JP4125205B2 - Edge exposure apparatus and substrate processing apparatus having the same - Google Patents

Description

  The present invention relates to an edge exposure apparatus that exposes a peripheral portion of a substrate and a substrate processing apparatus including the edge exposure apparatus.

  In processing steps of various substrates such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, or a glass substrate for an optical disk, a resist coating process is performed to form a circuit pattern on the substrate.

  A resist film is formed on the entire surface of the substrate after the resist coating process. Here, the resist film formed on the peripheral edge of the substrate may be peeled off by mechanical contact during substrate transportation to become particles. In order to prevent generation of particles and the like, a process of previously removing the resist film formed on the peripheral edge of the substrate is performed.

  The removal of the resist film is performed, for example, by exposing and developing the resist film formed on the peripheral portion while rotating the substrate after the resist coating process (edge exposure process).

  The edge exposure process is performed by an edge exposure apparatus. FIG. 9 is a schematic diagram showing a conventional general edge exposure apparatus.

  The edge exposure apparatus 900A of FIG. 9 includes a spin motor 910, a rotating shaft 911, a spin chuck 912, and a light projecting device 950. The light projecting device 950 includes a lens barrel 901, a light shielding mask 902, and a light guide 904. Further, the lens barrel 901 includes a lens 903 inside.

  The substrate W is placed on the spin chuck 912 at the time of edge exposure processing at the peripheral edge of the substrate. The spin chuck 912 sucks and holds the placed substrate W. The spin motor 910 rotates the rotation shaft 911. Thereby, the spin chuck 912 rotates and the substrate W rotates.

  On the other hand, light for edge exposure is introduced into the light guide 904 of the light projector 950 from an exposure light source (not shown). The light introduced into the light guide 904 is further introduced into the lens barrel 901.

  The light introduced into the lens barrel 901 is irradiated onto the peripheral surface of the substrate W through one or a plurality of lenses 903. Thereby, only the peripheral part of the substrate W is exposed.

  Note that part of the light irradiated on the peripheral surface of the substrate W is reflected toward the light projecting device 950 side, but the reflected light is absorbed by the light shielding mask 902. Thereby, scattering of the light between the board | substrate W and the light projector 950 is prevented.

  By the way, in the edge exposure process, when exposure light such as ultraviolet light is irradiated to the resist film, bubbles may be generated inside the resist film. In this case, bubbles break through the surface of the resist film and particles are scattered. Further, when the resist film is irradiated with exposure light such as ultraviolet light, a resist sublimate may be generated.

  Such generation of resist particles and sublimates has been regarded as a problem since it causes a decrease in yield during the development processing of the substrate.

  Therefore, various edge exposure apparatuses capable of eliminating particles and resist sublimates have been proposed (see, for example, Patent Document 1 and Patent Document 2).

  FIG. 10 is a schematic diagram showing a conventional edge exposure apparatus that can eliminate particles.

  The edge exposure apparatus 900B of FIG. 10 includes a spin motor 910, a spin chuck 912, a light source 931, an exposure unit 960, an exhaust unit 970, and a gas blowing unit 980. The exposure unit 960 includes a light path 932 and a light emitting unit 933. A gas blowing unit 980 is attached to the exposure unit 960. The exhaust means 970 includes an exhaust nozzle 940 and an exhaust passage 941, and the gas blowing means 980 includes an ejection nozzle 921 and a gas supply passage 920.

  In the exposure apparatus 900B, a spin motor 910 is connected to the lower end portion of the spin chuck 912 as a rotation mechanism. The spin chuck 912 holds the substrate W by suction. The spin chuck 912 is rotated by the spin motor 910, and the substrate W is rotated.

  In the exposure unit 960, for example, ultraviolet light is propagated from the light source 931 to the light emitting unit 933 through the light path 932. Thereby, the propagated light is irradiated to the peripheral portion of the substrate W.

  In the gas blowing means 980, the tip of the ejection nozzle 921 is opened toward the exposure part which is the peripheral edge of the substrate W, and gas is blown onto this part. In particular, the ejection nozzle 921 is provided inside the spin chuck 912 in the radial direction with respect to the exposure unit 960. Thereby, at the time of gas blowing, it is comprised so that an inert gas may be sprayed by the downward inclination toward the radial direction outer side from the inner side of the board | substrate W. FIG.

  The exhaust unit 970 is provided slightly below the exposure unit 960 and on the side of the held substrate W. In the exhaust unit 970, the exhaust nozzle 940 is provided on the surface of the substrate W or slightly above it so as to face the ejection nozzle 921. The exhaust nozzle 940 is connected to an exhaust pump via an exhaust pipe 941.

Accordingly, by driving the exhaust pump, the inert gas blown from the injection nozzle 921 comes into contact with the peripheral edge of the substrate W and is then efficiently sucked into the exhaust nozzle 940. As a result, particles generated during exposure of the peripheral edge of the substrate W are eliminated without being scattered.
Japanese Patent Laid-Open No. 6-216025 JP 7-201717 A

  By the way, at the time of edge exposure processing on the peripheral edge of the substrate, contamination of the lens of the optical system occurs. The contamination of the lens of the optical system is caused by resist particles and sublimates generated during the edge exposure process. As a result of the investigation, the present inventor has discovered that such contamination of the lens of the optical system causes a decrease in the illuminance of light used for exposure. When the illuminance decreases, it is necessary to lengthen the exposure time in order to perform sufficient edge exposure processing.

  Furthermore, the present inventor has discovered that contamination of the lens of the optical system changes not only the illuminance of light but also the refractive index of the light transmitted through the lens. In particular, when the refractive index of light transmitted through the lens changes, the light may not be focused on the peripheral edge of the substrate.

  As a countermeasure against such a problem, a method of cleaning the lens dirt by stopping the edge exposure apparatus itself and performing maintenance is taken, but there are problems such as labor cost required for cleaning and apparatus downtime. Has been pointed out.

  According to the edge exposure apparatus 900B described above, the inert gas is blown to the edge peripheral edge to be exposed, so that contamination of the lens of the optical system can be prevented.

  However, since the inert gas is always blown to the edge peripheral edge to be exposed during the edge exposure process, the consumption amount of the inert gas is increased, and the use efficiency of the injected inert gas is poor. Along with this, the manufacturing cost of the substrate W also increases.

  An object of the present invention is to provide an edge exposure apparatus and a substrate processing apparatus including the edge exposure apparatus that can efficiently prevent contamination of an optical member with a simple configuration.

  In order to solve the various problems associated with the contamination of the lens of the optical system as described above, the present inventor has devised an edge exposure apparatus and a substrate processing apparatus including the edge exposure apparatus described below.

