JP3816506B2 - Micro movable device - Google Patents

Micro movable device Download PDF

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JP3816506B2
JP3816506B2 JP2004296491A JP2004296491A JP3816506B2 JP 3816506 B2 JP3816506 B2 JP 3816506B2 JP 2004296491 A JP2004296491 A JP 2004296491A JP 2004296491 A JP2004296491 A JP 2004296491A JP 3816506 B2 JP3816506 B2 JP 3816506B2
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hinge
movable
substrate
hinges
mirror
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JP2005134895A (en
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嘉睦 加藤
恵一 森
恵 吉田
理 伊巻
義彦 濱田
健治 近藤
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Japan Aviation Electronics Industry Ltd
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Description

この発明は、静電駆動部により駆動されるミラーを可動部としてもつ光スイッチ、可動電極を可動部としてもつリレーデバイスなど基板上にヒンジにより可動部が保持され、そのヒンジの2つの異なる屈曲状態で可動部を安定に自己保持し、かつそのヒンジの可動範囲を挟んで両側に壁面が上記基板に形成されている微小可動デバイスに関する。   In this invention, the movable part is held by a hinge on a substrate such as an optical switch having a mirror driven by an electrostatic drive part as a movable part, a relay device having a movable electrode as a movable part, and the two different bent states of the hinge Thus, the movable part stably holds the movable part, and the wall surface is formed on the substrate on both sides of the movable range of the hinge.

可動部が2つの安定状態に自己保持されるものでないが、可動部を備える微小可動デバイス、特にフォトリソグラフィによるマスクの形成と、ガス反応性の異方性ドライエッチングにより作製されるものとして基板上にミラー、ヒンジ、アクチュエータ、光導波部の各要素を形成し、光導波部にミラーを挿抜することによって光路の切換えを行なう機能を有する光スイッチを説明する。
図3に特許文献1のMEMS(Micro Electro Mechanical Systems:微小電気機械システム)光スイッチの構造を示す。基板100(図3では100aと100bに分割分離して示しているが一体のものである)の上面(100u)に4本のファイバ溝1A〜1Dが一端を互に連続して十字状に形成され、その互いに直角なファイバ溝1Aと1B間の基板100を駆動体形成部101とし、駆動体形成部101にファイバ溝1Aと1Bに対しそれぞれ45度をなすスロット103が上面(100u)に形成され、スロット103内に可動ロッド116が配され、可動ロッド116の両側に支持枠134A,134Bの一端が固定され、支持枠134A,134Bの他端が板ばねヒンジ128A,128Bにより固定支持部130A,130Bに固定され、可動ロッド116はその延長方向に、かつ基板100の板面(上面100u)と平行に移動自在に保持されている。4本の光ファイバ106A〜106Dがファイバ溝1A〜1D内に配置され、光ファイバ106A〜106Dの放射状配置の中心部1cにミラー102が位置して可動ロッド116の一端に支持され、可動ロッド116の他端に櫛歯型静電アクチュエータ122が連結される。
The movable part is not self-maintained in two stable states, but it is a micro-movable device with a movable part, especially on the substrate as produced by mask formation by photolithography and gas-reactive anisotropic dry etching. An optical switch having a function of switching the optical path by forming each element of a mirror, a hinge, an actuator, and an optical waveguide and inserting and removing the mirror in the optical waveguide will be described.
FIG. 3 shows the structure of a MEMS (Micro Electro Mechanical Systems) optical switch disclosed in Patent Document 1. Four fiber grooves 1A to 1D are continuously formed in a cross shape on the upper surface (100u) of the substrate 100 (in FIG. 3, divided into 100a and 100b but integrated). The substrate 100 between the fiber grooves 1A and 1B perpendicular to each other is used as a driving body forming portion 101, and slots 103 that form 45 degrees with respect to the fiber grooves 1A and 1B, respectively, are formed on the upper surface (100u). The movable rod 116 is disposed in the slot 103, one end of the support frames 134A and 134B is fixed to both sides of the movable rod 116, and the other end of the support frames 134A and 134B is fixed to the fixed support portion 130A by leaf spring hinges 128A and 128B. , 130B, and the movable rod 116 is movably held in its extending direction and parallel to the plate surface (upper surface 100u) of the substrate 100. There. Four optical fibers 106A to 106D are arranged in the fiber grooves 1A to 1D. The mirror 102 is positioned at the central portion 1c of the radial arrangement of the optical fibers 106A to 106D and supported by one end of the movable rod 116. A comb-teeth electrostatic actuator 122 is connected to the other end of the first electrode.

櫛歯型静電アクチュエータ122は可動ロッド116の両側にそれぞれ延長された可動櫛歯電極110と固定櫛歯電極108が可動ロッド116の延長方向に配列され、可動櫛歯電極110が可動ロッド116に固定され、固定櫛歯電極108が、駆動体形成部101にそれぞれ固定される。なお基板100の上面100uの駆動体形成部101領域に浅い方形状凹部115がスロット103とつながって形成され、この凹部115内に可動ロッド116が延長挿入され、静電アクチュエータ122、ヒンジ128A,128B、支持枠134A,134Bが位置され、固定櫛歯電極108、固定支持部130A,130Bは凹部115の底に固定されているが、その他の可動部は凹部115の底面との間に隙間があり浮かされている。櫛歯電極110と108の間に電圧を印加することにより静電気の吸引力が発生し、可動ロッド116が固定櫛歯電極108側に移動し、ミラー102が中心部1cから抜き出た状態に維持させる。この電圧印加を解くと、可動ロッド116はヒンジ128A,128Bの復帰力で中心部1cに移動しミラー102が中心部1cに位置し、元の状態に戻る。   In the comb-shaped electrostatic actuator 122, a movable comb electrode 110 and a fixed comb electrode 108 extended on both sides of the movable rod 116 are arranged in the extending direction of the movable rod 116, and the movable comb electrode 110 is formed on the movable rod 116. The fixed comb electrodes 108 are fixed to the driving body forming unit 101, respectively. A shallow rectangular recess 115 is formed in the region of the driving body forming portion 101 on the upper surface 100u of the substrate 100 so as to be connected to the slot 103. A movable rod 116 is extended and inserted into the recess 115, and the electrostatic actuator 122 and the hinges 128A and 128B. The support frames 134A and 134B are positioned, and the fixed comb electrode 108 and the fixed support portions 130A and 130B are fixed to the bottom of the recess 115, but there is a gap between the other movable portions and the bottom surface of the recess 115. It is floating. By applying a voltage between the comb electrodes 110 and 108, an electrostatic attraction force is generated, the movable rod 116 moves to the fixed comb electrode 108 side, and the mirror 102 is maintained in a state of being extracted from the central portion 1c. Let When this voltage application is released, the movable rod 116 is moved to the central portion 1c by the restoring force of the hinges 128A and 128B, and the mirror 102 is positioned at the central portion 1c and returns to the original state.

