JP3789766B2 - IC memory card and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC memory card formed by joining a main body resin frame and a panel member, and a manufacturing method thereof.
[0002]
[Prior art]
In recent years, the density of IC memory cards has been increasing, and the card substrate size has been increased in order to increase the area where components can be mounted. For this reason, an IC memory card manufactured using an ultrasonic welding method capable of increasing the substrate size has been used.
[0003]
For example, in the conventional IC memory card as shown in FIG. 16, an integrally molded product of the front metal panel 100 and the front resin frame 101 (hereinafter referred to as the front frame 104), and the back metal panel 103 and the back resin frame 102. And an integrally molded product (hereinafter referred to as a back frame 105). Then, a substrate (not shown) on which an IC such as a memory or LSI is mounted is inserted between the front frame 104 and the back frame 105, and the resin portion is melted by irradiating ultrasonic waves. 105 is welded to manufacture an IC memory card.
[0004]
Furthermore, recently, an IC memory card of a type in which a back metal panel 110 and a main body resin frame 111 as shown in FIG. 17 are integrally molded and a front metal panel 112 is bonded to it by welding is also manufactured.
[0005]
In addition, there is an IC memory card of a type in which a front metal panel 130 and a back metal panel 132 are welded to both sides of a main body resin frame 131 as shown in FIG.
[0006]
Japanese Patent Laid-Open No. 9-58164 discloses an IC memory card having an assembly structure shown in FIG. 17 among the conventional IC memory cards and a method for manufacturing the same.
[0007]
In the IC memory card of the above publication, as shown in FIG. 19, the end portion of the metal panel 140 is bent, and a hole 142 for allowing resin to flow into the bent portion 141 is formed. The bent portion 141 is fitted into the groove portion 144 of the main body resin frame 143, and the metal panel 140 and the main body resin frame 143 are joined by ultrasonic welding. In this connection, the resin of the main body resin frame 143 is melted by ultrasonic vibration, and the resin flows into the holes 142 and then hardens, whereby the metal panel 140 and the main body resin frame 143 are combined.
[0008]
With such a configuration, the bonding strength can be improved as compared with an IC memory card in which no hole is provided in the bent portion, and an IC memory card excellent in impact resistance can be obtained by a simple method.
[0009]
As shown in FIG. 20, an IC memory card is also manufactured in which a ground clip 153 formed to increase the ground area is provided on at least one of the front and back metal panels 150 and 152.
[0010]
[Problems to be solved by the invention]
However, the conventional IC memory card disclosed in the above publication has the following problems.
[0011]
That is, when the main body resin frame 143 and the metal panel 140 are welded and bonded, most of the bonding force depends on the hole 142 portion provided in the bent portion 141 of the metal panel 140, and the resin flowing into the hole 142. Therefore, the coupling strength for each bent portion 141, that is, the impact resistance performance for each IC memory card, tends to vary. There is also a problem that when the resin is melted by irradiating ultrasonic waves to the groove portion 144 in which the bent portion 141 of the metal panel 140 in the main body resin frame 143 is inserted, the melted resin hardly flows into the hole 142. This is considered due to the fact that the molten resin tends to flow in the direction perpendicular to the opening direction of the holes 142.
[0012]
For example, even when the bent portions 141 are formed on all four sides of the metal panel 140 and the holes 142 are formed in the bent portions 141, the bonding strength is improved, but the bonding strength varies between the bent portions 141 and the holes 142. The problem that molten resin is difficult to flow into cannot be solved.
[0013]
Further, in the IC memory card having the structure as shown in FIG. 16, the shape is usually specified, and the shape of the front frame 104 and the back frame 105 is different, so two integral molds are required. An example of the IC memory card as described above is a PCMCIA (JEIDA) standard compliant card or the like.
[0014]
Furthermore, in the IC memory card provided with the ground clip 153 as shown in FIG. 20, the ground clip 153 is formed only on the back metal panel 152, but not on the front metal panel 150. Therefore, two molds for manufacturing the front and back metal panels 150 and 152 are required. As a result, the mold cost is reflected in the manufacturing cost, and there is a problem that the manufactured IC memory card is very disadvantageous in terms of cost.