An edge exposure apparatus according to a first aspect of the present invention is an edge exposure apparatus that exposes a peripheral portion of a substrate, the substrate holding means that holds the substrate, the light source that generates light, and the light generated by the light source that holds the substrate. An optical system that forms a path that leads to the substrate held by the means, an optical member that is provided in the path of light formed by the optical system, and a space around the space in the path of light formed by the optical system. A first space forming member that surrounds the member and has an opening through which light passes; and a gas supply unit that supplies an inert gas into a space formed by the first space forming member. A light collecting unit configured to collect light generated by the light source; and the optical member includes a light transmitting member configured to transmit light and having an end surface that receives the light collected by the light collecting unit. The forming member is a light transmitting portion by the light collecting means. The surrounding space in the path of the light incident on the end surface is intended to surround with the end face of the optical transmission member.

In the edge exposure apparatus according to the first invention, the substrate is held by the substrate holding means. The light generated by the light source is collected by the light collecting means, passes through the space formed by the first space forming member and the end face of the light transmission member, and enters the end face of the light transmission member. The light incident on the end face of the light transmission member is transmitted by the light transmission member, guided to the substrate held by the substrate holding means, and the peripheral portion of the substrate is exposed. An inert gas is supplied into the space formed by the first space forming member and the end face of the light transmission member by the gas supply means.

Thus, the inert gas is filled in that space, the inert gas is filled in the space, leaving the inert gas leaks from the opening. As a result, contaminants are prevented from entering the space due to the flow of the inert gas formed from the space to the outside through the opening. Therefore, contamination of the end face of the light transmission member is prevented. As a result, even when used for a long time, a decrease in light transmission efficiency due to contamination of the end face of the light transmission member is sufficiently prevented. Moreover, since inert gas is used, generation | occurrence | production of the pollutant by the substance in air | atmosphere is fully prevented.

In addition, since it is not necessary to supply a large amount of inert gas into the space formed by the first space forming member, the consumption of the inert gas can be reduced. As a result, low resources and low costs are realized.

Furthermore, since it is only necessary to provide the first space forming member having the opening, contamination of the end face of the light transmission member can be prevented with a simple configuration.

The optical member includes a condensing member that condenses the light transmitted by the light transmitting member on the peripheral portion of the substrate held by the substrate holding means, and surrounds the space in the light path from the condensing member to the substrate. A second space forming member surrounding the light collecting member may be further provided, and the gas supply means may further supply an inert gas into the space formed by the second space forming member.

In this case, the light generated by the light source is transmitted by the light transmission member and is collected on the peripheral edge of the substrate by the light collecting member. In this case, the light passes through the space formed by the second space forming member and the light collecting member.

As in the space the inert gas is filled, the inert gas is filled in the space, leaving the inert gas leaks from the opening. As a result, contaminants are prevented from entering the space due to the flow of the inert gas formed from the space to the outside through the opening. Therefore, contamination of the light collecting member is prevented.

The condensing member includes a cylindrical member containing a lens, and the second space forming member forms a space in the light path at the tip of the cylindrical member on the light emission side and is irradiated from the lens to the substrate. The light may pass through the opening.

In this case, a space is formed at the distal end portion on the light emission side of the cylindrical member containing the lens by the second space forming member. Thereby, since a space is formed by the second space forming member and the tubular member, the configuration becomes very simple.

Further, the inert gas into the space formed by the second space forming member and the cylindrical member is filled, the inert gas is filled in the space, leaving the inert gas leaks from the opening. As a result, contaminants are prevented from entering the space due to the flow of the inert gas formed from the space to the outside through the opening. Therefore, contamination of the lens is prevented.

The second space forming member may have a cylindrical peripheral surface portion that surrounds the periphery of the light path from the lens to the substrate, and a tapered portion that gradually decreases in diameter from the end portion of the peripheral surface portion.

In this case, the reflected light from the surface of the substrate is reflected outward by the tapered portion. Thereby, the reflected light on the surface of the substrate is prevented from entering the space formed by the second space forming member and the cylindrical member. Further, since the reflected light is reflected outward from the taper portion, the reflected light from the second space forming member is prevented from being irradiated again on the substrate.

  A substrate processing apparatus according to a second aspect of the present invention is a substrate processing apparatus that performs processing on a substrate, and includes a coating apparatus that applies a processing liquid to the substrate, and a peripheral portion of the substrate on which the processing liquid is applied by the coating apparatus. An edge exposure apparatus according to the first aspect of the invention for exposure is provided.

  In this case, the coating liquid is applied to the substrate by the coating apparatus, and the edge portion of the substrate to which the processing liquid is applied is exposed by the edge exposure apparatus according to the first aspect of the invention.

Accordingly, in the edge exposure apparatus, the inert gas fills the space formed by the first space forming member, and the inert gas leaks from the opening when the inert gas fills the space. As a result, contaminants are prevented from entering the space due to the flow of the inert gas formed from the space to the outside through the opening. Therefore, contamination of the end face of the light transmission member is prevented. As a result, even when used for a long time, a decrease in light transmission efficiency due to contamination of the end face of the light transmission member is sufficiently prevented.

In addition, since it is not necessary to supply a large amount of inert gas into the space formed by the first space forming member, the consumption of the inert gas can be reduced. As a result, low resources and low costs are realized.

Furthermore, since it is only necessary to provide the first space forming member having the opening, contamination of the end face of the light transmission member can be prevented with a simple configuration.

In the edge exposure apparatus according to the present invention, the substrate is held by the substrate holding means. The light generated by the light source is collected by the light collecting means, passes through the space formed by the first space forming member and the end face of the light transmission member, and enters the end face of the light transmission member. The light incident on the end face of the light transmission member is transmitted by the light transmission member, guided to the substrate held by the substrate holding means, and the peripheral portion of the substrate is exposed. An inert gas is supplied into the space formed by the first space forming member and the end face of the light transmission member by the gas supply means.

Thus, the inert gas is filled in that space, the inert gas is filled in the space, leaving the inert gas leaks from the opening. As a result, contaminants are prevented from entering the space due to the flow of the inert gas formed from the space to the outside through the opening. Therefore, contamination of the end face of the light transmission member is prevented. As a result, even when used for a long time, a decrease in light transmission efficiency due to contamination of the end face of the light transmission member is sufficiently prevented.

In addition, since it is not necessary to supply a large amount of inert gas into the space formed by the first space forming member, the consumption of the inert gas can be reduced. As a result, low resources and low costs are realized.

Furthermore, since it is only necessary to provide the first space forming member having the opening, contamination of the end face of the light transmission member can be prevented with a simple configuration.

  Hereinafter, an edge exposure apparatus and a substrate processing apparatus including the same according to an embodiment of the present invention will be described with reference to FIGS.

  In the following description, a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask, a substrate for an optical disk, and the like.

  FIG. 1 is a schematic diagram showing an example of an edge exposure apparatus according to an embodiment of the present invention.

  The edge exposure apparatus 100 according to the present embodiment includes a light projecting unit 10, a light projecting unit holding unit 20, a substrate rotating unit 40, a light source unit 50, and a gas supply unit 60.

