JP4138740B2 - Method for producing ceramic green sheet and method for producing ceramic electronic component - Google Patents

Description

  The present invention relates to a method for producing a ceramic green sheet and a method for producing a ceramic electronic component.

  In order to manufacture a ceramic electronic component such as a ceramic capacitor, a ceramic green sheet in which a conductor pattern or the like is incorporated in a thin film made of a ceramic material is used. The ceramic green sheet is usually provided on a predetermined substrate, and the ceramic electronic component is manufactured, for example, by peeling and transferring and laminating the ceramic green sheet from the substrate. In this case, in order to facilitate the peeling of the ceramic green sheet from the base material, a base material whose surface is subjected to a release treatment is usually used.

As a method for producing a ceramic green sheet, for example, a method described in Patent Document 1 is known. In this method, first, a photosensitive conductive paste is applied to the surface of a support and dried to form a photosensitive conductive film on the support. Next, the photosensitive conductive film is irradiated with light such as ultraviolet rays through a mask. Subsequently, the photosensitive conductive film is developed using a developer. Thereby, a conductor pattern of a predetermined shape is formed on the support. Furthermore, an insulator layer is formed on the surface of the support so as to cover the conductor pattern.
JP 2003-168617 A

  However, in the method for producing a ceramic green sheet described in Patent Document 1, a fine conductor pattern is peeled off from the support during development. In particular, since the miniaturization of the conductor pattern is remarkable in recent years, it is difficult to form a fine conductor pattern on the support by the above method. In addition, it is more difficult to form a fine conductor pattern portion on a base material whose surface has been subjected to a release treatment.

  Then, an object of this invention is to provide the manufacturing method of the ceramic green sheet which can form a fine pattern on the base material by which the mold release process was performed on the surface, and the manufacturing method of a ceramic electronic component.

In order to achieve the above object, a method for producing a ceramic green sheet according to the present invention includes a first material having a conductive component powder on a substrate having a release treatment on the surface and having solubility in a predetermined solvent. A step of forming a base layer made of a conductive material, a step of forming a top layer made of a conductive material containing a conductive component powder on the base layer, and exposing a predetermined portion of the top layer. Applying a predetermined solvent, developing the upper layer to form the first conductor pattern portion, etching the underlayer to form the second conductor pattern portion, and insulating on the base material A step of forming a layer, wherein the average particle diameter d1 of the first conductive material and the average particle diameter d2 of the second conductive material satisfy a relationship represented by the following formula (1): To do.
d2> d1 (1)

In another method for producing a ceramic green sheet of the present invention, a base layer made of a ceramic material containing ceramic powder and having solubility in a predetermined solvent is formed on a base material having a release treatment applied to the surface. Using a predetermined solvent, a step of forming an upper layer made of a conductive material containing a conductive component powder and having a photosensitive property on the base layer, a step of exposing a predetermined portion of the upper layer, and a predetermined solvent. Developing the ground layer to form a conductor pattern portion, etching the ground layer to form a ceramic pattern portion, and forming an insulating layer on the substrate, the average particle diameter d1 of the ceramic material, The average particle diameter d2 of the conductive material satisfies the relationship shown in the following formula (1).
d2> d1 (1)

Furthermore, another method for producing a ceramic green sheet according to the present invention includes a base layer made of a conductive material containing a powder of a conductive component and having a solubility in a predetermined solvent on a substrate whose surface has been subjected to a release treatment. Using a predetermined solvent, a step of forming an upper layer made of a ceramic material containing ceramic powder and having photosensitivity on the underlayer, a step of exposing a predetermined portion of the upper layer, and a predetermined solvent. The base layer is developed to form a ceramic pattern portion, and the conductive layer portion is etched to form a conductor pattern portion, and the insulating layer is formed on the substrate. The average particle diameter d2 of the ceramic material satisfies the relationship shown in the following formula (1).
d2> d1 (1)

Furthermore, another method for producing a ceramic green sheet of the present invention comprises a first ceramic material containing a ceramic powder and having solubility in a predetermined solvent on a substrate whose surface has been subjected to a release treatment. A step of forming an underlayer, a step of forming an upper layer made of a second ceramic material containing ceramic powder and having a photosensitivity on the underlayer, a step of exposing a predetermined portion of the upper layer, and a predetermined step Using the solvent, developing the upper layer to form the first ceramic pattern portion, etching the underlayer to form the second ceramic pattern portion, and forming the insulating layer on the substrate; The average particle diameter d1 of the first ceramic material and the average particle diameter d2 of the second ceramic material satisfy the relationship represented by the following formula (1).
d2> d1 (1)

  Here, the above-mentioned “average particle diameter of the conductive material” refers to the average particle diameter of the powder of the conductive component contained in the material. For example, a paste or a conductive material containing a metal powder, a binder, an organic solvent, etc. In the case of a slurry, the average particle size of the metal powder contained therein corresponds to the “average particle size of the conductive material”. Similarly, the “average particle size of the ceramic material” refers to the average particle size of the ceramic powder contained in the material. For example, when the ceramic material is a paste or slurry containing ceramic powder, a binder, a solvent, etc. The average particle diameter of the contained ceramic powder corresponds to “the average particle diameter of the ceramic material”.

  When a fine pattern portion such as a conductor pattern portion or a ceramic pattern portion is directly formed on a base material whose surface has been subjected to a release treatment, these pattern portions are easily peeled off from the base material. On the other hand, in the method for producing a ceramic green sheet of the present invention, after forming a base layer made of a conductive material or a ceramic material on a base material, an upper layer made of a conductive material or a ceramic material is formed, and this base layer Is developed to form a conductor pattern portion. For this reason, even if the conductor pattern part or ceramic pattern formed from the upper layer is miniaturized, it is difficult to peel from the substrate.

  In general, when pattern formation is performed on a predetermined layer on a substrate, coarser particles constituting the layer are easier to remove during development, which is advantageous for fine pattern formation. In this case, the adhesion of the layer to the substrate tends to be reduced. On the other hand, in the method for producing a ceramic green sheet of the present invention, a conductive material or ceramic material constituting the upper layer is one having an average particle size larger than those materials constituting the underlayer. ing. By doing so, even if the upper layer is composed of coarse particles advantageous for development, the upper layer is satisfactorily adhered to the base material via the underlayer composed of finer particles. Therefore, the conductor pattern portion or the ceramic pattern portion formed from the upper layer can be easily miniaturized, and even if it is miniaturized, it is difficult to peel off from the base material.

In these ceramic green sheet manufacturing methods, it is more preferable that the thickness t1 of the underlayer and the thickness t2 of the upper layer satisfy the relationship represented by the following formula (2). That is, it is preferable that the thickness t1 of the underlayer is equal to or less than the thickness t2 of the upper layer.
t2 ≧ t1 (2)

  In this way, even if the etching conditions for removing the underlayer (such as the concentration of the predetermined solution and the etching time) are relaxed, the underlayer can be removed satisfactorily. Thereby, the damage by the etching of the conductor pattern part and ceramic pattern part formed from an upper layer is reduced significantly, As a result, it becomes possible to form these pattern parts more satisfactorily.

