JP4041023B2 - Wiring board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wiring board on which, for example, an electronic component can be mounted.
[0002]
[Prior art]
Conventionally, in order to prevent an excessive temperature rise due to heat generation of the electronic component mounted on the wiring pattern of the wiring layer of the wiring substrate, for example, natural convection or air cooling of the electronic component on the wiring substrate by blowing by a blower, or A method of cooling an electronic component by arranging a heat pipe, a cooling pipe, or the like in the vicinity of the wiring board has been used (for example, see Patent Document 1).
[0003]
[Patent Document 1]
JP-A-11-163565 [0004]
[Problems to be solved by the invention]
However, when the above-described blower or cooling pipe is provided, the device provided with the wiring board is increased in weight or size. In particular, when an electronic component with a high degree of integration is mounted on a wiring board, the amount of heat generation becomes large. In this case, it is necessary to provide a large blower or a cooling pipe in order to increase the cooling capacity. is there. For these reasons, it has been difficult to secure a sufficient cooling capacity for electronic components and reduce the size and weight of a device provided with a substrate on which the electronic components are mounted.
[0005]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a wiring board that can sufficiently cool a mounted component without increasing the size or weight.
[0006]
[Means for Solving the Problems]
That is, the wiring board according to the present invention is a wiring board having a wiring layer on which a wiring pattern of a mounted component is formed, and a cooling layer provided with a refrigerant pipe that absorbs heat of the component is provided in the wiring layer. And a means for connecting the refrigerant conduit formed in the component and the cooling layer conduit .
[0007]
According to such a configuration, the heat generated from the components is absorbed by the refrigerant in the pipelines provided in the cooling layer and in the pipelines inside the components, so that a blower and a cooling pipe are installed on or around the wiring board. There is no need for mounting, and the device provided with the substrate can be reduced in size and weight. Further, the distance between the component and the refrigerant can be reduced, and the cooling effect of the component can be improved as compared with the case where a blower or a cooling pipe is mounted.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)
First, a first embodiment of the present invention will be described.
FIG. 1 is a diagram showing an example of the structure of a wiring board according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view of the multilayer wiring board 1 shown in FIG. 1 taken along line AA.
[0009]
As shown in FIG. 1, in the multilayer wiring board 1, a cooling layer 3 is integrally laminated on a wiring layer 2, and a wiring layer 4 is integrally laminated on the cooling layer 3. An electronic component 19 is mounted on the upper surface 1 a of the multilayer wiring board 1. The wiring layer 2 and the wiring layer 4 are formed by laminating an insulating substrate and a wiring pattern layer. A connector 19-2 for connecting a lead wire (not shown) is mounted on the upper surface 1a of the multilayer wiring board 1.
[0010]
As shown in FIG. 2, the wiring layer 2 includes a first insulating substrate 11, a first wiring pattern layer 12, a second insulating substrate 13, a second wiring pattern layer 14, and a third insulating substrate 15. . The wiring layer 4 includes a fourth insulating substrate 17 and a third wiring pattern layer 18. The through holes for electrically connecting the wiring pattern layers 12, 14 and 18 of the multilayer wiring board 1 are not directly related to the invention of the present application, and thus are not shown and described.
[0011]
In the multilayer wiring board 1, a first wiring pattern layer 12 is stacked on a first insulating substrate 11, and a second insulating substrate 13 is stacked on the first wiring pattern layer 12, and this second insulating board 13 is stacked. A second wiring pattern layer 14 is stacked on the substrate 13, and a third insulating substrate 15 is stacked on the second wiring pattern layer 14. Then, the cooling layer 3 is laminated on the third insulating substrate 15, the fourth insulating substrate 17 is laminated on the cooling layer 3, and the third wiring pattern layer 18 is laminated on the fourth insulating substrate 17. Then, the electronic component 19 is mounted on the third wiring pattern layer 18.
