JP4180587B2 - Cutting method of stick-shaped wafer - Google Patents

Description

  The present invention relates to a stick-shaped wafer cutting method for manufacturing a floating magnetic head slider used in a magnetic disk device.

  In recent magnetic head sliders of magnetic disk devices, the flying height has been reduced to increase the recording density of the magnetic disk medium. Further, since a large acceleration is applied in the access direction for speeding up access, a slider having excellent flying stability is required.

  Further, in order to reduce the size of the magnetic disk device and simplify the mechanism, a rotary positioner has been widely used in recent magnetic disk devices, and a negative pressure slider with a small flying height fluctuation due to a change in yaw angle is desired.

  As a negative-pressure magnetic head slider with excellent flying stability, a pair of rails whose rail width decreases from the air inflow end to the air outflow end is formed, and a groove is defined between the pair of rails. A slider for generating a negative pressure has been proposed (Japanese Patent Laid-Open No. 4-228157).

  FIG. 1A is a plan view of a conventional negative pressure magnetic head slider disclosed in the above publication, and FIG. 1B is a perspective view thereof. The slider 2 has a rectangular parallelepiped shape, and has an air inflow end 2a and an air outflow end 2b.

  A pair of rails 4 and 6 for generating a positive pressure are formed on the disk-facing surface of the slider 2. Each of the rails 4 and 6 has flat air bearing surfaces (rail surfaces) 4a and 6a for generating a flying force when the disk rotates.

  Tapered surfaces 4b and 6b are formed on the air inflow end sides of the rails 4 and 6, respectively. A groove 8 is defined between the pair of rails 4 and 6 for generating negative pressure by expanding the compressed air once.

  An electromagnetic transducer 10 is formed at the air outflow end of the slider 2 where the rail 4 is located. A center rail 11 is formed on the air inflow end side of the pair of rails 4 and 6.

  By making the width of each rail 4 and 6 wide at the inflow end and outflow end side and narrow at the middle portion, floating fluctuation due to yaw angle change is suppressed. Further, by forming the tapered surfaces 4b and 6b at the inflow end, it is possible to suppress the floating fluctuation at the time of dust adhesion.

  FIG. 1B is a perspective view of the slider 2 as viewed from the rail surface side. A dotted arrow indicates a positive pressure applied to the slider 2 and a solid arrow indicates a negative pressure applied to the slider 2. A positive pressure is generated at the rail surfaces 4a and 6a, and a negative pressure is generated at the groove 8 portion.

  When the flying height of the slider is 0.05 μm or less, the influence of the slider surface shape on the flying state increases.

  In the conventional slider described above, the slider has a rectangular shape, and each of a pair of rails formed substantially in parallel has two wide portions on the inflow end side and the outflow end side. Distribution peaks occur at 4 points, and the slider is supported at 4 points.

  When the slider is supported at four points and floats in this way, the effect of the slider surface shape on the flying state increases. That is, when the slider crown, camber, twist, etc. fluctuate due to manufacturing errors, there is a problem that the flying state of the slider fluctuates greatly.

  Accordingly, an object of the present invention is to provide a head slider that can suppress flying fluctuation due to rail surface flatness tolerance generated during slider machining and flying fluctuation due to taper length machining tolerance and has good flying characteristics.

  Another object of the present invention is to provide a stick-shaped wafer cutting method for manufacturing a head slider.

  According to the present invention, there is provided a stick-shaped wafer cutting method for obtaining a trapezoidal slider by cutting a stick-shaped wafer having a predetermined width, in which a plurality of sliders are formed side by side, and an angle of an inclined side surface of the trapezoidal slider. A rotary cutter having a cutting blade with an inclination angle equal to the above is provided, and the stick-shaped wafer is conveyed in a substantially horizontal direction with respect to the cutter while the stick-shaped wafer is set up so that the air inflow end of each slider is on the upper side Thus, a method for cutting a stick-shaped wafer is provided.

