JP3947661B2 - MoSi2 plate heater - Google Patents

MoSi2 plate heater Download PDF

Info

Publication number
JP3947661B2
JP3947661B2 JP2001304950A JP2001304950A JP3947661B2 JP 3947661 B2 JP3947661 B2 JP 3947661B2 JP 2001304950 A JP2001304950 A JP 2001304950A JP 2001304950 A JP2001304950 A JP 2001304950A JP 3947661 B2 JP3947661 B2 JP 3947661B2
Authority
JP
Japan
Prior art keywords
heater
plate
mosi
plate heater
heat generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001304950A
Other languages
Japanese (ja)
Other versions
JP2003109724A (en
Inventor
博 高村
一郎 澤村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Priority to JP2001304950A priority Critical patent/JP3947661B2/en
Publication of JP2003109724A publication Critical patent/JP2003109724A/en
Application granted granted Critical
Publication of JP3947661B2 publication Critical patent/JP3947661B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/018Heaters using heating elements comprising mosi2

Abstract

PROBLEM TO BE SOLVED: To provide a heater made of MoSi2 which can heat with accuracy without troubles of short-circuiting by enabling to tightly set sintering heaters of MoSi2 on a bottom wall, an upper wall, an inner wall or the like of a heating device or the like. SOLUTION: The heater is one of plate shape made of MoSi2 having a bent part without seams, of which, each bent part is bent in the width direction of the plate-shaped heater.

