JP3778835B2 - Method for manufacturing layered structure including electronic circuit - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a layer structure such as a card including an electronic circuit , a business card, a postcard, a manufacturing method and a manufacturing apparatus thereof, and is particularly suitable for personal use, for example, for printing an image or the like using an inkjet printer or the like. A method for manufacturing a simple layer structure is provided.
[0002]
[Prior art and its problems]
Conventionally, a structure including an electronic circuit such as an IC card is made of plastic in consideration of bending rigidity and the like. For this reason, it is difficult to personally write or print on the surface of an IC card or the like, and the usage is limited.
In addition, it is desirable to expand the usage of cards, business cards, postcards, etc. with various shapes and patterns according to the user's preference. It is difficult to meet the demands of individuals who want to make cards easily.
An object of the present invention is to provide a method for manufacturing a layered structure capable of solving the problems included in the conventional technology as described above.
[0003]
[Means for Solving the Problems]
In order to achieve the above object, the first invention according to the present application is:
A first bonding step for bonding one side of a tag having a plurality of electronic circuits printed on one side or both sides, and a temporary outer layer sheet via a first adhesive layer;
A first removal step of removing the other portion of the tag and the first adhesive layer leaving a region corresponding to each of the electronic circuits from the layered body obtained in the first adhesion step;
The intermediate layer structure, which is a layer structure composed of the tag and the electronic circuit in the region corresponding to each of the electronic circuits and the first adhesive layer, is peeled off from the temporary outer layer sheet, and each of the intermediate layer structures is removed. A second bonding step for bonding to the first outer layer sheet via the first adhesive layer;
A third bonding step in which the first outer layer sheet and the second outer layer sheet to which the intermediate layer structures are bonded are sandwiched between the intermediate layer structure and the second adhesive layer; ,
A notch step for cutting the second outer layer sheet, the second adhesive layer, and the first outer layer sheet so as to surround a region corresponding to each of the electronic circuits with respect to the product obtained by the third bonding step. When,
A method for producing a layered structure including an electronic circuit comprising:
The second invention according to this application, a first adhesive for bonding one side or the side of the tag in which a plurality of electronic circuits are printed on both sides, and a tentative outer sheet through the first adhesive layer Process,
A first removal step of removing the other portion of the tag and the first adhesive layer leaving a region corresponding to each of the electronic circuits from the layered body obtained in the first adhesion step;
The intermediate layer structure, which is a layer structure composed of the tag and the electronic circuit in the region corresponding to each of the electronic circuits and the first adhesive layer, is peeled off from the temporary outer layer sheet, and each of the intermediate layer structures is removed. A second bonding step for bonding to the first outer layer sheet via the first adhesive layer ;
And the intermediate layer structure each of which is bonded to the first outer layer sheet, and a third bonding process of the second outer sheet is bonded via a second adhesive layer with sandwich the intermediate layer structure ,
A second portion that removes the second outer layer sheet , the second adhesive layer, and the first outer layer sheet in other portions, leaving a region corresponding to each of the electronic circuits from the product of the third bonding step . And a removing method for the layer structure including the electronic circuit .
According to this method, it is possible to produce an effect that a plurality of the layer structures can be manufactured at a time.
Also, the above method
The first bonding step is
Using one of the temporary outer layer sheets provided with a release paper through the first adhesive layer, the one side of the tag is adhered to the first adhesive layer while peeling the release paper. It can also be understood as a process.
Also, the above method
The third bonding step is
The release sheet is provided on one side of the second outer layer sheet via the second adhesive layer, and the first outer layer sheet is applied to the second adhesive layer while peeling the release sheet. It can also be grasped as a method which is a process of adhering .
