JP4147566B2 - Sheet thickness reduction method and apparatus - Google Patents

Sheet thickness reduction method and apparatus Download PDF

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JP4147566B2
JP4147566B2 JP25969699A JP25969699A JP4147566B2 JP 4147566 B2 JP4147566 B2 JP 4147566B2 JP 25969699 A JP25969699 A JP 25969699A JP 25969699 A JP25969699 A JP 25969699A JP 4147566 B2 JP4147566 B2 JP 4147566B2
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JP2001079632A (en
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紀夫 岩波
史郎 長田
賢一 井出
肇 石井
昌夫 三上
崇 西井
早登史 村田
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IHI Corp
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IHI Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、被成形材を圧下する板厚圧下方法及び装置に関する。
【0002】
【従来の技術】
従来、スラブや粗バー等の被成形物を熱間圧延するに際して、ロール圧延する場合、圧延ロールの噛み込み率(圧延ロール径と元厚との比)の限界より圧下率(元厚に対する減厚量との比)が制約されタンデムミル方式或いは可逆圧延方式の2方式が一般的に用いられていた。しかしながら、近年圧下率のアップ、圧延中の放熱の抑制、更には設備のコンパクト化のニーズが高くなり圧下率の制約条件の少ないプレス方式が提案された。
【0003】
例えば、特開平2−175011号公報にはシングルプレスによる走間厚み圧下プレスが提案されている。図9はこのプレスの基本的構成を示す図で、被成形材1の上下にテーパー付の金型100が設けられ、各金型100はロッド101を介して偏心軸102により同期して上下動を行い、ロッド101の中間点には球面部材を上下方向に摺動可能に保持し流れ方向に揺動可能となり走間減厚する。更に、圧下荷重を軽減するために特開平11ー114602号公報にはタンデム方式のプレスが提案されている。
【0004】
ドイツ国特許公開公報DE2531591A1には2段でプレスするタンデム式プレスが記載されている。図10はこのプレスの基本的構造を示す図で、被成形材1の上下に可動金型100aと固定金型100bとが設けられている。各金型100a,100bはテーパー付金型であり、上流側金型対の上金型100aはロッド101を介して偏心軸102に接続され揺動可能とし、下金型100bは固定されている。下流側金型対の上金型100bは固定され、下金型100aはロッド101を介して偏心軸102に接続され揺動可能としている。上流側金型100aと下流側金型100aとは180度の位相差をもって上下動し、被成形材1を交互に圧下する。
【0005】
【発明が解決しようとする課題】
特開平2−175011号公報及び特開平11ー114602号公報のプレスは何れも上下一対の金型は上下金型とも上下動するため可動部分の慣性質量が大きくなり、実質の圧下に要する馬力よりも金型を同期させるための加減速馬力が大きくなる傾向にあり、付帯的な加減速馬力を低減させることに注目した。一方、ドイツ2531591A1号公報のタンデムかつ間欠搬送方式のプレスは上下一対のそれぞれの金型はテーパー付き金型で構成され、かつ固定金型は入り側と出側とで逆方向に配列されているために、圧下終了後の被成形材の搬送時、上・下流側一方の固定金型のテーパー部分をせり上がりながら走行する際に、他方の固定金型が被成形材に干渉しない様上下金型間の間隙を大きくする必要が生じクランク半径が大きくなり回転トルクが増大する問題があり、更には上下動が大きいため不安定な搬送となりその対策が必要となり付帯装置が増える欠点がある。
【0006】
本発明は上述の問題点に鑑みてなされたもので、被成形材搬送方向に金型対を単列または複列に設け、一方の金型を固定させ他方の金型を可動金型とすることで可動質量を少なくし、さらにタンデムに設けた両金型対の可動金型を上下同じ側に配置し、被成形材の上下振幅を半減した板厚圧下方法と装置を提供することを目的とする。
【0007】
【課題を解決するための手段】
上記目的を達成するため、請求項1の発明では、被成形材を挟んで上下に配置された1対の金型対を被成形材の流れ方向における上流側箇所および下流側箇所に配置し、上流側金型対の一方を圧下動作する可動金型とし他方の金型を固定金型とにより構成し、更に下流側金型対の一方の可動金型は上流側可動金型と同じ側に配列し、他方に固定金型を配列し、被成形材を搬送する搬送装置を設け、該搬送装置は被成形材を昇降する昇降機構を有し、
上流側可動金型と下流側可動金型とを交互に圧下・開放するとともに、金型開放動作時に被成形材を前記搬送装置により搬送し
前記金型対を上下に開いて被成形材を前記搬送装置で搬送する時に、被成形材の高さを、該金型対で被成形材を圧下する時の当該高さから前記昇降機構により変更し、これにより、被成形材と前記金型との干渉を低減する
【0008】
上下の金型の一方を上下動し、他方を固定することにより慣性質量が半減し、駆動動力を大幅に軽減することができる。
【0009】
請求項2の発明では、被成形材を挟んで上下に配置された1対の金型対を備え、該金型対の一方の金型は揺動機構により上下動する可動金型とし、他方の金型は所定の位置に保持される固定金型とし、金型対の上流側、下流側の少なくとも一方に被成形材を搬送する搬送装置を設け、
該搬送装置は、被成形材を昇降する昇降機構を有し、
該昇降機構は、前記金型対を上下に開いて被成形材を前記搬送装置で搬送する時に、被成形材の高さを、該金型対で被成形材を圧下する時の当該高さから変更し、これにより、被成形材と前記金型との干渉を無くし又は低減する。
【0010】
上下金型対の一方の可動金型は揺動機構で上下動し、他方の固定金型は金型固定機構で固定される。プレスの可動質量は可動金型のみであり、これにより慣性質量が半減し駆動動力を大幅に削減できる。また該昇降機構は、前記金型対を上下に開いて被成形材を前記搬送装置で搬送する時に、被成形材の高さを、該金型対で被成形材を圧下する時の当該高さから変更し、これにより、被成形材と前記金型との干渉を無くし又は低減し、更に被成形材の振動を抑え被成形材を昇降させるので安定した搬送ができる。
【0011】
請求項3の発明では、請求項2において、前記両金型を被成形材の流れ方向に往復動させる往復動装置が設けられ、圧下時被成形材の移動速度と略同じ速度で金型を下流側へ移動させ、開放時上流側に復帰させる。
【0012】
請求項2の装置で、圧下している可動金型及び固定金型を被成形材の流れ方向に被成形材と略同じ速度で移動することにより、被成形材を連続的に圧下することができる。
【0013】
請求項4の発明では、被成形材を挟んで上下に配置された1対の金型対がタンデムに配置され該金型対の上流側及び下流側のそれぞれが可動金型と固定金型より構成され、上流側金型対の上下一方の可動金型を上下動する上流側揺動機構と、下流側金型対の上流側可動金型と同じ側の可動金型を上下動する下流側揺動機構と、上流側揺動機構と下流側揺動機構とを互いに異なる位相で回転する揺動装置と、前記上流側金型対の上流側と前記下流側金型対の下流側の少なくとも一方に被成形材を搬送する搬送装置を設け、
該搬送装置は、被成形材を昇降する昇降機構を有し、
該昇降機構は、前記金型対を上下に開いて被成形材を前記搬送装置で搬送する時に、被成形材の高さを、該金型対で被成形材を圧下する時の当該高さから変更し、これにより、被成形材と前記金型との干渉を低減する。
【0014】
請求項2の発明であるシングルプレス方式に対して高圧下荷重に対応すべくなされたものであり、シングルプレスの場合は圧下荷重が増加すると機械強度上大きくなり構造的に成り立たないこともあり、ダブルプレス方式とすることにより1回当たりの圧下荷重を半減できるので、高圧力に対応したプレス成形ができる。
【0015】
請求項5の発明では、請求項4において、前記上流側金型対及び下流側金型対の可動金型及び固定金型を被成形材の流れ方向に往復動させる往復動装置が設けられ、圧下時被成形材の移動速度と略同じ速度で金型を下流側へ移動させ、非圧下時上流側に復帰させる。
