JP3778850B2 - IC socket - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a socket for an electronic component having a sliding mechanism between an insulating substrate and a sliding substrate of a socket body, and more particularly to an IC socket, and in particular, an IC having a sliding mechanism that ensures centering of the sliding substrate with respect to the insulating substrate. It relates to sockets.
[0002]
[Prior art]
Conventionally, a package for an electronic component as an electrical component, particularly an IC socket to which an IC package or the like is mounted, is provided with a cover member that can move up and down with respect to the socket body, and the slide substrate is fitted to the insulating substrate. IC sockets are known.
[0003]
In such a conventional IC socket, the socket body substrate is composed of an insulating substrate and a slide substrate, and the slide having a substantially square-shaped uneven portion so that the slide substrate can slide relative to the insulating substrate. It is formed by fitting through a mechanism.
[0004]
An example of a slide mechanism in a conventional IC socket is shown in FIG. As shown in the figure, conventionally, for example, a slide mechanism 103 is formed between an insulating substrate 101 and a slide substrate 102 constituting the substrate 100 of the socket body. Such a conventional sliding mechanism 103 is formed of a concave portion 104 and a convex portion 105 that are elongated in the longitudinal direction and have a substantially square shape such as a rectangle or a quadrangle, and can slide in the longitudinal direction. In this way, the convex portion 105 is fitted into the elongated concave portion 104, and the movable-side elastic contact piece of the sandwiched contact is moved with respect to the fixed-side elastic contact piece by the relative sliding of the concave portion 104 and the convex portion 105, so that the contact Is configured to open and close.
[0005]
[Problems to be solved by the invention]
However, in such a conventional IC socket, there is a slight clearance C between the concave portion 104 and the convex portion 105 of the slide mechanism 103 in the right and left direction of the cross section, and this clearance C causes the concave portion 104 by that amount. This causes a center shift S such as the center of the convex portion 105 being shifted, which causes a deviation in the substrate 100.
[0006]
Accordingly, an object of the present invention is to solve such a problem in the prior art by always forcibly correcting the slide part at the time of opening the contact to the center position so that the center shift does not occur and the contact mechanism is preferably opened. An IC socket having the following is provided.
[0007]
[Means for Solving the Problems]
In order to achieve the above-described object, an IC socket according to the present invention includes a socket body that forms a substrate having an insulating substrate and a slide substrate, a plurality of contacts that are mounted on the socket body, and a vertically movable cover. In an IC socket having a member, a concave portion having a substantially semicircular cross-sectional shape in a direction substantially perpendicular to the sliding direction is formed elongated in a sliding direction in a portion of the insulating substrate where the contact is provided, and the insulating substrate A slide mechanism that is elongated in the slide direction so as to be slidably fitted in the recess of the slide, and has a substantially semicircular cross section in a direction substantially perpendicular to the slide direction. the length of the slide direction in the recess of the insulating substrate, especially to be longer than the corresponding length of the projecting portion of the slide board To.
[0008]
The IC socket of the present invention is an IC socket having a socket body that forms a substrate having an insulating substrate and a slide substrate, a plurality of contacts mounted on the socket body, and a cover member that can move up and down. In the insulating substrate, the portion where the contact is provided is elongated in the sliding direction, and the cross-sectional shape in a direction substantially perpendicular to the sliding direction is slidably fitted into the concave portion of the insulating substrate. The slide substrate has a slide mechanism that is elongated in the slide direction and has a substantially semicircular cross section in a direction substantially orthogonal to the slide direction, and slides in the recess of the insulating substrate. The length in the direction is longer than the corresponding length of the convex portion of the slide substrate.
[0010]
Furthermore, the IC socket of the present invention is characterized in that the slide substrate is provided with a latch mechanism having an arm member having a hook claw that is locked to the insulating substrate at the tip.
[0011]
Other objects, features and advantages of the present invention will become apparent from the following detailed description of the embodiments of the present invention illustrated in the accompanying drawings.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
(Example)
1 to 6 are schematic views for illustrating and explaining an embodiment of an IC socket according to the present invention. FIG. 1 is a plan view of the IC socket according to the present invention, and FIG. FIG. 3 is a front view of the IC socket. FIG. 3 is a cross-sectional view of both substrates showing a fitting state of the insulating substrate and the slide substrate in the IC socket of the present invention of FIG. 1, and FIG. 4 is a diagram of the insulating substrate of the IC socket of the present invention. FIG. 5 is a sectional view of the insulating substrate in the IC socket of the present invention of FIG. 4, FIG. 6 is a bottom view of the slide substrate in the IC socket of the present invention, and FIG. 7 is a plan view of the present invention of FIG. 8 is a side view of the slide substrate in the IC socket, FIG. 8 is a cross-sectional view of the uneven portion of the slide mechanism in the IC socket of FIG. 1, and FIG. 9 is a deformation of the uneven portion of the slide mechanism in the IC socket of the present invention. It is sectional drawing which shows an example.
