JP4129437B2 - Line lighting device - Google Patents
Line lighting device Download PDFInfo
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- JP4129437B2 JP4129437B2 JP2004020265A JP2004020265A JP4129437B2 JP 4129437 B2 JP4129437 B2 JP 4129437B2 JP 2004020265 A JP2004020265 A JP 2004020265A JP 2004020265 A JP2004020265 A JP 2004020265A JP 4129437 B2 JP4129437 B2 JP 4129437B2
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- Prior art keywords
- light emitting
- lead frame
- light
- plate
- line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
- Led Device Packages (AREA)
Description
本発明は発光ユニット、この発光ユニットを組み込んだ照明装置及びこの照明装置を組み込んだ密着型および縮小型の画像読取装置（イメージセンサ）に関する。 The present invention relates to a light emitting unit, an illuminating device incorporating the light emitting unit, and a contact-type and reduced-type image reading device (image sensor) incorporating the illuminating device.
密着型イメージセンサは、ファクシミリ装置、複写機、イメージスキャナ装置等で原稿を読み取るための装置として用いられている。この密着型イメージセンサは、原稿面を主走査範囲に亘って線状に照明するライン照明装置を備えている。このライン照明装置は棒状または板状をなす透明導光体の端部に発光ユニットを配置し、導光体の端面から入射した光を内面で反射させながら長さ方向に沿って設けた出射面から出射せしめるようにしている。 The contact image sensor is used as a device for reading a document by a facsimile machine, a copying machine, an image scanner device or the like. This close-contact image sensor includes a line illumination device that illuminates a document surface linearly over the main scanning range. In this line illumination device, a light emitting unit is arranged at the end of a bar-like or plate-like transparent light guide, and an exit surface provided along the length direction while reflecting light incident from the end face of the light guide on the inner surface It is made to radiate | emit from.
前記発光ユニットの一般的な構造は図７に示すように、リードフレーム１００とリード端子１０１を樹脂モールド１０２で互いに接触しないように保持し、樹脂モールド１０２に設けた開口１０３に露出するリード端子１０１上に発光素子（ＬＥＤ）１０４…を搭載し、これら発光素子１０４とグランドにつながるリードフレーム１００とを金線１０５で接続している。 As shown in FIG. 7, the general structure of the light emitting unit is that the lead frame 100 and the lead terminal 101 are held by the resin mold 102 so as not to contact each other, and the lead terminal 101 exposed in the opening 103 provided in the resin mold 102. The light emitting elements (LEDs) 104 are mounted thereon, and the light emitting elements 104 and the lead frame 100 connected to the ground are connected by a gold wire 105.
ところで、最近では画像読み取りの高速化の要望があり、このためにはライン照明装置の輝度を上げ、これにより原稿の読取面を照明する照明光の輝度を上げることが必要になる。しかしながら、ライン照明装置の輝度を上げるために発光素子の通電電流を増加すると、発光と同時にジャンクション温度が上昇する（発光素子自体から発熱する）。それに伴って発光効率が低下し、発光素子の寿命も短くなる。 Recently, there has been a demand for speeding up image reading. For this purpose, it is necessary to increase the luminance of the line illumination device and thereby increase the luminance of the illumination light that illuminates the reading surface of the document. However, when the energization current of the light emitting element is increased in order to increase the luminance of the line illumination device, the junction temperature rises simultaneously with light emission (heat is generated from the light emitting element itself). Accordingly, the light emission efficiency is lowered and the life of the light emitting element is shortened.
そこで、特許文献１では、リードフレームの材料として熱伝導率が２５０Ｗ／（ｍ・Ｋ）以上の銅合金またはアルミニウム合金とすることを提案している。また、特許文献２では、リードフレームの一部を拡張して放熱効果を高めるようにしている。 Therefore, Patent Document 1 proposes to use a copper alloy or aluminum alloy having a thermal conductivity of 250 W / (m · K) or more as the material of the lead frame. In Patent Document 2, a part of the lead frame is expanded to enhance the heat dissipation effect.
