JP3967534B2 - Radiation beam equipment irradiated object cassette - Google Patents

Radiation beam equipment irradiated object cassette Download PDF

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Publication number
JP3967534B2
JP3967534B2 JP2000286660A JP2000286660A JP3967534B2 JP 3967534 B2 JP3967534 B2 JP 3967534B2 JP 2000286660 A JP2000286660 A JP 2000286660A JP 2000286660 A JP2000286660 A JP 2000286660A JP 3967534 B2 JP3967534 B2 JP 3967534B2
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Japan
Prior art keywords
irradiated object
cassette
radiation beam
beam apparatus
push
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JP2000286660A
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JP2002100550A (en
Inventor
谷 安 秀 藤
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Jeol Ltd
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Jeol Ltd
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  • Measuring Temperature Or Quantity Of Heat (AREA)

Description

【0001】
【発明の属する分野】
本発明は、被照射物の温度を直接測定出来るように成した放射ビーム装置の被照射物カセットに関する。
【0002】
【従来の技術】
図1は電子ビーム描画装置の1概略例を示したものである。図中1は、電子銃2,集束レンズ(図示せず),ビーム断面成形手段(例えば、それぞれ正方形のスリットを有する上下2枚の成形スリット、該スリット間に配置された成形レンズ及び成形用偏向器から成り、上方成形スリットを通過したビームの下方スリット上ので位置を成形用偏向器でコントロールすることにより、任意の大きさの正方形状若しくは矩形状断面のビームを作成する手段)、位置決め用偏向器(図示せず)等を備えた電子光学系鏡筒、3はステージ4等が設けられた描画室である。尚、前記電子光学系鏡筒1や描画室3にはそれぞれ排気口(図示せず)を介して排気手段(図示せず)が繋がれている。
【0003】
この様な装置において、描画室3の外部において、被描画材料を保持させたカセット5を、描画室3に設けられているゲート(図示せず)を介して搬送手段(図示せず)によりステージ4上にセットする。そして、制御装置(図示せず)からのパターンデータに基づいて、描画すべきパターンの形状及び大きさのデータに基づく成型用データをビーム断面成形手段の成型用偏向器に送り、パターン描画位置データを位置決め用偏向器(図示せず)に送ることにより、断面を成形した電子銃2からの電子ビームを被描画材料上の所定の位置にショットさせ、パターンを描くようにしている。
【0004】
近年、この様な電子ビーム描画装置は、益々高密度化する半導体素子の製作になくてはならない存在となっている。又、一方では、この様な電子ビーム描画装置において、この様な半導体素子の高密度化に伴ってパターン描画精度の向上化が計られている。
【0005】
さて、前記被描画材料は外部の温度変化により温度変化を起こし、該温度変化に基づく歪みを発生する。この様な歪みを発生すると、描画精度の低下が起きる。
【0006】
【発明が解決しようとする課題】
そこで、例えば、カセット5の温度を、例えば、各領域描画毎に測定する事により、被描画材料の温度を類推し、温度と描画領域とを対応づけてデータ上で管理している。尚、測定した温度に基づいてカセット(即ち、被描画材料)の温度を所定の温度にコントロールしたり、被描画材料の歪み分だけ電子ビームのショット位置を補正したりすることも考えられるが、実際にはこの様なコントロールや補正を首尾良く行うことは難しい。
【0007】
しかしながら、カセット5の温度を測定することにより、被描画材料の温度を類推しているので、実際の被描画材料の温度が得られないのが現状である。
【0008】
尚、最近、被描画材料の1つであるウェハの中心部と端部の中間辺りの下面に温度センサーを当てウェハの温度を直接測るものが提案されているが、これでは、ウェハのパターン描画領域内に歪みが発生する恐れがあり、描画精度に影響を及ぼすことになる。
本発明は、この様な問題点を解決する為になされたもので、新規な放射ビーム装置の材料カセットを提供することを目的とする。
【0009】
【課題を解決するための手段】
本発明に基づく放射ビーム装置の被照射物カセットは、被照射物を異なる複数箇所において、カセット本体に取り付けられた複数対の上面支持部材と下面支持部材とで上下両面から挟んで被照射物を支持するように成した放射ビーム装置の被照射物カセットにおいて、前記各支持部材の少なくとも1つに被照射物に接触するように温度センサを設けたことを特徴とする。
【0010】
【発明の実施の形態】
以下、図面を参照して本発明の実施の態様の形態を詳細に説明する。
【0011】
図2は本発明の一例として示した被照射物カセットの概略図、図3は図2のA−A′断面図である。
【0012】
図中11はカセット本体で、天井部分が吹き抜けの空間部12を有している。該空間部12は二階構造になっており、1階空間部13と2階空間部14とから成り、該2つの空間部の間は押上ホルダ支持板20で仕切られている。
【0013】
前記カセット本体11の上面三箇所には、上面規制板15A,15B,15Cが取り付けられている。該各上面規制板の先端部下面は半球状に形成されている。
【0014】
該各上面規制板の位置にそれぞれ対応する前記押上ホルダ支持板20の位置に、押上ホルダー16A,16B,16C(16Cは図示されていない)が上下方向に滑動可能にはめ込まれている。
