JP3877870B2

JP3877870B2 - Substrate molding die and method for adjusting thickness of molded substrate in substrate molding die

Info

Publication number: JP3877870B2
Application number: JP14022698A
Authority: JP
Inventors: 和夫井上; 吉弘川▲さき▼
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1997-05-30
Filing date: 1998-05-21
Publication date: 2007-02-07
Anticipated expiration: 2018-05-21
Also published as: JPH1142648A

Description

【０００１】
【発明の属する技術分野】
本発明は、例えば、光ディスク等に使用する樹脂基板を成形することに利用可能な、基板成形金型、及び基板成形金型における成形基板の板厚調整方法に関するものである。
【０００２】
【従来の技術】
従来より、メモリ媒体としての光ディスクの基板の成形には樹脂材料が用いられている。この基板は、嵌合する一対の金型である固定金型と可動金型との間に形成した隙間に、溶融樹脂を流入させた後に、固化させて成形するものである。
【０００３】
そこで従来は、成形された基板の板厚分布が、金型を形成する部材の加工精度で決まっていた。しかし、光ディスクの記録容量が大きくなるにつれて光ディスク基板に要求される板厚の精度が高くなってきた。これは、基板のチルトの影響を低減するために基板の板厚を薄くする必要があるためである。
【０００４】
特開平７−２６６３７８号公報には、固定金型と可動金型との接合面を形成する接合部材とこれを取り付ける取付型板との間にシムを設ける方法が開示されている。この場合、キャビティ厚が変わるため基板の外径を形作る外周リングを弾性部材でスタンパ側に押し当てている。
【０００５】
図１９にその金型の断面図を示す。固定金型１０１と可動金型１０２とは締まって固定突当リング１０３と可動突当リング１０４とが当たって止まる。固定突当リング１０３は固定取付型板１０５とシム１０６を介して嵌合する。固定取付型板１０５には内周側に向かって、順に固定鏡面盤１０７、固定ブッシュ１０８、スプルブッシュ１０９が設けられている。固定鏡面盤１０７上にはスタンパ１１０が、内周と外周とをそれぞれ、スタンパホルダー１１１、外周リング１１２とで保持されている。外周リング１１２は可動金型１０２と連動して動く構造のため、弾性部材であるバネ１１３でスタンパ１１０側に押し当てている。可動金型１０２側は、可動突当リング１０４が可動取付型板１１４にボルト止めされており、内周側に順に可動鏡面盤１１５、可動ブッシュ１１６、エジェクタパンチ１１７、カットパンチ１１８、エジェクタピン１１９が設けられている。固定鏡面盤１０７および可動鏡面盤１１５には、それぞれ、温調溝１２０および１２１が設けられている。成形基板の板厚の調整はシム１０６の板厚を変えることで行う。
【０００６】
【発明が解決しようとする課題】
しかしながら、このような特開平７−２６６３７８号公報で示された従来の方法では、固定金型と可動金型とが突き当てられた際に両金型間に形成されるキャビティの厚みを規定する箇所にシムを配置している。そのために、成形された基板の全体的な厚みの調整は可能であるが、成形された基板の面内ばらつき、すなわち、径方向や周方向の厚みのばらつきを抑制することは困難である。
【０００７】
本発明は、このような従来の金型の課題を考慮し、成形基板の厚みばらつきを抑制することができる基板成形金型、及び基板成形金型における成形基板の板厚調整方法を提供することを目的とする。
【０００８】
【課題を解決するための手段】
第1の本発明（請求項１記載の本発明に対応）は、基板を成形する一対の基板成形部材と、
前記一対の基板成形部材の内、一方の基板成形部材を保持する固定基盤と、
前記一対の基板成形部材の内、他方の基板成形部材を保持する可動基盤と、
前記一対の基板成形部材が嵌合された際、それら一対の基板成形部材の間に、前記基板を成形する所定の隙間を設けるために互いに突き当てられる、前記固定基盤及び可動基盤に設けられ且つ前記基板成形部材より外側の位置に配置された一対の突当部材と、
前記隙間を調整するために、前記一方の基板成形部材と前記固定基盤との間及び／又は前記他方の基板成形部材と前記可動基盤との間であって、且つ、前記突当部材の内側に配置される隙間調整手段とを備えた基板成形金型である。
【０００９】
又、第２の本発明（請求項２記載の本発明に対応）は、前記基板成形部材が複数の金型構成部材の組み合わせにより構成されている場合、前記複数の金型構成部材の内、全部又は一部の金型構成部材と前記基盤との間に、前記隙間調整手段が設けられている上記第１の発明の基板成形金型である。
【００１０】
又、第３の本発明（請求項３記載の本発明に対応）は、前記基板成形部材に形成された、温度調整用の媒体を流す溝を覆うための蓋部材を備え、
前記隙間調整手段が、前記蓋部材と前記固定基盤又は可動基盤との間に設けられている上記第１の発明の基板成形金型である。
【００１１】
又、第４の本発明（請求項４記載の本発明に対応）は、前記突当部材は環状につながっており、
前記基盤と前記基板成形部材との接合面の外周端が、前記突当部材の内周壁面に当たる位置に、前記基盤の段差があり、
前記隙間調整手段が、前記基盤の段差がある前記突当部材の内周壁面に隣接して配置されている上記第1の発明の基板成形金型である。
【００１２】
又、第５の本発明（請求項５記載の本発明に対応）は、前記基板成形部材は、前記隙間に通じる貫通孔を中央部に有し、かつ前記貫通孔から一端側の外周部がはみ出して嵌合するように配置された環状部材を含み、
前記基盤と前記環状部材以外の前記基板成形部材との接合面の内周端が、前記環状部材の前記外周部の壁面に当たる位置に、前記基盤の段差があり、
前記隙間調整手段が、前記基盤の段差がある前記環状部材の前記外周部の壁面に隣接して配置されている上記第１の発明の基板成形金型である。
【００１３】
又、第１６の本発明（請求項１６記載の本発明に対応）は、基板を成形する一対の基板成形部材と、
前記一対の基板成形部材の内、一方の基板成形部材を保持する固定基盤と、
前記一対の基板成形部材の内、他方の基板成形部材を保持する可動基盤と、
前記一対の基板成形部材が嵌合された際、それら一対の基板成形部材の間に、前記基板を成形する所定の隙間を設けるために互いに突き当てられる、前記固定基盤及び可動基盤に設けられ且つ前記基板成形部材より外側の位置に配置された一対の突当部材とを備えた基板成形金型における成形基板の板厚調整方法であって、
前記隙間を調整するために、前記一方の基板成形部材と前記固定基盤との間及び／又は前記他方の基板成形部材と前記可動基盤との間であって、且つ、前記突当部材の内側に隙間調整手段を配置する基板成形金型における成形基板の板厚調整方法である。
【００１４】
又、第１７の本発明（請求項１７記載の本発明に対応）は、前記基板成形部材が複数の金型構成部材の組み合わせにより構成されている場合、
前記隙間調整手段を、前記複数の金型構成部材の内、全部又は一部の金型構成部材と前記基盤との間に設ける上記第１６の発明の基板成形金型における成形基板の板厚調整方法である。
【００１５】
又、第１８の本発明（請求項１８記載の本発明に対応）は、前記基板成形部材に設けられた、温度調整用の媒体を流す溝を覆うための蓋部材が設けられている場合、
前記隙間調整手段を、前記蓋部材と前記固定基盤又は可動基盤との間に設ける上記第１６の発明の基板成形金型における成形基板の板厚調整方法である。
【００１６】
又、第１９の本発明（請求項１９記載の本発明に対応）は、前記突当部材は環状につながっており、前記基盤と前記基板成形部材との接合面の外周端が、前記突当部材の内周壁面に当たる位置に、前記基盤の段差がある場合、
前記隙間調整手段を、前記基盤の段差がある前記突当部材の内周壁面に隣接して配置することを特徴とする上記第１６の発明の基板成形金型における成形基板の板厚調整方法である。
【００１７】
又、第２０の本発明（請求項２０記載の本発明に対応）は、前記基板成形部材は、前記隙間に通じる貫通孔を中央部に有し、かつ前記貫通孔から一端側の外周部がはみ出して嵌合するように配置された環状部材を含み、
前記基盤と前記環状部材以外の前記基板成形部材との接合面の内周端が、前記環状部材の前記外周部の壁面に当たる位置に、前記基盤の段差がある場合、
前記隙間調整手段を、前記基盤の段差がある前記環状部材の前記外周部の壁面に隣接して配置する上記第１６の発明の基板成形金型における成形基板の板厚調整方法である。
【００１８】
【発明の実施の形態】
以下、本発明の実施の形態について、図１から図１８を用いて説明する。
【００１９】
（実施の形態１）
本発明の基板成形用金型の実施の形態１を示す断面図を図１に示す。
【００２０】
図１に示すように、金型は、摺動しない固定金型１と摺動する可動金型２とからなる。
【００２１】
図１では、スタンパ３を固定金型１側に装着する場合を示す。スタンパ３は、内周および外周をスタンパホルダー４と外周リング５とで固定鏡面盤６に固定される。固定鏡面盤６は温調溝７があり、温調溝７をふさぐように固定鏡面盤６はＯリングを介して固定金型基盤８にボルト止めされている。
【００２２】
この固定鏡面盤６と固定金型基盤８との接合面にはシム９が配されている。固定鏡面盤６の内側には順にスタンパホルダー４、固定ブッシュ１０、スプルブッシュ１１が設けられている。スプルブッシュ１１には孔があり、ここから溶融樹脂が金型内に流入する。また、固定ブッシュ１０と固定金型基盤８との接合面にはスプルブッシュ１１に嵌合する環状のシム１２がある。尚、本発明の一方の基板成形部材は、スタンパ３、スタンパホルダー４、固定鏡面盤６、及び固定ブッシュ１０等を含むものである。
【００２３】
シム９は成形基板の径方向と周方向の板厚ばらつきを調整するために設ける。一方、シム１２はシム９を設けた結果、固定ブッシュ１０と固定金型基盤８との間に生じる隙間を埋めるために設ける。したがって、シム９を設けても固定ブッシュ１０と固定金型基盤８との間に隙間が生じない場合はシム１２は必要ない。
【００２４】
シム９は固定鏡面盤６と固定金型基盤８とに挟まれて押さえつけられることで、摩擦力によって固定される。ここでシム９を配置する際に、耐熱粘性流体、例えば、グリースをシム９に塗布するとシム９が一時固定されるため、固定鏡面盤６と固定金型基盤８とを接合する場合にシム９の移動が抑制され、設定通りの設置が容易になる。
【００２５】
金型は高温になるため塗布液は耐熱性が必要である。また、金型は多数の部品から構成されているため分解組立をするごとにミクロンオーダーで部材間の寸法が変わる。したがって、シム９を接着剤で固定しないことが好ましい。
【００２６】
シム１２はスプルブッシュ１１によって位置が規定されて移動が抑制される。
【００２７】
一方、可動金型２では、可動突当リング１４が固定突当リング１３と突当り、金型内にキャビティ１５が形成される。この可動突当リング１４は、可動金型基盤１６にボルト止めする。可動突当リング１４より内周側には、順に、可動鏡面盤１７、可動ブッシュ１８、エジェクタパンチ１９、カットパンチ２０、エジェクタピン２１が設けられている。カットパンチ２０は成形基板の内周に孔を形成するものであり、エジェクタパンチ１９とエジェクタピン２１は、基板とスプルとを、それぞれ、押し出す役割を持つ。可動鏡面盤１７にも温調溝２２が設けられている。尚、本発明の他方の基板成形部材は、可動鏡面盤１７、可動ブッシュ１８、及びエジェクタパンチ１９等を含むものである。
【００２８】
２３はバネであり、外周リング５をスタンパ３側に押しつけるものである。
【００２９】
内径１５ｍｍ、外径１２０ｍｍ、板厚０．６ｍｍの樹脂基板を成形する金型に用いるシム９，１２として、幅が１０ｍｍで、厚みが５μｍ，１０μｍ，１５μｍ，・・・，５０μｍまでの５μｍ毎に厚みの設定されたものを用意し、次の様な実験を行った。
【００３０】
図２は、シムの配置を示す平面図である。又、図３（ａ）は、シムを挿入しないで成形した成形基板３０１ａの板厚分布を示す図であり、図３（ｂ）は、図２に示した配置にシムを挿入して成形した成形基板３０１ｂの板厚分布を示す図であり、図中に示す板厚の単位はｍｍである。
【００３１】
この場合、図２に示すシムの配置は、固定突当リング１３の内側の固定金型基盤８上を可動金型２側から固定金型１側を見た場合のものであり、図２中、最外周円２０１は、図１で示した固定鏡面盤６の外周部に対応し、最内周円２０２は、図１で示した固定ブッシュ１０の中央の孔の内縁部に対応している。又、図３（ａ）、図３（ｂ）に示す基板３０１ａ、３０１ｂの板厚の分布図の向きは、図２に示すシムの配置図の向きに対応している。
【００３２】
基板の板厚の測定位置は、同図に示す様に、半径２３ｍｍ，４０ｍｍ，５８ｍｍ（図中では、それぞれ、符号３０２，３０３，３０４を付した）の３つの同心円周上であり、且つ、金型の鉛直上方を基準として４５度間隔で基板の中心から延びる放射状の８本の直線上の、各交点の位置である。即ち、各基板毎に、各円周上においてそれぞれ８箇所、合計２４箇所について板厚を測定した。又、シムの厚みは、図２に示す通り、シム９ａ、９ｂ、１２の順に、それぞれ５μｍ、２０μｍ、２０μｍである。又、成形条件は、最大型締め圧は２０トン、金型温度は１２５℃、サイクルは８秒とした。
【００３３】
この結果、シムを入れない従来構成の場合は、図３（ａ）に示す通り、最大板厚が０．６１８ｍｍ、最小板厚が０．５８６ｍｍであることから、成形基板１枚内の板厚ばらつきは、最大３２μｍとなり、３０μｍ以上あった。これに対して、シムを挿入した本実施の形態の構成では、図３（ｂ）に示す通り、最大板厚が０．６０７ｍｍ、最小板厚が０．５９９ｍｍであることから、成形基板１枚内の板厚ばらつきは、最大８μｍとなり、１０μｍ未満にまでばらつき幅を小さくすることが出来た。
【００３４】
ここで、板厚ばらつきの分布と、シムの配置の関係について図２、図３（ａ）を参照しながら述べる。
【００３５】
即ち、図２に示す様に、中央部にシム９ｂとして２０μｍの板厚のものを入れたのは、シムを入れない場合の、半径２３ｍｍの円周（図３（ａ）中、符号３０２を付した点線の円周に対応）上での板厚が、半径５８ｍｍの円周（図３（ａ）中、符号３０４を付した点線の円周に対応）上での板厚より約２０μｍ厚いためである。
【００３６】
又、図２に示す様に、外周部にシム９ａとして５μｍの板厚のものを入れたのは、シムを入れない場合に周方向で生じている約１０μｍの板厚差（図３（ａ）参照）を改善するためである。即ち、シム９ａを図中に示した位置に入れて、固定鏡面盤６を全体的に傾けることにより、周方向の板厚のばらつきを低減した。
【００３７】
図１では、シム９は固定鏡面盤６の内外周に配しているが、シム９は溝７のない面ならどこに敷いても良い。
【００３８】
（実施の形態２）
本発明の基板成形用金型の実施の形態２を示す断面図を図４に示す。
【００３９】
図１と比べて異なるのは、第１に、固定鏡面盤６の温調溝７を覆う蓋板２４を設け、固定鏡面盤６を蓋板２４を介して固定金型基盤８に固定する構造とし、シム９をその蓋板２４と固定金型基盤８との間に配した点である。
【００４０】
第２に、シム９ａが、固定突当リング１３の内周壁面１３ａと隣接して配置されており、又、シム９ｂが、固定ブッシュ１０の外周壁面１０ａと隣接して配置されている点である。
【００４１】
固定鏡面盤６と固定金型基盤８との間に蓋板２４を設けたことによって、温調溝７を流れる媒体が漏れる可能性はなくなる。また、シムを敷く位置の制限が実施の形態１よりなくなる。さらに、固定鏡面盤６と蓋板２４とをボルト止め等で一体にすることで固定金型基盤８と固定鏡面盤６との着脱が容易になる。
【００４２】
また、シム９を配する接合面の端面に環状部材を嵌合させることで、シム９が他部材の接合面に移動する可能性がなくなる。
【００４３】
このシム９にも、実施の形態１と同様に、耐熱粘性流体、例えば、グリースをシム９に塗布するとシム９が一時固定されるため、蓋板２４と固定金型基盤８とを接合する場合にシム９の移動が抑制され、設定通りの設置が容易になる。
【００４４】
シム１２は実施の形態１と同様に環状とした。シム１２はスプルブッシュ１１に規定されて移動が抑制される。
【００４５】
内径１５ｍｍ、外径１２０ｍｍ、板厚０．６ｍｍの樹脂基板を成形する金型に用いるシム９，１２として、幅が５ｍｍで、厚みが５μｍ，１０μｍ，１５μｍ，・・・，５０μｍまでの５μｍ毎に厚みの設定されたものを用意し、次の様な実験を行った。
【００４６】
図５は、シムの配置を示す図である。又、図６（ａ）は、シムを挿入しないで成形した成形基板３０１ａの板厚分布を示す図であり、図３（ｂ）は、図５に示した配置にシムを挿入して成形した成形基板３０１ｂの板厚分布を示す図であり、図中に示す板厚の単位はｍｍである。
【００４７】
この場合、図５に示すシムの配置は、固定突当リング１３の内側の固定金型基盤８上を可動金型２側から固定金型１側を見た場合のものであり、図５中、最外周円２０１は、図４で示した固定鏡面盤６の外周部に対応し、最内周円２０２は、図４で示した固定ブッシュ１０の中央の孔の内縁部に対応している。又、図５中、周円５０１は、図４で示した固定ブッシュ１０の外周部１０ａに対応している。又、図６（ａ）、図６（ｂ）に示す基板３０１ａ、３０１ｂの板厚の分布図の向きは、図５に示すシムの配置図の向きに対応している。
【００４８】
基板の板厚の測定位置は、図３（ａ）で説明した内容と同じである。又、シムの厚みは、図５に示す通りである。又、成形条件は、図３（ａ）、図３（ｂ）で述べたものと同じである。
【００４９】
この結果、シムを入れない従来構成の場合は、図６（ａ）に示す通り、最大板厚が０．６１８ｍｍ、最小板厚が０．５８７ｍｍであることから、成形基板１枚内の板厚ばらつきは、最大３１μｍであった。これに対して、シムを挿入した本実施の形態の構成では、図６（ｂ）に示す通り、最大板厚が０．６０３ｍｍ、最小板厚が０．５９７ｍｍであることから、成形基板１枚内の板厚ばらつきは、最大６μｍとなり、１０μｍ未満にまでばらつき幅を小さくすることが出来た。
【００５０】
ここで、板厚ばらつきの分布と、シムの配置の関係について図５、図６（ａ）を参照しながら述べる。
【００５１】
シムを入れない場合の板厚分布は、図６（ａ）に示すよう、径方向では、半径２３ｍｍの円周上での板厚が、半径５８ｍｍの円周上での板厚より約２０μｍ強厚い。シム９ｂとして板厚２０μｍのものを入れたとして、半径２３ｍｍ、４０ｍｍ，５８ｍｍの円周上での板厚値から、０．６１０ｍｍ，０．６００ｍｍ，０．５９０ｍｍを引くと、周方向では、基板３０１ａ上の右上が１０μｍ強厚いことがわかる（図６（ａ）参照）。
【００５２】
そこで、シム９ａとシム９ｂを図５に示す位置に入れた。又、基板３０１ａ上の右上の半径４０ｍｍの円周上で、僅かに盛り上がっている。そこで、シム９ｃを図５に示す位置に入れて、その盛り上がりを矯正した。
【００５３】
ここで、シム１２は環状のものを用いたが異なっても良い。この場合、シム１２の位置は内側をスプルブッシュ１１で規定される。一方、シム１２の位置の外側は固定側金型基盤８に設けた段差によって規定される。
【００５４】
（実施の形態３）
本発明の基板成形用金型の実施の形態３を示す断面図を図７に示す。又、図８（ａ）は、シムの配置を示す平面図である。この場合、図８（ａ）に示すシムの配置は、固定突当リング１３の内側の固定金型基盤８上を可動金型２側から固定金型１側を見た場合のものであり、図８（ａ）中、最外周円２０１は、図７で示した固定鏡面盤６の外周部に対応し、最内周円２０２は、図７で示した固定ブッシュ１０の中央の孔の内縁部に対応している。又、図８（ａ）中、周円５０１は、図７で示した固定ブッシュ１０の外周部１０ａに対応している。
【００５５】
実施の形態２との相違点はシム９を環状としたことであり、実施の形態２と同様に接合面の端面で環状部材と隣接するように配置している。具体的な環状部材は、内周側が固定ブッシュ１０であり、外周側が固定突当リング１３である。この結果、シム９の移動は抑制される。
【００５６】
シム９は内周と外周とで厚みを調整することによって成形基板のばらつきを抑制できる。ここで、環状のシム９の別の例として、図８（ｂ）に示すように、その板厚が環状内の場所によって異なる様な形状のものを用いても良い。図８（ｂ）は、場所によって板厚の異なる環状シムの平面図及び断面図を示している。
【００５７】
また、シム１２も環状で、スプルブッシュ１１によって位置が規定されて移動が抑制される。
【００５８】
内径１５ｍｍ、外径１２０ｍｍ、板厚０．６ｍｍの樹脂基板を成形する金型に用いるシム９，１２として、幅が１０ｍｍで、厚みが５μｍ，１０μｍ，１５μｍ，・・・，５０μｍまでの５μｍ毎に厚みの設定されたものを用意して、上記実施の形態と同様の実験を行った。成形条件も上記実施の形態と同様である。
【００５９】
この結果、シムを入れない従来構成の場合は、成形基板１枚内の板厚ばらつきは、最大３０μｍ以上であったが、シムを挿入した本実施の形態の構成では、そのばらつきは、最大１５μｍ未満にまでばらつき幅を小さくすることが出来た。又、図８（ｂ）に示したシムを用いた場合は、最大１０μｍ未満にまでばらつき幅を小さくすることが出来た。
【００６０】
ここではシム１２に環状のものを用いたが、異なるものを用いても構わない。