[0015]
The present invention has been made in view of the above problems, and its purpose is to eliminate variations in the bonding strength between the metal panel and the main body resin frame, to have a more stable and strong bonding force, and to reduce the manufacturing cost. It is an object of the present invention to provide an IC memory card and a method for manufacturing the same.
[0016]
[Means for Solving the Problems]
In order to solve the above problems, an IC memory card according to the present invention is an IC memory card that includes a substrate provided with a memory and is formed by covering a main body resin frame with a panel member. On the side facing the panel member, a groove portion for fitting the panel member is formed, and the panel member is provided with a protrusion portion to be inserted into the groove portion. The tip part is characterized by having a shape wider than the root part.
[0017]
According to the above configuration, it is possible to obtain an IC memory card excellent in impact resistance by suppressing variation in bonding strength and improving the bonding strength between the main body resin frame and the panel member.
[0018]
That is, the panel member is formed with a protrusion for coupling with the main body resin frame, and the main body resin frame and the panel are inserted by inserting the protrusion into the groove of the main body resin frame and melting the resin. The member can be welded and bonded. At this time, the molten resin flows into the periphery of the protrusion and then hardens, whereby an IC memory card with a stronger bond can be obtained.
[0019]
In the conventional IC memory card, a through hole is provided in a portion where the end portion of the panel member is bent, and the bonding strength is improved by flowing molten resin into the through hole. However, in practice, since the opening direction of the through hole is perpendicular to the resin flow, it is difficult for molten resin to flow in and it is difficult to obtain a stable bond strength.
[0020]
On the other hand, in the IC memory card of the present invention, a projection is provided on the panel member. Therefore, the place where the melted resin should flow in order to improve the bonding force is the space around the protrusion, which is formed when the main body resin frame and the panel member are combined. Therefore, compared with the through-hole provided in the conventional IC memory card, the molten resin tends to flow.
[0021]
Thereby, in the IC memory card of the present invention, the main body resin frame and the panel member have a structure having a stronger bond without variation, and thus an IC memory card excellent in impact resistance can be obtained.
[0022]
Moreover, it is more preferable that the protruding portion has a constricted shape from the tip portion to the root portion. Thereby, since the flow of the melted resin becomes smooth around the protrusions and easily flows into the periphery of the protrusions, the bonding force between the main body resin frame and the panel member can be further improved.
[0023]
Moreover, it is more preferable that the height of the protrusion is at least half of the thickness of the main body resin frame. As a result, since the protrusion can be inserted to the depth of the groove provided in the main body resin frame, the protrusion is easily covered with the resin even when the amount of the molten resin is small. Bonds can be made stronger.
[0024]
Moreover, it is more preferable that the protrusion is provided with a plurality of portions having a width wider than the base of the protrusion. Thereby, since the part holding a coupling | bonding becomes multiple places, a main body resin frame and a panel member can be combined more firmly.
[0025]
Further, it is more preferable that a through hole is provided in the protrusion. As a result, a part of the molten resin flows into the through hole, so that the bonding force between the main body resin frame and the panel member can be further improved.
[0026]
Moreover, it is more preferable that the protrusion has a shape having a protrusion only on the main body side of the panel member. Thus, even when a ground clip for expanding the area of the ground in the IC memory card is provided at the end of the panel member, both can be provided without contacting the ground clip and the protrusion. Therefore, the area of the ground of the IC memory card can be increased, and a strongly coupled IC memory card can be obtained.
[0027]
Further, it is more preferable that a plurality of the protrusions are provided on the end face of the panel member and are provided so as to be symmetric at the center of the end face. Thereby, a uniform coupling force can be applied to the end surface of the panel member, and variations in the coupling force between the end surfaces can be eliminated.
[0028]
The width of the groove provided in the main body resin frame is more preferably 1.0 to 2.0 times the thickness of the panel member. As a result, the displacement of the position when the panel member is welded can be suppressed to at most the displacement equivalent to the thickness of the panel member, so that the main body resin frame and the panel member can be accurately combined. it can.
