of grids is set as the upper limit number of ground points. Since the required number of ground points can be set and the ground point can be set in the vicinity of the large component, erroneous determination in the large component can be reduced and the inspection accuracy can be improved.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a system configuration diagram for implementing the substrate height reference point automatic generation method of the present invention, FIG. 2 is a diagram showing data contents of a ground point generation condition file, FIG. 3 is a ground point automatic generation flowchart, and FIG. Is an explanatory diagram showing a rectangular ground point generation logic, FIG. 5 is an explanatory diagram showing a square ground point generation logic, FIG. 6 is an explanatory diagram showing a method of calculating a rectangular ground point shape, and FIG. 7 is a square ground point shape. FIG. 8 is an explanatory diagram for setting a ground point on a solid foil.

  In FIG. 1, a CAD database 1 is composed of design information (attribute information and graphic information) such as a board outer size, a pattern, a resist, a metal mask, silk, a hole, and a through hole, and a component shape library 2 includes a component part number, It consists of a shape code, component size (X, Y) lead pitch, number of leads, component height, and the like. The height reference data generation condition file 10 includes a ground point size, a minimum pattern width, a pattern boundary deviation allowable range, an inspection deviation allowable value, a board variation allowable value, a ground point generation interval, a component shadow area, and a component deviation allowable value. It consists of the distance from the part, the ground point setting distance around the large part, and the allowable values from the silk and resist.

  Next, a substrate height reference point automatic generation system will be described with reference to FIG.

  In the figure, CAD data 1 and a component shape library 2 are input to a design data input unit 3, inspection data is generated by an inspection data generation and output unit 4, and land shape data 5 and a component shape master 6 are output. The data output to the land shape data 5 and the component shape master 6 is processed by the inspection data creation system 7 and is composed of a board size, a circuit number, a block number, a component part number, a mounting position, an inspection library code, and a mark position. Component inspection position information 8a, inspection library code, component shape execution data 8b composed of component shape, size, lead shape size, land composed of circuit number, block number, land number, land shape, size, land position Each is registered as shape execution data 8c.

  On the other hand, the substrate height reference data automatic generation unit 9 reads specified attribute information and parameters from the design data input to the design data input unit 3 and the height reference data generation condition file 10, and the flowchart shown in FIG. Then, the substrate height reference data is automatically generated, and the ground point position and ground point shape information is output from the substrate height reference data output unit 11 to the substrate height reference database 12.

  The appearance inspection machine 13 reads information from the substrate height reference data 12, the component inspection position database 8a, the component shape database 8b, and the land shape database 8c, and generates appearance inspection data for each substrate.

  FIG. 2 shows the data contents of the height reference data generation condition file 10, and shows attributes, variables, contents, default values, and units.

  Attributes are solid foil pattern, line pattern, component, silk, resist, and variables include ground point size, minimum pattern width, pattern boundary deviation tolerance, inspection deviation tolerance, board variation tolerance, and ground point generation interval. , The shadow area of the component, the component deviation tolerance, the distance from the component, the ground setting distance around the large component, the tolerance from the silk and resist. The data possessed by the height reference data generation condition file 10 is not limited to the above data, and necessary data can be selected and possessed.

  Next, a ground point automatic generation flowchart will be described with reference to FIG.

In accordance with the outer dimensions of the printed circuit board obtained from the design data in S ₁ generates a square mesh. In the present embodiment, the mesh size is (0.16 × 0.16). Set the ground point upper limit number N in S ₂ from the system file, causing the substrate area generating grid N division. In the present embodiment, the number of divisions is 3000. Horizontal in the substrate at S _3, it searches the vertical line pattern, and generates a rectangular ground point in the logic shown in FIG. 4 on the line pattern. Select all rectangular ground point generated in S _4, to create a forbidden area in S _5, to remove the ground point generated in forbidden areas. Generating a ground point of a square with logic shown in FIG. 5 on the solid foil pattern S _6.

Create a prohibited area in the S _7, to remove the ground point that occurred in the prohibited area.

Recently neighbor square ground point selected point from the center of the grid S _8, and outputs the ground point selected in S ₅ and S ₈ in S _9.

  Next, logic for generating a rectangular ground point on a vertical line pattern in the substrate will be described with reference to FIG. First, the upper limit number N of ground points is set from the system file, and a grid for dividing the substrate into N is generated.