【００６１】
又、図８（ａ）には、シム９として、異なる径のものを２枚挿入している例を示したが、ばらつきの分布の状況によっては、一方のみでも良い。
【００６２】
（実施の形態４）
本発明の基板成形用金型の実施の形態４を示す断面図を図９に示す。又、図１０は、シム１２とピン２５ａ、２５ｂの配置を示す平面図である。この場合、図１０に示すシム１２とピン２５の配置は、固定突当リング１３の内側の固定金型基盤８上を可動金型２側から固定金型１側を見た場合のものであり、図１０中、最外周円２０１は、図９で示した固定鏡面盤６の外周部に対応し、最内周円２０２は、図９で示した固定ブッシュ１０の中央の孔の内縁部に対応している。
【００６３】
図４と異なるのは、シム９を敷く接合面を形成する部材に複数の凹凸の嵌合部を設け、凸部に嵌入する孔をシム９に設けた点である。図９では、図１１（ａ）に示すように、固定金型基盤８にピン２５を嵌入し、蓋板２４でのピン２５が対応する箇所にピン２５が挿入される凹部を形成している。そして、孔を有するシム９をピン２５に嵌入した後にシム９は固定鏡面盤６と固定金型基盤８とで押さえつけられる。この結果、シム９の移動が抑制される。
【００６４】
シム１２は環状である。したがって、シム１２は嵌合するスプルブッシュ１１で規定され、移動が抑制される。
【００６５】
ピン２５の断面形状とシム９に有する孔の形状を図１１（ｂ）から図１１（ｆ）に示す。図１１（ｂ）のように１個の円形のピン２５で１個のシム９を固定する場合はピン回りに回転する移動が考えられる。そこで、図１１（ｃ）に示すようにシム９に通すピン２５の数が複数であれば回転移動は抑制される。
【００６６】
また、１つのシム９に通すピン２５の数が１個であってもピン２５の断面形状およびシム９の孔形状が真円以外であればシム９の回転移動は抑制される。ピン２５の断面形状およびシム９の孔形状は、例えば多角形、好ましくは図１１（ｄ）および（ｅ）に示す四角形か三角形、あるいは図１１（ｆ）に示す長円がある。
【００６７】
また、１つのシム９に通すピンの数が１個であっても、シム９を接合面の端面と嵌合する環状部材と隣接するように配置すればシム９の回転移動は抑制される。
【００６８】
例えば、図９に示すように、蓋板２４と固定金型基盤８との接合面４０１が、固定突当リング１３の内周壁面と当たる位置に段差４０２が形成されている。この段差４０２の内周部分に、シム９ａの端面が隣接するように、シム９ａとシム９ａが嵌入するピン２５ａを配置すれば良い。又、同様に、上記接合面４０１が、固定ブッシュ１０の外周壁面と当たる位置に段差４０３が形成されている。この段差４０３の外周部分に、シム９ｂの端面が隣接するように、シム９ｂとシム９ｂが嵌入するピン２５ｂを配置すれば良い。
【００６９】
以上のどの構成においても、内径１５ｍｍ、外径１２０ｍｍ、板厚０．６ｍｍの樹脂基板を成形する金型に用いるシム９，１２として、幅が１０ｍｍで、厚みが５μｍ，１０μｍ，１５μｍ，・・・，５０μｍまでの５μｍ毎に厚みの設定されたものを用意し、次の様な実験を行った。成形条件は、上記実施の形態と同様で、最大型締め圧は２０トン、金型温度は１２５℃、サイクルは８秒とした。
【００７０】
その結果、成形基板１枚内の板厚ばらつきは、従来構造の場合は３０μｍ以上あったが、本発明の実施の形態４では１０μｍ未満になった。また、定期的に金型を外してシム９とシム１２の移動を調べたところシム９とシム１２の移動は見られなかった。
【００７１】
実施の形態４ではピン２５を固定金型基盤８側に設け、ピン２５が入る凹部を蓋板２４側に設けたが、反対にピン２５を蓋２４側に設ける構成であっても構わない。
【００７２】
また、シム１２にもシム９と同様に孔を設け、この孔に嵌入するピンを設けても良い。
【００７３】
さらに、シムを嵌入する凸部として部材に嵌入するピンではなしに金型部材を直接加工しても構わない。
【００７４】
（実施の形態５）
本発明の基板成形用金型の実施の形態５を示す断面図を図１２に示す。
【００７５】
図１２に示す構成は、図１の構成と比べて、固定鏡面盤６に凸部を設け、それと嵌合する凹部を固定金型基盤８に設け、凹凸の嵌合部の当たり平面間にシム９を設けている点が異なる。
【００７６】
また、固定ブッシュに凸部を設け、それと嵌合する凹部を固定金型基盤８に設け、凹凸の嵌合部の当たり平面間にシム１２を設けている点が異なる。
【００７７】
シム９とシム１２は凹部の底部と同じ形状で、かつ、その底部にはまっているため移動が抑制される。
【００７８】
この凹凸部の位置は、接合面に散在していれば良いが、一様に散在しているかキャビティ１５と同心円上に存在することが好ましい。凹凸部を同心円上に設ける場合は少なくとも接合面の内周と外周とに設ける必要がある。これは、内周と外周とに設けたシム９の厚みを調整することで、成形基板の径方向のばらつきを抑制できるからである。また、周方向に設けた複数のシム９の厚みを調整することで、成形基板の周方向のばらつきを抑制できるからである。
【００７９】
図１３に、シム９又は１２を挿入するための凹部６０１の配置を表した平面図を示す。この場合、図１３に示す凹部６０１の配置は、固定突当リング１３の内側の固定金型基盤８上を可動金型２側から固定金型１側を見た場合のものである。図１３中、最外周円２０１は、図１２で示した固定鏡面盤６の外周部に対応し、最内周円２０２は、図１２で示した固定ブッシュ１０の中央の孔の内縁部に対応している。
【００８０】
ここでは、シムの外形、及び凹部の断面形状は円形とした。凹部の直径は１０ｍｍ、シムの直径は９ｍｍとした。
【００８１】
又、内径１５ｍｍ、外径１２０ｍｍ、板厚０．６ｍｍの樹脂基板を成形する金型に対して、シム９、１２として、５μｍから５０μｍまで５μｍ毎の厚みのものを用意して、上記実施の形態と同様の実験を行った。成形条件も上記実施の形態と同様である。
【００８２】
この結果、シムを入れない従来構成の場合は、成形基板１枚内の板厚ばらつきは、最大３０μｍ以上であったが、シムを挿入した本実施の形態の構成では、最大１０μｍ未満にまでばらつき幅を小さくすることが出来た。
【００８３】
また、本実施の形態では、シムの外形を円形としたが、これに限らず、シムの外形は凹部に入ればどのような形状でも勿論良い。また、凹部の断面形状は円形でなくてもかまわない。
【００８４】
（実施の形態６）
本発明の基板成形用金型の実施の形態６を示す断面図を図１４に示す。
【００８５】
図１４に示す構成では、図４に示すシム９の代わりに、蓋板２４と固定金型基盤８との接合面に突き当て部材２６を設けている。詳細には、図１６（ａ）に示すように、本発明の突出部材に対応するこの突き当て部材２６は周囲にネジ山が切ってあり、固定金型基盤８に設けた側面にネジ山を有する凹部にねじ込まれている。そこで、この突き当て部材２６は回転させることで固定金型基盤８からの飛び出し量を調整できる。尚、本発明の突出量は、この飛び出し量に対応する。
【００８６】
具体的には、突き当て部材２６の直径を１０ｍｍ、ネジ山のピッチを０．５ｍｍとすると、飛び出し量を１０μｍ調整するのに、５０分の１回転させることになる。そこで、飛び出し量を調整するには、図１７（ａ）、図１７（ｂ）に示すように、回転比の異なるギアなどを用い、例えば、調整側を１０回転させると突き当て部材２６を１回転させる治具を用いると良い。
【００８７】
尚、図１７（ａ）は、図１７（ｂ）のＡＡ断面図である。図１７（ａ）に示す７０２〜７０４は回転比の異なるギヤである。又、図１７（ｂ）に示す、先端部７０１が、突き当て部材２６側である。
【００８８】
又、突き当て部材２６の頭には溝があり、この溝に、図１７（ｂ）に示す工具の先端部７０１をはめ込み回転が容易に出来るようにしてある。溝形状としては、真円以外で有れば良く、例えば、図１６（ｂ）から（ｅ）に示すようなマイナス、プラス、四角形、六角形等がある。
【００８９】
この突き当て部材２６は蓋板２４と固定金型基盤８との接合面に散在していれば良いが、一様に散在しているかキャビティ１５と同心円上に存在することが好ましい。これは、周方向に設けた複数の突き当て部材２６の突出量を調整することで成形基板の周方向のばらつきを抑制できるからである。また、突き当て部材２６を同心円上に設ける場合は少なくとも接合面の内周と外周とに設ける必要がある。これは、内周と外周とに設けた突き当て部材２６の突出量を調整することで成形基板の径方向のばらつきを抑制できるからである。
【００９０】
図１５に、凹凸部の配置の一例を表した平面図を示す。この場合、図１５に示す凹凸部（突き当て部材２６）の配置は、固定突当リング１３の内側の固定金型基盤８上を、可動金型２側から固定金型１側に向かって見た場合のものである。
【００９１】
シム１２は環状で、内周と外周を、それぞれ、スプルブッシュ１１と固定金型基盤８とで規定される。
【００９２】
内径１５ｍｍ、外径１２０ｍｍ、板厚０．６ｍｍの樹脂基板を成形する金型に対して、シム１２として、５μｍから５０μｍまで５μｍ毎の厚みのものを用意して、かつ、突き当て部材２６の突出量を調整して、上記実施の形態と同様の実験を行った。成形条件も上記実施の形態と同様である。
【００９３】
この結果、従来構成の場合は、成形基板１枚内の板厚ばらつきは、最大３０μｍであったが、突き当て部材２６を利用した本実施の形態の構成では、最大１０μｍ未満にまでばらつき幅を小さくすることが出来た。
【００９４】
突き当て部材２６は、固定金型基盤８に螺入しているため固定されているので横方向へは移動しない。しかし、回転する可能性がある。そこで、ネジ部には接着剤等で回転を防止する必要がある。
【００９５】
機械的にネジ部の回転を抑制する構成を図１６（ｆ）（ｇ）に示す。図１６（ｆ）は断面図であり、図１６（ｇ）は突き当て部材２６の頭側から見た平面図である。固定金型基盤８の突き当て部材２６が嵌入する箇所の表面に座ぐりを設け、回転止めとしてナット２７を突き当て部材２６と嵌合する。ナット２７を固定金型基盤８に押しつけることで突き当て部材２６と固定金型基盤８のネジ部にあった隙間をなくして突き当て部材２６の回転が抑制される。
【００９６】
もちろん、固定ブッシュ１０と固定金型基盤８との接合面に、シム１２の代わりに突き当て部材を用いても構わない。
【００９７】
（実施の形態７）
本発明の基板成形用金型の実施の形態７を示す断面図を図１８に示す。
【００９８】
上記実施の形態では、隙間調整手段が固定金型１側にある場合を示してきたが、実施の形態７では隙間調整手段が可動金型２側にある。
【００９９】
可動鏡面盤１７の温調溝２２を覆うように蓋板２８が可動鏡面盤１７と接合され、蓋板２８は可動金型基盤１６と接合する。
【０１００】
蓋板２８と可動金型基盤１６との接合面の外周側にピン２９とシム３０とを設ける。シム３０にはピン２９が差し込まれる孔を設けている。このピン２９と対応する蓋板２８にはへこみが設けられ、ピン２９が当たらなくしてある。そして、シム３０がこのピン２９に嵌合することで、シム３０は固定され移動しなくなる。
【０１０１】
シム３１は環状をしており、可動金型基盤１６と蓋板２８との間および可動金型基盤１６と可動ブッシュ１８との間にまたがって敷いてある。これは、可動鏡面盤１７と可動ブッシュ１８とが隣接し、かつ、可動金型基盤１６と同一平面で接するような構造になっているためである。
【０１０２】
成形基板の径方向のばらつきはシム３０とシム３１との厚み調整で抑制し、周方向のばらつきはシム３０の周方向の厚み調整で抑制する。
【０１０３】
内径１５ｍｍ、外径１２０ｍｍ、板厚０．６ｍｍの樹脂基板を成形する金型に対して、シム３０とシム３１としては、その幅がそれぞれ１０ｍｍと２０ｍｍのもであり、厚みが５μｍから５０μｍまで５μｍ毎の厚みのものを用意して、上記実施の形態と同様の実験を行った。成形条件も上記実施の形態と同様である。
【０１０４】
この結果、シムを利用しない従来構成の場合は、成形基板１枚内の板厚ばらつきは、最大３０μｍであったが、シム３０，３１を利用した本実施の形態の構成では、最大１０μｍ未満にまでばらつき幅を小さくすることが出来た。
以上の実施の形態では固定金型もしくは可動金型に鏡面盤の温調溝を覆う蓋板を設け、蓋板と金型基盤との接合面にピンとシムを設けたが、もちろん、両金型にピンとシムとを設けても良い。
【０１０５】
また、ピンは金型基盤側でなく蓋板側に固定される構造でも良い。
【０１０６】
また、ピンの断面形状およびシムの孔形状は真円以外であれば良い。
【０１０７】
以上のように本発明によれば、成形基板の１枚内の板厚ばらつきが１０μｍ未満の高精度が得られる。
【０１０８】
即ち、成形基板の板厚調整をきめ細かく行うことが可能で、成形基板の径方向や周方向に発生する厚みのばらつきを低減することが出来る。
【０１０９】
また、成形動作を継続し続けても、上記精度が持続されるという顕著な効果が得られる。
【０１１０】
【発明の効果】
以上述べたところから明らかなよう本発明は、成形基板の厚みばらつきを抑制することができるという長所を有する。
【図面の簡単な説明】
【図１】本発明の実施の形態１の基板成形用金型を示す断面図
【図２】本発明の実施の形態１の基板成形用金型のシムの配置を示す平面図
【図３】（ａ）：本発明の実施の形態１の基板成形用金型にシムを挿入する前の基板の板厚分布図
（ｂ）：本発明の実施の形態１の基板成形用金型にシムを挿入した後の基板の板厚分布図
【図４】本発明の実施の形態２の基板成形用金型を示す断面図
【図５】本発明の実施の形態２の基板成形用金型のシムの配置を示す平面図
【図６】（ａ）：本発明の実施の形態２の基板成形用金型にシムを挿入する前の基板の板厚分布図
（ｂ）：本発明の実施の形態２の基板成形用金型にシムを挿入した後の基板の板厚分布図
【図７】本発明の実施の形態３の基板成形用金型を示す断面図
【図８】（ａ）：本発明の実施の形態３の基板成形用金型のシムの配置を示す平面図
（ｂ）：本発明の実施の形態３の基板成形用金型のシムの形状を示す平面図と断面図
【図９】本発明の実施の形態４の基板成形用金型を示す断面図
【図１０】本発明の実施の形態４の基板成形用金型のシムとピンの配置を示す平面図
【図１１】（ａ）：本発明の実施の形態４の基板成形用金型のピンとシムとの構成を示した断面図
（ｂ）：本発明の実施の形態４の基板成形用金型のシム形状を示した平面図
（ｃ）：本発明の実施の形態４の基板成形用金型のシム形状を示した平面図
（ｄ）：本発明の実施の形態４の基板成形用金型のシム形状を示した平面図
（ｅ）：本発明の実施の形態４の基板成形用金型のシム形状を示した平面図
（ｆ）：本発明の実施の形態４の基板成形用金型のシム形状を示した平面図
【図１２】本発明の実施の形態５の基板成形用金型を示す断面図
【図１３】本発明の実施の形態５の基板成形用金型のシムを設ける凹部の配置を示した断面図
【図１４】本発明の実施の形態６の基板成形用金型を示す断面図
【図１５】本発明の実施の形態６の基板成形用金型の突き当て部材の配置を示した平面図
【図１６】（ａ）：本発明の実施の形態６の基板成形用金型の突き当て部材の構成を示した断面図
（ｂ）：本発明の実施の形態６の基板成形用金型の突き当て部材の頭の溝形状を示した平面図
（ｃ）：本発明の実施の形態６の基板成形用金型の突き当て部材の頭の溝形状を示した平面図
（ｄ）：本発明の実施の形態６の基板成形用金型の突き当て部材の頭の溝形状を示した平面図
（ｅ）：本発明の実施の形態６の基板成形用金型の突き当て部材の頭の溝形状を示した平面図
（ｆ）：本発明の実施の形態６の基板成形用金型の突き当て部材の構成を示した断面図
（ｇ）：本発明の実施の形態６の基板成形用金型の突き当て部材の構成を示した平面図
【図１７】（ａ）：本発明の実施の形態６の基板成形用金型の突き当て部材の突出量を調整する治具の断面図
（ｂ）：本発明の実施の形態６の基板成形用金型の突き当て部材の突出量を調整する治具の側面図
【図１８】本発明の実施の形態７の基板成形用金型を示す断面図
【図１９】従来例の基板成形用金型を示す断面図
【符号の説明】
１固定金型
２可動金型
３スタンパ
４スタンパホルダー
５外周リング
６固定鏡面盤
７、２２温調溝
８固定金型基盤
９、１２、３０、３１シム
１０固定ブッシュ
１１スプルブッシュ
１３固定突当リング
１４可動突当リング
１５キャビティ
１６可動金型基盤
１７可動鏡面盤
１８可動ブッシュ
１９エジェクタパンチ
２０カットパンチ
２１エジェクタピン
２３バネ
２４、２８蓋板
２５、２９ピン
２６突き当て部材
２７ナット
１０１固定金型
１０２可動金型
１０３固定突当リング
１０４可動突当リング
１０５固定取付型板
１０６シム
１０７固定鏡面盤
１０８固定ブッシュ
１０９スプルブッシュ
１１０スタンパ
１１１スタンパホルダー
１１２外周リング
１１３バネ
１１４可動取付型板
１１５可動鏡面盤
１１６可動ブッシュ
１１７エジェクタパンチ
１１８カットパンチ
１１９エジェクタピン
１２０、１２１温調溝
２０１固定鏡面盤の外周端
２０２固定ブッシュの内周端
３０１基板
３０２半径２３ｍｍの円周
３０３半径４０ｍｍの円周
３０４半径５８ｍｍの円周
４０１接合面
４０２、４０３段差
５０１固定ブッシュの外周部
６０１凹部
７０１先端部
７０２〜７０４ギヤ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate molding die and a method for adjusting the thickness of a molded substrate in a substrate molding die, which can be used for molding a resin substrate used for an optical disc or the like, for example.
[0002]
[Prior art]
Conventionally, a resin material has been used for forming a substrate of an optical disk as a memory medium. This substrate is formed by allowing molten resin to flow into a gap formed between a fixed mold and a movable mold, which are a pair of molds to be fitted, and then solidifying and molding.
[0003]
Therefore, conventionally, the thickness distribution of the molded substrate has been determined by the processing accuracy of the member forming the mold. However, as the recording capacity of the optical disc increases, the accuracy of the plate thickness required for the optical disc substrate has increased. This is because it is necessary to reduce the thickness of the substrate in order to reduce the influence of the substrate tilt.
[0004]
Japanese Patent Application Laid-Open No. 7-266378 discloses a method of providing a shim between a joining member that forms a joining surface between a fixed mold and a movable mold and an attachment mold plate to which the joining member is attached. In this case, since the cavity thickness changes, the outer ring that forms the outer diameter of the substrate is pressed against the stamper side by an elastic member.
[0005]