  The method for producing a ceramic electronic component of the present invention includes a firing step of firing the ceramic green sheet produced by the method for producing a ceramic green sheet. In the firing step, the ceramic green sheet produced by the method for producing the ceramic green sheet and the ceramic green sheet produced by a production method other than the method for producing the ceramic green sheet may be combined and fired. . In such a ceramic electronic component manufacturing method, since the ceramic green sheet obtained by the manufacturing method of the present invention is used, a ceramic electronic component having a fine conductor pattern portion or ceramic pattern portion can be obtained. .

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the manufacturing method of the ceramic green sheet which can form a fine conductor pattern part on the base material by which the mold release process was performed, and the manufacturing method of a ceramic electronic component.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same element through all the figures, and the overlapping description is abbreviate | omitted.
[Method of manufacturing ceramic green sheet]

(First embodiment)
FIG. 1A to FIG. 1F are process cross-sectional views schematically showing a first embodiment of a method for producing a ceramic green sheet.

  First, as shown in FIG. 1A, a release treatment is performed on the surface 1a of the substrate 1. Thereby, the release layer 3 is formed on the surface 1a of the substrate 1.

  The base material 1 is plate shape or film shape, for example, PET film is mentioned. The thickness of the substrate 1 is preferably about 25 to 100 μm, and more preferably about 50 μm. In the release treatment, first, for example, an addition reaction type silicone resin material is added to a solvent such as toluene or methyl ethyl ketone, and the obtained solution is applied to the surface of the substrate 1 by a barcode method, a gravure coating method, a doctor blade coating method, or the like. Apply on 1a.

  Then, the drying process by heating is performed with respect to the base material 1 with which the solution was applied, for example at 150 degreeC for 30 second. Thereby, the addition reaction type silicone resin material undergoes addition polymerization, and the solvent is removed. In this way, the release layer 3 having a thickness of, for example, about 0.01 to 0.1 μm is formed. In addition, the performance (release property) of the release layer 3 can also be adjusted by changing the kind, usage amount, etc. of the silicone resin material to be used.

  Next, as shown in FIG. 1 (b), on the release layer 3 in the base material 1, a conductive layer 5a (bottom layer) made of a conductive material (first conductive material) that is soluble in a predetermined solvent. Formation). In this case, it is preferable that the thickness of the conductor layer 5a is 0.8 to 25 μm after drying. The conductive material that is soluble in a predetermined solvent is a mixed material that contains a powder of a conductive component and is soluble in the predetermined solvent. In this case, the average particle size of the conductive component powder is preferably 0.2 to 2.5 μm.

  As said electrically conductive material, what contains the binder resin material which has solubility with respect to the etching liquid used at the process of forming the below-mentioned 1st conductor pattern part, for example is preferable. Examples of the etching solution include an alkaline solution, an alkaline aqueous solution, an organic solvent-based etching solution, and a water-based etching solution. Examples of the binder resin that can be dissolved in these include base polymers mainly composed of alkali-soluble cellulose derivatives and alkali-soluble acrylic resins.

  As the first conductive material, in addition to the binder resin, a metal powder (for example, a powder composed of metal particles such as an alloy such as Ag, Ni, Pd, Cu, or Ag-Pd) that is a powder of a conductive component, and an organic solvent It is preferable that it is the electrically conductive paste which further contains etc. Such a conductive material is, for example, an electrode material, and the conductor layer 5a is an electrode layer in a ceramic electronic component or the like.

  The conductor layer 5a can be formed as follows, for example. That is, first, a paste-like or slurry-like conductive material is applied onto the release layer 3 using an application coater (for example, a coater equipped with a doctor blade) or the like.

  Alternatively, the conductor layer 5a may be partially formed on the surface 1a of the substrate 1 by pattern-printing a paste-like or slurry-like conductive material on the release layer 3 using a printing machine. In this case, compared with the case where the conductor layer 5a is formed on the entire surface 1a of the substrate 1, the amount of the conductive material used can be suppressed. Further, the amount of etching solution used, the processing time, and the like in the formation process of the conductor pattern portion 13 described later can be reduced. Therefore, for example, when an expensive conductive material or etching solution is used, the manufacturing cost of the ceramic green sheet can be reduced. Subsequently, the solvent component in the conductive material is removed by performing a drying process by heating or the like.

  Next, as shown in FIG. 1C, a conductor layer 13a (upper layer) made of a photosensitive conductive material (second conductive material) is formed on the conductor layer 5a. It is preferable that the thickness of the conductor layer 13a be 1.5 to 50 μm after drying. This photosensitive conductive material is a mixed material that contains a powder of a conductive component, is soluble in the predetermined solvent, and has photosensitivity. The average particle size of the conductive component powder is preferably 0.3 to 3.0 μm. Such a photosensitive conductive material is soluble in the predetermined solvent, but is cured when irradiated with a predetermined actinic ray and becomes insoluble in the same solvent.

  The conductor layer 13a may be partially formed on the conductor layer 5a or may be formed on the entire surface. However, from the viewpoint of reducing peeling of the conductor pattern portion 13 described later from the base material 1, the conductor layer 5a is preferably formed over a larger area than the conductor layer 13a. This photosensitive conductive material is, for example, a photosensitive electrode material, and the conductor layer 13a becomes an electrode layer in a ceramic electronic component or the like.

  Examples of the photosensitive conductive material include those containing a negative photosensitive binder resin material that is soluble in a solvent (developer or etching solution) used in a step of forming a conductor pattern portion described later. Examples of the solvent include an alkaline solution, an alkaline aqueous solution, an organic solvent solvent, an aqueous solvent, and the like. Further, the negative photosensitive binder resin material contains, for example, a polymer or monomer that undergoes cross-linking polymerization upon irradiation with ultraviolet rays, a polymerization initiator, and the like.

  In the present embodiment, the photosensitive conductive material is a powder composed of metal particles such as metal powder (for example, an alloy such as Ag, Ni, Pd, Cu, or Ag—Pd) in addition to the negative photosensitive binder resin material. And a photosensitive conductive paste further containing an organic solvent and the like.

  The conductor layer 13a can be formed by, for example, applying a paste-like or slurry-like photosensitive conductive material to the entire surface of the conductor layer 5a, or pattern printing on a predetermined portion of the conductor layer 5a. And after such application | coating or printing, the drying process by heating etc. is performed, the solvent component in a photosensitive electrically-conductive material is removed, and the conductor layer 13a is formed. Note that the photosensitive performance of the photosensitive conductive material can be changed or developed by heating. The thickness of the conductor layer 13a thus formed is preferably 1.5 to 50 μm.

Here, in the present embodiment, the average particle diameter d1 of the first conductive material for forming the conductor layer 5a and the average particle diameter d2 of the second conductive material for forming the conductor layer 13a are: The relationship shown in the following formula (1) is satisfied.
d2> d1 (1)

  That is, the average particle diameter d1 of the first conductive material is smaller than the average particle diameter d2 of the second conductive material. By doing so, the conductor layer 5a has a denser structure than the conductor layer 13a, and has excellent adhesion to the base material 1. Thereby, even if it is a case where the conductor layer 13a is comprised by comparatively coarse particle | grains so that it may become advantageous in the image development mentioned later, it adhere | attaches favorably with respect to the base material 1 via the conductor layer 5a.

  From the viewpoint of obtaining such an effect better, it is more preferable that the average particle diameters d1 and d2 described above satisfy the following relationship. That is, d2 / d1 is preferably 1.1 to 15.0, more preferably 1.5 to 15.0, and still more preferably 3.0 to 15.0.