【0016】
請求項4の装置において、圧下している可動金型及び固定金型を被成形材の流れ方向に被成形材と略同じ速度で移動することにより、被成形材を連続的に圧下することができる。
【0017】
請求項6の発明では、請求項2ないし5のいずれかにおいて、前記固定金型を被成形材下側に配置し、かつ被成形材と接する面が水平な固定平金型とする。
【0018】
固定金型を被成形材の下側にし、固定平金型とすることにより、搬送時被成形材の上下の挙動を少くし搬送を容易にすることができる。
【0019】
請求項7の発明では、請求項4または5において、前記上流側固定金型および下流側固定金型を被成形材下側に配置し、かつ被成形材と接する面が水平な固定平金型とし、更に両金型を一体化構造とする。
【0020】
固定金型を被成形材の下側にし、固定平金型とすることにより、搬送時被成形材の上下の挙動を少くし搬送を容易にすることに加え、上流側固定金型および下流側固定金型を一体化構造にすることにより、金型構造およびその支持構造を単純化することができる。
【0021】
【発明の実施の形態】
以下、本発明の実施形態について図面を参照して説明する。
図1は本発明の第1実施形態の板厚圧下装置の構成を示す図である。板厚圧下装置は、スラブ等の被成形材1を挟んで設けられた金型対20と、この金型対20を囲むフレーム4と、フレーム4の上側に設けられた揺動機構7と、フレーム4の上流側と下流側に設けられた搬送装置10a,10bを備えている。搬送装置10a,10bはピンチロールで構成され、かつ昇降機構13を備え、被成形材1を搬送時昇降して金型対20との干渉を少なくし円滑に搬送できるようにしている。金型対20は上側に設けられた可動金型20aと下側に設けられた固定金型20bよりなり、可動金型20aは、図示しない駆動装置により上下動を行う偏心軸よりなる揺動機構7に接続され、固定金型20bは金型ホルダー5に金型間ギャップ調整用ライナー6を介して固定されている。金型ホルダー5はフレーム4に取り付けられている。各金型20a,20bは被成形材1と接触する面が水平面とテーパー面とからなるテーパー付き金型である。
【0022】
次に動作について説明する。
揺動機構7を駆動することにより可動金型20aを降下し、被成形材1を圧下する。この際、被成形材1は停止状態とする。圧下が終了すると、可動金型20aは上昇し両金型20a,20b間を開く。両搬送装置10a,10bを稼動し、被成形材1を送り出す。この際搬送装置の昇降機構13で被成形材1を上昇させ固定金型20bとの干渉を少なくし円滑に搬送することができる。このようにして断続的にプレスを行うことができる。また金型対20の内一方の可動金型のみ駆動することにより可動質量が少なくなるので金型駆動動力を大幅に少くすることができる。
【0023】
次に第2実施形態を説明する。図2は第2実施形態の板厚圧下装置の構成を示す。図1に示した第1実施形態では圧下中は被成形材1の移動はできない間欠搬送方式で、非圧下中に移動が行われている。これに対して第2実施形態は圧下中も被成形材1を移動する走間プレス方式である。なお、図1と同一符号は同一の機能を有するものを表す。可動金型20aは可動金型用スライダー11により水平方向に摺動可能に支持され、固定金型20bは固定金型用スライダー14により同様に支持されている。可動金型用スライダー11は揺動機構7と連結しており、固定金型用スライダー14は金型間ギャップ調整用ライナー6を介して金型ホルダー5に取付けられている。各金型用スライダー11、14には水平方向に金型20a,20bを往復動するシリンダ12が設けられている。
【0024】
次に動作について説明する。全体の動作は第1実施形態と同様であるが、圧下中の上下の金型20a,20bをシリンダ12により被成形材1と略同じ速度で下流側へ移動する。なお、開放時、金型20a,20bをシリンダ12により上流側へ移動しておく。これにより、被成形材1を停止させることなく被成形材慣性による衝撃力を抑制し、連続的に圧下することができる。
【0025】
次に第3実施形態について説明する。
図3は本発明の第3実施形態の板厚圧下装置の構成を示す図である。板厚圧下装置は、スラブ等の被成形材1を挟んで上流側金型対2、被成形材1の流れ方向下流側の下流側金型対3、この両金型対2,3を囲むフレーム4、フレーム4の上側に設けられた上流側揺動機構7a、下流側揺動機構7b、両揺動機構を駆動する揺動装置、およびフレーム4の上流側と下流側に設けられた搬送装置10a、10bから構成される。搬送装置10a,10bはピンチロールより構成され、かつ昇降機構13を備え、被成形材1を搬送時昇降して金型対2,3との干渉を少なくし円滑に搬送できるようにしている。上流側金型対2は上流側可動金型2aと上流側固定金型2bからなり、上流側可動金型2aは、被成形材1の上側に設けられ、被成形材1と接触する面は水平面とテーパー面とからなるテーパー付き金型である。上流側固定金型2bは、下側に設けられ、同様にテーパー付き金型であり、金型間ギャップ調整用ライナー6を介して金型ホルダー5に取付けられている。金型ホルダー5はフレーム4に固定されている。
【0026】
下流側金型対3も同様に下流側可動金型3aと下流側固定金型3bからなり、下流側可動金型3aは、被成形材1の上側に設けられ、テーパー付き金型が用いられる。下流側固定金型3bは、下側に設けられ、同様にテーパー付き金型が用いられ、金型間ギャップ調整用ライナー6を介して金型ホルダー5に取付けられている。
【0027】
フレーム4の頂部には、上流側可動金型2aを上下動する偏心軸を備えた上流側揺動機構7aと下流側可動金型3aを上下動する偏心軸を備えた下流側揺動機構7bとが設けられている。両揺動機構7a,7bは図に示すように互いに180度の位相差をつけた状態としている。揺動装置は電導機8と歯車9a,9b,9cからなり、電動機8は歯車9aを回転し、歯車9aは左右に配置された歯車9b,9cを回転する。歯車9bは上流側揺動機構7aを回転し、歯車9cは下流側揺動機構7bを回転する。これにより電動機8を回転することにより、上流側可動金型2aと下流側可動金型3aとを180度の位相差で交互に上下動させることができる。フレーム4の上流側と下流側にはピンチロール10a,10bが設けられ、被成形材1を流れ方向に搬送する。搬送装置10a,10bは昇降機構13を備え、被成形材1を搬送時昇降して金型対2,3との干渉を少なくし円滑に搬送できるようにしている。上流側と下流側の金型対2、3はいずれも可動金型のみ駆動するので駆動動力を大幅に少くすることができる。また1台の電動機で2個の可動金型を位相差をつけて駆動することができ、簡単な駆動装置となっている。
【0028】
次に図4〜図7を参照して動作を説明する。
図4は上流側揺動機構7aの偏心位置が上死点で、下流側揺動機構7bの偏心位置が下死点にきた状態を示す。この場合、下流側金型対3で斜線部の圧下が終了し、上流側金型対2は最大開放状態となる。下流側揺動機構7bの偏心位置が下死点より上昇に向かうと、下流側金型対3は開き、上流側金型対2は閉じ始める。これとともに搬送装置10a,10bにより、被成形材1を開いた金型間に、下流側可動金型3aを押圧し開放を付勢しながら押し入れる。これとともに昇降機構13を追従させ、下側の固定金型2b,3bと当たりを少なくし円滑に被成形材1を移動し、略1/4回転すると図5の状態となる。
【0029】
図5は上流側揺動機構7aと下流側揺動機構7bの偏心位置が中間位置にきた状態を示す。上流側金型対2は間隔が開いた状態から閉じて圧下開始状態になり、被成形材1が移動してくるので、上流側可動金型2aのテーパー部が被成形材1の傾斜部と接触し停止する。しかし、下流側金型対3は開いてゆくので、被成形材1が移動してきても下流側可動金型3aとは接触しない。この状態から上流側可動金型2aによる圧下が始まり、図6に示す状態になってゆく。
【0030】
図6は上流側揺動機構7aの偏心位置が下死点で、下流側揺動機構7bの偏心位置が上死点にきた状態を示す。この場合、上流側金型対2で斜線部の圧下が終了し、下流側金型対3は最大開放状態となる。上流側揺動機構7aの偏心位置が下死点より上昇に向かうと、上流側金型対2は開き、下流側金型対3は閉じ始める。これとともに搬送装置10a,10bにより、被成形材1を開いた金型間に、上流側可動金型2aを押圧し開放を付勢しながら押し入れる。これとともに昇降機構13を作動させ、下側の固定金型2b,3bと当たりを少なくし円滑に被成形材1を移動し、略1/4回転すると図7の状態となる。
【0031】