  The light projecting unit 10 includes a lens barrel 11 and a light shielding mask 1. The light shielding mask 1 is provided at the lower end of the lens barrel 11, and the gas introducing path 2 is integrally formed in the light shielding mask 1.

  A light guide 50 t made of an optical fiber cable or the like is connected to the upper end of the lens barrel 11. Thereby, the light projection part 10 is connected with the light source unit 50 via the light guide 50t. A gas supply pipe 60t is connected to the gas introduction path 2. Thereby, the light projection part 10 is connected with the gas supply unit 60 via the gas supply pipe 60t. The gas supply unit 60 is connected to the light source unit 50 through a gas supply pipe 58.

The light projecting unit 10 irradiates the peripheral edge of the substrate W with light transmitted from the light source unit 50 via the light guide 50t. At the time of irradiation, N ₂ (nitrogen) gas is supplied as an inert gas from the gas supply unit 60 to the gas introduction path 2 of the light projecting unit 10 through the gas supply pipe 60t. The light source unit 50 is also supplied with N ₂ gas from the gas supply unit 60 via the gas supply pipe 58. Details of these will be described later.

  Here, a predetermined direction parallel to the substrate W placed on the substrate rotating unit 40 is defined as the Y direction, and a direction orthogonal to the Y direction is defined as the X direction.

  The light projecting unit holding unit 20 includes a Y direction drive motor 21, a Y direction ball screw 22, a light projecting unit holding guide 23, a support 24, an X direction drive motor 31, a support holding guide 32, and an X direction ball screw (not shown).

  In the light projecting unit holding unit 20, the light projecting unit holding guide 23 holds the light projecting unit 10 so as to be movable in the Y direction. Further, the Y-direction ball screw 22 is screwed into a connecting portion (not shown) provided in the light projecting portion 10.

  The Y direction ball screw 22 is provided so as to protrude from the Y direction drive motor 21, and rotates in the direction of the arrow R <b> 1 as the Y direction drive motor 21 operates. Thereby, the light projecting unit 10 moves in the Y direction as the Y direction ball screw 22 rotates.

  The Y-direction drive motor 21 and the light projecting unit holding guide 23 are supported at a predetermined height by a support 24.

  The lower end of the column 24 is held by a column holding guide 32. The column holding guide 32 holds the column 24 so as to be movable in the X direction. An X-direction ball screw (not shown) is screwed into a connection portion (not shown) provided on the column 24.

  The X direction ball screw protrudes from the X direction drive motor 31 and extends in the X direction, and rotates in a predetermined direction as the X direction drive motor 31 rotates. Thereby, the support | pillar 24 moves to a X direction with operation | movement of the X direction drive motor 31. FIG.

  By such operation of each part of the light projecting unit holding unit 20, the light projecting unit 10 moves in the X direction and the Y direction.

  The Y direction drive motor 21 and the X direction drive motor 31 of the light projecting unit holding unit 20 are connected to a controller (not shown). The controller moves the light projecting unit 10 to a desired plane coordinate position by controlling the operations of the Y-direction drive motor 21 and the X-direction drive motor 31.

  The substrate rotation unit 40 includes a substrate rotation motor 41, a substrate rotation shaft 42, and a spin chuck 43. The substrate W is placed on the spin chuck 43 at the time of exposure processing (edge exposure processing) of the peripheral edge of the substrate W. Therefore, the spin chuck 43 holds the substrate W by suction. The spin chuck 43 is connected to a substrate rotation shaft 42 provided so as to protrude from the substrate rotation motor 41.

  The substrate rotation motor 41 rotates the substrate rotation shaft 42 in the direction of the arrow R2. As a result, the spin chuck 43 rotates and the substrate W held by suction rotates.

  The substrate rotation motor 41 is connected to a controller (not shown) similarly to the Y direction drive motor 21 and the X direction drive motor 31. The controller rotates the substrate W by controlling the operation of the substrate rotation motor 41.

  The light source unit 50 generates light for exposing the resist film on the substrate W (hereinafter referred to as exposure light). The exposure light generated by the light source unit 50 is sent to the light projecting unit 10 through the light guide 50t. Details will be described later.

Gas supply unit 60, N ₂ gas is supplied to the gas introducing passage 2 of the light projecting unit 10 via the gas supply pipe 60t, as described above, the N ₂ gas _is supplied to the light source unit 50 through the gas supply pipe 58 To do.

The configuration of the gas supply unit 60 is not particularly limited as long as N ₂ gas can be supplied to the gas introduction path 2 and the light source unit 50 of the light projecting unit 10. For example, the gas supply unit 60 may include an N ₂ gas tank, a pump, or the like, or may be a connecting member that can be connected to a previously provided facility pipe of N ₂ gas.

In the present embodiment, the gas supply unit 60 supplies N ₂ gas to the light projecting unit 10 and the light source unit 50, but the supplied gas is fine if the particles are fine and the inert gas does not cause fluctuation of light. There is no particular limitation.

  The edge exposure apparatus 100 according to the present embodiment operates as follows during the edge exposure processing of the substrate W.

  First, the substrate W is placed on the spin chuck 43 of the substrate rotation unit 40. The spin chuck 43 holds the substrate W by suction. The substrate W is rotated by the substrate rotation motor 41 rotating the substrate rotation shaft 42.

  Next, when the Y direction drive motor 21 and the X direction drive motor 31 of the light projecting unit holding unit 20 that holds the light projecting unit 10 operate, the light projecting unit 10 is moved to a predetermined plane coordinate position.

  Subsequently, the exposure light generated by the light source unit 50 at a desired position on the substrate W is sent to the light projecting unit 10 through the light guide 50t. Thereby, the exposure light is irradiated to the resist film of the substrate W.

On the other hand, simultaneously with the irradiation of the exposure light onto the substrate W, N ₂ gas supplied from the gas supply unit 60 is supplied to the gas introduction path 2 of the projection path 10 through the gas supply pipe 60t. As a result, N ₂ gas is sent around the exposure target portion of the substrate W and the periphery of the tip portion of the light projecting portion 10. Further, during the above series of operations, the light source unit 50 is supplied with N ₂ gas from the gas supply unit 60 through the gas supply pipe 58.

  As a result of the above-described series of operations by the edge exposure apparatus 100, the peripheral portion of the target substrate W is exposed.

  Details of the configuration of the light projecting unit 10 in FIG. 1 will be described with reference to FIGS. 2 and 3. FIG. 2 is a diagram for explaining the configuration of the light projecting unit 10 according to an embodiment of the present invention, and FIG. 3 is a longitudinal sectional view around the lower end of the light projecting unit 10 in FIG.

  As shown in FIG. 2, an aperture AP and a plurality of lenses LE1, LE2, LE3, and LE4 are provided inside the lens barrel 11 of the light projecting unit 10.