  As an alternative, the stick-shaped wafer may be moved and cut in the vertical direction with respect to the cutter so that the cutting location substantially coincides with a vertical line passing through the center of the cutter.

  According to the present invention, it is possible to provide a stick-shaped wafer cutting method suitable for separating individual trapezoidal sliders from a stick-shaped wafer.

  Referring to FIG. 2, there is shown a perspective view of a magnetic disk apparatus equipped with the magnetic head slider of the present invention. Reference numeral 12 denotes a housing (disk enclosure) composed of a base 14 and a cover 16.

  On the base 14, a spindle hub (not shown) that is rotationally driven by an inner hub motor is provided. Magnetic disks 20 and spacers (not shown) are alternately inserted into the spindle hub, and a plurality of magnetic disks 20 are attached to the spindle hub at a predetermined interval by screwing the disk clamp 18 to the spindle hub.

  Reference numeral 22 denotes a rotary actuator including an actuator arm assembly 26 and a magnetic circuit 28. The actuator arm assembly 26 is rotatably mounted around a shaft 24 fixed to the base 14.

  The actuator arm assembly 26 includes a plurality of actuator arms 30 extending in one direction from the center of rotation, and a coil support member 36 extending in the opposite direction to the actuator arm 30.

  A proximal end portion of a suspension 34 that supports the magnetic head slider 32 at the distal end portion is fixed to the distal end portion of each actuator arm 30.

  A coil 38 is supported by the coil support member 36. A voice coil motor (VCM) 40 is configured by the magnetic circuit 28 and the coil 38 inserted into the gap of the magnetic circuit 28.

  Reference numeral 42 denotes a flexible printed circuit board (FPC) that takes out a signal from an electromagnetic transducer mounted on the head slider 32. One end of the flexible printed circuit board (FPC) is fixed by a fixing member 44 and is electrically connected to a connector (not shown). Yes.

  An annular packing assembly 46 is mounted on the base 14, and the inside of the housing 12 is sealed by screwing the cover 16 to the base 14 with the packing assembly 46 interposed therebetween.

  FIG. 3 shows a plan view of the magnetic head slider 50A according to the first embodiment of the present invention, and FIG. 4 shows a perspective view thereof in a floating state. In the present embodiment and a number of subsequent embodiments, substantially the same components will be described with the same reference numerals.

  The magnetic head slider 50A has an air inflow end 52a and an air outflow end 52b, and has a trapezoidal shape in which the air inflow end side is narrow and the air outflow end side is wide. The magnetic head slider 50A is supported by the suspension 34 shown in FIG.

  A pair of rails 54 and 56 having flat rail surfaces (air bearing surfaces) 54a and 56a are formed on the disk facing surface of the magnetic head slider 50A.

  Tapered surfaces 54b and 56b are formed at the air inflow side ends of the rails 54 and 56, respectively. Since the slider 50A has a trapezoidal shape, the pair of rails 54 and 56 are arranged so as to approach each other on the air inflow end side, and a slit 58 is defined therebetween.

  Further, a negative pressure generating groove 60 is defined between the pair of rails 54 and 56. An electromagnetic transducer 62 is formed at the air outflow end 52b of the slider 50A where the rail 54 is located.

  The slider 50A is made of Al2 O3-TiC. After a plurality of electromagnetic transducers 62 are formed on the wafer, the wafer is cut into a bar shape, the side surfaces are processed to form rails 54 and 56, and then the individual sliders are formed. Cut to 50A.

  The slider size is 1.25 mm × 0.25-0.75 mm (air inflow end) × 1 mm (air outflow end), and the thickness is 0.3 mm. Since the width of the rails 54 and 56 is 100 μm or less at the narrowest portion, the rails 54 and 56 are formed by a photolithography technique.