Moreover, when suitable, thickness t1 of the conductor layer 5a and thickness t2 of the conductor layer 13a satisfy | fill the relationship shown to following formula (2).
t2 ≧ t1 (2)

  That is, the thickness t1 of the conductor layer 5a is equal to or less than the thickness t2 of the conductor layer 13a. By adopting such a configuration, in the development and etching described later, even if the development conditions are relaxed, for example, the developer concentration is reduced or the development time is shortened, the conductor The layer 5a can be easily patterned. Therefore, the conductor layer 13a is hardly damaged by development or etching, and as a result, a good pattern can be formed even when the conductor layer 5a or the conductor layer 13a having a fine pattern is formed. Become.

  From the viewpoint of obtaining such an effect better, it is more preferable that the thicknesses t1 and t2 described above satisfy the following relationship. That is, t2 / t1 is preferably 1.0 to 62.5, more preferably 2.0 to 62.5, and still more preferably 4.0 to 62.5.

  Thus, after forming the conductor layer 5a and the conductor layer 13a on the base material 1, as shown in FIG.1 (d), it exposes to the predetermined part 13b of the conductor layer 13a. In the present embodiment, the conductive layer 13a is irradiated with an actinic ray L such as ultraviolet rays using a mask 11 having a light transmitting portion 11a having a predetermined pattern shape and a light shielding portion 11b surrounding the light transmitting portion 11a. Ultraviolet rays are emitted from, for example, a high-pressure mercury lamp.

  Examples of the actinic ray L applied to the conductor layer 13a include light having a wavelength of 365 nm (i-line), light having a wavelength of 405 nm (h-line), light having a wavelength of 436 nm (g-line), or a mixed light thereof. It is done. Further, the conductor layer 13a may be irradiated with light having a continuous wavelength band.

Examples of the exposure method include a contact exposure method, a proximity exposure method, and a projection exposure method. The exposure amount is appropriately adjusted according to the photosensitive performance of the photosensitive conductive material contained in the conductor layer 13a, the thickness (height) of the conductor layer 13a, and is, for example, several hundred to several thousand mJ / cm ² . Further, in order to obtain a desired resolution, development processing conditions and an exposure amount described later can be appropriately set.

  Examples of the mask 11 include a glass mask and a film mask. In addition, you may perform exposure by selectively irradiating the predetermined part 13b of the conductor layer 13a with a laser beam, without using the mask 11. FIG. Thus, when irradiating a laser beam, a laser drawing apparatus can be used suitably.

  Next, as shown in FIG. 1E, the conductor layer 13a is developed by using a predetermined solvent to form the conductor pattern portion 13 (first conductor pattern), and the conductor layer 13a is masked. As a result, the conductor layer 5a is etched to form the conductor pattern portion 5 (second conductor pattern). Thereby, in this embodiment, the conductor pattern parts 5 and 13 come to have a pattern shape corresponding to the light transmission part 11a of the mask 11. FIG.

  In this step, the solvent functions as a developer and an etchant. The predetermined portion 13b of the exposed conductor layer 13a is insoluble in the solvent (developer) due to cross-linking polymerization of the photosensitive conductive material. On the other hand, in the portion of the conductor layer 13a that has not been exposed, the photosensitive conductive material does not undergo cross-linking polymerization and is soluble in the solvent (developer). Therefore, in the development, the unexposed portion (except for the predetermined portion 13b) of the conductor layer 13a is removed.

Examples of the solvent include an alkaline solution, an alkaline aqueous solution, an organic solvent solvent, and an aqueous solvent. The solvent is preferably selected in consideration of compatibility with the binder resin material contained in the first conductive material and the second conductive material. As an example, the solvent may be a 1% by mass aqueous solution of Na ₂ CO ₃ . In this case, first, a solvent is sprayed onto the conductor layer 5a and the conductor layer 13a at a spray pressure of 0.01 to 0.3 MPa for several tens of seconds to several minutes. Subsequently, pure water is sprayed onto the conductor layer 5a and the conductor layer 13a at a spray pressure of 0.01 to 0.3 MPa for several tens of seconds to several minutes. Thereby, for example, the hydrogen atom (H) in the carboxyl group in the photosensitive resin side chain or the like contained in the photosensitive conductive material is not cross-linked by substitution with the sodium atom (Na) in the solvent. The part is dissolved in the presence of OH ⁻ .

  Next, as shown in FIG. 1 (f), the insulating layer 9 is formed on the region of the base material 1 where the conductor pattern portions 5 and 13 are not formed. Thereby, the ceramic green sheet 10 having a shape in which the conductor pattern portions (conductor pattern portions 5 and 13) are incorporated in the layer made of an insulating material (insulating layer 9) is formed on the release layer 3 of the base material 1. Is done. Thereafter, the substrate 1 may be peeled off. Examples of the constituent material of the insulating layer 9 include ceramic materials and magnetic materials such as ferrite.

  The ceramic green sheet 10 obtained by the manufacturing method of the first embodiment described above is suitable for manufacturing capacitors, inductors, wiring boards and the like, for example.

  That is, the capacitor can be manufactured by, for example, alternately laminating ceramic green sheets 10 and insulating layers. The inductor can be manufactured by sequentially laminating the ceramic green sheets 10. In manufacturing such an inductor, the conductor pattern portions (conductor pattern portions 5 and 13) of each ceramic green sheet 10 have a shape that can form a coil pattern by lamination.

  Furthermore, the wiring board can be formed by making the conductor pattern portions (conductor pattern portions 5 and 13) in the ceramic green sheet 10 into a desired wiring shape. Further, a multilayer substrate can be formed by further sandwiching the ceramic green sheet 10 having the conductor pattern portions (conductor pattern portions 5 and 13) functioning as through holes between the wiring boards thus obtained.

(Second Embodiment)
2A to 2F are process cross-sectional views schematically showing a second embodiment of a method for producing a ceramic green sheet.

  First, as shown in FIG. 2A, a release treatment is performed on the surface 1a of the substrate 1 in the same manner as in the first embodiment to form the release layer 3.

  Next, as shown in FIG. 2B, a ceramic layer 105 a (underlayer) made of a ceramic material that is soluble in a predetermined solvent is formed on the release layer 3 in the substrate 1. The ceramic layer 105a may be provided with a through hole penetrating the front and back surfaces. It is preferable that the thickness of the ceramic layer 105a be 0.8 to 25 μm after drying. Here, the ceramic material that is soluble in a predetermined solvent is a mixed material that contains ceramic powder and is soluble in the predetermined solvent. Here, a so-called ferrite material may be used as the ceramic material. These ceramic powders preferably have an average particle size of 0.2 to 2.5 μm.

  As said ceramic material, what contains the binder resin material which has solubility with respect to the etching liquid (predetermined solvent) used at the process of forming the below-mentioned conductor pattern part 113 is preferable, for example. Examples of the etching solution include an alkaline solution, an alkaline aqueous solution, an organic solvent-based etching solution, and a water-based etching solution. Examples of the binder resin that can be dissolved in these include base polymers mainly composed of alkali-soluble cellulose derivatives, alkali-soluble acrylic resins, and the like. Moreover, you may use the photoresist (for example, a base polymer, a monomer, resin, etc.) which does not contain a photoinitiator as binder resin.

  In the present embodiment, the ceramic material is more preferably a ceramic paste or a ceramic slurry further containing a ceramic powder and an organic solvent in addition to the binder resin material.