[0029]
The panel member is coupled to both surfaces of the main body resin frame, and the protrusions provided on the panel member are fitted into the main body resin frame with panel members respectively coupled to the front and back sides of the main body resin frame. In this case, it is more preferable that the protrusions are provided at positions where the protrusions do not contact each other. As a result, protrusions that are more than half the thickness of the main body resin frame are formed, and even if the IC memory card is formed by combining the panel members from both front and back surfaces, the protrusions on the front and back panel members Can be prevented from contacting.
[0030]
The panel member preferably has the same shape on both the front and back surfaces of the main body resin frame. As a result, when the panel member is made of metal, thermosetting resin, etc., it is not necessary to provide a mold for molding the panel member on the front and back sides, thereby reducing the mold cost and suppressing the manufacturing cost of the IC memory card. Can do.
[0031]
The IC memory card manufacturing method of the present invention is the above-described IC memory card manufacturing method, wherein the groove portion of the main body resin frame and the protrusion provided on the end surface of the panel member are joined by ultrasonic welding. More preferred.
[0032]
Thereby, the main body resin frame and the panel member can be combined in a simple manner by irradiating the periphery of the position where the groove portion of the main body resin frame and the projection of the panel member are in contact with each other to melt the resin. Can do.
[0033]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1
An embodiment relating to the IC memory card of the present invention will be described below with reference to FIGS.
[0034]
As shown in FIG. 1, the IC memory card of this embodiment includes a front metal panel (panel member) 10, a back metal panel (panel member) 11, and a main body resin frame 12.
[0035]
For convenience of explanation, FIG. 1 shows an IC memory card in which the back metal panel 11 is already attached to the main body resin frame 12, but a method for attaching the back metal panel 11 to the main body resin frame 12 is as follows. It is the same as the attachment method of the surface metal panel 10 demonstrated by FIG.
[0036]
The front metal panel 10 has the same shape as the back metal panel 11, and ends of the four sides are bent to form a bent portion 15. Further, a protrusion 16 is provided at the tip of the bent portion 15. Thus, by making the front and back metal panels 10 and 11 into the same shape, a mold for molding the front and back metal panels 10 and 11 can be shared, and the manufacturing cost can be reduced.
[0037]
As shown in FIG. 2, the protruding portion 16 is formed such that the width of the tip portion (tip portion) 21 is larger than the width of the root portion (root portion) 22 connected to the bent portion 15.
[0038]
In addition, this front and back metal panel 10 * 11 consists of stainless steel (SUS304-CSP), for example, and thickness is 0.1 mm-0.2 mm.
[0039]
The main body resin frame 12 is a frame-shaped member having a hollow inside, and a groove portion 17 for inserting the protruding portion 16 of the bent portion 15 is formed. Although not shown, a printed circuit board on which a connector, a memory IC, an LSI, and the like are mounted is fixed to the main body resin frame 12, and the IC memory card 20 is manufactured by being coupled to the front and back metal panels 10 and 11. .
[0040]
When the IC memory card 20 is assembled, the bent portions 15 formed on the end surfaces of the four sides of the front metal panel 10 are inserted into the grooves 17 of the main body resin frame 12 to which the back metal panel 11 is already attached. Next, in a state where the front and back metal panels 10 and 11 are pressed in the closing direction, ultrasonic waves are applied to the contact portion between the groove portion 17 and the projection portion 16 of the main body resin frame 12 to melt the resin in the groove portion 17 portion. The And when this molten resin hardens | cures, the main body resin frame 12 and the surface metal panel 10 are couple | bonded. In addition, the resin melted at this time flows into the periphery of the protrusion 16 formed on the tip of the bent portion 15 of the front metal panel 10 and then hardens, so that the front metal panel 10 and the main body resin frame 12 are Compared with the case where the protrusions 16 are not provided, they are more firmly coupled. Thus, by using the ultrasonic method, the front and back metal panels 10 and 11 and the main body resin frame 12 can be combined by a simple method.