図7は上流側揺動機構7aと下流側揺動機構7bの偏心位置が中間位置にきた状態を示す。上流側金型対2は間隔が開いてゆくので、被成形材1が移動してきても上流側可動金型2aは接触しない。一方、下流側金型対3は開いた状態から閉じつつあり、被成形材1が移動してくると、下流側可動金型3aのテーパー部が被成形材1の傾斜部と接触し停止する。この状態から下流側可動金型3aによる圧下が始まる。以上の動作を繰り返して圧下が行われる。
【0032】
次に第4実施形態を説明する。図8は第4実施形態の板厚圧下装置の構成を示す。図3に示した第3実施形態は間欠搬送方式で、圧下中は被成形材1の移動はできず、上流側金型の圧下工程と下流側金型の圧下工程の間に移動が行われている。これに対して第4実施形態は圧下中も被成形材1を移動する走間プレス方式である。なお、図3と同一符号は同一の機能を有するものを表す。上流側可動金型2aは可動金型用スライダー11により水平方向に摺動可能に支持され、上流側固定金型2bは固定金型用スライダー14により同様に支持されている。可動金型用スライダー11は上流側揺動機構7aと連結しており、固定金型用スライダー14は金型間ギャップ調整用ライナー6を介して金型ホルダー5に取付けられている。各金型用スライダー11、14には水平方向に金型2a,2bを往復動するシリンダ12が設けられている。下流側金型対3も同様な構造となっており、下流側可動金型3aの可動金型用スライダー11は下流側揺動機構7bと連結している。
【0033】
次に動作について説明する。全体の動作は図4〜図7と同様であるが、図4、図6に示す圧下時は上下の金型はシリンダ12により被成形材1と略同じ速度で移動する。なお、圧下開放時は、金型はシリンダ12により上流側待機位置へ移動する。これにより、被成形材1を停止させることなく、被成形材慣性による衝撃力を抑制し連続的に圧下することが可能となる。
【0034】
上述の実施形態では、可動金型を上流側、下流側共に上側としたが、共に下側とすることも可能である。また、上流側揺動機構7aと下流側揺動機構7bとを180度の位相差としたが、他の位相差としてもよい。また電動機8により3個の歯車9a,9b,9cを用いて両揺動機構7a,7bを駆動したが、これに限らず1個の電動機8で両両揺動機構7a,7bを位相差をつけて駆動できればよい。
【0035】
また上述の実施形態では、固定金型は被成形材と接する面を水平面とテーパー面からなるテーパー付金型としたが、これを水平面のみからなる固定平金型とすることにより、搬送時の被成形材の上下の挙動を少なくし搬送を容易にすることができる。また上流側固定金型と下流側固定金型を被成形材の下側に配置し、固定平金型とし、さらに一体化構造とすることにより、搬送の容易さに加え、固定金型の構造とその支持構造を単純化することができる。
【0036】
【発明の効果】
以上の説明より明らかなように、本発明は、上下金型の一方を可動金型とし、他方を固定金型とし、可動金型のみを駆動することにより慣性質量を半減し圧下動力を大幅に軽減することができる。また、上流側金型対と下流側金型対を設け、上流側金型対の一方と下流側金型の上流側金型と同じ側の金型を互いに位相差をもつ別々の揺動機構に接続し、この両揺動機構を1個の駆動装置で上下動させる。これにより、電動機1個で上流側金型と下流側金型を交互に圧下動作させることもできる。圧下は交互に行われるので、圧下に要する動力は少くなる。また搬送装置に昇降機構を設けることにより被成形材の安定した搬送ができる。さらに固定金型を固定平金型にすることによりさらに安定した搬送が可能になる。また金型を連続搬送で圧下できるので、被成形材より発生する衝撃力を抑制し装置の軽量化ができる。
【図面の簡単な説明】
【図1】本発明の第1実施形態の構成図である。
【図2】本発明の第2実施形態の構成図である。
【図3】本発明の第3実施形態の構成図である。
【図4】第3実施形態の動作を示し、上流側揺動機構の偏心位置が上死点で、下流側揺動機構の偏心位置が下死点の場合である。
【図5】第3実施形態の動作を示し、上流側揺動機構と下流側揺動機構の偏心位置が中間の位置の場合である。
【図6】第3実施形態の動作を示し、上流側揺動機構の偏心位置が下死点で、下流側揺動機構の偏心位置が上死点の場合である。
【図7】第3実施形態の動作を示し、上流側揺動機構と下流側揺動機構の偏心位置が中間の位置の場合である。
【図8】本発明の第4実施形態の構成図である。
【図9】従来の厚み圧下プレスの構成図である。
【図10】従来のタンデム式厚み圧下プレスの構成図である。
【符号の説明】
1 被成形材
2 上流側金型対
2a 上流側可動金型
2b 上流側固定金型
3 下流側金型対
3a 下流側可動金型
3b 下流側固定金型
4 フレーム
5 金型ホルダー
6 金型間ギャップ調整用ライナー
7 揺動機構
7a 上流側揺動機構
7b 下流側揺動機構
8 電動機
9a,9b,9c 歯車
10a,10b 搬送装置
11 可動金型用スライダー
12 シリンダー
13 昇降機構
14 固定金型用スライダー
20 金型対
20a 可動金型
20b 固定金型
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plate thickness reduction method and apparatus for reducing a material to be molded.
[0002]
[Prior art]
Conventionally, when roll-rolling a workpiece such as a slab or a rough bar, the rolling reduction (reduction from the original thickness) is more than the limit of the biting rate of the rolling roll (ratio of the rolling roll diameter to the original thickness). The ratio (thickness ratio) is limited, and two methods, a tandem mill method and a reversible rolling method, have been generally used. However, in recent years, there has been a need for a press method with a high rolling reduction ratio, suppression of heat dissipation during rolling, and further downsizing of equipment, and less restrictions on the rolling reduction ratio.
[0003]
For example, Japanese Patent Laid-Open No. 2-175011 proposes a running thickness reduction press using a single press. FIG. 9 is a diagram showing the basic structure of this press. Tapered molds 100 are provided above and below the material 1 to be molded, and each mold 100 is moved up and down in synchronization with an eccentric shaft 102 via a rod 101. The spherical member is held slidable in the vertical direction at the intermediate point of the rod 101, and can be swung in the flow direction, thereby reducing the thickness during running. Further, in order to reduce the rolling load, Japanese Patent Laid-Open No. 11-114602 proposes a tandem press.
[0004]
