JP3853126B2 - Plasma display panel and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a panel structure of a plasma display panel and a manufacturing method thereof.
[0002]
[Problems to be solved by the invention]
In recent years, a surface discharge type AC plasma display panel has been attracting attention as a large and thin color screen display device, and its spread is being promoted.
[0003]
4 is a plan view schematically showing a conventional cell structure of this surface discharge type AC plasma display panel, FIG. 5 is a cross-sectional view taken along the line V-V in FIG. 4, and FIG. 6 is W1-W1 in FIG. 7 is a cross-sectional view taken along line W2-W2 of FIG.
[0004]
4 to 7, on the front glass substrate 1 side that is the display surface of the plasma display panel, a plurality of row electrode pairs (X, Y) and the row electrode pairs (X, Y) are covered on the back surface. And a protective layer 3 made of MgO covering the back surface of the dielectric layer 2 is sequentially provided.
[0005]
Each of the row electrodes X and Y is composed of transparent electrodes Xa and Ya made of a wide transparent conductive film such as ITO, and bus electrodes Xb and Yb made of a narrow metal film that compensates for the conductivity. .
[0006]
The row electrodes X and Y are alternately arranged in the column direction so as to face each other across the discharge gap g, and one display line (row) L of the matrix display is formed by each row electrode pair (X, Y). Composed.
[0007]
On the other hand, a plurality of column electrodes D arranged so as to extend in a direction perpendicular to the row electrode pairs X and Y are provided on the rear glass substrate 4 facing the front glass substrate 1 through the discharge space S filled with a rare gas. A strip-shaped partition wall 5 formed so as to extend in parallel between the column electrodes D, and a phosphor layer 6 color-coded into R, G, and B, respectively, covering the side surface of the partition wall 5 and the column electrode D; Is provided.
[0008]
In each display line L, the discharge electrode C is defined in each unit light emitting region formed by the column electrode D and the row electrode pair (X, Y) intersecting each other and the discharge space S being partitioned by the barrier ribs 5. Has been.
[0009]
In this plasma display panel, as shown in FIGS. 5 and 6, along the bus electrodes Xb and Yb, the portions on the back side of the dielectric layer 2 facing the bus electrodes Xb and Yb extending parallel to each other back to back. A raised dielectric layer 2A extending in parallel is formed.
[0010]
The raised dielectric layer 2A is formed so as to protrude into the discharge space S from the back surface of the dielectric layer 2, and in the discharge space S, between the transparent electrodes Xa and Ya facing each other. By suppressing the generated surface discharge d from spreading toward the bus electrodes Xb and Yb, it functions to prevent erroneous discharge from occurring between adjacent discharge cells C.
[0011]
The raised dielectric layer 2A is formed on the dielectric layer 2 formed by firing the low-melting glass paste applied to the front glass substrate 1 with a predetermined thickness and then dried, and then the low-melting glass paste is further applied to the predetermined dielectric layer 2A. It is formed by screen-printing and drying at a thickness of, followed by firing.
[0012]
An image is displayed on the surface discharge type AC plasma display panel as described above.
[0013]
That is, first, by address operation, discharge (opposite discharge) is selectively performed between the row electrode pair (X, Y) and the column electrode D in each discharge cell C, and the lighting cell (dielectric layer 2 has a wall) The discharge cells C in which charges are formed and the extinguishing cells (discharge cells C in which no wall charges are formed in the dielectric layer 2) are distributed on the panel corresponding to the image to be displayed.
[0014]
After this address operation, a discharge sustain pulse is alternately applied to the row electrode pair (X, Y) simultaneously on all display lines L, and every time this discharge sustain pulse is applied to the lighting cell. A surface discharge is generated in a space between a pair of adjacent raised dielectric layers 2A located so as to sandwich the lighting cell, and R, G, and R in the discharge space S are generated by ultraviolet rays generated by the surface discharge. Each of the B phosphor layers 6 is excited to emit light, thereby forming an image to be displayed.
[0015]
As described above, in the raised dielectric layer 2A, the surface discharge d generated between the transparent electrodes Xa and Ya facing each other during image formation is caused by the bus electrodes Xb and Yb side, that is, other adjacent The function of suppressing spreading in the direction of the discharge cell C is exhibited.
[0016]
However, since this conventional PDP is formed by applying the glass paste on the dielectric layer 2 and drying and firing the dielectric layer 2A, as described above, from FIG. As can be seen, the edge portions 2Aa on both sides facing the discharge cell C are gently inclined.