Description

【0001】
【発明の属する技術分野】
本発明は、ヒーターの集積性が高く高温化及び温度制御が容易であり、また加熱時の変形(あばれ)やショート等の故障が少なく、さらに低コストで製造できるMoSi 製板状ヒーターに関する
なお、本明細書で使用するMoSi製板状ヒーターは、純MoSi乃至MoSiに絶縁性酸化物等を含有させて電気抵抗を増加させたMoSi主成分とするヒーターを含む。
【0002】
【従来の技術】
二珪化モリブデン(MoSi)を主成分とするヒーターは、優れた耐酸化特性を有するため、特に大気又は酸化性雰囲気下で使用する超高温ヒーターとして1950〜1960年頃から市販され、現在まで幅広い用途で使用されている。このヒーターは主成分として、MoSiを70wt%以上含有している。
従来、ガラス工業やセラミックス焼成等の多くの分野で使用されているヒーターは発熱部(なお、通常「発熱部」は、通電時に主として発熱するヒーターの径が細い部分(端子部以外)を意味する。)が1つのU字形を成す形状(2シャンク型)をしており、炉の天井や側壁から宙吊りに取付けられ、その炉の最高使用温度は1700〜1850°Cに達する。
【0003】
最近、半導体デバイスの微細化及びデバイス製造時間の短縮化と省エネルギー化に伴い、従来金属発熱体が使用されていたCVD装置や拡散炉等の半導体製造装置にMoSiを主成分とするヒーターが利用されるようになってきた。
MoSiを主成分とするヒーターは優れた耐熱特性を有し、金属発熱体の約10倍の表面負荷が可能であり、また急速加熱昇温することができる大きな特長を有する。
一般に、半導体製造装置に使用される熱処理炉は炉内の温度分布を厳密に制御するなど、非常に高精度な温度特性が要求される。
【0004】
MoSiを主成分とするヒーターは、通常図9に示すように、棒状のヒーター素材をU字形に曲げ、その発熱部の両端に端子部を溶接したU字形ヒーターが使用されている。図9においてU字形ヒーター31は発熱部32、溶接部33、グリップ(端子)部34、電極部35からなる。
しかし、この端子部は発熱部に比べて温度低下が大きいので、上記のような精密な温度制御が必要となる炉では、図10に示すように、端子部を減らすために同様に棒状のヒーター素材を曲げたU字形の発熱部を多数連接した形状(マルチシャンク)のヒーターが提案されている。
このような多数連接したヒーターの形状は、炉の内外を貫通する端子部の数が減るので該端子部から放熱する熱損失を減少させることができ、炉の温度の均一化に一定の効果があると考えられている。
最近はヒーターの集積性を高め、かつ熱のコントロールを正確にできるヒーターが求められている。ところが棒状のヒーター素材を曲げたヒーター又は溶接したヒーターは加熱時の変形(あばれ)が生じ易く、曲げ部を密にした場合はショート等の事故が発生するという問題があった。したがって、集積性を高めた高精度のヒーターを製造することは事実上難しいという問題があった。
【0005】
【発明が解決しようとする課題】
本発明は、MoSi製ヒーターを加熱装置の底壁、上壁、側壁等に密に設置できるようにし、ショート等の事故がなく、精度良く加熱できるMoSi 製ヒーターを提供する
【0006】
【課題を解決するための手段】
上記の課題を解決するために、本発明者らは鋭意研究の結果、MoSi製ヒーターを板状にすることにより、集積度を高め、ショート等の事故がなく、正確に温度コントロールすることができるとの知見を得た。
本発明はこの知見に基づき、
1.ヒーターの原料となるMoSi粉を、熱可塑性樹脂を含有するバインダーと混練し、押出し成型して棒材とし、さらにこれを型に嵌め込んで成型した後、この成型体を脱脂及び焼結して得た継ぎ目のないU字形の連続波形を有するMoSi製板状ヒーターであって、U字形の各屈曲部は板状ヒーターの板幅方向に屈曲し、該屈曲部は円弧状又は角形状であり、板幅対厚さの比(板幅/厚さ)が2以上であることを特徴とするMoSi製板状ヒーターを提供する。
【0007】
本発明は、また
2.板状ヒーターの端子部を発熱部よりも幅広にして給電することを特徴とする上記1記載のMoSi 製板状ヒーター
3.板状ヒーターの端子部の厚さを発熱部よりも肉厚として給電すること特徴とする上記1又は2記載のMoSi 製板状ヒーター
4.板状ヒーターの発熱部を水冷機能付の金属電極により直接チャックして給電することを特徴とする上記1〜3のいずれかに記載のMoSi 製板状ヒーターを提供する。
【0008】
【発明の実施の形態】
本発明のMoSi製板状ヒーターを製造する際には、まずヒーターの原料となるMoSi粉をバインダーと混合し、この混合物を例えば混練後棒状にし、型に嵌め込んで板状にプレス成型する。前記バインダーには熱可塑性樹脂を含有させて使用することが望ましい。バインダーに熱可塑性樹脂を含有させた場合、特に成型後の強度(グリーン強度)が上がり、成型精度を向上させたり、薄板の成型も可能となる。
この場合、棒状の混合物は塑造物であり、型の板状の窪みに一致する容量又は若干多めに装填するだけで良い。プレス成型した後の余剰のMoSi混合物は除去する。ここで重要な点は、各屈曲部は板状ヒーターの板幅方向に屈曲する形状に成型することである。
【0009】
成型方法として、いくつかの方法を挙げることができる。その1として、MoSi粉とバインダーの混合粉末を型に充填して加熱プレス成型する方法、その2として、MoSi粉とバインダーの混合粉末を混練して粘土状にし、これによって得られた混合物を型に充填しプレス成型する方法、その3として、MoSi粉とバインダーの混合粉末を混練して、押出し成形した棒材を型に嵌め込み、プレス成型する方法等がある。但し、熱可塑性のバインダーを使用する場合は、混練から成型するまで、材料と型の温度を適宜調整する必要がある。
本発明においては、いずれの方法を採用してもよく、成型する形状に応じて適宜選択して使用することができる。いずれの場合においても、基材内部に気泡等の欠陥が残らないように充填し、成型することが望ましい。
次に、この成型体を脱脂、一次焼結及び通電加熱焼結して屈曲部が板状ヒーターの板幅方向に屈曲したMoSi製板状ヒーターを作製する。
【0010】
この屈曲部が板状ヒーターの板幅方向に屈曲していることが重要であり、構造的にヒーターとしての使用時に板の幅方向への変形は殆ど生じないという特徴を有する。したがって、板状ヒーターの間隔を小さくすることができ、集積度を著しく高めることができる。板状ヒーターの板幅対厚さの比(板幅/厚さ)は2以上、好ましくは4以上であることが望ましい。この比が大きい程、同じ厚みの板状ヒーターでは変形防止の効果がある。
このように集積度を高めたMoSi製板状ヒーターは、加熱装置等の底壁、上壁、側壁等に密に設置することができる。しかも、板幅方向への変形が殆どないのでショート等の事故がなく、ヒーターの集積度が高いために、炉内温度分布の均一性をより効果的に高めることができる。
【0011】
さらに、棒材と同じ電流密度でも、板状ヒーターは熱処理する製品方向の発熱部の表面積が大きくなるので、加熱効率を上げることができ、製品の均熱性をより高めることができるという特長を有する。
本発明の板状ヒーターが連続波形を有する場合は、必ずしもU字形ばかりでなく、底の浅いU字形、V字形あるいはサインカーブ状の波形にも形成でき、さらに波高を変えることもできる。これらは単に屈曲の程度や長さを変えるものであり、本発明のU字形の連続波形は、これらの波形の全て包含するものである。
板状ヒーターの断面形状は必ずしも矩形(角が直角)である必要はなく、例えば板状ヒーターの隅角部に丸みを付け(Rを付け)、成型後に型から分離(離型)し易い形状にすることができる。
また、板状ヒーターの断面の全体形状を、楕円形状、半円形状、トラック形状等にしても良い。本発明の板状ヒーターの断面形状に特に制限はなく、上記の形状等、いずれも使用することができる。
【0012】
本発明の板状ヒーターを使用する場合、重要なのは給電方法、特に端子部の構造である。板状ヒーターの発熱部に対して、給電する端子部の温度を十分に下げる必要がある。このため本発明は、板状ヒーターの端子部を発熱部よりも幅広にして給電するか、又は板状ヒーターの端子部の厚さを発熱部よりも肉厚として給電する。これによって、端子部の断面積を増加させ抵抗を下げることによって、端子部の加熱を抑制する。
また、上記に替えて、板状ヒーターの発熱部を水冷機能付の金属電極により直接チャックして給電することもできる。本発明においては、これらの給電方法をヒーターによる加熱条件に応じて任意に選択し、実施できる。
さらに、板状ヒーターの端子部又は端子部近傍の発熱部を断熱性及び絶縁性を有する材料で固定することが望ましい。これによって、端子等の接触による事故を効果的に防止することができる。
【0013】
【実施例】
次に、本発明の平板状MoSi製板状ヒーターの具体例を図面に沿って説明する。なお、以下の実施例は、発明が容易に理解できるように、好適な例を示すことが目的であり、これらの実施例に制限されるものではない。すなわち、本発明の技術思想に基づく変形又は他の例は当然本発明に包含されるものである。
【0014】
(実施例1)
図1に、左右対称にS字形を連接し、全体として一つの円の中にほぼ均等に納まるようにした形状のMoSi製板状ヒーターの例を示す。
このヒーター1の発熱部2の板幅は10mm、板厚1.8mm、S字形の間隔は6mmとした。ヒーター1の発熱部2の両端は、図の下方向に平行に延びており、この先端に端子部3を取付ける。
端子部3は温度を下げる必要があるので、図1のように発熱部2との接合部から次第に幅を広げ、例えば幅20mmの幅広の端子部3とすることができる。端子部3の幅は発熱部2の幅の2倍となっている。但し、この場合、発熱部2と端子部3の厚さは同一である。
この両方の端子部3、3を、図2に示すようにアルミナ等の耐熱性及び絶縁性を有する材料4で固定し、通電性を向上させるために、その先端にアルミニウム溶射5を施すことができる。これをさらに図3に示すように、ケーブル7に接続するホルダー6でチャックし通電できる構造とすることができる。
【0015】
(実施例2)
図4に、左右対称にほぼ半円毎に屈曲を反転させ、全体として一つの円の中にほぼ均等に納まるようにした形状のMoSi製板状ヒーターの例を示す。
このヒーター11の発熱部12の板幅は5mm、板厚1.5mm、間隔は6mmとした。ヒーター11の発熱部12の両端は、図の下方向に平行に延びており、この先端に端子部13を取付ける。
端子部13は温度を下げる必要があるので、図5のように発熱部12の両側に、例えば同一の幅5mm、板厚1.5mmの板を重ね合せて端子部13とすることができる。端子部13の厚さは発熱部12の厚さの3倍となっている。但し、この場合、発熱部12と端子部13の幅は同一である。