[0012]
In the cooling layer 3, a pipe line 3a for allowing the refrigerant to flow is formed. The refrigerant is water, for example, and absorbs heat generated from the electronic component 19 by being introduced into the conduit 3a and circulating in the conduit 3a. The pipe line 3a can be formed, for example, by forming a groove in the cooling layer 3, and laminating the wiring layer 4 on the cooling layer 3 to close the groove.
[0013]
The pipe line 3a is formed along the flat plate direction of the cooling layer 3 as shown in FIG. Since the heat absorption effect of the electronic component 19 increases as the distance between the electronic component 19 and the refrigerant decreases, the conduit 3a is preferably formed so as to pass near the mounting location of the electronic component 19. That is, the pipe line 3 a is formed at a location where the heat generated from the electronic component 19 can be absorbed via the fourth insulating substrate 17 and the third wiring pattern layer 18. In the example shown in FIG. 2, the conduit 3 a and the electronic component 19 are opposed to each other with the fourth insulating substrate 17 and the third wiring pattern layer 18 interposed therebetween.
[0014]
As shown in FIG. 1, a circulation mechanism 20 for circulating the refrigerant in the pipe line 3 a is provided on the upper surface 1 a of the multilayer wiring board 1.
FIG. 3 is a cross-sectional view taken along the line BB passing over the circulation mechanism 20 of the multilayer wiring board 1 shown in FIG.
As shown in FIG. 3, the multilayer wiring board 1 is provided with a plurality of holes 3b and 3c in a direction perpendicular to the board surface. The holes 3b and 3c are provided continuously through the third wiring pattern layer 18 and the fourth insulating substrate 17, and one end thereof communicates with the pipe line 3a and the other end opens. Two holes are formed in the lower surface 20h of the casing 20a of the circulation mechanism 20, and refrigerant tubes 20e and 20f are attached to these holes. The circulation mechanism 20 is attached to the multilayer wiring board 1 by inserting the refrigerant tubes 20e and 20f provided in the housing 20a into the holes 3b and 3c of the multilayer wiring board 1, respectively.
[0015]
The circulation mechanism 20 is provided with an electric motor 20b, a rotating shaft 20c, and a blade-like member 20d.
The electric motor 20b is attached to the outside of the housing 20a and supports the rotary shaft 20c in a rotatable manner. The rotating shaft 20c is inserted into the housing 20a through a hole formed in the upper surface 20k of the housing 20a. A blade-like member 20d is attached to the rotary shaft 20c. A refrigerant inlet 20g is provided on the upper surface 20k of the casing 20a, and the refrigerant can be injected into the casing 20a. The refrigerant inlet 20g is provided with a lid (not shown) and can be arbitrarily opened and closed.
[0016]
The refrigerant tubes 20e and 20f provided on the lower surface 20h of the housing 20a are formed so that the outer diameters thereof are substantially the same as the inner diameters of the holes 3b and 3c so that the refrigerant does not leak. . Moreover, the electric motor 20b is connected to a power supply part via the lead wires 20i and 20j. For example, the lead wires 20 i and 20 j are electrically connected to the third wiring pattern layer 18 and are connected to the power supply unit via the third wiring pattern layer 18.
[0017]
When the refrigerant is injected into the housing 20a from the refrigerant inlet 20g, the refrigerant is introduced into the pipe line 3a through the refrigerant tubes 20e and 20f and the holes 3b and 3c. When electric power is supplied through the lead wires 20i and 20j, the electric motor 20b drives the rotary shaft 20c to rotate. Thereby, a flow is generated in the refrigerant introduced into the housing 20a by the blade-like member 20d attached to the rotating shaft 20c. Then, the refrigerant in the pipe line 3a circulates by flowing into the housing 20a from the hole 3b and out of the hole 3c, for example. The blade-like member 20d is not limited to the blade shape but may be a member having another shape as long as the refrigerant in the pipe line 3a can be circulated with the rotation of the rotation shaft 20c.