FIG. 19 shows a sectional view of the mold. The fixed mold 101 and the movable mold 102 are tightened, and the fixed abutting ring 103 and the movable abutting ring 104 come into contact with each other and stop. The fixed abutment ring 103 is fitted through a fixed mounting template 105 and a shim 106. The fixed mounting template 105 is provided with a fixed mirror plate 107, a fixed bush 108, and a sprue bush 109 in order toward the inner peripheral side. On the fixed mirror plate 107, a stamper 110 is held by an stamper holder 111 and an outer ring 112, respectively, on the inner periphery and the outer periphery. Since the outer ring 112 is structured to move in conjunction with the movable mold 102, it is pressed against the stamper 110 side by a spring 113 which is an elastic member. On the movable mold 102 side, a movable abutting ring 104 is bolted to a movable mounting mold plate 114, and a movable mirror surface plate 115, a movable bush 116, an ejector punch 117, a cut punch 118, and an ejector pin 119 are sequentially arranged on the inner peripheral side. Is provided. Temperature control grooves 120 and 121 are provided in the fixed mirror surface plate 107 and the movable mirror surface plate 115, respectively. The thickness of the molded substrate is adjusted by changing the thickness of the shim 106.
[0006]
[Problems to be solved by the invention]
However, in the conventional method disclosed in Japanese Patent Laid-Open No. 7-266378, the thickness of the cavity formed between the two molds when the fixed mold and the movable mold are abutted is defined. A shim is placed at the location. Therefore, it is possible to adjust the overall thickness of the molded substrate, but it is difficult to suppress in-plane variations of the molded substrate, that is, variations in thickness in the radial direction and the circumferential direction.
[0007]
  The present invention takes into consideration the problems of the conventional molds as described above, and suppresses variation in the thickness of the molded substrate.ShapeAn object of the present invention is to provide a mold and a method for adjusting the thickness of a molded substrate in a substrate molding die.
[0008]
[Means for Solving the Problems]
  A first aspect of the present invention (corresponding to the present invention of claim 1) is a pair of substrate forming members for forming a substrate,
  Of the pair of substrate forming members, a fixed base for holding one substrate forming member,
  Of the pair of substrate forming members, a movable base for holding the other substrate forming member;
  When the pair of substrate forming members are fitted, the fixed substrate and the movable substrate are abutted against each other to provide a predetermined gap for forming the substrate between the pair of substrate forming members, andAt a position outside the substrate molding memberA pair of abutting members arranged;
  In order to adjust the gap, between the one substrate molding member and the fixed base and / or between the other substrate molding member and the movable base and inside the abutting member It is a board | substrate shaping | molding die provided with the clearance gap adjustment means arrange | positioned.
[0009]
Further, according to a second aspect of the present invention (corresponding to the present invention of claim 2), when the substrate molding member is constituted by a combination of a plurality of mold constituent members, among the plurality of mold constituent members, The substrate molding die according to the first aspect of the present invention, wherein the gap adjusting means is provided between all or part of the mold constituent members and the base.
[0010]
The third aspect of the present invention (corresponding to the third aspect of the present invention) includes a lid member for covering the groove for flowing the temperature adjusting medium formed in the substrate molding member,
In the substrate molding die according to the first invention, the gap adjusting means is provided between the lid member and the fixed base or the movable base.
[0011]
  According to a fourth aspect of the present invention (corresponding to the fourth aspect of the present invention), the abutting member isConnected to the ring,
  Between the substrate and the substrate molding member.At the position where the outer peripheral end of the joining surface hits the inner peripheral wall surface of the abutting member, there is a step of the base,
  The gap adjusting means isOn the inner peripheral wall surface of the abutting member with the step of the baseThe substrate molding die according to the first aspect of the present invention, which is arranged adjacent to the first invention.
[0012]
  The fifth invention (corresponding to the invention described in claim 5)The substrate molding member includes an annular member having a through hole leading to the gap in a central portion, and arranged so that an outer peripheral portion on one end side protrudes from the through hole and is fitted,
  AboveWith the baseOther than the annular memberThe inner peripheral end of the joint surface with the substrate molding member isAboveAnnular memberOf the outer peripheryThere is a step of the base at the position hitting the wall surface,
  The gap adjusting means is configured so that the annular member having the step of the base hasOf the outer peripheryIt is a board | substrate shaping | molding die of the said 1st invention arrange | positioned adjacent to a wall surface.
[0013]
  According to a sixteenth aspect of the present invention (corresponding to the present invention of claim 16), a pair of substrate forming members for forming a substrate,
  Of the pair of substrate forming members, a fixed base for holding one substrate forming member,
  Of the pair of substrate forming members, a movable base for holding the other substrate forming member;
  When the pair of substrate forming members are fitted, the fixed substrate and the movable substrate are abutted against each other to provide a predetermined gap for forming the substrate between the pair of substrate forming members, andAt a position outside the substrate molding memberA method for adjusting the thickness of a molded substrate in a substrate molding die provided with a pair of disposed abutting members,
  In order to adjust the gap, between the one substrate molding member and the fixed base and / or between the other substrate molding member and the movable base and inside the abutting member This is a method for adjusting the thickness of a molded substrate in a substrate molding die in which a gap adjusting means is arranged.
[0014]
Further, according to a seventeenth aspect of the present invention (corresponding to the present invention of claim 17), when the substrate molding member is constituted by a combination of a plurality of mold constituent members,
Adjusting the thickness of the molded substrate in the substrate molding die according to the sixteenth aspect of the present invention, wherein the gap adjusting means is provided between all or a part of the plurality of mold constituent members and the base. Is the method.
[0015]
Further, an eighteenth aspect of the present invention (corresponding to the present invention of claim 18) is provided with a lid member for covering a groove for flowing a temperature adjusting medium provided in the substrate forming member.
The method for adjusting the thickness of a molded substrate in the substrate molding die according to the sixteenth aspect of the present invention, wherein the gap adjusting means is provided between the lid member and the fixed base or the movable base.
[0016]
  According to a nineteenth aspect of the present invention (corresponding to the present invention of claim 19), the abutting member isConnected to the ring,Between the substrate and the substrate molding member.When there is a step of the base at a position where the outer peripheral end of the joining surface hits the inner peripheral wall surface of the abutting member,
  The gap adjusting means;On the inner peripheral wall surface of the abutting member with the step of the baseIt is the board | substrate thickness adjustment method of the shaping | molding board | substrate in the board | substrate shaping die of the said 16th invention characterized by arrange | positioning adjacent.
[0017]
  The twentieth aspect of the invention (corresponding to the invention of claim 20)The substrate molding member includes an annular member having a through hole leading to the gap in a central portion, and arranged so that an outer peripheral portion on one end side protrudes from the through hole and is fitted,
  AboveWith the baseOther than the annular memberThe inner peripheral end of the joint surface with the substrate molding member isAboveAnnular memberOf the outer peripheryIf there is a step in the base at a position that hits the wall,
  The gap adjusting means may be formed on the annular member having a step on the base.Of the outer peripheryA method for adjusting the thickness of a molded substrate in the substrate molding die according to the sixteenth aspect of the present invention, which is disposed adjacent to a wall surface.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS.
[0019]
(Embodiment 1)
FIG. 1 is a cross-sectional view showing Embodiment 1 of the substrate molding die of the present invention.
[0020]
As shown in FIG. 1, the mold includes a fixed mold 1 that does not slide and a movable mold 2 that slides.
[0021]
FIG. 1 shows a case where the stamper 3 is mounted on the fixed mold 1 side. The stamper 3 is fixed to the fixed mirror surface plate 6 by the stamper holder 4 and the outer ring 5 at the inner periphery and the outer periphery. The fixed mirror surface plate 6 has a temperature control groove 7, and the fixed mirror surface plate 6 is bolted to the fixed mold base 8 through an O-ring so as to close the temperature control groove 7.