Further, a third outer layer sheet is provided on the surface of the first outer layer sheet opposite to the side to be bonded to the intermediate layer structure via a detachable pseudo adhesive layer or a detachable fourth adhesive layer. Are joined ,
When the second removing step is a step of removing the second outer layer sheet, the second adhesive layer, and the first outer layer sheet while leaving the third outer layer sheet, The layer structure bonded to the third outer layer sheet can be obtained, which is very advantageous for the user.
Furthermore, following the first bonding step, the method further includes a lamination bonding step of sandwiching the temporary outer layer sheet and the laminate film with the intermediate layer structure sandwiched therebetween and via a third adhesive layer. There may be. In this case, since the laminate film plays a role of reinforcement, it is useful in the manufacturing stage of the layer structure.
[0004]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
FIG. 1 is a perspective view for explaining a tag used in the present invention, FIG. 2 is a perspective view for explaining a first bonding process, and FIG. 3 is a layer structure obtained in the first bonding process. 4 is a perspective view for explaining the first removal step, FIG. 5 is a perspective view showing the layer structure obtained in the first removal step, and FIG. FIG. 7 is a sectional view showing a modification of the layer structure obtained in the first bonding step, and FIG. 8 is used in the second bonding step. FIG. 9 is a side view showing the second bonding step, FIG. 10 is a cross-sectional view of the layer structure obtained in the second bonding step, and FIG. FIG. 12 is a sectional view showing a layer structure according to one embodiment of the present invention, and FIG. 13 shows another embodiment of the present invention. Is a cross-sectional view showing the that the layer structure.
[0005]
As shown in FIG. 1, the tag T used in the present embodiment is one in which a plurality of electronic circuits 2 are printed on a plastic film 1 at a predetermined interval, generally in the form of a tape, Manufactured in a roll state. However, it does not necessarily have to be on a tape, and may have a sheet piece structure. Especially when a card is personally made, a sheet body on which one or several electronic circuits are printed. Is more preferable.
[0006]
In this embodiment, the first mount 3 (an example of a temporary outer layer sheet) is attached to one side of the tag T. FIG. 2 shows a process of attaching the first mount 3 to the film 1. In a preferred embodiment for mass production, the first mount 3 is composed of a first adhesive layer 4 on one side and a release paper 5 attached to the first adhesive layer 4. As shown in FIG. 2, the tag T is attached to the first adhesive layer 4 while peeling the release paper 5. This is the first bonding step.
The resulting layer structure is shown in FIG. FIG. 3 is a cross-sectional view taken at a right angle to the film 1 at the center of the electronic circuit 2. When viewed from the cross-sectional view of the electronic circuit 3, the electronic circuit 2 bonded by the first adhesive layer 4 is shown. The structure is sandwiched between the first mount 3 and the film 1 of the tag T.
[0007]
Then, as shown in FIG. 4, the notch shown with the broken line 6 is made from the film 1 side. The depth of the cut does not reach the first mount 3 but reaches the first adhesive layer 4. The cut is formed in a shape surrounding the electronic circuit 2.
Subsequently, a region including each of the electronic circuits 2 (in this embodiment, an inner portion of a rectangular broken line 6 indicating a cut) is left and other regions are removed. The removal can be easily performed by the incision. Thus, the first removal step is to remove the film 1 (the tag of the other part) and the first adhesive layer 4 except for the part of the electronic circuit 2.
The shape of the layer structure after the removal is shown in a perspective view in FIG. 5 and in a sectional view in FIG.
The first adhesive layer 4 having a weak adhesive force facilitates the first removal step and the next step.
[0008]
Next , the intermediate layer structure D , which is a layer structure composed of the adhesive layer 4, the electronic circuit 2, and the film 1 shown in FIGS. 5 and 6 , is peeled off from the first mount 3 (an example of a temporary outer layer sheet). , Affixed to one side of the second mount 7 (an example of the first outer layer sheet). This is the second bonding step.
In this embodiment, the second mount 7 is used that is pseudo-bonded to the third mount 8 (an example of a third outer layer sheet) . Pseudo-adhesion is also commonly referred to as heat welding, and the second mount 7 can be easily peeled off from the third mount 8 and no adhesive remains after it is peeled off. , Easy to handle.