German patent publication DE 2531591 A1 describes a tandem press that presses in two stages. FIG. 10 is a diagram showing the basic structure of this press. A movable mold 100a and a fixed mold 100b are provided above and below the material 1 to be molded. Each mold 100a, 100b is a tapered mold, and the upper mold 100a of the upstream mold pair is connected to the eccentric shaft 102 via the rod 101 so as to be swingable, and the lower mold 100b is fixed. . The upper mold 100b of the downstream mold pair is fixed, and the lower mold 100a is connected to the eccentric shaft 102 via the rod 101 so as to be swingable. The upstream mold 100a and the downstream mold 100a move up and down with a phase difference of 180 degrees, and the material to be molded 1 is alternately pressed down.
[0005]
[Problems to be solved by the invention]
In the presses of JP-A-2-175011 and JP-A-11-114602, the pair of upper and lower molds move up and down with the upper and lower molds, so that the inertial mass of the movable part becomes large, and the horsepower required for substantial reduction is reduced. However, the acceleration / deceleration horsepower for synchronizing the molds tends to increase, and we focused on reducing the incidental acceleration / deceleration horsepower. On the other hand, in the press of the tandem and intermittent conveyance method of German 2531591A1, the upper and lower pair of dies are each configured by a tapered die, and the fixed dies are arranged in the opposite direction on the entry side and the exit side. Therefore, when transporting the molding material after the end of the rolling, the upper and lower molds prevent the other stationary mold from interfering with the molding material when traveling while moving up the tapered portion of one of the upper and downstream stationary molds. There is a problem that it is necessary to increase the gap between the molds, and the crank radius is increased and the rotational torque is increased. Further, since the vertical movement is large, unstable conveyance is required and countermeasures are required, and there is a disadvantage that the number of auxiliary devices is increased.
[0006]
The present invention has been made in view of the above-described problems, and a pair of molds is provided in a single row or a double row in the molding material conveyance direction, one mold is fixed, and the other mold is a movable mold. The purpose is to provide a plate thickness reduction method and apparatus that reduces the movable mass and further arranges the movable molds of both mold pairs provided in tandem on the same upper and lower sides and halves the vertical amplitude of the material to be molded. And
[0007]
[Means for Solving the Problems]
In order to achieve the above object, in the first aspect of the present invention, a pair of molds arranged one above the other with the material to be molded interposed therebetween is arranged at an upstream location and a downstream location in the flow direction of the material to be molded , One of the upstream mold pairs is configured as a movable mold that performs a reduction operation, and the other mold is configured by a fixed mold. Further, one movable mold of the downstream mold pair is on the same side as the upstream movable mold. Arranging a fixed mold on the other side, and providing a conveying device for conveying the material to be molded, the conveying device having a lifting mechanism for raising and lowering the material to be molded,
The upstream movable mold and a downstream movable mold while pressure and opening alternately to be profiled is conveyed by the conveying device during the mold opening operation,
When the mold pair is opened up and down and the material to be molded is conveyed by the conveying device, the height of the material to be molded is adjusted by the lifting mechanism from the height when the mold material is crushed by the mold pair. Thus, the interference between the molding material and the mold is reduced .