  That is, after applying a resist to a desired rail pattern to be formed, the wafer is scraped by ion milling to form slits 58 and grooves 60. The tapered surfaces 54b and 56b are formed by machining before or after the rails 54 and 56 are formed.

  The taper angle is preferably 0.5 ° to 4.0 °, and the taper length is preferably 1/10 to 1/20 of the rail length. The positive pressure generated at the tapered surfaces 54b and 56b prevents the dirt from adhering to the end side surfaces of the rails 54 and 56.

  As is apparent from the floating perspective view of the slider 50A in FIG. 4, positive pressure is generated at the rail surfaces (air bearing surfaces) 54a and 56a as indicated by dotted arrows, and as indicated by solid arrows at the groove 60 portion. Negative pressure suction force is generated. That is, negative pressure is generated by the air once compressed in the slit 58 portion being expanded in the groove 60 portion.

  As apparent from the pressure distribution shown in FIG. 5, the slider 50A of the present embodiment has a trapezoidal shape, and thus has three pressure peaks, and the flying slider 50A is supported at three points.

  Since the slider 50A is supported at three points, even if the crown, camber, twist, etc. of the slider fluctuate due to a processing error, the floating variation rate of the slider becomes small. Further, since the slider shape is a trapezoidal shape, a slider having the same thickness has a mass of about 1/2 to 3/4 of a conventional slider.

  For example, the conventional slider is 1.757 mg, and the slider 50A of the first embodiment is 0.984 to 1.378 mg. For this reason, when the slider 50A is attached to the suspension of 1.161 mg, the resonance frequency can be increased by 3.8 to 13%.

  FIG. 6 shows a plan view of a slider 50B according to the second embodiment of the present invention. The slider 50B of the present embodiment has a pair of parallel side surfaces 64a and 64b formed on the air outflow end 52b side, and a pair of inclined side surfaces 66a and 66b that connect the side surfaces 64a and 64b to the air inflow end 52a. is doing.

  Since the slider 50B of this embodiment has a pair of parallel side surfaces 64a and 64b on the air outflow end portion side, alignment by pressing in the lateral direction is facilitated during slider processing. Further, since the angle of the corner portion on the air outflow end portion side is not an acute angle, the degree of dent scratches by the slider corner portion at the time of collision is reduced.

  FIG. 7 shows a plan view of a slider 50C according to the third embodiment of the present invention. The slider 50C has a pair of rails 68 and 70. Between the pair of rails 68 and 70, a slit 72 and a groove 74 for inflating compressed air and generating a negative pressure are defined. Yes.

  The rail 68 includes an air inflow end portion 68a, an air outflow end portion 68b, and an intermediate portion 68c. The center of the air outflow end portion 68b connects the center of the air inflow end portion 68a and the center of the intermediate portion 68c. It is positioned outside the straight line 69.

  Similarly, the rail 70 includes an air inflow end portion 70a, an air outflow end portion 70b, and an intermediate portion 70c. The center of the air outflow end portion 70b is located between the center of the air inflow end portion 70a and the intermediate portion 70c. It is positioned outside the straight line 71 connecting the centers.

  Since the rails 68 and 70 have the shapes described above, the airflow from the air inflow end 52a is easily blocked, and the flying height can be reduced while maintaining the rail width necessary for stable flying.

  FIG. 8 is a plan view of a slider 50D according to the fourth embodiment of the present invention. Since the width of the rail portion having the tapered surfaces 68d and 70d decreases from the air inflow end toward the air outflow end, even if the taper length varies due to the taper processing tolerance, the flying height change of the slider 50D is reduced. be able to.

  In other words, the flying height increases as the taper length increases, but the flying height decreases by decreasing the rail width of the taper portion from the air inflow end toward the air outflow end, and the flying height due to the taper length becoming longer. Offsetting the increase.

  FIG. 9 is a plan view of a slider 50E according to a fifth embodiment of the present invention. In the present embodiment, the center rail 76 is provided between the pair of rails 68 and 70. Other configurations are the same as those of the fourth embodiment shown in FIG.