ミラー102が中心部1cに挿入されている状態では光ファイバ106Aから出射した光がミラー102で反射されて光ファイバ106Bに入射し、光ファイバ106Dから出射した光はミラー102で反射されて光ファイバ106Cに入射する。ミラー102を中心部1cから抜き出した状態では光ファイバ106Aから出射した光は光ファイバ106Cに入射し、光ファイバ106Dから出射した光は受光用光ファイバ106Bに入射する。
特表2003−506755号公報
In a state where the mirror 102 is inserted into the central portion 1c, the light emitted from the optical fiber 106A is reflected by the mirror 102 and enters the optical fiber 106B, and the light emitted from the optical fiber 106D is reflected by the mirror 102 and is reflected by the optical fiber. Incident on 106C. When the mirror 102 is extracted from the central portion 1c, the light emitted from the optical fiber 106A enters the optical fiber 106C, and the light emitted from the optical fiber 106D enters the light receiving optical fiber 106B.
Special table 2003-506755 gazette

図3に示した微小光スイッチではミラー102を中心部1cから抜けている状態を保持するには両櫛歯電極108と110間に電圧を印加し続けなければならず、その間電力消費がなされ、経済的でない。この点から異なる屈曲状態をもつことができるヒンジを用いることにより、静電型アクチュエータに電圧を印加してミラー102を中心部1cに位置させた状態、又は中心部1cから抜いた状態にすると、電圧印加を解除してもその状態に保持される微小光スイッチを考えた。以下にこの光スイッチを説明する。図4にその平面図を、その断面を図5に示すように、基板31の上面31uに十字状にファイバ溝1が形成され、十字状ファイバ溝1の中心部1cに対し、放射状となっている4本のファイバ溝1A〜1Dにそれぞれ、光ファイバ32A〜32Dが挿入され、図6に示すようにファイバ溝1A〜1Dが光ファイバ径に十分近い溝幅で作成されているため上方から圧入すれば溝の両側壁面に安定して挟持されると共に、中心部1cの近くの突き当て突部3に各光ファイバ端面が突き当てられて基板31に対して光ファイバ32A〜32Dが位置決めされる。各光ファイバ32A〜32Dの端面は例えば6°に斜面研磨されたコリメーションファイバが用いられた例である。   In the minute optical switch shown in FIG. 3, in order to maintain the state where the mirror 102 is removed from the central portion 1c, a voltage must be continuously applied between the comb electrodes 108 and 110, during which power consumption is achieved. Not economical. By using a hinge that can have a different bending state from this point, when a voltage is applied to the electrostatic actuator and the mirror 102 is positioned at the central portion 1c, or pulled out from the central portion 1c, We considered a micro optical switch that remains in that state even when voltage application is released. This optical switch will be described below. FIG. 4 is a plan view and FIG. 5 is a cross-sectional view thereof. A fiber groove 1 is formed in a cross shape on the upper surface 31 u of the substrate 31, and is radial with respect to the central portion 1 c of the cross-shaped fiber groove 1. The optical fibers 32A to 32D are respectively inserted into the four fiber grooves 1A to 1D, and the fiber grooves 1A to 1D are formed with a groove width sufficiently close to the optical fiber diameter as shown in FIG. Then, the optical fibers 32 </ b> A to 32 </ b> D are positioned with respect to the substrate 31 by being stably held between the both side walls of the groove and with the end faces of the optical fibers being abutted against the abutting protrusion 3 near the center portion 1 c. . The end face of each of the optical fibers 32A to 32D is an example in which a collimation fiber whose slope is polished at, for example, 6 ° is used.

図4に示すように基板31の上面31u側における十字状ファイバ溝1により4分割された1つの領域が駆動体形成部10とされ、駆動体形成部10はこれを2分するように中心部1cと連通したロッド溝33が形成され、ロッド溝33に可動ロッド7が配され、可動ロッド7の中心部1c側の一端にミラー4が保持され、可動ロッド7の両側の各2個所に連結された変形S字状板ばねヒンジ6A〜6Dにより、可動ロッド7がその延長方向に移動自在に駆動体形成部10に支持される。ヒンジ6A,6Cと6B,6Dとの間において、櫛歯型静電アクチュエータが設けられ、その可動櫛歯電極5が可動ロッド7の両側に固定され、可動櫛歯電極5のヒンジ6C,6D側とヒンジ6A,6B側とに第1、第2固定櫛歯電極8,9が駆動体形成部10に固定されている。また板ばねヒンジ6A,6Bと6C,6Dは駆動体形成部10に形成されたヒンジ用凹部14aと14b内に配されている。   As shown in FIG. 4, one region divided into four by the cross-shaped fiber groove 1 on the upper surface 31 u side of the substrate 31 is a driving body forming portion 10, and the driving body forming portion 10 has a central portion so as to divide this into two. A rod groove 33 communicated with 1c is formed, the movable rod 7 is arranged in the rod groove 33, the mirror 4 is held at one end of the movable rod 7 on the central portion 1c side, and is connected to each of two positions on both sides of the movable rod 7. By the deformed S-shaped leaf spring hinges 6 </ b> A to 6 </ b> D, the movable rod 7 is supported by the drive body forming unit 10 so as to be movable in the extending direction. A comb-shaped electrostatic actuator is provided between the hinges 6A, 6C and 6B, 6D. The movable comb electrode 5 is fixed to both sides of the movable rod 7, and the movable comb electrode 5 is on the hinge 6C, 6D side. The first and second fixed comb electrodes 8 and 9 are fixed to the drive body forming portion 10 on the hinges 6A and 6B side. The leaf spring hinges 6A, 6B and 6C, 6D are disposed in hinge recesses 14a and 14b formed in the drive body forming portion 10.