[0008]
It moves up and down one of the upper and lower molds, the inertial mass is halved by fixing the other, Ru can significantly reduce the drive power.
[0009]
In the invention of claim 2, a pair of molds are arranged above and below with a material to be molded, and one mold of the mold pair is a movable mold that moves up and down by a swing mechanism, and the other The mold is a fixed mold that is held at a predetermined position, and is provided with a conveying device that conveys the molding material to at least one of the upstream side and the downstream side of the mold pair,
The conveying device has an elevating mechanism for elevating the material to be molded,
The elevating mechanism opens the mold pair up and down and conveys the molding material by the conveying device, and determines the height of the molding material and the height when the molding material is reduced by the mold pair. Thus, interference between the molding material and the mold is eliminated or reduced.
[0010]
One movable mold of the pair of upper and lower molds moves up and down by a swing mechanism, and the other fixed mold is fixed by a mold fixing mechanism. The movable mass of the press is only a movable mold, which can halve the inertial mass and greatly reduce the driving power. Further, the elevating mechanism opens the mold pair up and down and conveys the material to be molded by the conveying device, and determines the height of the material to be molded and the height when the material to be pressed is reduced by the mold pair. Accordingly, the interference between the molding material and the mold is eliminated or reduced, and further, the vibration of the molding material is suppressed and the molding material is moved up and down, so that stable conveyance can be performed.
[0011]
According to a third aspect of the present invention, there is provided a reciprocating device for reciprocating the two molds in the flow direction of the molding material in the second aspect, and the mold is moved at a speed substantially the same as the moving speed of the molding material during the reduction. Move to the downstream side and return to the upstream side when opened.
[0012]
In the apparatus according to claim 2, the material to be molded can be continuously reduced by moving the movable mold and the fixed mold being reduced in the flow direction of the material to be molded at substantially the same speed as the material to be molded. it can.
[0013]
In a fourth aspect of the present invention, a pair of molds arranged above and below the material to be molded are arranged in tandem, and the upstream side and the downstream side of the mold pair are respectively a movable mold and a fixed mold. An upstream swing mechanism configured to move up and down one movable mold of the upstream mold pair and a downstream side to move up and down the movable mold on the same side as the upstream movable mold of the downstream mold pair An oscillating mechanism, an oscillating device that rotates the upstream oscillating mechanism and the downstream oscillating mechanism at phases different from each other, and at least the upstream side of the upstream mold pair and the downstream side of the downstream mold pair. On one side, a conveying device for conveying the material to be molded is provided,
The conveying device has an elevating mechanism for elevating the material to be molded,
The elevating mechanism opens the mold pair up and down and conveys the molding material by the conveying device, and determines the height of the molding material and the height when the molding material is reduced by the mold pair. Thus, the interference between the molding material and the mold is reduced.
[0014]
The single press system according to the invention of claim 2 is adapted to cope with a high pressure load. In the case of a single press, when the reduction load increases, the mechanical strength increases and may not be structurally realized. By adopting the double press method, the rolling load per one time can be halved, so press molding corresponding to high pressure can be performed.
[0015]
In the invention of claim 5, in claim 4, a reciprocating device is provided for reciprocating the movable mold and the fixed mold of the upstream mold pair and the downstream mold pair in the flow direction of the molding material, The mold is moved to the downstream side at a speed substantially the same as the moving speed of the molding material at the time of reduction, and returned to the upstream side at the time of no reduction.
[0016]
5. The apparatus according to claim 4, wherein the molding material can be continuously crushed by moving the squeezed movable mold and fixed mold in the flow direction of the molding material at substantially the same speed as the molding material. it can.
[0017]
According to a sixth aspect of the present invention, in any one of the second to fifth aspects, the fixed mold is disposed below the material to be molded, and a fixed flat mold having a horizontal surface in contact with the material to be molded is provided.
[0018]
By setting the fixed mold below the material to be molded and using the fixed flat mold, the vertical movement of the material to be molded during conveyance can be reduced and the conveyance can be facilitated.
[0019]
According to a seventh aspect of the present invention, in the fourth or fifth aspect, the upstream fixed mold and the downstream fixed mold are arranged below the molding material, and the fixed flat mold having a horizontal surface in contact with the molding material In addition, both molds have an integrated structure.
[0020]
By making the fixed mold below the material to be molded and using a fixed flat mold, the upper and lower fixed molds and the downstream side are made easier in addition to reducing the up and down behavior of the material to be molded during conveyance. By making the fixed mold into an integrated structure, the mold structure and its support structure can be simplified.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram showing a configuration of a plate thickness reduction device according to a first embodiment of the present invention. The plate thickness reduction device includes a mold pair 20 provided with a molding material 1 such as a slab, a frame 4 surrounding the mold pair 20, a swing mechanism 7 provided on the upper side of the frame 4, Conveying devices 10 a and 10 b provided on the upstream side and the downstream side of the frame 4 are provided. The conveying devices 10a and 10b are constituted by pinch rolls and are provided with an elevating mechanism 13. The conveying device 10a and 10b are moved up and down at the time of conveyance so that the interference with the mold pair 20 can be reduced and smoothly conveyed. The mold pair 20 includes a movable mold 20a provided on the upper side and a fixed mold 20b provided on the lower side. The movable mold 20a is a swinging mechanism including an eccentric shaft that moves up and down by a driving device (not shown). 7, the fixed mold 20 b is fixed to the mold holder 5 via the inter-mold gap adjusting liner 6. The mold holder 5 is attached to the frame 4. Each of the molds 20a and 20b is a tapered mold in which a surface in contact with the molding material 1 is a horizontal surface and a tapered surface.
[0022]
Next, the operation will be described.
By driving the swing mechanism 7, the movable mold 20a is lowered, and the material 1 to be molded is pressed down. At this time, the molding material 1 is in a stopped state. When the reduction is completed, the movable mold 20a rises and opens between both molds 20a and 20b. Both the conveying apparatuses 10a and 10b are operated, and the molding material 1 is sent out. At this time, the material to be molded 1 can be raised by the lifting mechanism 13 of the transport device, and can be smoothly transported with less interference with the fixed mold 20b. In this way, pressing can be performed intermittently. Moreover, since only one movable mold in the mold pair 20 is driven, the movable mass is reduced, so that the mold drive power can be greatly reduced.