  The ceramic layer 105a can be formed as follows, for example. That is, first, using a coating coater (for example, a coater provided with a doctor blade), a paste-like or slurry-like ceramic material is applied onto the release layer 3. In place of the coating coater, a paste or slurry ceramic material may be pattern-printed on the release layer 3 using a printing machine. Thus, after apply | coating or printing, the solvent component in a ceramic material is removed by performing the drying process by heating.

  When printing is performed as in the latter case, the amount of ceramic material used can be reduced as compared with the case where the ceramic layer 105a is formed on the entire surface 1a of the substrate 1. Furthermore, it is possible to reduce the amount of etching solution used, the processing time, and the like in the step of forming the conductor pattern portion 113 described later. Therefore, for example, when an expensive ceramic material or etching solution is used, the manufacturing cost of the ceramic green sheet can be reduced.

  Next, as shown in FIG. 2C, a conductor layer 113a (upper layer) made of a photosensitive conductive material is formed on the ceramic layer 105a. It is preferable that the thickness of the conductor layer 113a is 1.5 to 50 μm after drying. As the photosensitive conductive material, the same material as in the first embodiment described above can be applied, and the conductor layer 113a can be formed by applying or printing the material. In this case, the average particle size of the conductive component powder contained in the photosensitive conductive material is preferably 0.3 to 3 μm.

Here, in this embodiment, the average particle diameter d1 of the ceramic material for forming the ceramic layer 105a and the average particle diameter d2 of the photosensitive conductive material for forming the conductor layer 113a are expressed by the following formula (1). ) Is satisfied. That is, the average particle diameter d1 of the ceramic material is smaller than the average particle diameter d2 of the photosensitive conductive material. Thereby, even if it is a case where the conductor layer 113a is formed from a comparatively coarse particle | grain, it will be in the state favorably bonded to the base material 1 via the ceramic layer 105a.
d2> d1 (1)

  In particular, d1 and d2 satisfy the relationship that d2 / d1 is preferably 1.1 to 15.0, more preferably 1.5 to 15.0, and still more preferably 3.0 to 15.0. When it is, there exists a tendency for the said effect to be acquired more favorably.

Further, the thickness t1 of the ceramic layer 105a and the thickness t2 of the conductor layer 113a satisfy the relationship represented by the following formula (2). That is, the thickness t1 of the ceramic layer 105a is equal to or less than the thickness t2 of the conductor layer 113a. By doing so, it becomes possible to perform pattern formation more satisfactorily.
t2 ≧ t1 (2)

  In particular, t1 and t2 satisfy the relationship that t2 / t1 is preferably 1.0 to 62.5, more preferably 2.0 to 62.5, and still more preferably 4.0 to 62.5. When it is, there exists a tendency for the said effect to be acquired more favorably.

  Next, as shown in FIG. 2D, the predetermined portion 113b of the conductor layer 113a is exposed. As in the first embodiment, the exposure is performed by using the mask 11 having the light transmissive part 11a having a predetermined pattern shape and the light shielding part 11b surrounding the light transmissive part 11a. It can be performed by irradiating the light beam L.

  Subsequently, as shown in FIG. 2E, the conductor layer 113a is developed by using a predetermined solvent to form the conductor pattern portion 113, and the ceramic layer 105a is formed using the conductor pattern portion 113 as a mask. Is etched to form a ceramic pattern portion 105. In the present embodiment, the ceramic pattern portion 105 and the conductor pattern portion 113 have a pattern shape corresponding to the light transmission portion 11 a of the mask 11. The kind of the predetermined solvent, the development conditions, etc. can be the same as those in the first embodiment described above.

  Then, as shown in FIG. 2 (f), an insulating layer 109 is formed on a region on the substrate 1 where the ceramic pattern portion 105 and the conductor pattern portion 113 are not formed. Thereby, the ceramic green sheet 110 having a shape in which the ceramic pattern portion 105 and the conductor pattern portion 113 are incorporated in a layer made of an insulating material (insulating layer 109) is formed on the release layer 3 of the substrate 1. . Thereafter, the substrate 1 may be peeled off. Examples of the constituent material of the insulating layer 109 include a ceramic material and a magnetic material such as ferrite.

  The ceramic green sheet 110 obtained by the manufacturing method of the second embodiment described above is suitable for manufacturing capacitors, inductors, wiring boards and the like, for example.

  That is, the capacitor can be manufactured, for example, by stacking a plurality of ceramic green sheets 110. In this case, an insulating layer may be interposed between layers as necessary.

  The inductor can be manufactured by laminating a plurality of ceramic green sheets 110 each having a through hole in a part of the ceramic pattern portion 105. In manufacturing such an inductor, a coiled pattern is formed by sequentially laminating the through hole of the ceramic pattern portion 105 and the conductor pattern portion 113.

  Furthermore, the wiring board can be formed by making the conductor pattern portion 113 in the ceramic green sheet 110 into a desired wiring shape. Moreover, a multilayer substrate can also be formed by laminating a plurality of wiring substrates thus obtained. At this time, a through hole may be formed in a part of the ceramic pattern portion 105.

(Third embodiment)
3A to 3F are process cross-sectional views schematically showing a third embodiment of the method for manufacturing a ceramic green sheet.

  First, as shown in FIG. 3A, a release process is performed on the surface 1a of the substrate 1 in the same manner as in the first embodiment to form the release layer 3.

  Next, as shown in FIG. 3B, a conductor layer 205 a (underlayer) made of a conductive material that is soluble in a predetermined solvent is formed on the release layer 3 in the substrate 1. It is preferable that the thickness of the conductor layer 205a is 0.8 to 25 μm after drying. Examples of the conductive material that is soluble in a predetermined solvent can be the same as those shown in the first embodiment. In this case, the average particle diameter of the conductive component powder contained in the conductive material is preferably 0.2 to 2.5 μm. The conductive layer 205a can be formed by applying this conductive material on the front surface of the surface 1a of the substrate 1 or by pattern printing on a predetermined portion.

  Subsequently, as shown in FIG. 3C, a ceramic layer 213a (upper layer) made of a photosensitive ceramic material is formed on the conductor layer 205a. It is preferable that the thickness of the ceramic layer 213a is 1.5 to 50 μm after drying. The photosensitive ceramic material is a mixed material containing ceramic powder, having solubility in the predetermined solvent and having photosensitivity. In this case, the average particle size of the ceramic powder is preferably 0.3 to 3 μm. The photosensitive ceramic material is soluble in the above-mentioned predetermined solvent, but is cured when irradiated with a predetermined actinic ray and becomes insoluble in the same solvent.

  Examples of such a photosensitive ceramic material include a negative photosensitive binder resin material that is soluble in a solvent (developer or etching solution) used in a step of forming a ceramic pattern portion 213 described later. Things. Examples of the solvent include an alkaline solution, an alkaline aqueous solution, an organic solvent solvent, an aqueous solvent, and the like. The negative photosensitive binder resin material contains, for example, a polymer or monomer that undergoes cross-linking polymerization upon irradiation with ultraviolet rays, a polymerization initiator, and the like.

In the present embodiment, as the photosensitive ceramic material, in addition to the negative photosensitive binder resin material, ceramic powder (for example, dielectric ceramic material such as BaTiO ₃ and TiO ₂ ; insulating ceramic material such as α-alumina; Mn -Magnetic ceramic materials such as Zn-based ferrite and Ni-Zn-based ferrite; raw material powders such as glass ceramic materials containing B ₂ O ₃ , SiO ₂ , Al ₂ O _3, etc., or these raw material powders are mixed as necessary And a ceramic paste further containing an organic solvent or the like.