Next, the center coordinates [X ₁ + (X ₂ −X ₁ ) / 2, Y ₁ + (Y ₂ −Y ₁ ) / 2] of the grid dividing the substrate are obtained, and the vertical line pattern L ₁ ( L ₁ is the center line of the line pattern), and the intersection coordinates (Xi, Yi) between L ₁ and a straight line Y = Y ₁ + (Y ₂ −Y ₁ ) / 2 passing through the center of the grid are obtained. A central ground point is generated at (Xi, Yi). Next, an additional ground point is generated on the vertical line pattern that is separated from the straight line Y = Y ₁ + (Y ₂ −Y ₁ ) / 2 by a predetermined distance L. The distance L is determined in advance by the number of ground points to be set.

Similarly, for the horizontal line pattern L ₃ , the intersection of the line pattern L ₂ and the straight line X = X ₁ + (X ₂ −X ₁ ) / 2 is obtained, a ground point is generated on the intersection coordinates, and the oblique line pattern the L _3, to generate a ground point on the intersection coordinates of the straight line Y or X, generates a ground point a vertical line pattern in the same way.

  Next, the square ground point generation logic will be described with reference to FIGS.

  First, a mesh is generated in accordance with the external dimensions of the substrate. The size of the mesh is a recommended area for the ground point defined in the height reference data generation condition file (hereinafter referred to as an input condition file) to have sufficient luminance. In this embodiment, the recommended area is 0.0256. Thus, the length of one side of the square is 0.16. Next, the mesh contained in the copper foil is extracted, and the shadow area of the component, the hole, the solder (metal mask), and the silk character and the touched mesh are removed.

  Next, an upper limit number N of ground points is set from the system file, and a grid for dividing the substrate into N is generated.

  Next, a ground point in the grid is selected. If there is one ground point, a ground point is selected. If there are one or more ground points, one nearest ground point from the grid center is selected.

  Next, a ground point shape calculation method will be described with reference to FIGS.

  FIG. 6 shows a method of calculating dimensions of a rectangular ground point shape.

  In the figure, 14 is a line pattern, and the width is Wline. ΔW1 is the allowable value of the inspection deviation generated by the inspection machine acquired from the input condition file, Wgrd is the width of the rectangular ground 15, Lgrd is the length of the rectangular ground 15, and Pdisp is the board variation acquired from the input condition file. It is an acceptable value. Depending on the correction accuracy of the inspection machine, the ground point 16 may be shifted by 1 to 2 dots from the center of the line pattern 14. In order to generate a ground point having sufficient luminance in the line pattern 14, The width of 15 must be a dimension obtained by subtracting the inspection deviation allowable value defined in the input condition file from both sides of the line pattern 14. In addition, in order for the ground point 16 to have sufficient luminance, it must have a recommended area S obtained from the resolution of image processing of each inspection machine. Therefore, the width W and the length Lgrd of the ground point 16 are calculated by the following equations.

W = Wline-2 × ΔW1
Wgrd = Wline + ΔPdisp × 2
Lgrd = S / W
S: Recommended ground point area ΔW1: Inspection tolerance value Wgrd: Rectangular ground width Lgrd: Rectangular ground length Pdisp: Substrate variation tolerance value When generating a ground point under the conditions that the component displacement tolerance is 0.01 mm and the recommended ground point area is 0.0256 mm ² , the width of the ground point is 0.1 mm−0.01 × 2, The length is 0.0256 / 0.08 and is 0.32. Under this condition, a ground point 16 having a recommended ground point area of 0.0256 mm ² is set on a line pattern of 0.1 mm (see FIG. 6b).
In this way, by incorporating the component deviation allowable value and the board variation allowable value specified in the input condition file into the ground point setting conditions, as shown in FIG. Even if a deviation occurs, a ground point having an effective area with a certain luminance can be set.

  FIG. 7 shows a method of calculating a square ground point shape.

  In the figure, 17 is a solid foil, ΔW2 is an allowable value of an inspection deviation generated by an inspection machine acquired from an input condition file, Xgrd is a length of one side of a square ground point, and S is an area of the ground point. .

  The length Xgrd of the square ground point is calculated by the following equation.

S = Xgrd ²
Next, the ground point allowable region of the solid foil pattern will be described with reference to FIG.

In the figure, reference numeral 19 denotes an external shape of the component, and the external shape and height information of the component are acquired from the design information and the component shape library. Reference numeral 20 denotes an electronic component acquired from the input condition file 10 and a component shadow region generated around the electronic component. In this embodiment, the shadow region offset ΔX ₁ = component height × 40%, ΔY ₁ = component height. × 40%. 21 is a component displacement tolerance region, and displacement tolerance values ΔX ₂ = 0.3 mm, ΔY ₂ = 0.3 mm, 22 is a ground point tolerance region, ground point distance tolerance value ΔX ₃ = 5 mm, ΔY ₃ = 5 mm.