[0023]
Next, a second embodiment will be described. FIG. 2 shows the configuration of the plate thickness reduction device of the second embodiment. In the first embodiment shown in FIG. 1, the material to be molded 1 cannot be moved during the reduction, and the movement is performed during the reduction. On the other hand, 2nd Embodiment is a running press system which moves the to-be-molded material 1 also during rolling. The same reference numerals as those in FIG. 1 denote the same functions. The movable mold 20 a is supported by the movable mold slider 11 so as to be slidable in the horizontal direction, and the fixed mold 20 b is similarly supported by the fixed mold slider 14. The movable mold slider 11 is connected to the swing mechanism 7, and the fixed mold slider 14 is attached to the mold holder 5 via the inter-mold gap adjusting liner 6. Each of the mold sliders 11 and 14 is provided with a cylinder 12 that reciprocates the molds 20a and 20b in the horizontal direction.
[0024]
Next, the operation will be described. Although the entire operation is the same as that of the first embodiment, the upper and lower molds 20a and 20b being reduced are moved downstream by the cylinder 12 at substantially the same speed as the material 1 to be molded. Note that the molds 20a and 20b are moved upstream by the cylinder 12 when opened. Thereby, it is possible to suppress the impact force due to the inertia of the molding material without stopping the molding material 1 and to continuously reduce the molding material.
[0025]
Next, a third embodiment will be described.
FIG. 3 is a diagram showing a configuration of a plate thickness reduction device according to a third embodiment of the present invention. The plate thickness reduction device surrounds a mold member 2 such as a slab with an upstream mold pair 2, a downstream mold pair 3 on the downstream side in the flow direction of the mold material 1, and both mold pairs 2 and 3. Frame 4, upstream swing mechanism 7 a provided on the upper side of frame 4, downstream swing mechanism 7 b, swing device for driving both swing mechanisms, and conveyance provided on the upstream side and downstream side of frame 4 It is comprised from apparatus 10a, 10b. The conveying devices 10a and 10b are constituted by pinch rolls and are provided with an elevating mechanism 13. The conveying device 10a and 10b are moved up and down during conveyance so that interference with the mold pairs 2 and 3 can be reduced and conveyed smoothly. The upstream mold pair 2 is composed of an upstream movable mold 2a and an upstream fixed mold 2b. The upstream movable mold 2a is provided on the upper side of the molding material 1 and the surface in contact with the molding material 1 is It is a taper mold comprising a horizontal surface and a tapered surface. The upstream fixed mold 2b is provided on the lower side, is similarly a tapered mold, and is attached to the mold holder 5 via the inter-mold gap adjusting liner 6. The mold holder 5 is fixed to the frame 4.
[0026]
Similarly, the downstream mold pair 3 includes a downstream movable mold 3a and a downstream fixed mold 3b. The downstream movable mold 3a is provided on the upper side of the material 1 and a tapered mold is used. . The downstream side fixed mold 3b is provided on the lower side, similarly a tapered mold is used, and is attached to the mold holder 5 via a gap adjusting liner 6 between molds.
[0027]
At the top of the frame 4, an upstream swing mechanism 7a having an eccentric shaft that moves the upstream movable mold 2a up and down and a downstream swing mechanism 7b that has an eccentric shaft that moves the downstream movable mold 3a up and down. And are provided. Both swinging mechanisms 7a and 7b are in a state in which a phase difference of 180 degrees is given to each other as shown in the figure. The oscillating device includes an electric conductor 8 and gears 9a, 9b, 9c. The electric motor 8 rotates the gear 9a, and the gear 9a rotates the gears 9b, 9c arranged on the left and right. The gear 9b rotates the upstream swing mechanism 7a, and the gear 9c rotates the downstream swing mechanism 7b. Thereby, by rotating the electric motor 8, the upstream movable mold 2a and the downstream movable mold 3a can be alternately moved up and down with a phase difference of 180 degrees. Pinch rolls 10a and 10b are provided on the upstream side and the downstream side of the frame 4 to convey the molding material 1 in the flow direction. The conveying devices 10a and 10b are provided with an elevating mechanism 13, and the molding material 1 is moved up and down during conveyance so that interference with the mold pairs 2 and 3 can be reduced and smoothly conveyed. Since both the upstream and downstream mold pairs 2 and 3 are driven only by the movable mold, the driving power can be greatly reduced. Moreover, it is possible to drive two movable molds with a phase difference with a single electric motor, which is a simple driving device.
[0028]
Next, the operation will be described with reference to FIGS.
FIG. 4 shows a state where the eccentric position of the upstream swing mechanism 7a is at the top dead center and the eccentric position of the downstream swing mechanism 7b is at the bottom dead center. In this case, the reduction of the hatched portion is completed in the downstream mold pair 3, and the upstream mold pair 2 is in the maximum open state. When the eccentric position of the downstream oscillating mechanism 7b moves upward from the bottom dead center, the downstream mold pair 3 opens and the upstream mold pair 2 starts to close. At the same time, the downstream movable mold 3a is pressed between the molds with the material to be molded 1 opened by the conveying devices 10a and 10b while pushing the opening. At the same time, the elevating mechanism 13 is caused to follow, the contact with the lower stationary molds 2b and 3b is reduced, the molding material 1 is smoothly moved, and the state shown in FIG.
[0029]
FIG. 5 shows a state in which the eccentric positions of the upstream-side swing mechanism 7a and the downstream-side swing mechanism 7b are at the intermediate positions. Since the upstream mold pair 2 is closed from the open state and starts to be reduced, the molding material 1 moves, so that the taper portion of the upstream movable mold 2a is in contact with the inclined portion of the molding material 1. Touch and stop. However, since the downstream mold pair 3 opens, even if the molding material 1 moves, it does not contact the downstream movable mold 3a. From this state, the reduction by the upstream side movable mold 2a starts and the state shown in FIG. 6 is reached.
[0030]
FIG. 6 shows a state in which the eccentric position of the upstream swing mechanism 7a is at the bottom dead center and the eccentric position of the downstream swing mechanism 7b is at the top dead center. In this case, the reduction of the hatched portion is completed in the upstream mold pair 2, and the downstream mold pair 3 is in the maximum open state. When the eccentric position of the upstream rocking mechanism 7a moves upward from the bottom dead center, the upstream mold pair 2 opens and the downstream mold pair 3 starts to close. At the same time, the upstream movable mold 2a is pressed between the molds with the material to be molded 1 opened by the conveying devices 10a and 10b while pushing the opening. At the same time, the elevating mechanism 13 is actuated to reduce the contact with the lower fixed molds 2b and 3b and smoothly move the molding material 1, and when it is rotated approximately 1/4, the state shown in FIG. 7 is obtained.