[0041]
The IC memory card 20 according to the present embodiment is particularly characterized by the shape of the protrusion 16 formed on the bent portion 15 of the front metal panel 10.
[0042]
That is, the protrusion 16 is formed such that the tip 21 is wider than the root 22 as shown in FIG.
[0043]
Further, by forming a constricted shape from the root portion 22 to the tip end portion 21 of the protrusion 16, that is, a curved shape, the molten resin can easily flow.
[0044]
The molten resin of the main body resin frame 12 melted by being irradiated with ultrasonic waves flows so as to fill a space around the protrusion 16 formed when the front metal panel 10 is inserted into the groove portion 17 of the main body resin frame 12. Therefore, the molten resin can easily flow around the root portion 22 of the protrusion 16 that holds the bond after the molten resin is cured, and the bonding force between the protrusion 16 and the main body resin frame 12 is stronger and does not vary. it can. Thereby, an IC memory card with improved impact resistance can be provided.
[0045]
Here, the conventional IC memory card in which only the through hole is provided in the bent portion 15 is compared with the IC memory card of the present embodiment.
[0046]
In the conventional IC memory card, the opening direction of the through hole is perpendicular to the flowing direction of the molten resin, and it is difficult for the molten resin to flow into the through hole, and it is difficult to obtain a stable coupling amount.
[0047]
On the other hand, in the protrusion 16 of the IC memory card 20 of the present embodiment, the uneven portion of the protrusion 16 into which the molten resin should flow is a space. 12 and the surface metal panel 10 can be made stronger.
[0048]
In addition, the shape of the projection part 16 provided in the end surface of the front and back metal panels 10 and 11 of the IC memory card described in this embodiment is not limited to the shape shown in FIG. For example, as shown in FIG. 3, the same effect as described above can be obtained even if the protruding portion 16a having two or more wide portions similar to the tip portion 21 shown in FIG. 2 is formed. it can.
[0049]
Furthermore, by providing the projections 16 and 16a shown in FIGS. 2 and 3 with the through holes 30 as shown in FIGS. 4 and 5 to form the projections 16b and 16c, a part of the molten resin can be obtained. A stronger bonding force can be obtained as compared with the case where the through hole 30 is not provided by flowing into the through hole 30.
[0050]
Further, the length from the bent portion of the bent portion 15 to the tip of the protruding portion 16 is such that the tip portion 21 of the protruding portion 16 is inserted into the groove portion 17 of the main body resin frame 12 as deeply as possible. More preferably, it is half or more of the length.
[0051]
As a result, even when the amount of molten resin is small, the protrusion 16 is inserted to a deep position of the groove 17, so that the resin can easily flow into the root portion 22 of the protrusion 16, and a firmly coupled IC memory card can be obtained. Obtainable.
[0052]
The height of the protrusion 16 is more preferably equal to or less than the thickness of the main body resin frame 12 so that the tip of the protrusion 16 does not penetrate the main body resin frame 12.
[0053]
Moreover, the shape of the protrusion 16 may be a shape as shown in (a) to (ku) shown in FIG.
[0054]
For example, the protrusions as shown in FIGS. 6A, 6A, and 6C may be protrusions provided only on one side, or the protrusions as shown in FIG. It may be a hexagonal shape. Furthermore, the tip of the protrusion may have a trapezoidal shape as shown in (e) and (e) of FIG. 6 (a), or a triangle as shown in (f), A square may be used as shown in (g).
[0055]
Moreover, even if it is a shape like (K)-(T) shown in FIG.6 (b) which provided the through-hole 30 in the projection part of Fig.6 (a), the same effect as said projection part is acquired. It is possible.
[0056]
Here, the position where the projection part 16 is provided in the front and back metal panels 10 and 11 will be described. For convenience of explanation, the shape of the protrusion described below is one type of the protrusion 16 shown in FIG. 2, but is not limited thereto. Even if any of the protrusions having the shapes described above is applied, the same effects as those described below can be obtained.
[0057]
As shown in FIG. 7, it is more preferable to provide the protrusions 16 symmetrically at the center of one side of the front metal panel 10. Thereby, a uniform bonding force can be given to each end surface of the front metal panel 10.