上述した先行技術はいずれもリード端子に発光素子を搭載し、この発光素子とリードフレームとを金線で接続している。前記リード端子は先端が実装基板のスルーホールにハンダにて固定されるため、自ずからリード端子の断面積はスルーホールの大きさによって制限され、放熱を十分行える断面積にすることができない。 In each of the above prior arts, a light emitting element is mounted on a lead terminal, and the light emitting element and the lead frame are connected by a gold wire. Since the tip of the lead terminal is fixed to the through hole of the mounting substrate with solder, the cross sectional area of the lead terminal is naturally limited by the size of the through hole, and the cross sectional area that can sufficiently dissipate heat cannot be obtained.
また、発光素子は大面積のリードフレームに接続されているといっても細い金線を介して接続され、廻りは樹脂が充填されているため、極めて伝熱効率が悪く、リードフレームからの放熱は期待できない。 In addition, the light-emitting element is connected to a large area lead frame via a thin gold wire, and the surrounding area is filled with resin, so the heat transfer efficiency is very poor. I can't expect it.
上記課題を解決すべく本発明に係る発光ユニットは、線状若しくは幅狭帯状をなすリード端子とこのリード端子よりも大面積の板状リードフレームが樹脂モールドに保持された発光ユニットと、棒状又は板状をなす透明導光体の一端又は両端に前記発光ユニットを設けたライン発光装置であって、前記板状リードフレームに発光素子が搭載され、前記板状リードフレームは拡張部を有し、該拡張部は前記ケースに沿って折り曲げられた構成とした。
上記構成によれば、発熱源である発光素子が大面積の板状リードフレーム上に直接搭載されているので、リードフレームからの放熱効果が高まる。
In order to solve the above problems, a light-emitting unit according to the present invention includes a light-emitting unit in which a lead terminal having a linear or narrow band shape and a plate-like lead frame having a larger area than the lead terminal are held in a resin mold , a rod-shaped or A line light-emitting device in which the light-emitting unit is provided at one or both ends of a plate-shaped transparent light guide, wherein a light- emitting element is mounted on the plate-shaped lead frame , and the plate-shaped lead frame has an extended portion, the extension was bent et configuration along said casing.
According to the above configuration, since the light emitting element as a heat source is directly mounted on the plate-shaped lead frame having a large area, the heat dissipation effect from the lead frame is enhanced.
前記板状リードフレームには更に拡張部を付設することで放熱効果を高めることができる。拡張部が大きくて邪魔になる場合には、当該拡張部を例えばライン照明装置のケースに沿って折り曲げることが好ましい。また、放熱効果を高めるために板状リードフレームに放熱用のダミーリード端子を設けることも可能である。 The plate-like lead frame can be further provided with an extended portion to enhance the heat dissipation effect. In the case where the extension portion is large and obstructive, it is preferable to bend the extension portion along the case of the line lighting device, for example. In order to enhance the heat dissipation effect, it is possible to provide dummy lead terminals for heat dissipation on the plate-like lead frame.
本発明に係る発光ユニットは、棒状または板状をなす透明導光体の端部に取付けることでライン照明装置とすることができ、更にこのライン照明装置と、ラインイメージセンサと、原稿からの反射光または透過光を前記ラインイメージセンサに収束させるためのレンズアレイとを組み合わせることで画像読取装置とすることができる。 The light emitting unit according to the present invention can be a line illuminating device by being attached to the end of a bar-shaped or plate-shaped transparent light guide. Furthermore, the line illuminating device, the line image sensor, and the reflection from the document An image reading apparatus can be obtained by combining a lens array for converging light or transmitted light to the line image sensor.
本発明に係る発光ユニットによれば、発光素子からリードフレームへの伝熱効率が高く、リードフレームを介した放熱が効果的に行われる。その結果、発光効率の向上と寿命の延長に有効となる。 According to the light emitting unit of the present invention, the heat transfer efficiency from the light emitting element to the lead frame is high, and heat dissipation through the lead frame is effectively performed. As a result, it is effective in improving luminous efficiency and extending the life.