  FIG. 10 is a plan view of a slider 50F according to the sixth embodiment of the present invention. In this embodiment, the inner edges 68f and 70f of the rails 68 and 70 that define the slit 72 are formed in parallel to the longitudinal center line of the slider 50F.

  Further, the width of the rail portion having the tapered surfaces 68e and 70e decreases from the air inflow end toward the air outflow end. Thereby, similarly to the fourth and fifth embodiments, even if the taper length varies due to the taper processing tolerance, the flying height change of the slider 50F can be reduced.

  FIG. 11 is a plan view of a slider 50G according to the seventh embodiment of the present invention. In the slider 50G of this embodiment, the pair of rails 78 and 80 are connected to each other by a connecting rail portion 82 on the air inflow end side.

  That is, since the rail shape is an inverted V shape and the air inflow end is closed, air is greatly compressed at the air inflow end, and the compressed air expands in the groove 84, so that negative pressure is easily generated. . The connecting rail portion 82 has a tapered surface 82a at the air inflow end portion 52a.

  When an inverted V-shaped or inverted U-shaped rail is employed in a conventional rectangular slider, the taper length becomes longer, so that a positive pressure is excessively generated and it is difficult to realize a low flying height of the slider.

  In order to improve this problem, it is necessary to narrow the rail width of the taper part. There is a problem that the corner contacts the magnetic disk.

  In the slider 50G of the present embodiment, since the outer shape of the slider is trapezoidal, the width of the air inflow end is shorter than that of a conventional normal type slider. As a result, it is not necessary to shorten the rail width of the tapered portion in order to suppress the positive pressure, and the contact between the slider corner and the magnetic disk due to the tightening of the slider 50G can be avoided.

  FIG. 12 shows a plan view of a slider 50H according to an eighth embodiment of the present invention. In the slider 50H of the present embodiment, the rail width of the connecting rail portion 86 that connects the rails 78 and 80 decreases from the air inflow end to the air outflow end in the tapered surface 86a. As a result, even if the taper length varies due to the taper processing tolerance, the flying height change of the slider 50H can be suppressed small.

  FIG. 13 shows a plan view of a slider 50I according to the ninth embodiment of the present invention. Since the connecting rail portion 86 includes a slit 88 extending from the air outflow end side to a part of the tapered surface 86a, positive pressure at the air inflow end portion can be suppressed, and the flying height of the slider 50I can be reduced. It becomes easy.

  FIG. 14 is a plan view of a slider 50J according to the tenth embodiment of the present invention. A slit 90 extending from the air outflow end side formed in the connecting rail portion 86 to a part of the tapered surface 86a is narrowed from the air outflow end side toward the air inflow end side.

  As a result, it becomes easy to form a pair of rails whose width is narrowed from the air inflow end side to the outflow end in the connecting rail portion 86, and the flying height of the slider 50J even if the taper length varies due to the taper processing tolerance. Change can be kept small.

  FIG. 15A shows a plan view of a slider 50K according to an eleventh embodiment of the present invention, and FIG. 15B is a cross-sectional view taken along line BB in FIG. 15A.

  Since the slit 92 formed in the connecting rail portion 86 is shallower than the depth of the groove 84, a negative pressure can be easily generated, and the compressed air current does not rapidly expand in the groove 84, so that the groove 84 becomes dirty. Will not adhere.

  FIG. 16 is a plan view of a slider 50L according to a twelfth embodiment of the present invention. Since the rail width of the taper surface 86a of the connecting rail portion 86 decreases from the air inflow end toward the air outflow end, the flying height change of the slider 50L is changed even if the taper length varies due to the taper processing tolerance. It can be kept small.