[0031]
FIG. 7 shows a state in which the eccentric positions of the upstream side swing mechanism 7a and the downstream side swing mechanism 7b are at the intermediate position. Since the upstream mold pair 2 is spaced apart, the upstream movable mold 2a does not contact even if the molding material 1 moves. On the other hand, the downstream mold pair 3 is closing from the open state, and when the molding material 1 moves, the tapered portion of the downstream movable mold 3a comes into contact with the inclined portion of the molding material 1 and stops. . From this state, the reduction by the downstream movable mold 3a starts. The above operation is repeated to perform the reduction.
[0032]
Next, a fourth embodiment will be described. FIG. 8 shows the configuration of the plate thickness reduction device of the fourth embodiment. The third embodiment shown in FIG. 3 is an intermittent conveyance system, and the molding material 1 cannot be moved during the reduction, and the movement is performed between the upstream mold pressing process and the downstream mold pressing process. ing. On the other hand, 4th Embodiment is a running press system which moves the to-be-molded material 1 also during rolling-down. Note that the same reference numerals as those in FIG. 3 denote the same functions. The upstream movable mold 2 a is supported by a movable mold slider 11 so as to be slidable in the horizontal direction, and the upstream fixed mold 2 b is similarly supported by a fixed mold slider 14. The movable mold slider 11 is connected to the upstream swing mechanism 7 a, and the fixed mold slider 14 is attached to the mold holder 5 via the inter-mold gap adjusting liner 6. Each of the mold sliders 11 and 14 is provided with a cylinder 12 that reciprocates the molds 2a and 2b in the horizontal direction. The downstream mold pair 3 has the same structure, and the movable mold slider 11 of the downstream movable mold 3a is connected to the downstream swing mechanism 7b.
[0033]
Next, the operation will be described. The overall operation is the same as that shown in FIGS. 4 to 7, but the upper and lower molds are moved by the cylinder 12 at substantially the same speed as that of the workpiece 1 during the reduction shown in FIGS. 4 and 6. Note that the mold moves to the upstream standby position by the cylinder 12 when the reduction is released. Thereby, it is possible to suppress the impact force due to the inertia of the molding material and continuously reduce the molding material 1 without stopping the molding material 1.
[0034]
In the above-described embodiment, the movable mold is on the upper side on both the upstream side and the downstream side, but it is also possible to have both on the lower side. Further, although the upstream swing mechanism 7a and the downstream swing mechanism 7b have a phase difference of 180 degrees, other phase differences may be used. In addition, although both swing mechanisms 7a and 7b are driven by the electric motor 8 using the three gears 9a, 9b and 9c, the present invention is not limited to this and both the swing mechanisms 7a and 7b are phase-shifted by the single motor 8. It only has to be able to drive with it.
[0035]
In the above-described embodiment, the fixed mold is a tapered mold having a horizontal surface and a tapered surface on the surface in contact with the material to be molded, but this is a fixed flat mold consisting only of a horizontal surface. The vertical movement of the material to be molded can be reduced and the conveyance can be facilitated. Also, the upstream fixed mold and the downstream fixed mold are arranged below the material to be molded to form a fixed flat mold and an integrated structure. And its support structure can be simplified.
[0036]
【The invention's effect】
As is clear from the above description, the present invention has one of the upper and lower molds as a movable mold and the other as a fixed mold, and driving only the movable mold reduces the inertial mass by half and greatly reduces the reduction power. Can be reduced. In addition, an upstream mold pair and a downstream mold pair are provided, and separate swing mechanisms having a phase difference between one of the upstream mold pair and the mold on the same side as the upstream mold of the downstream mold The two swing mechanisms are moved up and down by one drive device. Thereby, the upstream mold and the downstream mold can be alternately driven by one electric motor. Since the reduction is performed alternately, less power is required for the reduction. In addition, the material to be molded can be stably conveyed by providing the elevating mechanism in the conveying device. Further, by using a fixed flat mold as the fixed mold, more stable conveyance is possible. Further, since the mold can be reduced by continuous conveyance, the impact force generated from the material to be molded can be suppressed, and the weight of the apparatus can be reduced.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a first embodiment of the present invention.
FIG. 2 is a configuration diagram of a second embodiment of the present invention.
FIG. 3 is a configuration diagram of a third embodiment of the present invention.
FIG. 4 shows the operation of the third embodiment, where the eccentric position of the upstream swing mechanism is at the top dead center and the eccentric position of the downstream swing mechanism is at the bottom dead center.
FIG. 5 shows the operation of the third embodiment, and is a case where the eccentric position of the upstream swing mechanism and the downstream swing mechanism is an intermediate position.
FIG. 6 shows the operation of the third embodiment, where the eccentric position of the upstream swing mechanism is at the bottom dead center and the eccentric position of the downstream swing mechanism is at the top dead center.
FIG. 7 shows the operation of the third embodiment, and is a case where the eccentric position of the upstream swing mechanism and the downstream swing mechanism is an intermediate position.
FIG. 8 is a configuration diagram of a fourth embodiment of the present invention.
FIG. 9 is a configuration diagram of a conventional thickness reduction press.
