JP3992360B2 - Conductive adhesive tape - Google Patents

Description

表１から明らかなように、実施例１〜６の導電性接着テープは、電極部に段差があっても、優れた耐湿性を示し、安定した導電性能を発現できる。
【図面の簡単な説明】
【図１】本発明の導電性接着テープの一例を示す概略断面図である。
【図２】図１の導電性接着テープの使用状態を示す概略断面図である。
【図３】本発明の導電性接着テープの他の例を示す概略断面図である。
【図４】図３の導電性接着テープの使用状態を示す概略断面図である。
【符号の説明】
T1，T2 導電性接着テープ
１，11 導電性基材
２，12 接着剤層
３，13 導電性接着テープ本体
４，14 基材
５，15 接着剤層
６，16 補助テープ
７ 被着体
８ 電極部
17 導通部
18 端子部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a conductive adhesive tape useful for electrically connecting two spaced apart locations such as grounding a printed wiring board.
[0002]
[Prior art]
When electrically connecting two separate locations, such as installing a printed circuit board, grounding an exterior shield case of an electronic device, and grounding a TV cathode ray tube, two pressure sensitive adhesive tapes are required. Electricity between the two places is applied by the electrical conduction between the adherend surface and the conductive base of the conductive adhesive tape and the electrical conduction in the longitudinal direction of the conductive base. The aim is to establish a continuous continuity.
[0003]
As such a conductive tape, a conductive tape in which a pressure-sensitive adhesive layer containing a conductive filler is laminated on one side of a metal foil base material has been conventionally used. Japanese Utility Model Publication No. 63-46980 consists of a conductive substrate and a pressure-sensitive adhesive layer provided on at least one surface of the conductive substrate, and on the adhesive layer side of the substrate, A conductive adhesive tape is disclosed in which a conductive portion with a desired interval is provided having a terminal portion that penetrates the adhesive layer and slightly covers the surface of the adhesive layer.
[0004]
Japanese Patent Application Laid-Open No. 8-185714 discloses an improved version of the conductive adhesive tape described in the above-mentioned Japanese Utility Model Publication No. 63-46980, on the surface of the conductive adhesive tape on the base material side. There has been proposed an adhesive tape comprising a pressure-sensitive adhesive layer provided on one side of a material, and an auxiliary tape having a width wider than that of the conductive adhesive tape. According to such an adhesive tape, it is possible to prevent moisture and moisture from entering the contact interface between the pressure-sensitive adhesive layer and the adherend surface, and it is possible to suppress a decrease in conductive performance.
[0005]
In addition, for a conductive tape in which a pressure-sensitive adhesive layer containing a conductive filler is laminated on one side of the metal foil base material, polyester is applied to the other surface of the base material in order to prevent hand cuts caused by the metal foil. An adhesive tape obtained by bonding an auxiliary tape made of a base material is commercially available.
[0006]
When such a conductive adhesive tape with an auxiliary tape is bonded to a completely smooth adherend, the auxiliary tape can be adhered cleanly without causing a gap in the adherend. It is possible to completely seal the sides. However, the conductive tape is hardly affixed to a completely smooth surface, and is often affixed to a non-smooth surface such as a bent portion of a cathode ray tube or a stepped portion of a printed wiring portion. With conventional conductive adhesive tapes with an auxiliary tape made of polyester base material, for example, when sticking to the bent part as described above, the length aberration caused by the thickness of the metal foil cannot be absorbed, and sticking wrinkles occur. A gap is formed between the interface and the adherend. In addition, when the conductive adhesive tape is attached to a portion having a step, the base material of the auxiliary tape cannot follow the step, and a gap is formed between the adherend and the adherend. When such a gap-exposed part is exposed to high humidity, the gap becomes a path for moisture and moisture, causing a decrease in adhesive force, resulting in a contact failure (conductivity failure). Occurs.
[0007]
[Problems to be solved by the invention]
Accordingly, an object of the present invention is to provide a conductive adhesive tape that exhibits excellent moisture resistance and can exhibit stable electrical conductivity even when applied to an adherend having a non-smooth surface such as a bent portion or a step. There is to do.
[0008]
[Means for Solving the Problems]
As a result of intensive studies to achieve the above object, the present inventors can follow even if the adherend has a bent portion or a step when the base material of the auxiliary tape is made of a plastic film having specific physical properties. The inventors have found that the sealing property of the conductive adhesive tape main body can be improved, and completed the present invention.