[0022]
A shim 9 is disposed on the joint surface between the fixed mirror surface plate 6 and the fixed mold base 8. A stamper holder 4, a fixed bush 10, and a sprue bush 11 are provided in this order inside the fixed mirror surface plate 6. The sprue bush 11 has a hole from which molten resin flows into the mold. Further, an annular shim 12 that fits into the sprue bush 11 is provided at the joint surface between the fixed bush 10 and the fixed mold base 8. One substrate forming member of the present invention includes a stamper 3, a stamper holder 4, a fixed mirror surface board 6, a fixed bush 10 and the like.
[0023]
The shim 9 is provided to adjust the thickness variation between the radial direction and the circumferential direction of the molded substrate. On the other hand, the shim 12 is provided to fill a gap generated between the fixed bush 10 and the fixed mold base 8 as a result of providing the shim 9. Therefore, even if the shim 9 is provided, the shim 12 is not necessary if no gap is generated between the fixed bush 10 and the fixed mold base 8.
[0024]
The shim 9 is fixed by frictional force by being sandwiched and pressed between the fixed mirror surface plate 6 and the fixed mold base 8. Here, when the shim 9 is disposed, the shim 9 is temporarily fixed when a heat-resistant viscous fluid, for example, grease, is applied to the shim 9. Movement is suppressed and installation according to the setting becomes easy.
[0025]
Since the mold becomes high temperature, the coating solution needs to have heat resistance. In addition, since the mold is composed of a large number of parts, the dimension between members changes in micron order every time disassembly and assembly are performed. Therefore, it is preferable not to fix the shim 9 with an adhesive.
[0026]
The position of the shim 12 is regulated by the sprue bush 11 and the movement is suppressed.
[0027]
On the other hand, in the movable mold 2, the movable abutting ring 14 abuts against the fixed abutting ring 13, and a cavity 15 is formed in the mold. The movable abutting ring 14 is bolted to the movable mold base 16. A movable mirror surface plate 17, a movable bush 18, an ejector punch 19, a cut punch 20, and an ejector pin 21 are provided in this order on the inner peripheral side of the movable abutting ring 14. The cut punch 20 forms a hole in the inner periphery of the molded substrate, and the ejector punch 19 and the ejector pin 21 have a role of pushing out the substrate and the sprue, respectively. The movable mirror surface plate 17 is also provided with a temperature control groove 22. The other substrate forming member of the present invention includes a movable mirror plate 17, a movable bush 18, an ejector punch 19, and the like.
[0028]
A spring 23 presses the outer ring 5 against the stamper 3 side.
[0029]
As shims 9 and 12 used in a mold for molding a resin substrate having an inner diameter of 15 mm, an outer diameter of 120 mm, and a plate thickness of 0.6 mm, the width is 10 mm and the thickness is 5 μm, 10 μm, 15 μm,. A sample with a set thickness was prepared, and the following experiment was conducted.
[0030]
FIG. 2 is a plan view showing the arrangement of shims. FIG. 3A is a view showing the thickness distribution of the molded substrate 301a formed without inserting the shim, and FIG. 3B is formed by inserting the shim into the arrangement shown in FIG. It is a figure which shows the board thickness distribution of the shaping | molding board | substrate 301b, and the unit of the board thickness shown in a figure is mm.
[0031]
In this case, the arrangement of the shim shown in FIG. 2 is that when the fixed mold base 8 inside the fixed abutment ring 13 is viewed from the movable mold 2 side to the fixed mold 1 side. The outermost peripheral circle 201 corresponds to the outer peripheral portion of the fixed mirror surface plate 6 shown in FIG. 1, and the innermost peripheral circle 202 corresponds to the inner edge portion of the central hole of the fixed bush 10 shown in FIG. . 3A and 3B corresponds to the orientation of the shim layout shown in FIG. 2. The distribution of the thickness distribution of the substrates 301a and 301b shown in FIGS.
[0032]
As shown in the figure, the measurement positions of the board thickness are on three concentric circumferences having radii of 23 mm, 40 mm, and 58 mm (indicated by reference numerals 302, 303, and 304, respectively), and It is the position of each intersection on eight radial straight lines extending from the center of the substrate at 45 degree intervals with reference to the vertical upper side of the mold. That is, for each substrate, the plate thickness was measured at 8 locations on each circumference for a total of 24 locations. Further, as shown in FIG. 2, the thickness of the shim is 5 μm, 20 μm, and 20 μm in the order of the shims 9a, 9b, and 12, respectively. The molding conditions were a maximum clamping pressure of 20 tons, a mold temperature of 125 ° C., and a cycle of 8 seconds.
[0033]
As a result, in the case of the conventional configuration without the shim, the maximum plate thickness is 0.618 mm and the minimum plate thickness is 0.586 mm as shown in FIG. The variation was a maximum of 32 μm, which was 30 μm or more. On the other hand, in the configuration of the present embodiment in which the shim is inserted, as shown in FIG. 3B, the maximum plate thickness is 0.607 mm and the minimum plate thickness is 0.599 mm. The maximum plate thickness variation was 8 μm, and the variation width could be reduced to less than 10 μm.
[0034]
Here, the relationship between the distribution of the plate thickness variation and the shim arrangement will be described with reference to FIGS. 2 and 3A.
[0035]
That is, as shown in FIG. 2, a 20 μm-thick shim 9b is placed in the center as a shim 9b when a shim is not inserted (a reference numeral 302 in FIG. 3A). The plate thickness on the circumference of the attached dotted line) is about 20 μm thicker than the plate thickness on the circumference of 58 mm in radius (corresponding to the circumference of the dotted line labeled 304 in FIG. 3A). Because.
[0036]
Also, as shown in FIG. 2, the thickness of the shim 9a having a thickness of 5 .mu.m is added to the outer peripheral portion because the thickness difference of about 10 .mu.m generated in the circumferential direction when no shim is added (FIG. 3 (a)). This is for improving the reference). That is, the shim 9a is placed in the position shown in the figure, and the fixed mirror surface plate 6 is tilted as a whole, thereby reducing variations in the plate thickness in the circumferential direction.
[0037]
In FIG. 1, the shim 9 is arranged on the inner and outer peripheries of the fixed mirror surface board 6, but the shim 9 may be placed anywhere as long as it does not have the groove 7.
[0038]
(Embodiment 2)
FIG. 4 is a cross-sectional view showing a second embodiment of the substrate molding die of the present invention.
[0039]
1 differs from FIG. 1 in that first, a cover plate 24 that covers the temperature control groove 7 of the fixed mirror surface board 6 is provided, and the fixed mirror surface board 6 is fixed to the fixed mold base 8 via the cover plate 24. The shim 9 is disposed between the lid plate 24 and the fixed mold base 8.
[0040]
Secondly, the shim 9 a is disposed adjacent to the inner peripheral wall surface 13 a of the fixed abutting ring 13, and the shim 9 b is disposed adjacent to the outer peripheral wall surface 10 a of the fixed bush 10. is there.
[0041]
By providing the cover plate 24 between the fixed mirror surface plate 6 and the fixed mold base 8, there is no possibility that the medium flowing through the temperature control groove 7 leaks. Further, the restriction on the position where the shim is laid is eliminated from the first embodiment. Furthermore, by attaching the fixed mirror surface plate 6 and the cover plate 24 together by bolting or the like, the fixed mold base 8 and the fixed mirror surface plate 6 can be easily attached and detached.
[0042]
Moreover, the possibility that the shim 9 moves to the joint surface of the other member is eliminated by fitting the annular member to the end surface of the joint surface on which the shim 9 is disposed.
[0043]
Similarly to the first embodiment, when a heat-resistant viscous fluid, for example, grease is applied to the shim 9, the shim 9 is temporarily fixed to the shim 9, so that the lid plate 24 and the fixed mold base 8 are joined. Therefore, the movement of the shim 9 is suppressed, and the installation according to the setting becomes easy.
[0044]
The shim 12 is annular as in the first embodiment. The shim 12 is regulated by the sprue bush 11 and is prevented from moving.
[0045]
As shims 9 and 12 used in a mold for molding a resin substrate having an inner diameter of 15 mm, an outer diameter of 120 mm, and a plate thickness of 0.6 mm, the width is 5 mm and the thickness is 5 μm, 10 μm, 15 μm,. A sample with a set thickness was prepared, and the following experiment was conducted.
[0046]
FIG. 5 is a diagram showing the arrangement of shims. FIG. 6A is a diagram showing the thickness distribution of a molded substrate 301a formed without inserting a shim, and FIG. 3B is a diagram in which the shim is inserted into the arrangement shown in FIG. It is a figure which shows the board thickness distribution of the shaping | molding board | substrate 301b, and the unit of the board thickness shown in a figure is mm.