The procedure for generating a square ground point is as follows. First, a solid foil pattern is set as a candidate area for the board height reference point from the design information, the external shape and height information of the component 19 is acquired from the component shape library, and from this and the input condition file 10, the electronic component and The shadow area 20 that occurs around the area is acquired, a deviation allowable area 21 is set outside the shadow area 20, the shadow area 20 and the deviation allowable area 21 are excluded from the reference point candidate areas, and close to the outside of the deviation allowable area. Then, a square ground point is generated in the ground point allowable area 22.
(Embodiment 2)
A logic for generating a rectangular ground point on the line pattern of the second embodiment and a flowchart for automatically generating a ground point will be described with reference to FIGS.

  A logic for setting a rectangular ground point on a vertical line pattern in the substrate will be described with reference to FIG.

First, the vertical lines L ₁ and L ₂ and the horizontal line pattern L ₃ in the substrate are obtained. Next, the midpoint coordinates (X ₁ , Y ₁ ) of the straight line L ₁ are obtained.

The start point coordinates of the straight line L ₁ are (Xsl, Ysl), and the end point coordinates are (Xel, Yel).

Next, a ground point is generated at the midpoint coordinates (X ₁ , Y ₁ ) of the straight line L ₁ .

Next, a straight line that passes through the midpoint coordinates and is perpendicular to the straight line L ₁ , a straight line Y = Yel + (Ysl−Yel) / 2, is obtained, and a ground point is generated on the vertical line pattern L ₁ that is separated from the straight line Y by L.

The ground points are also generated for the straight lines L ₂ and L ₃ by the same method.

  In the present embodiment, the square ground point generation logic, the ground point shape calculation method, and the ground point allowable area of the solid foil pattern are the same as those in the first embodiment, and the description thereof is omitted.

  Next, a ground point automatic generation flowchart will be described with reference to FIG.

10, to generate a square mesh in accordance with the outer dimensions of the printed circuit board obtained from the design data in S _1. In the present embodiment, the mesh size is (0.16 × 0.16). Horizontal in the substrate at S _2, and find the vertical line pattern, and generates a rectangular ground point on the line pattern.

To generate a ground point of the square on the solid foil in S _3.

Create a prohibited area in S _4, to delete the ground point that occurred in the prohibited area.

The substrate area to generate a grid of N divided by S _5. In the present embodiment, the number of divisions is 3000.

If there are rectangular ground points in the grid, all rectangular ground points are selected in S ₆ , one nearest square ground point is selected from the center of the S ₇ grid, and S ₆ and S ₇ are selected in S _8. Output the ground point. In the present embodiment, a rectangular ground point can be set on the line pattern without generating a grid.
(Embodiment 3)
A logic for generating a ground point in the vicinity of a large component and a ground point automatic generation flowchart will be described with reference to FIGS.

  In the case of a large part such as a QFP connector, if a plurality of ground points are set in the vicinity of the four corners of the external part of the part, the inspection is stabilized and erroneous determination and over determination are reduced.

  In the case of the ground point automatic generation logic according to the first and second embodiments, since the ground point is set by selecting one point in the 3000 divided area, the ground cannot always be set near the component.

  Therefore, this embodiment provides a method for setting a ground in the vicinity of the component outline of a large component on the board.

  In the case of large parts such as QFP, individual recognition marks (local fiducial marks) are provided at two diagonal points of the parts as recognition marks for position correction when the parts are mounted by the mounter. The present embodiment is characterized in that a ground point is set by paying attention to the individual recognition mark.

  Hereinafter, the ground point generation logic of a large component will be described with reference to FIG.

In the figure, reference numeral 23 denotes a large part, and 24a and 24b denote individual recognition marks provided near the corners of the large part, and a ground point is set on the mark. The coordinates of the individual recognition mark 24a are (X ₁ , Y ₁ ), the coordinates of 24b are (X ₂ , Y ₂ ), and the midpoint coordinates of the large part are (X ₂ −X ₁ ) / 2, (Y ₂ − Y ₁ ) / 2.

Line L ₁ is a line connecting the individual recognition marks 24a, 24b, the line L ₂ passes through the midpoint of the line L _1, a straight line perpendicular to the line L _1. The line L ₃ is a straight line passing through the corners (Xc, Yc) of the large component 23 and parallel to the line L ₁ .