[0018]
FIG. 4 is a diagram in which the circulation mechanism 20 shown in FIG. 3 is configured by an electric motor 21 and a rotation mechanism 22.
As shown in FIG. 4, the electric motor 21 and the rotation mechanism 22 are opposed to each other through the fourth insulating substrate 17 and the third wiring pattern layer 18. In this case, the refrigerant is introduced into the pipe line 3a through a hole penetrating from the upper surface 1a of the multilayer wiring board 1 to the pipe line 3a.
[0019]
The electric motor 21 is attached to the upper surface 1 a via the attachment member 23. The electric motor 21 has a rotating shaft 21a, and a permanent magnet 24 is attached to an end 21b of the rotating shaft 21a. The permanent magnet 24 has an end 24a having an S pole and an end 24b having an N pole. The permanent magnet 24 is attached to the rotating shaft 21 a so that the end surface 24 c is parallel to the flat plate direction of the fourth insulating substrate 17.
[0020]
The rotation mechanism 22 is provided in the pipe line 3a. The rotating mechanism 22 includes a bearing base 22a, a rotating shaft 22b, a blade-like member 22c, and a permanent magnet 22d.
[0021]
The bearing base 22a is installed in the bottom part 3d of the pipe line 3a, and supports the rotating shaft 22b rotatably. A blade-like member 22c is attached to the rotating shaft 22b, and a permanent magnet 22d is attached to an end 22g of the rotating shaft 22b. The permanent magnet 22d has an end 22e having an S pole and an end 22f having an N pole. Permanent magnet 22d is the end face 22h is attached to the rotating shaft 22 b so as to be parallel to the flat direction of the fourth insulating substrate 17.
[0022]
By driving the electric motor 21, the rotary shaft 21a and the permanent magnet 24 attached thereto are rotated. Then, the permanent magnet 22d is rotated by the action of the magnetic force between the permanent magnet 24 and the permanent magnet 22d of the rotating mechanism 22, and the blade-like member 22c attached to the rotating shaft 22b is rotated by this rotation. When the refrigerant is introduced into the pipe line 3a, the refrigerant circulates in the pipe line 3a along the rotation direction of the rotary shaft 22b. Note that the blade-like member 22c is not limited to the blade-like shape and may be a member having another shape as long as it is a member that circulates the refrigerant in the pipe line 3a as the rotary shaft 22b rotates.
[0023]
Next, a modification of the mechanism shown in FIG. 4 will be described with reference to FIG.
In the modification shown in FIG. 5, instead of the electric motor 21 shown in FIG. 4, a plurality of electromagnets 25a and 25b are installed on the upper surface 1a.
[0024]
Here, the end portions 25g and 25h of the electromagnets 25a and 25b and the end portions 22e and 22f of the permanent magnet 22d of the rotating mechanism 22 are opposed to each other with the fourth insulating substrate 17 and the third wiring pattern layer 18 interposed therebetween. To form a motor. Further, the electromagnets 25a and 25b are electrically connected to the third wiring pattern layer 18 through lead wires 25c to 25f.
[0025]
When the polarities of the end portion 25g of the electromagnet 25a and the end portion 25h of the electromagnet 25b are changed at predetermined time intervals, respectively, due to the action of the magnetic force between the electromagnets 25a, 25b and the permanent magnet 22d, FIG. Similarly to the form shown, when the blade-like member 22c rotates through the rotating shaft 22b and the refrigerant is introduced into the pipe line 3a, the refrigerant passes along the rotation direction of the rotating shaft 22b. Circulate inside.