また板ばねヒンジ6A〜6Dの断面形状は、その両側面がわずか、例えばθ1=0.5°程度傾斜したテーパ面とされ、基板31の表面(上面31u)側の面6s側より内面に近づくに従って、漸次幅が狭くなるようにされていることが好ましい。例えば図7Aに示すように下の底辺に対し上辺が広い台形状あるいは図7Bに示すようにくさび形三角形状とするとよい。
変形S字状板ばねヒンジ6A〜6Dは異なる屈曲状態を保持するものである。従ってこの光デバイスの作製直後の初期形状(第1安定状態)において、例えばミラー4が中心部1cに挿入されているようにする。この時、光ファイバ32Aから出射された光はミラー4によって反射され光ファイバ32Bに入射される。光ファイバ32Dから出射された光は光ファイバ32Cへ反射入射される。可動ロッド7、可動櫛歯電極5と板ばねヒンジ6A〜6Dを介して電気的につながれている駆動体形成部10、第2固定櫛歯電極9をそれぞれアースした状態で第1固定櫛歯電極8に電圧を印加すれば、第1固定櫛歯電極8と可動櫛歯電極5との間に静電吸引力が働き、その力が第1安定状態の保持力よりも大きい場合、板ばねヒンジ6A〜6Dは第2安定状態へと反転し、その電圧の印加を絶ってもその状態で自己保持される。この時、図8に示すようにミラー4は中心部1cから退避した状態となり、光ファイバ32A,32Dからの各出射光は光ファイバ32C,32Bにそれぞれ入射される。駆動体形成部10、第1固定櫛歯電極8をアースした状態で第2固定櫛歯電極9に電圧を印加すれば、第2固定櫛歯電極9と可動櫛歯電極5との間に静電吸引力が作用し、その力が第2安定状態よりも大きい場合には再び第1安定状態へと戻る。なお、第1又は第2固定櫛歯電極8又は9と可動電極5との間にそれぞれ電圧を印加するには
、例えば第1、第2固定櫛歯電極8,9にそれぞれボンディングワイヤを接続しておき、これらボンディングワイヤと駆動体形成部10との間に電圧を印加すればよい。また板ばねヒンジ6A〜6Bは2つの安定な異なる屈曲状態間を反転することができるものであればよい。
Further, the cross-sectional shapes of the leaf spring hinges 6A to 6D are tapered surfaces whose both side surfaces are slightly inclined, for example, about θ1 = 0.5 °, closer to the inner surface than the surface 6s side on the surface (upper surface 31u) side of the substrate 31. Accordingly, it is preferable that the width gradually decreases. For example, a trapezoidal shape having a wide upper side with respect to the lower bottom side as shown in FIG. 7A or a wedge-shaped triangular shape as shown in FIG. 7B may be used.
The modified S-shaped leaf spring hinges 6A to 6D hold different bent states. Therefore, in the initial shape (first stable state) immediately after the fabrication of this optical device, for example, the mirror 4 is inserted into the central portion 1c. At this time, the light emitted from the optical fiber 32A is reflected by the mirror 4 and enters the optical fiber 32B. The light emitted from the optical fiber 32D is reflected and incident on the optical fiber 32C. The first fixed comb electrode in a state where the driving body forming portion 10 and the second fixed comb electrode 9 electrically connected to the movable rod 7, the movable comb electrode 5 and the leaf spring hinges 6A to 6D are grounded. When a voltage is applied to 8, an electrostatic attraction force acts between the first fixed comb electrode 8 and the movable comb electrode 5, and when the force is larger than the holding force in the first stable state, the leaf spring hinge 6A to 6D are inverted to the second stable state, and are self-held in that state even if the voltage application is stopped. At this time, as shown in FIG. 8, the mirror 4 is retracted from the central portion 1c, and the outgoing lights from the optical fibers 32A and 32D are incident on the optical fibers 32C and 32B, respectively. If a voltage is applied to the second fixed comb electrode 9 in a state where the driving body forming unit 10 and the first fixed comb electrode 8 are grounded, static electricity is generated between the second fixed comb electrode 9 and the movable comb electrode 5. When the electro-suction force is applied and the force is greater than the second stable state, the state returns to the first stable state again. In order to apply a voltage between the first or second fixed comb electrode 8 or 9 and the movable electrode 5, for example, a bonding wire is connected to each of the first and second fixed comb electrodes 8 and 9. A voltage may be applied between the bonding wires and the driving body forming unit 10. The leaf spring hinges 6A to 6B only need to be able to reverse between two stable different bent states.