  The lens barrel 11 and the light shielding mask 1 are both formed into a cylindrical shape, and the outer diameter of the lens barrel 11 is designed to be approximately the same as the inner diameter of the light shielding mask 1. Both the upper end and the lower end of the light shielding mask 1 formed into a cylindrical shape are open. As a result, the lower end portion of the lens barrel 11 is inserted into one end side (upper end side) of the light shielding mask 1.

  The other end side (lower end side) of the light shielding mask 1 into which the lower end portion of the lens barrel 11 is not inserted has a tapered shape. In other words, the lower end side of the light shielding mask 1 is gradually lighter toward the end face. Further, the gas introduction path 2 is integrally formed on the outer peripheral surface of the light shielding mask 1 as described above.

  The exposure light sent from the light source unit 50 to the upper end portion of the lens barrel 11 via the light guide 50t is incident on the aperture AP. The aperture AP is provided with a mask having a slit or the like, and is used for reducing the condensing diameter of the exposure light or forming a predetermined shape. Thereby, the exposure light passing through the aperture AP is shaped into a predetermined size and shape (for example, a rectangle).

  The exposure light that has passed through the aperture AP passes through a plurality of lenses LE1 to LE4 in the lens barrel 11, and is irradiated onto a predetermined position of the substrate W as indicated by an arrow L1. A part of the exposure light irradiated on the substrate W may be reflected by the resist film on the substrate W toward the light projecting unit 10 as indicated by an arrow L2.

  When such reflection is repeated between the substrate W and the light projecting unit 10, the exposure light is diffused between the substrate W and the light projecting unit 10. The above-described light shielding mask 1 is provided to prevent such scattering of exposure light. Since the outer surface of the light shielding mask 1 is processed so as to easily absorb light, the reflected light from the substrate W is further prevented from being reflected. Further, since the lower end side of the light shielding mask 1 is gradually lighter, the reflected light from the substrate W is prevented from entering the lens LE4 in the lens barrel 11 again.

  Furthermore, since the lower end side of the light shielding mask 1 is gradually lighter, even if the reflected light from the substrate W is irradiated to the lower end side of the light shielding mask 1, the reflected light is reflected outward.

  The distance h1 from the lens LE4 through which the exposure light finally passes in the lens barrel 11 to the surface of the substrate W is longer than the distance h2 from the lower end of the light shielding mask 1 to the surface of the substrate W. Thus, a predetermined semi-closed space opened to the outside by the light shielding mask 1 is formed between the lens LE4 and the lower end of the light shielding mask 1. A distance h1 from the lens LE4 to the surface of the substrate W is, for example, 10 mm, and a distance h2 from the lower end of the light shielding mask 1 to the surface of the substrate W is, for example, 1 mm.

  The gas introduction path 2 integrally formed on the outer peripheral surface of the light shielding mask 1 communicates the semi-closed space and the gas supply pipe 60 t connected to the gas introduction path 2.

In FIG. 3, N ₂ gas is supplied from the gas supply unit 60 to the gas supply pipe 60t as indicated by an arrow K1. As a result, as indicated by an arrow K2, N ₂ gas from the gas supply pipe 60t is introduced into the semi-enclosed space 1P between the lens LE4 and the lower end of the light shielding mask 1 through the gas introduction path 2. Thereby, the N ₂ gas is filled in the semi-enclosed space 1P.

As N ₂ gas is continuously supplied to the semi-enclosed space 1P, the N ₂ gas filled in the semi-enclosed space 1P leaks out from the opening of the light shielding mask 1 as indicated by an arrow K3.

  At the time of edge exposure of the substrate W, if exposure light is projected onto the resist film, a resist sublimate may be generated. In addition, bubbles may be generated inside the resist film, and the particles of the resist may be scattered by the bubbles breaking through the surface of the resist film.

  As described above, when the resist sublimates and particles generated during the edge exposure processing of the substrate W scatter on the substrate W as indicated by the arrow S, the scattered resist sublimates and particles adhere to the surface of the lens LE4. As a result, the illuminance of the exposure light decreases and the refractive index of the lens LE4 changes.

  When the illuminance decreases due to the lens LE4, the exposure time of the edge exposure process becomes longer. Further, when the exposure light passes through the lens LE4 having a changed refractive index, the focus on the substrate W is not achieved, and the exposure accuracy is deteriorated.

However, in the edge exposure apparatus 100 according to the present embodiment, the sublimates and particles of the resist film scattered on the substrate W as indicated by the arrow S leak from the opening of the light shielding mask 1 as indicated by the arrow K3. The flow of N ₂ gas prevents entry into the semi-enclosed space 1P. As a result, resist sublimates and particles are prevented from adhering and depositing on the surface of the lens LE4 in the lens barrel 11.

  In addition, during edge exposure processing of the substrate W, substances contained in the atmosphere may react when exposed to exposure light, and unnecessary products may be generated.

However, in the edge exposure apparatus 100 according to the present embodiment, the semi-enclosed space 1P is filled with N ₂ gas that is an inert gas, and the space between the lower end of the light shielding mask 1 and the substrate W is always N _2. Gas leaks out.

  Accordingly, since the exposure light that passes through the lens LE4 and is projected onto the substrate W is prevented from passing through the atmosphere, generation of unnecessary products due to the atmosphere is prevented. As a result, unnecessary products are prevented from adhering to the surface of the lens LE4.

  Note that examples of the substance contained in the atmosphere include sulfur and silicon-based substances.

  As described above, in edge exposure apparatus 100 according to the present embodiment, resist sublimates and particles and products generated from substances contained in the atmosphere do not adhere to and accumulate on lens LE4 in lens barrel 11. .

  Therefore, it is not necessary to periodically perform the maintenance of the lens LE4, and the cost can be reduced accordingly. Further, since the illuminance reduction of the exposure light passing through the lens LE4 is prevented, it is not necessary to lengthen the exposure time. Further, since the refractive index of the lens LE4 is always kept constant, the exposure accuracy is maintained and the edge exposure process with high reliability can be performed.

As shown in FIG. 3, a semi-closed space 1 </ b> P is formed between the lens LE <b> 4 and the lower end portion of the light shielding mask 1. By filling the semi-enclosed space 1P with N ₂ gas, it is possible to ensure that the atmosphere does not enter the passage of exposure light. Here, it is preferable that the area of the portion surrounding the periphery of the semi-enclosed space 1P is larger than the area of the opening.

Further, compared to the case where N ₂ gas is blown between the lens LE4 and the substrate W in the open space, the consumption of N ₂ gas is small, so that resource saving is realized.

  Further, as shown in FIG. 3, the semi-closed space 1 </ b> P is formed by the light guide 1 and the lens barrel 11 and has a very simple configuration.

  Details of the configuration of the light source unit 50 of FIG. 1 will be described with reference to FIG. FIG. 4 is a diagram for explaining the configuration of the light source unit 50 according to the embodiment of the present invention.

  The light source unit 50 of FIG. 1 includes a reflector 51, a lamp 52, a shutter motor 53, a shutter 54, a diaphragm motor 55, a diaphragm disk 56, a semi-closed container 57, and a casing 59. A light guide 50t and a gas supply pipe 58 are connected to the casing 59 from the outside.