[0026]
As described above, when the cooling layer 3 provided with the pipe line 3 a is laminated as one layer of the multilayer wiring board 1, the heat generated from the electronic component 19 is transferred to the refrigerant in the pipe line 3 a via the wiring layer 4. As a result, the electronic component 19 is cooled. Therefore, compared with the case where a blower or a cooling pipe is mounted, an increase in the size and weight of the substrate can be prevented. Further, since the electronic component 19 is mounted on the wiring layer 4 laminated on the cooling layer 3, the distance between the location where the electronic component 19 is installed, that is, the heat generation location and the coolant is the thickness of the wiring layer 4. Therefore, it can be shortened as compared with the case where the blower and the cooling pipe described above are mounted. Therefore, the efficiency of absorbing heat generated from the electronic component 19 can be increased. In addition, since the coolant pipe 3a can be formed by processing the cooling layer 3, the number of mounted parts can be reduced as compared with the case where a blower or a cooling pipe is manufactured and mounted. Manufacturing cost can be reduced by mass production effect.
[0027]
(Second Embodiment)
Next, a second embodiment of the present invention will be described.
FIG. 6 is a diagram showing an example of the structure of the multilayer wiring board 1 in the second embodiment of the present invention. In the following embodiments, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals, and description thereof is omitted here.
[0028]
The heat generated from the electronic component 19 is absorbed by the refrigerant in the pipe line 3a and then released from the refrigerant to the outside through the pipe wall of the pipe line 3a and each wiring layer. In some cases, the tube wall and each wiring layer cannot be sufficiently discharged due to low thermal conductivity.
[0029]
Therefore, a heat exchanger 26 is provided in the vicinity of the pipe line 3 a of the cooling layer 3 on the upper surface 1 a of the multilayer wiring board 1. In the example shown in FIG. 6, the heat exchanger 26 is provided at a position facing a part of the pipe line 3 a with the wiring layer 4 interposed therebetween.
[0030]
The heat exchanger 26 absorbs the heat of the refrigerant flowing in the pipe line 3a of the cooling layer 3 through the wiring layer 4, and releases it to the outside by a fan (not shown) or the like. Thereby, compared with the form shown in FIG. 1, the thermal radiation efficiency of the heat | fever which a refrigerant | coolant has can be improved.
[0031]
(Third embodiment)
Next, a third embodiment of the present invention will be described.
FIG. 7 is a diagram showing an example of the structure of the multilayer wiring board 1 in the third embodiment of the present invention.
In the multilayer wiring board 1 shown in FIG. 7, the side surfaces 1 b and 1 c of the multilayer wiring board 1 are provided in contact with the heat dissipation member 27. The heat dissipating member 27 is provided with a plurality of heat dissipating plates, and absorbs and releases the heat of the refrigerant in the pipe line 3a. Thereby, compared with the form shown in FIG. 1, the thermal radiation efficiency of the heat | fever which a refrigerant | coolant has can be improved.
[0032]
(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described.
FIG. 8 is a diagram showing an example of the structure of the multilayer wiring board 1 in the fourth embodiment of the present invention. FIG. 9 is a cross-sectional view of the multilayer wiring board 1 shown in FIG. 8 cut along the line CC.
As shown in FIG. 9, in addition to the pipe line formed along the flat plate direction of the cooling layer 3, the pipe line 3 a communicates with this pipe line and extends along the direction perpendicular to the flat plate direction of the cooling layer 3. 4 insulatively connected to the insulating substrate 17 and the third wiring pattern layer 18. One end of the continuous line is an opening 3e. In the example shown in FIG. 8, the opening 3 e of the conduit 3 a is provided on the side surface 1 b side and the side surface 1 c side of the multilayer wiring board 1.
[0033]
And as shown in FIG. 8, fluid connectors 28a and 28b are provided in the location where the opening part 3e of the pipe line 3a is formed in the upper surface 1a. The fluid connectors 28a and 28b connect the pipe line 3a and an external pipe line, and allow the refrigerant to flow in and out between the pipe line 3a and the external pipe line.
[0034]
Pipes 29a and 29b, which are external pipe lines, are connected to the fluid connectors 28a and 28b, and a refrigerant supply device (not shown) is connected to the pipes 29a and 29b.