この光デバイスにおいて、ミラー4以外の可動部はミラー駆動方向と平行な中心線(可動ロッド7の中心線)に関して線対称な構造を有し、尚且つ、4本の板ばねヒンジ6A,6B,6C,6Dによる可動ロッド7の支持点A,B,C,D(すなわち、ヒンジ反力作用点)は可動櫛歯電極5と可動ロッド7との連結部(すなわち、駆動力作用点S)に関して対象な位置に配置されている。更に、前記駆動力作用点Sは可動部の重心にほぼ一致するように設計されている。このような構造をとることにより、例え、アクチュエータの駆動力が前記可動部を駆動すべき所望の方向とは異なるベクトル成分を含有している場合においても、前記駆動力の不要ベクトル成分に対し前記4本の板ばねヒンジ6A,6B,6C,6Dから均等に反力が作用するため、前記可動部の所望の駆動方向以外への動きを効果的に抑制することができる。   In this optical device, the movable parts other than the mirror 4 have a line-symmetric structure with respect to a center line parallel to the mirror driving direction (center line of the movable rod 7), and the four leaf spring hinges 6A, 6B, The support points A, B, C, and D of the movable rod 7 by 6C and 6D (that is, the hinge reaction force action point) are related to the connecting portion of the movable comb electrode 5 and the movable rod 7 (that is, the driving force action point S). It is placed at the target position. Further, the driving force action point S is designed to substantially coincide with the center of gravity of the movable part. By adopting such a structure, for example, even when the driving force of the actuator contains a vector component different from the desired direction in which the movable portion should be driven, the unnecessary vector component of the driving force is Since the reaction force acts equally from the four leaf spring hinges 6A, 6B, 6C, 6D, the movement of the movable portion in a direction other than the desired driving direction can be effectively suppressed.

また、衝撃力等の外乱が作用した場合においても、1)可動部の重心に関し対称な位置に4本の板ばねヒンジ6A,6B,6C,6Dが設けられていること、2)重い構造体である可動櫛歯電極5を4本の板ばねヒンジ6A,6B,6C,6Dが均等に支持していること、以上2点の構造的特徴により可動部の不必要な動きを効果的に抑制することができる。
次に図4〜6に示した光デバイスを作製する方法としては以下のようにすることが考えられる。図9はその各工程における図4中5A−5A線断面を示す。
Even when a disturbance such as an impact force is applied, 1) the four leaf spring hinges 6A, 6B, 6C, 6D are provided at symmetrical positions with respect to the center of gravity of the movable part, and 2) a heavy structure. The four leaf spring hinges 6A, 6B, 6C, 6D are uniformly supported by the movable comb electrode 5 and the above two structural features effectively suppress unnecessary movement of the movable part. can do.
Next, as a method of manufacturing the optical device shown in FIGS. FIG. 9 shows a cross section taken along line 5A-5A in FIG.

図9Aに示すように中間絶縁層41を介して2枚のシリコン単結晶層42,43が接合された基板、いわゆるSOI基板31を用意する。例えばシリコン単結晶層42として厚さ350μmの単結晶シリコン基板を用い、そのシリコン基板42上に厚さ3μmのシリコン酸化膜41が中間絶縁層として形成され、更にその上にシリコン単結晶層43として単結晶のシリコンデバイス層43が形成されて基板31とされる。
その基板31上、つまりシリコンデバイス層43上にマスク材層44を形成する。マスク材層44としては例えばシリコン酸化膜が用いられる。
As shown in FIG. 9A, a substrate in which two silicon single crystal layers 42 and 43 are bonded via an intermediate insulating layer 41, a so-called SOI substrate 31, is prepared. For example, a single crystal silicon substrate having a thickness of 350 μm is used as the silicon single crystal layer 42, a silicon oxide film 41 having a thickness of 3 μm is formed as an intermediate insulating layer on the silicon substrate 42, and a silicon single crystal layer 43 is further formed thereon. A single crystal silicon device layer 43 is formed to form the substrate 31.
A mask material layer 44 is formed on the substrate 31, that is, on the silicon device layer 43. For example, a silicon oxide film is used as the mask material layer 44.

ミラー4、ヒンジ6A〜6B、可動ロッド7、可動櫛歯電極5、第1、第2固定櫛歯電極8,9上と、ファイバ溝1、ロッド溝33及び板ばねヒンジ6A〜6Bの屈曲動作に影響を与えない空間部分(ヒンジ用凹部14)を除く基板31上、つまりミラー面と、ミラー面以外の基板板面に垂直な側壁面とを規定するパターン、この例では図4に示す形状パターンに、例えばフォトリソグラフィ技術を用いてマスク材層44をパターニングして図9Bに示すようにマスク45を作成する。
次に例えばICP(Inductively Coupled Plasma)によるドライエッチングにより、マスク45をマスクとしてシリコンデバイス層43を、図9Cに示すように中間絶縁層41が露出するまで、基板31の板面に対し、ほぼ垂直にエッチングする。これによりファイバ溝1、ロッド溝33、ヒンジ用凹部14、各櫛歯電極の櫛歯などが形成される。
Bending operation of the mirror 4, the hinges 6A to 6B, the movable rod 7, the movable comb electrode 5, the first and second fixed comb electrodes 8, 9 and the fiber groove 1, the rod groove 33, and the leaf spring hinges 6A to 6B. Pattern defining the mirror surface and the side wall surface perpendicular to the substrate plate surface other than the mirror surface, in this example the shape shown in FIG. The mask material layer 44 is patterned into a pattern, for example, using a photolithography technique, and the mask 45 is created as shown in FIG. 9B.
Next, for example, by dry etching using ICP (Inductively Coupled Plasma), using the mask 45 as a mask, the silicon device layer 43 is substantially perpendicular to the plate surface of the substrate 31 until the intermediate insulating layer 41 is exposed as shown in FIG. 9C. Etch into. As a result, the fiber groove 1, the rod groove 33, the hinge recess 14, the comb teeth of each comb-tooth electrode, and the like are formed.

