JP3778799B2 - Optical pickup device - Google Patents

Optical pickup device Download PDF

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Publication number
JP3778799B2
JP3778799B2 JP2001032757A JP2001032757A JP3778799B2 JP 3778799 B2 JP3778799 B2 JP 3778799B2 JP 2001032757 A JP2001032757 A JP 2001032757A JP 2001032757 A JP2001032757 A JP 2001032757A JP 3778799 B2 JP3778799 B2 JP 3778799B2
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JP
Japan
Prior art keywords
light receiving
receiving element
hole
plate
pickup device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001032757A
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Japanese (ja)
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JP2002237072A (en
Inventor
晋 藤原
一典 植木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to JP2001032757A priority Critical patent/JP3778799B2/en
Publication of JP2002237072A publication Critical patent/JP2002237072A/en
Application granted granted Critical
Publication of JP3778799B2 publication Critical patent/JP3778799B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Light Receiving Elements (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、CDプレーヤー等に組み込まれる光ピックアップ装置で、レーザービームを受光する受光素子の支持方法に係る光ピックアップ装置に関するものである。
【0002】
【従来の技術】
光ピックアップ装置の一例として、特開平8−329511に開示しているように受光素子は左右に接続端子が配置されるとともに受光面方向へL字型に形成された接続端子を設け、受光素子より大きなプリント基板に受光面がプリント基板に対向するよう半田付けされるとともにプリント基板中央部には記録媒体からの反射光が通過し受光素子に照射する孔を設け、受光素子の後面とフレームを当接しプリント基板とフレーム間を接着材にて充填して支持するように構成されている。
【0003】
また、他の方法として、左右に複数の接続端子が配置された受光素子は受光部面の方向へL字型に形成された接続端子を設け、受光素子と同程度の面積であるプリント基板を受光面と対向させて接続端子が半田付けされ、そして、プリント基板は中央部に記録媒体からの反射光が通過し受光素子に照射する孔と両端に位置決め用の凹部が切込まれ、本体フレームには受光素子の両側面を当接する位置決め用の二つの突起を設け、該突起にプリント基板を受光面をフレーム方向に対向して凹部に当接し接着剤により突起と受光素子の上側面をUV接着剤にて支持するように構成されている。
【0004】
また、他の方法として、受光素子が搭載されるプリント基板は中央部に受光素子が配置されるよう空間部を設け、左右に接続端子を有した受光素子は前記プリント基板の空間部に配置するとともに、プリント基板と受光素子の接続端子間とを半田付けにより支持され、受光素子が搭載されたプリント基板は中央部に記録媒体からの反射光が通過し受光素子に照射する孔を設け、フレームに設けられている記録媒体からの反射光が通過する孔に前記受光素子が合致するようプリント基板をネジにより固定されるよう構成されている。
【0005】
【発明が解決しようとする課題】
受光素子を動作させると発熱が起こり、受光素子の電源変換回路は、温度による抵抗値変化が発生する。これは、温度の変化に応じて変換された電圧レベルが変化することである。この変化は周囲温度や受光素子自体の発熱によっても起こるもので、自己発熱は受光素子の電源電圧投入時と時間を経過した場合とで電圧レベルに変化が現れるものとなる。
【0006】
光学ピックアップを使用するドライブでは、電源投入時やディスクの入れ替え時にこの電圧レベルを各種回路で適正に自動調整を行うが、電源投入時に設定された場合には、時間経過によって調整されたレベルが適正な値からずれる場合が考えられる。調整されたレベルが適正値からずれることは、ディスクの再生、記録性能に劣化をもたらし、最悪の場合、CD−Rディスクの記録破損をもたらすこととなるという問題があった。
【0007】
本発明は、斯かる問題を解決した光ピックアップ装置を提供しようとするものである。
【0008】
【課題を解決するための手段】
本発明に係る光ピックアップ装置は、各種光学部品が組込まれるハウジングに熱伝導性及び放熱性に優れたプレートを取付け、該プレートに受光素子が遊嵌される凹部を設けるとともに、該凹部内に前記反射光が通過する孔と接着孔を設け、該凹部内の反射光が通過する孔と受光素子の検出部が一致するように遊嵌させた状態で前記接着孔内に充填する接着剤により該プレートに受光素子を密着して接着するようにしている。