  From the lamp 52, the above-described exposure light is generated. The lamp 52 is, for example, an ultraviolet lamp. The reflector 51 reflects a part of the exposure light generated from the lamp 52 and collects it at a predetermined position.

  A shutter 54 is disposed at a light collecting position by the reflector 51. The shutter 54 is rotatably attached to the shutter motor 53. The shutter 54 is opened and closed by the operation of the shutter motor 53.

  In addition, an exposure light incident portion 50x of the light guide 50t is fixed at a condensing position by the reflector 51 by a connection portion of the casing 59 and a light guide 50t (not shown).

  Further, a diaphragm disk 56 is disposed between the lamp 52 and the shutter 54. The aperture disc 56 has an opening and is connected to the aperture motor 55 by a drive mechanism (not shown). The aperture area of the aperture disc 56 is adjusted by operating the aperture motor 55.

  A semi-closed container 57 is disposed so as to surround the periphery of one end portion (exposure light incident portion 50x) of the light guide 50t connected to the light source unit 50.

  Thus, even when the shutter 54 is opened by the shutter motor 53 and when the aperture disk 56 is fully opened by the aperture motor 55, the exposure light generated by the lamp 52 is collected in the exposure light incident portion 50x with a sufficient amount of light. Lighted. The opening 57h is formed closer to the lamp 52 than the exposure light incident part 50x.

  When the shutter 54 is opened by the shutter motor 53, the direct light from the lamp 52 and a part of the reflected light from the reflector 51 are incident on the exposure light incident part 50x. In this case, the amount of exposure light incident on the exposure light incident portion 50 x is adjusted by the aperture disk 56.

  On the other hand, when the shutter 54 is closed by the shutter motor 53 (the state shown in FIG. 4), the direct light from the lamp 52 and a part of the reflected light from the reflector 51 are blocked by the shutter 54. As a result, the exposure light is not incident on the exposure light incident portion 50x.

  Here, inside the casing 59, the gas supply pipe 58 connected from the outside is attached to the semi-closed container 57. Thereby, the semi-enclosed space 2 </ b> P that is the internal space of the semi-enclosed container 57 and the gas supply pipe 58 are communicated with each other.

When the exposure light is generated by the lamp 52 and the shutter 54 is opened, the gas supply pipe 58 is supplied with N ₂ gas, which is an inert gas, from the gas supply unit 60 described above.

Thereby, the N ₂ gas is filled in the semi-closed space 2P of the semi-closed container 57. As a result, there is no air in the condensing part of the exposure light, and a substance contained in the air reacts when irradiated with the exposure light, thereby preventing unnecessary products from being generated. As a result, the product from the substance contained in the atmosphere does not adhere to and deposit on the exposure light incident part 50x.

  Therefore, the exposure light incident on the exposure light incident part 50x and sent to the light projecting part 10 through the light guide 50t is sufficiently reduced in light quantity due to contamination of the exposure light incident part 50x even if it is used for a long time. Is prevented.

Further, as described above, since the N ₂ gas is supplied into the semi-closed container 57, it is much lower than when N ₂ gas is blown between the exposure light incident part 50x and the reflector 51 in an open state. N ₂ gas can be supplied in consumption. Thereby, resource reduction is realized.

  In the above, it is desirable that the size of the opening 57h of the semi-closed container 57 is designed to be as small as possible.

  As shown in FIG. 4, the semi-enclosed space 2P is formed by a semi-enclosed container 57 having a simple structure having an opening in a part thereof, and has a very simple configuration.

  In the present embodiment, the exposure light applied to the substrate W from the light projecting unit 10 is determined according to a resist film formed in advance on the substrate W. Examples of such exposure light include light having a wavelength in the ultraviolet region.

  The edge exposure apparatus 100 in FIG. 1 can move in the X direction and the Y direction by holding the light projecting unit 10 in the light projecting unit holding unit 20, but holds the light projecting unit 10. The unit 20 does not necessarily hold the light projecting unit 10 so as to be movable in the X direction and the Y direction, and may move the light projecting unit 10 only in either the X direction or the Y direction.

  As described above, according to the edge exposure apparatus 100 according to the present embodiment, particles and sublimates generated during the edge exposure process can be eliminated with a simple configuration.

(Supply test of N ₂ gas to semi-enclosed space)
FIG. 5 is a schematic diagram showing an outline of a supply test of N ₂ gas to the semi-enclosed space 1P.

In order to obtain an optimum supply amount when supplying N ₂ gas to the semi-enclosed space 1P of FIG. 3, the following test (N ₂ gas supply amount measurement test) was performed.

  First, as shown in FIG. 5A, the light projecting unit 10 of FIG. 1 was attached to a drive type base 200X. The drive-type gantry 200X includes a column 201a, a connecting member 201b, a drive pedestal 202, and a ball screw 203.

  The drive base 202 is screwed with the ball screw 203. When the ball screw 203 is rotated by a motor (not shown), the drive base 202 moves in a direction parallel to the ball screw 203 (direction of arrow G).

  A connecting member 201b is connected to the upper end side of the column 201a that is attached so as to be perpendicular to the drive base 202. The light projecting unit 10 is held by the gantry 200X in a state of being movable in the direction of arrow G by being attached to the connecting member 201b.

  Next, the pH test paper PH (red) was attached to the lower surface side of the lens LE4 provided inside the lens barrel 11 of the light projecting unit 10. The lower surface side of the lens LE4 is a part of a surface surrounding the semi-enclosed space 1P in FIG.

  And as shown to Fig.5 (a), it arrange | positioned so that the board | substrate W might become the distance of 10 mm from the lens LE4 (attachment position of pH test paper PH) of the light projection part 10 in the lower end side of the light projection part 10. FIG. .

  Thereafter, the light guide 1 was attached to the lower end of the lens barrel 11. The light guide 1 was attached such that the distance h3 from the lower end of the light guide 1 to the substrate W was 1 mm.

  After arranging the light projecting unit 10 and the substrate W as described above, the smoke tube 301 for ejecting hydrogen chloride gas is arranged at a predetermined position. The predetermined position is a position at which the hydrogen chloride gas ejected from the smoke tube 301 is blown into the space between the lower end of the light guide 1 and the surface of the substrate W.

  A flow meter 601 was attached to the gas supply pipe 60t. The restrictor of the flow meter 601 was opened.

As shown in FIG. 1, the gas supply unit 60 connected to the gas introduction path 2 through the gas supply pipe 60t is provided with an N ₂ gas supply amount adjusting unit (not shown). Supplying amount adjuster of N ₂ gas in the gas supply unit 60 (in this example, a needle) by operating a flow meter 601 N ₂ gas supplied to the semi-closed space 1P based on the measurement values of the amount of later It adjusted so that it might become a predetermined | prescribed amount.