[0047]
In this case, the arrangement of the shim shown in FIG. 5 is a case where the fixed mold base 8 inside the fixed abutting ring 13 is viewed from the movable mold 2 side to the fixed mold 1 side, and in FIG. The outermost peripheral circle 201 corresponds to the outer peripheral portion of the fixed mirror surface plate 6 shown in FIG. 4, and the innermost peripheral circle 202 corresponds to the inner edge portion of the central hole of the fixed bush 10 shown in FIG. . Further, in FIG. 5, a circumferential circle 501 corresponds to the outer circumferential portion 10a of the fixed bush 10 shown in FIG. 6A and 6B corresponds to the orientation of the shim layout shown in FIG. 5. The distribution of the thicknesses of the substrates 301a and 301b shown in FIGS.
[0048]
The measurement position of the thickness of the substrate is the same as that described in FIG. The thickness of the shim is as shown in FIG. The molding conditions are the same as those described in FIGS. 3 (a) and 3 (b).
[0049]
As a result, in the case of the conventional configuration without shims, the maximum plate thickness is 0.618 mm and the minimum plate thickness is 0.587 mm as shown in FIG. The variation was a maximum of 31 μm. On the other hand, in the configuration of the present embodiment in which the shim is inserted, as shown in FIG. 6B, the maximum plate thickness is 0.603 mm and the minimum plate thickness is 0.597 mm. The maximum plate thickness variation was 6 μm, and the variation width could be reduced to less than 10 μm.
[0050]
Here, the relationship between the distribution of the plate thickness variation and the shim arrangement will be described with reference to FIGS. 5 and 6A.
[0051]
As shown in FIG. 6A, the plate thickness distribution without the shim is about 20 μm larger in the radial direction than the plate thickness on the circumference of the radius of 23 mm than the plate thickness on the circumference of the radius of 58 mm. thick. Assuming that a shim 9b having a plate thickness of 20 μm is inserted, subtracting 0.610 mm, 0.600 mm, and 0.590 mm from the plate thickness values on the circumference of a radius of 23 mm, 40 mm, and 58 mm, It can be seen that the upper right on 301a is thicker by 10 μm (see FIG. 6A).
[0052]
Therefore, the shim 9a and the shim 9b are placed at the positions shown in FIG. Moreover, it is slightly raised on the circumference of the upper right radius of 40 mm on the substrate 301a. Therefore, the shim 9c was placed in the position shown in FIG.
[0053]
  Here, the shim 12 is an annular one, but may be different. In this case, shim 12The position of is defined by the sprue bush 11 on the inside. On the other hand, the outside of the position of the shim 12 is due to the step provided on the fixed mold base 8.It is prescribed.
[0054]
(Embodiment 3)
FIG. 7 is a cross-sectional view showing a third embodiment of the substrate molding die of the present invention. FIG. 8A is a plan view showing the arrangement of shims. In this case, the arrangement of the shim shown in FIG. 8A is a case where the fixed mold base 8 inside the fixed abutting ring 13 is viewed from the movable mold 2 side to the fixed mold 1 side. In FIG. 8A, the outermost circumference circle 201 corresponds to the outer circumference of the fixed mirror surface plate 6 shown in FIG. 7, and the innermost circumference circle 202 is the inner edge of the central hole of the fixed bush 10 shown in FIG. Corresponds to the department. In FIG. 8A, a circumferential circle 501 corresponds to the outer peripheral portion 10a of the fixed bush 10 shown in FIG.
[0055]
The difference from the second embodiment is that the shim 9 is formed in an annular shape, and is arranged so as to be adjacent to the annular member at the end face of the joint surface as in the second embodiment. The specific annular member has a fixed bush 10 on the inner peripheral side and a fixed abutment ring 13 on the outer peripheral side. As a result, the movement of the shim 9 is suppressed.
[0056]
The shim 9 can suppress variations in the molded substrate by adjusting the thickness between the inner periphery and the outer periphery. Here, as another example of the annular shim 9, as shown in FIG. 8 (b), a plate whose thickness varies depending on the location in the ring may be used. FIG.8 (b) has shown the top view and sectional drawing of the cyclic | annular shim from which board thickness differs according to a place.
[0057]
Further, the shim 12 is also annular, and its position is defined by the sprue bush 11 so that movement is suppressed.
[0058]
As shims 9 and 12 used in a mold for molding a resin substrate having an inner diameter of 15 mm, an outer diameter of 120 mm, and a plate thickness of 0.6 mm, the width is 10 mm and the thickness is 5 μm, 10 μm, 15 μm,. A sample with a set thickness was prepared, and the same experiment as in the above embodiment was performed. The molding conditions are the same as in the above embodiment.
[0059]
As a result, in the case of the conventional configuration in which no shim is inserted, the plate thickness variation within one molded substrate is 30 μm or more at maximum, but in the configuration of the present embodiment in which the shim is inserted, the variation is 15 μm at maximum. The variation width could be reduced to less than. Further, when the shim shown in FIG. 8B was used, the variation width could be reduced to a maximum of less than 10 μm.
[0060]
Although the annular shim 12 is used here, a different one may be used.
[0061]
FIG. 8A shows an example in which two shims 9 having different diameters are inserted. However, depending on the distribution of variations, only one of them may be used.
[0062]
(Embodiment 4)
FIG. 9 is a cross-sectional view showing a fourth embodiment of the substrate molding die of the present invention. FIG. 10 is a plan view showing the arrangement of the shim 12 and the pins 25a and 25b. In this case, the arrangement of the shim 12 and the pin 25 shown in FIG. 10 is that when the fixed mold base 8 inside the fixed abutting ring 13 is viewed from the movable mold 2 side to the fixed mold 1 side. 10, the outermost circumference circle 201 corresponds to the outer circumference of the fixed mirror surface plate 6 shown in FIG. 9, and the innermost circumference circle 202 is formed at the inner edge of the central hole of the fixed bush 10 shown in FIG. 9. It corresponds.
[0063]
4 differs from FIG. 4 in that a plurality of concave and convex fitting portions are provided in a member forming a joint surface on which the shim 9 is laid, and holes for fitting into the convex portions are provided in the shim 9. In FIG. 9, as shown in FIG. 11A, the pin 25 is inserted into the fixed mold base 8, and a recess in which the pin 25 is inserted is formed at a position corresponding to the pin 25 on the cover plate 24. . Then, after the shim 9 having a hole is fitted into the pin 25, the shim 9 is pressed by the fixed mirror surface plate 6 and the fixed mold base 8. As a result, the movement of the shim 9 is suppressed.
[0064]
The shim 12 is annular. Therefore, the shim 12 is defined by the sprue bush 11 to be fitted, and the movement is suppressed.
[0065]
The cross-sectional shape of the pin 25 and the shape of the hole in the shim 9 are shown in FIGS. When one shim 9 is fixed with one circular pin 25 as shown in FIG. 11 (b), a movement rotating around the pin can be considered. Therefore, as shown in FIG. 11C, if the number of pins 25 passing through the shim 9 is plural, the rotational movement is suppressed.
[0066]
Further, even if the number of pins 25 passing through one shim 9 is one, the rotational movement of the shim 9 is suppressed if the cross-sectional shape of the pin 25 and the hole shape of the shim 9 are other than a perfect circle. The cross-sectional shape of the pin 25 and the hole shape of the shim 9 are, for example, a polygon, preferably a quadrangle or a triangle shown in FIGS. 11 (d) and 11 (e), or an ellipse shown in FIG. 11 (f).
[0067]
Further, even if the number of pins passing through one shim 9 is one, the rotational movement of the shim 9 can be suppressed if the shim 9 is arranged so as to be adjacent to the annular member fitted to the end face of the joint surface.
[0068]
For example, as shown in FIG. 9, a step 402 is formed at a position where the joint surface 401 between the cover plate 24 and the fixed mold base 8 abuts against the inner peripheral wall surface of the fixed abutment ring 13. The shim 9a and the pin 25a into which the shim 9a is inserted may be disposed so that the end surface of the shim 9a is adjacent to the inner peripheral portion of the step 402. Similarly, a step 403 is formed at a position where the joint surface 401 contacts the outer peripheral wall surface of the fixed bush 10. The shim 9b and the pin 25b into which the shim 9b is fitted may be disposed so that the end surface of the shim 9b is adjacent to the outer peripheral portion of the step 403.
[0069]
In any of the above configurations, the shims 9 and 12 used in the mold for molding a resin substrate having an inner diameter of 15 mm, an outer diameter of 120 mm, and a plate thickness of 0.6 mm have a width of 10 mm and a thickness of 5 μm, 10 μm, 15 μm,. -Thicknesses were prepared every 5 μm up to 50 μm, and the following experiment was conducted. The molding conditions were the same as in the above embodiment, the maximum clamping pressure was 20 tons, the mold temperature was 125 ° C., and the cycle was 8 seconds.
