JP3911827B2 - Speaker - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a speaker used for various audio equipment.
[0002]
[Prior art]
A conventional speaker will be described with reference to a half sectional view of FIG.
[0003]
In the figure, reference numeral 2 denotes a magnetic circuit composed of a lower plate 5 having a center pole, a ring-shaped magnet 6, and a ring-shaped upper plate 7. A resin frame 1 is coupled to the upper surface of the magnetic circuit 2. ing. Reference numeral 8 denotes a voice coil, and the suspension 4 supports an intermediate portion of the voice coil 8 so that the lower portion is fitted in the magnetic gap 9 of the magnetic circuit 2 without being eccentric. The outer periphery of the suspension 4 is coupled to the resin frame 1.
[0004]
Reference numeral 3 denotes a diaphragm, and an outer peripheral portion thereof is coupled to the resin frame 1 via a gasket 10, and a central portion of the diaphragm 3 and an upper portion of the voice coil 8 are coupled to each other.
[0005]
Reference numeral 11 denotes a dust cap 11 coupled to the central upper surface of the diaphragm 3, and 12 denotes lead wires at both ends of the voice coil 8, and each tinsel is made of each eyelet 13 caulked on the surface of the diaphragm 3. The other end of the tinsel wire 14 is soldered to a terminal 16 of a connector terminal 15 fixed to the resin frame 1.
[0006]
Note that the lead wire 12 is bonded to the diaphragm 3 by applying an adhesive.
Also, the most common method is to use various adhesives (resin frame 1 and magnetic circuit 2, diaphragm 3 or suspension 4) with an adhesive.
[0007]
The operation of the conventional speaker configured as described above will be described below. When an input signal is applied from the connector terminal 15 to the voice coil 8 through the terminal 16 and the tinsel wire 14, Fleming's left-hand rule Accordingly, the voice coil 8 is driven, and the diaphragm 3 is oscillated by this driving force to emit sound into the air.
[0008]
[Problems to be solved by the invention]
However, in the above conventional configuration, the resin used as the material of the resin frame 1 contains a small amount of a release agent in order to improve the release during molding. Naturally, since this release agent has an effect of easily separating each of the release agents, the bonding strength between the resin frame 1 and the magnetic circuit 2 bonded using the adhesive is weakened by the influence of the release agent. However, there is a quality problem that the magnetic circuit 2 may be detached due to the load.
[0009]
SUMMARY OF THE INVENTION The present invention solves the above problems, and aims to improve the quality of a speaker having a resin frame by improving the bonding strength between the resin frame and other components.
[0010]
[Means for Solving the Problems]
In order to solve the above problems, a speaker of the present invention includes a magnetic circuit in which a magnetic gap is formed, a resin frame in which metal parts are integrally insert-molded so that a surface of a coupling portion with the magnetic circuit is a metal , It consists of a voice coil that fits in the magnetic gap, and a diaphragm that is joined to the resin frame on the outer periphery. Metal parts are integrally insert-molded at the joint with the magnetic circuit of the resin frame. Thus, when the resin frame and the magnetic circuit are bonded with an adhesive or the like so that the surface of the coupling portion between the resin frame and the magnetic circuit is a metal, the release agent contained in the resin that is the material of the resin frame A stable bond strength can be obtained without being affected.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, there is provided a magnetic circuit in which a magnetic gap is formed, a resin frame in which metal parts are integrally insert-molded so that a surface of a coupling portion with the magnetic circuit is metal, and the magnetic circuit. Since the voice coil that fits in the gap is coupled to the center and the outer periphery is composed of a diaphragm that is coupled to the resin frame, at least a part of the surface of the coupling portion with the magnetic circuit of the resin frame is made of metal. When the resin frame and the magnetic circuit are bonded with an adhesive, a stable bonding strength can be obtained without being affected by the release agent contained in the resin that is the material of the resin frame.
[0012]
According to a second aspect of the present invention, a magnetic circuit in which a magnetic gap is formed, a resin frame coupled to the upper surface of the magnetic circuit, and a voice coil that fits into the magnetic gap are coupled to each other at least at the outer periphery. Part of the resin frame is composed of a diaphragm that is integrally molded with the resin frame and bonded to the surface of the metal part. Therefore, when the resin frame and the diaphragm are bonded with an adhesive, the resin that is the material of the resin frame is used. Without being influenced by the contained release agent, a stable bond strength can be obtained and acoustically stable.
[0013]
According to a third aspect of the present invention, a magnetic circuit in which a magnetic gap is formed, a resin frame coupled to the upper surface of the magnetic circuit, and a voice coil that fits into the magnetic gap are coupled to each other around the outer periphery. Since the diaphragm is coupled to the resin frame, and the suspension is coupled to the surface of a metal part, the inner periphery of which is coupled to the voice coil and at least a part of the outer periphery is integrally molded with the resin frame. When the resin frame and suspension are bonded with an adhesive, it is not affected by the release agent contained in the resin that is the material of the resin frame, and a stable bond strength can be obtained and high input resistance is also improved. It is.
