JP4006434B2 - Semiconductor package inspection system and program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor package inspecting system and a program thereof which enable an operator to grasp the actual state of a semiconductor package three-dimensionally in detail, and to reflect the inspection result effectively on design data. <P>SOLUTION: The semiconductor package inspecting system 10 is composed of two or more X-ray photograph data 71 obtained through a process of photographing the semiconductor package with an X-ray photography device 70 or a camera photography device 75 before or after the semiconductor package is sealed up, or a three-dimensionally measured shape data forming/processing means 64 of forming three-dimensional shape data by the use of camera photography data 76; a measured gap calculating/processing means 65 of calculating a three-dimensional gap between the wires etc of the semiconductor package before or after it is sealed up, using the three-dimensionally measured shape data; and a measured gap display/processing means 66 of displaying the calculation/processing result of the measured gap on a screen. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

  The present invention relates to a semiconductor package inspection system and program for inspecting a semiconductor package after resin sealing or before resin sealing, for example, a semiconductor package by a collaborative operation via a network by a plurality of workers at remote locations. This can be used when performing a series of processes related to the inspection.

  In general, in the manufacture of semiconductor packages, a first bonding pad (First bonding pad) provided on a die (Die: synonymous with a chip, hereinafter also referred to as a chip) stacked on a substrate, and the substrate After being connected to a second bonding pad (Bondwire; hereinafter simply referred to as a wire), the resin sealing is performed. At this time, the wire is stretched between the pads in an arrangement and shape according to the design rules based on the three-dimensional design data. However, when resin sealing is performed, the wire is usually deformed by the inflow of resin, and the resin sealing The shape is different from the previous state.

  For this reason, since the prototype of the actually manufactured semiconductor package is not according to the three-dimensional design data, it is inspected whether or not the prototype can operate normally. As a result of the inspection, when a defect such as a gap between the wires being too narrow is found, it is necessary to review the design.

  As a semiconductor model display device, there is a device that displays a cross-sectional shape of a two-dimensional model and a three-dimensional image of a three-dimensional model on a display screen for each process of a semiconductor manufacturing process (see Patent Document 1). In this semiconductor model display device, the mask image used in the manufacturing process and the three-dimensional semiconductor model in the manufacturing process predicted at the time of design are simultaneously displayed on the screen, or in the manufacturing process predicted at the time of design. A two-dimensional semiconductor model and a photographic image of an electron microscope can be displayed simultaneously.

  Although not intended for semiconductors, as a shape model creation device for creating a CAD model of a prototype, the prototype was scanned with a CT scanner, and an actual CAD model was generated from a group of tomographic images obtained as a result. Subsequently, there is an apparatus that aligns the actual CAD model and the reference CAD model, and supplements the missing part of the actual CAD model due to partial image omission in the CT tomographic image with the shape information of the corresponding part of the reference CAD model. (See Patent Document 2). In this shape model creation device, even if the prototype shape is deviated from the reference CAD model as a result of the operator reworking the prototype created based on the reference CAD model as needed, the shape of the prototype It is possible to create a real CAD model faithful to the above.

  Furthermore, as a semiconductor inspection method, the normality of metal wiring, etc. can be confirmed in a short period of time by comparing and collating the read pattern of the element or wiring formed on the semiconductor substrate with the expected value pattern created in advance. In addition, there has been proposed a method for easily and accurately finding an abnormality such as a disconnection that has occurred in these metal wirings, a short circuit due to foreign matter, and the like (see Patent Document 3).

  As a three-dimensional image photographing device for photographing a semiconductor chip, a light emitting element and a light receiving element are formed adjacent to each other on the semiconductor chip, and a light projection pattern for measuring a three-dimensional shape is projected by the light emitting element on the semiconductor chip. There is an apparatus for imaging the same pattern on the same optical axis by a light receiving element on this chip (see Patent Document 4).

  Although not intended for semiconductors, there is an apparatus that creates a 3D model from a plurality of images taken from different angles as a 3D model creation apparatus (see Patent Document 5).

Japanese Patent Laid-Open No. 11-162802 (Claims 1, 3 and Abstract) JP 2003-196326 A (Claim 1, Summary) Japanese Patent Laid-Open No. 06-268036 (Claim 1, Summary) JP 2002-218505 A (summary) JP 2004-157968 (Abstract)

  As described above, the wire is deformed by the inflow of the resin, and the wire shape after the resin sealing becomes different from the state before the resin sealing, so that the prototype semiconductor package is inspected. However, since the wire shape of the semiconductor package after resin sealing cannot be confirmed directly visually, in order to grasp the state inside the package, an X-ray photograph is taken and the wire taken in the X-ray photograph is taken. The shape has to be confirmed, and conventionally, such confirmation work has been performed two-dimensionally and visually. Therefore, it is possible to grasp the wire shape of the prototype semiconductor package in detail three-dimensionally, to grasp the gap between wires numerically and accurately, or to compare and verify the prototype shape and the design shape. It was difficult to do. In addition, because of the difficulty of grasping the internal state of the semiconductor package after resin sealing in detail and the difficulty of comparison with the design data, the inspection result is effectively reflected in the design data. The current situation was that it was not possible to build a mechanism.

  In addition, inspection of semiconductor packages usually involves multiple workers such as sales representatives, designers, analysts, and process engineers, who are often in remote locations. However, this has increased the time required for the inspection of the semiconductor package, and also hindered a plurality of workers from exchanging information and opinions, etc., to improve design in cooperation.

  For this reason, an inspection system capable of grasping the internal state of the semiconductor package after resin sealing in a short time and in detail and effectively reflecting the inspection result in the design data is desired.

  Furthermore, the wire shape of the prototype semiconductor package is usually different from the design shape not only after resin sealing but also before resin sealing. Also, it is necessary to inspect and confirm the gap between the wires, etc., and to compare with the design shape. Therefore, in the case of a semiconductor package before resin sealing, an inspection system that can grasp the state in detail in a short time and can effectively reflect the inspection result in design data is desired.

  In the semiconductor model display device described in Patent Document 1, the cross-sectional shape of the two-dimensional model and the stereoscopic image of the three-dimensional model can be displayed on the display screen for each step of the semiconductor manufacturing process. For a real semiconductor, it is only possible to perform a two-dimensional comparison with a two-dimensional semiconductor model in a manufacturing process predicted at the time of design, using a photographic image of an electron microscope.

  Further, in the shape model creation apparatus described in Patent Document 2, a measured CAD model is generated from a tomographic image group obtained by scanning with a CT scanner, and a missing portion of the measured CAD model is used as a shape of a corresponding portion of the reference CAD model. Although it is supplemented with information, a comparison display of the difference between the actual CAD model and the reference CAD model is not performed.

  Further, in the semiconductor inspection method described in Patent Document 3, a comparison check is performed between a read pattern of an element or wiring formed on a semiconductor substrate and an expected value pattern created in advance. We do not perform comparative comparison.

  The three-dimensional image capturing device described in Patent Document 4 and the three-dimensional model creation device described in Patent Document 5 can capture the actual object three-dimensionally, but perform comparison and collation with design data. It is not possible.

  An object of the present invention is to provide a semiconductor package inspection system and program capable of grasping the actual state of a semiconductor package in detail three-dimensionally and effectively reflecting the inspection result in design data. By the way.

  The semiconductor package inspection system of the present invention creates three-dimensional measured shape data after resin sealing using a plurality of X-ray photograph data obtained by photographing the semiconductor package after resin sealing with an X-ray imaging apparatus. At least one of the processing to create or the three-dimensional measured shape data before resin sealing using a plurality of camera photo data obtained by photographing a semiconductor package before resin sealing with a camera photographing device 3D measured shape data creation processing means for processing, and after resin sealing or resin using 3D measured shape data after resin sealing or before resin sealing created by the 3D measured shape data creation processing means Measured gap calculation processing means for performing a process of calculating a three-dimensional gap between objects corresponding to components including wires of the semiconductor package before sealing, and this measured gap calculation process It is characterized in that a measured clearance display processing means for performing processing for displaying the calculation result of the stages on the display screen.

  Here, the “X-ray photograph data” may be digital X-ray photograph data output directly from a digital X-ray photographing apparatus, or an X-ray photograph obtained by digitizing a film photographed by the X-ray photographing apparatus. Data may be used. Similarly, the “camera photo data” may be digital camera photo data output directly from a digital camera photographing device, or camera photo data obtained by digitizing a film photographed by the camera photographing device.

  In the present invention, three-dimensional measured shape data is created using a plurality of X-ray photograph data or a plurality of camera photograph data, and a three-dimensional gap between objects is calculated based on the three-dimensional measured shape data. Since it is displayed on the screen, an operator engaged in the inspection of the semiconductor package can grasp in detail three-dimensionally the state of the semiconductor package after resin sealing or before resin sealing, such as a gap between wires. The detailed information obtained three-dimensionally can be effectively reflected in the design data, thereby achieving the object.

  Further, the semiconductor package inspection system of the present invention is a resin using a plurality of X-ray photograph data obtained by photographing a semiconductor package after resin sealing created based on three-dimensional design data with an X-ray imaging apparatus. Using a plurality of camera photograph data obtained by photographing a semiconductor package before resin sealing created based on processing for creating three-dimensional actually measured shape data after sealing or three-dimensional design data with a camera photographing device Created by 3D measured shape data creation processing means for performing at least one of the processes for creating 3D measured shape data before resin sealing, 3D design data, and 3D measured shape data creation processing means Using the three-dimensional measured shape data after resin sealing or before resin sealing, the design shape of the semiconductor package and the measured shape after resin sealing or before resin sealing are displayed. It is characterized in that a superimposed display processing means for performing processing to display superimposed on the ray screen.

  In the present invention as described above, three-dimensional actually measured shape data is created using a plurality of X-ray photograph data or a plurality of camera photograph data, and using this three-dimensional actually measured shape data and three-dimensional design data, Since the superimposed display with the actually measured shape is performed, it becomes possible for an operator involved in the inspection of the semiconductor package to grasp the difference between the design shape and the actually measured shape in detail three-dimensionally, and the three-dimensional result can be obtained. The detailed information can be effectively reflected in the design data, thereby achieving the object.

  Then, the above-described invention for displaying the three-dimensional gap on the screen may be combined with the invention for displaying the design shape and the measured shape in a superimposed manner. That is, in the case where the above-described three-dimensional gap is displayed on the screen, the three-dimensional measured shape data of the three-dimensional design data and the semiconductor package after or before resin sealing created based on the three-dimensional design data. Using the three-dimensional measured shape data after resin sealing or before resin sealing created by the creation processing means, the design shape of the semiconductor package and the measured shape after resin sealing or before resin sealing are displayed on the display screen. It is good also as a structure provided with the superimposition display process means which performs the process superimposed and displayed on.

  Thus, in the case of a configuration in which the invention for displaying the three-dimensional gap on the screen and the invention for superimposing the design shape and the actual measurement shape are combined, an operator engaged in the inspection of the semiconductor package must Alternatively, it becomes possible to grasp the state of the semiconductor package before resin sealing, for example, the gap between the wires in three dimensions in detail, and to grasp the difference between the design shape and the measured shape in detail in three dimensions. Therefore, the detailed information obtained three-dimensionally can be more effectively reflected in the design data.

  Further, in the semiconductor package inspection system described above, the three-dimensional measured shape data creation processing means is an X-ray imaging apparatus configured to image a semiconductor package after resin sealing from a plurality of directions in a plurality of directions. A process for creating three-dimensional actually measured shape data after resin sealing using a plurality of X-ray photograph data obtained from the above, or a configuration capable of photographing a semiconductor package before resin sealing from a plurality of directions. It is desirable that a process for creating three-dimensional measured shape data before resin sealing is performed using a plurality of camera photograph data obtained by photographing from a plurality of directions with a camera photographing apparatus.