この両方の端子部13、13を、図6に示すようにアルミナ等の耐熱性及び絶縁性を有する材料14、14で固定する。
実施例1と同様に、通電性を向上させるためにその先端にアルミニウム溶射15を施すことができる。図7は耐熱性及び絶縁性を有する材料14で固定した端子部13、13の断面を示す。これをさらに、例えば前記図3と同様に、ケーブルに接続するホルダーでチャックし通電できる構造とする。
【0016】
(実施例3)
図8に、左右対称に白鳥が向い合ったような形状の、全体として一つの円の中にほぼ均等に納まるようにした形状のMoSi製板状ヒーターの例を示す。
このヒーター21の発熱部22の板幅は20mm、板厚2.4mm、板の間隔は10mmとした。ヒーター21の発熱部22の両端は、図の中央から紙の裏面側に平行に突出している。この先端を水冷機能付の金属電極23で直接チャックし通電できる構造とする。符号24はヒーター21の支持台を、符号25は水冷管を、符号26は給電ケーブルを示す。
【0017】
【発明の効果】
本発明のMoSi製板状ヒーターは、加熱装置等の底壁、上壁、側壁等に密に設置することができ、ヒーターとしての使用時に変形がなく、幅方向の短絡等による電気的ショート等の事故が防止でき、これによって炉の均熱性を高めることができ、温度コントロールが容易になるという優れた効果を有する。
【図面の簡単な説明】
【図1】左右対称にS字形を連接し、全体として一つの円の中にほぼ均等に納まるようにした実施例1に示すMoSi製板状ヒーターの説明図である。
【図2】端子部をアルミナ等の耐熱性及び絶縁性を有する材料で固定した構造を示す斜視図である。
【図3】端子部をケーブルに接続するホルダーでチャックした構造の断面説明図である。
【図4】 左右対称にほぼ半円毎に屈曲を反転させ、全体として一つの円の中にほぼ均等に納まるようにした実施例2に示すMoSi製板状ヒーターの説明図である。
【図5】発熱部の両側に、同一の幅の板を重ね合せた端子部の斜視図である。
【図6】両方の端子部をアルミナ等の耐熱性及び絶縁性を有する材料で固定した構造の説明図である。
【図7】耐熱性及び絶縁性を有する材料で固定した端子部の断面を示す図である。
【図8】左右対称に白鳥が向い合ったような形状を有し、全体として一つの円の中にほぼ均等に納まるようにした実施例3のMoSi製板状ヒーターの説明図である。
【図9】U字形発熱部の両側に端子を溶接した従来のU字形ヒーターの説明図である。
【図10】従来のU字形ヒーター部材を連接して、炉の内部に弧状ヒーターを取付ける場合の様子を示す説明図である。
【符号の説明】
1、11、21 ヒーター
2、12、22 発熱部
3、13 端子部
4、14 耐熱性及び絶縁性を有する材料
5、15 アルミニウム溶射
6 ホルダー
7、26 給電ケーブル
23 水冷機能付の金属電極
24 ヒーターの支持台
25 水冷管
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a MoSi 2 plate heater that can be manufactured at a low cost, with high heater integration, high temperature and easy temperature control, and less deformation such as deformation and short circuit during heating.
The MoSi 2 plate heater used in the present specification includes a heater mainly composed of MoSi 2 in which an electrical resistance is increased by adding an insulating oxide or the like to pure MoSi 2 to MoSi 2 .
[0002]
[Prior art]
Since the heater mainly composed of molybdenum disilicide (MoSi 2 ) has excellent oxidation resistance, it has been commercially available since 1950-1960 as an ultra-high temperature heater especially used in the atmosphere or in an oxidizing atmosphere, and has a wide range of uses up to now. Used in. This heater contains 70 wt% or more of MoSi 2 as a main component.
Conventionally, a heater used in many fields such as glass industry and ceramic firing is a heat generating part (in general, "heat generating part" means a part where the diameter of the heater that mainly generates heat when energized is thin (other than the terminal part). .) Has a single U-shape (two shank type) and is suspended from the ceiling or side wall of the furnace, and the maximum operating temperature of the furnace reaches 1700-1850 ° C.
[0003]
Recently, along with miniaturization of semiconductor devices, shortening of device manufacturing time and energy saving, heaters mainly composed of MoSi 2 have been used in semiconductor manufacturing equipment such as CVD equipment and diffusion furnaces that conventionally used metal heating elements. It has come to be.
The heater mainly composed of MoSi 2 has excellent heat resistance characteristics, can have a surface load about 10 times that of a metal heating element, and has a great feature capable of rapid heating and heating.
In general, a heat treatment furnace used in a semiconductor manufacturing apparatus is required to have a highly accurate temperature characteristic such as strictly controlling the temperature distribution in the furnace.
[0004]
As shown in FIG. 9, a heater mainly composed of MoSi 2 is a U-shaped heater in which a rod-shaped heater material is bent into a U shape and terminal portions are welded to both ends of the heat generating portion. In FIG. 9, the U-shaped heater 31 includes a heating part 32, a welding part 33, a grip (terminal) part 34, and an electrode part 35.
However, since the temperature of the terminal portion is larger than that of the heat generating portion, in a furnace that requires precise temperature control as described above, as shown in FIG. A heater having a shape (multi-shank) in which a large number of U-shaped heat generating portions bent from a material are connected has been proposed.
The shape of such a multi-connected heater reduces the number of terminal portions penetrating through the inside and outside of the furnace, so heat loss radiated from the terminal portions can be reduced, and has a certain effect on the uniformity of the furnace temperature. It is thought that there is.
Recently, there has been a demand for a heater that can increase heater integration and accurately control heat. However, a heater obtained by bending a rod-shaped heater material or a welded heater is liable to be deformed (heated) during heating, and there is a problem that an accident such as a short circuit occurs when the bent portion is dense. Therefore, there is a problem that it is practically difficult to manufacture a high-precision heater with improved integration.