[0058]
Further, as described above, when the bent portion 15 is formed so that the length from the bent portion of the bent portion 15 to the tip of the protruding portion 16 is inserted deeper than half the thickness of the main body resin frame 12, It is conceivable that the protrusions 16 provided on the front and back metal panels 10 and 11 come into contact with each other during welding. For this reason, as shown in FIGS. 8 and 9, the protrusions 16e provided at the end portions of the front and back metal panels 10 and 11 are not more than half the thickness of the main body resin frame 12, and are provided at other positions. It is more preferable that the protrusions 16d on opposite sides of the front and back metal panels 10 and 11 are shifted in position so that the protrusions 16d are not in contact with each other.
[0059]
By changing the position of the protrusion 16 on the opposite side to a position different between the front and back metal panels 10 and 11, when the front and back metal panels 10 and 11 are aligned with the main body resin frame 12, the protrusion 16 is deeper. The front and back metal panels 10 and 11 can be firmly bonded in the inserted form, and the front and back metal panels 10 and 11 can be molded with the same mold.
[0060]
Furthermore, as shown in FIG. 10, the relationship between the width T of the groove 17 and the thickness of the protrusion 16, that is, the thickness t of the front metal panel 10 is as follows. It is preferably 0.0 times to 2.0 times.
[0061]
Thereby, the position shift of the surface metal panel 10 when the surface metal panel 10 is fitted into the main body resin frame 12 can be made equal to or less than the thickness of the surface metal panel 10, and workability can be improved.
[0062]
Generally, since the thickness of the surface metal panel 10 of this embodiment is 0.1 mm to 0.15 mm, if the width of the groove portion 17 is limited to the above range, the displacement of the surface metal panel 10 is at most. It can be suppressed to 0.15 mm.
[0063]
In the present embodiment, as shown in FIG. 1, the example in which the bent portion 15 is provided and the protruding portion 16 is provided at the tip thereof has been described, but the present invention is not limited to this. For example, an effect similar to that obtained by the present embodiment can be obtained even with an IC memory card in which the bent portion 15 is not provided and only the protruding portion 16 is provided.
[0064]
[Embodiment 2]
Another embodiment relating to the IC memory card of the present invention will be described below with reference to FIGS.
[0065]
For convenience of explanation, members having the same functions as those in the drawings described in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
[0066]
As shown in FIG. 11, the IC memory card 40 of the present embodiment is different from the IC memory card 20 of the first embodiment in that ground clips 33 are provided on one side of the front and back metal panels 31 and 32, respectively. Yes. Further, when the front and back metal panels 31 and 32 are fitted into the main body resin frame 12, the ground clip 33 is formed so that the ground clip 33 does not come on the same side.
[0067]
The ground clip 33 is a member provided when it is desired to increase the area of the ground. Providing the ground clip 33 is effective when the ground is taken from the side of the device having the IC memory card because the ground can be taken from the side of the IC memory card.
[0068]
The ground clip 33 is a member that is formed at the same time as the molding. However, if the projection 16 having the shape shown in the first embodiment is provided on the metal panel provided with the ground clip 33, the ground clip 33 becomes an obstacle. Cannot be formed.
[0069]
Therefore, in the IC memory card 50 of the present embodiment, as shown in FIG. 12, the protrusions 51 provided on the front and back metal panels 31 and 32 extend from the tip 21 of the protrusion 16 shown in FIG. A convex portion in the outer direction as viewed from the center of 50 is removed.
[0070]
As shown in FIG. 13, the protrusion 51 has a width that increases from the root 52 to the tip 53 in the direction of the main body side of the front metal panel 31 when viewed from the center line of the protrusion 51. On the other hand, when viewed from the center line of the protrusion 51, there is no change in the width from the root 52 toward the tip 53 in the outer direction of the surface metal panel 31, and the tip of the protrusion 51 from the end surface of the surface metal panel 31 The convex portion of the portion 53 is shaped so as not to protrude.