After the supply amount of N ₂ gas to the semi-enclosed space 1P is set to a predetermined value, hydrogen chloride gas is ejected from the smoke tube 301, and the space between the lower end of the light guide 1 and the surface of the substrate W (at a distance h3) It sprayed so that hydrogen chloride gas might fill a 1 mm space). The hydrogen chloride gas was sprayed continuously for 3 minutes.

Thereafter, the supply of N ₂ gas to the semi-enclosed space 1P and the blowing of hydrogen chloride gas were stopped, and the presence or absence of discoloration of the pH test paper PH attached to the lens LE4 was confirmed.

Here, the predetermined supply amount (N ₂ gas set flow rate) of N ₂ gas to the semi-enclosed space 1P is 0, 0.25, 0.5, 0.75, 1, 1.25, 1.5, 1.75, 2 and 2.25 NL / min.

The following table shows the presence or absence of discoloration of the pH test paper PH at each N ₂ gas set flow rate.

Thus, the pH test paper PH did not change color except when the N ₂ gas set flow rate was 0 NL / min. Therefore, in the edge exposure apparatus 100, it has been clarified that the lens LE4 of the light projecting unit 10 is prevented from being soiled by setting at least the N ₂ gas set flow rate to 0.25 NL / min or more.

In this way, since the lens LE4 is prevented from being soiled with a small N ₂ gas set flow rate, the resource can be reduced and particles and sublimates generated during the edge exposure process can be efficiently eliminated. Yes.

Since fluctuations in the exposure light by the N ₂ gas to investigate whether or not occur, the following tests were carried out (N ₂ gas fluctuation measurement test).

First, as shown in FIG. 5B, the light projecting unit 10 of FIG. 1 was attached to the drive type base 200X. The configuration and operation of the drive type base 200X are the same as those in the N ₂ gas supply amount measurement test.

  And the ultraviolet meter 701 was arrange | positioned at the lower end side of the light projection part 10. FIG. It arrange | positioned so that the measurement surface of the ultraviolet meter 701 might become the distance of 10 mm from the lens LE4 of the light projection part 10. FIG.

  Thereafter, the light guide 1 was attached to the lower end of the lens barrel 11. The light guide 1 was attached such that the distance h4 from the lower end of the light guide 1 to the measurement surface of the ultraviolet meter 701 was 1 mm.

  Next, the flow meter 601 was attached to the gas supply pipe 60t. The restrictor of the flow meter 601 was opened.

Similarly to the N ₂ gas supply amount measurement test, the N ₂ gas supply amount adjusting unit (needle) of the gas supply unit 60 is operated to supply N to the semi-enclosed space 1P based on the measured value of the flow meter 601. ₂ The amount of gas was adjusted to a predetermined amount described later.

  Therefore, the light projecting unit 10 for exposure light was projected onto the measurement surface of the ultraviolet meter 701 continuously for 1 minute. This operation is performed, for example, by opening the shutter 54 of the light source unit 50 for one minute in the first embodiment.

Thereafter, the supply of N ₂ gas to the semi-enclosed space 1P and the irradiation of the exposure light to the measurement surface of the ultraviolet meter 701 were stopped, and the fluctuation of the measurement value of the ultraviolet meter 701 when the exposure light was irradiated was confirmed.

Here, N ₂ predetermined amount of gas supplied into the semi closed space 1P (N ₂ gas set flow) is, N ₂ gas supply amount measuring test as well as 0,0.25,0.5,0.75, 1, 1.25, 1.5, 1.75, 2 and 2.25 NL / min.

The following table shows the presence or absence of fluctuations in the measured value of the ultraviolet meter 701 at each N ₂ gas set flow rate.

Thus, the measurement value of the ultraviolet meter 701 did not change at all N ₂ gas set flow rates. Therefore, it has become clear that the exposure light does not fluctuate due to the N ₂ gas.

Thus, when using a light having a wavelength in the ultraviolet region as the exposure light, N ₂ gas, as an inert gas to fill the semi-closed space 1P, it has been found to be suitably used.

  A substrate processing apparatus including the edge exposure apparatus 100 according to the above embodiment will be described.

  FIG. 6 is a plan view of a substrate processing apparatus including an edge exposure apparatus 100 according to an embodiment of the present invention.

  In each of the drawings from FIG. 6 to FIG. 8 described later, arrows indicating the X direction, the Y direction, and the Z direction orthogonal to each other are attached in order to clarify the positional relationship. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction. In each direction, the direction in which the arrow points is the + direction, and the opposite direction is the-direction. Further, the rotation direction around the Z direction is defined as the θ direction. The X direction and Y direction in the following description may be the same as or different from the X direction and Y direction used in the description of FIG.

  As shown in FIG. 6, the substrate processing apparatus 500 includes an indexer block 509, an antireflection film processing block 510, a resist film processing block 511, a development processing block 512, and an interface block 513. A stepper unit 514 is disposed adjacent to the interface block 513.

  The indexer block 509 includes a plurality of carrier platforms 560 and an indexer robot IR. The indexer robot IR has a hand IRH for delivering the substrate W. The indexer block 509 is provided with a bake unit controller 530 that controls the operation of a heat treatment unit described later. The anti-reflection film processing block 510 includes anti-reflection film heat treatment units 550 and 551, an anti-reflection film coating processing unit 570, and a first central robot CR1. The antireflection film coating processing unit 570 is provided opposite to the antireflection film heat treatment units 550 and 551 with the first central robot CR1 interposed therebetween. The first center robot CR1 has a hand CRH1 for delivering the substrate W.

  The resist film processing block 511 includes a resist film heat treatment unit 552, 553, a resist film coating processing unit 580, and a second central robot CR2. The resist film coating processing unit 580 is provided opposite to the resist film heat treatment units 552 and 553 with the second central robot CR2 interposed therebetween. The second center robot CR2 has a hand CRH2 for delivering the substrate W.

  The development processing block 512 includes a development heat treatment unit 554, 555, a development processing unit 590, and a third central robot CR3. The development processing unit 590 is provided to face the development heat treatment units 554 and 555 with the third central robot CR3 interposed therebetween. The third central robot CR3 has a hand CRH3 for delivering the substrate W.

  The interface block 513 includes a fourth central robot CR4, a buffer SBF, an interface transport mechanism IFR, and the edge exposure apparatus 100 of FIG. The fourth central robot CR4 has a hand CRH4 for delivering the substrate W. The interface transport mechanism IFR delivers the substrate W between a substrate platform PASS8 and a stepper unit 514, which will be described later.

  In the substrate processing apparatus 500 according to the present embodiment, an indexer block 509, an antireflection film processing block 510, a resist film processing block 511, a development processing block 512, and an interface block 513 are arranged in parallel along the Y direction. Has been.

  Hereinafter, each of the indexer block 509, the antireflection film processing block 510, the resist film processing block 511, the development processing block 512, and the interface block 513 is referred to as a processing block.

