JP3967641B2 - Curing board and floor curing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a curing board and a floor surface curing method that can reduce fixing work with a curing tape and can reliably prevent damage and contamination of the floor surface due to intrusion of sand and dust.
[0002]
[Prior art and problems to be solved by the invention]
Inside the building under construction, protect the finished floor with a curing material so that it will not be damaged or contaminated during subsequent work (wall or ceiling construction, etc.) It is widely done. Also, the floor surface is often protected with a curing material when moving in and out of moving luggage.
As a general curing method for such a floor surface, there is a method in which a curing sheet is attached to the entire floor surface with a curing tape, and a board such as plywood is fixed on the sheet using the curing tape. Curing sheets used in such methods are often embossed for the purpose of imparting resilience and preventing diffusion when dust enters. There is a problem that the board cannot be fixed sufficiently on the top. For example, when the board is warped, the curing tape may be peeled off. Furthermore, since the curing sheet and the board are each fixed by the curing tape, the amount of the curing tape used is increased, and the fixing work is troublesome.
[0003]
As a conventional curing material for a floor surface, a curing board having a three-layer structure in which an embossed sheet, a hard cardboard, and a foamed sheet are laminated is known. In this curing material, since the embossed sheet and the hard cardboard are integrated in advance, the fixing work can be reduced. However, when this curing material is laid directly on the floor surface, sand, dust, dropped paint, etc. may enter through the gaps between the curing materials and damage or contaminate the floor surface. On the other hand, in order to prevent such inconvenience, when the curing material is arranged after the curing sheet is laid on the entire floor surface, the fixing work is not reduced. Furthermore, in this curing material, if it is not fixed to the floor surface with a large amount of curing tape, there is a possibility that a deviation occurs or a gap is formed between the floor surface.
[0004]
Therefore, an object of the present invention is to reduce the fixing work by the curing tape, and to surely prevent damage and contamination of the floor surface due to the intrusion of sand, dust, etc., and the curing board and the floor surface. The purpose is to provide a curing method.
[0005]
[Means for Solving the Problems]
The present invention is a rectangular or parallelogram-shaped board, curing sheets a curing board formed by laminating integrally the curing sheet is formed of a flexible material than the material for forming the board, and the An extension portion extending from two adjacent side edges of the four side edges of the board ;
The above object is achieved by providing a curing board in which a warpage preventing groove is formed on the surface of the board.
[0006]
The present invention is a floor surface curing method for curing a floor surface using a plurality of the curing boards, wherein the other curing boards are arranged adjacent to each other in a direction along one side edge of the one curing board. And a step of arranging another curing board adjacently in a direction along the other side edge of the one curing board, and in both the steps, the curing sheet on the one curing board. By providing a curing method of the floor surface on which the side edge portion of the other curing board or the other curing board on the side where the curing sheet is not extended is placed on the extension part of the above, The purpose of this is achieved.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on preferred embodiments.
First, an embodiment of the curing board of the present invention will be described.
As shown in FIGS. 1 to 3, the curing board 1 of the present embodiment is integrally formed with a rectangular (rectangular) board 2 in plan view and a rectangular curing sheet 3 in plan view. It is laminated.
[0008]
The board 2 is a plate-like body made of paperboard. As the paperboard, various known materials such as water-resistant paper tube base paper can be used. Examples of other forming materials for the board include a hollow lightweight structural plate made of a synthetic resin such as polypropylene and polyethylene, and a foam molded body made of a synthetic resin such as polystyrene.
A warpage preventing groove 5 is formed on the surface of the board 2. The groove 5 for warpage prevention is formed by cutting the surface with a cutter, and can be effectively prevented from warping by being formed in two vertical and horizontal directions (two directions intersecting each other). By providing the groove 5 for preventing warpage, it is possible to reliably prevent a gap from being generated between the curing board and the floor surface. As another method of forming the groove 5 for preventing warping, formation of a compression line by embossing can be exemplified.
[0009]
The curing sheet 3 is at least more flexible than the board 2, and various known sheets can be used without particular limitation as the curing sheet. Examples of the material for forming the curing sheet 3 include embossed paper, embossed synthetic resin sheet, synthetic resin foam sheet such as polyethylene, and laminated paper of polyethylene and other synthetic resin sheet and paper. Among them, among these, embossed paper is preferable.
[0010]
The board 2 and the curing sheet 3 are joined and integrated. The contact surfaces between the board 2 and the curing sheet 3 are substantially bonded to each other. The phrase “substantially the entire surface is bonded” means to include the case where both are partially bonded by dispersed points, lines, or the like extending over the entire contact surface. As a bonding method between the two, various known bonding methods such as heat fusion can be adopted in addition to bonding with an adhesive.
[0011]
As shown in FIG. 1, the curing sheet 3 has an extension portion 4 that extends from adjacent two side edges 2 a and 2 b of the four side edges 2 a to 2 d of the board 2.
In detail, the board 2 and the curing sheet 3 have substantially the same shape in plan view, and as shown in FIG. Accordingly, the curing sheet 3 does not extend from the side edges 2c and 2d other than the two side edges 2a and 2b among the four side edges 2a to 2d of the board 2.
[0012]
The widths W1 and W2 of the extending portions 4 extending from the adjacent two side edges 2a and 2b of the board 2 are 20 mm or more, particularly 25 to 35 mm, respectively. This is preferable from the viewpoint of preventing damage and contamination of the floor surface due to intrusion of sand, dust, dripped paint, or the like.
[0013]