  The ceramic layer 213a is, for example, a paste or a slurry-like photosensitive ceramic material applied to the entire surface of the conductor layer 205a, or pattern-printed on a predetermined portion of the conductor layer 205a, and then dried by heating or the like, It can be formed by removing the solvent component in the photosensitive ceramic material. Further, the photosensitive performance of the photosensitive ceramic material may be changed or developed by heating.

Here, in this embodiment, the average particle diameter d1 of the conductive material for forming the conductor layer 205a and the average particle diameter d2 of the photosensitive ceramic material for forming the ceramic layer 213a are expressed by the following formula (1). ) Is satisfied. That is, the average particle diameter d1 of the conductive material is smaller than the average particle diameter d2 of the photosensitive ceramic material. Thereby, even when the ceramic layer 213a is formed from relatively coarse particles, the ceramic layer 213a is in a state of being favorably bonded to the base material 1 through the conductor layer 205a.
d2> d1 (1)

  In particular, d1 and d2 satisfy the relationship that d2 / d1 is preferably 1.1 to 15.0, more preferably 1.5 to 15.0, and still more preferably 3.0 to 15.0. When it is, there exists a tendency for the said effect to be acquired more favorably.

Further, the thickness t1 of the conductor layer 205a and the thickness t2 of the ceramic layer 213a satisfy the relationship represented by the following formula (2). That is, the thickness t1 of the conductor layer 205a is equal to or less than the thickness t2 of the ceramic layer 213a. By doing so, it becomes possible to perform pattern formation more satisfactorily.
t2 ≧ t1 (2)

  In particular, t1 and t2 satisfy the relationship that t2 / t1 is preferably 1.0 to 62.5, more preferably 2.0 to 62.5, and still more preferably 4.0 to 62.5. When it is, there exists a tendency for the said effect to be acquired more favorably.

  Next, as shown in FIG. 3D, the predetermined portion 213b of the ceramic layer 213a is exposed. In the exposure, as in the first embodiment, the ceramic layer 213a is activated with ultraviolet light or the like using the mask 11 having the light transmitting portion 11a having a predetermined pattern shape and the light shielding portion 11b surrounding the light transmitting portion 11a. It can be performed by irradiating the light beam L.

  Subsequently, as shown in FIG. 3E, the ceramic layer 213a is developed using a predetermined solvent to form the ceramic pattern portion 213, and the conductor layer 205a is formed using the ceramic pattern portion 213 as a mask. Is etched to form a conductor pattern portion 205. In the present embodiment, the conductor pattern portion 205 and the ceramic pattern portion 213 have a pattern shape corresponding to the light transmission portion 11 a of the mask 11. The kind of the predetermined solvent, the development conditions, etc. can be the same as those in the first embodiment described above.

  Then, as shown in FIG. 3 (f), an insulating layer 209 is formed on the region on the substrate 1 where the conductor pattern portion 205 and the ceramic pattern portion 213 are not formed. Thereby, the ceramic green sheet 210 having a shape in which the conductor pattern portion 205 and the ceramic pattern portion 213 are incorporated in a layer made of an insulating material (insulating layer 209) is formed on the release layer 3 of the substrate 1. . Thereafter, the substrate 1 may be peeled off. Examples of the constituent material of the insulating layer 209 include ceramic materials and magnetic materials such as ferrite.

  The ceramic green sheet 210 obtained by the manufacturing method of the third embodiment described above is suitable for manufacturing capacitors and wiring boards, for example.

  That is, the capacitor can be manufactured by stacking a plurality of ceramic green sheets 210, for example. In this case, an insulating layer may be interposed between layers as necessary.

  The wiring board can be formed by making the conductor pattern portion 205 in the ceramic green sheet 210 into a desired wiring shape. Moreover, a multilayer substrate can also be formed by laminating a plurality of wiring substrates thus obtained. At this time, a through hole may be formed in a part of the ceramic pattern portion 213.

(Fourth embodiment)
4A to 4F are process cross-sectional views schematically showing a fourth embodiment of a method for producing a ceramic green sheet.

  First, as shown in FIG. 4A, a release process is performed on the surface 1a of the substrate 1 in the same manner as in the first embodiment to form the release layer 3.

  Next, as shown in FIG. 4B, a ceramic layer 305a (lower) made of a ceramic material (first ceramic material) that is soluble in a predetermined solvent is formed on the release layer 3 of the substrate 1. Formation). It is preferable that the thickness of the ceramic layer 305a is 0.8 to 25 μm after drying. Examples of the ceramic material having solubility in a predetermined solvent include the same materials as those in the second embodiment described above. That is, a ferrite material may be used as the ceramic material. In this case, the average particle size of the ceramic powder is preferably 0.2 to 2.5 μm. The ceramic layer 305a can be formed by applying this ceramic material to the entire surface 1a of the substrate 1 or pattern printing on a predetermined portion.

  Subsequently, as shown in FIG. 4C, a ceramic layer 313a (upper layer) made of a photosensitive ceramic material (second ceramic material) is formed on the ceramic layer 305a. The thickness of the ceramic layer 313a is preferably 1.5 to 50 μm after drying. The ceramic layer 313a is soluble in the predetermined solvent described above, but forms a cured product that is insoluble in the predetermined solvent when irradiated with the predetermined actinic ray.

  As the photosensitive ceramic material, the same materials as those mentioned in the third embodiment can be applied. In this case, the average particle size of the ceramic powder contained therein is preferably 0.3 to 3 μm. The ceramic layer 313a can be formed by applying a paste or slurry-like photosensitive ceramic material to the entire surface of the ceramic layer 305a or pattern printing on a predetermined portion.

Here, in the present embodiment, the average particle diameter d1 of the first ceramic material for forming the ceramic layer 305a and the average particle diameter d2 of the second ceramic material for forming the ceramic layer 313a are: The relationship shown in the following formula (1) is satisfied. That is, the average particle diameter d1 of the first ceramic material is smaller than the average particle diameter d2 of the second ceramic material. Thereby, even when the ceramic layer 313a is formed from relatively coarse particles, the ceramic layer 313a is in a state of being favorably bonded to the substrate 1 via the ceramic layer 305a.
d2> d1 (1)

  In particular, d1 and d2 satisfy the relationship that d2 / d1 is preferably 1.1 to 15.0, more preferably 1.5 to 15.0, and still more preferably 3.0 to 15.0. When it is, there exists a tendency for the said effect to be acquired more favorably.

Moreover, it is preferable that the thickness t1 of the ceramic layer 305a and the thickness t2 of the ceramic layer 313a satisfy the relationship represented by the following formula (2). That is, the thickness t1 of the ceramic layer 305a is preferably equal to or less than the thickness t2 of the ceramic layer 313a. By doing so, it becomes possible to perform pattern formation more satisfactorily.
t2 ≧ t1 (2)

  In particular, t1 and t2 satisfy the relationship that t2 / t1 is preferably 1.0 to 62.5, more preferably 2.0 to 62.5, and still more preferably 4.0 to 62.5. When it is, there exists a tendency for the said effect to be acquired more favorably.