  When using a plurality of tomographic images in the case where the three-dimensional measured shape data is created using a plurality of X-ray photograph data or a plurality of camera photograph data obtained by photographing from a plurality of directions as described above. Compared to the above, it is possible to easily create the three-dimensional measured shape data with less data.

  Further, in the case where the configuration is such that three-dimensional measured shape data is created using a plurality of X-ray photograph data or a plurality of camera photograph data obtained by photographing from a plurality of directions described above, three-dimensional measured shape data creation processing The means displays the upper surface photograph including the wire on the display screen by using the upper surface photograph data obtained by photographing at least a part of the semiconductor package after the resin sealing or before the resin sealing from the upper side. Using top-surface trace reception processing means for processing to accept input operations for tracing on the screen, and tilted photographic data obtained by photographing at least a part of the semiconductor package after resin sealing or before resin sealing from an oblique direction Tilt tray that performs processing to accept input operations to display a tilt photo including the wire on the display screen and trace the wire on the screen Synthesis processing for synthesizing the upper surface trace data obtained by the trace operation received by the upper surface trace acceptance processing means and the inclined trace data obtained by the trace operation accepted by the inclined trace acceptance processing means The tilt photograph data obtained by photographing from an oblique direction is orthogonal to the straight line between the bonding positions connecting the first bonding position where one end of the wire is bonded and the second bonding position where the other end is bonded. Alternatively, it is tilted photographic data obtained by photographing a line that is substantially perpendicular or a right angle or a substantially right angle and that forms an acute angle with a surface that includes the wire and the straight line between bonding positions as a center line of view angle. It is desirable.

  Here, the “upper surface photographic data obtained by photographing at least a part of the semiconductor package from above” may be upper surface photographic data obtained by photographing the entire upper surface of the semiconductor package at once, or a plurality of upper surfaces of the semiconductor package. That is, the upper surface photograph data may be divided and taken. However, from the viewpoint of simplifying the photographing operation, it is preferable to use the upper surface photograph data obtained by photographing the entire upper surface at once.

  In addition, “tilt photo data obtained by photographing at least a part of a semiconductor package from an oblique direction” may be tilt photo data obtained by photographing the whole semiconductor package at a time, and a part of the semiconductor package was photographed. Inclined photograph data may be used. In short, three-dimensional measurement is performed according to the position and size of the portion including the wire to be inspected, or the wire placement status such as the orientation and spacing of the wire to be inspected. What is necessary is just to photograph an appropriate number of images with an appropriate size so that the shape data can be created with high accuracy.

  In this way, when the three-dimensional measured shape data is created by tracing the wire of the upper surface photograph and the wire of the inclined photograph, the X, Y coordinate values (wire plane (Position information) can be obtained, and the Z coordinate value (wire height information) can be obtained by tracing the wire of the inclined photograph. At this time, it is common for a plurality of wires having the same wire shape to be arranged in the vicinity, but when these wires are viewed from the side, the wires naturally appear to overlap each other. Each wire overlaps on the photograph even if it is taken from the photo, and even if the contrast of the image of the photograph is adjusted, each wire cannot be distinguished, and each wire cannot be traced. Even if they do not overlap or partly overlap, it is possible to discriminate each wire by adjusting the contrast of the image (in the case of X-ray imaging, this can be done by using an X-ray detector with good resolution). So it can be traced. Therefore, it is possible to trace a photograph taken in an appropriate state, that is, a photograph taken by a method suitable for photographing a wire in accordance with the arrangement state of the wires in the semiconductor package, so that the three-dimensional measured shape data can be efficiently used. Can be created.

  Further, in the case where the above-described design shape and the actually measured shape are superimposed and displayed, a plurality of operators including a process engineer, an analyst, and a designer who are involved in the design and inspection of the semiconductor package respectively operate. Terminal devices, and a management server that is connected to these terminal devices via a network and manages information related to the inspection of the semiconductor package, and the terminal device is a part of dialog or image sharing among a plurality of workers. In order to realize collaborative work by at least one of the above, a process of receiving an input operation by an operator and transmitting the operation information to the management server is performed, and the shared information distributed from the management server is received and the shared information is received. Terminal-side collaboration processing means that performs display processing on the display screen for presenting to the worker, and management And a data transmission / reception processing means for performing data transmission / reception processing on the design and inspection of the semiconductor package with the server, and the management server A server-side collaboration processing means for performing processing for receiving operation information transmitted from the terminal device, and processing for distributing shared information to other terminal devices or all terminal devices based on the operation information, and a terminal Receives data related to the design and inspection of the semiconductor package transmitted from the apparatus via the network, performs registration processing of this data, searches the corresponding data in response to a request from the terminal apparatus, and transmits the data to the terminal apparatus. Data management processing means for performing processing to be transmitted via the device, and three-dimensional design data of the semiconductor package 3D design data storage means for storing, 3D measured shape data storage means for storing 3D measured shape data after resin sealing or before resin sealing created by the 3D measured shape data creation processing means, and a semiconductor It is configured to include superimposed display data storage means for storing superimposed display data for displaying the package design shape and the actually measured shape after resin sealing or before resin sealing superimposed on the display screen, The data management processing means receives the three-dimensional measured shape data after resin sealing or before resin sealing transmitted from the terminal device operated by the process engineer via the network, and receives the received three-dimensional measured shape data. The process of registering in the three-dimensional measured shape data storage means and the superimposed display data transmitted from the terminal device operated by the process engineer via the network 3D actual measurement data is received from the 3D actual measurement shape data storage means in response to a request from the terminal device operated by the analyst. Processing for searching for shape data, transmitting the searched three-dimensional measured shape data to a terminal device operated by an analyst via a network, and data storage means for superimposed display in response to a request from the terminal device operated by a designer From the terminal device operated by the designer through the network, and the processing for transmitting the superimposed display data from the terminal device operated by the designer to the terminal device operated by the designer. Receiving the corrected 3D design data and registering the received corrected 3D design data in the 3D design data storage means It is desirable to have been.

  Here, the “corrected three-dimensional design data” may be registered in the form of being overwritten on the three-dimensional design data before correction already stored in the three-dimensional design data storage means, or newly added. May be registered.

  In this way, multiple workers including process engineers, analysts, and designers who are involved in semiconductor package design and inspection work closely together in a configuration that enables collaborative work via a network. In addition, it is possible to proceed with each process related to the inspection of semiconductor packages in a short time, and the data obtained in each process related to the inspection is managed by the management server via the network. Is reflected more easily and reliably.

  Further, in the case where it is configured to be able to perform collaborative work via a network as described above, the plurality of terminal devices include terminal devices operated by sales representatives, and the data management processing means In response to a request from the terminal device operated by the person in charge, the corresponding superimposed display data is retrieved from the superimposed display data storage means, and the retrieved superimposed display data is sent to the terminal device operated by the sales person via the network. It is desirable that the transmission process is also performed.

  In this way, when it is configured to be able to perform collaborative work including the sales staff, the sales staff must present the semiconductor package inspection results to the customer in a short time using the terminal device. Is possible.

  Furthermore, in the case where it is configured to be able to perform collaborative work via the network as described above, the plurality of terminal devices include a terminal device operated by a manager that comprehensively manages the inspection process of the semiconductor package, The management server includes a process table storage unit that stores a process table for inputting a progress status of each process of the inspection of the semiconductor package, and the data management processing unit stores the process table according to a request from the terminal device operated by the manager. The process table screen display data stored in the means is transmitted to the terminal device operated by the manager via the network, and the progress input by the manager and transmitted from the terminal device operated by the manager via the network It is desirable to receive data indicating the situation and to update the process chart.

  In this way, when it is configured to be able to perform collaborative work including the manager, each work performed by a plurality of workers is managed by the manager so that the cooperation between the workers is smoothly performed. Thus, the work efficiency of the collaborative work is improved.

  The program of the present invention is a process for creating three-dimensional actually measured shape data after resin sealing using a plurality of X-ray photograph data obtained by imaging a semiconductor package after resin sealing with an X-ray imaging apparatus. Or at least one of the processes of creating three-dimensional measured shape data before resin sealing using a plurality of camera photograph data obtained by photographing a semiconductor package before resin sealing with a camera photographing device Three-dimensional measured shape data creation processing means to be performed, and resin sealing or resin sealing using the three-dimensional measured shape data created by the three-dimensional measured shape data creation processing means after or before resin sealing Actual measurement gap calculation processing means for performing processing for calculating a three-dimensional gap between objects corresponding to components including wires of the previous semiconductor package, and calculation by the actual measurement gap calculation processing means The physical results as an inspection system for a semiconductor package, characterized in that a measured clearance display processing means for performing processing for displaying on a display screen, is for causing a computer to function.

  The above-mentioned program or a part thereof is, for example, a magneto-optical disk (MO), a read-only memory (CD-ROM) using a compact disk (CD), a CD recordable (CD-R), a CD rewritable (CD -RW), read-only memory (DVD-ROM) using digital versatile disk (DVD), random access memory (DVD-RAM) using DVD, flexible disk (FD), magnetic tape, hard disk, It can be recorded on storage media such as read-only memory (ROM), electrically erasable and rewritable read-only memory (EEPROM), flash memory, and random access memory (RAM) for storage and distribution. And, for example, a local area network (LA ), A metropolitan area network (MAN), a wide area network (WAN), a wired network such as the Internet, an intranet, or an extranet, or a wireless communication network, or a combination thereof. It is also possible to carry it on a carrier wave. Furthermore, the above program may be a part of another program, or may be recorded on a recording medium together with a separate program.

  As described above, according to the present invention, three-dimensional measured shape data is created using a plurality of X-ray photograph data or a plurality of camera photograph data, and a three-dimensional gap between objects based on the three-dimensional measured shape data. Is calculated and displayed on the screen, so that the state of the semiconductor package after resin sealing or before resin sealing, such as the gap between wires, can be grasped in three dimensions in detail, or three-dimensional design data and Since the design shape and the actual measurement shape are superimposed using the three-dimensional actual measurement shape data, the difference between the design shape and the actual measurement shape can be grasped in three dimensions in detail. There is an effect that it can be reflected effectively.

  An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an overall configuration of a semiconductor package inspection system 10 according to the present embodiment. 2 to 6 show a flow chart of the semiconductor package inspection work. FIG. 7 is an explanatory diagram of an imaging situation by the X-ray imaging apparatus 70, and FIG. 8 is an explanatory diagram of an imaging direction of an inclined X-ray photograph. FIG. 9 shows an example of a process chart. Further, FIG. 10 is a perspective view showing a part of a prototype real semiconductor package 120, FIG. 11 is an explanatory view of the trace operation of the top surface X-ray photographic wire, and FIG. 12 is a tilted X-ray photograph. It is explanatory drawing of the trace operation | work of a wire. FIG. 13 shows an example of a parameter input screen 170 for automatically generating three-dimensional data. 14 to 17 are explanatory diagrams of wire data synthesis processing. FIG. 18 shows an example of a three-dimensional design rule check result, and FIG. 19 shows an example of a defective part list display screen 250 and a three-dimensional graphics display of a minimum gap portion between wires. 20 shows an example of a three-dimensional design rule check result display screen 270 and a three-dimensional graphics display of the minimum gap portion between the wire and the die. FIG. 21 shows the design shape of the semiconductor package. An example of a three-dimensional superimposed display with the measured shape is shown.