[0009]
That is, the present invention relates to a conductive adhesive tape main body (A) in which electrical conductivity is imparted between a conductive base material and a bonding surface of an adhesive layer provided on one side of the conductive base material. And an adhesive layer provided on one side of the substrate, and an auxiliary tape (B) formed wider than the conductive adhesive tape main body (A), and the conductive adhesive tape main body ( The conductive adhesive tape in which the surface on the conductive base material side of A) and the surface on the adhesive layer side of the auxiliary tape (B) are bonded together leaving both sides in the width direction of the auxiliary tape (B). Provided is a conductive adhesive tape in which the base material of the auxiliary tape (B) is composed of a plastic film having a tensile elastic modulus of 60 kgf / mm ² or less and a stress relaxation rate of 10% or more when stretched by 10%. To do.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings as necessary.
FIG. 1 is a schematic cross-sectional view showing an example of the conductive adhesive tape of the present invention. The conductive adhesive tape T1 includes a conductive adhesive tape body 3 in which an adhesive layer 2 is provided on one side of a conductive substrate 1, and an auxiliary tape 6 in which an adhesive layer 5 is provided on one side of a substrate 4. It consists of The auxiliary tape 6 is formed wider than the conductive adhesive tape main body 3, and the surface of the conductive adhesive tape main body 3 on the conductive substrate 1 side and the surface of the auxiliary tape 6 on the adhesive layer 5 side are formed. The auxiliary tape 6 is bonded so as to leave both side portions in the width direction.
And in this example, by adding a conductive filler to the adhesive layer 2 of the conductive adhesive tape main body 3, the conductive substrate 1 and the adhesive layer 2 between the bonding surfaces of the adherend are attached. Electrical conductivity is imparted.
[0011]
The conductive substrate 1 may be any film or sheet having self-supporting properties and conductivity, but is preferably a metal foil. Examples of the metal foil material include copper, aluminum, nickel, iron, lead, and silver. The thickness of the conductive substrate 1 is not particularly limited and can be appropriately selected from the range of about 5 to 500 μm. However, from the viewpoint of the balance between strength and flexibility, the thickness is about 8 to 200 μm, particularly about 10 to 100 μm. preferable.
[0012]
As an adhesive used for the adhesive layer 2 of the conductive adhesive tape main body 3, a conventional adhesive can be used, and a pressure-sensitive adhesive is particularly preferable. The pressure-sensitive adhesive is not particularly limited, and known pressure-sensitive adhesives such as rubber-based, acrylic-based, and silicone-based adhesives can be used, but generally acrylic pressure-sensitive adhesive is used from the viewpoint of heat resistance and durability. An agent is used. The thickness of the adhesive layer 2 can be appropriately selected within a range that does not impair the conductivity in the thickness direction, and is, for example, about 3 to 300 μm, preferably about 5 to 200 μm.
[0013]
As the conductive filler, conventional ones can be used, for example, metals such as Ni, Fe, Cr, Co, Al, Sb, Mo, Cu, Ag, Pt, Au, alloys or oxides thereof, carbon black Examples thereof include carbon. These can be used alone or in combination of two or more. The filler may be powdery or fibrous.
[0014]
The adhesive layer 2 may further contain conventional additives such as tackifier resins, anti-aging agents, ultraviolet absorbers, colorants, fillers, flame retardants, antistatic agents, and rust inhibitors.
[0015]
The conductive adhesive tape main body 3 can be obtained by a conventional method used when manufacturing an adhesive tape. For example, a coating liquid containing an adhesive such as a pressure-sensitive adhesive, a conductive filler, and an appropriate crosslinking agent is applied on a release paper so as to have a desired thickness, and dried to form an adhesive layer. The conductive substrate 1 can be bonded to the adhesive layer and cut into a desired width as necessary. The release paper can be peeled off at an appropriate time, for example, when being attached to an adherend. Moreover, the electroconductive adhesive tape main body 3 can also be obtained by apply | coating the said coating liquid directly to the electroconductive base material 1, drying, and cutting as needed.
[0016]
The main feature of the present invention is that the base material 4 of the auxiliary tape 6 has a tensile elastic modulus of 60 kgf / mm ² or less (for example, 5 to 60 kgf / mm ² ), and a stress relaxation rate at 10% stretching of 40% or more ( For example, 40 to 95%).