[0005]
[Problems to be solved by the invention]
The present invention, bottom wall, top wall of the heating apparatus MoSi 2 made heater, to allow closely installed on the side wall or the like, there is no accident such as a short circuit, to provide a MoSi 2 made heater can be accurately heated.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present inventors have intensively studied to increase the degree of integration by making the MoSi 2 heater into a plate shape, and to accurately control the temperature without causing an accident such as a short circuit. I learned that I can do it.
The present invention is based on this finding,
1. MoSi 2 powder, which is the raw material for the heater, is kneaded with a binder containing a thermoplastic resin, extruded to form a rod, and then molded by fitting it into a mold, and then the molded body is degreased and sintered. MoSi 2 plate heater having a seamless U-shaped continuous waveform obtained by bending each U-shaped bent portion in the plate width direction of the plate heater, and the bent portions are arc-shaped or angular-shaped , and the providing MoSi 2 made plate-like heater, wherein the ratio of plate width to thickness (plate width / thickness) is 2 or more.
[0007]
The present invention also provides
2. 2. The MoSi 2 plate heater as described in 1 above, wherein the power is supplied with the terminal portion of the plate heater wider than the heat generating portion.
3. 3. The MoSi 2 plate heater according to 1 or 2 above, wherein power is supplied with the thickness of the terminal portion of the plate heater being thicker than that of the heat generating portion.
4). Providing MoSi 2 made plate heaters according to the heat generation portion of the plate-like heater in any of the above 1 to 3, characterized in that for feeding directly the chuck by metal electrodes with water cooling.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
When manufacturing the MoSi 2 plate heater of the present invention, first, MoSi 2 powder, which is a raw material of the heater, is mixed with a binder, and this mixture is kneaded, for example, into a rod shape, fitted into a mold, and pressed into a plate shape. To do. The binder is desirably used by containing a thermoplastic resin. When a thermoplastic resin is contained in the binder, the strength after molding (green strength) is particularly improved, and the molding accuracy can be improved and the thin plate can be molded.
In this case, the rod-like mixture is a plastic product and only needs to be loaded with a capacity corresponding to the plate-like depression of the mold or slightly larger. Excess MoSi 2 mixture after press molding is removed. The important point here is that each bent portion is molded into a shape that bends in the plate width direction of the plate heater.
[0009]
Several methods can be cited as the molding method. Part 1 is a method in which a mixed powder of MoSi 2 powder and a binder is filled in a mold and heated and press-molded. Part 2 is a mixture obtained by kneading a mixed powder of MoSi 2 powder and a binder into a clay, and a mixture obtained thereby. As a third method, there is a method of kneading a mixed powder of MoSi 2 powder and a binder, fitting an extruded bar into the mold, and press-molding. However, when a thermoplastic binder is used, it is necessary to appropriately adjust the material and mold temperature from kneading to molding.
In the present invention, any method may be adopted, and it can be appropriately selected and used according to the shape to be molded. In either case, it is desirable to fill and mold the substrate so that no defects such as bubbles remain inside the substrate.
Next, this molded body is degreased, primary sintered and energized and heated to produce a MoSi 2 plate heater in which the bent portion is bent in the plate width direction of the plate heater.
[0010]
It is important that the bent portion bends in the plate width direction of the plate heater, and structurally, the plate is hardly deformed in the width direction when used as a heater. Therefore, the space | interval of a plate-shaped heater can be made small and an integration degree can be raised remarkably. The ratio of plate width to thickness (plate width / thickness) of the plate heater is 2 or more, preferably 4 or more. The larger the ratio, the more effective the plate heater having the same thickness is in preventing deformation.