  In FIG. 1, a semiconductor package inspection system 10 includes a terminal device 20 for a salesperson operated by a salesperson of a semiconductor package maker corresponding to a semiconductor maker that is a customer, and a semiconductor that comprehensively manages the inspection process of the semiconductor package. A terminal device 30 for a manager operated by a manager of the package manufacturer, a terminal device 40 for a designer operated by a semiconductor package manufacturer or a designer of the semiconductor manufacturer (for example, assuming that the designer is located in a design department in the United States), A terminal device 50 for an analyst operated by an analyst of a semiconductor package manufacturer (for example, assumed to be in an analysis department in Japan) and a process engineer of a semiconductor package manufacturer (for example, located in a semiconductor package manufacturing factory in Taiwan) The terminal device 60 for the process engineer operated by the A management server 80 that manages information about the examination of the body package is configured by connecting a network 1. The inspection system 10 also includes an X-ray imaging apparatus 70 and a camera imaging apparatus 75.

  The network 1 includes various forms such as, for example, the Internet, an intranet, an extranet, a LAN, a MAN, a WAN, or a combination of these, and is wired or wireless, or a mixture of wired and wireless Regardless of whether it is a type, in short, it may be anything that can transmit information at a certain speed between a plurality of points (regardless of the length of distance).

  Each terminal device 20, 30, 40, 50, 60 is constituted by, for example, a computer or the like, and includes input means such as a keyboard and a mouse and a display device such as a liquid crystal display and a CRT display. Each terminal device 20, 30, 40, 50, 60 may be, for example, a mobile phone (including PHS), a personal digital assistant (PDA), or the like.

  Each terminal device 20, 30, 40, 50, 60 includes terminal side collaboration processing means 21, 31, 41, 51, 61 and data transmission / reception processing means 22, 32, 42, 52, 62, respectively. ing.

  The terminal-side collaboration processing means 21, 31, 41, 51, 61 accepts an input operation by a worker and realizes this operation information in a management server in order to realize a collaborative work by dialogue and image sharing among a plurality of workers. In addition to performing processing to transmit to 80, the shared information distributed from the management server 80 is received, and display processing on the display screen for presenting the shared information to the operator is performed.

  Data transmission / reception processing means 22, 32, 42, 52, 62 perform data transmission / reception processing with respect to the design and inspection of the semiconductor package with the management server 80.

  Further, the terminal device 20 for a sales staff is provided with a document creation processing means 23 for performing processing for creating various documents to be submitted to a customer such as a prototype semiconductor package inspection report and a design improvement proposal.

  The terminal device 40 for the designer includes a design processing means 43 that performs processing for supporting a semiconductor package design work by the designer (including a design review work after the inspection), and a process engineer to be described later. Superimposed display processing means 47 that performs processing similar to the superimposed display processing means 67 of the terminal device 60 is provided.

  The design processing means 43 is realized by a CAD (Computer Aided Design) system, and includes a three-dimensional design data creation processing means 44, a design gap calculation processing means 45, and a design gap display processing means 46. The design processing unit 43 may be provided in a device physically different from the terminal side collaboration processing unit 41 and the data transmission / reception processing unit 42 (may be a stand-alone computer), but is the same from the viewpoint of improving work efficiency. It is preferable that it is provided in the apparatus.

  The three-dimensional design data creation processing means 44 is for the designer to create the three-dimensional design data of the semiconductor package as three-dimensional CAD data.

  The design gap calculation processing means 45 uses the 3D design data created by the 3D design data creation processing means 44 to create a 3D gap between objects corresponding to the components including the wires for the designed semiconductor package. The calculation process is performed. The components of the semiconductor package are, for example, wires, dies, substrates, and the like, and the objects corresponding to these components are data obtained by converting each component into data by three-dimensional CAD, and the three-dimensional between the objects. Examples of the gap include a gap between wires and a gap between wires and a die. The algorithm of this design gap calculation process is the same as that of the measured gap calculation processing means 65 described later.

  The design gap display processing means 46 performs processing for displaying the calculation processing result by the design gap calculation processing means 45 on the display screen. The display form by this design gap display processing is the same as that of the measured gap display processing means 66 described later.

  Moreover, the terminal device 50 for analysts is provided with an analysis processing means 53 that performs mechanical analysis and electrical analysis on a prototype semiconductor package using the three-dimensional measured shape data. For example, electrical analysis can be realized by commercially available analysis software such as MW-Studio. The analysis processing unit 53 may be provided in a device physically different from the terminal side collaboration processing unit 51 and the data transmission / reception processing unit 52 (may be a stand-alone computer), but is the same from the viewpoint of improving work efficiency. It is preferable that it is provided in the apparatus.

  Further, the terminal device 60 for the process engineer includes an inspection processing unit 63 that performs processing for inspecting the prototyped semiconductor package. This inspection processing means 63 includes a three-dimensional measured shape data creation processing means 64, an actual measurement gap calculation processing means 65, an actual measurement gap display processing means 66, a superimposed display processing means 67, a design gap calculation processing means 68, a design. And a gap display processing unit 69. The inspection processing unit 63 may be provided in a device (may be a stand-alone computer) physically different from the terminal-side collaboration processing unit 61 and the data transmission / reception processing unit 62, but is the same from the viewpoint of improving work efficiency. It is preferable that it is provided in the apparatus.

  The three-dimensional actually measured shape data creation processing means 64 uses a plurality of X-ray photograph data 71 obtained by photographing the semiconductor package after resin sealing with the X-ray imaging apparatus 70, and the three-dimensional actually measured shape after resin sealing. A process of creating data and a process of creating three-dimensional measured shape data before resin sealing using a plurality of camera photo data 76 obtained by photographing the semiconductor package before resin sealing with the camera photographing device 75 Is what you do. The process of creating the 3D actually measured shape data after resin sealing and the process of creating the 3D actually measured shape data before resin sealing are exactly the same process, and are simply the basis for creating the 3D actually measured shape data. The only difference is whether the photographic data to be is X-ray photographic data 71 or camera photographic data 76. The three-dimensional measured shape data creation processing unit 64 includes an upper surface trace reception processing unit 64A, an inclined trace reception processing unit 64B, and a synthesis processing unit 64C.

  The upper surface trace acceptance processing means 64A is a single sheet obtained by photographing at least a part of the semiconductor package after resin sealing or before resin sealing (in this embodiment, as a whole as an example) from above. The upper surface photograph data is used to display the upper surface photograph including the wire on the display screen and accept the input operation for tracing the wire on the screen.

  The inclined trace acceptance processing unit 64B is an oblique part of at least a part of the semiconductor package after resin sealing or before resin sealing (in this embodiment, the whole is divided into several parts as an example). A tilt screen including wires is displayed on the display screen using tilt photo data of a plurality of images obtained by photographing from the direction (however, one may be used depending on the number of wires to be inspected and the arrangement position). A process of receiving an input operation for displaying the above and tracing the wire on the screen is performed.

  The synthesis processing unit 64C performs a process of synthesizing the upper surface trace data obtained by the trace operation received by the upper surface trace reception processing unit 64A and the inclined trace data obtained by the trace operation received by the inclined trace reception processing unit 64B. Is what you do.

  The measured gap calculation processing means 65 uses the three-dimensional measured shape data after resin sealing or before resin sealing created by the three-dimensional measured shape data creation processing means 64, after resin sealing or before resin sealing. Processing for calculating a three-dimensional gap between objects corresponding to components including wires for the semiconductor package is performed. The three-dimensional gap between objects includes, for example, a gap between wires, a gap between wires and a die, as in the case of the design gap described above.

  The measured gap display processing means 66 performs processing for displaying the calculation processing result by the measured gap calculation processing means 65 on the display screen.

  The superimposed display processing means 67 uses the three-dimensional design data and the three-dimensional measured shape data after or before resin sealing created by the three-dimensional measured shape data creation processing means 64 to design the semiconductor package. The shape and the actually measured shape after resin sealing or before resin sealing are displayed so as to overlap each other on the display screen.

  The design clearance calculation processing means 68 and the design clearance display processing means 69 perform processing similar to the design clearance calculation processing means 45 and the design clearance display processing means 46 included in the design processing means 43 of the terminal device 40 for the designer. It is.

  Further, an X-ray imaging device 70 and a camera imaging device 75 are installed in the vicinity of the terminal device 60 for process engineers (for example, in a semiconductor package manufacturing factory in Taiwan). In this embodiment, the X-ray imaging apparatus 70 is a digital X-ray imaging apparatus that outputs a captured X-ray photograph as digital X-ray photograph data (for example, BMP data, JPEG data, etc.). Thus, the semiconductor package after resin sealing can be photographed from above and obliquely upward (for example, obliquely 45 degrees with respect to the vertical direction) (FIG. 7). reference). In this embodiment, the camera photographing device 75 is a digital camera photographing device that outputs a photographed camera photograph as digital camera photograph data (for example, BMP data or JPEG data). Similarly, the imaging target can be photographed from an arbitrary direction, so that the semiconductor package before resin sealing can be photographed from above and obliquely upward (for example, at an angle of 45 degrees with respect to the vertical direction). It can be done.

  The management server 80 is constituted by one or a plurality of computers, and processing means 80A for performing various processes for managing information relating to the inspection of the semiconductor package, and three-dimensional design data storage means connected to the processing means 80A 83, design gap storage means 84, photo data storage means 85, three-dimensional measured shape data storage means 86, measured gap storage means 87, superimposed display data storage means 88, analysis result data storage means 89, and process table storage means 90 And.

  The processing unit 80A includes a server-side collaboration processing unit 81 and a data management processing unit 82.

  The server-side collaboration processing unit 81 receives operation information transmitted from any one of the plurality of terminal devices 20, 30, 40, 50, 60 in order to realize cooperative work between the terminal devices. Based on this operation information, other terminal devices (terminal devices other than the terminal device that sent the operation information) or all terminal devices (all the terminal devices including the terminal device that sent the operation information) ) To distribute the shared information. The shared information includes text information by chat, image information including a leader line, a note, a comment, and the like, and may further include voice information. Therefore, each worker can share information among the terminal devices 20 to 60, and can obtain the same character information, the same image information, the same voice information, and the like as the other workers.

  The data management processing means 82 receives the data related to the design and inspection of the semiconductor package transmitted from the terminal devices 20 to 60 via the network 1 and registers these data in the storage means 83 to 90. At the same time, in response to requests from the terminal devices 20 to 60, the corresponding data is searched from the storage means 83 to 90, and the searched data is transmitted to the terminal devices 20 to 60 via the network 1. is there. Therefore, the server-side collaboration processing unit 81 described above realizes cooperative work performed in real time by a plurality of workers, whereas the data management processing unit 82 stores data performed by each worker as needed. Realize the reference.

  The three-dimensional design data storage means 83 stores the three-dimensional design data of the semiconductor package. The stored three-dimensional design data includes three-dimensional design data corrected based on the inspection result after the inspection.

  The design gap storage unit 84 stores the design gap calculated by the design gap calculation processing unit 45.

  The photograph data storage means 85 stores X-ray photograph data 71 obtained by photographing with the X-ray photographing apparatus 70 or camera photograph data 76 obtained by photographing with the camera photographing apparatus 75.

  The three-dimensional measured shape data storage means 86 stores the three-dimensional measured shape data after resin sealing or before resin sealing created by the three-dimensional measured shape data creation processing means 64.

  The measured gap storage means 87 stores the measured gap calculated by the measured gap calculation processing means 65.

  The superimposed display data storage means 88 stores superimposed display data for displaying the design shape of the semiconductor package and the actually measured shape after resin sealing or before resin sealing on the display screen. It is.

  The analysis result data storage unit 89 stores data obtained as an analysis result by the analysis processing unit 53.