Next, an embodiment of the method for curing a floor surface of the present invention will be described with reference to FIGS. 2 and 3 by taking as an example the case of using the curing board 1 described above.
FIG. 2 is a diagram showing a method for curing the floor surface of a building under construction. As shown in the figure, the floor surface is already finished with a woody finishing material such as a flooring material.
[0014]
In the method of the present embodiment, in order to cure this floor surface, the three curing boards 1 are arranged in a row from the front side of the figure to the far side wall along the left wall of FIG. Then, after the one row is arranged, the next one row is similarly arranged from the near side toward the wall on the other side. Similarly, the curing board 1 is arranged for each row, and the curing board is arranged on the entire floor surface.
For convenience of explanation, considering the curing board 1 (1A) in the front center of FIG. 2, in the method of this embodiment, another curing board is arranged in the direction P along one side edge 1a of the curing board 1A. While arrange | positioning 1B adjacent, another curing board 1C is arrange | positioned adjacent to the direction Q along the other side edge 1b of curing board 1A. Curing boards 1B and 1C have the same configuration as curing board 1A.
When the curing board 1A is disposed, the extending portion 4 of the curing sheet extending from each of the two side edges 2a and 2b of the board 2 in the curing board 1A is partially fixed by the curing tape 6.
[0015]
When the curing board 1B is disposed adjacent to the curing board 1A, the curing board is placed on the extension part (extension part extending from the side edge 2b of the board) 4 of the curing sheet in the curing board 1A. In 1B, the side edge 12 on the side where the curing sheet does not extend is placed. Further, when the curing board 1C is disposed adjacent to the curing board 1A, the extension portion of the curing sheet (an extension portion extending from the side edge 2a of the board) fixed on the curing tape 6 in the curing board 1A. 4) Place the side edge 11 on the side of the curing board 1C where the curing sheet is not extended.
[0016]
The method for arranging the curing board 1A and the method for arranging the curing board B and the curing board C adjacent to the curing board 1A are basically the same for other curing boards. However, in the part which collides with a wall, appropriate processes, such as a cutting | disconnection of the extension part 4 and a cutting | disconnection of a curing board, are performed. Moreover, in this embodiment, although the clearance gap between the boards 2 and 2 is block | closed with the curing tape 7, this can also be abbreviate | omitted. As the curing tapes 6 and 7, various known tapes can be used without particular limitation.
[0017]
According to the curing board 1 of this embodiment, since the board 2 and the curing sheet 3 are integrated and the curing sheet 3 extends from the board 2, the extension portion 4 is partially covered with a small amount of curing tape. Therefore, the curing board 1 can be stably fixed to the floor surface. Moreover, in the state where the curing boards are arranged adjacent to each other, the extension portion 4 of the curing sheet is present below the gap between the boards 2, so that sand, dust, paint, etc. that have entered the gap between the boards 2 are present. Can prevent floor damage and contamination.
[0018]
Moreover, according to the curing method of the floor surface of this embodiment, the side edge part of an adjacent curing board is mounted on the extension part 4 of one curing board, The floor of said one curing board Since the installation stability with respect to the surface is improved, the amount and fixing work of the curing tape for fixing the curing board can be further reduced.
[0019]
As mentioned above, although each embodiment of the curing board of the present invention and the curing method of a floor surface was shown and explained, each invention is not restricted to the above-mentioned embodiment and can be variously changed.
[0020]
For example, the curing board 1 ′ shown in FIG. 4 is another embodiment of the curing board of the present invention. In the curing board 1 ′, the curing sheet 3 having a larger outer dimension than the board 2 is provided on the board 2. By integrating the layers, an extending portion 4 extending from the two side edges 2a and 2b of the board 2 is formed.
Moreover, although the board 2 in each said embodiment was rectangular shape, it can replace with this and a parallelogram-shaped board can also be used.
[0021]
【The invention's effect】
According to the present invention, it is possible to reduce the fixing work with the curing tape, and it is possible to surely prevent the floor surface from being damaged or contaminated by the intrusion of sand, dust, etc., and the curing method of the floor surface. Can be provided.
[Brief description of the drawings]
FIG. 1 is a plan view showing a curing board as one embodiment of the present invention.
FIG. 2 is a diagram showing a floor surface curing method using the curing board of FIG. 1;
FIG. 3 is a cross-sectional view taken along line XX of FIG.
FIG. 4 is a plan view showing a curing board as another embodiment of the present invention.
[Explanation of symbols]
1, 1A-1C Curing board 2 Boards 2a, 2b Adjacent two side edges 3 Curing sheet 4 Extension part 5 Warpage prevention groove 6 Curing tape

Claims (4)

A curing board in which a curing sheet is integrally laminated on a rectangular or parallelogram board ,
The curing sheet is formed of a material softer than the forming material of the board, and has an extending portion that extends from two adjacent side edges of the four side edges of the board ,
A curing board in which grooves for preventing warpage are formed on the surface of the board. The curing board according to claim 1, wherein the forming material of the curing sheet is embossed paper, embossed synthetic resin sheet, synthetic resin foam sheet, or laminated paper of synthetic resin sheet and paper. . The curing board according to claim 1 or 2 , wherein the board and the curing sheet have substantially the same shape in plan view. A curing method for a floor surface using a plurality of the curing boards according to claim 1, wherein the floor surface is cured.
A step of placing another curing board adjacent in a direction along one side edge of the one curing board, and a further other curing board adjacent in a direction along the other side edge of the one curing board. In both of the steps, the curing sheet on the other curing board or the further curing board is extended on the extension portion of the curing sheet on the one curing board. A method for curing the floor surface on which the side edge of the side that has not been placed is placed.

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