A line L ₄ passes through the individual recognition marks 24a and 24b and is a straight line parallel to the line L ₂ , and W is a distance between the individual recognition marks 24a and 24b.

Lmax is obtained from the input condition file, on line L _4, the maximum allowable distance that is set outside of the intersection of line L ₄ and the line L _3.

Region A ₁ in the ground point generation area of a rectangle that is set apart by a maximum allowable distance Lmax from the outside at the intersection of the line L ₃ and the line L ₄ of the line L _3, the area is Lmax × W. The area A _{2 is} also set by the same method. If no individual recognition mark is provided, at least two ground points are preset in the vicinity of the component.

  Next, a ground point automatic generation flowchart will be described with reference to FIG.

A part having an attribute of a large part 23 such as QFP is searched, the large part is associated with the individual recognition marks 24a and 24b, and a ground point is set at the center coordinates of the individual recognition mark. Next, a line L ₁ connecting the individual recognition marks 24a and 24b is obtained in S ₁ . Through the midpoint of the line L ₁ in S _2, determine the vertical line L ₂ to the line L _1. The rectangular areas A ₁ and A ₂ are obtained in the vicinity of the component by the method described in the ground point generation logic in S ₃ . In S ₄ , the line foil and solid foil touching the areas A ₁ and A ₂ are obtained.

Next, the type of foil, if the solid foil in S _5, to generate a square ground area, if the line foil, to generate a rectangular ground area.

Next, remove the ground forbidden region S _7, and outputs the remaining ground point S _8. By this ground point setting method, a ground point can be generated within the maximum allowable distance in the vicinity of a large component, and erroneous determination and over determination in a large component can be reduced, and inspection accuracy can be improved.

  In the present embodiment, the generation logic of the rectangular ground point, the square ground point, the calculation method of the ground point shape, and the ground point allowable area of the solid foil pattern are the same as those of the first embodiment, and the description thereof is omitted.

  The present invention uses printed circuit board design CAD data and a component shape library to register as inspection position data, component shape execution data, and land shape execution data, acquires specified parameters from a height reference data generation condition file, Registered as height reference data and automatically set a ground point with a predetermined effective area on the board from the board height reference data, inspection position data, component shape execution data, and land shape execution data by the inspection machine Therefore, it is particularly useful as a method for creating reference point data in the appearance inspection of a printed circuit board.

The system block diagram of the board | substrate height reference point automatic generation method of this invention. Data contents of the ground point generation condition file. The grand point automatic generation flowchart. Explanatory drawing which shows a rectangular ground point generation logic. (A) and (b) are explanatory drawings showing square ground point generation logic. (A) (b) is explanatory drawing which shows the calculation method of a rectangular ground point shape. Explanatory drawing which shows the calculation method of square ground point shape. Explanatory drawing which sets a ground point to a solid foil. Explanatory drawing which shows a rectangular ground point generation logic. The grand point automatic generation flowchart. Explanatory drawing which shows the logic which generates a ground point in the vicinity of a large component. The grand point automatic generation flowchart. The flowchart of the conventional height reference point determination method. The figure which shows the ground point with a small effective area.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board design CAD data 2 Part shape library 3 Design data input part 4 Inspection data generation output part 5 Land shape data 6 Part shape data 7 Inspection data creation system 8a Inspection position data 8b Part shape execution data 8c Land shape execution data 9 Substrate height reference data automatic generation unit 10 Height reference data generation condition file 11 Substrate height reference data output unit 12 Substrate height reference data 13 Appearance inspection machine 14 Line pattern 15 Rectangular ground 16 Rectangular ground 17 Solid foil 18 Square ground point 19 Parts 20 Shadow Area 21 Deviation Allowed Area 22 Ground Point Allowable Area 23 Large Parts 24a, 24b Individual Recognition Marks

Claims (7)