  The process table storage means 90 stores a process table (see FIG. 9) for inputting the progress status of each process of the semiconductor package inspection. More specifically, a process chart form for displaying the process chart on the display screens of the terminal devices 20 to 60 and data indicating the progress status are stored.

  In the above, the terminal side collaboration processing means 21, 31, 41, 51, 61 and the data transmission / reception processing means 22, 32, 42, 52, 62 of each terminal device 20, 30, 40, 50, 60 are for sales representatives. Document creation processing means 23 of the terminal device 20, design processing means 43 and superimposed display processing means 47 of the terminal device 40 for designers, analysis processing means 53 of the terminal device 50 for analysts, and terminal device 60 for process engineers The server side collaboration processing unit 81 and the data management processing unit 82 included in the processing unit 80A of the management server 80 and the management unit 80 include a computer (only a personal computer) constituting each of the terminal devices 20 to 60 and the management server 80. In addition, the higher-level models are also included.) And the central processing unit provided inside the main body of mobile devices, etc. Unit (CPU), a and is realized by one or more programs that define the operation procedure of this CPU.

  Further, each storage means 83, 84, 85, 86, 87, 88, 89, 90 of the management server 80 is preferably realized by, for example, a hard disk or the like, but within a range that does not cause a problem in storage capacity or access speed. If there is, for example, ROM, EEPROM, flash memory, RAM, MO, CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, FD, magnetic tape, or a combination thereof is adopted. May be.

  In the present embodiment as described above, the test system 10 inspects the prototype semiconductor package as follows. In the following, the flow of inspection of a semiconductor package after resin sealing will be described, but the flow of inspection of a semiconductor package before resin sealing is exactly the same procedure, and X-ray imaging is used to obtain photographic data. Since only the difference between using the device 70 and using the camera photographing device 75 is different, the description thereof is omitted.

  In FIG. 2, first, a semiconductor manufacturer who is a customer of a semiconductor package manufacturer calls a sales person in charge of the semiconductor package manufacturer to inspect the internal structure of the prototyped semiconductor package after the resin encapsulation, Request inspection of internal structure. At the time when this request is made or at an earlier stage, the terminal devices 20 to 60 are activated to start the program, and the terminal devices 20 to 60 are connected to the management server 80.

  The sales representative receives the prototype semiconductor package from the customer, operates the terminal device 20 for the sales representative, and uses the chat function and the image sharing function of the terminal-side collaboration processing means 21 to indicate that the prototype semiconductor package is deposited. After contacting the manager and requesting inspection of the prototype semiconductor package, the actual prototype semiconductor package is sent to the manager. At this time, the contact with the manager is realized as follows. That is, the server-side collaboration processing means 81 of the management server 80 receives the transmission information from the terminal-side collaboration processing means 21 of the terminal device 20 for the sales staff via the network 1, and the server-side collaboration processing means 81 The received information is distributed as shared information to the manager terminal device 30 via the network 1 (at this time, other terminal devices 40, 50, 60 are set as information sharing partners, and the terminal devices 40, The terminal side collaboration processing means 31 of the manager terminal device 30 receives the shared information distributed from the management server 80, and receives the manager terminal device 30. Display shared information by text information or image information on the display screen or by voice information And outputs the specific information. Note that the flow of transmission / reception processing for realizing such collaboration is the same regardless of which terminal device is operated, and hence the description thereof will be omitted.

  After receiving the actual prototype semiconductor package, the manager refers to the shared information displayed on the display screen of the manager terminal device 30 and confirms the content of the request from the sales staff.

  Subsequently, the manager operates the terminal device 30 for the manager and uses the chat function and the image sharing function by the terminal side collaboration processing means 31 to send a process engineer, an analyst, and a designer from the sales staff. Explain the contents of the inspection request, X-ray imaging of the prototype semiconductor package, creation of 3D measured shape data from X-ray photograph data obtained by imaging, analysis of the created 3D measured shape data, and analysis The reflection of the result to the design data is instructed, and the process engineer, the analyst, and the designer confirm this instruction on the display screen of each terminal device 60, 50, 40.

  The process engineer starts work in response to an instruction from the manager (step S1), receives the actual semiconductor package prototyped by the customer from the manager (step S2), and then receives it using the X-ray imaging apparatus 70. Take a picture of the inside of the semiconductor package. In the X-ray imaging, first, the entire upper surface of the semiconductor package is imaged (step S3).

  As shown in FIG. 7, when a top surface X-ray photograph is taken, the angle-of-view center line C of the X-ray projected from the projector 72 of the X-ray imaging apparatus 70 is taken as the top surface of the semiconductor package 100 (parallel to the substrate). Normal plane direction D1. That is, when the semiconductor package 100 is horizontally disposed, the X-ray field angle center line C is in the vertical direction. In this state, X-ray imaging is performed, and the top X-ray image data is output from the X-ray imaging apparatus 70 as BMP data or JPEG data (step S4 in FIG. 2).

  Next, the semiconductor package is divided according to the arrangement position, arrangement interval, number, etc. of the wires to be inspected (meaning that the imaging section is divided in a plane as viewed from above, and each imaging section is Each of the divided parts may be photographed from an oblique direction (step S5 in FIG. 2). Therefore, the number of images taken from an oblique direction does not necessarily need to be plural. For example, when the wire to be inspected is a part of the wire and the number of wires is small or concentrated in a part The number of images taken from an oblique direction may be one. In FIG. 7, when a tilted X-ray photograph is taken, the X-ray field angle center line C is set to either the left or right direction with respect to the normal direction D1 of the upper surface (surface parallel to the substrate) of the semiconductor package 100. The direction is set to the direction D2 inclined to the side by θ degrees (in this embodiment, θ = 45 degrees as an example). At this time, the projector 72 and the angle-of-view center line C of the X-rays projected from the projector 72 may be fixed in the absolute space and the semiconductor package 100 may be rotated, or the semiconductor package 100 may be fixed in the absolute space. The position (posture) of the projector 72 and the direction of the X-ray field angle center line C may be changed. In short, the semiconductor package 100 and the X-ray field angle center line C direction are changed relatively. As long as it can be tilted.

  Further, in the photographing of the inclined X-ray photograph, it is only necessary that the elevational shape (profile) of each wire can be photographed so that the wires do not overlap each other or only a part of the wires overlap even if they overlap. Therefore, as described above, the normal line direction D1 of the upper surface (plane parallel to the substrate) of the semiconductor package 100 is used as a reference, and the field angle center line C of the X-ray is inclined by θ degrees with respect to the normal line direction D1. Rather than being set in the direction D2, as shown in FIG. 8, the surface S1 including the wire 101 and the line K connecting the first bonding position P1 and the second bonding position P2 of the wire 101 (the wire 101 is sealed during resin sealing). If it flows and is inclined, the surface S1 becomes a surface inclined with respect to the normal direction D1.) The X-ray field angle center line C is set to the surface S1 and θ degrees (main). Embodiment Then, as an example, θ = 45 degrees may be set), and may be set in a direction intersecting with each other and perpendicular to the line K. That is, the angle-of-view center line C of the X-ray may be set so as to be included in the surface S2 obtained by rotating the surface S1 about the line K by θ degrees and to be orthogonal to the line K. Although the measurement accuracy is somewhat reduced, the X-ray angle of view center line C is included in a plane parallel to the plane S2 and is perpendicular to the line K (but does not intersect the line K, but 90 degrees). You may set as follows.

  Even when the X-ray field angle center line C is set to be inclined by θ degrees with respect to the normal direction D1 as in the former case, the wires do not overlap with each other, and the elevational shape (profile) of each wire is set. ), The field angle center line C of the X-ray needs to be set in a direction that forms an acute angle with respect to the surface S1.

  In the state as described above, X-ray imaging is performed a plurality of times (in some cases, only once), and a plurality of images (in some cases, only one image) may be tilted from the X-ray imaging apparatus 70. X-ray photograph data (in this embodiment, 45-degree tilted X-ray photograph data) is output as BMP data or JPEG data (step S6 in FIG. 2).

  Note that a grid-like line plated with, for example, nickel or the like is provided on the lower side of the semiconductor package 100 so that X-rays can be taken in both the upper surface X-ray photograph and the inclined X-ray photograph. A glass plate 73 is arranged, and the effect of distortion at the time of imaging is removed or reduced by performing correction processing that eliminates the distortion using the distortion of the lattice shown in the captured X-ray photograph. It is preferable. Further, the photographing direction (inclination angle θ) may be grasped using such lattice distortion. The same applies to the case of photographing by the camera photographing device 75, and correction processing and grasping processing of the photographing direction (inclination angle θ) can be performed using lattice distortion. However, in the case of camera photography, unlike the case of X-ray photography, it is not necessary to apply nickel plating.

  Then, the process engineer operates the terminal device 60 for the process engineer and uses the data registration function by the data transmission / reception processing means 62 to output one upper surface X-ray photograph data output from the X-ray imaging apparatus 70. In addition, 45-degree inclined X-ray photograph data for a plurality of sheets (may be one sheet in some cases) are registered in the photograph data storage means 85 of the management server 80 (step S7).

  At this time, the process engineer can identify the storage destination of the photographic data storage means 85 (for example, which semiconductor package is the X-ray photographic data) with the terminal device 60 for the process engineer. A designated folder name, etc.), and the data transmission / reception processing means 62 accepts this designation, and sends each X-ray photo data with a file name that can identify the data contents and storage location information to the management server 80. In the management server 80, the X-ray photographic data transmitted from the terminal device 60 is received by the data management processing unit 82, and the received X-ray photographic data is received by the photographic data storage unit 85. Store in the specified storage location. Note that the flow of processing for data registration is the same for registration processing from any terminal device, and is the same for registration processing of other types of data. . Further, the process engineer only registers the upper surface X-ray photographic data for one sheet and 45-degree inclined X-ray photographic data for a plurality of sheets (may be one sheet) in the photographic data storage means 85. Instead, the terminal device 60 also performs local storage.

  Thereafter, the process engineer operates the terminal device 60 for the process engineer, and uses the chat function and the image sharing function by the terminal-side collaboration processing means 61 to register the X-ray imaging work and each X-ray photograph data photographed. Notify managers, designers, and sales staff that work has been completed.

  Next, the process engineer operates the terminal device 60 for the process engineer, and uses the data acquisition function of the data transmission / reception processing unit 62 to be the inspection target from the 3D design data storage unit 83 of the management server 80. The three-dimensional design data for the prototype semiconductor package being obtained is acquired (step S8). At this time, the process engineer inputs or designates the file name for specifying the 3D design data to be acquired or the acquisition source (for example, folder name) of the 3D design data storage unit 83 on the terminal device 60. Or the display data and the data storage information of the acquired data selection screen transmitted to the terminal device 60 via the network 1 by the data management processing means 82 of the management server 80 (whatever is stored in the 3D design data storage means 83 3D design data to be acquired is selected and specified on the acquisition data selection screen displayed on the display screen of the terminal device 60 by the data transmission / reception processing means 62 on the basis of information indicating whether data is stored. Then, the designation information of the three-dimensional design data to be acquired, which is input or selected by the process engineer, is transmitted to the management server 80 via the network 1 by the data transmission / reception processing unit 62. In the management server 80, the data management processing unit 82 is transmitted. Thus, the designation information is received, the corresponding three-dimensional design data is retrieved from the three-dimensional design data storage means 83 based on the designation information, and the retrieved three-dimensional design data is connected to the process engineer terminal via the network 1. The data is transmitted to the device 60 and received by the data transmission / reception processing means 62 of the terminal device 60. Note that the flow of processing for data acquisition is the same for acquisition processing from any terminal device, and is the same for acquisition processing of other types of data, and will not be described below. .