以下に本発明の実施の形態を添付図面に基づいて説明する。図１は本発明に係る発光素子を組み込んだ画像読取装置の断面図、図２は本発明に係る発光素子を組み込んだライン照明装置の斜視図、図３は本発明に係る発光素子の正面図、図４は発光ユニット内の発光素子の結線図である。 Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is a cross-sectional view of an image reading apparatus incorporating a light emitting element according to the present invention, FIG. 2 is a perspective view of a line illumination device incorporating the light emitting element according to the present invention, and FIG. 3 is a front view of the light emitting element according to the present invention. 4 is a connection diagram of light emitting elements in the light emitting unit.
画像読取装置はフレーム（筺体）１に凹部１ａ，１ｂを形成し、一方の凹部１ａにはライン照明装置１０を配置し、また他方の凹部１ｂには光電変換素子（ラインイメージセンサ）３を備えたセンサ基板４を取り付け、更にフレーム１内に等倍結像用のロッドレンズアレイ５を保持している。フレーム１の上部にはガラス板２が設けられている。 In the image reading apparatus, recesses 1a and 1b are formed in a frame (housing) 1, a line illumination device 10 is disposed in one recess 1a, and a photoelectric conversion element (line image sensor) 3 is provided in the other recess 1b. A sensor substrate 4 is attached, and a rod lens array 5 for equal magnification imaging is held in the frame 1. A glass plate 2 is provided on the upper portion of the frame 1.
ライン照明装置１０は、棒状または板状をなすアクリル樹脂製の透明導光体１１を白色ケース１２に装填し、このケース１２の両端には発光源として発光ユニット２０を取り付けている。透明導光体１１は主走査方向（長手方向）と直交する方向の断面形状は基本形状が矩形で、角部をＣ面取りし、この面を出射面１１ａとし、更に透明導光体１１の裏面には、入射光を散乱させるための光散乱パターン１１ｂが白色塗料をスクリーン印刷等することによって形成されている。
尚、図示例にあってはライン照明装置１０を１つ配置した例を示しているが、ロッドレンズアレイ５を中心として左右に１つづつ配置してもよい。
In the line illumination device 10, a transparent light guide 11 made of acrylic resin having a bar shape or a plate shape is loaded in a white case 12, and light emitting units 20 are attached to both ends of the case 12 as light emitting sources. The transparent light guide 11 has a rectangular cross-section in the direction orthogonal to the main scanning direction (longitudinal direction), the corner is chamfered, this surface is used as the exit surface 11a, and the back surface of the transparent light guide 11 is further formed. The light-scattering pattern 11b for scattering incident light is formed by screen-printing a white paint.
In the illustrated example, one line illuminating device 10 is disposed. However, one line illumination device 10 may be disposed on the left and right sides with the rod lens array 5 as the center.
発光ユニット２０は、樹脂モールド２１にリード端子２２…とこれらリード端子２２…よりも大面積の板状リードフレーム２３をインサート成形して作られ、発光素子を搭載するための窓２４が設けられている。 The light emitting unit 20 is formed by insert molding a lead terminal 22... And a plate-like lead frame 23 having a larger area than the lead terminals 22 in a resin mold 21, and a window 24 for mounting a light emitting element is provided. Yes.
リードフレーム２３の材料としては、りん青銅または鉄入り銅が好適に使用でき、このリードフレーム２３の窓２４から露出する部分に、ＲＧＢ（３原色）の発光素子（ＬＥＤ）２５，２６，２７を搭載し、これら発光素子２５，２６，２７とリード端子２２…とを金線２５ａ，２６ａ，２７ａで接続し、更に窓２４は金線の接続後に透明樹脂で封止している。 As the material of the lead frame 23, phosphor bronze or iron-containing copper can be preferably used, and RGB (three primary colors) light emitting elements (LEDs) 25, 26, and 27 are formed on portions exposed from the window 24 of the lead frame 23. The light emitting elements 25, 26, 27 and the lead terminals 22 are connected by gold wires 25a, 26a, 27a, and the window 24 is sealed with a transparent resin after the gold wires are connected.