[0035]
Further, the refrigerant supply device includes a refrigerant circulation mechanism. By this circulation mechanism, the refrigerant is introduced into the pipe line 3a from the fluid connector 28a side through the pipe 29a, and flows out from the fluid connector 28b side to be returned to the above-described refrigerant supply device through the pipe 29b, and this cycle is repeated. . The refrigerant supply device includes a mechanism that absorbs the heat of the electronic component 19 and releases the heat of the circulated refrigerant to the outside.
[0036]
(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described.
FIG. 10 is a diagram showing an example of the structure of the multilayer wiring board 1 in the fifth embodiment of the present invention.
In this embodiment, in the cooling layer 3, it has the structure which replaced with the pipe line 3a shown in FIG. In the example shown in FIG. 10, the heat pipe 30 is embedded in the cooling layer 3. The heat pipe 30 is provided such that its end 30 a is positioned in the vicinity of the electronic component 19 and its end 30 b is spaced from the electronic component 19.
[0037]
The heat pipe 30 is evacuated and filled with a small amount of coolant such as water. The refrigerant in the vicinity of the end 30 a in the heat pipe 30 is vaporized when it absorbs the heat of the electronic component 19 through the tube wall of the heat pipe 30, and moves in the direction of the end 30 b due to the pressure difference in the heat pipe 30. The refrigerant that has moved in the direction of the end 30b releases heat and liquefies. Then, the refrigerant returns to the end 30 a of the heat pipe 30. The released heat is released to the outside through the tube wall and each wiring layer. By repeating this cycle, the heat of the electronic component 19 can always be absorbed and released.
[0038]
In this way, if the heat pipe 30 is provided in the cooling layer 3, it is not necessary to mount a refrigerant circulation mechanism and a cooling mechanism, as compared with the case where the refrigerant pipe line 3a is formed.
[0039]
(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described.
FIG. 11 is a diagram showing an example of the structure of the multilayer wiring board 1 in the sixth embodiment of the present invention.
In the sixth embodiment, a refrigerant conduit is provided inside the electronic component, and this is mounted on the upper surface 1 a of the multilayer wiring board 1. As shown in FIG. 11, the electronic component 31 is provided with a refrigerant pipe 31 a therein. The pipe line 31 a communicates with the refrigerant pipes 31 b and 31 c provided so as to protrude from the lower part of the electronic component 31.
[0040]
By mounting the electronic component 31 on the multilayer wiring board 1, the refrigerant tubes 31 b and 31 c are inserted into the holes 3 f and 3 g communicating with the conduit 3 a of the cooling layer 3 and communicated with the conduit 31 a of the electronic component 31. The The holes 3 f and 3 g are continuously drilled in the third wiring pattern layer 18 and the fourth insulating substrate 17 along a direction perpendicular to the flat plate direction of the cooling layer 3. The refrigerant tubes 31b and 31c are formed so that their outer diameters are substantially the same as the diameters of the holes 3f and 3g, so that the refrigerant does not leak.
[0041]
Also in the sixth embodiment, when the refrigerant is circulated through the pipe line 3a of the cooling layer 3 by the above-described circulation mechanism 20 or the like, the refrigerant also circulates through the pipe line 31a of the electronic component 31. Then, the heat generated from the inside of the electronic component 31 is absorbed by the refrigerant in the pipe line 31a and is moved to the pipe line 3a through the refrigerant pipes 31b and 31c and the holes 3f and 3g. Thereby, the heat of the electronic component 31 can be absorbed and released. With such a structure, the heat generated from the electronic component 31 can be directly absorbed by the refrigerant from the inside of the component, so that the heat dissipation effect of the electronic component is further improved as compared with the multilayer wiring board 1 shown in FIG. Can be improved.
[0042]
Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine suitably the component covering different embodiment.
[0043]
【The invention's effect】
As described above, according to the present invention, the heat generated from the electronic component is absorbed by the coolant circulating in the cooling layer and the pipe line provided in the component , so that a large cooling device is mounted. The electronic component can be sufficiently cooled.