[0017]
The tensile elastic modulus is preferably about 5 to 55 kgf / mm ² , more preferably about 10 to 50 kgf / mm ² . Moreover, the stress relaxation rate at the time of the 10% stretching is preferably about 50 to 95%, more preferably about 60 to 90%. When the tensile elastic modulus exceeds 60 kgf / mm ² , the auxiliary tape 6 cannot follow the bent portion or the step of the adherend when the conductive adhesive tape is attached to the bent portion or the stepped step. A large gap is generated between the auxiliary tape 6 and the adherend. Further, if the stress relaxation rate is less than 40%, the residual tape causes the auxiliary tape 6 to float (peel) from the adherend over time, and the gap also becomes large. For this reason, the conductive performance is significantly lowered by moisture and moisture.
[0018]
In addition, a tensile elasticity modulus is a value based on the measuring method prescribed | regulated to JISK7127 (a test piece: No. 1 type test piece [width 10mm], a tensile speed: 200 mm / min). Moreover, the stress relaxation rate at the time of 10% stretching refers to the stress relaxation rate after the film is stretched (stretched) to 10% under the tensile elastic modulus test conditions and allowed to stand for 10 minutes in that state.
[0019]
The material of the base material 4 is not particularly limited as long as it exhibits the above physical properties. For example, low-density polyethylene, polyethylene / polypropylene blend products, soft polyvinyl chloride, nylon 6, and ionomer ( Examples thereof include a polymer obtained by neutralizing (ionizing) an ethylene-methacrylic acid copolymer with Na and Zn ions. Of these, soft polyvinyl chloride and ionomer are preferable.
[0020]
Conventional additives such as an anti-aging agent, an ultraviolet absorber, a colorant, a filler, a flame retardant, an antistatic agent, and a rust inhibitor may be added to the substrate 4.
Although the thickness of the base material 4 is not specifically limited, Considering the attaching workability | operativity as a conductive adhesive tape, about 20-200 micrometers is suitable.
[0021]
The type of the adhesive used for the adhesive layer 5 of the auxiliary tape 6 is not particularly limited, and a conventional adhesive such as a known pressure-sensitive adhesive such as rubber, acrylic, or silicone can be used. From the viewpoints of heat resistance, durability, etc., an acrylic pressure sensitive adhesive is preferred. The thickness of the adhesive layer 5 is not particularly limited, and is a thickness usually employed as an adhesive sheet, for example, about 5 to 100 μm.
[0022]
The adhesive layer 5 may be added with known additives such as a tackifier resin, an antioxidant, an ultraviolet absorber, a colorant, a filler, a flame retardant, an antistatic agent, and a rust inhibitor.
[0023]
The auxiliary tape 6 can be obtained by applying a conventional method used for manufacturing an adhesive tape. For example, after applying a surface treatment (for example, primer coating treatment, corona treatment, etc.) on the base material 4 as necessary, a coating liquid containing an adhesive is applied and dried, and a desired width is obtained as necessary. It can be obtained by cutting.
The width w2 of the auxiliary tape 6 only needs to be large enough to reliably cover the conductive adhesive tape main body 3 when being attached to the adherend, but in general, the width w1 of the conductive adhesive tape main body 3 is one. About 3 to 3.0 times.
[0024]
The conductive adhesive tape T1 is formed by connecting the surface of the conductive adhesive tape body 3 on the conductive base material 1 side and the surface of the auxiliary tape 6 on the adhesive layer 5 side, with both side portions in the width direction of the auxiliary tape 6 remaining. And can be manufactured by bonding.
[0025]
The conductive adhesive tape T1 is used for electrical continuity at each circuit portion of various electronic devices, particularly for grounding. FIG. 2 is a schematic cross-sectional view showing a use state of the conductive adhesive tape T1 of FIG. In FIG. 2, 7 is a to-be-adhered body, 8 shows the electrode part. The conductive adhesive tape T1 is affixed to the adherend 7 by both sides in the width direction of the adhesive layer 2 of the conductive adhesive tape body 3 and the adhesive layer 5 of the auxiliary tape 6, and the electrode 8 and the conductive group Due to electrical conduction (in the thickness direction) between the materials 1 and electrical conduction in the longitudinal direction of the conductive base material 1, the electrode 8 and other electrodes (not shown) positioned away from the electrode 8 are not connected. The space is electrically connected.
[0026]
According to the conductive adhesive tape T1, the substrate 7 of the auxiliary tape 6 is made of a material having a relatively low elasticity and a high stress relaxation rate. Therefore, the adherend 7 has a bent portion and a step. Even if it follows, the sealing performance of the electroconductive adhesive tape main body 3 which has the electroconductive base material 1 can be improved. Therefore, moisture and moisture can be reliably prevented from entering the adhesive interface between the conductive adhesive tape T1 and the adherend 7 and stable conductive performance can be exhibited.