[0071]
As described above, by forming the protrusion 51 as shown in FIG. 13, even if the IC memory card 50 is provided with the ground clip 33, the ground clip 33 and the protrusion 51 do not contact each other. Therefore, the ground clip 33 and the protrusion 51 can be provided together, and both expansion of the ground area and strong coupling can be realized.
[0072]
In addition, in this embodiment, although the example using a metal panel as a panel member was given and demonstrated, it is not limited to this. For example, if it is a non-melting material that is not melted by heat, such as thermosetting resin, paper, wood, stone, etc., the same effect as described above can be obtained.
[0073]
Moreover, in this embodiment, although the main body resin frame 12 is shape | molded by LCP (liquid crystal polymer) mixed with GF (glass fiber), it is not limited to this. For example, other thermoplastic resins may be used, and any thermoplastic material that can be melted by irradiation with ultrasonic waves or the like other than the resin may be used.
[0074]
Moreover, although this embodiment demonstrated the example which fuse | melts the groove part 17 of the main body resin frame 12 with an ultrasonic wave, and couple | bonds the main body resin frame 12 and a panel member, it is not limited to this. In addition to ultrasonic waves, the same effects as in the present embodiment can be obtained as long as the means can vibrate and melt a predetermined member (vibration applying means).
[0075]
The IC memory card 50 described in the present embodiment has been described with respect to the example in which the ground clip 33 is provided on each of the front and back metal panels 31 and 32. However, the present invention is not limited to this. For example, as illustrated in FIG. 14, one ground clip 33 may be provided on each side of the front and back metal panels 61 and 62. Thus, by using the IC memory card 60 having two or more ground clips 33 on the front and back metal panels 61 and 62, as shown in FIG. Expansion and strong bonding can be performed.
[0076]
Note that the IC memory card of the present invention is provided with a bent portion on the end face of the metal panel in the IC memory card having a metal panel that is embedded and bonded to the resin frame of the main body by ultrasonic welding. An IC memory card in which the protruding portion has a narrower width portion than the tip portion may be used.
[0077]
The IC memory card of the present invention may be an IC memory card having a curved tip at the protruding portion, or an IC memory card provided with a plurality of the narrow width portions. Also good.
[0078]
Furthermore, the IC memory card of the present invention is provided on the same end surface at a half or more of the width of the protrusion from the symmetrical position of the front and back metal panels when the metal panel is coupled to the front and back surfaces of the main body resin frame. The IC memory card may be formed by shifting the protrusions provided on the front and back metal panels within a range equal to or less than the distance between adjacent protrusions.
[0079]
Furthermore, the IC memory card of the present invention may be an IC memory card in which ground clips are provided on the front and back metal panels, and one ground clip is provided at each end of each metal panel. In the case where a metal panel is fitted into the main body resin frame, the IC memory card may be provided with ground clips provided on opposite sides of the IC memory card.
[0080]
In the lid sealing method of the present invention, as described above, the lid member (panel member) is provided with a protruding portion whose tip portion is wider than the root portion, and this protruding portion is formed on the main body frame. This is a method of inserting the groove portion and melting the groove portion to join the two, but this method is not limited to the IC memory card. For example, even when applied to a liquid crystal display panel, a display device such as a CRT, an information communication device such as a mobile phone, or a terminal such as a personal computer, the bonding strength between the main body and the lid member can be improved.
[0081]
In addition to the above, if the lid attached to the main body is applied to a housing that will not be removed later, the lid can be sealed with a high coupling force.
[0082]
The lid sealing method of the present invention is a lid sealing method formed by covering a main body frame with a lid member, and the main body frame is formed with a groove for fitting the lid member, The lid member is characterized in that the tip portion is wider than the root portion, and a protrusion is provided to be inserted into the groove.
[0083]
【The invention's effect】
As described above, the IC memory card of the present invention has a groove portion for fitting the panel member on the side facing the panel member in the main body resin frame. The protrusion part inserted in a groove part is provided, The said protrusion part is the structure of the shape where the front-end | tip part is wider than a root part.
[0084]
Therefore, it is possible to obtain an IC memory card excellent in impact resistance by suppressing the variation in the bonding strength and improving the bonding strength between the main body resin frame and the panel member.