Thus, the MoSi 2 plate heater having a high degree of integration can be densely installed on the bottom wall, top wall, side wall, etc. of a heating device or the like. In addition, since there is almost no deformation in the plate width direction, there is no accident such as a short circuit, and since the heater is highly integrated, the uniformity of the furnace temperature distribution can be improved more effectively.
[0011]
Furthermore, even with the same current density as the bar, the plate heater has the advantage that the heating surface area of the heat generating part in the direction of the product to be heat-treated becomes large, so that the heating efficiency can be increased and the temperature uniformity of the product can be further increased. .
When the plate heater of the present invention has a continuous waveform, it can be formed not only in a U-shape but also in a shallow U-shape, V-shape or sine curve, and the wave height can be changed. These merely change the degree and length of bending, and the U-shaped continuous waveform of the present invention encompasses all of these waveforms.
The cross-sectional shape of the plate heater does not necessarily have to be a rectangle (the corners are right-angled). For example, the corner shape of the plate heater is rounded (R is added) and can be easily separated (released) from the mold after molding. Can be.
The overall shape of the cross section of the plate heater may be an elliptical shape, a semicircular shape, a track shape, or the like. There is no restriction | limiting in particular in the cross-sectional shape of the plate-shaped heater of this invention, Any of said shape etc. can be used.
[0012]
When the plate heater of the present invention is used, what is important is the power feeding method, particularly the structure of the terminal portion. It is necessary to sufficiently lower the temperature of the terminal portion to be fed with respect to the heat generating portion of the plate heater. Therefore, according to the present invention, power is supplied with the terminal portion of the plate heater wider than the heat generating portion, or the thickness of the terminal portion of the plate heater is thicker than that of the heat generating portion. This suppresses heating of the terminal portion by increasing the cross-sectional area of the terminal portion and decreasing the resistance.
Instead of the above, power can be supplied by directly chucking the heat generating portion of the plate heater with a metal electrode having a water cooling function. In the present invention, these power feeding methods can be arbitrarily selected according to the heating conditions by the heater.
Furthermore, it is desirable to fix the terminal part of the plate heater or the heat generating part near the terminal part with a material having heat insulating properties and insulating properties. As a result, accidents due to contact of terminals and the like can be effectively prevented.
[0013]
【Example】
Next, specific examples of the plate-like MoSi 2 plate heater of the present invention will be described with reference to the drawings. The following examples are for the purpose of showing preferred examples so that the invention can be easily understood, and are not limited to these examples. That is, modifications or other examples based on the technical idea of the present invention are naturally included in the present invention.
[0014]
Example 1
FIG. 1 shows an example of a MoSi 2 plate-like heater having a shape in which S-shapes are connected symmetrically in a left-right direction so as to fit almost uniformly in one circle as a whole.
The plate width of the heat generating portion 2 of the heater 1 was 10 mm, the plate thickness was 1.8 mm, and the S-shaped interval was 6 mm. Both ends of the heat generating portion 2 of the heater 1 extend in the downward direction in the figure, and the terminal portion 3 is attached to the tip.
Since it is necessary to lower the temperature of the terminal portion 3, the width is gradually increased from the joint portion with the heat generating portion 2 as shown in FIG. 1, for example, a wide terminal portion 3 having a width of 20 mm can be obtained. The width of the terminal portion 3 is twice the width of the heat generating portion 2. However, in this case, the heat generating portion 2 and the terminal portion 3 have the same thickness.
Both the terminal portions 3 and 3 are fixed with a heat-resistant and insulating material 4 such as alumina as shown in FIG. 2, and an aluminum spray 5 is applied to the tip in order to improve electrical conductivity. it can. Further, as shown in FIG. 3, it can be structured such that it can be energized by chucking with a holder 6 connected to the cable 7.
[0015]
(Example 2)