FIG. 10 is a configuration diagram of a conventional tandem thickness reduction press.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Molding material 2 Upstream mold pair 2a Upstream movable mold 2b Upstream fixed mold 3 Downstream mold pair 3a Downstream movable mold 3b Downstream fixed mold 4 Frame 5 Mold holder 6 Between molds Gap adjusting liner 7 Oscillating mechanism 7a Upstream side oscillating mechanism 7b Downstream side oscillating mechanism 8 Electric motors 9a, 9b, 9c Gears 10a, 10b Conveying device 11 Movable mold slider 12 Cylinder 13 Lifting mechanism 14 Fixed mold slider 20 mold pair 20a movable mold 20b fixed mold

Claims (7)

被成形材を挟んで上下に配置された1対の金型対を被成形材の流れ方向における上流側箇所および下流側箇所に配置し、上流側金型対の一方を圧下動作する可動金型とし他方の金型を固定金型とにより構成し、更に下流側金型対の一方の可動金型は上流側可動金型と同じ側に配列し、他方に固定金型を配列し、被成形材を搬送する搬送装置を設け、該搬送装置は被成形材を昇降する昇降機構を有し、
上流側可動金型と下流側可動金型とを交互に圧下・開放するとともに、金型開放動作時に被成形材を前記搬送装置により搬送し
前記金型対を上下に開いて被成形材を前記搬送装置で搬送する時に、被成形材の高さを、該金型対で被成形材を圧下する時の当該高さから前記昇降機構により変更し、これにより、被成形材と前記金型との干渉を低減することを特徴とする板厚圧下方法。
A pair of molds arranged one above the other with the material to be molded interposed between them at the upstream side and the downstream side in the flow direction of the material to be molded , and one of the upstream die pairs is operated to perform a reduction operation. The other mold is composed of a fixed mold, and one movable mold of the downstream mold pair is arranged on the same side as the upstream movable mold, and the fixed mold is arranged on the other, and the molding is performed. A conveying device for conveying the material, the conveying device has a lifting mechanism for lifting and lowering the molding material;
The upstream movable mold and a downstream movable mold while pressure and opening alternately to be profiled is conveyed by the conveying device during the mold opening operation,
When the mold pair is opened up and down and the material to be molded is conveyed by the conveying device, the height of the material to be molded is adjusted by the lifting mechanism from the height when the mold material is crushed by the mold pair. A sheet thickness reduction method, characterized in that the interference between the material to be molded and the mold is reduced .
被成形材を挟んで上下に配置された1対の金型対を備え、該金型対の一方の金型は揺動機構により上下動する可動金型とし、他方の金型は所定の位置に保持される固定金型とし、金型対の上流側、下流側の少なくとも一方に被成形材を搬送する搬送装置を設け、
該搬送装置は、被成形材を昇降する昇降機構を有し、
該昇降機構は、前記金型対を上下に開いて被成形材を前記搬送装置で搬送する時に、被成形材の高さを、該金型対で被成形材を圧下する時の当該高さから変更し、これにより、被成形材と前記金型との干渉を無くし又は低減することを特徴とする板厚圧下装置。
A pair of molds disposed vertically with a material to be molded interposed therebetween, wherein one mold of the mold pair is a movable mold that moves up and down by a swing mechanism, and the other mold is at a predetermined position. A fixed mold to be held in, and provided with a conveying device for conveying the molding material to at least one of the upstream side and the downstream side of the mold pair,
The conveying device has an elevating mechanism for elevating the material to be molded,
The elevating mechanism opens the mold pair up and down and conveys the molding material by the conveying device, and determines the height of the molding material and the height when the molding material is reduced by the mold pair. The sheet thickness reduction device is characterized in that interference between the molding material and the mold is eliminated or reduced .
前記両金型を被成形材の流れ方向に往復動させる往復動装置が設けられ、圧下時被成形材の移動速度と略同じ速度で金型を下流側へ移動させ、開放時上流側に復帰させることを特徴とする請求項2記載の板厚圧下装置。  A reciprocating device for reciprocating both molds in the flow direction of the molding material is provided, and the mold is moved to the downstream side at approximately the same speed as that of the molding material at the time of reduction, and returned to the upstream side when opened. The plate thickness reduction device according to claim 2, wherein: 被成形材を挟んで上下に配置された1対の金型対がタンデムに配置され該金型対の上流側及び下流側のそれぞれが可動金型と固定金型より構成され、上流側金型対の上下一方の可動金型を上下動する上流側揺動機構と、下流側金型対の上流側可動金型と同じ側の可動金型を上下動する下流側揺動機構と、上流側揺動機構と下流側揺動機構とを互いに異なる位相で回転する揺動装置と、前記上流側金型対の上流側と前記下流側金型対の下流側の少なくとも一方に被成形材を搬送する搬送装置を設け、
該搬送装置は、被成形材を昇降する昇降機構を有し、
該昇降機構は、前記金型対を上下に開いて被成形材を前記搬送装置で搬送する時に、被成形材の高さを、該金型対で被成形材を圧下する時の当該高さから変更し、これにより、被成形材と前記金型との干渉を低減することを特徴とする板厚圧下装置。
A pair of molds arranged above and below the material to be molded are arranged in tandem, and the upstream and downstream sides of the mold pair are each composed of a movable mold and a fixed mold. An upstream swing mechanism that moves up and down one movable mold of the pair, a downstream swing mechanism that moves up and down the movable mold on the same side as the upstream movable mold of the downstream mold pair, and an upstream side A rocking device that rotates the rocking mechanism and the downstream rocking mechanism in different phases, and a workpiece to be conveyed to at least one of the upstream side of the upstream mold pair and the downstream side of the downstream mold pair A transport device is provided,
The conveying device has an elevating mechanism for elevating the material to be molded,
The elevating mechanism opens the mold pair up and down and conveys the molding material by the conveying device, and determines the height of the molding material and the height when the molding material is reduced by the mold pair. The plate thickness reduction device is characterized in that the interference between the molding material and the mold is reduced .
前記上流側金型対及び下流側金型対の可動金型及び固定金型を被成形材の流れ方向に往復動させる往復動装置が設けられ、圧下時被成形材の移動速度と略同じ速度で金型を下流側へ移動させ、開放時上流側に復帰させることを特徴とする請求項4記載の板厚圧下装置。  A reciprocating device for reciprocating the movable mold and the stationary mold of the upstream mold pair and the downstream mold pair in the flow direction of the molding material is provided, and the speed is substantially the same as the moving speed of the molding material during the reduction. 5. The plate thickness reduction device according to claim 4, wherein the die is moved downstream and returned to the upstream side when opened. 前記固定金型を被成形材下側に配置し、かつ被成形材と接する面が水平な固定平金型としたことを特徴とする請求項2ないし5のいずれかに記載の板厚圧下装置。  6. The plate thickness reduction device according to claim 2, wherein the fixed die is disposed on the lower side of the material to be molded, and is a fixed flat die having a horizontal surface in contact with the material to be molded. . 前記上流側固定金型および下流側固定金型を被成形材下側に配置し、かつ被成形材と接する面が水平な固定平金型とし、更に両金型を一体化構造としたことを特徴とする請求項4または5記載の板厚圧下装置。  The upstream fixed mold and the downstream fixed mold are arranged below the material to be molded, the surface in contact with the material to be molded is a fixed flat mold, and the two molds have an integrated structure. The plate thickness reduction device according to claim 4 or 5, characterized in that:
JP25969699A 1999-09-14 1999-09-14 Sheet thickness reduction method and apparatus Expired - Fee Related JP4147566B2 (en)

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