  The substrate processing apparatus 500 is provided with a main controller (not shown) that controls the operation of each processing block.

  In addition, a partition is provided between the processing blocks. Each of the partition walls is provided with two substrate platforms PASS1 to PASS6 adjacent to each other in the vertical direction for transferring the substrate W between the processing blocks.

  Further, the development heat treatment section 555 of the development processing block 512 is provided with a substrate platform PASS7 as described later, and the edge exposure apparatus 100 of the interface block 513 includes a substrate platform as described later. PASS8 is provided. The substrate platforms PASS1 to PASS8 are provided with a plurality of support pins fixedly installed. The substrate platforms PASS1 to PASS8 are provided with optical sensors (not shown) that detect the presence or absence of the substrate W. Thereby, it is possible to determine whether or not the substrate W is placed on the substrate platforms PASS1 to PASS8.

  The substrate platforms PASS1, PASS3, and PASS5 are used when delivering an unprocessed substrate W, and the substrate platforms PASS2, PASS4, and PASS6 are used when delivering a processed substrate W.

  Next, the operation of the substrate processing apparatus 500 according to the present embodiment will be briefly described.

  On the carrier mounting table 560 of the indexer block 509, a carrier C that stores a plurality of substrates W in multiple stages is loaded. The indexer robot IR takes out the unprocessed substrate W stored in the carrier C by using the hand IRH for delivering the substrate W. Thereafter, the indexer robot IR rotates in the ± θ direction while moving in the ± X direction, and transfers the unprocessed substrate W to the substrate platform PASS1.

  In the present embodiment, a FOUP (front opening unified pod) is adopted as the carrier C. However, the present invention is not limited to this, and the OC (Standard Mechanical Inter Face) pod and the storage substrate W are exposed to the outside air. open cassette) or the like may be used. Further, the indexer robot IR, the first to fourth center robots CR1 to CR4, and the interface transport mechanism IFR are each provided with a direct-acting transport robot that slides linearly with respect to the substrate W and moves the hand back and forth. Although it is used, the present invention is not limited to this, and an articulated transfer robot that linearly moves the hand back and forth by moving the joint may be used.

The unprocessed substrate W transferred to the substrate platform PASS1 is received by the hand CRH1 of the first central robot CR1 of the antireflection film processing block 510. The first center robot CR1 carries the substrate W into the antireflection film coating processing unit 570. In the antireflection film coating unit 570, the anti-reflection film at the bottom of the photoresist film for reducing standing wave and halation generated during the exposure is applied and formed by a coating unit BARC below.

  Thereafter, the first central robot CR1 takes out the substrate W from the antireflection film coating processing unit 570 and carries it into the antireflection film heat treatment units 550 and 551. After predetermined processing is performed in the antireflection film heat treatment units 550 and 551, the first central robot CR1 takes out the substrate W from the antireflection film heat treatment units 550 and 551 and transfers it to the substrate platform PASS3. To do.

  The substrate W transferred to the substrate platform PASS3 is received by the hand CRH2 of the second central robot CR2 of the resist film processing block 511. The second center robot CR2 carries the substrate W into the resist film coating processing unit 580. In the resist film coating processing unit 580, a photoresist film is coated and formed on a substrate W on which an antireflection film is coated by a coating unit RES described later. Thereafter, the second central robot CR2 takes out the substrate W from the resist film coating processing unit 580 and carries it into the resist film heat treatment units 552 and 553. After the predetermined processing is performed in the resist film heat treatment units 552 and 553, the second central robot CR2 takes out the substrate W from the resist film heat treatment units 552 and 553 and transfers it to the substrate platform PASS5.

  The substrate W transferred to the substrate platform PASS5 is received by the hand CRH3 of the third central robot CR3 of the development processing block 512. The third central robot CR3 transfers the substrate W to the substrate platform PASS7. The substrate W transferred to the substrate platform PASS7 is received by the hand CRH4 of the fourth central robot CR4 of the interface block 513. The fourth center robot CR4 carries the substrate W into the edge exposure apparatus 100. After the predetermined processing is performed in the edge exposure apparatus 100, the fourth central robot CR4 takes out the substrate W from the edge exposure apparatus 100 and transfers it to the substrate platform PASS8 provided in the edge exposure apparatus 100.

  The substrate W transferred to the substrate platform PASS8 is received by the interface transport mechanism IFR. The interface transport mechanism IFR carries the substrate W into the stepper unit 514. A predetermined process is performed on the substrate W in the stepper unit 514. Thereafter, the interface transport mechanism IFR receives the substrate W from the stepper unit 514 and transfers it to the substrate platform PASS8 provided in the edge exposure apparatus 100.

  The substrate W transferred to the substrate platform PASS8 is received by the hand CRH4 of the fourth central robot CR4 of the interface block 513. The fourth center robot CR4 carries the substrate W into the development heat treatment section 555. In the development heat treatment section 555, the substrate W is subjected to heat treatment. Thereafter, the fourth central robot CR4 takes out the substrate W from the development heat treatment section 555 and transfers it to the substrate platform PASS7.

  The substrate W transferred to the substrate platform PASS7 is received by the hand CRH3 of the third central robot CR3 of the development processing block 12. The third center robot CR3 carries the substrate W into the development processing unit 590. In the development processing unit 590, the exposed substrate W is subjected to development processing. Thereafter, the third central robot CR3 takes out the substrate W from the development processing unit 590 and carries it into the development heat treatment unit 554. After the predetermined processing is performed in the development heat treatment section 554, the third central robot CR3 takes out the substrate W from the development heat treatment section 554 and puts it on the substrate platform PASS6 provided in the resist film processing block 511. Transfer.

  The substrate W transferred to the substrate platform PASS6 is transferred to the substrate platform PASS4 by the second central robot CR2 of the resist film processing block 511. The substrate W transferred to the substrate platform PASS4 is transferred to the substrate platform PASS2 by the first central robot CR1 of the antireflection film processing block 510.

  The substrate W transferred to the substrate platform PASS2 is stored in the carrier C by the indexer robot IR of the indexer block 509.

  Next, FIG. 7 is a side view of the substrate processing apparatus 500 of FIG. 6 viewed from the −X direction.

  A carrier C storing the substrate W is placed on the carrier placement table 560 of the indexer block 509. The hand IRH of the indexer robot IR receives the substrate W in the carrier C by rotating in the ± θ direction or moving back and forth in the ± Y direction.

  In the antireflection film heat treatment section 550 of the antireflection film processing block 510, two heat treatment units PHP with a transfer section (hereinafter simply referred to as heat treatment units) and three hot plates HP are stacked one above the other. In the heat treatment part 551 for the antireflection film, two adhesion reinforcing agent application treatment parts AHL and four cooling plates CP are stacked one above the other. Further, in the heat treatment units 550 and 551 for the antireflection film, a local controller LC for controlling the temperatures of the heat treatment unit PHP, the hot plate HP, the adhesion strengthening agent application treatment unit AHL, and the cooling plate CP is disposed at the top.