FIG. 4 shows an example of a plate heater made of MoSi 2 having a shape in which bending is reversed approximately every semicircle symmetrically so as to fit almost uniformly in one circle as a whole.
The heating part 12 of the heater 11 has a plate width of 5 mm, a plate thickness of 1.5 mm, and an interval of 6 mm. Both ends of the heat generating portion 12 of the heater 11 extend in the downward direction in the figure, and the terminal portion 13 is attached to the tip.
Since it is necessary to lower the temperature of the terminal portion 13, as shown in FIG. 5, for example, a plate having the same width of 5 mm and a plate thickness of 1.5 mm can be overlapped on both sides of the heat generating portion 12 to form the terminal portion 13. The thickness of the terminal portion 13 is three times the thickness of the heat generating portion 12. However, in this case, the widths of the heat generating portion 12 and the terminal portion 13 are the same.
Both the terminal portions 13 and 13 are fixed with heat-resistant and insulating materials 14 and 14 such as alumina as shown in FIG.
In the same manner as in Example 1, in order to improve the electrical conductivity, an aluminum spray 15 can be applied to the tip thereof. FIG. 7 shows a cross section of the terminal portions 13 and 13 fixed with a material 14 having heat resistance and insulation. Further, for example, as in FIG. 3, the structure is such that it can be energized by chucking with a holder connected to the cable.
[0016]
(Example 3)
FIG. 8 shows an example of a MoSi 2 plate-like heater having a shape such that swans are symmetrically facing each other, and the shape is such that, as a whole, the swans are almost uniformly contained in one circle.
The plate width of the heat generating portion 22 of the heater 21 was 20 mm, the plate thickness was 2.4 mm, and the plate interval was 10 mm. Both ends of the heat generating part 22 of the heater 21 protrude in parallel from the center of the figure to the back side of the paper. The tip is chucked directly by a metal electrode 23 with a water cooling function so that power can be supplied. Reference numeral 24 denotes a support for the heater 21, reference numeral 25 denotes a water-cooled tube, and reference numeral 26 denotes a power feeding cable.
[0017]
【The invention's effect】
The MoSi 2 plate heater of the present invention can be densely installed on the bottom wall, top wall, side wall, etc. of a heating device, etc., is not deformed when used as a heater, and is electrically shorted by a short circuit in the width direction, etc. This makes it possible to prevent accidents such as the above, thereby improving the temperature uniformity of the furnace, and has an excellent effect of facilitating temperature control.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a MoSi 2 plate-like heater shown in Example 1 in which S-shapes are connected symmetrically left and right so as to fit almost uniformly in one circle as a whole.
FIG. 2 is a perspective view showing a structure in which a terminal portion is fixed with a heat-resistant and insulating material such as alumina.
FIG. 3 is a cross-sectional explanatory view of a structure in which a terminal portion is chucked with a holder connected to a cable.
FIG. 4 is an explanatory diagram of a MoSi 2 plate heater shown in Example 2 in which the bending is reversed approximately every semicircle symmetrically so as to fit almost uniformly in one circle as a whole.
FIG. 5 is a perspective view of a terminal portion in which plates of the same width are overlapped on both sides of a heat generating portion.
FIG. 6 is an explanatory diagram of a structure in which both terminal portions are fixed with a heat-resistant and insulating material such as alumina.
FIG. 7 is a view showing a cross section of a terminal portion fixed with a material having heat resistance and insulation.
FIG. 8 is an explanatory diagram of a MoSi 2 plate heater of Example 3 having a shape such that swans are symmetrically facing each other and fit almost uniformly in one circle as a whole.
FIG. 9 is an explanatory diagram of a conventional U-shaped heater in which terminals are welded to both sides of a U-shaped heat generating portion.
FIG. 10 is an explanatory view showing a state in which a conventional U-shaped heater member is connected and an arc heater is attached to the inside of a furnace.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1, 11, 21 Heater 2, 12, 22 Heat generating part 3, 13 Terminal part 4, 14 Material 5 which has heat resistance and insulation 5, 15 Aluminum spraying 6 Holder 7, 26 Feeding cable 23 Metal electrode 24 with a water cooling function 24 Heater Support base 25 Water-cooled tube