[0009]
Then, the 3rd adhesion process which adheres the 4th mount 9 (an example of the 2nd outer layer sheet) to the above-mentioned film 1 side is explained.
In this case, a fourth mount 9 bonded to the release paper 11 through the second adhesive layer 10 as shown in FIG. 8 is used. As the adhesive for the second adhesive layer 10 used here, one having a strong adhesive force is used. That is, in the third bonding step, as shown in FIG. Adhesive layer 10 is used to adhere fourth mount 9 to second mount 7 where there is no electronic circuit 2 and to film 1 where there is electronic circuit 2.
The completed layer structure is shown in FIG.
[0010]
As a final process, as shown by an arrow Z shown in FIG. 10, a notch surrounding each of the electronic circuits 2 is made (notch process) , and a second part other than the part of the electronic circuit 2 is left with the third mount 8 left. The mount 7, the second adhesive layer 10 and the fourth mount 9 are removed. This step is the second removal step. Since the second mount 7 and the third mount 8 are only pseudo-bonded, the removal can be easily performed. FIG. 11 is a perspective view of the layered structure after the removal step.
In this embodiment, as shown in FIG. 11, a layered structure comprising a second mount 7, a first adhesive layer 4, an electronic circuit 2, a film 1 and a fourth mount 9 on a third mount 8. The cards with the cards 12, 12,... Are finally manufactured.
The third mount 8 and / or the fourth mount 9 is made of paper or a material that can be printed.
In this embodiment, since the card 12 is detachably attached to the third mount 8 as described above, the user keeps this state or peels off the card 12 in this state. 、 Can be used with your favorite print.
In addition, since the present embodiment is configured as described above, it is possible to use paper or cloth that is used in normal life as a mount or the like, so various shapes and patterns are attached according to user's preference. Can be used to create new cards, business cards, postcards, and so on.
[0011]
【Example】
In the above embodiment, the second mount 7 is used in which the third mount 8 is pseudo-bonded so that the user can peel off the card 12 from the third mount 8 at the time of use. However, the third mount 8 can be omitted in some cases. In this case, the card 12 is separated from other parts at this point by the notch by the arrow Z shown in FIG. The user can print on the surface of not only the fourth mount 9 but also the second mount 7 .
Further, following the first bonding step shown in FIG. 2, a laminate film 14 may be attached to the film 1 side via a third adhesive layer 13 as shown in FIG. In this case, since the laminate film reinforces the film 1, the film 1 or the like can be reinforced when the portion around the electronic circuit 2 is subsequently removed, and damage to the layer structure is prevented.
Further, in the process of FIG. 7, the second mount 7 and the third mount 8 are pseudo bonded, but the fourth adhesive layer is used instead of the pseudo bond as shown in FIG. 15 may be interposed. Thus, when the card 12 is peeled off from the state of FIG. 11, the adhesive remains on the back surface of the card 12, so that the card as a product having a sealing function can be obtained.
Furthermore, in the above embodiment, the order of the layers constituting the card 12 is the order of the film 1, the electronic circuit 2, and the first adhesive layer 4. However, the present invention is not limited to this. The electronic circuit 2, the film 1, and the first adhesive layer 4 may be provided in this order.