A board height reference point automatic setting method in appearance inspection of a printed board using printed board design CAD data and a component shape library,
Obtaining design data including printed board design CAD data and board shape information and graphic information on the board having solid foil pattern, line pattern, and component information from the part shape library;
Acquires attribute information and parameters of the substrate to set the substrate height reference point from the height reference data generation condition file defining the parameters corresponding to the attribute information and the attribute information of the board on the basis of the design data, the substrate Ri Do from the substrate height reference data automatic generation step of setting a ground point having an effective area having a predetermined constant brightness is above,
The height reference data generation condition file includes, as the parameters, a solid foil pattern ground point size and a pattern boundary deviation allowable value in the case of a solid foil pattern, and a minimum pattern width and an inspection deviation of a line pattern in the case of a line pattern. Tolerance value, board variation tolerance value, ground point generation interval, in the case of components, the shadow area of the component, the component displacement area, the distance from the component, the ground setting distance around the large component,
The substrate height reference data automatic generation step includes a step of generating a square mesh on the substrate, a step of generating a grid for dividing the substrate, a step of generating a rectangular ground point on the acquired line pattern, and generation Creating a prohibited area from the process of selecting all the rectangular ground points, the process of generating a square ground point on the obtained solid foil pattern, and the shadow area and the parts displacement area of the acquired part. The step of deleting the generated rectangular and square ground points, the step of selecting one of the nearest square ground points from the center of the grid, and the step of outputting the selected ground point Reference point automatic setting method. A board height reference point automatic setting method in appearance inspection of a printed board using printed board design CAD data and a component shape library,
Obtaining design data including printed board design CAD data and board shape information and graphic information on the board having solid foil pattern, line pattern, and component information from the part shape library;
The board attribute information and parameters for setting the board height reference point are obtained from the height reference data generation condition file that defines the board attribute information and the parameters corresponding to the attribute information based on the design data, and are obtained on the board. It consists of a substrate height reference data automatic generation step for setting a ground point having an effective area with a predetermined constant brightness,
The height reference data generation condition file includes, as the parameters, a solid foil pattern ground point size and a pattern boundary deviation allowable value in the case of a solid foil pattern, and a minimum pattern width and an inspection deviation of a line pattern in the case of a line pattern. Tolerance value, board variation tolerance value, ground point generation interval, in the case of components, the shadow area of the component, the component displacement area, the distance from the component, the ground setting distance around the large component,
Substrate height reference data automatic generation process retrieves the ground point provided in two diagonal points of large parts near the substrate, a step of obtaining a line L ₁ connecting the individual recognition marks the midpoint of the line L ₁ To obtain a line L ₂ perpendicular to the line L ₁ , to obtain a rectangular area set between straight lines parallel to the line L ₂ and separated from the part by the maximum allowable distance Lmax, and touch the rectangular area A line foil, a solid foil, a step of generating a square ground in the solid foil area, a step of generating a line ground in the line foil area, the acquired shadow area of the component, and the component shift area create a forbidden area from the step a, board height reference point automatically set how to being a process of outputting a ground point to remove the ground of prohibited areas. 3. The substrate height reference point automatic according to claim 1, wherein the rectangular ground point generating step generates a rectangular ground point having a width W and a length L obtained by the following equation on the line pattern. Setting method.
  W = Wline−ΔW1 × 2
  L = S / W
          Wline Line pattern width
          △ W1: Inspection tolerance
          S: Recommended ground point area (mm2)
          L: Length of rectangular ground In the square ground point generation process, the solid foil pattern is set as a candidate area for the board height reference point from the design data, and the external shape and height information of the part is obtained from the part shape library. A step of acquiring a shadow region generated around the part and its surroundings, a step of setting a shift allowable region outside the shadow region, a step of excluding the shadow region and the shift allowable region from the reference point candidate region, and a shift allowable region 3. The substrate height reference point automatic setting method according to claim 1, further comprising a step of generating a square ground point close to the outside . The rectangular ground point generation step includes a step of generating a ground point at the intersection of the center line of the line pattern and an XY straight line passing through the center of the grid, and a ground point on the line pattern at a predetermined distance from the intersection. The substrate height reference point automatic setting method according to claim 1 , wherein the substrate height reference point is automatically set. The rectangular ground point generation step includes a step of obtaining a start point and an end point of the line pattern, generating a ground point at the center thereof, and a step of generating a ground point on the line pattern at a predetermined distance from the center. The substrate height reference point automatic setting method according to claim 1 , wherein the substrate height reference point is automatically set. The square ground point generation step includes a step of generating a square mesh having a predetermined effective area obtained from the substrate height reference data in the substrate height reference point candidate region, and a shadow region, hole, land, silk of the part. The process of extracting meshes, excluding the character and the mesh to touch, the process of generating the maximum number of grids in the candidate area, the process of generating square ground points in the grid, and the ground points in the grid If the upper limit is exceeded, select the nearest square ground point from the center of the grid, and if the ground points in the grid do not exceed the upper limit, select all square ground points. 3. The method of claim 1, further comprising the step of outputting a ground point. Substrate height reference point autoconfiguration crab according.