JP4175585B2 - Manufacturing method of photoelectric switch - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a photoelectric switch having an actuator that detects the presence or absence of an object to be detected without contact.
[0002]
[Prior art]
In recent years, photoelectric sensor switches having actuators that can detect the presence or absence of an object and obtain a switching signal without contact are widely used in facsimiles, printers, floppy disk drives, and the like. FIG. 12 is a perspective view showing the appearance of a general photoelectric switch. 13 is a cross-sectional view taken along line AA of FIG. 12 showing the structure. As shown in FIGS. 12 and 13, the photoelectric switch 1 houses a first housing 5 that houses the light emitting device 3 or the light receiving device 4 on both sides of the upper case 2, and a plunger 6 and a coil spring 7 in the center. A second storage unit 8 is provided. The light-emitting device 3 and the light-receiving device 4 housed in the first housing portion 5 face the partition walls of the first housing portion 5 and the second housing portion 8, and the optical axes of both devices are placed through a predetermined gap. A slit window 9 is formed at the matching position. A lower case 10 is inserted into the upper case 2. Terminals 3 a and 4 a are led out from the bottom surface of the lower case 10 from the light emitting device 3 and the light receiving device 4, respectively.
[0003]
The operation of the photoelectric switch structure will be described. In the state of FIG. 13, the light receiving device 4 receives light from the light emitting device 3 and knows that the plunger 6 is not pushed. When the plunger 6 is pushed in the direction of arrow B and the slit window 9 is blocked, the light receiving device 4 does not receive the light from the light emitting device 3.
[0004]
[Problems to be solved by the invention]
However, the conventional method for manufacturing a photoelectric switch has the following problems. As described above, the light emitting device and the light receiving device are mounted on the upper case, the plunger and the coil spring are assembled in a compressed state, and then the lower case is inserted into the upper case. Therefore, since the photoelectric switches are produced one by one, a large number of photoelectric switches cannot be produced.
[0005]
The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a method for manufacturing an extremely inexpensive photoelectric switch which is manufactured in large numbers and has excellent productivity.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the photoelectric switch manufacturing method according to the present invention is configured to detect the presence or absence of an object to be detected by blocking / receiving light from a light emitting device through a gap by inserting / ejecting a plunger. In a method of manufacturing a photoelectric switch that detects without contact, a through-hole processing step of drilling a plurality of through-holes at predetermined positions on a first and second collective substrate to be obtained in large numbers, and the first and second collective substrates Forming an upper surface electrode, a lower surface electrode, and a through-hole electrode that communicates both electrodes, and a plurality of light emitting devices or light receiving devices on the electrode pattern of the first or second assembly substrate by die bonding and wire bonding A mounting process, and a resin sealing process for sealing the light emitting device or the light receiving device and the bonding wire with an epoxy resin or the like A plunger having a first storage portion for storing the sealing resin portion on the first or second collective substrate on one surface, and communicating with the first storage portion via a slit window on the other surface; An injection molding step of the first or second mold body having a second storage portion for storing the coil spring, and the sealing resin portion of the first or second aggregate substrate as the first storage portion of the first or second mold body a bonding step of their respective constituting the first or second assembly housing to adhere the first or second set substrate and the first or second mold member, one of the first or second aggregates and embedded inserting a plan Ja and the coil spring consists of 2 pieces of the second housing portion of the light emitting device and the light receiving device of the first and second assemblies are opposed, and, a slit position via a predetermined gap The top surfaces of the first and second mold bodies are overlapped so as to match. And integrated assembly process of bonding together, is characterized in that the more the dicing step of dividing the integral assemblies photoelectric switch comprising one light emitting device and light receiving device.
[0007]
Further, in the assembling step of inserting a plunger and a coil spring into the second storage portion of the first or second assembly, the plunger has flange portions at both ends of the shaft portion and is symmetrical with respect to the center portion of the shaft. And a convex or concave engaging portion is provided in the substantially central portion of the shaft, and a convex portion formed on the plunger shaft at a constricted portion communicating with the adjacent second storage portion of the first mold body or the second mold body. Alternatively, a concave or convex engaging portion that engages with the concave engaging portion is formed to facilitate positioning of the plunger.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
A method for manufacturing a photoelectric switch according to the present invention will be described below with reference to the drawings. 1 to 10 show an embodiment of the present invention, FIG. 1 is an external perspective view of a single photoelectric switch, and FIG. 2 is a cross-sectional view taken along line BB of FIG. In the figure, the same members as those in the prior art are denoted by the same reference numerals.
[0009]
1 and 2, reference numeral 1 denotes a photoelectric switch, which has a configuration in which the light emitting device 3 is die-bonded to the first substrate 11 on which the electrode pattern is formed, and the light receiving device 4 is die-bonded to the second substrate 12. The electrode pattern is wire-bonded with a wire 13 and sealed with a sealing resin 14 made of an epoxy resin or the like.