[0017]
Therefore, the discharge generated in the discharge gap g between the transparent electrodes Xa and Ya spreads in the column direction (the left-right direction in FIG. 5) along the transparent electrodes Xa and Ya, and further, the edge portion 2Aa of the raised dielectric layer 2A There is a problem in that a discharge occurs at a portion facing the bus electrodes Xb and Yb along the gentle inclined surface, and a discharge current that does not contribute to light emission increases.
[0018]
The present invention has been made to solve the above-described problems in the conventional surface discharge type AC plasma display panel.
[0019]
That is, a first object of the present invention is to provide a plasma display panel that can more fully prevent the spread of discharge on the bus electrode and prevent an increase in discharge current that does not contribute to light emission. .
[0020]
Furthermore, the present invention provides a method of manufacturing a plasma display panel that can more completely prevent the spread of discharge on the bus electrode and prevent an increase in discharge current that does not contribute to light emission. Objective.
[0021]
[Means for Solving the Problems]
In order to achieve the first object, the plasma display panel according to the first invention includes a plurality of row electrode pairs extending in the row direction on the back side of the front substrate and arranged in parallel in the column direction to form display lines. In the plasma display panel, a dielectric layer covering the row electrode pair is formed, and each row electrode includes a transparent electrode facing each pair and a metal electrode connected to the base side of the transparent electrode. A raised dielectric that projects from the dielectric layer in the opposite direction to the front substrate by a low-melting glass material laminated and fired on the dielectric layer at a portion facing the metal electrode on the surface opposite to the front substrate of the body layer A body layer is formed, the inclination angle of the wall surface of the raised dielectric layer on which the transparent electrode extends to the dielectric layer is set to 45 degrees or more, and the metal of the raised dielectric layer Width in the column direction of the portion facing the transparent electrode projects from the portion facing the pole it is characterized in that it is set to 30μm to 10.
[0022]
According to the plasma display panel of the first invention, the surface discharge generated between the transparent electrodes facing each other in each row electrode pair is caused by the raised dielectric layer formed at the position facing the metal electrode of the row electrode, respectively. Spreading on the metal electrode side, that is, in the direction of other adjacent discharge cells, and the inclination angle of the wall surface on the side where the transparent electrode of the raised dielectric layer extends with respect to the dielectric layer is 45 degrees or more. By forming the steeply inclined surface, it is possible to prevent the surface discharge from spreading along the wall surface of the raised dielectric layer over the raised dielectric layer to the portion facing the metal electrode. The
Therefore, an increase in discharge current that does not contribute to light emission is prevented.
Furthermore, the length of the portion where the raised dielectric layer and the transparent electrode of the row electrode overlap is suppressed to a minimum size of 10 to 30 μm, so that the utilization efficiency of the reflected light by the surface discharge can be improved. .
[0023]
In order to achieve the first object, the plasma display panel according to the second invention has a length of 20 to 100 μm protruding from the dielectric layer of the raised dielectric layer in addition to the configuration of the first invention. It is characterized by being set.
[0024]
According to the plasma display panel of the second invention, the length (thickness) of the raised dielectric layer protruding from the dielectric layer is set to a large dimension of 20 to 100 μm, so that the surface discharge toward the metal electrode side is achieved. It is possible to further suppress the spread and more effectively prevent the discharge current from increasing.
[0027]
In order to achieve the second object, a method of manufacturing a plasma display panel according to a third aspect of the invention includes a transparent electrode extending in the column direction on the back side of the front substrate and a metal electrode extending in the row direction connected to the base side thereof. Forming a dielectric layer covering the row electrode pair on the back side of the front substrate, laminating a photosensitive resin film containing glass powder on the back side of the dielectric layer, The photosensitive resin film is exposed and developed through a mask having a predetermined pattern, and then the photosensitive resin film is baked to form a back surface of the dielectric layer facing each metal electrode of the row electrode. , together with the protruding front substrate opposite is set to an inclination angle more than 45 degrees with respect to the dielectric layer of the wall surface of the transparent electrode extending side-to-transparent electrode projects from the portion facing the metal electrode It is characterized in that the width in the column direction of the portion which forms the additional dielectric layer is set to 30μm from 10.
[0028]
According to the method for manufacturing a plasma display panel according to the third aspect of the invention, the formation of the raised dielectric layer is accurately performed by using the photosensitive resin film, and the wall surface of the raised dielectric layer is the inclination angle is formed to be a steep surface above 45 degrees Rutotomoni, length of the portion overlapping the transparent electrode is set to be a minimum length of 10 to 30 [mu] m.