[0085]
In the IC memory card of the present invention, the projection is provided on the panel member. Therefore, the place where the melted resin should flow in order to improve the bonding force is the space around the protrusion, which is formed when the main body resin frame and the panel member are combined. Therefore, compared with the through-hole provided in the conventional IC memory card, the molten resin tends to flow.
[0086]
As a result, in the IC memory card of the present invention, the main body resin frame and the panel member are manufactured so as to have a stronger bond without variation, thereby obtaining an IC memory card having excellent impact resistance. it can.
[0087]
In addition, it is more preferable that the protruding portion has a constricted shape from the tip portion to the root portion, and the flow of the molten resin becomes smooth around the protruding portion and easily flows into the protruding portion. There is an effect that the coupling force between the frame and the panel member can be improved more reliably.
[0088]
Further, the height of the protrusion is more preferably half or more of the thickness of the main body resin frame, and since the protrusion can be inserted deep into the main body resin frame, the amount of molten resin is small. Also, the projection is easily covered with the resin, and there is an effect that the connection between the main body resin frame and the panel member can be further strengthened.
[0089]
In addition, it is more preferable that the protruding portion is provided with a plurality of portions having a width wider than the base of the protruding portion, and since there are a plurality of portions that maintain the bonding strength, the main body resin frame and the panel member The effect that can be made into a stronger bond.
[0090]
Further, it is more preferable that a through hole is provided in the protrusion, and a part of the molten resin flows into the through hole, so that the connection between the main body resin frame and the panel member can be further improved. There is an effect.
[0091]
Moreover, it is more preferable that the protrusion has a shape having a protrusion only on the main body side of the panel member. Therefore, even when a ground clip for enlarging the area of the ground in the IC memory card is provided at the end of the panel member, both the ground clip and the projection can be made to coexist without contacting each other. Play. Therefore, the area of the ground is enlarged, and an IC memory card that is firmly coupled can be obtained.
[0092]
Further, it is more preferable that a plurality of the protrusions are provided on the end face of the panel member and are provided so as to be symmetric at the center of the end face. Therefore, a uniform coupling force can be applied to the end portion of the panel member, and the effect of eliminating the variation in the coupling force for each end surface can be achieved.
[0093]
The width of the groove provided in the main body resin frame is more preferably 1.0 to 2.0 times the thickness of the panel member. Therefore, since the displacement of the position when the panel member is welded can be suppressed to a displacement corresponding to the thickness of the panel member at the maximum, the main body resin frame and the panel member can be accurately combined. There is an effect that can be done.
[0094]
The panel member is coupled to both surfaces of the main body resin frame, and the protrusions provided on the panel member are fitted into the main body resin frame with panel members respectively coupled to the front and back sides of the main body resin frame. In this case, it is more preferable that the protrusions are provided at positions where the protrusions do not contact each other. Therefore, even if the IC memory card is formed by combining the panel members from both the front and back surfaces, the protrusions of the front and back panel members are formed between the front and back surfaces. There is an effect that it is possible to prevent the contact.
[0095]
The panel member preferably has the same shape on both the front and back surfaces of the main body resin frame. Therefore, it is not necessary to provide the molds for molding the front and back panel members, so that it is possible to reduce the cost of the mold and suppress the manufacturing cost of the IC memory card.
[0096]
The IC memory card manufacturing method of the present invention is the above-described IC memory card manufacturing method, wherein the groove portion of the main body resin frame and the protrusion provided on the end surface of the panel member are joined by ultrasonic welding. More preferred. Therefore, the main body resin frame and the panel member can be coupled by a simple method by irradiating ultrasonic waves around the position where the groove portion of the main body resin frame and the projection of the panel member contact to melt the resin. There is an effect that can be.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an embodiment of an IC memory card according to the present invention.
2 is an enlarged front view showing protrusions provided on front and back metal panels of the IC memory card of FIG. 1. FIG.
FIG. 3 is a front view showing another example of a protrusion provided on the IC memory card.
4 is a front view showing an example in which a through hole is provided in the protrusion shown in FIG. 2. FIG.