このエッチングにより形成された側壁を含むシリコンデバイス層43の表面を洗浄した後、中間絶縁層41に対して選択的なエッチング液、例えば弗素酸(HF)の50%溶液(又は弗化水素酸と弗化アンモニウムの混合液)に浸して中間絶縁層41に対しエッチングを行う。このエッチング時間は、ミラー4、可動櫛歯電極5、ヒンジ6A〜6D、可動ロッド7などの可動部と対応する部分の中間絶縁層41は完全に除去されるが、第1、第2固定櫛歯電極8,9の櫛歯以外の部分などの基体31に固定されているべき部分の中間絶縁層41は周縁のわずかな部分が除去されるのみとする。このエッチング処理により、
前記可動部は板ばねヒンジ6A〜6Dにより、移動自在に基板31に支持される。またこの例では中間絶縁層41とマスク材層44は同一材とし、マスク45も同時に除去している。
After cleaning the surface of the silicon device layer 43 including the side wall formed by this etching, an etching solution selective for the intermediate insulating layer 41, for example, a 50% solution of hydrofluoric acid (HF) (or hydrofluoric acid and The intermediate insulating layer 41 is etched by immersing it in a mixed solution of ammonium fluoride. In this etching time, the intermediate insulating layer 41 corresponding to the movable portion such as the mirror 4, the movable comb electrode 5, the hinges 6A to 6D, and the movable rod 7 is completely removed, but the first and second fixed combs are removed. In the intermediate insulating layer 41 at a portion to be fixed to the base 31 such as a portion other than the comb teeth of the tooth electrodes 8 and 9, only a small portion at the periphery is removed. By this etching process,
The movable part is supported on the substrate 31 movably by leaf spring hinges 6A to 6D. In this example, the intermediate insulating layer 41 and the mask material layer 44 are made of the same material, and the mask 45 is also removed at the same time.

ミラー4の両側面に高反射率の金属、例えばAu/Pt/Ti多層膜をスパッタによりコーティングして、ミラー本体を形成する。
以上述べたように異なる2つの屈曲状態をもつばねヒンジを用いることにより、駆動部に電圧を印加してミラーを変位させた後、この電圧の印加を解除してもそのミラーの変位した状態が保持され消費電力を減少させることができる。
しかし、実際にこの光スイッチを試作したところ、図4中に破線で示すように、ヒンジの1乃至複数がこれと対向するヒンジ用凹部14の壁面に付いた状態になっているものが生じ、歩留りが期待できないことが判明した。このような問題が生じないようにするには、ヒンジ6A〜6Dの機械的剛性を大にすればよい、例えばヒンジ6A〜6Dの厚みを大きくすればよい。しかしこのようにするとミラーを変位させるための駆動電圧も大きなものが必要となり、このように微小デバイスを用いるモジュールや装置などに比較的大きな電圧源を用意することは適しない。
A mirror body is formed by coating a high-reflectance metal such as an Au / Pt / Ti multilayer film on both sides of the mirror 4 by sputtering.
As described above, by using a spring hinge having two different bent states, the mirror is displaced by applying a voltage to the drive unit, and then the mirror is displaced even if the application of this voltage is canceled. It is held and power consumption can be reduced.
However, when this optical switch was actually prototyped, as shown by the broken line in FIG. 4, one or more of the hinges were attached to the wall surface of the hinge recess 14 opposed thereto, It turns out that the yield cannot be expected. In order to prevent such a problem from occurring, the mechanical rigidity of the hinges 6A to 6D may be increased, for example, the thickness of the hinges 6A to 6D may be increased. However, this requires a large drive voltage for displacing the mirror, and thus it is not suitable to prepare a relatively large voltage source for a module or apparatus using a microdevice.

そこでヒンジが壁面に付いた状態になる原因を追求し、ガス反応性のドライエッチングの後に、ウエットエッチングを行い、その後の乾燥工程が終了した状態においてヒンジが壁面に付いた状態のものが生じることが判明した。そこで乾燥工程として、減圧下で昇華する液体でエッチング液を置換した後、低温にし固化させ、減圧下で昇華させる方法や、液化二酸化炭素(CO2 )でエッチング液を置換し、液相から気相への状態変化を伴わない高温高圧下で行う超臨界乾燥法、あるいは単純に表面張力の小さい液体で置換した後、乾燥するといった方法などについて検討した。これらのなかで、表面張力の小さい液体から乾燥する方法が簡便であるが、確実性に欠けることがわかった。 Therefore, in pursuit of the cause of the hinge being attached to the wall surface, after gas reactive dry etching, wet etching is performed, and after the subsequent drying process, the hinge is attached to the wall surface. There was found. Therefore, as a drying process, after replacing the etching solution with a liquid that sublimates under reduced pressure, the temperature is reduced to solidify and sublimated under reduced pressure, or the etching solution is replaced with liquefied carbon dioxide (CO 2 ), and the gas phase is removed from the liquid phase. We investigated the supercritical drying method under high temperature and high pressure without phase change to the phase, or the method of simply substituting with a liquid with low surface tension and drying. Among these, it has been found that the method of drying from a liquid having a small surface tension is simple, but lacks certainty.

リレーの可動接点を2安定性のヒンジにより保持し、可動接点を2つの固定接点に対し切替接続してその状態を自己保持させたり固定接点との接触又は非接触にしてその状態を自己保持させたりするリレーデバイス、あるいは前述した光スイッチのミラー部を質量部とし、静電アクチュエータにかえて、静電容量型の変位センサとし、あるしきい値を超える加速度が入力されると質量部の位置が切替わる衝撃センサなどを、微小デバイスとして構成する場合は、同様の問題が生じると考えられる。
この発明目的は2つの異なる屈曲状態をもつヒンジにより可動部を支持し、その可動部の変位された状態を自己保持する微小可動デバイスであって、歩留りよく作製することができるものを提供することにある。
The movable contact of the relay is held by a bi-stable hinge, and the movable contact is switched and connected to two fixed contacts to make the state self-holding or to make the state self-hold by making contact or non-contact with the fixed contact. The relay device or the mirror part of the optical switch described above is used as a mass part, and instead of an electrostatic actuator, a capacitive displacement sensor is used. It is considered that the same problem occurs when an impact sensor or the like that switches between is configured as a micro device.
An object of the present invention is to provide a micro movable device that supports a movable part by a hinge having two different bent states and self-holds the displaced state of the movable part, and can be manufactured with high yield. It is in.