  Subsequently, the process engineer reads the top X-ray photograph data stored locally in the terminal device 60 or uses the data acquisition function by the data transmission / reception processing means 62 from the photograph data storage means 85 of the management server 80. After acquiring the upper surface X-ray photograph data, the size of the upper surface of the semiconductor package at the design stage displayed on the display screen based on the three-dimensional design data using the function of the three-dimensional measured shape data creation processing means 64, and the upper surface In order to match the size of the top X-ray photograph displayed on the display screen based on the X-ray photograph data, the scale of the top X-ray photograph data is roughly changed manually. Furthermore, when the process engineer creates, for example, three fiducial marks on the upper surface X-ray photograph using the function of the three-dimensional measured shape data creation processing means 64, the upper surface is based on these fiducial marks. The fine scale change of the X-ray photograph data is automatically performed (step S9).

  Then, the process engineer uses the function of the three-dimensional measured shape data creation processing means 64 to correct the outer position of the substrate in the three-dimensional design data in accordance with the state shown in the top X-ray photograph, The position of the second bonding pad (SBP) provided above is corrected (step S10).

  Furthermore, the process engineer corrects the outer position of the die (chip) in the three-dimensional design data using the function of the three-dimensional measured shape data creation processing means 64 according to the state shown in the upper surface X-ray photograph. At the same time, the position of the chip bonding pad (CBP; synonymous with the first bonding pad) provided on the die is corrected (step S11).

  Here, it is assumed that the prototype semiconductor package 120 is in a state as shown in FIG. First bonding pads 122, 123, and 124 are provided on the uppermost die 121, and first bonding pads 126, 127, and 128 are provided on the lower die 125. On the substrate 129 on which these dies 121 and 125 are mounted, second bonding pads 130, 131, and 132 are provided. Between the first bonding pads 122, 123, and 124 and the second bonding pads 130, 131, and 132, Relatively long wires 133, 134, and 135 are stretched, and relatively short wires 136, 137, and 138 are stretched between the first bonding pads 126, 127, and 128 and the second bonding pads 130, 131, and 132, respectively. ing.

  FIG. 11 shows a state in which a part of a top X-ray photograph 140 obtained by photographing the above-described semiconductor package 120 of FIG. 10 from above is displayed on a display screen. In the top X-ray photograph 140, wires 141, 142, and 143 projecting relatively long wires 133, 134, and 135 and wires projecting relatively short wires 136, 137, and 138 are shown as solid thick lines in the figure. 144, 145 and 146 are shown. Further, FIG. 11 shows the external shape of the wires 147, 148, and 149 at the design stage corresponding to the relatively long wires 133, 134, and 135 shown in FIG. 10 based on the two-dimensional wire data designed by CAD, as viewed from above. (For example, a green line) and lines indicating the outer shape of the wires 150, 151, 152 at the design stage corresponding to the relatively short wires 136, 137, 138 in FIG. Are displayed on the display screen in a state of being superimposed on the upper surface radiograph 140.

  The process engineer traces the wires 141 to 146 shown in the upper surface X-ray photograph 140 by using the function of the upper surface trace reception processing means 64A (step S12). FIG. 11 shows a trace line 153 (for example, a white line) obtained by tracing the wire 141. This trace work is performed by, for example, clicking the mouse on the wires 141 to 146 (center position in the thickness direction of the wire) on the display screen 140 at appropriate intervals on the upper surface X-ray photograph 140. Do. This trace operation is received by the upper surface trace reception processing means 64A, and trace data is created.

  Subsequently, the two-dimensional wire data at the design stage is automatically corrected along the trace line 153 by the three-dimensional measured shape data creation processing means 64 based on the trace data created by the upper surface trace reception processing means 64A. Vector conversion processing is performed, and on the display screen, the wire 147 in the state indicated by the two-dot chain line in FIG. 11 is automatically deformed to the wire 154 in the state indicated by the dotted line in FIG. S13). Thereby, two-dimensional wire data having the trace line 153 as the center line is created, and the wire is made into a component. In addition to the vector conversion process, net information (such as connection information between the die and the substrate for the wire) that is part of the three-dimensional design data is added to the created two-dimensional wire data. .

  Furthermore, the process engineer uses the function of the three-dimensional measured shape data creation processing means 64, for example, by clicking the portion of the wire 154 in the deformed state indicated by the dotted line in FIG. A profile number input screen 155 as shown in FIG. 11 is displayed on the display screen, and a profile number is input to a profile number input unit 156 provided on this screen, thereby forming the created two-dimensional wire data 1 A profile number is assigned to each one wire (step S14).

  Then, the process engineer uses the process engineer's two-dimensional wire data (for example, DWG data; drawing data attached with an identifier dwg) created by the top surface radiographic wire trace and vector conversion as described above. It stores locally in the terminal device 60 (step S15).

  Subsequently, the process engineer reads one of a plurality of inclined X-ray photograph data stored locally in the terminal device 60 or uses the data acquisition function by the data transmission / reception processing means 62 to manage the management server 80. One of the plurality of inclined X-ray photograph data is acquired from the photograph data storage means 85 (step S16 in FIG. 3). At this time, when each inclined X-ray photograph is taken for one wire, each inclined X-ray photograph data includes, for example, “wire1_5.jpg” (5 with the first die as the first bonding position). The file name that can identify which wire is the data is attached as shown in Fig. 4). Read or get tilted X-ray photo data. Then, as shown in FIG. 12, by using the function of the inclined trace acceptance processing means 64B, one inclined X-ray photograph 160 is displayed on the display screen, and the θ degree (book) shown in the inclined X-ray photograph 160 is displayed. In the embodiment, at least one of the wires 161, 162, and 163 in a state of being photographed with an inclination of 45 degrees is traced (step S17).

  In FIG. 12, trace lines 164, 165, and 166 (for example, white lines) obtained by tracing the wires 161, 162, and 163 are shown. In this trace work, for example, the mouse 161 is clicked on the wires 161, 162, and 163 (center positions in the thickness direction of the wires) on the display screen at an appropriate interval. By doing. This trace operation is accepted by the inclined trace acceptance processing means 64B, and trace data (for example, DWG data or the like) is created. In FIG. 12, a plurality of (three) wires 161, 162, and 163 are traced in one inclined X-ray photograph 160, but only the central wire 162 is traced from the viewpoint of improving measurement accuracy. However, trace data for one wire may be created. In this case, one inclined X-ray photograph may be taken for one wire to be inspected. Each tilted X-ray photograph may be taken partially overlapping.

  Then, the process engineer stores locally the trace data (for example, DWG data) of the tilted X-ray photograph wire created as described above in the terminal apparatus 60 of the process engineer (step S18). At this time, each data to be saved is a file that can specify the profile number assigned to the traced wire, such as “profile_1.dwg” (meaning that the profile number is 1). Give it a name.

  Then, it is determined whether or not all the 45-degree tilt photo data has been traced (step S19). If 45-degree tilt photo data that has not been traced still remains, another wire In order to create the trace data, the process returns to the process of step S16 again, and thereafter the processes of steps S16 to S19 are repeated until there is no 45-degree tilted photographic data to be processed.

  Thereafter, the two-dimensional wire data (for example, DWG data and the like) created by the upper surface X-ray photograph wire trace and vector conversion by the synthesis processing means 64C and the trace data (for example, DWG data and the like) of each inclined X-ray wire And wire data is three-dimensionally processed (step S20).

  In this synthesizing process, first, the synthesizing means 64C displays a three-dimensional data automatic generation parameter input screen 170 as shown in FIG. 13 on the display screen. Accept input. In FIG. 13, on a screen 170, input portions 171, 172, 173 for inputting the thickness of the chip bonding pad (CBP), the thickness of the substrate (PCB), the thickness of the second bonding pad (SBP), and the thickness of the adhesive layer, respectively. 174, a read data selection button 175 for selecting the trace data of the 45-degree inclined X-ray photographic wire to be read, and selection units 176, 177 for selecting that the 45-degree imaging direction is imaging from the right side and the left side, respectively. , An “OK” button 178 and a “Cancel” button 179 are provided. If the tilt angle θ at the time of X-ray imaging is not fixed at 45 degrees, the tilt angle θ may be input on this screen 170. Further, the thickness of each die (chip) is not input here because it is included in the three-dimensional design data acquired in step S8 of FIG.

  With the two-dimensional wire data created by the top X-ray photograph wire trace and vector conversion opened, the process engineer uses the screen 170 and presses the read data selection button 175 to read the 45-degree inclined X-ray photograph of the object to be read. When the trace data of the wire is selected and the necessary information is input and then the “OK” button 178 is pressed, the reading processing of the trace data of each inclined X-ray photograph wire stored locally in the terminal device 60 is started. Based on the profile number assigned to each wire, each wire constituting the two-dimensional wire data created by the top surface X-ray wire trace and vector conversion, and the trace data of each inclined X-ray wire (file name is profile) Are automatically associated with each other, and the composition processing means 64C Three-dimensional processing of Layer data (combining process) is automatically executed.

Here, the composition processing by the composition processing means 64C is performed as follows, for example. In FIG. 14, the position indicating the planar shape (the shape seen from above) of the wire 200, that is, the value of the (X, Y) coordinates, is obtained from the two-dimensional wire data created by the top surface X-ray wire trace and vector conversion. can get. On the other hand, the first bonding position is P ₁ (X ₁ , Y ₁ , Z ₁ ), the second bonding position is P ₂ (X ₂ , Y ₂ , Z ₂ ), and the line K connecting these P ₁ and P ₂ If the length of L is L, the height Z (e) of the wire 200 at the position e from P ₁ can be expressed as the following equation (1).

Z (e) = Zu (e) + H (e)
= Zu (e) + {Z ₁ × (L−e) + Z ₂ × e} / L (1)

Here, the distance e is a real variable of e = 0 to L, Zu (e) is a height above the line K connecting P ₁ and P _2, and H (e) is The height is lower than the line K.

As shown in FIG. 15, when X-ray imaging is performed from a direction inclined by θ degrees with respect to the normal direction D1 (see FIG. 7) of the upper surface (surface parallel to the substrate) of the semiconductor package, θ degrees inclination X If the height of the wire 200 shown in the line photograph at the position e from P ₁ is Zs (e) and the flow of the wire 200 at the time of resin sealing is ignored, Zu (e) Using (e), it can be approximately expressed as the following equation (2).

  Zu (e) = Zs (e) / sinθ (2)

Therefore, if the above equation (2) is substituted into the above equation (1), the height Z (e) of the wire 200 at the position of the distance e from P ₁ can be expressed as the following equation (3). Can do.

Z (e) = Zs (e) / sin θ + {Z ₁ × (L−e) + Z ₂ × e} / L (3)

Also, as shown in FIG. 16, the normal direction D1 (see FIG. 7) of the upper surface (surface parallel to the substrate) of the semiconductor package is not used as a reference, but the flow of the wire 200 during resin sealing is taken into consideration. When the X-ray imaging is performed from the direction inclined by θ degrees with respect to the surface S1 (see FIG. 8) including the wire 200 and the line K connecting P1 and P2, the θ angle inclination X Assuming that the height of the wire 200 shown in the line photograph at a distance e from P ₁ is Zs (e) and the angle formed by the surface S1 and the normal direction D1 is α degrees, Zu (e) is Using Zs (e), it can be expressed as the following equation (4).

Zu (e) = Zu (e) ′ × cos α
= {Zs (e) / sin θ} × cos α (4)

Therefore, when the above equation (4) is substituted into the above-described equation (1), the height Z (e) of the wire 200 at the position of the distance e from P ₁ can be expressed as the following equation (5). Can do.