[0029]
Therefore, the plasma display panel manufactured by this manufacturing method prevents the surface discharge generated between the transparent electrodes in each row electrode pair from rising and overcoming the dielectric layer and spreading to the portion facing the metal electrode. The increase in current can be suppressed, and the utilization efficiency of reflected light by surface discharge can be improved.
[0030]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments that are considered to be most suitable for the present invention will be described in detail below with reference to the drawings.
[0031]
FIG. 1 is a cross-sectional view (corresponding to FIG. 5 of a conventional PDP) of a PDP in an example of an embodiment of the present invention, and FIG. 2 is an enlarged view of a portion where a raised dielectric layer of the PDP is formed. FIG. 3 is a process diagram showing the manufacturing process of the PDP, in particular, the process of forming the raised dielectric layer.
[0032]
In FIG. 1, the configuration of the front glass substrate 1, dielectric layer 2, protective layer 3, rear glass substrate 4, phosphor layer 6, row electrode pair (X, Y), column electrode D, etc. 7 is the same as the conventional PDP, and is given the same reference numerals.
The raised dielectric layer 20Ax protruding into the discharge space S between the rear glass substrate 4 and the portion of the PDP dielectric layer 2 facing the bus electrodes Xb, Yb of the row electrodes X, Y on the back side. And 20 Ay are formed.
[0033]
Each of the raised dielectric layers 20Ax and 20Ay is formed so as to extend in parallel with the bus electrodes Xb and Yb along the row direction, and has a cross-sectional shape as shown below.
[0034]
That is, the raised dielectric layers 20Ax and 20Ay have cross-sections so that the inclination angle θ of the side wall surface on the side where the transparent electrodes Xa and Ya are located is 45 degrees or more, as shown in FIG. In addition, the overlap length s of the portion protruding from the portion facing the bus electrodes Xb and Yb on the back surface of the dielectric layer 2 to the portion facing the transparent electrodes Xa and Ya is formed to be 10 to 30 μm. Has been.
[0035]
The thickness t1 of the raised dielectric layers 20Ax and 20Ay is set to be smaller than the height of the partition wall (not shown) (see FIG. 4 or 6 and 7). In this example, When the height of the partition wall is 100 to 150 μm, the partition wall is formed to be 20 to 100 μm.
In this example, the width n of the row electrode pair X and Y is set to 200 to 400 μm, and the thickness t2 of the dielectric layer 2 is set to 20 to 30 μm.
[0036]
Next, a method for manufacturing the PDP, particularly a method for forming the raised dielectric layers 20Ax and 20Ay will be described.
[0037]
First, as shown in FIG. 3A, a row electrode pair (X, Y) having a predetermined pattern is formed on the front glass substrate 1.
The transparent electrodes Xa, Ya of the row electrode pair (X, Y) are formed by depositing a transparent conductive film such as ITO on the front glass substrate 1 and then patterning it by a photolithographic method. The bus electrodes Xb, Yb Is formed by applying a silver paste and drying it, followed by patterning and baking by photolithography.
[0038]
Next, a glass paste is uniformly applied to the surface (rear surface) of the front glass substrate 1 on which the row electrode pair (X, Y) is formed, dried and fired, whereby the dielectric layer 2 is formed. It is formed.
A positive photosensitive resin film 20 containing glass powder is laminated on the surface (back surface) opposite to the front glass substrate 1 of the dielectric layer 2 thus formed.
[0039]
This positive type photosensitive resin film 20 is a photosensitive resin paste containing glass powder having a softening point substantially equal to that of the glass material of the dielectric layer 2 on a base film (that is, containing lead oxide and silicon dioxide as main components). Glass powder and a low-melting-point glass paste mainly composed of a photosensitive resin composed of an acrylic monomer or oligomer) and then dried.
[0040]
Next, as shown in FIG. 3B, a film-like resist is laminated on the photosensitive resin film 20, and this resist is exposed and developed by using a mask having a predetermined pattern. A resist mask M is formed in which portions Ma of the electrodes X and Y facing the bus electrodes Xb and Yb are opened.
[0041]
Then, patterning is performed on the photosensitive resin film 20 by performing exposure and development through the resist mask M, and then the resist mask M is peeled off.
[0042]
Thus, after patterning to the photosensitive resin film 20, as shown in FIG.3 (c), the photosensitive resin film 20 is the temperature (for example, 560-580 degreeC) of the softening point vicinity. By firing, raised dielectric layers 20Ax and 20Ay are formed on the back side of the dielectric layer 2, respectively.