この発明によれば可動部が2つの異なる屈曲状態をもつヒンジにより支持され、ヒンジの2つの安定な屈曲状態の一方において、ヒンジとその両側のヒンジと接触可能な対向壁面との両間隔が、ヒンジの長手方向の各点で互いに等しくされている。ここでヒンジの一端部の壁面との間隔と、他端部の壁面との間隔は等しくなくてもよいことに注意されたい。   According to the present invention, the movable part is supported by a hinge having two different bent states, and in one of the two stable bent states of the hinge, the distance between the hinge and the opposing wall surface that can come into contact with the hinges on both sides thereof is They are made equal at each point in the longitudinal direction of the hinge. Note that the distance between the wall surface at one end of the hinge and the wall surface at the other end may not be equal.

図4に示した光スイッチではヒンジ6A〜6Dとその両側のヒンジ用凹部14の対向壁面との間隔、例えばヒンジ6Aについては間隔D1とD3が異なっているため、デバイス作製時のウエットエッチング後の乾燥工程で図10に示すようにヒンジ6(6A)の両側においてエッチング液の蒸発状態が不平衡となり、ヒンジの両側の液体が蒸発してしまうタイミングがずれ、ヒンジと壁面との両側において壁面との間隔が狭側は蒸発が遅れ液が残るが間隔が広い側には液がなくなる状態が生じ、この状態で液体の表面張力によりヒンジ6(6A)が凹部14の壁面に引き寄せられ、乾燥工程が終了してもそのままヒンジ6
(6A)が壁面についたままになってしまうと考えられる。
In the optical switch shown in FIG. 4, the distance between the hinges 6A to 6D and the opposite wall surfaces of the hinge recesses 14 on both sides thereof, for example, the distances D1 and D3 for the hinge 6A are different. In the drying process, as shown in FIG. 10, the evaporation state of the etching solution is unbalanced on both sides of the hinge 6 (6A), the timing at which the liquid on both sides of the hinge evaporates is shifted, and the wall surface on both sides of the hinge and the wall surface On the narrow side, the evaporation is delayed and the liquid remains, but on the wide side, the liquid disappears. In this state, the hinge 6 (6A) is attracted to the wall surface of the recess 14 by the surface tension of the liquid. Hinge 6 as it is
It is considered that (6A) remains on the wall surface.

この発明によればヒンジの長手方向における各点でヒンジの両側でその対応壁面との間隔が互いに等しいため、デバイス作製におけるウエットエッチングの後の乾燥工程で、液体がヒンジの両側で同様に減少してゆくため、ヒンジが壁面についた状態になり難い。   According to the present invention, since the distance from the corresponding wall surface on both sides of the hinge is equal to each other at each point in the longitudinal direction of the hinge, liquid is similarly reduced on both sides of the hinge in the drying process after wet etching in device fabrication. Therefore, it is difficult for the hinge to be attached to the wall.

この発明を図4に示した光スイッチを適用した実施形態を、図1に図4及び図5と対応する部分に同一参照番号を付けて示し、重複説明を省略する。
この実施形態では、初期状態、つまり光スイッチを作製した時、図1ではミラー4が十字状ファイバ溝1の中心部1cに位置している状態で板ばねヒンジ6A,6B,6C,6Dの長手方向における各点の両側のヒンジ用凹部14a,14bとの対向壁面14a1,14a2,14a3,14a4,14b1,14b2,14b3,14b4との間隔(距離)は互いに等しくされている。図1の例ではヒンジ6A〜6Dと、これらそれぞれ対向するヒンジ用凹部14a,14bの対応壁面とは互いに平行し、ヒンジ6A及び6Bとその両側の壁面との間隔(距離)D1,D3、ヒンジ6C及び6Dと、その両側の対向壁面との各間隔(距離)D2,D4は全て等しくD1=D2=D3=D4とされている。しかしD1=D3かつD2=D4とするがD1≠D2であってもよい。更にこのように各ヒンジ6A〜6Dとその両側の壁面との間隔(距離)がそのヒンジ長手方向における各点で同一、つまり均一でなくてもよい。即ち図2に示すようにヒンジ6(6A)の可動ロッド7側の端部におけるヒンジ6と対向壁面14a1,14a2との間隔(距離)D3aとD1aは等しく、ヒンジ6の反対側の端部におけるヒンジ6と対向壁面14a1,14a2との間隔(距離)D3bとD1bは等しいが、これら両端部の間隔D3aとD3bは互いに異なっていてもよい。また上記のD3bとD1b等を等しくすることは、ヒンジ6A〜6Dの全長に亙らなくとも、少なくとも対向する壁面と接触可能な長手方向の各点において成立すればよい。
An embodiment in which the optical switch shown in FIG. 4 is applied to the present invention is shown in FIG. 1 with the same reference numerals assigned to the portions corresponding to those in FIG. 4 and FIG.
In this embodiment, when the optical switch is manufactured in the initial state, the longitudinal direction of the leaf spring hinges 6A, 6B, 6C, 6D with the mirror 4 positioned in the central portion 1c of the cross-shaped fiber groove 1 in FIG. The distances (distances) between the opposing wall surfaces 14a1, 14a2, 14a3, 14a4, 14b1, 14b2, 14b3, 14b4 of the hinge recesses 14a, 14b on both sides of each point in the direction are made equal to each other. In the example of FIG. 1, the hinges 6A to 6D and the corresponding wall surfaces of the hinge recesses 14a and 14b facing each other are parallel to each other, and the distances (distances) D1, D3 between the hinges 6A and 6B and the wall surfaces on both sides thereof The distances (distances) D2 and D4 between 6C and 6D and the opposing wall surfaces on both sides thereof are all equal to D1 = D2 = D3 = D4. However, D1 = D3 and D2 = D4, but D1 ≠ D2. Further, the distances (distances) between the hinges 6A to 6D and the wall surfaces on both sides of the hinges 6A to 6D do not have to be the same, that is, not uniform at each point in the hinge longitudinal direction. That is, as shown in FIG. 2, the distance (distance) D3a and D1a between the hinge 6 and the opposed wall surfaces 14a1 and 14a2 at the end of the hinge 6 (6A) on the movable rod 7 side is equal, and at the opposite end of the hinge 6 The distances (distances) D3b and D1b between the hinge 6 and the opposing wall surfaces 14a1 and 14a2 are the same, but the distances D3a and D3b between these ends may be different from each other. Further, equalization of D3b and D1b described above may be established at each point in the longitudinal direction that can contact at least the opposing wall surfaces, even if it does not extend over the entire length of the hinges 6A to 6D.