Z (e) = {Zs (e) / sin θ} × cos α
+ {Z ₁ × (L−e) + Z ₂ × e} / L (5)

Further, as shown in FIG. 17, the normal direction D1 (see FIG. 7) of the upper surface (surface parallel to the substrate) of the semiconductor package is used as a reference, and X-rays are emitted from a direction inclined by θ degrees with respect to the normal direction D1. In the case of photographing, taking into account the flow of the wire 200 at the time of resin sealing, the angle formed by the surface S1 (see FIG. 8) including the wire 200 and the line K connecting P1 and P2 and the normal direction D1 is determined. Assuming that α degrees and the flow distance of the wire 200 at the position e from P ₁ in the upper surface X-ray photograph is S (e), Zu (e) can be expressed by the following equation (6) using Zs (e): ).

  Zu (e) = Zs (e) / sin θ + S (e) / tan θ (6)

Therefore, when the above equation (6) is substituted into the above equation (1), the height Z (e) of the wire 200 at the position of the distance e from P ₁ is expressed as the following equation (7). Can do.

Z (e) = Zs (e) / sin θ + S (e) / tan θ
+ {Z ₁ × (L−e) + Z ₂ × e} / L (7)

It should be noted that various approximate processes can be performed as the synthesis process by the synthesis processing unit 64C in addition to the above-described calculation formulas or a process for executing a calculation formula equivalent thereto. It is only necessary to create three-dimensional data of a wire by combining data obtained by tracing a wire and data obtained by tracing an inclined X-ray photographic wire. At this time, the height information of the wire uses data obtained by tracing the inclined X-ray photograph wire as described above and a value depending on the inclination angle of the inclined X-ray photograph calculated by the trigonometric function. In addition, the first bonding position P ₁ (X ₁ , Y ₁ , Z ₁ ) and the second bonding position P ₂ (X ₂ , Y ₂ , Z ₂ ) In this way, it is possible to adjust the scale of each data obtained from the top X-ray photograph and the tilted X-ray photograph.

  Subsequently, the process engineer uses the function of the three-dimensional measured shape data creation processing means 64 to form a three-dimensional wire frame format (only the wire is three-dimensionalized and other objects such as dies are not three-dimensionalized. The composition is confirmed by display in the “display format in the state” (step S21 in FIG. 3).

  Then, the process engineer uses the function of the three-dimensional measured shape data creation processing means 64 to perform a process of three-dimensionalizing an object corresponding to a component other than a wire such as a die (step S22).

  Furthermore, the process engineer uses the function of the three-dimensional measured shape data creation processing means 64 to display a three-dimensional shading format (a display format in which not only wires but also other objects such as dies and substrates are three-dimensionalized. ) To confirm the composition (step S23).

  Then, the process engineer operates the terminal device 60 for the process engineer, and uses the data registration function by the data transmission / reception processing means 62 to make CAD data (for example, DWG data, etc.) of the three-dimensional prototype semiconductor package. Is registered in the three-dimensional measured shape data storage means 86 of the management server 80 as three-dimensional measured shape data (step S24).

  In addition, the process engineer operates the terminal device 60 for the process engineer and uses the chat function and the image sharing function by the terminal side collaboration processing means 61 to end the creation of the three-dimensional measured shape data, and 3 The manager, the designer, and the sales staff are informed of the creation contents of the dimension measurement shape data (step S25), and the operation is terminated (step S26).

  After the manager operates the manager terminal device 30 and uses the chat function or the image sharing function of the terminal side collaboration processing means 31, the manager confirms the creation contents of the three-dimensional measured shape data contacted by the process engineer. Using the process progress management function of the data transmission / reception processing means 32, the process table 210 (see FIG. 9) is acquired from the process table storage means 90 of the management server 80 via the network 1 and displayed on the display screen of the terminal device 30. Display the work, and check the end of work in the check box of “Create three-dimensional measured shape data” of the process table 210. The data transmission / reception processing means 32 transmits the input information of this check to the management server 80 via the network 1, and the data management processing means 82 of the management server 80 receives the transmitted input information of the check, and this information Is stored in the process chart storage means 90. In the process table 210 shown in FIG. 9, there is a check column such as “sample reception” corresponding to the lower layer of “creation of three-dimensional measured shape data”, but the process engineer checks these lower layers. In the column, a check may be put at the end of each work. Note that the flow of processing associated with the check input operation to the process table 210 is the same when checking the check boxes of other items, and thus the description thereof will be omitted.

  Thereafter, the process engineer starts checking the prototype semiconductor package based on the created three-dimensional measured shape data (step S31 in FIG. 4). First, the process engineer operates the terminal device 60 for the process engineer, and uses the data acquisition function of the data transmission / reception processing unit 62 to make an inspection object from the three-dimensional design data storage unit 83 of the management server 80. The three-dimensional design data about the prototype semiconductor package is acquired (step S32). Note that if the already acquired 3D design data is stored locally in the terminal device 60, the acquisition process from the management server 80 may be omitted.

  In addition, the process engineer operates the terminal device 60 for the process engineer as necessary, and uses the data acquisition function of the data transmission / reception processing unit 62, and has already been calculated from the design gap storage unit 84 of the management server 80. The design gap display processing of the semiconductor package to be inspected is acquired or the design gap calculation processing means 68 calculates the design gap between objects such as wires using the three-dimensional design data. The design gap is checked by displaying the design gap on the display screen of the terminal device 60 by means 69 (step S33).

  Next, the process engineer operates the terminal device 60 for the process engineer, and uses the data acquisition function by the data transmission / reception processing unit 62 to read the inspection target data from the three-dimensional measured shape data storage unit 86 of the management server 80. The three-dimensional measured shape data for the semiconductor package is acquired (step S34). Then, after the measured gap calculation processing means 65 calculates the measured gap between objects such as wires using the three-dimensional measured shape data, the measured gap display processing means 66 displays the calculated measured gap on the display screen of the terminal device 60. By displaying the above, a three-dimensional design rule check and an actual measurement gap check are performed (step S35).

  FIG. 18 shows an example of a three-dimensional design rule check result displayed on the display screen of the terminal device 60 by the measured gap display processing means 66. As a result of performing the design rule check in three dimensions, when a three-dimensional gap between objects (for example, between wires, between a wire and a die, etc.) is below a threshold value, that is, when a defect is detected, The object is displayed with a thick line, for example, as shown in the figure. In the example of FIG. 18, among the wires 221 to 229 developed from the upper die 220 to the substrate 240 and the wires 231 to 239 developed from the lower die 230 to the substrate 240, between five sets of wires, that is, the wires 221 and 231. A defect is detected between the wires 222 and 232, between the wires 224 and 234, between the wires 226 and 236, and between the wires 227 and 228.

  Further, as shown in FIG. 19, the process engineer can cause the measured gap display processing unit 66 to numerically display the three-dimensional gap between the wires that is equal to or less than the threshold value on the defect location list display screen 250. In the display example of the third row in FIG. 19, the display “D1-4” is the fourth pad of the die 220 whose upper bonding position is the upper die 220 (“D1” means the upper die 220). The wire 224 is the fourth pad of the die 230 whose first bonding position is the lower die 230 (“D2” means the lower die 230). The three-dimensional gap between these wires 224 and 234 (between “D1-4” and “D2-4”) is “0.0556” (mm).

  Further, as shown in FIG. 19, when the process engineer double-clicks any display portion among the wires in which the defect is detected, the actually-measured gap display processing unit 66 causes the double-clicked wires 224 and 234 to be displayed. 3D graphics display is performed, and the minimum gap position between the wires 224 and 234 is indicated by a line 260 such as red. Then, the wires 224 and 234 and the lines 260 such as red, which are displayed in the three-dimensional graphics in this way, rotate together on the screen around these, so that the positional relationship between the wires 224 and the wires 234 and these The state of the minimum gap position can be easily confirmed.

  Note that the three-dimensional gap is a gap between the outer portions of the object. For example, if the gap is between the wires, the thickness of the wire is considered in consideration of the thickness of the wire, not the three-dimensional gap between the center lines of the wires. It is a three-dimensional gap between the outer peripheral surfaces.

  Further, not only the three-dimensional graphics display of the gap between the wires as shown in FIG. 19, but also the three-dimensional graphics display of the gap between the wire and other objects can be performed. FIG. 20 shows an example of a three-dimensional design rule check result display screen 270 displayed on the display screen of the terminal device 60 by the measured gap display processing means 66. In FIG. 20, the screen 270 displays a numerical value (for example, “0.0556) between the wires, which is the smallest of the three-dimensional gaps between the wires when the bond wire diameter is set to 0.025 (mm). ”(Mm) etc.), a first target wire (for example,“ D1-4 ”etc.) and a second target wire (for example“ D2-4 ”) that form a three-dimensional gap between the smallest wires. Display unit 272, 273, a display unit 274 for a numerical value of the smallest gap among the three-dimensional gaps between the wire and the component (die) (for example, “0.0531”, etc.), Display unit 275 for the smallest gap among the three-dimensional gaps between the die bonding pad (DBP) and display unit for the smallest gap among the three-dimensional gaps between the wire and the cavity. 276 and Display portions 277 and 278 for the lengths (lengths along the wires) of the first target wire and the second target wire that form a minimum three-dimensional gap between the wires, and capillary (the movement of the apparatus when hitting the wire) ) (A situation in which the gap disappears) occurs, and a display section 279 for the number of error occurrence locations used is provided.

  Further, the screen 270 of FIG. 20 includes a gap limit value input unit 280, a “bond wire / bond wire” selection unit 281 for displaying a three-dimensional graphics of a minimum gap portion between wires, and wires and components ( “Bond wire / component” selection unit 282 for displaying the three-dimensional graphics of the minimum gap portion between the wire and the die) and the three-dimensional graphics of the minimum gap portion between the wire and the die bonding pad (DBP) A “bond wire / die bonding pad” selection unit 283 for performing display, and a “bond wire / cavity” selection unit 284 for performing three-dimensional graphics display of a minimum gap portion between the wire and the cavity; An “OK” button 285 and a “Cancel” button 286 are provided.

  When the process engineer inputs the gap limit value to the input unit 280 and presses the “OK” button 285 on the screen 270 of FIG. 20, the failure when displaying the defective portion in FIG. 18 or FIG. 19 described above. The threshold value serving as a criterion for determining whether or not is changed. Further, when the process engineer selects the “bond wire / bond wire” selection unit 281 and then clicks the display unit 271 or its title portion, the measured gap display processing unit 66 causes the wire gaps as shown in FIG. When the “bond wire / component” selection section 282 is selected and the display section 274 or its title section is clicked, the measured gap display processing means 66 displays the three-dimensional graphics of the minimum gap portion of FIG. The three-dimensional graphics display of the minimum gap portion between the wire 290 and the die 291 as shown is performed. At this time, the minimum gap position between the wire 290 and the die 291 is indicated by a red line 292, and the wire 290, the die 291 and the red line 292 rotate together on the screen.

  Further, when the “bond wire / die bonding pad” selection unit 283 is selected and then the display unit 275 or its title portion is clicked, the measured gap display processing means 66 causes the wire and die bonding pad (DBP) to be clicked. 3D graphics display of the minimum gap portion between and the “bond wire / cavity” selection unit 284 is selected, and when the display unit 276 or its title portion is clicked, the measured gap display processing means 66 A three-dimensional graphics display of the minimum gap portion between the wire and the cavity is performed.

  Then, the process engineer operates the terminal device 60 for the process engineer, and uses the data registration function of the data transmission / reception processing unit 62 to store the measured gap data calculated by the measured gap calculation processing unit 65 with the management server 80. Is registered in the measured gap storage means 87 (step S36 in FIG. 4).

