JP3791440B2 - Electronic component thermocompression bonding equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component thermocompression bonding apparatus for thermocompression bonding an electronic component to a substrate using a horizontally long thermocompression bonding tool.
[0002]
[Prior art]
As a thermocompression bonding apparatus for electronic parts for bonding electronic parts such as flip chips and film carrier packages to a substrate such as a display panel such as a liquid crystal panel, a device using a thermocompression bonding tool is known.
[0003]
FIG. 5 is a front view of a conventional thermocompression bonding apparatus for electronic components, and FIG. 6 is a cross-sectional view of a conventional thermocompression bonding apparatus for electronic components. 5 and 6, the display panel 1 in which two glass plates are bonded together is supported by the movable table 2, and an electronic component P is temporarily attached to the edge of the display panel 1 in the previous process. The edge of the display panel 1 is supported from below by a support 4 provided on the base 3.
[0004]
On the upper part of the main body frame 5, a cylinder 6 as a vertical movement means is disposed with its rod 7 facing downward. A head portion 8 is attached to the lower end portion of the rod 7. The head portion 8 includes a plate-like holding member 9 attached to the lower end portion of the rod 7 and a horizontally long thermocompression bonding tool 10 attached to the lower portion of the holding member 9. The thermocompression bonding tool 10 has a built-in heater 11 for heating it.
[0005]
A slider 12 is provided on the back surface of the holding member 9, and the slider 12 is fitted to a vertical guide rail 13 provided on the front surface of the main body frame 5 so as to be slidable in the vertical direction. As shown in FIG. 5, since the thermocompression bonding tool 10 is horizontally long, the guide means for guiding the vertical movement of the thermocompression bonding tool 10 including the slider 12 and the guide rail 13 is arranged at a plurality of locations in the horizontal direction (in this example, 2 places on the left and right). The distances L1 and L2 from the center C of the cylinder 6 to the left and right sliders 12 and the guide rails 13 are equal. Of course, the slider 12 and the guide rail 13 may be provided at three or more locations.
[0006]
This conventional thermocompression bonding apparatus for electronic components has the above-described configuration, and the operation thereof will be described next. As shown in FIG. 6, the movable table 2 is driven to support the edge portion of the display panel 1 on the support portion 4, and the electronic component P is positioned directly below the thermocompression bonding tool 10. The thermocompression bonding tool 10 is heated to a high temperature (generally about 400 ° C.) by a heater 11.
[0007]
Therefore, the rod 7 of the cylinder 6 is protruded downward to lower the thermocompression bonding tool 10, the electronic component P is pressed against the display panel 1 and bonded by thermocompression bonding, and then the rod 7 is pulled upward and the thermocompression bonding tool 10 is To rise. A large number of electrodes, to which terminals formed on the lower surface of the electronic component P are connected, are arranged in parallel at a narrow pitch on the upper surface of the edge portions of the plurality of sides of the display panel 1 (generally, the edge portions of two orthogonal sides). A plurality of electronic components are bonded in parallel on these electrodes. If a horizontally long thermocompression bonding tool 10 as shown in FIG. 5 is used, a plurality of electronic components P can be bonded to the edge of the display panel 1 at the same time, so that the work efficiency is improved.
[0008]
[Problems to be solved by the invention]
As described above, this type of electronic component thermocompression bonding apparatus lowers and raises the horizontally long thermocompression bonding tool 10 heated to a high temperature along the guide rail 13 to bond the electronic component P to a substrate such as the display panel 1. It is supposed to be.
[0009]
However, since the thermocompression bonding tool 10 is heated to a high temperature by a heating means such as the heater 11, the thermocompression bonding tool 10 and the holding member 9 to be transferred from the thermal expansion tool 10 are thermally expanded in the lateral direction. In FIG. 5, the arrow a indicates that the thermocompression bonding tool 10 and the holding member 9 are thermally expanded in the lateral direction.
[0010]
When the holding member 9 is thermally expanded in the lateral direction (arrow a direction) as described above, the slider 12 attached to the rear surface of the holding member 9 is also displaced in the same direction, and the interval T1 between the left and right sliders 12 is slightly increased by the thermal expansion. . On the other hand, the interval T2 between the guide rails 13 does not change.
[0011]
Although the amount of lateral displacement of the slider 12 due to the thermal expansion (the amount of spread of the interval T1 between the left and right sliders 12) is slight, the slider 12 is firmly fitted to the guide rail 13 without rattling, thereby improving the mechanical accuracy. Therefore, when the slider 12 is displaced in the lateral direction due to the thermal expansion of the holding member 9 as described above, the sliding frictional force between the slider 12 and the guide rail 13 increases and the slider 12 moves along the guide rail 13. It is difficult to move up and down smoothly.