  Six heat treatment units PHP are vertically stacked in the resist film heat treatment section 552 of the resist film processing block 511, and four cooling plates CP are vertically stacked in the resist film heat treatment section 553. The The resist film heat treatment units 552 and 553 are each provided with a local controller LC for controlling the temperature of the heat treatment unit PHP and the cooling plate CP at the top.

  In the development heat treatment section 554 of the development processing block 512, four hot plates HP and four cooling plates CP are stacked one above the other. The development heat treatment section 555 includes five substrate platforms PASS7 and five pieces. The heat treatment unit PHP and the cooling plate CP are stacked one above the other. Further, in the development heat treatment units 554 and 555, local controllers LC for controlling the temperatures of the heat treatment unit PHP, the hot plate HP, and the cooling plate CP are arranged at the top.

  In the interface block 513, two edge exposure apparatuses 100, a buffer unit BF, and a substrate platform PASS8 are stacked one above the other, and a fourth central robot CR4 and an interface transport mechanism IFR (not shown) are disposed. Is done.

  FIG. 8 is a side view of the substrate processing apparatus 500 of FIG. 6 viewed from the + X direction.

  A bake unit controller 530 is disposed above the indexer block 509. In the antireflection film coating processing unit 570 of the antireflection film processing block 510, three coating units BARC are stacked in a vertical direction. Three coating units RES are vertically stacked in the resist film coating processing unit 580 of the resist film processing block 511. In the development processing unit 590 of the development processing block 512, five development processing devices DEV are vertically stacked.

  As described above, the substrate processing apparatus 500 is provided with the edge exposure apparatus 100 of FIG. Thereby, particles and sublimates can be excluded from each optical system during the edge exposure processing of the substrate W in the substrate processing apparatus 500.

As described above, in the embodiment of the present invention, the edge exposure apparatus 100 corresponds to the edge exposure apparatus, the light projecting unit holding unit 20 corresponds to the substrate holding unit, the light source unit 50 and the lamp 52 correspond to the light source, The unit 50, the light guide 50t, and the light projecting unit 10 correspond to an optical system. Further, a reflector 51, a lamp 52, a light guide 50t, aperture AP and a plurality of lenses LE1, LE2, LE3, LE4 corresponds to an optical member, a semi-closed space 1P, 2P corresponds to a space in the path of light, half The closed container 57 corresponds to a first space forming member, the light shielding mask 1 corresponds to a second space forming member, and the opening at the lower end of the light shielding mask 1 and the opening 57 h of the semi-closed container 57 correspond to an opening. To do.

  Further, the gas supply pipes 58 and 60t and the gas introduction path 2 correspond to gas supply means, the light guide 50t corresponds to a light transmission member, the lenses LE1, LE2, LE3 and LE4 correspond to light condensing members, and the lens barrel 11 corresponds to a cylindrical member. The outer peripheral surface of the light shielding mask 1 corresponds to a collecting surface portion, the tapered portion of the light shielding mask 1 corresponds to a tapered portion, the reflector 51 corresponds to a condensing means, and the exposure light incident portion 50x corresponds to an end surface.

Further, the N ₂ gas corresponds to an inert gas, the substrate processing apparatus 500 corresponds to a substrate processing apparatus, and the resist film coating processing unit 580 corresponds to a coating apparatus.

  INDUSTRIAL APPLICABILITY The present invention is useful as an edge exposure apparatus that exposes a peripheral portion of a substrate while preventing adhesion of dust or deposits to a lens surface and a substrate processing apparatus including the edge exposure apparatus.

It is a schematic diagram which shows an example of the edge exposure apparatus which concerns on one embodiment of this invention. It is a figure for demonstrating the structure of the light projection part which concerns on one embodiment of this invention. It is a longitudinal cross-sectional view in the lower end part periphery of the light projection part of FIG. It is a figure for demonstrating the structure of the light source unit which concerns on one embodiment of this invention. Is a schematic diagram showing an outline of supply test to half closed space of N ₂ gas. 1 is a plan view of a substrate processing apparatus including an edge exposure apparatus 100 according to an embodiment of the present invention. It is the side view which looked at the substrate processing apparatus of Drawing 6 from the -X direction. It is the side view which looked at the substrate processing apparatus of Drawing 6 from the + X direction. It is a schematic diagram which shows the conventional general edge exposure apparatus. It is a schematic diagram which shows the conventional edge exposure apparatus which enables exclusion of a particle.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light shielding mask 1P, 2P Semi-closed space 2 Gas introduction path 10 Projection part 11 Lens tube 20 Projection part holding unit 50 Light source unit 50t Light guide 50x Exposure light incident part 51 Reflector 52 Lamp 57 Semi-closed container 57h Opening part 58 , 60t Gas supply pipe 100 Edge exposure device 500 Substrate processing device 580 Resist film coating processing section AP aperture LE1, LE2, LE3, LE4 Lens

Claims (5)

An edge exposure apparatus that exposes a peripheral portion of a substrate,
Substrate holding means for holding the substrate;
A light source that generates light;
An optical system that forms a path for guiding the light generated by the light source to the substrate held by the substrate holding means;
An optical member provided in a light path formed by the optical system;
A first space forming member surrounding the space in the light path formed by the optical system together with the optical member and having an opening through which the light passes;
Gas supply means for supplying an inert gas into the space formed by the first space forming member,
The optical system includes condensing means for condensing light generated by the light source,
The optical member has an end surface that receives the light collected by the light collecting means, and includes a light transmission member that transmits light,
The edge exposure apparatus, wherein the first space forming member surrounds a space in a path of light incident on an end surface of the light transmission member by the condensing unit together with the end surface of the light transmission member. The optical member includes a condensing member that condenses the light transmitted by the light transmitting member on a peripheral edge of the substrate held by the substrate holding means,
A second space forming member surrounding the periphery of the space in the light path from the light collecting member to the substrate together with the light collecting member;
2. The edge exposure apparatus according to claim 1, wherein the gas supply means further supplies an inert gas into a space formed by the second space forming member. The condensing member includes a cylindrical member containing a lens,
The second space forming member forms a space in the path of the light at a tip portion on the light emitting side of the cylindrical member, and so that light irradiated from the lens to the substrate passes through the opening. The edge exposure apparatus according to claim 2, wherein the edge exposure apparatus is provided. The second space forming member has a cylindrical peripheral surface portion that surrounds the periphery of the light path from the lens to the substrate, and a tapered portion that gradually decreases in diameter from an end portion of the peripheral surface portion. The edge exposure apparatus according to claim 3. A substrate processing apparatus for processing a substrate,
A coating apparatus for applying a treatment liquid to a substrate;
The substrate processing apparatus characterized by comprising an edge exposure apparatus according to any of claims 1-4 for exposing the periphery of a substrate which the treatment liquid has been applied by the coating apparatus.

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