  FIG. 17 shows a plan view of a slider 50M according to a thirteenth embodiment of the present invention. In the slider 50M of this embodiment, the depth of the slit 94 formed in the connecting rail portion 86 is shallower than the depth of the groove 84, and the width of the slit 94 gradually increases from the air inflow end 52a toward the air outflow end. It is formed to become.

  Furthermore, since the rail width of the taper surface 86a decreases from the air inflow end to the air outflow end, even if the taper length varies due to the taper processing tolerance, the flying height change of the slider 50M can be kept small. it can.

  FIG. 18 is a plan view of a slider 50N according to a fourteenth embodiment of the present invention. A slit 96 extending from the air outflow end side of the connecting rail portion 86 to a part of the tapered surface 86 a is included, and the depth of the slit 96 is shallower than the depth of the groove 84. The slider 50N of this embodiment can easily generate a negative pressure, and can easily achieve low flying height.

  FIG. 19A shows a plan view of a slider 50P according to a fifteenth embodiment of the present invention, and FIG. 19B is a cross-sectional view taken along line BB in FIG. 19A.

  In each of the embodiments described above, the rail surface is tapered in order to generate a positive pressure at the air inflow end. However, in this embodiment, the depth of the groove 74 is about ½ to ¼ (groove depth). Steps 98 and 100 of 0.5 to 2 μm are formed at the air inflow ends of the rails 68 and 70. Further, step 102 is formed at the air inflow end of the slit 72.

  A positive pressure is generated at steps 98 and 100 provided at the air inflow ends of the rails 68 and 70. Compared to the case of the conventional rectangular slider, the width of the air inflow end portion where the steps 98, 100, and 102 are formed becomes narrow, so that the amount of dirt attached is reduced, and the variation in the flying height of the slider 50P can be kept small. it can.

  FIG. 20 is a plan view of a slider 50Q according to the sixteenth embodiment of the present invention. The slider 50Q of the present embodiment has a pair of rails 104 and 106 having different average rail widths.

  That is, the average rail width of the rail 106 on which the electromagnetic transducer 62 is located is formed to be narrower than the average rail width of the other rail 104, and the flying height of the rail 106 on the electromagnetic transducer 62 side is surely reduced.

  This can reduce the probability that the slider 50Q contacts the magnetic disk during low flying. A groove 108 is defined between the rails 104 and 106.

  FIG. 21 is a diagram illustrating the flying height of the air inflow end and the air outflow end of the slider 50Q according to the sixteenth embodiment. The vertical axis represents the slider flying height, and the horizontal axis represents the radial distance from the center of the magnetic disk.

  The solid line indicates the electromagnetic transducer mounting rail, and the dotted line indicates the flying height of the rail not mounting the electromagnetic transducer. It can be seen that the flying height of the electromagnetic transducer mounting rail is lower than the other rails at both the air inflow end and the air outflow end.

  Next, with reference to FIGS. 22A and 22B, a slider manufacturing method will be schematically described. As shown in FIG. 22A, first, a plurality of electromagnetic transducers 62 are formed on the wafer 110. The Al 2 O 3 —TiC substrate 112 is cut out from the wafer 110 into a bar shape, which is referred to as a stick-shaped wafer in this specification.

  Next, a photoresist mask pattern is formed on the stick-shaped wafer 112 and etched by ion milling to form a plurality of rails 54 and 56 on the stick-shaped wafer 112 as shown in FIG.

  Referring to FIG. 23, a first cutting method of the stick-shaped wafer 112 is shown. That is, since the slider of the present invention has a trapezoidal shape, a special cutting method is required to separate individual sliders from the stick-shaped wafer 112.

  The rotary cutter 114 has a cutting blade 116 on its outer peripheral surface. The cutting blade 116 has a special cross-sectional shape as shown in FIG. That is, the cutting blade 116 has an inclination angle equal to the angle of the inclined side surface of the trapezoidal slider 50A. Further, the cutting blade 116 has a radial length L that is larger than the length of the trapezoidal slider 50A.