【0015】
該各押上ホルダーは、その上方先端部は半球状の有底筒体を成しており、各半球状部の頂点と前記各上面規制板の半球状部の頂点とが光軸Oに平行な同一軸Qa,Qb,Qc(Qcは図示せず)上に位置するように、各押上ホルダーは支持板20に取り付けられている。
【0016】
一方、前記支持板20の下面の各押上ホルダー16A,16B,16Cに対向する箇所に、押上ばね支持体17A,17B,17C(17Cは図示されていない)が取り付けられている。該各押上ばね支持体の内部の凸部18A,18B,18C(18B,18Cは図示されていない)には、その先端部が対向する前記押上ホルダーの内部の底面を上方へ押圧する様に、押上ばね19,19B,19C(19B,19Cは図示されていない)が取り付けられている。
【0017】
前記押上ホルダー16Aの半球状底部の中心には孔が開けられており、ここに、該半球状底部の曲率半径と同一曲率半径の曲面を有する温度センサー21が取り付けられている。22は該センサーからの温度信号を電気的に取り出すためのリード線で、その一方の端部は、カセット本体11の側壁23に絶縁スペーサ24A,24Bを介して嵌挿されている外部端子25に繋がれている。尚、前記押上ばね支持体17Aの凸部18Aの中心には温度センサー21の一部を通すための孔26が開けられている。
【0018】
この様な構成の材料カセットに被描画材料をセットする場合、図示しない押上ホルダー下降手段により、各押上ばね19A,19B,19Cに抗して押上ホルダー16A,16B,16Cを適宜、軸Qa,QB,Qcに沿って下降させておき、その状態で被描画材料27を空間部14に入れる。この際、被描画材料27のエッジ部にある非描画領域の所定の三箇所が、各上面規制板15A,15B,15Cの半球状面中心点と、各押上ホルダー16A,16B,16Cの半球状面中心点に挟まれる位置に来る様に、被描画材料27を空間部14に入れる。そして、ホルダー下降手段による下降状態を解除することにより、各押上ばね19A,19B,19Cの押圧によって、被描画材料27を前記三点において、上面規制板と押上ホルダーにて支持させる。
【0019】
この様にして被描画材料27を支持させたカセットを図1に示す如き描画室3内のステージ4上にセットする。尚、カセットをステージ4上にセットした時に、外部端子25の一方の先端が、描画室3の側壁をOリングなどを介して貫通させて設けられている端子体(図示せず)の端部に接触するように構成されている。
【0020】
そして、電子ビームによる被描画材料上への描画が開始される。該描画において、時々刻々と温度センサー21が測定した被描画材料27の温度信号がリード線22,外部端子25及び端子体(図示せず)を通じて外部に取り出され、例えば、被描画材料上の各フィールド描画と対応づけられて、被描画材料直接の温度が得られる。この様な装置においては、被描画材料の三点の支持部は被描画材料の非描画領域にあり、温度センサー21は、被描画材料の支持を担っている押上ホルダーの半球状面部の中心部を成すように押上ホルダーに取り付けられているので、被描画材料が歪む心配がない。
尚、前記例では上面規制板及び押上ホルダーの先端部の被描画材料に対向する部分を半球状状に形成したが、被描画材料に点接触出来するならば、他の曲状面に形成してても良い。
【0021】
又、前記例では3点にて被描画材料を支持するように成したが、3点に限定されず、例えば、4点でも良い。
【0022】
又、前記例ではガラスの様なマスク材を被照射物として説明したが、この様なマスク材に限定されず、例えば、ウェハの如き半導体材料等の被照射物を支持するカセットについても本発明は応用可能である。
【0023】
又、前記例では、電子ビーム描画装置で使用される被照射物カセットについて説明したが、イオンビーム描画装置若しくはレーザー描画装置等で使用される被照射物カセット、或いは、大型試料を観察若しくは検査するような走査型電子顕微鏡等に使用される試料カセット等についても本発明は応用可能である。
【図面の簡単な説明】
【図1】 荷電粒子ビーム装置の一例として、電子ビーム描画の1概略例を示したものである。
【図2】 本発明の一例として示した被照射物カセットの概略図である。
【図3】 図2のA−A′断面図である。
【番号の説明】
1…電子光学系鏡筒
2…電子銃
3…描画室
4…ステージ
5…カセット
11…カセット本体
12,13,14…空間部
15A,15B,15C…上面規制板
16A,16B,16C…押上ホルダー
17A,17B,17C…押上ばね支持体
18A,B,18C…凸部
19A,19B,19C…押上ばね
20…押上ホルダ支持板
21…温度センサー
22…リード線
23…側壁
24A,24B…絶縁スペーサー
25…外部端子
26…孔
27…被描画材料
[0001]
[Field of the Invention]
The present invention relates to an irradiated object cassette of a radiation beam apparatus that can directly measure the temperature of an irradiated object.
[0002]
[Prior art]
FIG. 1 shows one schematic example of an electron beam drawing apparatus. In the figure, reference numeral 1 denotes an electron gun 2, a focusing lens (not shown), beam section shaping means (for example, two upper and lower molding slits each having a square slit, a molding lens disposed between the slits, and a molding deflection. A means for creating a beam with a square or rectangular cross section of any size by controlling the position on the lower slit of the beam that has passed through the upper shaping slit with a shaping deflector), and positioning deflection An electron optical system barrel 3 equipped with a container (not shown), etc., 3 is a drawing chamber provided with a stage 4 and the like. Note that exhaust means (not shown) is connected to the electron optical system barrel 1 and the drawing chamber 3 via exhaust ports (not shown).