[0013]
As shown in FIGS. 1 to 8, the IC socket 1 of the present invention is mainly composed of a socket body 2 and a cover member 3 that can be moved up and down. The socket body 2 serves as a substrate and an insulating substrate 6. A slide mechanism 10 is formed between the insulating substrate 6 and the slide substrate 7.
[0014]
As shown in the figure, an IC socket 1 to which the present invention is applied is aligned with a socket body 2 as a substrate, a cover member 3 elastically supported by a plurality of spring members 4 so as to move up and down, and the socket body 2. The IC package is mounted on the IC package mounting portion 8 in the center of the socket body 2. Such an IC package mounting portion 8 of the socket body 2 is provided with a plurality of sandwiched contacts 5, and an external terminal of a spherical or hemispherical solder of the IC package between the tips of the contacts 5 It is formed so that it can be connected by inserting.
[0015]
In such an IC socket 1 of the present invention, a socket body 2 as a substrate is composed of an insulating substrate 6 and a slide substrate 7 as shown in FIGS. A slide substrate 7 is fitted in the insulating substrate 6 so as to be able to slide and move horizontally. Accordingly, the slide mechanism 10 for sliding the slide substrate 7 to slide with respect to the insulating substrate 6 has a structure in which a concave portion 11 and a convex portion 12 as described later are fitted to each other. It is comprised so that it may be provided between.
[0016]
Further, the cover member 3 is elastically supported by a plurality of spring members 4 so as to be movable up and down with respect to the socket body 2, and an opening 9 is provided in the center so that the IC package in the center of the socket body 2 is mounted. It is formed so that the IC package can be mounted on the portion 8. Further, corner type guide post members 13 are provided at the four corners of the IC package mounting portion 8 so as to improve the insertion and positioning at the time of mounting the IC package.
[0017]
In the IC socket 1 of the present invention, the slide mechanism 10 as described above is formed of a concave portion 11 and a convex portion 12 which are elongated in the longitudinal direction and have a substantially semicircular cross-sectional shape in the lateral direction. A projection 12 as an elongated projection is fitted in the elongated recess 11 so that it can slide in a direction, that is, slide, and slides by sliding the projection 12 relative to the groove-shaped recess 11 to thereby move the socket. The movable elastic contact pieces of the plurality of sandwiched contacts 5 provided in the IC socket mounting portion 8 at the center of the main body 2 are moved with respect to the fixed elastic contact pieces to open and close each contact 5. ing.
[0018]
Therefore, the length of the concave portion 11 in the slide mechanism 10 in the longitudinal direction is longer than the length of the convex portion 12 by the amount of sliding, and the convex portion 12 slides and moves in the longitudinal direction in the concave portion 11. It is made to be able to. Further, the slide mechanism 10 in the IC socket 1 of the present invention as shown in FIG. 8 shows a cross section in the lateral direction of the concave portion 11 and the convex portion 12, and the concave portion 11 and the convex portion 12 having a substantially semicircular cross section. Are fitted, and there is no gap, that is, no clearance between the recessed portion 11 and the protruding portion 12 to be fitted, and therefore there is no occurrence of deviation or deviation in the left-right direction. A well-fitted state is shown.
[0019]
An IC package used as an example in the present invention is an IC component such as a ball grid type IC package having a plurality of spherical or hemispherical solder external terminals, but other similar IC packages may be used. Of course, it can be applied. In such an IC package, a spherical or hemispherical solder external terminal is sandwiched between the fixed elastic contact piece of the contact 5 and the tip of the movable elastic contact piece so as to be held and connected. The contact 5 is opened and closed satisfactorily when the slide substrate 7 slides smoothly with respect to the insulating substrate 6 and operates.
[0020]
Further, as shown in FIG. 3, the slide substrate 7 is provided with latch mechanisms 14 on both sides, each having an arm member 15 having a hook claw 16 that is locked to the insulating substrate 6 formed at the tip. The slide mechanism 7 can be easily and easily attached to the insulating substrate 6 by the latch mechanism 14 and can be easily removed and replaced.
[0021]
(Example 2)
FIG. 9 shows a modification of the slide mechanism in the second embodiment of the IC socket of the present invention. The IC socket in the present embodiment is substantially the same as the IC socket in the first embodiment described above. The detailed description of the socket main body, the cover member, the contacts, and the like will be omitted here, and only the characteristic slide mechanism will be described.