またこの実施形態においては可動櫛歯電極5、第1、第2固定電極8,9、ヒンジ6A〜6Dが形成、収容されている凹部内は、基板31のこれら櫛歯電極、ヒンジが形成されている面31uに形成され、基板31の辺縁に開放されている溝と接続されている。この例ではヒンジ用凹部14aはロッド溝33を通じて十字状ファイバ溝1の中心部1cとつながっている。ファイバ溝1(1A〜1D)はその中心部1cと反対側の端が、基板31の各角から外部に開放されている。更にロッド溝33の延長方向において、これを中心部1cと反対方向に延長するように開放用溝16が基板31の辺縁に達するまで形成され、ヒンジ用凹部14bが開放用溝16とつながっている。更にヒンジ用凹部14aと14bの各櫛歯電極側は、その可動ロッド7と平行な壁面に沿った連通溝17,18により互いにつながっている。また好ましくはこれら連通溝17,18につながり、基板31の辺縁(図1では下側の辺縁)に達する開放溝19,20が形成されている。   Further, in this embodiment, the comb electrodes and hinges of the substrate 31 are formed in the recesses in which the movable comb electrodes 5, the first and second fixed electrodes 8 and 9, and the hinges 6A to 6D are formed and accommodated. The groove 31 is formed on the surface 31 u and is open to the edge of the substrate 31. In this example, the hinge recess 14 a is connected to the central portion 1 c of the cross-shaped fiber groove 1 through the rod groove 33. The end of the fiber groove 1 (1A to 1D) opposite to the central portion 1c is opened to the outside from each corner of the substrate 31. Further, in the extending direction of the rod groove 33, the opening groove 16 is formed so as to extend in the direction opposite to the central portion 1c until the edge of the substrate 31 is reached, and the hinge recess 14b is connected to the opening groove 16. Yes. Further, the comb electrode side of the hinge recesses 14 a and 14 b are connected to each other by communication grooves 17 and 18 along a wall surface parallel to the movable rod 7. Preferably, open grooves 19 and 20 that are connected to the communication grooves 17 and 18 and reach the edge of the substrate 31 (the lower edge in FIG. 1) are formed.

この実施形態1に示した光スイッチは図9に示した製法と同様に作製することができる。その場合、マスク材層44をパターニングする際に、板ばねヒンジ6A〜6Bが2つの安定な屈曲状態の一方の形状(目的とする初期状態の形状)になるようにすると共に、ヒンジ用凹部14a,14bの壁面形状、またこれら壁面とヒンジとの間隔が先に述べたようにし、かつ開放用溝16,19,20や連通溝17,18が形成されるようにする。つまり図1に示す平面形状にパターニングすればよい。
この実施形態1では、ヒンジ6A〜6Dと、その長手方向の各点でその両側のヒンジ用凹部14a,14bとの壁面との間隔が等しいため、図2に示すように蒸発遅れした液体15がヒンジ6A〜6Dの両側で同一量となり、ヒンジが壁面に引き寄せられたままになるおそれがない。しかも作製時のウエットエッチング後の乾燥工程で簡便な液体からの直接乾燥を利用することができ、かつ歩留りがよいものとなる。
The optical switch shown in Embodiment 1 can be manufactured in the same manner as the manufacturing method shown in FIG. In this case, when patterning the mask material layer 44, the leaf spring hinges 6A to 6B are set to one of two stable bent shapes (target initial shape) and the hinge recess 14a. , 14b and the interval between the wall surface and the hinge are as described above, and the opening grooves 16, 19, 20 and the communication grooves 17, 18 are formed. That is, patterning may be performed in the planar shape shown in FIG.
In the first embodiment, since the distance between the hinges 6A to 6D and the wall surfaces of the hinge recesses 14a and 14b on both sides at the respective points in the longitudinal direction is equal, the liquid 15 delayed in evaporation as shown in FIG. It becomes the same amount on both sides of the hinges 6 </ b> A to 6 </ b> D, and there is no possibility that the hinges remain pulled toward the wall surface. Moreover, direct drying from a simple liquid can be used in the drying step after the wet etching during production, and the yield is improved.