[0003]
In such an apparatus, outside the drawing chamber 3, the cassette 5 holding the drawing material is staged by a conveying means (not shown) via a gate (not shown) provided in the drawing chamber 3. 4 Set on top. Based on the pattern data from the control device (not shown), the molding data based on the shape and size data of the pattern to be drawn is sent to the molding deflector of the beam section shaping means, and the pattern drawing position data Is sent to a positioning deflector (not shown) to cause the electron beam from the electron gun 2 having a shaped cross section to be shot at a predetermined position on the drawing material, thereby drawing a pattern.
[0004]
In recent years, such an electron beam lithography apparatus has become indispensable for the production of semiconductor elements with higher density. On the other hand, in such an electron beam drawing apparatus, the pattern drawing accuracy is improved with an increase in the density of such semiconductor elements.
[0005]
Now, the drawing material undergoes a temperature change due to an external temperature change, and generates a strain based on the temperature change. When such a distortion occurs, the drawing accuracy decreases.
[0006]
[Problems to be solved by the invention]
Therefore, for example, by measuring the temperature of the cassette 5 for each area drawing, for example, the temperature of the drawing material is estimated, and the temperature and the drawing area are associated with each other and managed on the data. Although it is possible to control the temperature of the cassette (that is, the material to be drawn) to a predetermined temperature based on the measured temperature, or to correct the shot position of the electron beam by the amount of distortion of the material to be drawn, In practice, it is difficult to perform such controls and corrections successfully.
[0007]
However, since the temperature of the drawing material is estimated by measuring the temperature of the cassette 5, the actual temperature of the drawing material cannot be obtained at present.
[0008]
Recently, it has been proposed to directly measure the temperature of the wafer by applying a temperature sensor to the lower surface near the center and end of the wafer, which is one of the drawing materials. There is a possibility that distortion occurs in the region, which affects the drawing accuracy.
The present invention has been made to solve such problems, and an object of the present invention is to provide a material cassette for a new radiation beam apparatus.