  Next, as shown in FIG. 4D, exposure is performed on a predetermined portion 313b of the ceramic layer 313a. In the exposure, as in the first embodiment, the ceramic layer 313a is activated with an ultraviolet ray or the like using the mask 11 having the light transmitting portion 11a having a predetermined pattern shape and the light shielding portion 11b surrounding the light transmitting portion 11a. It can be performed by irradiating the light beam L.

  Subsequently, as shown in FIG. 4E, the ceramic layer 313a is developed by using a predetermined solvent to form a ceramic pattern portion 313 (first ceramic pattern portion), and this ceramic pattern portion. The ceramic layer 305a is etched using 313 as a mask to form a ceramic pattern portion 305 (second ceramic pattern portion). In the present embodiment, the ceramic pattern portion 305 and the ceramic pattern portion 313 have a pattern shape corresponding to the light transmission portion 11 a of the mask 11. The kind of the predetermined solvent, the development conditions, etc. can be the same as those in the first embodiment described above.

  Then, as shown in FIG. 4 (f), an insulating layer 309 is formed on a region where the ceramic pattern portion 305 and the ceramic pattern portion 313 are not formed on the substrate 1. As a result, the ceramic green sheet 310 having a shape in which the ceramic pattern portions 305 and 313a are incorporated in a layer made of an insulating material (insulating layer 309) is formed on the release layer 3 of the substrate 1. Thereafter, the substrate 1 may be peeled off. Examples of the constituent material of the insulating layer 309 include ceramic materials and magnetic materials such as ferrite.

  Thus, according to the manufacturing method according to the fourth embodiment, a ceramic green sheet having two different ceramic layers can be obtained. Specifically, for example, a ceramic green sheet in which one of the two layers is a nonmagnetic ceramic layer and the other is a ferrite layer. For example, in the manufacture of multilayer wiring boards, a noise absorbing layer having a structure in which a conductor layer is disposed between ferrite layers by using a ceramic green sheet having such a structure and sandwiching a ceramic green sheet including a predetermined conductor layer, etc. Can be easily formed.

(Other forms of insulating layer formation method)
In 1st-4th embodiment mentioned above, after forming the laminated structure of 2 layers provided with a conductor pattern part or a ceramic pattern part, and a conductor pattern part or a ceramic pattern part on the base material 1, on the base material 1 Although the insulating layer is formed in the region in which these are not formed, the method of forming this insulating layer is not limited to the above-described embodiment, and may take other forms.

  Hereinafter, other embodiments of the method for forming the insulating layer will be described using the first to fifth methods as examples. Hereinafter, the laminated structure of the first embodiment (a laminated structure including the second conductor pattern portion on the first conductor pattern portion) will be described as an example, but these first to fifth methods will be described. It is preferable to select and use a suitable method for each of the first to fourth embodiments described above.

<First method>
FIG. 5A and FIG. 5B are diagrams schematically showing a cross-sectional structure of a ceramic green sheet on which an insulating layer is formed by the first method.

  As shown in FIGS. 5A and 5B, in the first method, the insulating layers 91 and 92 are not only formed on the regions where the conductor pattern portions 5 and 13 are not formed, but also on the conductor pattern portions 5 and 13. 13 is also formed so as to cover the laminated structure composed of 13. Thereby, the ceramic green sheet 10a, 10b having a structure in which the conductor pattern portions 5, 13 are covered with the insulating layers 91, 92 is obtained.

  The insulating layers 91 and 92 can be formed by applying a material for forming an insulating layer over the entire surface 1 a of the substrate 1. Thereby, compared with the said embodiment which formed the insulating layer 9 in area | regions other than the conductor pattern parts 5 and 13, the formation process of an insulating layer can be simplified. Further, as shown in FIG. 5B, the surface of the ceramic green sheet 10b can be easily flattened if the surface position of the insulating layer 92 substantially matches the surface position of the conductor pattern portion 13. More preferred.

<Second method>
6A to 6E are process cross-sectional views schematically showing a second method for forming an insulating layer. FIG. 6A is a diagram subsequent to FIG. FIG. 7 is a process cross-sectional view showing another example of the process cross-sectional view shown in FIG.

  First, as shown in FIG. 6A, an insulating material layer 15 a is formed on the base material 1. At this time, the insulating material layer 15 a is formed so as to cover the conductor pattern portion 13 and the conductor pattern portion 5. The insulating material layer 15a is preferably made of an insulating material that is soluble in a predetermined solvent as exemplified in the first to fourth embodiments described above.

  Next, as shown in FIG. 6B, the insulating layer 15a is formed by etching the entire surface of the insulating material layer 15a using the predetermined solvent. At this time, the surface position of the insulating layer 15 is lower than the surface position of the conductor pattern portion 13 so that the upper portion of the conductor pattern portion 13 is exposed. Note that the insulating material layer 15 a may remain on the conductor pattern portion 13. This insulating material layer 15a can be removed at the same time as the development processing described later.

  Next, as shown in FIG. 6C, a photosensitive insulating layer 17 a made of a negative photosensitive insulating material is formed on the insulating layer 15. The photosensitive insulating layer 17a is preferably made of a photosensitive insulating material that is soluble in a predetermined solvent as described above. At this time, it is preferable to make the surface position of the photosensitive insulating layer 17 a substantially coincide with the surface position of the conductor pattern portion 13. Thereby, it becomes easy to flatten the surface of the obtained ceramic green sheet.

  Thereafter, as shown in FIG. 6 (d), the photosensitive insulating layer 17 a is exposed through a mask 16. The mask 16 includes a light shielding part 16b having a pattern shape corresponding to the conductor pattern part 13 and the conductor pattern part 5, and a light transmission part 16a surrounding the light shielding part 16b. For this reason, the light L is not irradiated to the part on the conductive pattern part 13 in the photosensitive insulating layer 17a.

  In addition, as FIG. 7 shows, the light L can also be irradiated to the photosensitive insulating layer 17a from the base material 1 side, without using the mask 16. FIG. At least one of the conductor pattern portion 13 and the conductor pattern portion 5 has a light shielding property with respect to the light L to be irradiated, and the base material 1, the release layer 3 and the insulating layer 15 have a light transmitting property. If it is, the light L is not irradiated on the portion of the photosensitive insulating layer 17 a on the conductor pattern portion 13.

  Next, as shown in FIG. 6E, by developing the exposed photosensitive insulating layer 17a using the predetermined solvent, the portion on the conductive pattern portion 13 in the photosensitive insulating layer 17a is Then, the insulating layer 17 is formed. As a result, the ceramic green sheet 20 provided with the insulating layer 9a composed of the insulating layer 15 and the insulating layer 17, the conductor pattern portion 13, and the conductor pattern portion 5 is obtained.

  In the second method, by increasing the thickness of the insulating material layer 15a, the thickness of the photosensitive insulating layer 17a can be reduced, so that the amount of the photosensitive insulating material used can be suppressed. In this case, since the photosensitive insulating material (for example, photosensitive ceramic slurry) is relatively expensive, the manufacturing cost can be reduced particularly in the method for manufacturing the ceramic green sheet using a large amount of the photosensitive insulating material.

<Third method>
8A to 8D are process cross-sectional views schematically showing a third method for forming an insulating layer. FIG. 8A is a diagram subsequent to FIG. FIG. 9 is a process cross-sectional view showing another example of the process cross-sectional view shown in FIG.