[0043]
In this way, the raised dielectric layers 20Ax and 20Ay are accurately formed by using the photosensitive resin film 20, whereby the raised dielectric layers 20Ax and 20Ay are formed on the respective side wall surfaces. The inclination angle (see FIG. 2) is formed to be a steep surface of 45 degrees or more, and the overlap length s (see FIG. 2) with the transparent electrodes Xa and Ya is also minimal (for example, 10 to 30 μm). ).
[0044]
As described above, the raised dielectric layers 20Ax and 20Ay are formed so that the inclination angle of the side wall surfaces becomes steep, so that the surface discharge generated between the transparent electrodes Xa and Ya is caused by the raised dielectric layer 20Ax. , 20Ay can be almost completely prevented from spreading to the portion facing the bus electrodes Xb, Yb, thereby suppressing an increase in discharge current and increasing the dielectric layers 20Ax, 20Ay and the transparent electrode Xa, respectively. , Ya is minimized so that the use efficiency of reflected light from the phosphor layer 6 is improved.
[0045]
Further, by increasing the thickness of the raised dielectric layers 20Ax and 20Ay, the spread of the surface discharge toward the bus electrodes Xb and Yb can be further suppressed.
[0046]
The raised dielectric layers 20Ax and 20Ay as described above are formed by vertical walls extending in the column direction and horizontal walls extending in the row direction, in addition to the PDP having the strip-like partition walls 5 extending in the column direction as shown in FIG. A PDP of a type that partitions the discharge space in a grid shape can be formed in the same manner.
[Brief description of the drawings]
FIG. 1 is a side sectional view showing an example of an embodiment of a plasma display panel according to the present invention.
FIG. 2 is a partially enlarged view of a main part of FIG.
FIG. 3 is a process explanatory view showing an example in an embodiment of a plasma display panel manufacturing method according to the present invention;
FIG. 4 is a plan view schematically showing a configuration of a conventional plasma display panel.
5 is a cross-sectional view taken along line VV in FIG.
6 is a cross-sectional view taken along line W1-W1 of FIG.
7 is a cross-sectional view taken along line W2-W2 of FIG.
[Explanation of symbols]
1 ... Front glass substrate (front substrate)
2 ... Dielectric layer 3 ... Protective layer 4 ... Back glass substrate (back substrate)
5 ... barrier rib 6 ... phosphor layer 20 ... photosensitive resin film 20Ax, 20Ay ... raised dielectric layer X, Y ... row electrode Xa, Ya ... transparent electrode Xb, Yb ... bus electrode (metal electrode)
D ... Column electrode S ... Discharge space C ... Discharge cell g ... Gap θ ... Inclination angle s ... Overlap length M ... Resist mask

Claims (3)

A plurality of row electrode pairs extending in the row direction on the back side of the front substrate and arranged in parallel in the column direction to form display lines and a dielectric layer covering the row electrode pairs are formed. In a plasma display panel comprising a transparent electrode opposite to the metal electrode connected to the base side of the transparent electrode,
The low-melting glass material laminated on the dielectric layer and fired in a portion facing the metal electrode on the surface opposite to the front substrate of the dielectric layer protrudes in the opposite direction from the front substrate. The raised dielectric layer is formed, and the inclination angle of the wall surface on the side where the transparent electrode extends of the raised dielectric layer with respect to the dielectric layer is set to 45 degrees or more, and the metal electrode of the raised dielectric layer is A plasma display panel characterized in that a width in a column direction of a portion protruding from an opposing portion and facing a transparent electrode is set to 10 to 30 μm.   The plasma display panel according to claim 1, wherein a length of the raised dielectric layer protruding from the dielectric layer is set to 20 to 100 µm. Forming a row electrode pair having a transparent electrode extending in the column direction on the back side of the front substrate and a metal electrode extending in the row direction connected to the base side thereof;
Forming a dielectric layer covering the row electrode pair on the back side of the front substrate;
Laminating a photosensitive resin film containing glass powder on the back side of this dielectric layer,
The photosensitive resin film is exposed and developed through a mask having a predetermined pattern, and then the photosensitive resin film is baked to form a back surface of the dielectric layer facing each metal electrode of the row electrode. A row of portions that protrude to the opposite side of the front substrate and have an inclination angle with respect to the dielectric layer of the wall surface on the side where the transparent electrode extends is set to 45 degrees or more and project from the portion facing the metal electrode and facing the transparent electrode A method of manufacturing a plasma display panel, comprising forming a raised dielectric layer having a direction width of 10 to 30 μm .

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