[0009]
[Means for Solving the Problems]
The irradiated object cassette of the radiation beam apparatus according to the present invention is configured such that the irradiated object is sandwiched from above and below by a plurality of pairs of upper surface support members and lower surface support members attached to the cassette body at a plurality of different positions. In the irradiated object cassette of the radiation beam apparatus to be supported, a temperature sensor is provided on at least one of the supporting members so as to contact the irradiated object.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0011]
FIG. 2 is a schematic view of the irradiated object cassette shown as an example of the present invention, and FIG. 3 is a cross-sectional view taken along the line AA ′ of FIG.
[0012]
In the figure, reference numeral 11 denotes a cassette body, which has a space 12 whose ceiling portion is blown out. The space portion 12 has a two-story structure, and includes a first-floor space portion 13 and a second-floor space portion 14, and the two space portions are partitioned by a push-up holder support plate 20.
[0013]
Upper surface restricting plates 15A, 15B, and 15C are attached to three positions on the upper surface of the cassette body 11. The lower surface of the tip of each upper surface regulating plate is formed in a hemispherical shape.
[0014]
Push-up holders 16A, 16B, and 16C (16C not shown) are slidably fitted in the vertical direction at the positions of the push-up holder support plate 20 corresponding to the positions of the upper surface regulating plates.
[0015]
Each push-up holder has a semispherical bottomed cylinder at its upper tip, and the apex of each hemispherical part and the apex of the hemispherical part of each upper surface regulating plate are parallel to the optical axis O. Each push-up holder is attached to the support plate 20 so as to be positioned on the same axis Qa, Qb, Qc (Qc is not shown).
[0016]
On the other hand, push-up spring supports 17A, 17B, and 17C (17C not shown) are attached to locations on the lower surface of the support plate 20 that face the push-up holders 16A, 16B, and 16C. The convex portions 18A, 18B, and 18C (18B and 18C are not shown) inside each of the push-up spring supports are configured so that the bottom portion of the push-up holder facing the tip portion presses upward. Push-up springs 19, 19B, 19C (19B, 19C are not shown) are attached.
[0017]
A hole is formed in the center of the hemispherical bottom of the push-up holder 16A, and a temperature sensor 21 having a curved surface having the same radius of curvature as that of the hemispherical bottom is attached to the hole. Reference numeral 22 denotes a lead wire for electrically taking out a temperature signal from the sensor, and one end of the lead wire is connected to an external terminal 25 which is inserted into the side wall 23 of the cassette body 11 via insulating spacers 24A and 24B. It is connected. In addition, a hole 26 through which a part of the temperature sensor 21 passes is formed in the center of the convex portion 18A of the push-up spring support 17A.
[0018]
When the material to be drawn is set in the material cassette having such a structure, the push-up holders 16A, 16B, and 16C are appropriately moved to the axes Qa and QB against the push-up springs 19A, 19B, and 19C by push-up holder lowering means (not shown). , Qc, and the drawing material 27 is put into the space 14 in this state. At this time, predetermined three portions of the non-drawing region at the edge portion of the drawing material 27 are the hemispherical center point of each of the upper surface regulating plates 15A, 15B, 15C and the hemispherical shape of each of the push-up holders 16A, 16B, 16C. The drawing material 27 is placed in the space portion 14 so as to come to a position between the surface center points. Then, by releasing the lowered state by the holder lowering means, the drawing material 27 is supported by the upper surface regulating plate and the push-up holder at the three points by the push of the push-up springs 19A, 19B, 19C.
[0019]
The cassette supporting the drawing material 27 in this way is set on the stage 4 in the drawing chamber 3 as shown in FIG. When the cassette is set on the stage 4, one end of the external terminal 25 is an end of a terminal body (not shown) provided by penetrating the side wall of the drawing chamber 3 through an O-ring or the like. It is comprised so that it may contact.
[0020]
Then, drawing on the drawing material by the electron beam is started. In the drawing, the temperature signal of the drawing material 27 measured by the temperature sensor 21 is taken out to the outside through the lead wire 22, the external terminal 25 and the terminal body (not shown). Corresponding to field drawing, the temperature directly to the drawing material is obtained. In such an apparatus, the three support portions of the drawing material are in the non-drawing region of the drawing material, and the temperature sensor 21 is the central portion of the hemispherical surface portion of the push-up holder that supports the drawing material. Since it is attached to the push-up holder so as to form, there is no concern that the drawing material will be distorted.
In the above example, the upper surface regulating plate and the tip portion of the push-up holder facing the material to be drawn are formed in a hemispherical shape, but if they can make point contact with the material to be drawn, they are formed on other curved surfaces. May be.