  Subsequently, as shown in FIG. 21, the process engineer superimposes the design shape and the measured shape of the semiconductor package on the terminal by using the superimposed display processing means 67 using the three-dimensional design data and the three-dimensional measured shape data. It is displayed on the display screen of the device 60, both are compared and verified, and the difference between the two is confirmed (step S37). In the example of FIG. 21, the wire 300 at the design stage and the wire 301 after resin sealing corresponding thereto are displayed with different colors.

  Subsequently, the process engineer operates the terminal device 60 for the process engineer, and uses the data registration function by the data transmission / reception processing unit 62 to display the superimposed display data for display by the superimposed display processing unit 67. The data is registered in the superimposed display data storage means 88 of the management server 80 (step S38 in FIG. 4).

  Then, the process engineer operates the terminal device 60 for the process engineer, uses the chat function and the image sharing function by the terminal-side collaboration processing means 61, and checks the gap and compares the design shape with the actually measured shape. The manager, the designer, the analyst, and the sales staff are informed of the completion of the work and the comparison / collation result (step S39), and the work is finished (step S40).

  The manager operates the manager terminal device 30 and uses the chat function and the image sharing function of the terminal side collaboration processing means 31 to confirm the contents of communication from the process engineer, and then the process progress by the data transmission / reception processing means 32 Using the management function, the process table 210 (see FIG. 9) is acquired from the process table storage unit 90 of the management server 80 via the network 1 and displayed on the display screen of the terminal device 30. Check the end of work in the check box of “Check gap and check comparison between design shape and actual shape”.

  The sales person operates the terminal device 20 for the sales person and uses the chat function and the image sharing function by the terminal-side collaboration processing means 21 and the design shape as the comparison result on the display screen of the terminal device 20. Display the difference from the measured shape and show it to the customer.

  The manager operates the manager terminal device 30 and requests analysis (mechanical analysis and electrical analysis) from the analyst using the chat function and the image sharing function of the terminal side collaboration processing means 31.

  The analyst operates the analyst's terminal device 50 and uses the chat function and the image sharing function by the terminal-side collaboration processing means 51 to confirm the contents of the request from the manager, and then starts the analysis work (FIG. 5). Step 51), using the data acquisition function of the data transmission / reception processing means 52, the three-dimensional measured shape data to be analyzed is acquired from the three-dimensional measured shape data storage means 86 of the management server 80 (Step S52).

  Subsequently, the analyst performs a mechanical analysis of the three-dimensional measured shape data by the analysis processing means 53 (step S53), and further performs an electrical analysis (step S54), and then outputs analysis result data (step S54). Step S55). Then, the analyst registers the analysis result data by the analysis processing unit 53 in the analysis result data storage unit 89 of the management server 80 by using the data registration function by the data transmission / reception processing unit 52 (step S56). The analyst reports various analysis results to the manager and the designer using the chat function and the image sharing function by the terminal side collaboration processing means 51, and proposes design changes based on these analysis results (steps). S57), the analysis work is finished (step S58).

  The manager operates the manager terminal device 30, uses the chat function or the image sharing function of the terminal side collaboration processing means 31, confirms the content of communication from the analyst, and then manages the process progress by the data transmission / reception processing means 32. Using the function, the process table 210 (see FIG. 9) is acquired from the process table storage unit 90 of the management server 80 via the network 1 and displayed on the display screen of the terminal device 30. Check the “Work completed” check box.

  Then, the designer operates the terminal device 40 for the designer, uses the chat function and the image sharing function by the terminal side collaboration processing means 41, confirms the analysis result and the proposed content of the design change, and then reviews the design. Work (design rule parameter value correction work) is started (step S61 in FIG. 6), and the data display function by the data transmission / reception processing means 42 is used to display the superimposed display from the superimposed display data storage means 88. Business data is acquired (step S62).

  Subsequently, the designer uses the superimposed display processing unit 47 to display and confirm the difference between the design shape and the actually measured shape, which are the comparison verification results, on the display screen of the terminal device 40 using the superimposed display data. Then, the error of the parameter value of the design rule is calculated from the difference (step S63), and the parameter value of the design rule is corrected (step S64). Then, the designer operates the terminal device 40 for the designer, and uses the data registration function by the data transmission / reception processing means 42 to convert the three-dimensional design data reflecting the corrected design rule parameter values into the management server It is registered in the 80 three-dimensional design data storage means 83 (step S65). Further, the designer uses the chat function and the image sharing function of the terminal side collaboration processing means 41 to notify the manager that the parameter value correction work for the design rule has been completed (step S66), and the design review work is performed. The process ends (step S67).

  The manager operates the manager terminal device 30 and confirms the contact details from the designer using the chat function and the image sharing function by the terminal side collaboration processing means 31, and then the process progress management by the data transmission / reception processing means 32 Using the function, the process table 210 (see FIG. 9) is acquired from the process table storage unit 90 of the management server 80 via the network 1 and displayed on the display screen of the terminal device 30. Check “End of work” in the “Correction of parameter value of rule” check box.

  The sales person operates the terminal device 20 for the sales person and uses the data acquisition function by the data transmission / reception processing means 22 to use the three-dimensional design data storage means 83, the design gap storage means 84, and the photographic data of the management server 80. Necessary data is appropriately acquired from the storage unit 85, the three-dimensional measured shape data storage unit 86, the measured gap storage unit 87, the superimposed display data storage unit 88, and the analysis result data storage unit 89. Using the acquired data, create various documents such as prototype semiconductor package inspection reports and design improvement proposals and submit them to customers.

  According to this embodiment, there are the following effects. That is, since the inspection system 10 includes the three-dimensional measured shape data creation processing means 64, a semiconductor package after resin sealing or before resin sealing using a plurality of X-ray photograph data or a plurality of camera photograph data. 3D actual shape data can be created.

  In addition, since the inspection system 10 includes the measured gap calculation processing means 65 and the measured gap display processing means 66, the three-dimensional gap between objects of the prototype semiconductor package is calculated based on the three-dimensional measured shape data and displayed on the screen. (See FIGS. 18-20). For this reason, an operator engaged in the inspection of the semiconductor package can grasp in detail three-dimensionally the state of the semiconductor package after resin sealing or before resin sealing, for example, the gap between wires. Detailed information obtained dimensionally can be effectively reflected in the design data.

  Furthermore, since the inspection system 10 includes the superimposed display processing means 47 and 67, the design shape and the measured shape can be superimposed and displayed using the three-dimensional measured shape data and the three-dimensional design data (see FIG. 21). For this reason, an operator involved in the inspection of the semiconductor package can grasp the difference between the design shape and the actual measurement shape in three dimensions in detail, and the detailed information obtained in the three dimensions can be effectively applied to the design data. Can be reflected. In particular, in the case of inspection of semiconductor packages after resin sealing, it is possible to grasp how the wires flow (how much and in which direction, and what shape) when the resin is sealed. The design can be changed in consideration of the influence.

  Since the inspection system 10 includes the design gap calculation processing means 45 and 68 and the design gap display processing means 46 and 69, the three-dimensional gap between the objects of the semiconductor package at the design stage is determined based on the three-dimensional design data. It can be calculated and displayed on the screen. For this reason, designers can work while confirming design gaps during design work or correction of design rule parameter values after inspection, and process engineers can check design gaps during inspection work. can do. Further, by displaying the measured gap by the measured gap display processing means 66, the gap at the design stage and the gap of the prototype can be easily confirmed and compared, so that the process engineer The designer can make a design improvement proposal or make a design change after confirming the difference between the two.

  Further, the plurality of X-ray photograph data or the plurality of camera photograph data used in the processing by the three-dimensional measured shape data creation processing means 64 is taken from a plurality of directions by the X-ray imaging apparatus 70 or the camera imaging apparatus 75. Therefore, compared to the case of using a plurality of tomographic images, the three-dimensional measured shape data can be easily created with a small amount of data.

  Further, the three-dimensional measured shape data creation processing means 64 is configured to create the three-dimensional measured shape data by tracing the wire of the upper surface photograph and the wire of the inclined photograph, respectively. Information can be obtained efficiently and three-dimensional measured shape data can be created efficiently. That is, the X and Y coordinate values (wire planar position information) can be obtained by the wire trace in the upper surface photograph, and the Z coordinate values (wire height information) can be obtained by the wire trace in the inclined photograph. , Inclined photographs can be taken with the wires not overlapping or with only a part of the wires overlapping, so that the tracing work to obtain the wire height information can be performed accurately and smoothly. Can do.

  The inspection system 10 is configured to connect each terminal device 20 to 60 and the management server 80 via the network 1 and to perform cooperative work (digital collaboration) among a plurality of workers. In each process of testing prototype semiconductor packages, sales representatives, managers, designers, analysts, and process engineers can share information and work closely together to efficiently perform a series of operations. . For this reason, a series of operations relating to the inspection of the prototype semiconductor package can be completed in a short time, and the work efficiency can be improved even when there is an operator at a remote place.

  In addition, since the inspection system 10 is configured to register data stored in the management server 80 and store / manage data obtained by the work performed in each of the terminal devices 20 to 60, the data obtained as a result of the inspection is stored. Can be accumulated. For this reason, know-how, knowledge and technical information necessary for the design and production of semiconductor packages are accumulated and managed collectively, so that the speed of design and production can be increased and the time required for them can be shortened. And the reliability of the product can be improved.

  Furthermore, since the inspection system 10 is configured to be able to input the progress of each process related to the inspection using the process table registered in the management server 80 (see FIG. 9), the manager or other The worker can input the end of the work of each process to the process table, or each worker can refer to them to manage the progress of each process related to the inspection. For this reason, a series of operations relating to the inspection can be completed more reliably in a short time.

  Note that the present invention is not limited to the above-described embodiment, and modifications and the like within a scope where the object of the present invention can be achieved are included in the present invention.

  That is, in the inspection system 10 of the above embodiment, as shown in FIG. 1, the X-ray imaging apparatus 70 and the camera imaging apparatus 75 and the inspection processing means 63 including the three-dimensional measured shape data creation processing means 64 are different. Although they are provided as an apparatus, they may be integrated into an X-ray imaging apparatus or a camera imaging apparatus having a processing function by an inspection processing unit 63 including a three-dimensional measured shape data creation processing unit 64.

  In addition, the inspection system 10 according to the embodiment has a configuration in which the terminal devices 20 to 60 and the management server 80 are connected to each other via the network 1 and can perform cooperative work (digital collaboration) among a plurality of workers. However, the inspection system of the present invention is not necessarily limited to the configuration capable of performing the cooperative work via the network 1, for example, between a plurality of workers or between each device. Data delivery may be performed using a recording medium such as FD or MO. However, from the viewpoints of work efficiency, work time reduction, centralized data management, and the like, it is preferable to adopt a configuration capable of performing cooperative work via the network 1.

  Furthermore, in the inspection system 10 of the above-described embodiment, the design shape and the actually measured shape after the resin sealing or before the resin sealing are obtained by the superimposed display processing means 47 and 67 in terms of the comparison between the design information and the actually measured information. In this case, only the process of superimposing and displaying on the display screen is performed (see FIG. 21), but the measured three-dimensional gap calculated by the measured gap calculation processing means 65 (for example, the gap between the wires) , A gap between the wire and the die, etc.) and a three-dimensional gap at the design stage calculated by the design gap calculation processing means 68 (a gap corresponding to the actually measured gap) are displayed numerically on the display screen. Design / measurement gap contrast display processing means for performing the above may be provided. This design / measured gap contrast display processing means is preferably provided, for example, in the terminal device 60 for the process engineer or the terminal device 40 for the designer. When provided in the terminal device 40 for the designer, the design / measured gap comparison display processing unit may acquire display data from the design gap storage unit 84 and the measured gap storage unit 87 of the management server 80. Alternatively, a design / measured gap contrast display data storage unit may be separately provided in the management server 80, and display data may be acquired from the design / actual gap comparison display data storage unit. By displaying a comparison between numerical values of the design gap and the actual measurement gap, an operator involved in the inspection of the semiconductor package can grasp the difference between the design gap and the actual measurement gap in detail in numerical values. Detailed information obtained by comparison can be effectively reflected in the design data.