[0012]
【The invention's effect】
In order to achieve the above object, the first invention according to the present application is:
A first bonding step for bonding one side of a tag having a plurality of electronic circuits printed on one side or both sides, and a temporary outer layer sheet via a first adhesive layer;
A first removal step of removing the other portion of the tag and the first adhesive layer leaving a region corresponding to each of the electronic circuits from the layered body obtained in the first adhesion step;
The intermediate layer structure, which is a layer structure composed of the tag and the electronic circuit in the region corresponding to each of the electronic circuits and the first adhesive layer, is peeled off from the temporary outer layer sheet, and each of the intermediate layer structures is removed. A second bonding step for bonding to the first outer layer sheet via the first adhesive layer;
A third bonding step in which the first outer layer sheet and the second outer layer sheet to which the intermediate layer structures are bonded are sandwiched between the intermediate layer structure and the second adhesive layer; ,
A notch step for cutting the second outer layer sheet, the second adhesive layer, and the first outer layer sheet so as to surround a region corresponding to each of the electronic circuits with respect to the product obtained by the third bonding step. When,
A method for producing a layered structure including an electronic circuit comprising:
The second invention according to this application, a first adhesive for bonding one side or the side of the tag in which a plurality of electronic circuits are printed on both sides, and a tentative outer sheet through the first adhesive layer Process,
A first removal step of removing the other portion of the tag and the first adhesive layer leaving a region corresponding to each of the electronic circuits from the layered body obtained in the first adhesion step;
The intermediate layer structure, which is a layer structure composed of the tag and the electronic circuit in the region corresponding to each of the electronic circuits and the first adhesive layer, is peeled off from the temporary outer layer sheet, and each of the intermediate layer structures is removed. A second bonding step for bonding to the first outer layer sheet via the first adhesive layer ;
And the intermediate layer structure each of which is bonded to the first outer layer sheet, and a third bonding process of the second outer sheet is bonded via a second adhesive layer with sandwich the intermediate layer structure ,
A second portion that removes the second outer layer sheet , the second adhesive layer, and the first outer layer sheet in other portions, leaving a region corresponding to each of the electronic circuits from the product of the third bonding step . And a removing method for the layer structure including the electronic circuit .
According to this method, it is possible to produce an effect that a plurality of the layer structures can be manufactured at a time.
Also, the above method
The first bonding step is
Using one of the temporary outer layer sheets provided with a release paper through the first adhesive layer, the one side of the tag is adhered to the first adhesive layer while peeling the release paper. It can also be understood as a process.
Also, the above method
The third bonding step is
The release sheet is provided on one side of the second outer layer sheet via the second adhesive layer, and the first outer layer sheet is applied to the second adhesive layer while peeling the release sheet. It can also be grasped as a method which is a process of adhering .
Further, a third outer layer sheet is provided on the surface of the first outer layer sheet opposite to the side to be bonded to the intermediate layer structure via a detachable pseudo adhesive layer or a detachable fourth adhesive layer. Are joined ,
When the second removing step is a step of removing the second outer layer sheet, the second adhesive layer, and the first outer layer sheet while leaving the third outer layer sheet, The layer structure bonded to the third outer layer sheet can be obtained, which is very advantageous for the user.
Furthermore, following the first bonding step, the method further includes a lamination bonding step of sandwiching the temporary outer layer sheet and the laminate film with the intermediate layer structure sandwiched therebetween and via a third adhesive layer. There may be. In this case, since the laminate film plays a role of reinforcement, it is useful in the manufacturing stage of the layer structure.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a tag used in the present invention.
FIG. 2 is a perspective view for explaining a first bonding step.
FIG. 3 is a cross-sectional view showing the configuration of the layer structure obtained in the first bonding step.
FIG. 4 is a perspective view for explaining a removal step.
FIG. 5 is a perspective view showing a layer structure obtained in the removing step.
FIG. 6 is a cross-sectional view showing the layer structure obtained in the removing step.
FIG. 7 is a cross-sectional view showing a modification of the layer structure obtained in the first bonding step.
FIG. 8 is a perspective view showing the structure of a mount that can be used in the second bonding step.
FIG. 9 is a side view showing a second bonding step.
FIG. 10 is a cross-sectional view of the layer structure obtained in the second bonding step.
FIG. 11 is a perspective view showing a layer structure obtained in a second bonding step.
FIG. 12 is a cross-sectional view showing a layered structure according to an embodiment of the present invention.