[0012]
Therefore, conventionally, in order to overcome the sliding contact frictional force, the downward projecting force of the rod 7 of the cylinder 6 is increased, and the thermocompression bonding tool 10 is forcibly lowered and raised with a large force.
[0013]
However, when the downward projecting force of the rod 7 is increased in this way, the load applied to the electronic component P by the thermocompression bonding tool 10 becomes excessive, causing damage to the electronic component P or destroying the electronic component P in the worst case. There was a problem that could be.
[0014]
Therefore, the present invention solves the above-mentioned conventional problems, and even if the thermocompression bonding tool and its holding member are thermally expanded, the thermocompression bonding tool is lowered and raised with a small force, and the electronic component is thermocompression bonded to the substrate with a low load. An object of the present invention is to provide a thermocompression bonding apparatus for electronic components.
[0015]
[Means for Solving the Problems]
An electronic component thermocompression bonding apparatus according to the present invention includes a horizontally long thermocompression bonding tool, a holding member to which the thermocompression bonding tool is attached, a vertical movement means for moving the holding member up and down, and the holding member. and a plurality of guide means for guiding the vertical movement of the member, the plurality of guide means, Ri from the slider to slide vertically along the guide rail and vertical guide rails formed in the lateral direction of the holding member lateral and fixed guide means not allowing displacement, vertical guide rails and horizontal formation Ri said holding member from a horizontal guide rail for guiding the sliding of the slider and the slider to slide vertically along the guide rail And movable guide means for allowing displacement to the position.
[0016]
According to the electronic component thermocompression bonding apparatus of the present invention, the lateral displacement of the slider accompanying thermal expansion of the thermocompression bonding tool or the holding member is absorbed by the slider sliding sideways along the horizontal guide rail. Since it is allowed, a large sliding contact friction force as described above does not occur between the vertical guide rail and the conventional guide rail. Therefore, the thermocompression bonding tool can be smoothly lowered and raised with a small force of the vertical movement means, and the electronic component can be thermocompression bonded to the substrate with a low load.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
1 is a front view of an electronic component thermocompression bonding apparatus according to Embodiment 1 of the present invention, FIG. 2 is a side view of the fixing guide means side according to Embodiment 1 of the present invention, and FIG. 3 is Embodiment 1 of the present invention. It is a side view by the side of the movable guide means in. In each figure, the same elements as those in the conventional means are denoted by the same reference numerals.
[0018]
1 and 2, the display panel 1 is supported by a movable table 2, and a plurality of electronic components P are provided in parallel at the edges of the plurality of sides in the previous process. The edge of the display panel 1 is supported from below by a support 4 provided on the base 3.
[0019]
On the upper part of the main body frame 5, a cylinder 6 as a vertical movement means is disposed with its rod 7 facing downward. A head portion 8 is attached to the lower end portion of the rod 7. The head portion 8 includes a plate-like holding member 9 attached to the lower end portion of the rod 7 and a horizontally long thermocompression bonding tool 10 attached to the lower portion of the holding member 9. The thermocompression bonding tool 10 has a built-in heater 11 as a heating means for heating it.
[0020]
FIG. 2 is a side view of the fixed guide means side and has the same structure as the conventional example shown in FIG. That is, a slider 12 is provided on the back surface of the holding member 9, and the slider 12 is fitted to a vertical guide rail 13 provided on the front surface of the main body frame 5 so as to be slidable in the vertical direction. As shown in FIG. 1, since the thermocompression bonding tool 10 is long and long, the slider 12 and the guide rail 13 are provided in a plurality of positions in the horizontal direction (two positions on the left and right in this example). In the present invention, the lateral direction is the left-right direction (the direction in which the guide rails 13 are arranged side by side) in FIG. T1 and T2 are intervals between the left and right sliders 12 and between the guide rails 13 at room temperature.
[0021]
FIG. 3 is a side view of the movable guide means side, and a horizontal guide rail 20 is provided on the back surface of the holding member 9 (see also FIG. 1). One surface of the slider 12 ′ is slidably fitted to the vertical guide rail 13, and the other surface is slidably fitted to the horizontal guide rail 20 in the horizontal direction (lateral direction).
[0022]
This thermocompression bonding apparatus for electronic parts has the above-described configuration, and its operation will be described next. As shown in FIG. 2, the movable table 2 is driven to support the edge portion of the display panel 1 on the support portion 4, and the electronic component P is positioned directly below the thermocompression bonding tool 10. The thermocompression bonding tool 10 is heated to a high temperature (generally about 400 ° C.) by a heater 11.