また、リードフレーム２３からはアース端子（コモン）２８および放熱用のダミー端子２９，３０を導出し、前記リード端子２２…，アース端子（コモン）２８及びダミー端子２９，３０の下端を実装基板４０に形成したスルーホール４１にハンダを介して固定している。 Further, a ground terminal (common) 28 and heat radiation dummy terminals 29 and 30 are led out from the lead frame 23, and the lower ends of the lead terminals 22, the ground terminals (common) 28 and the dummy terminals 29 and 30 are mounted on the mounting substrate 40. The through hole 41 is fixed to the through hole 41 with solder.
以上において、ライン照明装置１０の出射面１１ａから出射した光がガラス板２を通して原稿Ｇに当てられ、原稿Ｇからの反射光をロッドレンズアレイ５を介して光電変換素子（ラインイメージセンサ）３にて検出することで原稿Ｇを読み取る。ガラス板２に対してフレーム１を、図２の副走査方向に移動させて原稿Ｇの所望の領域の読み取りを行う。この際、発光素子２５，２６，２７で発生した熱はリードフレーム２３に直接伝わり、リードフレーム２３自体、アース端子（コモン）２８及びダミー端子２９，３０から有効に放出される。 In the above, the light emitted from the emission surface 11 a of the line illumination device 10 is applied to the original G through the glass plate 2, and the reflected light from the original G is applied to the photoelectric conversion element (line image sensor) 3 via the rod lens array 5. The original G is read. The frame 1 is moved with respect to the glass plate 2 in the sub-scanning direction of FIG. At this time, heat generated in the light emitting elements 25, 26, 27 is directly transmitted to the lead frame 23, and is effectively released from the lead frame 23 itself, the ground terminal (common) 28, and the dummy terminals 29, 30.
図５は別実施例に係る発光素子の正面図であり、この実施利にあってはリードフレーム２３に拡張部２３ａを設け、この延長部２３ａからも放熱を行うようにしている。 Figure 5 is a front view of a light emitting device according to another embodiment, in this embodiment advantage is provided an extension 23a to the lead frame 23, and to perform the heat radiation from the extension portion 23a.
図６は別実施例に係る発光素子を組み込んだライン照明装置の斜視図であり、この実施例にあっては拡張部２３ａをライン照明装置１０のケース１２に沿って折り曲げ、他の部材との干渉を避ける構造にしている。 FIG. 6 is a perspective view of a line illuminating device incorporating a light emitting element according to another embodiment. In this embodiment, the extended portion 23a is bent along the case 12 of the line illuminating device 10 and is connected to other members. The structure avoids interference.
本発明に係る発光ユニットは、棒状導光体などと組み合わせた照明装置及びこの照明装置を組み込んだ密着型および縮小型の画像読取装置に有効に利用される。 The light emitting unit according to the present invention is effectively used for an illuminating device combined with a rod-shaped light guide and the like, and a contact type and a reduction type image reading device incorporating the illuminating device.
１…画像読取装置のフレーム、１ａ，１ｂ…凹部、２…ガラス基板、３…光電変換素子（ラインイメージセンサ）、４…センサ基板、５…ロッドレンズアレイ、１０…ライン照明装置、１１…透明導光体、１１ａ…出射面、１１ｂ…光散乱パターン、１２…白色ケース、２０…発光ユニット、２１…樹脂モールド、２２…リード端子、２３…リードフレーム、２３ａ…拡張部、２４…窓、２５，２６，２７…発光素子（ＬＥＤ）、２５ａ，２６ａ，２７ａ…金線、２８…アース端子（コモン）、２９，３０…放熱用のダミー端子、４０…実装基板、４１…スルーホール。 DESCRIPTION OF SYMBOLS 1 ... Frame of image reading apparatus, 1a, 1b ... Recess, 2 ... Glass substrate, 3 ... Photoelectric conversion element (line image sensor), 4 ... Sensor substrate, 5 ... Rod lens array, 10 ... Line illumination device, 11 ... Transparent Light guide, 11a ... light exit surface, 11b ... light scattering pattern, 12 ... white case, 20 ... light emitting unit, 21 ... resin mold, 22 ... lead terminal, 23 ... lead frame, 23a ... expansion part, 24 ... window, 25 , 26, 27... Light emitting element (LED), 25a, 26a, 27a... Gold wire, 28... Earth terminal (common), 29, 30.