またヒンジ用凹部14a,14b、櫛歯電極5,8,9が形成、収容されている凹部は
基板31に形成され、外部に解放されているファイバ溝1や開放用溝16,19,20とつながっているため、作製時のウエットエッチング後の乾燥工程において、エッチング液を基板31から外部へ流出させることができ、それだけ乾燥工程を短かくすることができる。なおヒンジ用凹部14a,14bの板ばねヒンジ6A〜6Dの両側の部分は板ばねヒンジ6A〜6D、可動ロッド7と凹部14a,14bの底面との隙間でつながっているので、図示された開放用溝19、20を設けることなく開放用溝16のみを設ける構成であってもエッチング液を流出させ、乾燥工程を短くする効果が得られる。しかし開放用溝16のみの構成の場合は基板31の外部へ開放される溝に直結している凹部14aのヒンジ6A、6Bより壁面14a1、14a3側の部分および凹部14bのヒンジ6C、6Dより壁面14b2、14b4側の部分のエッチング液の方がより速く排出され、各凹部14a、14bのヒンジ6A〜6Dより壁面14a2、14a4及び14b1、14b3側の各部分のエッチング液の流出が相対的に遅くなる傾向をもつので、さらに開放用溝19,20も設けてこれらヒンジ6A〜6Dより壁面14a2、14a4、14b1、14b3側の各部分の液の流出を促進させ、乾燥工程におけるヒンジ両側の液の減少の平衡をより確実にすることが望ましい。
The recesses for forming and receiving the hinge recesses 14a and 14b and the comb electrodes 5, 8, and 9 are formed in the substrate 31, and the fiber groove 1 and the release grooves 16, 19, and 20 that are released to the outside. Since they are connected, in the drying process after the wet etching at the time of manufacturing, the etching solution can flow out from the substrate 31 and the drying process can be shortened accordingly. Since the concave portions 14a and 14b for the hinges are connected to each other by the gap between the leaf spring hinges 6A to 6D and the movable rod 7 and the bottom surfaces of the concave portions 14a and 14b. Even in the configuration in which only the opening groove 16 is provided without providing the grooves 19 and 20, the etching solution is allowed to flow out and the effect of shortening the drying process can be obtained. However, in the case of the configuration having only the opening groove 16, the hinges 6A and 6B of the recess 14a directly connected to the groove opened to the outside of the substrate 31 and the wall surfaces 14a1 and 14a3 side portions of the recess 14a and the hinges 6C and 6D of the recess 14b are wall surfaces. The etchant at the portions on the 14b2 and 14b4 side is discharged faster, and the outflow of the etchant at each portion on the wall surfaces 14a2, 14a4 and 14b1, 14b3 side is relatively slower than the hinges 6A to 6D of the recesses 14a and 14b. Therefore, the opening grooves 19 and 20 are also provided to promote the outflow of the liquid on the wall surfaces 14a2, 14a4, 14b1 and 14b3 from the hinges 6A to 6D, and the liquid on both sides of the hinge in the drying process is promoted. It is desirable to ensure a more balanced reduction.

この発明は微小光スイッチのみならず、先にも述べたようにフォトリソグラフィ、深彫りドライエッチング、ウエットエッチングを用いて、2つの互いに異なる安定な屈曲状態をもつことができるヒンジで可動部を、その駆動体形成部に支持して、可動部を2つの位置の一方の選択的に自己保持させるリレーデバイス、衝撃センサなどの微小可動デバイスに適用することができる。   This invention uses not only a micro optical switch but also a movable part with a hinge that can have two different stable bending states by using photolithography, deep etching dry etching, and wet etching as described above. It can be applied to a minute movable device such as a relay device or an impact sensor that is supported by the driving body forming portion and selectively holds the movable portion in one of two positions.

この発明の実施形態を示す平面図。The top view which shows embodiment of this invention. この発明デバイスを作製する際のウエットエッチング後の乾燥、工程の途中における液体の残存状態を示す図。The figure which shows the residual state of the liquid in the middle of the drying after a wet etching at the time of producing this invention device, and a process. 従来の光スイッチを示す平面図。The top view which shows the conventional optical switch. 2安定状態のいずれも自己保持可能な光スイッチの一例を示す平面図。The top view which shows an example of the optical switch which can hold | maintain both of 2 stable states. 図4に示した光スイッチの5A−5A線断面、5B−5B線断面、5C−5C線断面を示す図。The figure which shows the 5A-5A line cross section of the optical switch shown in FIG. 4, the 5B-5B line cross section, and the 5C-5C line cross section. 図4に示した光スイッチの十字状ファイバ溝の中心部付近の構造を説明するための拡大平面図。The enlarged plan view for demonstrating the structure of the center part vicinity of the cross-shaped fiber groove | channel of the optical switch shown in FIG. 図4に示した光スイッチに用いた板ばねヒンジの拡大断面図。The expanded sectional view of the leaf | plate spring hinge used for the optical switch shown in FIG. 図4に示した光スイッチにおいてミラーがファイバ溝中心部1cから抜けた状態を示す平面図。FIG. 5 is a plan view showing a state in which the mirror is removed from the fiber groove center portion 1c in the optical switch shown in FIG. 図4に示した光スイッチの作製方法を説明するための各工程における図4の5A−5A線断面を示す図。FIG. 5 is a cross-sectional view taken along line 5A-5A in FIG. 4 in each step for explaining a method for manufacturing the optical switch shown in FIG. 図4に示した光スイッチの作製時のウエットエッチング後の乾燥工程途中における液体の残存状態を示す図。The figure which shows the residual state of the liquid in the middle of the drying process after the wet etching at the time of preparation of the optical switch shown in FIG.

Claims (2)

基板上に形成され、その基板板面と平行に変位する可動部と、上記基板上に形成された駆動体形成部と、上記可動部と上記駆動体形成部とに両端が連結され、2つの相異なる屈曲状態で上記可動部を2つの位置に自己保持する双安定動作をするヒンジと、このヒンジの可動範囲を挟んで両側にヒンジと対向して上記駆動体形成部に形成されている壁面とを備える微小可動デバイスであって、
上記ヒンジとそのヒンジと接触可能な上記両側の壁面との各間隔が、上記ヒンジの2つの安定な屈曲状態の一方において、上記ヒンジの長手方向の各点で互いに等しいことを特徴とする微小可動デバイス。
A movable part formed on the substrate and displaced in parallel with the substrate plate surface, a driver forming part formed on the substrate, the movable part and the driver forming part are connected at both ends, A hinge that performs a bi-stable operation that self-holds the movable part in two positions in different bending states, and a wall surface that is formed on the drive body forming part opposite to the hinge on both sides of the movable range of the hinge A micro movable device comprising:
The minute movement is characterized in that the distance between the hinge and the wall surfaces on both sides that can come into contact with the hinge is equal to each other at each point in the longitudinal direction of the hinge in one of two stable bent states of the hinge. device.
上記ヒンジと上記両側の壁面とにより構成される各溝が、上記基板の上記駆動体形成部形成面に形成され、基板の辺縁に開放されている溝に連続していることを特徴とする請求項1記載の微小可動デバイス。   Each groove formed by the hinge and the wall surfaces on both sides is formed on the driving body forming portion forming surface of the substrate and is continuous with the groove opened to the edge of the substrate. The micro movable device according to claim 1.
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