Claims (4)

ヒーターの原料となるMoSi粉を、熱可塑性樹脂を含有するバインダーと混練し、押出し成型して棒材とし、さらにこれを型に嵌め込んで成型した後、この成型体を脱脂及び焼結して得た継ぎ目のないU字形の連続波形を有するMoSi製板状ヒーターであって、U字形の各屈曲部は板状ヒーターの板幅方向に屈曲し、該屈曲部は円弧状又は角形状であり、板幅対厚さの比(板幅/厚さ)が2以上であることを特徴とするMoSi製板状ヒーター。MoSi 2 powder, which is the raw material for the heater, is kneaded with a binder containing a thermoplastic resin, extruded to form a rod, and then molded by fitting it into a mold, and then the molded body is degreased and sintered. MoSi 2 plate heater having a seamless U-shaped continuous waveform obtained by bending each U-shaped bent portion in the plate width direction of the plate heater, and the bent portions are arc-shaped or angular-shaped And a ratio of plate width to thickness (plate width / thickness) is 2 or more, MoSi 2 plate heater. 板状ヒーターの端子部を発熱部よりも幅広にして給電することを特徴とする請求項1記載のMoSi製板状ヒーター。 2. The MoSi 2 plate heater according to claim 1 , wherein the power is supplied by making the terminal portion of the plate heater wider than the heat generating portion. 板状ヒーターの端子部の厚さを発熱部よりも肉厚として給電すること特徴とする請求項1又は2記載のMoSi製板状ヒーター。The MoSi 2 plate heater according to claim 1 or 2, wherein power is supplied with the thickness of the terminal portion of the plate heater being thicker than that of the heat generating portion. 板状ヒーターの発熱部を水冷機能付の金属電極により直接チャックして給電することを特徴とする請求項1〜3のいずれかに記載のMoSi製板状ヒーター。The MoSi 2 plate heater according to any one of claims 1 to 3, wherein the heating portion of the plate heater is directly chucked by a metal electrode with a water cooling function to supply power.
JP2001304950A 2001-10-01 2001-10-01 MoSi2 plate heater Expired - Fee Related JP3947661B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001304950A JP3947661B2 (en) 2001-10-01 2001-10-01 MoSi2 plate heater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001304950A JP3947661B2 (en) 2001-10-01 2001-10-01 MoSi2 plate heater