  As described above, the semiconductor package inspection system and program according to the present invention are, for example, inspection of a semiconductor package after resin sealing or before resin sealing in a collaborative operation via a network by a plurality of workers at remote locations. It is suitable for use when performing a series of processes related to the above.

1 is an overall configuration diagram of a semiconductor package inspection system according to an embodiment of the present invention. The figure of the flowchart which shows the flow of the test | inspection operation | work of the semiconductor package of the said embodiment (the first half of the three-dimensional measurement shape data creation work by a process engineer). The figure of the flowchart which shows the flow of the test | inspection operation | work of the semiconductor package of the said embodiment (the second half of the three-dimensional measurement shape data creation work by a process engineer). The figure of the flowchart which shows the flow of the test | inspection work (check work by a process engineer) of the semiconductor package of the said embodiment. The figure of the flowchart which shows the flow of the test | inspection work (analysis work by an analyst) of the semiconductor package of the said embodiment. The figure of the flowchart which shows the flow of the test | inspection work of the semiconductor package of the said embodiment (The correction work of the parameter value of the design rule by a designer). Explanatory drawing of the imaging | photography condition by the X-ray imaging apparatus of the said embodiment. Explanatory drawing of the imaging | photography direction of the inclination X-ray photograph of the said embodiment. The figure which shows an example of the process chart of the said embodiment. The perspective view which shows a part of real semiconductor package made as an experiment. Explanatory drawing of the trace operation | work of the upper surface X-ray photography wire of the said embodiment. Explanatory drawing of the trace operation | work of the inclination X-ray photography wire of the said embodiment. The figure which shows an example of the parameter input screen for the three-dimensional data automatic generation of the said embodiment. The 1st explanatory view of the composition processing of wire data of the embodiment. The 2nd explanatory view of the composition processing of wire data of the embodiment. The 3rd explanatory view of the composition processing of wire data of the embodiment. The 4th explanatory view of the composition processing of wire data of the embodiment. The figure which shows an example of the design rule check result in three dimensions of the said embodiment. The figure which shows an example of the list display screen of the defect location of the said embodiment, and a three-dimensional graphics display of the minimum clearance gap part between wires. The figure which shows an example of the three-dimensional graphics display of the 3D design rule check result display screen of the said embodiment, and the minimum clearance gap part between a wire and die | dye. The figure which shows an example of the superimposition display in three dimensions with the design shape and measured shape of the semiconductor package of the said embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Network 10 Inspection system 20 Terminal device for sales staff 21, 31, 41, 51, 61 Terminal side collaboration processing means 22, 32, 42, 52, 62 Data transmission / reception processing means 30 Manager terminal device 40 For designers Terminal device 47, 67 superimposed display processing means 50 terminal device for analysts 60 terminal device for process engineers 64 three-dimensional measured shape data creation processing means 64A upper surface trace acceptance processing means 64B inclined trace acceptance processing means 64C synthesis processing means 65 Actual measurement gap calculation processing means 66 Actual measurement gap display processing means 70 X-ray imaging apparatus 71 X-ray photograph data 75 Camera imaging apparatus 76 Camera photograph data 80 Management server 81 Server side collaboration processing means 82 Data management processing means 83 Three-dimensional design data storage Means 86 Three-dimensional Shape measurement data storage means 88 Superposition display data storage means 90 Process table storage means 120 Semiconductor package 210 Process table

Claims (6)

Creates three-dimensional measured shape data of components including wires of the semiconductor package after resin sealing, using a plurality of X-ray photograph data obtained by imaging the semiconductor package after resin sealing with an X-ray imaging apparatus. and 3-dimensional measured shape data creation processing unit that performs processing for,
Three-dimensional gaps between objects corresponding to components including wires of the semiconductor package after resin sealing using the three-dimensional measured shape data after resin sealing created by the three-dimensional measured shape data creation processing means Measured gap calculation processing means for performing processing for calculating
The actual measurement gap display processing means for performing processing for displaying the calculation processing result by the actual measurement gap calculation processing means on the display screen ,
The three-dimensional measured shape data creation processing means includes:
The upper surface photograph including the wire is displayed on the display screen using the upper surface photograph data obtained by X-ray imaging of at least a part of the semiconductor package after the resin sealing from above, and the wire is screened over the entire length. Upper surface trace reception processing means for performing processing for receiving an input operation to be traced above;
An inclined photograph including a wire is displayed on a display screen using inclined photograph data obtained by X-ray photographing at least a part of the semiconductor package after resin sealing from an oblique direction, and the wire is extended over the entire length. An inclined trace reception processing means for performing a process of receiving an input operation to be traced on the screen;
Combining processing means for performing processing for combining upper surface trace data obtained by the trace operation received by the upper surface trace reception processing means and inclined trace data obtained by the trace operation received by the inclined trace reception processing means; Consists of
Tilt photograph data obtained by X-ray photography from the oblique direction,
A wire orthogonal to or substantially perpendicular to a straight line between bonding positions connecting a first bonding position for joining one end of the wire and a second bonding position for joining the other end, or a line perpendicular to or substantially perpendicular to the wire, and the wire A tilt inspection data obtained by X-ray imaging using a line forming an acute angle with a plane including the straight line between the bonding positions as an angle of view center line . A configuration including a wire of the semiconductor package after resin sealing using a plurality of X-ray photograph data obtained by photographing the semiconductor package after resin sealing created based on the three-dimensional design data with an X-ray imaging apparatus and 3-dimensional measured shape data creation processing unit that performs processing of creating a 3-dimensional measured shape data element,
Using the three-dimensional design data and the three-dimensional measured shape data of the component including the wire of the semiconductor package after resin sealing created by the three-dimensional measured shape data creation processing means , the wire of the semiconductor package Superimposing display processing means for performing processing to superimpose and display the design shape of the wire and the measured shape of the wire after resin sealing on the display screen ,
The three-dimensional measured shape data creation processing means includes:
The upper surface photograph including the wire is displayed on the display screen using the upper surface photograph data obtained by X-ray imaging of at least a part of the semiconductor package after the resin sealing from above, and the wire is screened over the entire length. Upper surface trace reception processing means for performing processing for receiving an input operation to be traced above;
An inclined photograph including a wire is displayed on a display screen using inclined photograph data obtained by X-ray photographing at least a part of the semiconductor package after resin sealing from an oblique direction, and the wire is extended over the entire length. An inclined trace reception processing means for performing a process of receiving an input operation to be traced on the screen;
Combining processing means for performing processing for combining upper surface trace data obtained by the trace operation received by the upper surface trace reception processing means and inclined trace data obtained by the trace operation received by the inclined trace reception processing means; Consists of
Tilt photograph data obtained by X-ray photography from the oblique direction,
A wire orthogonal to or substantially perpendicular to a straight line between bonding positions connecting a first bonding position for joining one end of the wire and a second bonding position for joining the other end, or a line perpendicular to or substantially perpendicular to the wire, and the wire A tilt inspection data obtained by X-ray imaging using a line forming an acute angle with a plane including the straight line between the bonding positions as an angle of view center line . The semiconductor package inspection system according to claim 1,
A configuration including three-dimensional design data and the wire of the semiconductor package after resin sealing created by the three-dimensional measured shape data creation processing unit for the semiconductor package after resin sealing created based on the three-dimensional design data Superimposed display processing means for performing processing for superimposing and displaying the design shape of the wire of the semiconductor package and the measured shape of the wire after resin sealing on the display screen using the three-dimensional measured shape data of the element A semiconductor package inspection system characterized by this. The semiconductor package inspection system according to claim 2 or 3,
A plurality of terminal devices respectively operated by a plurality of workers including process engineers, analysts, and designers engaged in the design and inspection of the semiconductor package, and the semiconductor package connected to these terminal devices via a network And a management server that manages information related to the inspection of
The terminal device
In order to realize collaborative work by at least one of dialogues or image sharing between the plurality of workers, processing for receiving input operations by the workers and transmitting the operation information to the management server, and Terminal-side collaboration processing means for receiving the shared information distributed from the management server and performing display processing on the display screen for presenting the shared information to the worker;
A data transmission / reception processing means for performing data transmission / reception processing with respect to the design and inspection of the semiconductor package with the management server;
The management server
In order to realize the cooperative work, a process of receiving operation information transmitted from any one of the plurality of terminal devices is performed, and another terminal device or all terminals are performed based on the operation information. Server-side collaboration processing means for performing processing for distributing shared information to the device;
Receives data related to the design and inspection of the semiconductor package transmitted from the terminal device via the network, performs registration processing of this data, and searches for corresponding data in response to a request from the terminal device. Data management processing means for performing processing to transmit to the terminal device via the network;
3D design data storage means for storing 3D design data of the semiconductor package;
Three-dimensional measured shape data storage means for storing three-dimensional measured shape data of the component including the wire of the semiconductor package after the resin sealing created by the three-dimensional measured shape data creation processing means;
And a data storage means for superimposed display for storing superimposed display data for displaying the design shape of the wire of the semiconductor package and the actually measured shape of the wire after resin sealing on the display screen. ,
The data management processing means includes
The 3D measured shape data of the component including the wire of the semiconductor package after resin sealing transmitted from the terminal device operated by a process engineer via the network is received, and the received 3D measured shape is received. Processing for registering data in the three-dimensional measured shape data storage means;
Processing for receiving the superimposed display data transmitted from the terminal device operated by a process engineer via the network and registering the received superimposed display data in the superimposed display data storage unit;
In response to a request from the terminal device operated by the analyst, the corresponding three-dimensional actually measured shape data is searched from the three-dimensional actually measured shape data storage means, and the terminal device by which the analyst operates the searched three-dimensional actually measured shape data Transmitting to the network via the network;
In response to a request from a terminal device operated by a designer, the corresponding superimposed display data is retrieved from the superimposed display data storage means, and the retrieved superimposed display data is transmitted to the terminal device operated by the designer. Process to send via
Processing for receiving corrected three-dimensional design data transmitted from the terminal device operated by the designer via the network and registering the received corrected three-dimensional design data in the three-dimensional design data storage means A semiconductor package inspection system characterized by comprising a process including: The semiconductor package inspection system according to claim 4 ,
The plurality of terminal devices include a terminal device operated by a sales representative,
The data management processing means retrieves the corresponding superimposed display data from the superimposed display data storage means in response to a request from a terminal device operated by a sales representative, and the retrieved superimposed display data is assigned to the sales representative. The semiconductor package inspection system is also configured to perform a process of transmitting via a network to a terminal device operated by a person. The semiconductor package inspection system according to claim 4 or 5 ,
The plurality of terminal devices include a terminal device operated by a manager that comprehensively manages the inspection process of the semiconductor package,
The management server includes a process table storage unit that stores a process table for inputting a progress status of each process of the inspection of the semiconductor package,
The data management processing means transmits, via the network, the data for displaying the screen of the process chart stored in the process chart storage means to the terminal apparatus operated by the manager in response to a request from the terminal apparatus operated by the manager. And receiving the data indicating the progress status transmitted from the terminal device input by the manager and operated by the manager via the network and updating the process chart. Semiconductor package inspection system.

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