[0014]
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
The same parts as those in the prior art are given the same numbers, and the description thereof is omitted, and only the differences will be described.
[0015]
(Embodiment 1)
FIG. 1 is a half sectional view of a speaker according to an embodiment of the present invention.
[0016]
According to the figure, 1a is a ring-shaped first metal part that is insert-molded integrally with the resin frame 1, and is integrally molded so that the surface is exposed. The magnetic circuit 2 is coupled by an adhesive all around the exposed portion of the first metal part 1a.
[0017]
Since the connecting portion between the resin frame 1 and the magnetic circuit 2 is made of metal because it is configured as described above, the influence of the release agent that acts to weaken the adhesive strength contained in the resin that is the material of the resin frame 1 is affected. In this way, a stable bond strength can be obtained.
[0018]
In the above embodiment, the first metal part 1a has a ring shape, and the ring-shaped first metal part 1a and the magnetic circuit 2 have been described as being bonded by an adhesive over the entire circumference. What is necessary is just to set suitably according to a form, and if sufficient bond strength is obtained, it insert-molds integrally so that a 1st metal component may be divided into several and partially embedded in the resin frame 1, and a magnetic circuit 2 and the resin frame 1 may be combined with a portion through the first metal part and a portion through the first metal part.
[0019]
Further, since the first metal component 1a only needs to be exposed on the surface at the coupling portion with the magnetic circuit 2, by embedding the portion other than the coupling portion in the resin frame 1, the first metal component 1a It is also possible to prevent peeling due to impact or aging.
[0020]
(Embodiment 2)
FIG. 2 is a half cross-sectional view of a speaker according to another embodiment of the present invention, and the resin frame 1 is integrated with a ring-shaped first metal part 1a at the coupling portion with the magnetic circuit 2 as in the first embodiment. In addition, the ring-shaped second metal part 1b is integrally formed at the joint with the diaphragm 3, and the ring-shaped third metal part 1c is integrally molded at the joint with the suspension 4. .
[0021]
With the above configuration, the surfaces of the joint portion of the resin frame 1 to the diaphragm 3 and the joint portion to the suspension 4 are each made of metal, and the material of the resin frame 1 at the joint portion to the diaphragm 3 and the suspension 4 is used. Thus, it is possible to obtain a stable bond strength by eliminating the influence of a release agent that acts to weaken the adhesive strength contained in the resin.
[0022]
The ring-shaped first, second, and third metal parts 1a, 1b, and 1c in the present embodiment may be set appropriately according to the speaker to which the first embodiment is applied, as in the first embodiment. If the bonding strength is acceptable, a plurality of metal parts are divided and partly embedded so as to be partially embedded in the resin frame 1, and the magnetic circuit 2 and the resin frame 1 are joined via the metal parts. It may be mixed with a part not intervening.
[0023]
Another object of the present invention is to eliminate the influence of a release agent used at the time of resin molding in the bonding of the resin frame 1 to the magnetic circuit 2, the diaphragm 3, and the suspension 4, and to obtain a stable bond. Therefore, it may be selectively applied to any coupling portion of the magnetic circuit 2, the diaphragm 3, and the suspension 4 as necessary.
[0024]
【The invention's effect】
As described above, the speaker of the present invention is configured not to be affected by the release agent contained in the resin, which is the material of the resin frame, by configuring the surface of the joint portion between the resin frame and other parts to be metal. It is possible to obtain a stable bond strength with other parts.
[Brief description of the drawings]
FIG. 1 is a half sectional view of an embodiment of the speaker of the present invention. FIG. 2 is a half sectional view of the other embodiment. FIG. 3 is a half sectional view of a conventional speaker.
DESCRIPTION OF SYMBOLS 1 Resin frame 1a 1st metal component 1b 2nd metal component 1c 3rd metal component 2 Magnetic circuit 3 Diaphragm 4 Suspension 8 Voice coil 9 Magnetic gap

Claims (3)

  A magnetic circuit in which a magnetic gap is formed, a resin frame in which metal parts are integrally insert-molded so that the surface of the coupling portion with the magnetic circuit is made of metal, and a voice coil that fits in the magnetic gap is coupled around the outer periphery. And a diaphragm that is coupled to the resin frame. A magnetic circuit in which a magnetic gap is formed, a resin frame coupled to the upper surface of the magnetic circuit, and a metal part that is coupled around the voice coil that fits in the magnetic gap, and at least the outer periphery is integrally insert-molded in the resin frame A speaker composed of a diaphragm coupled to the surface of the speaker. A magnetic circuit formed with a magnetic gap; a resin frame coupled to the upper surface of the magnetic circuit; a diaphragm coupled around the voice coil that fits into the magnetic gap and having an outer periphery coupled to the resin frame; And a suspension that is coupled to the surface of a metal part that is joined to the voice coil and at least a part of the outer periphery of which is insert-molded integrally with the resin frame.

Images