[0070]
As a result, the thickness variation in one molded substrate was 30 μm or more in the conventional structure, but was less than 10 μm in the fourth embodiment of the present invention. Further, when the movement of the shim 9 and the shim 12 was examined by periodically removing the mold, the movement of the shim 9 and the shim 12 was not seen.
[0071]
In the fourth embodiment, the pins 25 are provided on the fixed mold base 8 side and the recesses into which the pins 25 are inserted are provided on the lid plate 24 side. However, the pins 25 may be provided on the lid 24 side.
[0072]
Also, the shim 12 may be provided with a hole in the same manner as the shim 9, and a pin that fits into the hole may be provided.
[0073]
Furthermore, you may process a metal mold member directly instead of the pin which inserts in a member as a convex part which inserts a shim.
[0074]
(Embodiment 5)
FIG. 12 is a sectional view showing Embodiment 5 of the substrate molding die of the present invention.
[0075]
Compared to the configuration of FIG. 1, the configuration shown in FIG. 12 is provided with a convex portion on the fixed mirror surface plate 6, a concave portion for fitting with the fixed mirror base plate 6 is provided on the fixed mold base 8, and a shim between the contact planes of the concave and convex fitting portions. 9 is different.
[0076]
Moreover, the point which provided the convex part in the fixed bush, provided the recessed part fitted with it in the fixed mold base | substrate 8, and provided the shim 12 between the contact planes of the uneven | corrugated fitting part differs.
[0077]
Since the shim 9 and the shim 12 have the same shape as the bottom of the recess and are fitted in the bottom, movement is suppressed.
[0078]
The positions of the uneven portions are only required to be scattered on the joint surface, but are preferably scattered uniformly or concentrically with the cavity 15. When the concave and convex portions are provided on concentric circles, it is necessary to provide them at least on the inner periphery and outer periphery of the joint surface. This is because the variation in the radial direction of the molded substrate can be suppressed by adjusting the thickness of the shim 9 provided on the inner periphery and the outer periphery. Moreover, it is because the dispersion | variation in the circumferential direction of a shaping | molding board | substrate can be suppressed by adjusting the thickness of the some shim 9 provided in the circumferential direction.
[0079]
FIG. 13 is a plan view showing the arrangement of the recesses 601 for inserting the shim 9 or 12. In this case, the arrangement of the recesses 601 shown in FIG. 13 is the case where the fixed mold 1 side is viewed from the movable mold 2 side on the fixed mold base 8 inside the fixed abutting ring 13. In FIG. 13, the outermost circumference circle 201 corresponds to the outer peripheral portion of the fixed mirror surface plate 6 shown in FIG. 12, and the innermost circumference circle 202 corresponds to the inner edge portion of the central hole of the fixed bush 10 shown in FIG. is doing.
[0080]
Here, the outer shape of the shim and the cross-sectional shape of the recess are circular. The diameter of the recess was 10 mm, and the diameter of the shim was 9 mm.
[0081]
In addition, for the mold for molding a resin substrate having an inner diameter of 15 mm, an outer diameter of 120 mm, and a plate thickness of 0.6 mm, shims 9 and 12 having thicknesses of 5 μm to 50 μm are prepared every 5 μm. Experiments similar to the morphology were performed. The molding conditions are the same as in the above embodiment.
[0082]
As a result, in the case of the conventional configuration in which no shim is inserted, the thickness variation within one molded substrate is 30 μm or more at maximum, but in the configuration of the present embodiment in which the shim is inserted, the variation is less than 10 μm at maximum. The width could be reduced.
[0083]
In this embodiment, the outer shape of the shim is circular. However, the shape of the shim is not limited to this, and the outer shape of the shim may be any shape as long as it enters the recess. Moreover, the cross-sectional shape of the recess may not be circular.
[0084]
(Embodiment 6)
FIG. 14 is a sectional view showing Embodiment 6 of the substrate molding die of the present invention.
[0085]
In the configuration shown in FIG. 14, an abutting member 26 is provided on the joint surface between the lid plate 24 and the fixed mold base 8 instead of the shim 9 shown in FIG. 4. Specifically, as shown in FIG. 16A, the abutting member 26 corresponding to the projecting member of the present invention is threaded around the periphery, and the side surface provided on the fixed mold base 8 is threaded. It is screwed into the recessed part which has. Therefore, the amount of protrusion from the fixed mold base 8 can be adjusted by rotating the abutting member 26. Note that the protrusion amount of the present invention corresponds to this protrusion amount.
[0086]
Specifically, if the diameter of the abutting member 26 is 10 mm and the thread pitch is 0.5 mm, the protrusion amount is adjusted by 10/50 to adjust the protrusion amount by 10 μm. Therefore, in order to adjust the pop-out amount, as shown in FIGS. 17A and 17B, gears having different rotation ratios are used. For example, when the adjustment side is rotated 10 times, the abutting member 26 is set to 1 It is preferable to use a jig that rotates.
[0087]
FIG. 17A is a cross-sectional view taken along the line AA in FIG. 702 to 704 shown in FIG. 17A are gears having different rotation ratios. Moreover, the front-end | tip part 701 shown in FIG.17 (b) is the butting member 26 side.
[0088]
Further, there is a groove at the head of the abutting member 26, and the tip portion 701 of the tool shown in FIG. The groove shape only needs to be other than a perfect circle, and examples thereof include minus, plus, square, and hexagon as shown in FIGS.
[0089]
The abutting members 26 may be scattered on the joint surface between the lid plate 24 and the fixed mold base 8, but are preferably evenly distributed or concentrically with the cavity 15. This is because the variation in the circumferential direction of the molded substrate can be suppressed by adjusting the protruding amount of the plurality of butting members 26 provided in the circumferential direction. Moreover, when providing the abutting member 26 on a concentric circle, it is necessary to provide at least the inner periphery and outer periphery of a joint surface. This is because the variation in the radial direction of the molded substrate can be suppressed by adjusting the protruding amount of the abutting member 26 provided on the inner periphery and the outer periphery.
[0090]
FIG. 15 is a plan view illustrating an example of the arrangement of the uneven portions. In this case, the arrangement of the concavo-convex portion (abutting member 26) shown in FIG. 15 is such that the fixed mold base 8 inside the fixed abutting ring 13 is viewed from the movable mold 2 side toward the fixed mold 1 side. Is the case.
[0091]
The shim 12 is annular, and the inner periphery and the outer periphery are defined by the sprue bush 11 and the fixed mold base 8, respectively.
[0092]
For a mold for molding a resin substrate having an inner diameter of 15 mm, an outer diameter of 120 mm, and a plate thickness of 0.6 mm, a shim 12 having a thickness of 5 μm to 50 μm is prepared for each 5 μm. An experiment similar to that of the above embodiment was performed by adjusting the protrusion amount. The molding conditions are the same as in the above embodiment.
[0093]
As a result, in the case of the conventional configuration, the thickness variation within one molded substrate was 30 μm at the maximum, but in the configuration of the present embodiment using the abutting member 26, the variation width is reduced to a maximum of less than 10 μm. I was able to make it smaller.
[0094]
The abutting member 26 is fixed because it is screwed into the fixed mold base 8, and therefore does not move in the lateral direction. However, there is a possibility of rotation. Therefore, it is necessary to prevent the screw portion from rotating with an adhesive or the like.
[0095]
A configuration for mechanically suppressing the rotation of the screw portion is shown in FIGS. FIG. 16F is a cross-sectional view, and FIG. 16G is a plan view seen from the head side of the abutting member 26. A counterbore is provided on the surface of the place where the abutting member 26 of the fixed mold base 8 is fitted, and a nut 27 is fitted to the abutting member 26 as a rotation stopper. By pressing the nut 27 against the fixed mold base 8, the clearance between the abutting member 26 and the threaded portion of the fixed mold base 8 is eliminated, and the rotation of the abutting member 26 is suppressed.
[0096]
Of course, an abutting member may be used instead of the shim 12 on the joint surface between the fixed bush 10 and the fixed mold base 8.
[0097]
(Embodiment 7)
FIG. 18 is a sectional view showing a seventh embodiment of the substrate molding die of the present invention.
[0098]