[0021]
In the above example, the drawing material is supported at three points. However, the material is not limited to three points, and for example, four points may be used.
[0022]
In the above example, a mask material such as glass has been described as an object to be irradiated. However, the present invention is not limited to such a mask material. For example, the present invention also applies to a cassette that supports an object to be irradiated such as a semiconductor material such as a wafer. Is applicable.
[0023]
In the above example, the irradiation object cassette used in the electron beam drawing apparatus has been described. However, the irradiation object cassette used in the ion beam drawing apparatus or the laser drawing apparatus, or a large sample is observed or inspected. The present invention can also be applied to a sample cassette used in such a scanning electron microscope.
[Brief description of the drawings]
FIG. 1 shows one schematic example of electron beam drawing as an example of a charged particle beam apparatus.
FIG. 2 is a schematic view of an irradiated object cassette shown as an example of the present invention.
FIG. 3 is a cross-sectional view taken along the line AA ′ of FIG.
[Explanation of numbers]
DESCRIPTION OF SYMBOLS 1 ... Electro-optic system lens barrel 2 ... Electron gun 3 ... Drawing chamber 4 ... Stage 5 ... Cassette 11 ... Cassette main body 12,13,14 ... Space part 15A, 15B, 15C ... Upper surface control board 16A, 16B, 16C ... Push-up holder 17A, 17B, 17C ... Push-up spring supports 18A, B, 18C ... Projections 19A, 19B, 19C ... Push-up spring 20 ... Push-up holder support plate 21 ... Temperature sensor 22 ... Lead wire 23 ... Side walls 24A, 24B ... Insulating spacer 25 ... External terminal 26 ... Hole 27 ... Draw material

Claims (6)

被照射物を異なる複数箇所において、カセット本体に取り付けられた複数対の上面支持部材と下面支持部材とで上下両面から挟んで被照射物を支持するように成した放射ビーム装置の被照射物カセットにおいて、前記各支持部材の少なくとも1つに被照射物に接触するように温度センサを設けた放射ビーム装置の被照射物カセット。Irradiation object cassette of a radiation beam apparatus configured to support an irradiation object by sandwiching the irradiation object from above and below by a plurality of pairs of upper surface support members and lower surface support members attached to the cassette body at a plurality of different locations. An irradiated object cassette of a radiation beam apparatus, wherein a temperature sensor is provided so that at least one of the support members contacts the irradiated object. 前記各支持部材の被照射物接触部が被照射物に点接触するように形成されている請求項1記載の荷電粒子ビーム装置の被照射物カセット。The irradiated object cassette of the charged particle beam apparatus according to claim 1, wherein the irradiated object contact portion of each support member is formed so as to make point contact with the irradiated object. 前記各支持部材の被照射物接触部が曲面状に形成されている請求項1記載の放射ビーム装置の被照射物カセット。The irradiated object cassette of the radiation beam apparatus according to claim 1, wherein the irradiated object contact portion of each support member is formed in a curved surface shape. 被照射物を介して対向する上面支持部材と下面支持部材の被照射物接触部が被照射物の同一位置を上下から挟むように配置される請求項2若しくは3記載の放射ビーム装置の被照射物カセット。The irradiated object of the radiation beam apparatus according to claim 2 or 3, wherein the irradiated object contact portions of the upper surface supporting member and the lower surface supporting member facing each other through the irradiated object are arranged so as to sandwich the same position of the irradiated object from above and below. Cassette. 前記温度センサーの被照射物接触部は、前記曲面状部の頂部に配置されている請求項3記載の放射ビーム装置の被照射物カセット。The irradiated object cassette of the radiation beam apparatus according to claim 3, wherein the irradiated object contact portion of the temperature sensor is disposed on a top portion of the curved surface portion. 下面支持部材はカセット本体に移動可能に取り付けられ、弾性体により被照射物表面に向けて押圧されている請求項1記載の放射ビーム装置の被照射物カセット。The irradiated object cassette of the radiation beam apparatus according to claim 1, wherein the lower surface support member is movably attached to the cassette body and is pressed toward the irradiated object surface by an elastic body.
JP2000286660A 2000-09-21 2000-09-21 Radiation beam equipment irradiated object cassette Expired - Fee Related JP3967534B2 (en)

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