[0010]
The first or second mold body 15 or 16 includes, on one surface, a first storage portion 5 that stores the sealing resin 14 on the first or second substrate, and a first storage portion 5 and a slit window on the other surface. A second storage portion 8 for storing the plunger 6 and the coil spring 7 communicating with each other through 9 is formed.
[0011]
A first assembly 17 is formed by adhering the first substrate 11 to the first mold body 15 so that the sealing resin 14 of the first substrate 11 is stored in the first storage portion 5 of the first mold body 15. Similarly, the second substrate 12 is bonded to the second mold body 16 so that the sealing resin 14 of the second substrate 12 is stored in the first storage portion 5 of the second mold body 16 to form the second aggregate 18. .
[0012]
After the photoelectric switch 1 is assembled in a state where the plunger 6 is inserted into the second storage portion 8 of either the first or second assembly 17 or 18 and the coil spring 7 is compressed, the slit windows of both assemblies 17 and 18 are assembled. The upper surface is overlapped and bonded and integrated so that the positions of 9 coincide with each other.
[0013]
Hereinafter, a method for manufacturing the photoelectric switch will be described. 3 to 9 show a method of manufacturing a photoelectric switch, FIG. 3 is a perspective view of a state in which a light emitting device or a light receiving device is mounted on the first or second aggregate substrate, and FIG. 4 is a first or second mold body. FIG. 5 (a) is a perspective view of two plungers, FIG. 5 (b) is a front view of a coil spring, and FIG. 6 incorporates the plunger and the coil spring into the first or second assembly. FIG. 7 is a perspective view of the integrated assembly in which the first assembly and the second assembly are bonded, FIG. 8 is a perspective view seen from the top of FIG. 7, and FIG. 9 is the perspective view of FIG. It is CC sectional view taken on the line. FIG. 10 is a diagram for explaining the operation of the photoelectric switch.
[0014]
In FIG. 3, in the through hole processing step, a plurality of through holes 21 are formed at predetermined positions on the first collective substrate 11A to be taken in large numbers. In the electrode pattern forming step, the upper electrode pattern 22, the lower electrode 23 (FIG. 7), and the through-hole electrode 21a that communicates both electrodes are formed on the first collective substrate 11A. The same process is performed on the second aggregate substrate 12A. In the mounting process, a plurality of light emitting devices 3 or light receiving devices 4 are die-bonded and wire-bonded on the first collective substrate 11A or the second collective substrate 12A. Next, in the resin sealing step, the light emitting device 3 or the light receiving device 4 and the wire are sealed with a sealing resin 14 (FIG. 9).
[0015]
In FIG. 4, in the injection molding process, the first storage portion 5 that stores the sealing resin 14 on the first aggregate substrate 11 </ b> A on one surface, and the first storage portion 5 and the slit window 9 on the other surface. The first mold body 15 formed by connecting the two plungers 6 communicating with each other and the two second storage portions 8 storing the coil springs 7 by the constricted portions 8a is injection-molded. The same process is performed for the second mold body 16.
[0016]
In FIG. 5, FIG. 5 (a) is composed of two plungers 6 and flange portions 6c that press the coil springs 7 at both ends with the substantially central portion 6b (cut portion) of the shaft 6a symmetrical. FIG. 5B shows a general coil spring.
[0017]
In FIG. 6, the sealing resin 14 on the first aggregate substrate 11 </ b> A is stored in the first storage portion 5 of the first mold body 15 in the bonding process between the collective substrate and the mold body and the plunger and coil spring incorporation process. The first assembly 17 is configured by bonding the first assembly substrate 11A and the first mold body 15 together. The same process is performed for the second aggregate 18. Next, the plunger 6 is inserted and fitted so that the shaft 6 a enters the constricted portion 8 a of the second storage portion 8 of either the first or second aggregate 17 or 18. Thereafter, the coil spring 7 is assembled in a compressed state between the flange portions 6 c of the two plungers 6 and the wall surface of the second storage portion 8.
[0018]
7, 8, and 9, the upper surface of the second assembly 18 is overlaid on the first assembly 17 incorporating the plunger 6 and the coil spring 7 so that the positions of the slit windows 9 coincide with each other. To form an integrated assembly 19.
[0019]
The photoelectric switch 1 shown in FIG. 1 and FIG. 2 by dicing that is cut and separated along cut lines in the X direction and the Y direction perpendicular to each other to divide into photoelectric switches including one light emitting device 3 and light receiving device 4 in a dicing process Is completed.
[0020]
The operation of the photoelectric switch 1 will be described with reference to FIG. In the state of FIG. 10A, the plunger 6 returns by the biasing force of the coil spring 7, and the light receiving device 4 receives the light from the light emitting device 3 and knows that the plunger 6 is not pushed. In the state of FIG. 10B, the light receiving device 4 does not receive the light from the light emitting device 3 by pushing the plunger 6 in the direction of arrow B and blocking the slit window 9.