In the above embodiment, the case where the gap adjusting means is on the fixed mold 1 side has been shown, but in Embodiment 7, the gap adjusting means is on the movable mold 2 side.
[0099]
A lid plate 28 is joined to the movable mirror plate 17 so as to cover the temperature control groove 22 of the movable mirror plate 17, and the lid plate 28 is joined to the movable mold base 16.
[0100]
A pin 29 and a shim 30 are provided on the outer peripheral side of the joint surface between the lid plate 28 and the movable mold base 16. The shim 30 is provided with a hole into which the pin 29 is inserted. The cover plate 28 corresponding to the pin 29 is provided with a dent so that the pin 29 does not hit. When the shim 30 is fitted to the pin 29, the shim 30 is fixed and does not move.
[0101]
The shim 31 has an annular shape and is laid between the movable mold base 16 and the cover plate 28 and between the movable mold base 16 and the movable bush 18. This is because the movable mirror plate 17 and the movable bush 18 are adjacent to each other and are in contact with the movable mold base 16 on the same plane.
[0102]
Variation in the radial direction of the molded substrate is suppressed by adjusting the thickness of the shim 30 and the shim 31, and variation in the circumferential direction is suppressed by adjusting the thickness of the shim 30 in the circumferential direction.
[0103]
For a mold for molding a resin substrate having an inner diameter of 15 mm, an outer diameter of 120 mm, and a plate thickness of 0.6 mm, the shim 30 and shim 31 have a width of 10 mm and 20 mm, respectively, and a thickness of 5 μm to 50 μm. Thicknesses of every 5 μm were prepared and the same experiment as the above embodiment was performed. The molding conditions are the same as in the above embodiment.
[0104]
As a result, in the case of the conventional configuration that does not use shims, the plate thickness variation within one molded substrate is 30 μm at the maximum, but in the configuration of this embodiment using shims 30 and 31, the maximum is less than 10 μm. It was possible to reduce the variation width until.
In the above embodiment, a cover plate that covers the temperature control groove of the mirror surface board is provided on the fixed mold or the movable mold, and pins and shims are provided on the joint surface between the cover plate and the mold base. You may provide a pin and a shim in.
[0105]
Further, the pin may be structured to be fixed to the lid plate side instead of the mold base side.
[0106]
The cross-sectional shape of the pin and the hole shape of the shim may be other than a perfect circle.
[0107]
As described above, according to the present invention, it is possible to obtain a high accuracy in which the thickness variation within one sheet of the molded substrate is less than 10 μm.
[0108]
That is, it is possible to finely adjust the thickness of the molded substrate, and it is possible to reduce variations in thickness that occur in the radial direction and circumferential direction of the molded substrate.
[0109]
Further, even if the molding operation is continued, the remarkable effect that the accuracy is maintained can be obtained.
[0110]
【The invention's effect】
As is apparent from the above description, the present invention has an advantage that variation in thickness of the molded substrate can be suppressed.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a substrate molding die according to a first embodiment of the present invention.
FIG. 2 is a plan view showing the arrangement of shims in a substrate molding die according to the first embodiment of the present invention.
FIG. 3A is a board thickness distribution diagram before a shim is inserted into a board molding die according to the first embodiment of the present invention.
(B): Thickness distribution diagram of the substrate after the shim is inserted into the substrate molding die according to the first embodiment of the present invention
FIG. 4 is a cross-sectional view showing a substrate molding die according to a second embodiment of the present invention.
FIG. 5 is a plan view showing shim arrangement of a substrate molding die according to a second embodiment of the present invention.
FIG. 6A is a board thickness distribution diagram before a shim is inserted into a board molding die according to a second embodiment of the present invention.
(B): Thickness distribution diagram of the substrate after the shim is inserted into the substrate molding die according to the second embodiment of the present invention
FIG. 7 is a cross-sectional view showing a substrate molding die according to a third embodiment of the present invention.
FIG. 8A is a plan view showing the arrangement of shims in a substrate molding die according to a third embodiment of the present invention.
(B): A plan view and a cross-sectional view showing the shape of the shim of the substrate molding die according to the third embodiment of the present invention.
FIG. 9 is a cross-sectional view showing a substrate molding die according to a fourth embodiment of the present invention.
FIG. 10 is a plan view showing the arrangement of shims and pins of a substrate molding die according to a fourth embodiment of the present invention.
FIG. 11A is a cross-sectional view showing a configuration of pins and shims of a substrate molding die according to a fourth embodiment of the present invention.
(B): Plan view showing shim shape of substrate molding die according to embodiment 4 of the present invention.
(C): Plan view showing shim shape of substrate molding die according to embodiment 4 of the present invention.
(D): Plan view showing shim shape of substrate molding die according to embodiment 4 of the present invention.
(E): Plan view showing shim shape of substrate molding die according to embodiment 4 of the present invention.
(F): Plan view showing shim shape of substrate molding die according to embodiment 4 of the present invention.
FIG. 12 is a cross-sectional view showing a substrate molding die according to a fifth embodiment of the present invention.
FIG. 13 is a cross-sectional view showing the arrangement of recesses for providing shims of a substrate molding die according to a fifth embodiment of the present invention.
FIG. 14 is a sectional view showing a substrate molding die according to a sixth embodiment of the present invention.
FIG. 15 is a plan view showing an arrangement of abutting members of a substrate molding die according to a sixth embodiment of the present invention.
FIG. 16A is a cross-sectional view showing the configuration of the abutting member of the substrate molding die according to the sixth embodiment of the present invention.
(B): The top view which showed the groove | channel shape of the head of the butting member of the metal mold | die for board | substrate shaping | molding of Embodiment 6 of this invention.
(C): The top view which showed the groove | channel shape of the head of the butting member of the metal mold | die for board | substrate shaping | molding of Embodiment 6 of this invention.
(D): The top view which showed the groove | channel shape of the head of the butting member of the metal mold | die for board | substrate shaping | molding of Embodiment 6 of this invention.
(E): Plan view showing the groove shape of the head of the abutting member of the substrate molding die according to the sixth embodiment of the present invention.
(F): Sectional view showing the configuration of the abutting member of the substrate molding die according to the sixth embodiment of the present invention.
(G): Plan view showing the configuration of the abutting member of the substrate molding die according to the sixth embodiment of the present invention.
FIG. 17A is a cross-sectional view of a jig for adjusting the protrusion amount of the abutting member of the substrate molding die according to the sixth embodiment of the present invention.
(B): Side view of a jig for adjusting the protruding amount of the abutting member of the mold for forming a substrate according to the sixth embodiment of the present invention.
FIG. 18 is a cross-sectional view showing a substrate molding die according to a seventh embodiment of the present invention.
FIG. 19 is a sectional view showing a conventional substrate molding die.
[Explanation of symbols]
1 Fixed mold
2 Movable mold
3 Stamper
4 Stamper holder
5 outer ring
6 Fixed mirror surface board
7, 22 Temperature control groove
8 Fixed mold base
9, 12, 30, 31 shims
10 Fixed bush
11 Sprue bush
13 Fixed abutment ring
14 Movable abutment ring
15 cavity
16 Movable mold base
17 Movable mirror
18 Movable bush
19 Ejector punch
20 Cut punch
21 Ejector pin
23 Spring
24, 28 Cover plate
25, 29 pins
26 Abutting member
27 nuts
101 Fixed mold
102 Movable mold
103 Fixed abutting ring
104 Movable abutment ring
105 Fixed mounting template
106 Sim
107 fixed mirror
108 Fixed bush
109 sprue bush
110 Stamper
111 stamper holder
112 outer ring
113 Spring
114 Movable mounting template
115 Movable mirror
116 Movable bush
117 Ejector punch
118 Cut punch
119 Ejector pin
120, 121 Temperature control groove
201 Perimeter edge of fixed mirror
202 Inner peripheral edge of fixed bush
301 substrate
302 circumference of 23mm radius
303 Circumference of radius 40mm
304 circumference of radius 58mm
401 Bonding surface
402, 403 steps
501 Outer part of fixed bush
601 recess
701 Tip
702-704 gear