  A plurality of rotary cutters 114 having such cutting blades 116 are arranged side by side at regular intervals as shown in FIG. 23, and the stick-shaped wafer 112 is erected so that the air inflow end 52a of each slider 50A is on the upper side. The stick-shaped wafer 112 is conveyed to the cutter 114 in the horizontal direction indicated by the arrow 118, and the stick-shaped wafer 112 is cut into individual sliders 50A.

  It should be noted here that the height relationship between the cutter 114 and the cutting blade 116 when the stick-shaped wafer 112 is conveyed is important, and the height relationship shown in FIG. The stick-shaped wafer 112 is transferred. When the stick-shaped wafer 112 passes just below the cutter 114, the stick-shaped wafer 112 is separated into a plurality of trapezoidal sliders 50A.

  In order to automate the cutting of the stick-shaped wafer 112, a stage 120 as shown in FIG. 25 is used. The stage 120 has a plurality of grooves 122 in which the stick-shaped wafer 112 is just accommodated. Further, a plurality of slits 124 are formed in a direction perpendicular to these grooves 122. The cutting blade 116 passes through these slits 124.

  26A shows a cross-sectional view taken along line 26A-26A in FIG. 25, and FIG. 26B shows a cross-sectional view taken along line 26B-26B in FIG.

  In order to cut the stick-shaped wafer 112 using the stage 120, the stick-shaped wafer 112 is inserted into the groove 122 of the stage 120 so that the air inflow end of each slider is on the upper side.

  Then, the stick-shaped wafer 112 is cut into individual sliders while the stage 120 is conveyed in the horizontal direction by the carrier. At the time of cutting, the cutting blade 116 of the rotary cutter 114 passes through the slit 124 of the stage 120.

  Referring to FIG. 27, a second method for cutting a stick-shaped wafer is shown. According to this cutting method, the stick-shaped wafer 112 is erected so that the air inflow end of each slider is on the upper side, and the wafer is positioned directly below the rotary cutter 114.

  Then, the stick-shaped wafer 112 is moved vertically upward with respect to the cutter 114 so that the cutting point substantially coincides with a vertical line passing through the center of the cutter 114, and the stick-shaped wafer 112 is cut into individual sliders. . The cutting blade 116 of the cutter 114 has the same shape as the cutting blade shown in FIG.

  Referring to FIG. 28, a stick-shaped wafer 112 'suitable for cutting positioning is shown. This stick-shaped wafer 112 ′ has a protrusion 128 extending over the entire length in the width direction of the stick-shaped wafer 112 ′ between adjacent sliders. These protrusions 128 are processed simultaneously with the processing of the rails 54 and 56 by ion milling.

  Thus, since the stick-shaped wafer 112 ′ has a plurality of protrusions 128, these protrusions 128 can be used as a guide for positioning the cutting blade 116 of the cutter 114. By cutting the stick-shaped wafer 112 ′ using these protrusions 128 as a guide, the stick-shaped wafer 112 ′ can be easily separated into individual sliders.