Claims (1)
前記板状リードフレームに発光素子が搭載され、
前記板状リードフレームは拡張部を有し、該拡張部は前記ケースに沿って折り曲げられていることを特徴とするライン照明装置。 A lead terminal having a linear or narrow strip shape, a light emitting unit in which a plate-like lead frame having a larger area than the lead terminal is held by a resin mold, and a transparent light guide having a rod-like or plate-like shape are attached to the case, A line illumination device provided with the light emitting unit at one or both ends of the transparent light guide ,
A light emitting element is mounted on the plate-like lead frame,
The plate-like lead frame has an extension, the line illumination device in which the extension is characterized in that bent along said casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004020265A JP4129437B2 (en) | 2004-01-28 | 2004-01-28 | Line lighting device |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2004020265A JP4129437B2 (en) | 2004-01-28 | 2004-01-28 | Line lighting device |
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| JP2005217644A JP2005217644A (en) | 2005-08-11 |
| JP4129437B2 true JP4129437B2 (en) | 2008-08-06 |
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| JP2004020265A Expired - Fee Related JP4129437B2 (en) | 2004-01-28 | 2004-01-28 | Line lighting device |
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Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4542453B2 (en) * | 2005-03-24 | 2010-09-15 | 日亜化学工業株式会社 | Light emitting device |
| WO2007099796A1 (en) * | 2006-02-22 | 2007-09-07 | Nippon Sheet Glass Company, Limited. | Light emitting unit, lighting apparatus and image reading apparatus |
| JP2007299775A (en) * | 2006-04-03 | 2007-11-15 | Nichia Chem Ind Ltd | Light-emitting unit and lighting apparatus |
| JP4978053B2 (en) | 2006-05-02 | 2012-07-18 | 日亜化学工業株式会社 | Light emitting device and lighting device |
| JP2008147847A (en) * | 2006-12-07 | 2008-06-26 | Rohm Co Ltd | Linear light source unit and image reading apparatus |
| JP4924090B2 (en) * | 2007-02-23 | 2012-04-25 | 日亜化学工業株式会社 | Light emitting device |
| JP2008219337A (en) * | 2007-03-02 | 2008-09-18 | Rohm Co Ltd | Linear light source device |
| JP2009259935A (en) | 2008-04-15 | 2009-11-05 | Nippon Sheet Glass Co Ltd | Electronic component, lighting system, contact-type image sensor, and image reading device |
| JP2010103369A (en) * | 2008-10-24 | 2010-05-06 | Keihin Corp | Electronic control device |
| WO2010095760A2 (en) * | 2009-02-19 | 2010-08-26 | Sumitomo Electric Industries, Ltd. | Optical module enclosing lead frame and semiconductor optical device mounted on the lead frame with transparaent mold resin |
| JP2011040605A (en) * | 2009-08-12 | 2011-02-24 | Quark Technology Co Ltd | Ultraviolet irradiation device |
| JP2011054470A (en) * | 2009-09-03 | 2011-03-17 | Mitsubishi Cable Ind Ltd | Led mounted connector, and light source device equipped with the same |
| WO2011040633A1 (en) * | 2009-09-30 | 2011-04-07 | 三洋電機株式会社 | Light-emitting module |
| KR101545926B1 (en) | 2013-11-27 | 2015-08-20 | 엘지디스플레이 주식회사 | Lighting module and backlight unit including the same |
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| JP2005217644A (en) | 2005-08-11 |
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