[0022]
As shown in FIG. 9, in the second embodiment of the IC socket of the present invention, the slide mechanism 20 includes a concave portion 21 having a substantially triangular cross-sectional shape in the lateral direction, and a convex portion 22 having a substantially semicircular sectional shape. It is composed of As shown in the figure, the cross-sectional shape of the concave portion 21 in the lateral direction is a triangular shape such as an isosceles triangle, and a part of both sides of the spherical portion of the convex portion 22 is formed on the slope formed by the hypotenuse of the triangle. The contact is made by abutting with line contact or minute surface contact. Accordingly, the convex portion 22 is always in contact with the slopes on both sides of the concave portion 21, is in good contact with no gap between the concave portion 21 and the convex portion 22, and the center deviation between the concave portion 21 and the convex portion 22 is shifted. The contacts can be opened and closed satisfactorily by sliding and sliding smoothly without causing misalignment and without shifting.
[0023]
【The invention's effect】
As described above, the IC socket of the present invention is formed in the insulating substrate with the contact portion provided with the elongated contact portion in the sliding direction, and the insulating portion having the substantially semicircular cross section in the direction substantially perpendicular to the sliding direction. A slide mechanism that is formed in the slide substrate so as to be slidably fitted in the recess of the substrate in the slide direction, and has a substantially semicircular cross section in a direction substantially orthogonal to the slide direction, The length in the sliding direction of the concave portion of the insulating substrate is formed longer than the corresponding length of the convex portion of the sliding substrate. The opening can be suitably performed.
[0026]
IC socket of the present invention, slide board, the latch mechanism is provided with an arm member which hooks claw to be locked to the insulation substrate is formed at the tip, easy slide substrate to the insulating substrate And it can be easily installed and removed and is interchangeable.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC socket according to the present invention.
FIG. 2 is a front view of the IC socket of the present invention of FIG.
3 is a cross-sectional view of both substrates showing a fitting state of an insulating substrate and a slide substrate in the IC socket of the present invention of FIG. 1. FIG.
FIG. 4 is a plan view of an insulating substrate in the IC socket of the present invention.
5 is a cross-sectional view of an insulating substrate in the IC socket of the present invention of FIG. 4;
FIG. 6 is a bottom view of a slide substrate in the IC socket of the present invention.
7 is a side view of a slide substrate in the IC socket of the present invention shown in FIG. 6. FIG.
8 is a cross-sectional view of an uneven portion of a slide mechanism in the IC socket of the present invention shown in FIG.
FIG. 9 is a cross-sectional view showing a modification of the uneven portion of the slide mechanism in the IC socket of the present invention.
FIG. 10 is a cross-sectional view when the uneven portion of the slide mechanism in the conventional IC socket is offset.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 IC socket 2 Socket main body 3 Cover member 4 Spring member 5 Contact 6 Insulating board 7 Slide board 8 IC package mounting part 9 Opening part 10 Slide mechanism 11 Recess 12 Protrusion 13 Guide post member 14 Latch mechanism 15 Arm member 16 Latch claw 20 Slide mechanism 21 Concave portion 22 Convex portion

Claims (3)

A socket body forming a substrate having an insulating substrate and a slide substrate;
In an IC socket having a plurality of contacts mounted on the socket body and a cover member that can move up and down,
A portion of the insulating substrate where the contact is provided is elongated in the sliding direction, and a substantially semicircular recess in a direction substantially perpendicular to the sliding direction is slidably fitted into the recess of the insulating substrate. A slide mechanism having an elongated shape in the sliding direction on the slide substrate and having a substantially semicircular cross section in a direction substantially perpendicular to the sliding direction,
The IC socket according to claim 1, wherein a length of the concave portion of the insulating substrate in the sliding direction is longer than a corresponding length of the convex portion of the slide substrate. In an IC socket having a socket body that forms a substrate having an insulating substrate and a slide substrate, a plurality of contacts mounted on the socket body, and a cover member that can move up and down.
A portion of the insulating substrate that is provided with the contact is elongated in the sliding direction, and is slidably fitted into a concave portion having a substantially triangular cross-section in a direction substantially perpendicular to the sliding direction, and the concave portion of the insulating substrate. And a slide mechanism that is formed in the slide substrate so as to be elongated in the slide direction, and has a substantially semicircular cross section in a direction substantially orthogonal to the slide direction,
The IC socket according to claim 1, wherein a length of the concave portion of the insulating substrate in the sliding direction is longer than a corresponding length of the convex portion of the slide substrate.   3. The IC socket according to claim 1, wherein the slide substrate is provided with a latch mechanism having an arm member having a hook claw that is engaged with the insulating substrate at a tip.

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