Claims

A pair of substrate molding members for molding the substrate;
Of the pair of substrate forming members, a fixed base for holding one substrate forming member,
Of the pair of substrate forming members, a movable base for holding the other substrate forming member;
When the pair of board forming members are fitted, the fixed board and the movable board are abutted with each other to provide a predetermined gap for molding the board between the pair of board forming members, and A pair of abutting members disposed at positions outside the substrate molding member ;
In order to adjust the gap, between the one substrate molding member and the fixed base and / or between the other substrate molding member and the movable base and inside the abutting member A gap adjusting means disposed;
A substrate molding die comprising:

When the substrate molding member is configured by a combination of a plurality of mold constituent members, the gap adjustment is performed between all or a part of the plurality of mold constituent members and the base. 2. The substrate molding die according to claim 1, further comprising means.

Provided with a lid member for covering the groove through which the temperature adjusting medium is provided, provided in the substrate forming member,
2. The substrate molding die according to claim 1, wherein the gap adjusting means is provided between the lid member and the fixed base or the movable base.

The abutting member is connected in an annular shape,
There is a step in the base at a position where the outer peripheral end of the joint surface between the base and the substrate molding member hits the inner peripheral wall surface of the abutting member,
2. The substrate molding die according to claim 1, wherein the gap adjusting means is disposed adjacent to an inner peripheral wall surface of the abutting member having a step of the base .

The substrate molding member includes an annular member having a through hole leading to the gap in a central portion, and arranged so that an outer peripheral portion on one end side protrudes from the through hole and is fitted,
The inner peripheral edge of the joint surface between the substrate molding member other than the annular member and the foundation, the position corresponding to the wall surface of the outer peripheral portion of the annular member, there is a step of said base,
2. The substrate molding die according to claim 1, wherein the gap adjusting means is disposed adjacent to a wall surface of the outer peripheral portion of the annular member having a step of the base.

Substrate forming metal mold according to any one of claims 1 to 5 using a shim as the gap adjusting means.

The substrate molding die according to claim 6, wherein the shim is an annular shim.

Groove for holding the shim, claim 6 substrate forming metal mold according to, characterized in that provided on either side of the joint surface that sandwiches the shim.

The shim is provided with a hole,
Pins, claim 6 substrate forming metal mold according to, characterized in that provided on either side of the joint surface that sandwiches the shim through said hole.

Said bore is provided with a plurality, claim 9 substrate forming metal mold of, wherein the pin is inserted into each hole.

The shape of the cross section and the holes in the pins, claim 9 substrate forming metal mold according to the shim is characterized by being adjusted so as not to rotational movement.

The gap adjusting means is a protruding member screwed into the substrate molding member or the base that is joined to the substrate molding member,
Wherein by rotating the protruding member, a substrate formed metal mold according to claim 1, 2, 4 or 5, characterized in that the projecting dimension is adjustable.

The gap adjusting means is a protruding member screwed into the lid member or the base joined to the lid member,
Wherein by rotating the protruding member, according to claim 3 substrate forming metal mold of, wherein that the projecting dimension is adjustable.

Wherein the end surface of the projecting member, according to claim 12 or 13 substrates forming metal mold according to, characterized in that the groove to be used for the rotation are formed.

14. substrate forming metal mold according to characterized in that a rotation preventing member for stopping the rotation of the projecting member in after the adjustment of the protruding amount of the projecting member.

A pair of substrate molding members for molding the substrate;
Of the pair of substrate forming members, a fixed base for holding one substrate forming member,
Of the pair of substrate forming members, a movable base for holding the other substrate forming member;
When the pair of board forming members are fitted, the fixed board and the movable board are abutted with each other to provide a predetermined gap for molding the board between the pair of board forming members, and A method for adjusting the thickness of a molded substrate in a substrate molding die comprising a pair of abutting members arranged at positions outside the substrate molded member ,
In order to adjust the gap, between the one substrate molding member and the fixed base and / or between the other substrate molding member and the movable base and inside the abutting member A method for adjusting the thickness of a molded substrate in a substrate molding die, wherein a gap adjusting means is arranged.

When the substrate molding member is constituted by a combination of a plurality of mold constituent members,
The molded substrate in a substrate molding die according to claim 16, wherein the gap adjusting means is provided between all or a part of the plurality of mold constituent members and the base. Thickness adjustment method.

When a lid member for covering a groove for flowing a temperature adjusting medium provided on the substrate forming member is provided,
The method for adjusting the thickness of a molded substrate in a substrate molding die according to claim 16, wherein the gap adjusting means is provided between the lid member and the fixed base or the movable base.

The abutting member is connected in an annular shape,
When there is a step of the base at a position where the outer peripheral end of the joint surface between the base and the substrate molding member hits the inner peripheral wall surface of the abutting member,
17. The method for adjusting the thickness of a molded substrate in a substrate molding die according to claim 16, wherein the gap adjusting means is disposed adjacent to an inner peripheral wall surface of the abutting member having a step of the base .

The substrate molding member includes an annular member having a through hole leading to the gap in a central portion, and arranged so that an outer peripheral portion on one end side protrudes from the through hole and is fitted,
If the inner peripheral end of the junction surface between the substrate molding member other than the annular member and the foundation, that the position corresponding to the wall surface of the outer peripheral portion of the annular member, there is a step of said base,
The method for adjusting the thickness of a molded substrate in a substrate molding die according to claim 16, wherein the gap adjusting means is disposed adjacent to a wall surface of the outer peripheral portion of the annular member having a step of the base.

The gap adjusting means is a thin plate-shaped shim,
The method for adjusting the thickness of a molded substrate in a substrate molding die according to any one of claims 16 to 20, wherein a heat-resistant viscous fluid is applied to the shim.

The gap adjusting means is a protruding member screwed into the substrate molding member or the base that is joined to the substrate molding member,
21. The method for adjusting a thickness of a molded substrate in a substrate molding die according to claim 16, 17, 19 or 20, wherein the protruding dimension of the protruding member is adjusted by rotating the protruding member. .

The gap adjusting means is a protruding member screwed into the lid member or the base joined to the lid member,
19. The method for adjusting the thickness of a molded substrate in a substrate molding die according to claim 18, wherein the projecting dimension of the projecting member is adjusted by rotating the projecting member.