[0027]
FIG. 3 is a schematic cross-sectional view showing another example of the conductive adhesive tape of the present invention, and FIG. 4 is a schematic cross-sectional view showing a use state of the conductive adhesive tape of FIG.
[0028]
This conductive adhesive tape T2 has a width w3 of a conductive adhesive tape body 13 having an adhesive layer 12 provided on one side of a conductive base material 11, and a width of an adhesive layer 15 provided on one side of a base material 14. It consists of w4 auxiliary tape 16. The auxiliary tape 16 is formed wider than the conductive adhesive tape main body 13, and the surface of the conductive adhesive tape main body 13 on the conductive base material 11 side and the surface of the auxiliary tape 16 on the adhesive layer 15 side are separated. The auxiliary tape 16 is pasted together leaving both sides in the width direction.
[0029]
In this example, the conductive adhesive tape main body 13 is formed with a conductive portion 17 extending from the conductive base material 11, penetrating the adhesive layer 12, and having a terminal portion 18 at the tip thereof. Electrical conductivity is imparted between the conductive substrate 11 and the adhesive surface of the adhesive layer 12. The conductive adhesive tape T2 and the conductive adhesive tape T1 shown in FIG. 1 are disposed between the conductive base material and the adhesive layer surface (adhesion surface to the adherend) in the conductive adhesive tape body. Only the means for imparting electrical conductivity is different, and the other points are common.
[0030]
The conductive adhesive tape main body 13 can be manufactured by the method described in Japanese Utility Model Publication No. 63-46980 or Japanese Patent Application Laid-Open No. 8-185714. For example, an adhesive such as a pressure sensitive adhesive and, if necessary, a coating liquid containing a crosslinking agent or an additive is applied to the surface of the conductive substrate 11 to a desired thickness and dried. After forming the adhesive layer 12, the conductive base material 11 is drawn into a cylindrical shape using a punch-shaped male die and a female die to form a conductive portion 17, and then the tip of the cylindrical portion is formed by pressing. Can be manufactured by horizontally bending the connector 18 to form the terminal portion 18. A plurality of conducting portions 17 are usually formed at appropriate intervals.
[0031]
The conductive adhesive tape T2 is attached to the adherend 7 by the both sides in the width direction of the adhesive layer 12 of the conductive adhesive tape body 13 and the adhesive layer 15 of the auxiliary tape 16, and the electrode 8 and the conductive layer are electrically conductive. Due to the electrical conduction in the thickness direction through the conduction part 17 between the base materials 11 and the electrical conduction in the longitudinal direction of the conductive base material 11, the electrodes 8 and other electrodes arranged at positions separated from the electrodes 8 Etc. (not shown) are electrically connected.
[0032]
Also in the conductive adhesive tape T2, since the base material 14 of the auxiliary tape 16 is made of a material having relatively low elasticity and a high stress relaxation rate, the same effects as the conductive adhesive tape T1 are achieved. The
[0033]
【The invention's effect】
According to the conductive adhesive tape of the present invention, even if the adherend has a non-smooth surface such as a bent portion or a step, it exhibits excellent moisture resistance and can exhibit stable electrical conductivity.
[0034]
【Example】
EXAMPLES Next, although this invention is demonstrated more concretely based on an Example, this invention is not limited at all by these Examples. Hereinafter, “parts” means “parts by weight”.
[0035]
Reference example 1
85 parts of 2-ethylhexyl acrylate, 10 parts of vinyl acetate, 5 parts of acrylic acid, 0.1 part of N, N′-azobisisobutyronitrile and 200 parts of toluene are placed in a flask, and after replacing with nitrogen, at 60 ° C. for 20 hours. The copolymerization reaction was advanced by stirring and mixing to prepare an acrylic copolymer solution.
[0036]
Reference example 2
In the copolymer solution obtained in Reference Example 1, 35 parts of rosin tackifier resin, 5 parts of carbon black, 30 parts of nickel powder, 0.15 part of aluminum chelate dispersant, 3 parts of a tolylene diisocyanate adduct of methylolpropane was added, and an appropriate amount of toluene was added for viscosity adjustment, followed by stirring to prepare a conductive filler-containing acrylic pressure-sensitive adhesive solution.