  First, as shown in FIG. 8A, an insulating material layer 19 a is formed on the base material 1. At this time, the insulating material layer 19 a is formed so as to cover the conductor pattern portion 13 and the conductor pattern portion 5. The surface position of the insulating material layer 19 a is set lower than the surface position of the conductor pattern portion 13. The insulating material layer 19a is preferably made of an insulating material that is soluble in a predetermined solvent.

  Next, as shown in FIG. 8B, a photosensitive insulating layer 21a made of a negative photosensitive insulating material is formed on the entire surface of the insulating material layer 19a. The photosensitive insulating layer 21a is preferably made of a photosensitive insulating material that is soluble in a predetermined solvent. At this time, it is preferable to make the surface position of the photosensitive insulating layer 21 a substantially coincide with the surface position of the conductor pattern portion 13. Thereby, it becomes easy to flatten the surface of the obtained ceramic green sheet.

  Next, as shown in FIG. 8C, the photosensitive insulating layer 21a is exposed through the mask 16 as in the second method. If the mask 16 is used, the light L is not irradiated to the part on the conductive pattern part 13 in the photosensitive insulating layer 21a.

  In addition, as FIG. 9 shows, you may irradiate the light L to the photosensitive insulating layer 21a from the base material 1 side, without using the mask 16. FIG. At least one of the conductor pattern portion 13 and the conductor pattern portion 5 has a light-shielding property with respect to the light L to be irradiated, and the substrate 1, the release layer 3 and the ceramic layer 19a have a light-transmitting property. If it is, the light L is not irradiated on the portion of the photosensitive insulating layer 21 a on the conductor pattern portion 13.

  Next, as shown in FIG. 8D, by developing the exposed photosensitive insulating layer 21a using the predetermined solvent, the portion on the conductive pattern portion 13 in the photosensitive insulating layer 21a is changed. The insulating layer 21 is formed by removing. Further, the insulating layer 19 is formed by etching the insulating material layer 19a using the predetermined solvent. As a result, the ceramic green sheet 30 provided with the insulating layer 9b including the insulating layer 19 and the insulating layer 21, the conductor pattern portion 13, and the conductor pattern portion 5 is obtained. In the third method, the entire etching process in the second method can be omitted.

<Fourth method>
10A to 10C are process cross-sectional views schematically showing a fourth method for forming an insulating layer. FIG. 10A is a diagram subsequent to FIG.

  First, as shown in FIG. 10A, a photosensitive insulating layer 23 a made of a negative photosensitive insulating material is formed on the entire surface of the base material 1. The photosensitive insulating layer 23a is preferably made of a photosensitive insulating material that is soluble in a predetermined solvent. At this time, the photosensitive insulating layer 23 a is formed so as to cover the conductor pattern portion 13 and the conductor pattern portion 5.

  Next, as shown in FIG. 10B, the photosensitive insulating layer 23a is irradiated with light L from the substrate 1 side. When at least one of the conductor pattern portion 13 and the conductor pattern portion 5 has a light-shielding property with respect to the light L to be irradiated, and the substrate 1 and the release layer 3 have a light-transmitting property, The portion of the conductive insulating layer 23 a on the conductor pattern portion 13 is not irradiated with the light L. In order to obtain a desired resolution, processing conditions and exposure amount in development described later can be set as appropriate.

  Next, as shown in FIG. 10C, the exposed photosensitive insulating layer 23a is developed using the predetermined solvent, so that the portion on the conductive pattern portion 13 in the photosensitive insulating layer 23a is formed. The insulating layer 9c is formed by removing. At this time, it is preferable to make the surface position of the insulating layer 9 c substantially coincide with the surface position of the conductor pattern portion 13 by adjusting the development processing conditions and the exposure amount. As a result, the ceramic green sheet 40 provided with the insulating layer 9c, the conductor pattern part 13, and the conductor pattern part 5 is obtained.

<Fifth method>
11A to 11C are process cross-sectional views schematically showing a fifth method for forming an insulating layer. FIG. 11A is a diagram subsequent to FIG. FIG. 12 is a process cross-sectional view showing another example of the process cross-sectional view shown in FIG.

  First, as shown in FIG. 11A, a photosensitive insulating layer 25a made of a negative photosensitive insulating material is formed on the entire surface of the substrate 1. The photosensitive insulating layer 25a is preferably made of a photosensitive insulating material that is soluble in a predetermined solvent. At this time, the photosensitive insulating layer 25 a is formed so as to cover the conductor pattern portion 13 and the conductor pattern portion 5. Further, it is preferable that the surface position of the photosensitive insulating layer 25 a substantially coincides with the surface position of the conductor pattern portion 13. Thereby, it becomes easy to flatten the surface of the obtained ceramic green sheet.

  Next, as shown in FIG. 11 (b), the photosensitive insulating layer 25 a is exposed through a mask 16. At this time, the portion of the photosensitive insulating layer 25a on the conductor pattern portion 13 is not irradiated with the light L by the mask.

  As shown in FIG. 12, the light L may be applied to the photosensitive insulating layer 25 a from the substrate 1 side without using the mask 16. When at least one of the conductor pattern portion 13 and the conductor pattern portion 5 has a light-shielding property with respect to the light L to be irradiated, and the substrate 1 and the release layer 3 have a light-transmitting property, The portion of the conductive insulating layer 25a on the conductor pattern portion 13 is not irradiated with the light L.

Next, as shown in FIG. 11C, the exposed photosensitive insulating layer 25a is developed using the predetermined solvent, so that the portion of the photosensitive insulating layer 25a on the conductor pattern portion 13 is exposed. The insulating layer 9d is formed by removing. As a result, the ceramic green sheet 40 provided with the insulating layer 9d, the conductor pattern portion 13, and the conductor pattern portion 5 is obtained.
[Method of manufacturing ceramic electronic components]

  Hereinafter, an example of a method of manufacturing a ceramic electronic component using the ceramic green sheet obtained by the manufacturing method of the above-described embodiment will be specifically described.

  FIG. 13 is a process cross-sectional view schematically showing a method for manufacturing a capacitor which is an example of a ceramic electronic component. In the method for manufacturing a capacitor shown in FIG. 13, a ceramic green sheet obtained by the manufacturing method of the second embodiment described above is used.

  First, as shown in FIG. 13A, a plurality (here, three) of ceramic green sheets 110 are stacked so that each layer is alternately offset in the left-right direction, and a pair of ceramic green sheets 410a are It arrange | positions so that the ceramic green sheet 110 may be pinched | interposed, and the laminated body 420 will be obtained. As the ceramic green sheet 110, one that has been previously peeled off from the substrate 1 is used. The ceramic green sheet 410a is made of a ceramic material and does not contain a conductor pattern or the like.

  Next, after pressing the laminated body 420 so that each layer may closely_contact | adhere, the edge part is cut | disconnected. The cutting is performed so that the conductor pattern 113 and the ceramic pattern 105 in the ceramic green sheet 110 are exposed at the cut ends. Since the ceramic green sheets are alternately offset as described above, the conductor pattern 113 and the ceramic pattern 105 of each layer are alternately exposed at both ends of the laminated body 420 after cutting.