FIG. 5 is a front view showing an example in which a through hole is provided in the protrusion shown in FIG. 3;
FIGS. 6A and 6B are front views showing the shapes of protrusions applicable in the present invention. FIGS.
FIG. 7 is a cross-sectional view showing an example in which the protrusion is provided on the front and back metal panels.
FIG. 8 is a cross-sectional view showing another example in which the protrusion is provided on the front and back metal panels.
FIG. 9 is a cross-sectional view showing still another example in which the protrusion is provided on the front and back metal panels.
FIG. 10 is a cross-sectional view showing the relationship between the width of the groove provided in the main body resin frame of the IC memory card and the thickness of the front metal panel.
FIG. 11 is an exploded perspective view showing a configuration of an IC memory card provided with a ground clip according to another embodiment of the present invention.
12 is a cross-sectional view showing the positions of protrusions provided on the front and back metal panels of the IC memory card of FIG. 11. FIG.
13 is an enlarged front view showing a protrusion of FIG. 12. FIG.
14 is an exploded perspective view showing another example of the IC memory card of FIG. 11. FIG.
15 is an exploded perspective view showing an example of an IC memory card provided with both the ground clip and the protrusion of FIG.
FIG. 16 is a side view showing a configuration of a conventional IC memory card.
FIG. 17 is a side view showing the configuration of another conventional IC memory card.
FIG. 18 is a side view showing the configuration of still another conventional IC memory card.
19 is an exploded perspective view showing the assembly structure of the IC memory card of FIG.
FIG. 20 is an exploded perspective view showing an assembly structure of a conventional IC memory card.
[Explanation of symbols]
10 Front metal panel (panel member)
11 Back metal panel (panel member)
12 Body resin frame
15 Bending part
16 Protrusion
17 Groove
20 IC memory card
21 Tip (tip)
22 Root part (Root part)
30 Through hole
31 Surface metal panel (panel member)
32 Back metal panel (panel member)
33 Grand Clip
40 IC memory card
50 IC memory card
51 Protrusion
52 Root part (Root part)
53 Tip (tip)
60 IC memory card
61 Surface metal panel (panel member)
62 Back metal panel (panel member)

Claims (10)

In an IC memory card that has a substrate with a memory inside and is formed by covering a main body resin frame with a panel member,
On the side of the main body resin frame facing the panel member, a groove for fitting the panel member is formed,
The panel member is provided with a protrusion inserted into the groove,
The protrusion has a shape whose tip is wider than the root,
The panel member is bonded to both surfaces of the main body resin frame, and the protrusions provided on the panel member are when the panel members respectively bonded to the front and back sides of the main body resin frame are fitted into the main body resin frame. In addition, the IC memory card is provided at a position where the protrusions are not in contact with each other .   2. The IC memory card according to claim 1, wherein the protruding portion has a constricted shape from a tip portion to a root portion.   3. The IC memory card according to claim 1, wherein a height of the protrusion is at least half of a thickness of the main body resin frame.   The IC memory card according to any one of claims 1 to 3, wherein the protrusion is provided with a plurality of portions having a width wider than the base of the protrusion.   The IC memory card according to claim 1, wherein a through hole is provided in the protrusion.   6. The IC memory card according to claim 1, wherein the protrusion has a shape having a protrusion only on the main body side of the panel member.   The said protrusion part is provided with two or more by the end surface of the said panel member, and it is provided so that it may become symmetrical in the center of the end surface, The one of Claims 1-6 characterized by the above-mentioned. IC memory card.   8. The IC memory according to claim 1, wherein a width of the groove provided in the main body resin frame is 1.0 to 2.0 times a thickness of the panel member. 9. card. The IC memory card according to any one of claims 1 to 8, wherein the panel member has the same shape on both the front and back surfaces of the main body resin frame. An IC memory card manufacturing method according to any one of claims 1 to 9,
  A method of manufacturing an IC memory card, wherein the groove portion of the main body resin frame and the protrusion provided on the end surface of the panel member are joined by ultrasonic welding.

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