[Brief description of the drawings]
FIG. 1 is a view showing an example of the structure of a multilayer wiring board according to a first embodiment of the present invention.
2 is a cross-sectional view when the multilayer wiring board shown in FIG. 1 is cut along the line AA. FIG.
3 is a cross-sectional view when the multilayer wiring board shown in FIG. 1 is cut along the line BB. FIG.
4 is a diagram in which the circulation mechanism shown in FIG. 3 is configured by an electric motor and a rotation mechanism.
FIG. 5 shows a modification of the circulation mechanism shown in FIG.
FIG. 6 is a view showing an example of the structure of a multilayer wiring board according to a second embodiment of the present invention.
FIG. 7 is a view showing an example of the structure of a multilayer wiring board according to a third embodiment of the present invention.
FIG. 8 is a view showing an example of the structure of a multilayer wiring board according to a fourth embodiment of the present invention.
9 is a cross-sectional view of the multilayer wiring board shown in FIG. 8 taken along the line CC.
FIG. 10 is a view showing an example of the structure of a multilayer wiring board according to a fifth embodiment of the present invention.
FIG. 11 is a view showing an example of the structure of a multilayer wiring board according to a sixth embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Multilayer wiring board, 1a ... Upper surface, 1b, 1c ... Side surface, 2 ... Wiring layer, 3 ... Cooling layer, 3a ... Pipe line, 3b, 3c ... Hole, 3d ... Bottom surface, 3e ... Opening, 3f, 3g ... Hole 4, wiring layer 11, first insulating substrate 12, first wiring pattern layer 13, second insulating substrate 14, second wiring pattern layer 15, third insulating substrate 17 ... 4th insulating substrate, 18 ... 3rd wiring pattern layer, 19 ... Electronic component, 19-2 ... Connector, 20 ... Circulation mechanism, 20a ... Housing, 20b ... Electric motor, 20c ... Rotating shaft, 20d ... Blade shape 20e ... refrigerant inlet, 20h ... bottom surface, 20i, 20j ... lead wire, 20k ... top surface, 21 ... electric motor, 21a ... rotating shaft, 21b ... end, 22 ... rotating mechanism, 22a ... Bearing base, 22b ... Rotary shaft, 22c ... Bane-like member, 22d ... Permanent Magnet, 22e, 22f ... end, 23 ... mounting member, 24 ... permanent magnet, 24a, 24b ... end, 25a, 25b ... electromagnet, 25c-25f ... lead wire, 26 ... heat exchanger, 27 ... heat dissipation member, 28a, 28b ... fluid connector, 29a, 29b ... piping, 30 ... heat pipe, 30a, 30b ... end of heat pipe, 31 ... electronic component, 31a ... pipe, 31b, 31c ... refrigerant pipe.

Claims (7)

A wiring board having a wiring layer on which a wiring pattern of a mounted component is formed,
A cooling layer provided with a refrigerant pipe that absorbs heat of the component is provided integrally with the wiring layer, and the refrigerant pipe formed inside the component is connected to the cooling layer pipe. wiring board, wherein a provided.   The wiring board according to claim 1, further comprising a circulation mechanism that circulates the refrigerant in the pipe line.   The wiring board according to claim 1, wherein a heat exchanger that absorbs heat of the refrigerant is provided in the vicinity of the pipe line.   The wiring board according to claim 1, wherein a member that absorbs heat of the refrigerant is attached in the vicinity of the pipe line.   2. The wiring board according to claim 1, further comprising means for connecting an external pipe line and the cooling layer pipe line. The circulation mechanism is
A first mechanism that is provided in the conduit and causes the refrigerant to flow;
The wiring board according to claim 2, further comprising a second mechanism that is provided outside the conduit and drives the first mechanism. The first mechanism is a rotating mechanism in which a blade-like member is attached to a rotating shaft,
The wiring board according to claim 6, wherein the second mechanism rotates a rotating shaft of the rotating mechanism by the action of a magnetic force.

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