FIG. 13 is a sectional view showing a layer structure according to another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Film 2 ... Electronic circuit 3 ... 1st mount 4 ... 1st adhesive layer 5 ... Release paper 6 ... Notch 7 ... 2nd mount 8 ... 3rd mount 9 ... 4th mount 10 ... 2nd Adhesive layer 11 ... release paper 12 ... card 13 ... third adhesive layer 14 ... laminate film 15 ... fourth adhesive layer

Claims (6)

A first bonding step for bonding one side of a tag having a plurality of electronic circuits printed on one side or both sides, and a temporary outer layer sheet via a first adhesive layer;
  A first removal step of removing the other portion of the tag and the first adhesive layer leaving a region corresponding to each of the electronic circuits from the layered body obtained in the first adhesion step;
  The intermediate layer structure, which is a layer structure composed of the tag and the electronic circuit in the region corresponding to each of the electronic circuits and the first adhesive layer, is peeled off from the temporary outer layer sheet, and each of the intermediate layer structures is removed. A second bonding step for bonding to the first outer layer sheet via the first adhesive layer;
  A third bonding step in which the first outer layer sheet and the second outer layer sheet to which the intermediate layer structures are bonded are sandwiched between the intermediate layer structure and the second adhesive layer; ,
  A notch step for cutting the second outer layer sheet, the second adhesive layer, and the first outer layer sheet so as to surround a region corresponding to each of the electronic circuits with respect to the product obtained by the third bonding step. When,
  A method of manufacturing a layered structure including an electronic circuit comprising: And one surface of one side or tag a plurality of electronic circuits on both sides are printed, a first bonding step of bonding the temporary outer sheet through the first adhesive layer,
A first removal step of removing the other portion of the tag and the first adhesive layer leaving a region corresponding to each of the electronic circuits from the layered body obtained in the first adhesion step;
Peeled is the tag and the electronic circuitry as well as a layer structure composed of the first adhesive layer in the region corresponding to the electronic circuit from each outer sheet of the temporary intermediate layer structures, each inter layer structure intermediate A second bonding step for bonding to the first outer layer sheet via the first adhesive layer;
And the intermediate layer structure each of which is bonded to the first outer layer sheet, and a third bonding process of the second outer sheet is bonded via a second adhesive layer with sandwich the intermediate layer structure ,
A second portion that removes the second outer layer sheet , the second adhesive layer, and the first outer layer sheet in other portions, leaving a region corresponding to each of the electronic circuits from the product of the third bonding step . The manufacturing method of the layer structure containing the electronic circuit which comprises the removal process.   The first bonding step is
  Using one of the temporary outer layer sheets provided with a release paper through the first adhesive layer, the one side of the tag is adhered to the first adhesive layer while peeling the release paper. The method for producing a layered structure including an electronic circuit according to claim 1, which is a process.   The third bonding step is
  The release sheet is provided on one side of the second outer layer sheet via the second adhesive layer, and the first outer layer sheet is applied to the second adhesive layer while peeling the release sheet. The method for producing a layered structure including an electronic circuit according to any one of claims 1 to 3, wherein the layer structure is a step of adhering the layers. The third outer layer sheet is bonded to the surface of the first outer layer sheet opposite to the side to be bonded to the intermediate layer structure via a peelable pseudo-adhesive layer or a peelable fourth adhesive layer. Has been
The second removal step, while leaving the third outer layer sheet, said second outer layer sheet, according to claim 2 is a step of removing the second adhesive layer and the first outer layer sheet 5. A method for producing a layered structure including the electronic circuit according to any one of 4 above.   Subsequent to the first adhering step, further comprising a laminating and adhering step of adhering the temporary outer layer sheet and the laminate film with the intermediate layer structure interposed therebetween and via a third adhesive layer. Item 6. A method for producing a layered structure including the electronic circuit according to any one of Items 1 to 5.

Images