[0023]
Therefore, the rod 7 of the cylinder 6 is protruded downward to lower the thermocompression bonding tool 10, the electronic component P is pressed against the display panel 1 and bonded by thermocompression bonding, and then the rod 7 is pulled upward and the thermocompression bonding tool 10 is To rise. A large number of electrodes, to which terminals formed on the lower surface of the electronic component P are connected, are arranged in parallel at a narrow pitch on the upper surface of the edge portions of the plurality of sides of the display panel 1 (generally, the edge portions of two orthogonal sides). In addition, a plurality of electronic components P are juxtaposed and bonded on these electrodes. If a horizontally long thermocompression bonding tool 10 as shown in FIG. 1 is used, a plurality of electronic components P can be bonded to the edge of the display panel 1 at the same time.
[0024]
Now, since the thermocompression bonding tool 10 is heated to a high temperature by heating means such as the heater 11, the thermocompression bonding tool 10 and the holding member 9 to be transferred from this are thermally expanded in the lateral direction as described above. In FIG. 1, when such thermal expansion occurs, the slider 12 on the fixed guide means side is not displaced in the lateral direction and maintains the position at room temperature, but the slider 12 ′ on the movable guide means side is a horizontal guide. It slides to the side along the rail 20 (arrow b) and is displaced, thereby absorbing this thermal expansion. Thus, when the slider 12 ′ on the movable guide means side is displaced in the direction of the arrow b (that is, when the interval T1 is expanded by the thermal expansion), the horizontal direction of the holding member 9 and the thermocompression bonding tool 10 (direction of arrow a) ) (Thermal expansion) is allowed. Therefore, no large sliding frictional force is generated between the left and right sliders 12 and 12 'and the guide rail 13, so that the thermocompression bonding tool can be obtained by lowering and raising the rod 7 of the cylinder 6 with a small force. 10 can be smoothly lowered and raised, so that the electronic component P can be bonded by thermocompression bonding to the display panel 1 without damaging the electronic component P with a low load.
[0025]
(Embodiment 2)
FIG. 4 is a front view of a thermocompression bonding apparatus for electronic components according to Embodiment 2 of the present invention. In the second embodiment, three guide rails 13 are arranged in parallel, the central guide rail 13 and slider 12 are fixed guide means, and the left and right guide rails 13 and slider 12 'are movable guide means. The distances L1 and L2 from the center C of the cylinder 6 to each guide means are equal.
[0026]
Accordingly, when the thermocompression bonding tool 10 and the holding member 9 (see FIGS. 2 and 3) are thermally expanded in the lateral direction a, the central slider 12 is not displaced, but the left and right sliders 12 ′ are displaced laterally (arrow b). ), Effects similar to those of the first embodiment are obtained.
[0027]
【The invention's effect】
As described above, according to the thermocompression bonding apparatus for electronic components of the present invention, the thermal expansion of the thermocompression bonding tool or the holding member in the lateral direction is caused by the slider on the movable guide means side in the lateral direction along the horizontal guide rail. Since it is allowed and absorbed by sliding, a large sliding contact friction force as described above is not generated between the guide rail and the vertical guide rail. Therefore, the thermocompression bonding tool can be smoothly lowered and raised with a small force of the vertical movement means, and the electronic component can be thermocompression bonded to the substrate with a low load.
[Brief description of the drawings]
FIG. 1 is a front view of a thermocompression bonding apparatus for an electronic component according to a first embodiment of the present invention. FIG. 2 is a side view of a fixing guide means side according to the first embodiment of the present invention. FIG. 4 is a front view of a thermocompression bonding apparatus for electronic components according to a second embodiment of the present invention. FIG. 5 is a front view of a conventional thermocompression bonding apparatus for electronic components. Sectional view of thermocompression bonding equipment for electronic parts
DESCRIPTION OF SYMBOLS 1 Display panel 6 Cylinder 9 Holding member 10 Thermocompression-bonding tool 12, 12 'Slider 13 Guide rail

Claims (1)

A horizontally long thermocompression bonding tool, a holding member to which the thermocompression bonding tool is attached, a vertical movement means for moving the holding member up and down, and a plurality of guide means provided on the holding member for guiding the vertical movement of the holding member. with the door, the plurality of guide means, the fixed guide means does not permit displacement in the lateral direction perpendicular to the guide rails and formed Ri said holding member from the slider to slide vertically along the guide rails, vertical and a guide rail and a slider that slides vertically along the guide rail and movable guide means for allowing displacement in the transverse direction of formation Ri said holding member from a horizontal guide rail for guiding the horizontal sliding of the slider An electronic component thermocompression bonding apparatus characterized by comprising:

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