[0037]
Reference example 3
To the copolymer solution obtained in Reference Example 1, 35 parts of a rosin-based tackifier resin and 3 parts of a tolylene diisocyanate adduct of trimethylolpropane are added to 100 parts of this solid content, and for viscosity adjustment. An appropriate amount of toluene was added and stirred to prepare an acrylic pressure-sensitive adhesive solution.
[0038]
Reference example 4
The conductive filler-containing acrylic pressure-sensitive adhesive solution obtained in Reference Example 2 is coated and heat-dried on release paper to form an adhesive layer having a thickness of 45 μm, and this is bonded to a 35 μm rolled copper foil. The electroconductive adhesive tape main body in this invention was obtained.
[0039]
Reference Example 5
The acrylic pressure-sensitive adhesive solution obtained in Reference Example 3 was coated on a release paper and dried by heating to form an adhesive layer having a thickness of 45 μm, which was bonded to a 35 μm rolled copper foil. Next, holes penetrating the adhesive layer from the copper foil side (holes of about 0.5 to 1.0 mm) are drilled at intervals of 3 mm, and terminal portions are formed on the surface of the adhesive layer. A tape body was obtained.
[0040]
Reference Example 6
After applying a vinyl chloride primer on the surface of a commercially available soft vinyl chloride film having a thickness of 60 μm (tensile modulus 40 kgf / mm ² , stress relaxation rate 80% when stretched 10%), acrylic type of Reference Example 3 The pressure sensitive adhesive solution was applied and dried to a dry thickness of 25 μm to obtain an auxiliary tape.
[0041]
Reference Example 7
An ionomer resin [manufactured by Mitsui DuPont Chemical Co., Ltd., Hyramine 1705] was extruded to a thickness of 40 μm and subjected to corona treatment on one side. The acrylic pressure-sensitive adhesive solution of Reference Example 3 was applied and dried to this film (tensile elastic modulus 28 kgf / mm ² , stress relaxation rate 64% when stretched 10%) to a dry thickness of 25 μm to obtain an auxiliary tape. .
[0042]
Reference Example 8
The acrylic pressure-sensitive adhesive solution of Reference Example 3 was dried on a commercially available polypropylene / polyethylene blend film having a thickness of 40 μm (tensile elastic modulus 30 kgf / mm ² , stress relaxation rate 55% when stretched 10%, single-sided corona treatment). It was applied and dried to a thickness of 25 μm to obtain an auxiliary tape.
[0043]
Reference Example 9
The acrylic pressure-sensitive adhesive solution of Reference Example 3 was dried to a commercially available low-density polyethylene film having a thickness of 40 μm (tensile modulus 20 kgf / mm ² , stress relaxation rate 47% when stretched 10%, single-sided corona treatment). The auxiliary tape was applied and dried to 25 μm.
[0044]
Reference Example 10
The acrylic pressure-sensitive adhesive solution of Reference Example 3 was dried to a thickness of 25 μm on a commercially available stretched polypropylene film having a thickness of 40 μm (tensile modulus 200 kgf / mm ² , stress relaxation rate 44% when stretched 10%, single-sided corona treatment). Then, it was applied and dried to obtain an auxiliary tape.
[0045]
Reference Example 11
A commercially available polyester film having a thickness of 50 μm (tensile elastic modulus 400 kgf / mm ² , stress relaxation rate 36% when stretched 10%) is applied and dried so that the acrylic pressure-sensitive adhesive solution of Reference Example 3 has a dry thickness of 25 μm. An auxiliary tape was obtained.
[0046]
Reference Example 12
The acrylic pressure-sensitive adhesive solution of Reference Example 3 was dried on a commercially available non-stretched polypropylene film having a thickness of 40 μm (tensile modulus 90 kgf / mm ² , stress relaxation rate 55% when stretched 10%, single-sided corona treatment). The auxiliary tape was applied and dried to 25 μm.
[0047]
Example 1
The conductive adhesive tape main body of Reference Example 4 was bonded to the copper foil side of 15 mm width so that the auxiliary tape 25 mm width of Reference Example 6 was aligned with the center line of both, and the conductive adhesive tape of the present invention was produced.
[0048]
Example 2
A conductive adhesive tape of the present invention was produced in the same manner as in Example 1 except that the auxiliary tape of Reference Example 9 was used instead of the auxiliary tape of Reference Example 6.
[0049]
Example 3
The conductive adhesive tape main body of Reference Example 5 was bonded to the 15 mm wide silver foil side of the auxiliary tape of Reference Example 6 with a width of 25 mm so that the center lines of the two matched, and the conductive adhesive tape of the present invention was produced.