Publications (2)

Publication Number Publication Date
JP2003109724A JP2003109724A (en) 2003-04-11
JP3947661B2 true JP3947661B2 (en) 2007-07-25

Family

ID=19124807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001304950A Expired - Fee Related JP3947661B2 (en) 2001-10-01 2001-10-01 MoSi2 plate heater

Country Status (1)

Country Link
JP (1) JP3947661B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011090801A (en) * 2009-10-20 2011-05-06 Jx Nippon Mining & Metals Corp MoSi2 HEATING ELEMENT AND MANUFACTURING METHOD OF THIS HEATING ELEMENT
EP3200558A1 (en) 2016-01-27 2017-08-02 JX Nippon Mining & Metals Corporation Mosi2 heating element and method of producing said heating element

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5452955B2 (en) * 2009-03-13 2014-03-26 本田技研工業株式会社 Preform heating device
CN108601116B (en) * 2018-06-12 2020-12-18 广东省新材料研究所 MoSi 2-based electrothermal coating heating roller and preparation method thereof
CN109123804A (en) * 2018-09-21 2019-01-04 深圳麦克韦尔股份有限公司 Toast smoking set and its heating component

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6251183A (en) * 1985-08-28 1987-03-05 株式会社デンソー Manufacture of ceramic heater
JPS62208586A (en) * 1986-03-08 1987-09-12 東京エレクトロン相模株式会社 Heater
JP2627506B2 (en) * 1987-06-09 1997-07-09 東海高熱工業株式会社 Far infrared heater
JPH03208861A (en) * 1990-01-12 1991-09-12 Sumitomo Electric Ind Ltd Superconducting material molding and production thereof
JP3618369B2 (en) * 1994-04-27 2005-02-09 日本高圧電気株式会社 Ceramic heating element
JP4445595B2 (en) * 1995-09-12 2010-04-07 日本特殊陶業株式会社 Ceramic heater, ceramic glow plug and manufacturing method thereof
JPH10324571A (en) * 1997-05-23 1998-12-08 Riken Corp Molybdenum disilicide ceramic heat generating body and its production
JP3000080B1 (en) * 1998-11-24 2000-01-17 坂口電熱株式会社 Water-cooled electrode
JP2000340349A (en) * 1999-05-28 2000-12-08 Kyocera Corp Ceramic heater
JP2001071368A (en) * 1999-09-08 2001-03-21 Nippon Shokubai Co Ltd Production of artificial slate and artificial slate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011090801A (en) * 2009-10-20 2011-05-06 Jx Nippon Mining & Metals Corp MoSi2 HEATING ELEMENT AND MANUFACTURING METHOD OF THIS HEATING ELEMENT
EP3200558A1 (en) 2016-01-27 2017-08-02 JX Nippon Mining & Metals Corporation Mosi2 heating element and method of producing said heating element

Also Published As

Publication number Publication date
JP2003109724A (en) 2003-04-11

Similar Documents

Publication Publication Date Title
JP4874244B2 (en) PTC thick film electric circuit controlled electric heating element
WO2001031978A1 (en) Ceramic heater
US20180204754A1 (en) Substrate supporting device
KR102661729B1 (en) Heating modules and smoke generating devices
JP2008508664A5 (en)
WO1997028409A1 (en) Electric furnace
CN110959918A (en) Heating assembly and electronic atomization device
JP3947661B2 (en) MoSi2 plate heater
WO2008054040A1 (en) Composition of mosi2 and the application of the same
KR100614195B1 (en) Heater device of portable hair iron that use micro white gold heating element and the manufacture method
CN211128234U (en) Vacuum furnace heating element connecting structure
CN210581031U (en) Heating assembly of aerosol generating device
TWI243151B (en) MoSi2 arc-shaped heater, and method and device for manufacturing the heater
JP2002246160A (en) Hot plate unit
US20090250453A1 (en) Electric conduction heating device
CN113170538B (en) Multi-handle type heater
JPH0667539B2 (en) Method of heating molten metal
KR20000049900A (en) wafer heater
JP3222121B2 (en) Ceramic heater for semiconductor manufacturing and inspection equipment
JPS60212986A (en) Dc voltage applying ceramic heater
JP2002093677A (en) Ceramic heater for producing/inspecting system of semiconductor
CN211557524U (en) Ceramic heating body capable of heating uniformly
WO2020017204A1 (en) Method for controlling temperature of heating element, and method for manufacturing glass article
WO2003075613A1 (en) High-temperature ceramic heater with high efficiency and method for manufacturing the same
JP4053277B2 (en) Electric furnace

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040408

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060228

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060428

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060808

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060914

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070109

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070305

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20070315

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070410

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070416

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100420

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110420

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110420

Year of fee payment: 4

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110420

Year of fee payment: 4

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110420

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120420

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120420

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130420

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130420

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees