JP3908184B2 - IC socket - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC socket in which a semiconductor device such as an IC package is used. In particular, a coil spring that elastically supports a positioning base on which the IC package is placed is omitted, and an IC lead of the IC package is contacted. The present invention relates to an IC socket configured to be elastically supported directly by a tip portion of a supporting contact.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, an IC package or the like as an electrical component is known as a cover type IC socket with a positioning base that is mounted on a socket body of an IC socket and pressed and held by a pressing mechanism (for example, Patent Documents). 1).
[0003]
FIG. 17 and FIG. 18 show an example of a conventional IC socket. FIG. 17 shows a state when the cover member of this conventional IC socket is opened, and FIG. 18 shows a positioning base. And a portion of the contacts are shown.
[0004]
As shown in FIGS. 17 and 18, a conventional IC socket 1000 includes a socket body 1001, a cover pivotally supported on one side of the socket body 1001, and provided with an IC pressing portion 1003 in the center. A member 1002, a plurality of contacts 1004 provided in the socket body 1001, and a latch mechanism 1005 provided on the other side of the cover member 1002 so that the cover member 1002 is detachably locked to the socket body 1001. And an IC mounting base 1007 on which the IC package 1010 is placed.
[0005]
In such a conventional IC socket 1000, an IC mounting base 1007 is elastically supported by a spring member 1013, and a positioning wall 1008 on which the IC package 1010 is mounted is provided. A plurality of contacts 1004 that are in contact with and electrically connected to external terminals 1011 such as IC leads of the IC package 1010 are provided around the IC mounting base 1007. These contacts 1004 are formed in a curved shape so that the external terminals 1011 of the IC package 1010 can be elastically supported together with the IC mounting base 1007.
[0006]
[Patent Document 1]
Japanese Examined Patent Publication No. 7-114138 (page 2-3, FIG. 3-5)
[0007]
[Problems to be solved by the invention]
However, in such a conventional cover type IC socket 1000 with an IC mounting base 1007 on which an IC package 1010 or the like as an electrical component is mounted, a cover member 1003 is pivotally pivoted on one side of the socket body 1002. The IC package 1010 is positioned and supported by an IC mounting base 1007 that is supported and elastically supported by a spring member 1013 such as a coil spring. Then, since the IC mounting base 1007 needs to move when it is pressed thereafter, the bottom surface of the IC mounting base 1007 is pushed up by the coil spring 1013.
[0008]
Accordingly, in such a conventional IC socket 1000, when the IC tower 1007 is pressed, the contact portion 1012 of the elastic contact piece 1014 of the contact 1004 is pushed downward and lowered as shown in FIG. At the same time, it is possible to reduce the movement of the upper surface 1015 of the contact portion 1012 wiping the lower surface of the external terminal 1011 of the IC package 1010 by the IC tower 1007 by moving outward, that is, laterally. By using the IC tower 1007 and the coil spring 1013, the number of parts in the IC socket 1000 increases, and as a result, problems such as an increase in assembly process and an increase in product cost are observed.
[0009]
In another conventional IC socket as another example, an external terminal which is an IC terminal of an IC package is directly supported on a contact portion of an elastic contact piece of a contact without having an IC tower. For example, it is shown in FIGS. 19 to 21.
[0010]
In such conventional IC socket contacts 1004A, B, C, as shown in FIGS. 19-21, the size of the contact portions 1012A, B is increased or decreased in the vertical direction, or the elastic contact pieces 1014B, The curve part of C is enlarged. However, even in the contacts 1004A to 1004C of the conventional IC sockets 1000A to 1000C, even if the elastic contact pieces 1014B and C can be largely bent, the wiping amount ΔX can be reduced, but the bent elastic contact portion 1014B is also reduced. , C may not be used for an automatic machine because the beam portion of C is located at a higher position above the contact portions 1012B, C. Further, if the contact portions 1012A, B are made larger or longer, the wiping amount ΔX is increased even if the required elastic displacement amount ΔY is obtained, and the external terminals 1011A, B which are the IC leads of the IC packages 1010A, B are connected to the contacts 1004A. , B contact parts 1012A, B may fall off, or problems such as increased dents. It should be noted that the elastic displacement amount and the wiping amount in the vertical direction in the contact of such a conventional IC socket have an elastic displacement amount ΔY of 0.3 to 1.0 mm and a wiping amount ΔX of about 0.1 to 0.4 mm, respectively. Thus, the elastic displacement amount ΔY has a required size, but the wiping amount ΔX tends to be too large.
[0011]
Accordingly, an object of the present invention is to eliminate such wiping in the IC terminal by suppressing sliding at the contact portion of the contact so as to eliminate the lateral wiping when the IC package is mounted. Another object of the present invention is to provide an IC socket that can reduce or eliminate damage.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, an IC socket of the present invention is an IC socket having a substrate and a plurality of contacts disposed on the substrate, wherein the contacts are in contact with an IC package extending from a contact base. And a contact piece that is elastically displaced and a control piece that contacts the restriction surface provided on the substrate when the contact piece is displaced and restricts the movement in the front-rear wiping direction. The contact piece forms an elastic arm part and has a contact part for supporting an external terminal of the IC package, and the control piece extends substantially vertically downward from the contact part of the contact piece, Formed as a sliding member with a restraining portion at the lower end, the control piece is in contact with the regulating surface provided on the substrate even before displacement. It is characterized by that.
[0015]
Also, The IC socket of the present invention is characterized in that the sliding member is provided so as to be slidable in the vertical direction along the regulating surface.
Furthermore, The IC socket of the present invention is The regulation surface is arranged before and after the control piece. It is characterized by that.
[0016]
Other objects, features and advantages of the present invention will become apparent from the following detailed description of the embodiments of the present invention illustrated in the accompanying drawings.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Example 1
1 to 4 are views showing an embodiment 1 of the IC socket of the present invention, FIG. 1 is a plan view of the IC socket, FIG. 2 is a central longitudinal sectional view of the IC socket of FIG. 1, and FIG. FIG. 4 is an enlarged partial view showing one of the contacts of the IC socket according to the present invention shown in FIGS. 1 to 3 when the IC package is mounted on the IC socket 2 and pressed.
[0018]
As shown in FIGS. 1 to 4, the IC socket 1 according to the first embodiment of the present invention includes a generally rectangular socket body 2 having a substantially rectangular depression 3 at the center, and a depression at the center of the socket body 2. It has a plurality of slits 4 arranged at regular intervals in three to four directions, and a contact 5 arranged in each of these slits 4.
[0019]
In such an IC socket 1 according to the present invention, the socket body 2 is formed in the hole 7 in the portion of the substrate 6 that forms the bottom of the slit 4, and substantially downward at right angles from the contact base portion 14 as the leg portion on the fixed side of the contact 5. The contact pin 5 is fixed by inserting the extending terminal pin portion 18.
[0020]
Thus, the contact 5 disposed in the socket body 2 elastically supports the IC package 10 and can be brought into contact with the external terminal 11 that is an IC lead of the IC package 10 so as to be elastically deformable. It is formed in a shape that is bent into a C-shape. That is, the contact 5 is elastically deformable to bend in a substantially U shape or C shape from a contact base portion 14 attached to the base plate 6 portion which is the bottom of the socket body 2 as one leg portion of a substantially U shape or flat C shape. An elastic contact piece is formed as a simple arm portion, and a contact piece 8 having a contact portion 16 for mounting and supporting an external terminal 11 such as an IC lead of the IC package 10, and vertically downward from the contact portion 16. It is mainly formed from the control piece 9 which has the suppression part 17 which extends in a lower end. Further, the contact 5 is provided with a terminal pin portion 18 that protrudes downward from the contact base portion 14. Accordingly, the contact 5 is fixed by being firmly press-fitted into the hole 7 of the board 6 portion which is the bottom of the socket body 2 at the base portion of the terminal pin portion 18 protruding from the contact base portion 14. Further, the contact 5 is formed so that the terminal pin portion 18 can be inserted into a terminal hole of a printed circuit board, a test board or the like, and is punched or pressed from a thin metal plate material having good conductivity. Is made by.
[0021]
Further, the restraining portion 17 of the contact 5 has an extended portion formed at the lower end portion of the control piece 9 extending downward from the contact portion 16 above the contact piece 8 in the vertical direction. The sliding member 12 is formed so as to be slidable along the wall 13 perpendicular to the opening or hole of the portion 3. In the illustrated contact 5, the distal end portion of the suppressing portion 17 is formed so as to be slidable in the vertical direction with respect to the opening of the recess portion 3 of the socket body 2 or the wall 13 of the hole.
[0022]
The vertical elastic displacement amount and wiping amount of the contact 5 of the IC socket 1 of the present invention are such that the elastic displacement amount ΔY is 0.3 to 1.0 mm and the wiping amount ΔX is 0.03. The required elastic displacement amount is obtained and the wiping amount is very small and almost equal to zero.
[0023]
In the IC socket 1 of the present invention configured as described above, the sliding member 12 extending downward from the contact portion 16 of the contact 5 with respect to the contact portion 16 of the contact piece 8 to which the IC package 10 is mounted. By providing the restraining portion 17 of the control piece 9 at the lower end via the contact 5, the contact 5 can favorably support the external terminal 11 of the IC package 10, and against the elastic displacement of the contact portion 16 of the contact 5 in the vertical direction. Since there is no lateral movement outward and the restraining portion 17 of the control piece 9 is guided and restrained along the wall 13 of the recess 3, the wiping amount of the contact portion 16 is very small, and the IC The external terminal 11 of the package 10 is not damaged or damaged, and the wiping by the contact portion 16 of the contact 5 can be reduced and almost eliminated. Moreover, in such a contact 5, since an IC tower mount is not used, a spring member such as a coil spring that elastically supports the IC tower mount is unnecessary, and the number of parts can be reduced. The assembly process can be reduced and the manufacturing cost can be reduced.
[0024]
Moreover, with such a configuration, the contact piece 8 having the elastic contact piece 15 and the control piece 9 having the restraining portion 17 can be achieved only by simple means, and a simple structure can be achieved. Thus, effects such as being able to manufacture at low cost and reducing the number of parts can be obtained.
[0025]
The IC package used in the IC socket of the present invention is an IC package such as a quad flat package or a small outline package. However, the IC package is not limited to such an IC package. Of course, an IC package of the same type can be used.
[0026]
(Example 2)
FIG. 5 is an enlarged partial view showing one of the contacts of the IC socket according to the second embodiment of the present invention.
[0027]
As shown in the drawing, the contact in the second embodiment of the present invention is configured so that the restraining portion is engaged with the hole provided in the substrate of the IC socket. The other details are substantially the same as those in the first embodiment.
[0028]
As illustrated, the contact 22 according to the second embodiment of the present invention includes a contact piece 23 and a control piece 24, a sliding member 25 having the contact piece 23 at the upper end and the control piece 24 at the lower end, and an IC socket. A contact base 26 to be attached and fixed to the substrate 20, an elastically displaceable elastic contact piece 27 extending upward from the contact base 26, and a control piece 24 at the lower end of the sliding member 25 are formed. It has a suppression portion 28 and a terminal pin portion 29 that extends downward from the contact base portion 26 and is fixedly inserted into the mounting hole of the board 20 of the socket body.
[0029]
In such a contact 22 of the present invention, the sliding member 25 is integrally formed so as to intersect with the end portion of the elastic contact portion 27 in a substantially T shape, and is formed to extend in the vertical direction. ing. Therefore, the control piece 24 at the lower end of the sliding member 25 of the contact 22 is formed so as to be engaged in the bottomed hole 21 provided in the board 20 of the socket body. Further, the hole 21 provided in the board 20 of the socket main body has a cross-sectional shape that is substantially the same as the cross-sectional shape of the suppressing portion 28 and has an elongated rectangular shape or a rectangular shape. It is fitted so that it can move up and down. Accordingly, when the contact piece 23 is pressed and the elastic contact piece 27 is elastically deformed, the suppressing portion 28 of the control piece 24 is engaged with the inside of the hole 21 of the board 20 of the socket body so as to be movable up and down. The cross-sectional shape of the hole 21 is not limited to a rectangle or a rectangle, but may be a circle or an ellipse.
[0030]
According to the contact 22 of the second embodiment of the present invention configured as described above, when the IC package is mounted on the contact piece 23 of the contact 22 and the contact piece 23 of the contact 22 is pressed, the sliding member 25 is provided. Since the control piece 24 at the lower end of the socket moves up and down in the hole 21 of the board 20 of the socket body, the hole 21 provides a sufficient elastic displacement amount ΔY and suppresses lateral wiping outward. The wiping can be suitably suppressed by only generating a slight wiping amount ΔX.
[0031]
As described above, the contact 22 in this second embodiment of the present invention is formed in a substantially U-shaped or C-shaped shape so that the IC package can be elastically supported. That is, the contact 22 has a substantially U-shaped or C-shaped contact base 26 attached on the board 20 of the socket body, and an elastically deformable elastic contact piece 27 bent upward from the contact base 26. A contact piece 23 as a terminal contact portion for mounting and supporting an external terminal such as an IC lead of an IC package formed at the tip of the other leg of the elastic contact piece 27 bent into a U-shape or C-shape; The control piece 24 is formed at the lower end portion of the straight sliding member 25 extending downward from the contact piece 23 and has a restraining portion 28 fitted into the hole 21 of the substrate 20 of the IC socket so as to be movable up and down. And have.
[0032]
Therefore, the contact 22 is firmly fixed by being inserted into the mounting hole of the board 20 portion of the socket main body at the base portion of the terminal pin portion 29 protruding downward from the contact base portion 26. In particular, it is preferable to provide a flange portion like a barb at the base portion of the terminal pin portion 29 as shown in FIG. Furthermore, the contact 22 is formed so as to protrude downward from the substrate 20 so that the terminal pin portion 29 can be inserted into a terminal hole of a printed circuit board, a test board or the like, and is a thin metal plate having good conductivity. It is made from materials by punching or pressing.
[0033]
In the contact 22 of the IC socket of the present invention configured as described above, the IC package is mounted on the socket body and is pressed against the first contact portion 23 which is a terminal contact portion by an appropriate pressing means. . As a result, the upper surface of the contact piece 23 at the upper end of the elastic contact piece 27 is firmly in contact with the lower surface of the external terminal of the IC package, and the elastic contact piece 27 is elastically displaced. Accordingly, the vertical and horizontal lateral displacements of the contact piece 23 of the contact 22 are, as is apparent from the figure, a vertical elastic displacement amount and a lateral elastic displacement amount, and the vertical elastic displacement amount. ΔY is about 0.3 to 1.0 mm, and the lateral wiping amount ΔX is about 0.03 to 0.07 mm. The necessary elastic displacement amount is obtained, and the wiping amount is very small and almost zero. equal.
[0034]
In the contact 22 of the IC socket of the present invention configured as described above, the control piece 24 is restrained at the lower end via the sliding member 25 extending downward with respect to the contact piece 23 to which the IC package is mounted. By providing the portion 28 and engaging in the bottomed hole 21 of the substrate 20 of the IC socket, the contact 22 can favorably support the external terminal of the IC package, and the vertical direction of the contact piece 23 of the contact 22 The lateral movement to the outside with respect to the elastic displacement of the control piece 24 is very small and hardly occurs, and the restraining portion 28 of the control piece 24 is guided and restrained in the vertical direction along the wall of the hole 21. The wiping amount of the piece 23 becomes very small. Thus, the contact 22 of the present invention does not cause dents or damage to the external terminals of the IC package, and the wiping by the contact piece 23 of the contact 22 can be reduced and almost eliminated. In addition, since the IC tower mount is not used in such a contact 22, a spring member such as a coil spring that elastically supports the IC tower mount is not required, and therefore the number of parts can be reduced. In addition, the assembly process can be reduced to reduce the manufacturing cost.
[0035]
Moreover, with such a configuration, the contact piece 23 supported by the elastic contact piece 27 and the control piece 24 having the suppressing portion 28 are provided in the contact 22, and the bottomed hole 21 is formed in the board 20 of the socket body. It is possible to achieve the intended purpose only by providing simple means, providing an effect that the structure can be manufactured inexpensively with a simple structure and the number of parts can be reduced. It is done.
[0036]
(Example 3)
FIG. 6 is an enlarged partial view showing one of the contacts of the IC socket according to the third embodiment of the present invention.
[0037]
As shown in the drawing, the contact in the third embodiment of the present invention is configured so that the restraining portion is engaged with a through hole provided in the substrate of the IC socket. The other details are substantially the same as those in the first embodiment.
[0038]
As shown in the figure, the contact 32 according to the third embodiment of the present invention includes a contact piece 33 and a control piece 34, a sliding member 35 having a contact piece 33 at the upper end and a control piece 34 at the lower end, and an IC socket. A contact base portion 36 to be attached and fixed to the substrate 30, an elastically displaceable elastic contact piece 37 extending upwardly from the contact base portion 36, and a control piece 34 at the lower end of the sliding member 35 are formed. It has a restraining portion 38 and a terminal pin portion 39 that extends downward from the contact base portion 36 and is fixedly inserted into the mounting hole of the board 30 of the socket body.
[0039]
In such a contact 32 of the present invention, the sliding member 35 is integrally formed so as to intersect with the end of the elastic contact portion 37 in a substantially T shape, and is formed to extend in the vertical direction. ing. Therefore, the control piece 34 at the lower end of the sliding member 35 of the contact 32 is formed so as to be engaged in the through hole 31 provided in the board 30 of the socket body. In addition, the hole 31 provided in the board 30 of the socket main body has a cross-sectional shape that is substantially the same as the cross-sectional shape of the suppressing portion 38 and has an elongated rectangular shape or a rectangular shape. It is fitted so that it can move up and down. As a result, when the contact piece 33 is pressed and the elastic contact piece 37 is elastically deformed, the suppressing portion 38 of the control piece 34 is engaged in the hole 31 of the board 30 of the socket body so as to move up and down. Moreover, the cross-sectional shape of the hole 31 is not limited to a rectangle or a rectangle, but may be a circle or an ellipse.
[0040]
According to the thus configured contact 32 of the third embodiment of the present invention, when the IC package is mounted on the contact piece 33 of the contact 32 and the contact piece 33 of the contact 32 is pressed, the sliding member 35 is provided. Since the control piece 34 at the lower end of the socket moves up and down in the hole 31 through which the board 30 of the socket body penetrates, the hole 31 provides a sufficient elastic displacement amount ΔY and suppresses lateral wiping outward. Thus, only a slight wiping amount ΔX is generated, and wiping can be suitably suppressed.
[0041]
As described above, the contact 32 in this third embodiment of the present invention is formed in a substantially U-shaped or C-shaped shape so as to elastically support the IC package. That is, the contact 32 includes a substantially U-shaped or C-shaped contact base 36 attached on the board 30 of the socket body, and an elastically deformable elastic contact piece 37 bent upward from the contact base 36. A contact piece 33 as a terminal contact portion for mounting and supporting an external terminal such as an IC lead of an IC package formed at the tip of the other leg of the elastic contact piece 37 bent into a U-shape or C-shape; The control piece 34 is formed at the lower end portion of the straight sliding member 35 extending downward from the contact piece 33 and has a restraining portion 38 that is fitted to the hole 31 of the substrate 30 of the IC socket so as to be movable up and down. And have.
[0042]
Therefore, the contact 32 is inserted into the mounting hole of the board 30 portion of the socket main body at the base portion of the terminal pin portion 39 protruding downward from the contact base portion 36 and firmly fixed. In particular, it is preferable to provide a flange portion like a barb at the base portion of the terminal pin portion 39 as shown in FIG. Furthermore, the contact 32 is formed so as to protrude downward from the substrate 30 so that the terminal pin portion 39 can be inserted into a terminal hole of a printed circuit board, a test board or the like, and is a thin metal plate having good conductivity. It is made from materials by punching or pressing.
[0043]
In the contact 32 of the IC socket of the present invention configured as described above, the IC package is mounted on the socket body and is pressed against the first contact portion 33 which is a terminal contact portion by an appropriate pressing means. . As a result, the upper surface of the contact piece 33 at the upper end of the elastic contact piece 37 is firmly in contact with the lower surface of the external terminal of the IC package, and the elastic contact piece 37 is elastically displaced. Accordingly, the vertical and horizontal lateral displacements of the contact piece 33 of the contact 32 are, as is apparent from the figure, a vertical elastic displacement and a lateral elastic displacement, and the required vertical elasticity. The displacement amount can be obtained and the lateral wiping amount is very small and can be suppressed to be almost equal to zero.
[0044]
In the contact 32 of the IC socket of the present invention configured as described above, the control piece 34 is restrained at the lower end via the sliding member 35 extending downward with respect to the contact piece 33 to which the IC package is mounted. By providing the portion 38 and engaging in the hole 31 through which the substrate 30 of the IC socket penetrates, the contact 32 can favorably support the external terminal of the IC package, and the contact piece 33 of the contact 32 can be supported in the vertical direction. Since the lateral movement to the outside is very small and hardly caused by the elastic displacement, the restraining portion 38 of the control piece 34 is guided and restrained along the wall of the hole 31 so as to be restrained. The amount of wiping 33 becomes very small. Thus, the contact 32 of the present invention does not cause dents or damage to the external terminals of the IC package, and the wiping by the contact piece 33 of the contact 32 can be reduced and almost eliminated. Further, since such an IC tower mount is not used in such a contact 32, a spring member such as a coil spring that elastically supports the IC tower mount is unnecessary, and therefore the number of parts can be reduced. In addition, the assembly process can be reduced to reduce the manufacturing cost.
[0045]
In addition, with such a configuration, the contact piece 33 supported by the elastic contact piece 37 and the control piece 34 having the suppressing portion 38 are provided in the contact 32, and the hole 31 penetrating the board 30 of the socket body is provided. It is possible to achieve the intended purpose with only simple means, and it is possible to produce an inexpensive structure with a simple structure and to reduce the number of parts. It is done.
[0046]
Example 4
FIG. 7 is an enlarged partial view showing one of the contacts of the IC socket according to the fourth embodiment of the present invention.
[0047]
As shown, the contact in the fourth embodiment of the present invention is configured such that the restraining portion is engaged with the surface of the upright wall provided on the substrate of the IC socket. 1 to 3 and the other details are substantially the same as those in Examples 1 to 3.
[0048]
As illustrated, the contact 42 according to the fourth embodiment of the present invention includes a contact piece 43 and a control piece 44, a sliding member 45 having the contact piece 43 at the upper end and the control piece 44 at the lower end, and an IC socket. A contact base 46 to be attached and fixed to the substrate 40, an elastically displaceable elastic contact piece 47 extending upwardly from the contact base 46, and a control piece 44 at the lower end of the sliding member 45 are formed. It has a restraining portion 48 and a terminal pin portion 49 that extends downward from the contact base portion 46 and is fixedly inserted into the mounting hole of the board 40 of the socket body.
[0049]
In such a contact 42 of the present invention, the sliding member 45 is integrally formed so as to intersect with the end of the elastic contact portion 47 in a substantially T shape, and is formed to extend in the vertical direction. ing. Therefore, the control piece 44 at the lower end of the sliding member 45 of the contact 42 is formed so as to be engaged with the surface of the upright wall 41 provided on the board 40 of the socket body. Further, the wall 41 provided on the board 40 of the socket body has a certain thickness, extends in the lateral direction (direction perpendicular to the paper surface), and the suppressing portion 48 is provided on the wall 41. It abuts so that it can move up and down along the surface. Accordingly, when the contact piece 43 is pressed and the elastic contact piece 47 is elastically deformed, the suppressing portion 48 of the control piece 44 can move in the vertical direction along the surface of the wall 41 of the board 40 of the socket body. .
[0050]
According to the contact 42 of the fourth embodiment of the present invention configured as described above, when the IC package is mounted on the contact piece 43 of the contact 42 and the contact piece 43 of the contact 42 is pressed, the sliding member 45. Since the control piece 44 at the lower end of the socket moves up and down along the surface of the wall 41 standing upright on the board 40 of the socket body, the wall 41 can provide a sufficient elastic displacement amount ΔY and a lateral direction outward. The wiping as the movement of is suppressed and only a slight amount of wiping ΔX, which is substantially equal to zero, is generated, and the wiping can be preferably suppressed.
[0051]
As described above, the contact 42 according to the fourth embodiment of the present invention is formed in a substantially U-shaped or C-shaped shape so that the IC package can be elastically supported. That is, the contact 42 has a substantially U-shaped or C-shaped contact base 46 attached on the board 40 of the socket body, and an elastically deformable elastic contact piece 47 that bends upward from the contact base 46. A contact piece 43 as a terminal contact portion for mounting and supporting an external terminal such as an IC lead of an IC package formed at the tip of the other leg of the elastic contact piece 47 bent in the U-shape or C-shape; The control piece 44 is formed at the lower end portion of the straight sliding member 45 extending downward from the contact piece 43 and has a restraining portion 48 fitted to the hole 41 of the substrate 40 of the IC socket so as to be movable up and down. And have.
[0052]
Accordingly, the contact 42 is inserted into the mounting hole of the board 40 portion of the socket body at the base portion of the terminal pin portion 49 protruding downward from the contact base portion 46 and firmly fixed. In particular, it is preferable to provide a flange portion like a barb at the base portion of the terminal pin portion 49 as shown in FIG. Furthermore, the contact 42 is formed so as to protrude downward from the substrate 40 so that the terminal pin portion 49 can be inserted into a terminal hole of a printed circuit board, a test board or the like, and is a thin metal plate having good conductivity. It is made from materials by punching or pressing.
[0053]
In the contact 42 of the IC socket of the present invention configured as described above, the IC package is mounted on the socket body and is pressed against the first contact portion 43 which is the terminal contact portion by an appropriate pressing means. . As a result, the upper surface of the contact piece 43 at the upper end of the elastic contact piece 47 is firmly brought into contact with the lower surface of the external terminal of the IC package, and the elastic contact piece 47 is elastically displaced. Accordingly, the vertical and horizontal lateral displacements of the contact piece 43 of the contact 42 are, as is apparent from the figure, the vertical elastic displacement and the lateral elastic displacement, and the required vertical elasticity. The displacement amount can be obtained and the lateral wiping amount is very small and can be suppressed to be almost equal to zero.
[0054]
In the contact 42 of the IC socket of the present invention configured as described above, the control piece 44 is restrained at the lower end via a sliding member 45 extending downward with respect to the contact piece 43 to which the IC package is mounted. By providing the portion 48 and engaging in the upright wall 41 of the substrate 40 of the IC socket, the contact 42 can favorably support the external terminal of the IC package, and the contact piece 43 of the contact 42 in the vertical direction Since the lateral movement to the outside is very small and hardly caused by the elastic displacement, the restraining portion 48 of the control piece 44 is guided and restrained along the wall 41 in the vertical direction. The amount of wiping becomes very small. Thus, the contact 42 of the present invention does not cause dents or damage to the external terminals of the IC package, and the wiping by the contact piece 43 of the contact 42 can be reduced and almost eliminated. In addition, since the IC tower mount is not used in such a contact 42, a spring member such as a coil spring that elastically supports the IC tower mount is unnecessary, and therefore the number of parts can be reduced. In addition, the assembly process can be reduced to reduce the manufacturing cost.
[0055]
In addition, with such a configuration, the contact piece 43 supported by the elastic contact piece 47 and the control piece 44 having the suppressing portion 48 are provided in the contact 42, and the wall 41 standing upright on the board 40 of the socket body is provided. It is possible to achieve the intended purpose with only simple means, and it is possible to produce an inexpensive structure with a simple structure and to reduce the number of parts. It is done.
[0056]
(Example 5)
FIG. 8 is an enlarged partial view showing one of the contacts of the IC socket according to the fifth embodiment of the present invention.
[0057]
As shown in the drawing, the contact in the fifth embodiment of the present invention is configured such that the restraining portion is engaged in a groove provided in the substrate of the IC socket, as in the first to fourth embodiments. The other details are substantially the same as those in the first to fourth embodiments.
[0058]
As shown, the contact 52 of the fifth embodiment of the present invention includes a contact piece 53 and a control piece 54, a sliding member 55 having the contact piece 53 at the upper end and the control piece 54 at the lower end, and an IC socket. A contact base 56 to be attached and fixed to the substrate 50, an elastically displaceable elastic contact piece 57 that bends upward from the contact base 56, and a control piece 54 at the lower end of the sliding member 55 are formed. It has a restraining portion 58 and a terminal pin portion 59 that extends downward from the contact base portion 56 and is fixedly inserted into the mounting hole of the board 50 of the socket body.
[0059]
In such a contact 52 of the present invention, the sliding member 55 is integrally formed so as to intersect with the end of the elastic contact portion 57 in a substantially T shape, and is formed to extend in the vertical direction. ing. Therefore, the control piece 54 at the lower end of the sliding member 55 of the contact 52 is engaged with the groove 51 provided in the board 50 of the socket body and extending in the lateral direction (perpendicular to the paper surface). Is formed. Further, the groove 51 provided in the board 50 of the socket body has a certain width and depth, and the restraining portion 58 can move in the vertical direction along the wall surface in the groove 51. Are fitted. As a result, when the contact piece 53 is pressed and the elastic contact piece 57 is elastically deformed, the restraining portion 58 of the control piece 54 can move up and down along the wall surface of the groove 51 provided in the board 50 of the socket body. It is mated.
[0060]
According to the contact 52 of the fifth embodiment of the present invention configured as described above, when the IC package is mounted on the contact piece 53 of the contact 52 and the contact piece 53 of the contact 52 is pressed, the sliding member 55 is provided. Since the control piece 54 at the lower end of the socket moves up and down in the groove 51 of the board 50 of the socket body, the groove 51 provides a sufficient elastic displacement amount ΔY, and wiping as a lateral movement outward is performed. The wiping can be suitably suppressed only by generating a very small amount of wiping ΔX. In addition, such a groove 51 may be provided with only one groove 51 for a plurality of contacts 52 to be aligned, can be easily processed, and the number of steps can be reduced.
[0061]
As described above, the contact 52 in this fifth embodiment of the present invention is formed in a substantially U-shaped or C-shaped shape so that the IC package can be elastically supported. That is, the contact 52 includes a substantially U-shaped or C-shaped contact base portion 56 attached on the board 50 of the socket body, and an elastically deformable elastic contact piece 57 bent upward from the contact base portion 56. A contact piece 53 as a terminal contact portion for mounting and supporting an external terminal such as an IC lead of an IC package formed at the tip of the other leg of the elastic contact piece 57 bent into a U-shape or C-shape; A control piece having a restraining portion 58 formed at the lower end portion of a straight sliding member 55 extending downward from the contact piece 53 and fitted into the groove 51 of the substrate 50 of the IC socket so as to be movable up and down. 54.
[0062]
Accordingly, the contact 52 is firmly fixed by being inserted into the mounting hole of the base plate 50 portion of the socket body at the base portion of the terminal pin portion 59 protruding downward from the contact base portion 56. In particular, it is preferable to provide a flange portion like a barb at the base portion of the terminal pin portion 59 as shown in FIG. Furthermore, the contact 52 is formed so as to protrude downward from the substrate 50 so that the terminal pin portion 59 can be inserted into a terminal hole of a printed circuit board, a test board or the like, and is a thin metal plate having good conductivity. It is made from materials by punching or pressing.
[0063]
In the contact 52 of the IC socket of the present invention configured as described above, the IC package is mounted on the socket body and is pressed against the first contact portion 53 which is a terminal contact portion by an appropriate pressing means. . As a result, the upper surface of the contact piece 53 at the upper end of the elastic contact piece 57 is firmly brought into contact with the lower surface of the external terminal of the IC package, and the elastic contact piece 57 is elastically displaced. Accordingly, the vertical and horizontal lateral displacements of the contact piece 53 of the contact 52 are, as is apparent from the figure, a vertical elastic displacement and a lateral elastic displacement, and the required vertical elasticity. The displacement amount can be obtained and the lateral wiping amount is very small and can be suppressed to be almost equal to zero.
[0064]
In the contact 52 of the IC socket of the present invention configured as described above, the control piece 54 is restrained at the lower end via the sliding member 55 extending downward with respect to the contact piece 53 to which the IC package is mounted. By providing the portion 58 and fitting into the groove 51 of the substrate 50 of the IC socket, the contact 52 can favorably support the external terminal of the IC package, and the elastic displacement of the contact piece 43 of the contact 52 in the vertical direction. In contrast, the lateral movement outward is very small and hardly occurs, and the restraining portion 58 of the control piece 54 is restrained by being guided in the vertical direction along the groove 51. Becomes very small.
[0065]
Thus, the contact 52 of the present invention does not cause dents or damage to the external terminals of the IC package, and wiping by the contact piece 53 of the contact 52 can be reduced and almost eliminated. In addition, since the IC tower mount is not used in such a contact 52, a spring member such as a coil spring that elastically supports the IC tower mount is unnecessary, and therefore the number of parts can be reduced. In addition, the assembly process can be reduced to reduce the manufacturing cost.
[0066]
In addition, by such a configuration, the contact piece 53 supported by the elastic contact piece 57 and the control piece 54 having the suppressing portion 58 are provided in the contact 52, and the groove 51 is provided in the board 50 of the socket body. Thus, the desired purpose can be achieved by simple means, and it is possible to produce an inexpensive structure with a simple structure and to reduce the number of parts.
[0067]
Example 6
FIG. 9 is an enlarged partial view showing one of the contacts of the IC socket according to the sixth embodiment of the present invention.
[0068]
As shown in the drawing, the contact in the sixth embodiment of the present invention is in contact with the wall surface provided so that the sliding member stands upright on the substrate of the IC socket, and the suppressing portion is fitted in the hole of the substrate. The configuration is different from that in the first to fifth embodiments, and the other details are substantially the same as those in the first to fifth embodiments.
[0069]
As shown in the drawing, the contact 62 according to the sixth embodiment of the present invention includes a contact piece 63 and a control piece 64, a sliding member 65 having the contact piece 63 at the upper end and the control piece 64 at the lower end, and an IC socket. A contact base portion 66 to be attached and fixed to the substrate 60, an elastically displaceable elastic contact piece 67 extending upwardly from the contact base portion 66, and a control piece 64 at the lower end of the sliding member 65 are formed. It has a restraining portion 68 and a terminal pin portion 69 that extends downward from the contact base portion 66 and is fixedly inserted into the mounting hole of the board 60 of the socket body.
[0070]
In such a contact 62 of the present invention, the sliding member 65 is integrally formed so as to intersect with the end portion of the elastic contact portion 67 in a substantially T shape, and is formed to extend in the vertical direction. ing. Accordingly, the sliding member 65 of such a contact 62 has a control piece 64 at the lower end thereof in contact with the surface of the upright wall 61 provided on the board 60 of the socket body, and a control piece at the lower end of the sliding member 65. 64 is formed so as to be fitted into a bottomed hole 61 </ b> A formed in the substrate 60. Further, the wall 61 provided on the board 60 of such a socket body stands upright on the board 60 with an arbitrary thickness, and a hole 61A is provided in a lower part of the wall 61, so that the suppressing portion 68 is provided. The holes 61A are engaged so that they can move in the vertical direction. Thereby, when the contact piece 63 is pressed and the elastic contact piece 67 is elastically deformed, the sliding member 65 slides in the vertical direction along the surface of the wall 61, and the restraining portion 68 of the control piece 64 is It is provided so that it can move up and down in a groove 61A formed in a lower part of the wall 61 of the board 60 of the socket body.
[0071]
According to the contact 62 of the sixth embodiment of the present invention configured as described above, when the IC package is mounted on the contact piece 63 of the contact 62 and the contact piece 63 of the contact 62 is pressed, the sliding member 65 is provided. Moves up and down along the surface of the wall 61, and the control piece 64 at the lower end of the sliding member 65 is fitted into the hole 61A of the board 60 of the socket body and moves up and down along the wall surface of the hole 61A. A sufficient elastic displacement amount ΔY in the vertical direction is obtained by the wall 61 and the hole 61A, and wiping as a lateral movement in the outward direction is suppressed, so that the wiping amount ΔX is small and substantially zero. Only by the occurrence of wiping, wiping can be suitably suppressed. In particular, since the sliding member 65 of the contact 62 is guided so as to move up and down along the wall 61, the forward tilting of the contact 62 can be suitably suppressed.
[0072]
As described above, the contact 62 in the sixth embodiment of the present invention is formed in a substantially U-shaped or C-shaped shape so that the IC package can be elastically supported. That is, the contact 62 has a substantially U-shaped or C-shaped contact base 66 attached on the board 60 of the socket body, and an elastically deformable elastic contact piece 67 bent upward from the contact base 66. A contact piece 63 as a terminal contact portion for mounting and supporting an external terminal such as an IC lead of an IC package formed at the tip of the other leg of the elastic contact piece 67 bent into the U-shape or C-shape; A straight sliding member 65 extending downward from the contact piece 63 and a lower portion of the wall 61 formed on the lower end portion of the sliding member 65 and standing upright on the substrate 60 of the IC socket. And a control piece 64 having a restraining portion 68 that is fitted in the groove 61A so as to be movable up and down.
[0073]
Accordingly, the contact 62 is firmly fixed by being inserted into the mounting hole of the board 60 portion of the socket body at the base portion of the terminal pin portion 69 protruding downward from the contact base portion 66. In particular, it is preferable to provide a hook portion like a barb at the base portion of the terminal pin portion 69 as shown in FIG. Furthermore, the contact 62 is formed so as to protrude downward from the substrate 60 so that the terminal pin portion 69 can be inserted into a terminal hole of a printed circuit board, a test board or the like, and is a thin metal plate having good conductivity. It is made from materials by punching or pressing.
[0074]
In the contact 62 of the IC socket of the present invention configured as described above, the IC package is mounted on the socket body and is pressed against the first contact portion 63 which is a terminal contact portion by an appropriate pressing means. . As a result, the upper surface of the contact piece 63 at the upper end of the elastic contact piece 67 is firmly brought into contact with the lower surface of the external terminal of the IC package, and the elastic contact piece 67 is elastically displaced. Accordingly, the vertical and horizontal lateral displacements of the contact piece 63 of the contact 62 are, as is apparent from the figure, a vertical elastic displacement amount and a lateral elastic displacement amount, and the required vertical elasticity. The displacement amount can be obtained and the lateral wiping amount is very small and can be suppressed to be almost equal to zero.
[0075]
In the contact 62 of the IC socket of the present invention configured as described above, the control piece 64 is restrained at the lower end via the sliding member 65 extending downward with respect to the contact piece 63 to which the IC package is mounted. By providing the portion 68 and fitting into the hole 61A of the wall 61 standing upright on the substrate 60 of the IC socket, the contact 62 can favorably support the external terminal of the IC package, and the contact piece 63 of the contact 62 The lateral movement to the outside is restrained by the elastic displacement in the up and down direction, and is hardly reduced so that the restraining portion 68 of the control piece 64 is fitted in the hole 61A and guided in the up and down direction. Therefore, the wiping amount of the contact piece 63 is almost eliminated.
[0076]
Thus, the contact 62 of the present invention does not cause dents or damage to the external terminals of the IC package, and the wiping by the contact piece 63 of the contact 62 can be made extremely small and almost eliminated. . In addition, since the IC tower mount is not used in such a contact 62, a spring member such as a coil spring that elastically supports the IC tower mount is unnecessary, and therefore the number of parts can be reduced. In addition, the assembly process can be reduced to reduce the manufacturing cost.
[0077]
Moreover, with such a configuration, the contact piece 63 supported by the elastic contact piece 67 and the control piece 64 having the suppressing portion 68 are provided in the contact 62, and the wall 61 upright on the board 60 of the socket body, By simply providing a hole 61A in the lower part, the intended purpose can be achieved, and the structure can be manufactured at low cost with a simple structure and the number of parts can be reduced. The effect that it can do is acquired.
[0078]
(Example 7)
FIG. 10 is an enlarged partial view showing one of the contacts of the IC socket according to the seventh embodiment of the present invention.
[0079]
As shown in the figure, in the contact in Example 7 of the present invention, the sliding member moves up and down along the wall provided upright on the substrate of the IC socket, and the suppressing portion is formed below this wall. It is different from that in the previous Examples 1 to 6 in that it is configured to be engaged in the formed through hole or groove, and in other details, it is the same as in Examples 1 to 6. Is substantially the same.
[0080]
As shown, the contact 72 of the seventh embodiment of the present invention includes a contact piece 73 and a control piece 74, a sliding member 75 having a contact piece 73 at the upper end and a control piece 74 at the lower end, and an IC socket. A contact base portion 76 to be attached and fixed to the substrate 70, an elastically displaceable elastic contact piece 77 extending upward from the contact base portion 76, and a control piece 74 at the lower end of the sliding member 75 are formed. It has a restraining portion 78 and a terminal pin portion 79 that extends downward from the contact base portion 76 and is fixedly inserted into the mounting hole of the board 70 of the socket body.
[0081]
In such a contact 72 of the present invention, the sliding member 75 is integrally formed so as to intersect with the end portion of the elastic contact portion 77 in a substantially T shape, and is formed to extend in the vertical direction. ing. Therefore, the control piece 74 at the lower end of the sliding member 75 of the contact 72 is formed to be engaged with the surface of the upright wall 71 provided on the board 70 of the socket body. Further, the wall 71 provided on the board 70 of the socket body has an arbitrary thickness and stands upright on the board 70. Furthermore, a lower portion of the wall 71 is provided with a through hole 71A or a groove, and the restraining portion 78 is engaged so as to be able to move vertically along the surface of the hole 71A or the groove. .
[0082]
As a result, when the contact piece 73 is pressed and the elastic contact piece 77 is elastically deformed, the sliding member 75 is brought into contact with the wall 71 of the socket body substrate 70 so as to move up and down. Furthermore, the restraining portion 78 of the control piece 74 at the lower end of the sliding member 75 is engaged in a hole 71A or a groove that penetrates the lower side of the wall 71 so as to be vertically movable.
[0083]
According to the thus configured contact 72 of the seventh embodiment of the present invention, when the IC package is mounted on the contact piece 73 of the contact 72 and the contact piece 73 of the contact 72 is pressed, the sliding member 75 is provided. Moves up and down along the surface of the wall 71 of the board 50 of the socket body, and the control piece 74 at the lower end of the sliding member 75 moves up and down along the surface in the hole 71A. A sufficient amount of elastic displacement ΔY in the required vertical direction can be obtained, and wiping as a lateral movement in the outward direction is suppressed, so that a very slight, substantially zero wiping amount ΔX is generated. Only by doing this, wiping can be suitably suppressed. In particular, since the sliding member 75 of the contact 72 is guided so as to move up and down along the wall 71, the forward tilting of the contact 72 can be suitably suppressed.
[0084]
As described above, the contact 72 in the seventh embodiment of the present invention is formed in a substantially U-shaped or C-shaped shape so as to elastically support the IC package. That is, the contact 72 includes a substantially U-shaped or C-shaped contact base portion 76 attached on the board 70 of the socket body, and an elastically deformable elastic contact piece 77 bent upward from the contact base portion 76. A contact piece 73 as a terminal contact portion for mounting and supporting an external terminal such as an IC lead of an IC package formed at the tip of the other leg of the elastic contact piece 77 bent into a U-shape or C-shape; The straight sliding member 75 extending downward from the contact piece 73 and the lower end portion of the sliding member 75 are fitted into the hole 71A or the groove of the substrate 70 of the IC socket so as to be movable up and down. And a control piece 74 having a suppression portion 78 to be operated.
[0085]
Therefore, the contact 72 is firmly fixed by being inserted into the mounting hole of the board 70 portion of the socket body at the base portion of the terminal pin portion 79 protruding downward from the contact base portion 76. In particular, it is preferable to provide a flange portion like a barb at the base portion of the terminal pin portion 79 as shown in FIG. Furthermore, the contact 72 is formed so as to protrude downward from the substrate 70 so that the terminal pin portion 79 can be inserted into a terminal hole of a printed circuit board, a test board or the like, and is a thin metal plate having good conductivity. It is made from materials by punching or pressing.
[0086]
In the contact 72 of the IC socket of the present invention configured as described above, the IC package is mounted on the socket body and is pressed against the first contact portion 73 which is a contact portion for terminals by an appropriate pressing means. . As a result, the upper surface of the contact piece 73 at the upper end of the elastic contact piece 77 is firmly in contact with the lower surface of the external terminal of the IC package, and the elastic contact piece 77 is elastically displaced. Accordingly, the vertical and horizontal lateral displacements of the contact piece 73 of the contact 72 are, as is apparent from the figure, the vertical elastic displacement amount and the lateral elastic displacement amount, and the required vertical elasticity. The displacement amount can be obtained and the lateral wiping amount is very small and can be suppressed to be almost equal to zero.
[0087]
In the contact 72 of the IC socket of the present invention configured as described above, the control piece 74 is restrained at the lower end via a sliding member 75 extending downward with respect to the contact piece 73 to which the IC package is mounted. By providing the portion 78 and engaging in the hole 71A or the groove of the substrate 70 of the IC socket, the contact 72 can favorably support the external terminal of the IC package, and the contact piece 73 of the contact 72 can be supported in the vertical direction. Since the lateral movement outward is very small with respect to the elastic displacement, the restraining portion 78 of the control piece 74 is restrained by being guided in the vertical direction along the hole 71A or the groove. The wiping amount of 73 becomes very small.
[0088]
Thus, the contact 72 of the present invention does not cause dents or damage to the external terminals of the IC package, and wiping by the contact piece 53 of the contact 72 can be reduced and almost eliminated. In addition, since the IC tower mount is not used in such a contact 72, a spring member such as a coil spring that elastically supports the IC tower mount is unnecessary, and therefore the number of parts can be reduced. In addition, the assembly process can be reduced to reduce the manufacturing cost.
[0089]
Moreover, with such a configuration, the contact piece 73 supported by the elastic contact piece 77 and the control piece 74 having the restraining portion 78 are provided on the contact 72, and the wall 71 standing upright on the board 70 of the socket body and its The intended purpose can be achieved by simple means only by providing the lower hole 71A or groove, and the structure can be manufactured at low cost with a simple structure and the number of parts can be reduced. The effect that it can do is acquired.
[0090]
(Example 8)
FIG. 11 is an enlarged partial view showing one of the contacts of the IC socket according to the eighth embodiment of the present invention.
[0091]
As shown in the figure, in the contact according to the eighth embodiment of the present invention, the sliding member moves up and down along the wall provided upright on the substrate of the IC socket, and the suppressing portion is formed below this wall. It is different from those in the first to seventh embodiments in that it is configured to be engaged in a space between the other wall and the first to seventh embodiments. This is substantially the same as in FIG.
[0092]
As shown in FIG. 11, the contact 82 according to the eighth embodiment of the present invention has substantially the same configuration as the contact according to the first to seventh embodiments. That is, the contact 82 is attached to and fixed to the contact piece 83 and the control piece 84, the sliding member 85 having the contact piece 83 at the upper end and the control piece 84 at the lower end, and the substrate 80 of the IC socket. A contact base 86; an elastically displaceable elastic contact piece 87 extending upwardly from the contact base 86; a restraining part 88 forming a control piece 84 at the lower end of the sliding member 85; and a downward direction from the contact base 86. And a terminal pin portion 89 that extends and is inserted into the mounting hole of the board 80 of the socket body and fixed.
[0093]
In such a contact 82 of the present invention, the sliding member 85 is integrally formed so as to intersect with the end portion of the elastic contact portion 87 in a substantially T shape, and is formed to extend in the vertical direction. ing. Therefore, the control piece 84 at the lower end of the sliding member 85 of the contact 82 is brought into contact with the surface of the upright wall 81 provided on the board 80 of the socket body, and between the other wall 81A. It is formed so as to be engaged in the void. Further, the wall 81 provided on the board 80 of the socket main body has an arbitrary thickness, and stands upright on the board 80, and another small wall 81A below the wall 81 is controlled. It is provided so as to form a space necessary for the restraining portion 88 of the piece 84 to be engaged. Accordingly, a space or a gap is provided between the lower portion of the wall 81 and another wall 81A, and the restraining portion 88 along with the sliding member 85 along the surface of the wall 81 and the wall 81 Another small wall 81A is provided so as to form a space or a gap between them, and the restraining portion 88 is engaged so as to be able to move up and down in the space.
[0094]
As a result, when the contact piece 83 is pressed and the elastic contact piece 87 is elastically deformed, the sliding member 85 is brought into contact with the wall 81 of the board 80 of the socket body so as to move up and down. Furthermore, the restraining portion 88 of the control piece 84 at the lower end of the sliding member 85 is engaged in a space between the wall 81 and another small wall 81A below the wall 81 so as to be movable up and down. .
[0095]
According to the contact 82 of the eighth embodiment of the present invention configured as described above, when the IC package is mounted on the contact piece 83 of the contact 82 and the contact piece 83 of the contact 82 is pressed, the sliding member 85 is provided. Moves up and down along the surface of the wall 81 of the board 80 of the socket body, and the control piece 74 at the lower end of the sliding member 85 moves up and down along the surface in the space between the wall 81 and the other wall 81A. Therefore, the space between the wall 81 and the wall 81A can provide a sufficient amount of elastic displacement ΔY in the required vertical direction, and wiping as a lateral movement outward can be suppressed, so that a slight amount of wiping can be achieved. Wiping can be suitably suppressed only by the occurrence of ΔX. In particular, since the sliding member 85 of the contact 82 is guided so as to move up and down along the wall 81, the forward tilting of the contact 82 can be suitably suppressed.
[0096]
As described above, the contact 82 in the eighth embodiment of the present invention is formed in a substantially U-shaped or C-shaped shape so that the IC package can be elastically supported. That is, the contact 82 has a substantially U-shaped or C-shaped contact base 86 attached on the board 80 of the socket body, and an elastically deformable elastic contact piece 87 bent upward from the contact base 86. A contact piece 83 as a terminal contact portion for mounting and supporting an external terminal such as an IC lead of an IC package formed at the tip of the other leg of the U-shaped or C-shaped elastic contact piece 87; A straight sliding member 85 extending downward from the contact piece 83, and a space between the wall 81 of the substrate 80 of the IC socket and another wall 81A formed at the lower end of the sliding member 85. And a control piece 84 having a restraining portion 88 that is fitted so as to be movable up and down.
[0097]
Therefore, the contact 82 is firmly fixed by being inserted into the mounting hole of the board 80 portion of the socket body at the base portion of the terminal pin portion 89 protruding downward from the contact base portion 86. In particular, it is preferable to provide a flange portion like a barb at the base portion of the terminal pin portion 89 as shown in FIG. Furthermore, the contact 82 is formed so as to protrude downward from the substrate 80 so that the terminal pin portion 89 can be inserted into a terminal hole of a printed circuit board, a test board or the like, and is a thin metal plate having good conductivity. It is made from materials by punching or pressing.
[0098]
In the contact 82 of the IC socket of the present invention configured as described above, the IC package is mounted on the socket body and is pressed against the first contact portion 83 which is a terminal contact portion by an appropriate pressing means. . As a result, the upper surface of the contact piece 83 at the upper end of the elastic contact piece 87 is firmly in contact with the lower surface of the external terminal of the IC package, and the elastic contact piece 87 is elastically displaced. Accordingly, the vertical and horizontal lateral displacements of the contact piece 83 of the contact 82 are, as is apparent from the figure, a vertical elastic displacement amount and a lateral elastic displacement amount, and the required vertical elasticity. The displacement amount can be obtained and the lateral wiping amount is very small and can be suppressed to be almost equal to zero.
[0099]
In the contact 82 of the IC socket of the present invention configured as described above, the control piece 84 is restrained at the lower end via a sliding member 85 extending downward with respect to the contact piece 83 to which the IC package is mounted. By providing the portion 88 and engaging in the space between the wall 81 and the wall 81A of the substrate 80 of the IC socket, the contact 82 can favorably support the external terminal of the IC package. The lateral movement outward is very small with respect to the elastic displacement of the piece 83 in the vertical direction, and the restraining portion 88 of the control piece 84 moves up and down in the space between the wall 81 and the wall 81A. Therefore, the amount of wiping of the contact piece 83 becomes very small.
[0100]
Thus, the contact 82 of the present invention does not cause dents or damage to the external terminals of the IC package, and the wiping by the contact piece 83 of the contact 82 can be reduced and almost eliminated. In addition, since the IC tower mount is not used in such a contact 82, a spring member such as a coil spring that elastically supports the IC tower mount is unnecessary, and therefore the number of parts can be reduced. In addition, the assembly process can be reduced to reduce the manufacturing cost.
[0101]
Moreover, with such a configuration, the contact piece 83 supported by the elastic contact piece 87 and the control piece 84 having the restraining portion 88 are provided in the contact 82, and separately from the wall 81 standing upright on the board 80 of the socket body. It is possible to achieve the intended purpose only with simple means by providing the wall 81A, and it can be manufactured at a low cost with a simple structure and the number of parts can be reduced. The effect that it can do is acquired.
[0102]
(Other examples)
FIGS. 12 to 16 show IC socket contacts in Examples 9 to 13 as other examples of the present invention.
[0103]
The contact 90 in the ninth embodiment shown in FIG. 12 is attached to the contact piece 91 and the control piece 92, the sliding member 93 having the contact piece 91 at the upper end and the control piece 92 at the lower end, and the substrate of the IC socket. A contact base 94 to be fixed, an elastically displaceable elastic contact piece 95 extending upwardly from the contact base 94, a restraining part 98 forming a control piece 92 at the lower end of the sliding member 93, It has a terminal pin portion 99 that extends downward from the contact base portion 94 and is fixedly inserted into the mounting hole of the socket body.
[0104]
In such a contact 90 of the present invention, in particular, the elastic contact piece 95 forming the arm portion has a shape in which the three bent portions 95A, 95B, and 95C are continuously connected, and the amount of elastic displacement in the vertical direction. It is comprised so that it can fully be obtained. Therefore, the contact 90 may be formed in any complicated shape even if the shape of the elastic contact piece 95 is formed.
[0105]
13 includes a contact piece 101 and a control piece 102, a sliding member 103 having a relatively long contact piece 101 at the upper end and the control piece 102 at the lower end, and an IC socket. A contact base 104 to be fixed to the substrate, an elastically displaceable elastic contact piece 105 extending upwardly from the contact base 104, and a control piece 102 at the lower end of the sliding member 103. It has a restraining portion 108 and a terminal pin portion 109 that extends downward from the contact base portion 104 and is fixed by being inserted into the mounting hole of the socket body.
[0106]
In such a contact 100 of the present invention, the elastic contact piece 105 forming the arm portion is configured to have a curvature 105A formed so as to protrude upward, and accordingly, a sufficient vertical direction can be obtained. It is ensured that an elastic displacement amount is obtained. Therefore, the contact 100 may be formed such that the length of the contact piece 101 may be increased, or the elastic contact piece 105 may be formed so as to be provided with a large bent portion 105A. Of course, the curved portion 105A is made to have a size that does not interfere with the attachment to other equipment such as an automatic machine.
[0107]
The contact 110 in Example 11 shown in FIG. 14 is attached to the contact piece 111 and the control piece 112, the sliding member 113 having the contact piece 111 at the upper end and the control piece 112 at the lower end, and the substrate of the IC socket. The contact base 114 to be fixed, the elastic contact piece 115 elastically displaceable extending upward from the contact base 114 in a substantially U shape, and the control piece 112 at the lower end of the sliding member 113. Part 118 and a terminal pin part 119 which extends downward from the contact base part 114 and is fixedly inserted into the mounting hole of the board of the socket body.
[0108]
In such a contact 110 of the present invention, the sliding member 113 is formed so as to be bent in a shape that is offset from the center, particularly in a stepped shape, whereby the suppressing portion 118 is formed on the bottom of the board of the socket body. It is configured so that wiping can be satisfactorily suppressed by suitably fitting or engaging with a hole, groove, or through hole. Accordingly, if the contact 110 is formed so that the restraining portion 118 at the lower end of the sliding member 113 can always be fitted into the hole, groove, or hole of the board of the socket body, the upper and lower portions of the sliding member 113 are arranged. The center may be formed in a stepped shape and may not be straight.
[0109]
Further, the contact 120 in the twelfth embodiment shown in FIG. 15 has the contact piece 121 and the control piece 122, the contact piece 121 at the upper end, the control piece 122 at the lower end, and the contact piece 121 at the upper end shifted from the center. A sliding member 123 formed in a step shape, a contact base 124 to be attached and fixed to the substrate of the IC socket, and elastically displaceable extending from the contact base 124 in a substantially U-shape upwardly. The elastic contact piece 125, the restraining part 128 that forms the control piece 122 at the lower end of the sliding member 123, and the terminal pin that extends downward from the contact base part 124 and is inserted into the mounting hole of the board of the socket body and fixed. Part 129.
[0110]
In such a contact 120 of the present invention, the contact piece 121 and the control piece 122 are formed so as to be out of center, and the sliding member 123 is a hole, groove, or hole provided in the board of the socket body. And the like, and a sufficient amount of elastic displacement in the vertical direction can be obtained, so that wiping can be suppressed. Therefore, even if the contact 120 is not centered on the contact piece 121 and the control piece 122 and the control piece 122 is not located directly below the contact piece 121, the contact 120 can be used in any way as long as it can prevent forward tilt. .
[0111]
16 includes a contact piece 131 and a control piece 132, a sliding member 133 having a relatively small contact piece 131 at the upper end and the control piece 132 at the lower end, and an IC socket. Suppression of forming a contact base 134 to be attached and fixed to the substrate, an elastically displaceable elastic contact piece 135 that bends upward from the contact base 134, and a control piece 132 at the lower end of the sliding member 133 And a terminal pin portion 139 which extends downward from the contact base portion 134 and is fixedly inserted into the mounting hole of the socket body.
[0112]
In such a contact 130 of the present invention, the contact piece 131 is formed to be relatively small, and the elastic contact piece 135 is formed so as to have a relatively large bent portion 135A. The displacement amount is ensured and wiping can be suppressed. Therefore, the contact 130 may be such that the contact piece 131 is relatively small, the bent portion 135A of the elastic contact piece 135 protrudes upward, and the contact piece 131 is not above the elastic contact piece 135.
[0113]
In the contact of the IC socket of the present invention configured as described above, a control piece restraining portion is provided at the lower end of the contact piece to which the IC package is mounted via a sliding member extending downward. The contact can favorably support the external terminal of the IC package by engaging in the hole or groove of the substrate of the IC socket or by sliding the sliding member along the wall surface standing upright on the substrate. It is possible to control the forward tilt of the contact. Furthermore, in the contact according to the present invention, the lateral movement of the contact piece in the lateral direction is very small with respect to the vertical elastic displacement of the contact piece. However, since it is suppressed by being guided in the vertical direction along the hole or groove, the wiping amount of the contact piece is very small and can be suppressed to almost zero.
[0114]
As described above, the contact of the present invention does not cause dents or damage to the external terminals of the IC package, and the wiping by the contact piece of the contact can be reduced and almost eliminated. In addition, since the IC tower mount is not used in such a contact, a spring member such as a coil spring that elastically supports the IC tower mount is unnecessary, and therefore the number of parts can be reduced. The assembly process can be reduced to reduce the manufacturing cost.
[0115]
Moreover, with such a configuration, the contact piece supported by the elastic contact piece and the control piece having the restraining portion are provided on the contact, and the wall upright on the board of the socket body and the hole or groove below the wall are provided. It is possible to achieve the intended purpose only by providing simple means, and it can be manufactured inexpensively with a simple structure, and the number of parts can be reduced. can get.
[0116]
【The invention's effect】
An IC socket according to claim 1 of the present invention is an IC socket having a substrate and a plurality of contacts arranged on the substrate, wherein the contacts are elastically displaced by being in contact with an IC package extending from a contact base. Contact piece to be contacted with a regulating surface provided on the substrate when the contact piece is displaced, and a control piece for regulating the movement in the front-rear wiping direction. In this case, the wiping of the IC terminal can be suppressed and almost no lateral wiping can be achieved, so that the dent and damage of the IC terminal can be reduced or eliminated. There are no dents or damage to the external terminals of the IC package, and wiping by the contact piece of the contact can be reduced and almost eliminated, and since no IC tower mount is used, the IC tower mount A spring member such as a coil spring that is elastically supported is also unnecessary, so that the number of parts can be reduced, the assembly process can be reduced, and the manufacturing cost can be reduced.
[0117]
In the IC socket according to claim 2 of the present invention, since the contact piece or the control piece is in contact with the regulating surface provided on the substrate even before the displacement, the wiping can be satisfactorily suppressed.
[0118]
According to a third aspect of the present invention, there is provided the IC socket according to the present invention, wherein the contact piece includes a contact part that forms an elastic arm part and supports an external terminal of the IC package, and the control piece is the contact piece. Since it has a sliding member that extends substantially vertically downward from the contact part and has a restraining part at the lower end, it is possible to sufficiently secure the elastic displacement in the vertical direction and suitably suppress the wiping by suppressing the lateral elastic displacement. it can.
[0119]
In the IC socket according to claim 4 of the present invention, since the sliding member is provided so as to be slidable in the vertical direction along the regulating surface, a sufficient amount of elastic displacement in the vertical direction can be obtained. Lateral wiping can be satisfactorily suppressed.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC socket according to a first embodiment of the present invention.
2 is a central longitudinal sectional view of the IC socket of the present invention of FIG.
3 is a central longitudinal cross-sectional view when measuring by mounting an IC package on the IC socket of the present invention of FIG. 1. FIG.
4 is an enlarged partial view showing one of the contacts of the IC socket of the present invention shown in FIG. 1; FIG.
FIG. 5 is an enlarged partial view showing one of the contacts in the embodiment 2 of the IC socket of the present invention.
FIG. 6 is an enlarged partial view showing one of the contacts in the embodiment 3 of the IC socket of the present invention.
FIG. 7 is an enlarged partial view showing one of the contacts in Embodiment 4 of the IC socket of the present invention.
FIG. 8 is an enlarged partial view showing one of the contacts in the fifth embodiment of the IC socket of the present invention.
FIG. 9 is an enlarged partial view showing one of contacts in Embodiment 6 of the IC socket of the present invention.
FIG. 10 is an enlarged partial view showing one of contacts in an embodiment 7 of the IC socket of the present invention.
FIG. 11 is an enlarged partial view showing one of the contacts in the eighth embodiment of the IC socket of the present invention.
FIG. 12 is an enlarged partial view showing one of the contacts in the ninth embodiment of the IC socket of the present invention.
FIG. 13 is an enlarged partial view showing one of contacts in an IC socket according to a tenth embodiment of the present invention.
14 is an enlarged partial view showing one of the contacts in the eleventh embodiment of the IC socket of the present invention. FIG.
FIG. 15 is an enlarged partial view showing one of the contacts in the twelfth embodiment of the IC socket of the present invention.
FIG. 16 is an enlarged partial view showing one of the contacts in Example 13 of the IC socket of the present invention.
FIG. 17 is a perspective view of a conventional IC socket with a cover member opened.
18 is an enlarged partial view showing one of the contacts of the conventional IC socket of FIG.
FIG. 19 is an enlarged partial view showing another contact in the conventional IC socket.
FIG. 20 is an enlarged partial view showing still another contact in the conventional IC socket.
FIG. 21 is an enlarged partial view showing still another contact in the conventional IC socket.
[Explanation of symbols]
1 IC socket
2 Socket body
3 depressions
4 slits
5 Contact
6 Substrate
7 holes
8 Contact pieces
9 Control piece
10 IC package
11 External terminal (IC lead)
12 Sliding member
13 Wall
14 Contact base
15 Elastic contact piece
16 Contact area
17 Suppression part
18 Terminal pin part
20 Board (IC socket)
21 holes
22 contacts
23 Contact piece
24 Control piece
25 Sliding member
26 Contact base
27 Elastic contact piece
28 Suppression part
29 Terminal pin part
30 Substrate (for IC socket)
31 holes
32 contacts
33 Contact piece
34 Control piece
35 Sliding member
36 Contact base
37 Elastic contact piece
38 Suppressor
39 Terminal pin
40 Board (IC socket)
41 walls
42 contacts
43 Contact piece
44 Control piece
45 Sliding member
46 Contact base
47 Elastic contact piece
48 Suppressor
49 Terminal pin
50 PCB (for IC socket)
51 holes
52 contacts
53 Contact piece
54 Control piece
55 Sliding member
56 Contact base
57 Elastic contact piece
58 Suppressor
59 Terminal pin part
60 Board (IC socket)
61 wall
61A hole
62 contacts
63 Contact piece
64 Control piece
65 Sliding member
66 Contact base
67 Elastic contact piece
68 Suppressor
69 Terminal pin
70 Board (IC socket)
71 wall
71A Groove
72 contacts
73 Contact piece
74 Control piece
75 Sliding member
76 Contact base
77 Elastic contact piece
78 Suppression part
79 Terminal pin part
80 PCB (IC socket)
81 walls
81A wall
82 contacts
83 Contact piece
84 Control piece
85 Sliding member
86 Contact base
87 Elastic contact piece
88 Suppressor
89 Terminal pin
90 contacts
91 Contact piece
92 Control piece
93 Sliding member
94 Contact base
95 Elastic contact piece
95A Folding Club
98 suppression part
99 Terminal pin part
100 contacts
101 Contact piece
102 Control piece
103 Sliding member
104 Contact base
105 Elastic contact piece
105A Folding Club
108 Suppressor
109 Terminal pin
110 contacts
111 Contact piece
112 Control piece
113 Sliding member
114 Contact base
115 Elastic contact piece
118 Suppressor
119 Terminal pin part
120 contacts
121 Contact piece
122 Control piece
123 Sliding member
124 Contact base
125 Elastic contact piece
128 Suppressor
129 Terminal pin part
130 contacts
131 Contact piece
132 Control piece
133 Sliding member
134 Contact base
135 Elastic contact piece
135A Folding Club
138 Suppression part
139 Terminal pin part

Claims (3)

In an IC socket having a substrate and a plurality of contacts disposed on the substrate,
The contact is in contact with an IC package that extends from the contact base and is elastically displaced when in contact with a regulating surface provided on the substrate when the contact piece is displaced. have a control piece to regulate,
The contact piece has an elastic arm part and has a contact part that supports an external terminal of the IC package. The control piece extends substantially vertically downward from the contact part of the contact piece, and has a lower end. Formed as a sliding member with a restraining part,
The IC socket , wherein the control piece is in contact with a regulating surface provided on the substrate even before displacement .   The IC socket according to claim 1, wherein the sliding member is provided so as to be slidable in the vertical direction along the restriction surface. The IC socket according to claim 2, wherein the restricting surface is disposed before and after the wiping direction with respect to the sliding member.

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