[0021]
FIG. 11 is a front view of the first mold body 15 or the second mold body 16 and two plungers 6 showing another embodiment of the present invention. In FIG. 11B, the two plungers 6 are provided with a convex engaging portion 6d at a substantially central portion 6b of the shaft 6a. In FIG. 11A, a convex engaging portion 6d formed on the shaft 6a of the plunger 6 is connected to a constricted portion 8a communicating with the adjacent second storage portion 8 of the first mold body 15 or the second mold body 16. A concave engaging portion 8b is formed to engage with the. As described above, the coil spring is compressed in the compressed state by inserting the plunger 6 into the first assembly 17 or the second assembly 18 and engaging the engaging portions (6d, 8b) to position the plunger 6. The work of incorporating 7 becomes extremely easy. The engaging portions (6d, 8b) may be concave on the plunger 6 side and convex on the mold body 15 (16) side.
[0022]
Although both the engaging portions (6d, 8b) described above remain in the dicing process when they are cut and separated into a single photoelectric switch, there is no functional problem. The convex engagement portion may be cut off to improve the appearance.
[0023]
【The invention's effect】
As described above, according to the present invention, the coil spring can be compressed and incorporated by being inserted into a mold body that takes a large number of two plungers. In addition, since most of the manufacturing process is performed in an assembled state, the manufacturing cost is extremely low.
[0024]
Further, by forming an engaging portion between the plunger and the mold body and positioning the plunger, the work of compressing and incorporating the coil spring can be very easily performed.
[Brief description of the drawings]
FIG. 1 is an external perspective view of a single photoelectric switch according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line BB in FIG.
3 is a perspective view of a state in which a light-emitting device or a light-receiving device is mounted on a first or second aggregate substrate, illustrating a method for manufacturing the photoelectric switch of FIG. 1. FIG.
FIG. 4 is a perspective view of a first or second mold body.
FIG. 5A is a perspective view of two plungers, and FIG. 5B is a front view of a coil spring.
FIG. 6 is a perspective view of a state in which a plunger and a coil spring are incorporated in the first or second assembly.
FIG. 7 is a perspective view of an integrated assembly in which a first assembly and a second assembly are bonded together.
8 is a perspective view seen from the top surface of FIG. 7. FIG.
9 is a cross-sectional view taken along the line CC of FIG.
FIG. 10 is an operation explanatory diagram of a photoelectric switch.
FIG. 11 is a front view showing an engaging portion between a plunger and a mold body according to another embodiment of the present invention.
FIG. 12 is a perspective view showing the appearance of a conventional general photoelectric switch.
13 is a cross-sectional view taken along line AA in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Photoelectric switch 3 Light-emitting device 4 Light-receiving device 5 1st accommodating part 6 Plunger 6d, 8b Engaging part 7 Coil spring 8 Second accommodating part 9 Slit window 11 1st board | substrate 11A 1st collective board 12 2nd board | substrate 12A 2nd collective board 15 First mold body 16 Second mold body 17 First assembly 18 Second assembly 19 Integrated assembly

Claims (2)

In the manufacturing method of a photoelectric switch that detects the presence / absence of an object to be detected in a contactless manner by blocking / receiving light from a light emitting device through a gap by inserting / ejecting a plunger, a first is taken. And a through-hole processing step of drilling a plurality of through-holes at predetermined positions on the second collective substrate, and forming an upper electrode, a lower electrode, and a through-hole electrode communicating the both electrodes on the first and second collective substrates. An electrode pattern forming step, a mounting step of die-bonding and wire-bonding a plurality of light-emitting devices or light-receiving devices on the electrode pattern of the first or second aggregate substrate, and the light-emitting device or light-receiving device and bonding wire are bonded to an epoxy resin or the like And the sealing resin portion on the first or second aggregate substrate is accommodated on one surface. An injection molding step of a first or second mold body having a first storage portion and having a second storage portion for storing a plunger and a coil spring communicating with the first storage portion via a slit window on the other surface; The sealing resin portion of the first or second aggregate substrate is accommodated in the first accommodating portion of the first or second mold body, and the first or second aggregate substrate and the first or second mold body are bonded to each other. a bonding step of their respective constituting the second assembly, and incorporation step of inserting the first or any plan Ja and the coil spring consists of 2 pieces of the second housing part of the second assembly, the first And an integrated assembly in which the upper surfaces of the first and second mold bodies are overlapped and bonded so that the light emitting device and the light receiving device of the second assembly face each other and the slit positions coincide via a predetermined gap. Process and the integrated assembly in one light emission Method of manufacturing a photoelectric switch, characterized in that the more the dicing step of dividing the vice and the photoelectric switch including a light-receiving device.  In the assembling process of inserting a plunger and a coil spring into the second storage portion of the first or second assembly, the plunger has two flange portions at both ends of the shaft portion and is symmetrical at the center portion of the shaft, A convex or concave engaging portion is provided at a substantially central portion of the shaft, and a convex or concave shape formed on the shaft of the plunger at a constricted portion communicating with the adjacent second storage portion of the first mold body or the second mold body. 2. The method of manufacturing a photoelectric switch according to claim 1, wherein a concave or convex engaging portion that engages with the engaging portion is formed to facilitate positioning of the plunger.

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