FIG. 1A is a plan view of a conventional magnetic head slider, and FIG. 1B is a perspective view thereof in a floating state. 1 is a perspective view of a magnetic disk device. It is a top view of the slider of 1st Embodiment of this invention. It is a perspective view of the floating state of the slider of 1st Embodiment. It is a figure which shows the pressure distribution of the slider of 1st Embodiment. It is a top view of the slider of 2nd Embodiment. It is a top view of the slider of 3rd Embodiment. It is a top view of the slider of 4th Embodiment. It is a top view of the slider of 5th Embodiment. It is a top view of the slider of 6th Embodiment. It is a top view of the slider of 7th Embodiment. It is a top view of the slider of 8th Embodiment. It is a top view of the slider of 9th Embodiment. It is a top view of the slider of 10th Embodiment. FIG. 15A is a plan view of the slider of the eleventh embodiment, and FIG. 15B is a cross-sectional view taken along line BB in FIG. 15A. It is a top view of the slider of 12th Embodiment. It is a top view of the slider of 13th Embodiment. It is a top view of the slider of 14th Embodiment. FIG. 19A is a plan view of the slider of the fifteenth embodiment, and FIG. 19B is a cross-sectional view taken along the line BB of FIG. 19A. It is a top view of the slider of 16th Embodiment. It is a figure which shows the flying height of the slider of 16th Embodiment. 22A is a perspective view of the wafer, and FIG. 22B is a perspective view of a stick-shaped wafer cut out from the wafer shown in FIG. 22A. It is a figure which shows the 1st cutting method. It is a figure which shows the cross-sectional shape of a cutting blade. It is a perspective view of a stage. 26A is a cross-sectional view taken along line 26A-26A in FIG. 25, and FIG. 26B is a cross-sectional view taken along line 26B-26B in FIG. It is a figure which shows the 2nd cutting method. It is a figure which shows the stick-shaped wafer suitable for positioning of a cutting | disconnection.

Explanation of symbols

50A-50Q Magnetic head slider 52a Air inflow end 52b Air outflow end 54, 56 Rail 54a, 56a Rail surface (air bearing surface)
54b, 56b Tapered surface 58 Slit 60 Groove 62 Electromagnetic transducer

Claims (7)

A stick-shaped wafer cutting method for obtaining a trapezoidal slider by cutting a stick-shaped wafer having a predetermined width in which a plurality of sliders are formed side by side,
Providing a rotary cutter having a cutting blade having an inclination angle equal to the angle of the inclined side surface of the trapezoidal slider;
While standing the stick-shaped wafer so that the air inflow ends of the individual sliders are on the upper side, the stick-shaped wafer is transported in a substantially horizontal direction with respect to the cutter and cut.
A method for cutting a stick-shaped wafer. The stick-shaped wafer cutting method according to claim 1, wherein a radial length of the cutting blade is equal to or greater than a width of the stick-shaped wafer. 2. The stick-shaped wafer cutting method according to claim 1, wherein the stick-shaped wafer has a cutting positioning protrusion reaching an air inflow end at an intermediate portion between adjacent sliders. A stick-shaped wafer cutting method for obtaining a trapezoidal slider by cutting a stick-shaped wafer having a predetermined width in which a plurality of sliders are formed side by side,
Providing a rotary cutter having a cutting blade having an inclination angle equal to the angle of the inclined side surface of the trapezoidal slider;
The stick-shaped wafer is erected so that the air inflow end of each slider is on the upper side, and the wafer is positioned directly below the cutter;
Moving the stick-shaped wafer in a vertical direction with respect to the cutter and cutting so that a cutting point substantially coincides with a vertical line passing through the center of the cutter;
A method for cutting a stick-shaped wafer. The stick-shaped wafer cutting method according to claim 4, wherein a length in a radial direction of the cutting blade is equal to or greater than a width of the stick-shaped wafer. 5. The method for cutting a stick-shaped wafer according to claim 4, wherein the stick-shaped wafer has a protrusion for cutting positioning reaching an air inflow end at an intermediate portion between adjacent sliders. A stick-shaped wafer cutting method for obtaining a plurality of trapezoidal sliders by cutting a stick-shaped wafer having a predetermined width in which a plurality of sliders are formed side by side,
A plurality of rotary cutters having cutting blades having an inclination angle equal to the angle of the inclined side surface of the trapezoidal slider are provided at predetermined intervals;
Providing a stage having a groove into which the stick-shaped wafer is inserted and a plurality of slits formed at a predetermined interval in a direction perpendicular to the groove;
Inserting the stick-shaped wafer into the groove of the stage so that the air inflow end of each slider is on the upper side;
Transporting the stage substantially horizontally with respect to the cutter to cut the stick-shaped wafer;
A method for cutting a stick-shaped wafer.

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