[0050]
Example 4
A conductive adhesive tape of the present invention was produced in the same manner as in Example 3, except that the auxiliary tape of Reference Example 7 was used instead of the auxiliary tape of Reference Example 6.
[0051]
Example 5
A conductive adhesive tape of the present invention was produced in the same manner as in Example 3 except that the auxiliary tape of Reference Example 8 was used instead of the auxiliary tape of Reference Example 6.
[0052]
Example 6
A conductive adhesive tape of the present invention was produced in the same manner as in Example 3 except that the auxiliary tape of Reference Example 9 was used instead of the auxiliary tape of Reference Example 6.
[0053]
Comparative Example 1
A conductive adhesive tape was produced in the same manner as in Example 1 except that the auxiliary tape of Reference Example 10 was used instead of the auxiliary tape of Reference Example 6.
[0054]
Comparative Example 2
A conductive adhesive tape was produced in the same manner as in Example 1 except that the auxiliary tape of Reference Example 11 was used instead of the auxiliary tape of Reference Example 6.
[0055]
Comparative Example 3
A conductive adhesive tape was produced in the same manner as in Example 1 except that the auxiliary tape of Reference Example 12 was used instead of the auxiliary tape of Reference Example 6.
[0056]
Comparative Example 4
A conductive adhesive tape was produced in the same manner as in Example 3 except that the auxiliary tape of Reference Example 10 was used instead of the auxiliary tape of Reference Example 6.
[0057]
Comparative Example 5
A conductive adhesive tape was produced in the same manner as in Example 3 except that the auxiliary tape of Reference Example 11 was used instead of the auxiliary tape of Reference Example 6.
[0058]
Comparative Example 6
A conductive adhesive tape was produced in the same manner as in Example 3 except that the auxiliary tape of Reference Example 12 was used instead of the auxiliary tape of Reference Example 6.
[0059]
Experimental example (measurement of contact resistance)
A double-sided tape having a thickness of 50 μm was applied to one side of a copper foil having a length of 50 mm, a width of 5 mm, and a thickness of 35 μm.
Similarly, a double-sided tape having a thickness of 100 μm was attached to one side of the copper foil to form an electrode having a step of 135 μm.
Next, the conductive adhesive tapes obtained in Examples 1 to 6 and Comparative Examples 1 to 6 are each cut into a length of 130 mm and straddle the electrodes formed in parallel in an atmosphere of 23 ° C. and a relative humidity of 65%. Thus, it was pressed and stuck with a 5 kg rubber roller.
[0060]
The resistance value between two electrodes formed in parallel was measured with a multi-tester and used as an initial value. Next, each glass plate with a conductive adhesive tape attached is placed in an atmosphere of 40 ° C. and 92% relative humidity for 100 hours, then left in an atmosphere of 23 ° C. and 65% relative humidity for 30 minutes, and again between the two electrodes The resistance value of was measured. The results are shown in Table 1.
[Table 1]

As is apparent from Table 1, the conductive adhesive tapes of Examples 1 to 6 exhibit excellent moisture resistance and can exhibit stable conductive performance even if there is a step in the electrode part.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing an example of a conductive adhesive tape of the present invention.
2 is a schematic cross-sectional view showing a use state of the conductive adhesive tape of FIG.
FIG. 3 is a schematic cross-sectional view showing another example of the conductive adhesive tape of the present invention.
4 is a schematic cross-sectional view showing a use state of the conductive adhesive tape of FIG.
[Explanation of symbols]
T1, T2 Conductive adhesive tape 1,11 Conductive base material 2,12 Adhesive layer 3,13 Conductive adhesive tape body 4,14 Base material 5,15 Adhesive layer 6,16 Auxiliary tape 7 Substrate 8 Electrode Part
17 Conduction part
18 Terminal

Claims (1)

A conductive adhesive tape main body (A) to which electrical conductivity is imparted between the conductive substrate and the adhesive surface of the adhesive layer provided on one side of the conductive substrate, and one side of the substrate And an auxiliary tape (B) formed wider than the conductive adhesive tape body (A), and a conductive group of the conductive adhesive tape body (A). The surface of the material side and the surface of the auxiliary tape (B) on the adhesive layer side are conductive adhesive tapes that are bonded together leaving both sides in the width direction of the auxiliary tape (B), and the auxiliary tape (B ) Is formed of a plastic film having a tensile modulus of 60 kgf / mm ² or less and a stress relaxation rate of 10% or more when stretched by 10%.

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