  Thereafter, the laminated body 420 after cutting is fired under a predetermined temperature condition to obtain the capacitor element body 400. By firing, a capacitor layer 405 is formed from the ceramic pattern portion 105 and the insulating layer 109, an internal electrode 413 is formed from the conductor pattern portion 113, and a protective layer 410 is formed from the ceramic green sheet 410a. A multilayer ceramic capacitor can be obtained by providing external electrodes or the like at both ends of the capacitor body 400.

  As described above, the ceramic green sheet 110 has a configuration in which the conductor pattern portion 113 and the ceramic pattern portion 105 are previously laminated. Therefore, by laminating a plurality of ceramic green sheets 110, a multilayer ceramic sheet 110 is obtained. A capacitor can be easily obtained.

  As described above, the ceramic green sheet 210 obtained in the third embodiment similarly has a configuration in which the ceramic pattern portion 113 and the conductor pattern portion 105 are laminated. If a plurality of layers are stacked, a multilayer ceramic capacitor can be manufactured.

  In addition, when the ceramic green sheet 10 obtained in the first embodiment has two layers of conductor pattern portions, ie, the conductor pattern portion 113 and the conductor pattern portion 105, the ceramic green sheet 10, the conductor pattern, etc. It is also possible to obtain a multilayer ceramic capacitor by alternately laminating ceramic green sheets that do not contain s.

  In addition, according to the ceramic green sheet obtained by the manufacturing method of each said embodiment, it is not restricted to the capacitor | condenser mentioned above, A various ceramic electronic component can be manufactured. For example, a circuit board, an inductor, a varistor, an NTC (Negative Temperature Coefficient) thermistor, a PTC (Positive Temperature Coefficient) thermistor, etc., an actuator, or a laminate or a composite part thereof can be used. Examples of the laminated product include a multilayer substrate, and examples of the composite component include an LC filter. These ceramic electronic components can be suitably manufactured by appropriately changing the constituent material and pattern shape of the conductor pattern portion and ceramic pattern portion in the ceramic green sheet.

It is process sectional drawing which shows typically 1st Embodiment of the manufacturing method of a ceramic green sheet. It is process sectional drawing which shows typically 2nd Embodiment of the manufacturing method of a ceramic green sheet. It is process sectional drawing which shows typically 3rd Embodiment of the manufacturing method of a ceramic green sheet. It is process sectional drawing which shows 4th Embodiment of the manufacturing method of a ceramic green sheet typically. It is a figure which shows typically the cross-section of the ceramic green sheet in which the insulating layer was formed by the 1st method. It is process sectional drawing which shows typically the 2nd method of forming an insulating layer. FIG. 7D is a process cross-sectional view illustrating another example of the process cross-sectional view illustrated in FIG. It is process sectional drawing which shows typically the 3rd method of forming an insulating layer. It is process sectional drawing which shows the other example of process sectional drawing shown by FIG.8 (c). It is process sectional drawing which shows typically the 4th method of forming an insulating layer. It is process sectional drawing which shows typically the 5th method of forming an insulating layer. It is process sectional drawing which shows the other example of process sectional drawing shown by FIG.11 (b). It is process sectional drawing which shows typically the manufacturing method of the capacitor | condenser which is an example of a ceramic electronic component.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Base material, 1a ... Surface, 3 ... Release layer, 5 ... Conductor pattern part, 5a ... Conductor layer, 9, 9a, 9b, 9c, 9d ... Insulating layer, 10 ... Ceramic green sheet, 13 ... Conductor pattern part , 13a ... conductor layer, 91, 92 ... insulating layer, 105a ... ceramic layer, 105 ... ceramic pattern portion, 109 ... insulating layer, 110 ... ceramic green sheet, 113a ... conductor layer, 113 ... conductor pattern portion, 205a ... conductor layer , 205 ... Conductor pattern part, 209 ... Insulating layer, 210 ... Ceramic green sheet, 213a ... Ceramic layer, 213 ... Ceramic pattern part, 305a ... Ceramic layer, 305 ... Ceramic pattern part, 309 ... Insulating layer, 310 ... Ceramic green sheet 313a: Ceramic layer, 313 ... Ceramic pattern part, 400 ... Capacitor body 410a ... ceramic green sheet, 410 ... insulating layer, 420 ... laminate.

Claims (6)

Forming a base layer made of a first conductive material containing a powder of a conductive component and having solubility in a predetermined solvent on a substrate having a release treatment applied to the surface;
Forming a top layer made of a second conductive material containing a conductive component powder and having photosensitivity on the base layer;
Exposing a predetermined portion of the upper layer,
Using the predetermined solvent to develop the upper layer to form a first conductor pattern portion and etching the underlayer to form a second conductor pattern portion;
Forming an insulating layer on the base material on which the first conductor pattern portion and the second conductor pattern portion are formed, and
The average particle diameter d1 of the first conductive material and the average particle diameter d2 of the second conductive material satisfy the relationship represented by the following formula (1).
A method for producing a ceramic green sheet.
d2> d1 (1) Forming a base layer made of a ceramic material containing ceramic powder and having solubility in a predetermined solvent on a substrate whose surface has been subjected to a mold release treatment;
Forming an upper layer made of a conductive material containing a conductive component powder and having photosensitivity on the base layer;
Exposing a predetermined portion of the upper layer,
Using the predetermined solvent, developing the upper layer to form a conductor pattern part, etching the base layer to form a ceramic pattern part,
Forming an insulating layer on the substrate on which the conductor pattern portion and the ceramic pattern portion are formed, and
The average particle diameter d1 of the ceramic material and the average particle diameter d2 of the conductive material satisfy the relationship represented by the following formula (1).
A method for producing a ceramic green sheet.
d2> d1 (1) Forming a base layer made of a conductive material containing a powder of a conductive component and having a solubility in a predetermined solvent on a substrate whose surface has been subjected to a mold release treatment;
Forming an upper layer made of a ceramic material containing ceramic powder and having photosensitivity on the underlayer;
Exposing a predetermined portion of the upper layer,
Using the predetermined solvent, developing the upper layer to form a ceramic pattern portion, and etching the underlayer to form a conductor pattern portion;
Forming an insulating layer on the substrate on which the ceramic pattern portion and the conductor pattern portion are formed, and
The average particle diameter d1 of the conductive material and the average particle diameter d2 of the ceramic material satisfy the relationship represented by the following formula (1);
A method for producing a ceramic green sheet.
d2> d1 (1) Forming a base layer made of a first ceramic material containing ceramic powder and having solubility in a predetermined solvent on a substrate having a release treatment on the surface;
Forming an upper layer made of a second ceramic material containing ceramic powder and having photosensitivity on the underlayer;
Exposing a predetermined portion of the upper layer,
Using the predetermined solvent to develop the upper layer to form a first ceramic pattern portion and etching the underlayer to form a second ceramic pattern portion;
Forming an insulating layer on the base material on which the first ceramic pattern portion and the second ceramic pattern portion are formed, and
The average particle diameter d1 of the first ceramic material and the average particle diameter d2 of the second ceramic material satisfy the relationship represented by the following formula (1);
A method for producing a ceramic green sheet.
d2> d1 (1) 5. The ceramic according to claim 1, wherein a thickness t <b> 1 of the underlayer and a thickness t <b> 2 of the upper layer satisfy a relationship represented by the following formula (2). Green sheet manufacturing method.
t2 ≧ t1 (2) The manufacturing method of a ceramic electronic component including the baking process which bakes the ceramic green sheet manufactured by the manufacturing method of the ceramic green sheet as described in any one of Claims 1-5.

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