【0009】
【実施例】
図1は本発明の一実施例を示す光ピックアップ装置として、要部を示す分解斜視図である。図2は図1に示すフレームに受光素子を接着固定した状態を示すA−A’の断面図である。
【0010】
図1において、1はピックアップ装置の各種光学部品が組み込まれているハウジング、1aはハウジング1に設けられた記録媒体からの反射光を通過させるハウジング透孔、2は前記ハウジング1の方向に受光部が対向配置されており、複数の端子が設けている受光素子であり、受光面に設けられた検出部2aはセンターよりシフトした位置に設けられ、受光素子2の後面にはフレキシブルプリント基板3が接着され接続されている。
【0011】
4は前記受光素子2が取り付けられる熱伝導性及び放熱性に優れたアルミニューム製のプレート、4aは前記プレート4に受光素子2の受光面を遊嵌させて取付ける取付凹部、4bは前記取付凹部4a内にハウジング孔1aと一致する位置に孔を設け、前記受光素子2の検出部2aと一致する位置に配置されているプレート透孔、4cは前記取付凹部4a内の中央部に孔を設け、該孔と受光素子2の受光面とを接着する接着孔である。
【0012】
5は前記プレート4とハウジング1の間に配置されて前記プレート4を保持する熱伝導性及び放熱性に優れたアルミニューム製のプレートベース、5aは前記プレートベース5にプレート透孔4bとハウジング透孔1aに一致する位置に設けられたプレートベース透孔、6は前記フレキシブルプリント基板3と受光素子2を押圧しプレートベース5に取り付ける鉄製のカバーである。
【0013】
7aと7bは前記プレートベース5に設けられ、受光素子2が取付けらたプレート4とカバー6を取付るネジ孔、8aと8bは前記プレート透孔4bとプレートベース透孔5aとを一致した位置において、ネジ孔7aと7bに一致する孔を設けたプレート取付孔、9aと9bはカバー6が取り付けられるカバー取付孔である。
【0014】
10aはカバー取付孔9aとプレート取付孔8aを介してネジ孔7aに取り付ける取付けネジ、10bは前記取付ネジ10aと同様にカバー取付孔9bとプレート取付孔8bを介してネジ孔7bに取り付けるネジ孔、11aと11bは前記ハウジング1のハウジング透孔1aと同一面に設けられ、プレートベース5が取り付けられるプレートベース取付ネジ孔である。
【0015】
12aと12bはプレートベース5をハウジング1に当接し取り付けるプレートベース取付孔であり、プレート取付ネジ13a及び14bによりプレートベース取付ネジ孔11aと12bにネジ止めされる。このプレートベース取付孔12aと12bはプレートベース5を取り付ける際、プレートベース取付孔12a、12bはプレート取付ネジ13a及び13bの直径との遊びがあり受光素子2に記録媒体からの反射光が正確に受光するよう調節しネジ止めされるように構成されている。
【0016】
14はプレートベース5をZ軸方向に調節する為のZ軸調整孔、16は前記Z軸調整孔14にネジ止めされるとともにネジの先端部はハウジング1の当接面16を押圧し、プレートベース5はZ軸方向に変位し受光素子2に記録媒体からの反射光が正確に受光するように構成されている。
【0017】
次に組立て方法について述べると、まず、プレート4に設けられた取付凹部4aにフレキシブルプリント基板3が接着接続された受光素子2の受光面を受光素子2の検出部2aとプレート透孔4bとを一致させて遊嵌させる。遊嵌させると同時に密着状態を保持し、接着孔4c内にUV接着即ち接着剤を充填して硬化することにより受光素子2とプレート4は接着される。
【0018】
受光素子2が搭載されたプレート4はフレキシブルプリント基板3が接着されている受光素子2の背部よりカバー6を押圧した状態を保持し、取付ネジ10aによりカバー取付孔9aとプレート取付孔8aを介してネジ孔7aにネジ止めされる。また、同様に取付ネジ10bはカバー取付孔9bとプレート取付孔8bを介してネジ孔7bにネジ止めされる。このように部品が取付けられたプレートベース5は更にハウジング透孔1aとプレートベース透光5aを合致させた状態においてプレート取付ネジ13a、14bはプレートベース取付孔12a、12bを介してプレートベース取付ネジ孔11a、12bに取り付けられる。
【0019】
次にZ軸調整孔14にZ軸調整ネジ15をネジ締め貫通させ当接面16を押圧することによりプレートベース5はZ軸方向に付勢され、受光素子2に記録媒体からの反射光の光軸が正確に受光素子2へ照射するようにZ軸調整ネジ15を調節する。
【0020】
その結果、記録媒体からの反射光はハウジング透孔1aからプレートベース透孔5aとプレート透孔4bを通過し受光素子2の検出部2aに照射されることになる。
【0021】
【発明の効果】
本発明は、熱伝導性及び放熱性に優れたプレートに設けた凹部に受光素子の受光面を密着させた状態でプレートの接着孔内に接着剤を充填することにより受光素子をプレートに接着するようにしているので、プレートに受光素子を密着させて接着する組立作業が簡単になるとともに、受光素子の発熱を効果的にプレートに伝達して放熱させることができる。
【図面の簡単な説明】
【図1】本発明の一実施形態を示す光ピックアップ装置の要部を示す分解斜視図である。
【図2】図1に示すフレームに受光素子を接着固定した状態のA−A’の断面図である。
【符号の説明】
1 ハウジング
2 受光素子
2a 検出部
4 プレート
4a 取付凹部
4b プレート透孔
4c 接着孔
5 プレートベース
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical pickup device that is incorporated in a CD player or the like and relates to a method of supporting a light receiving element that receives a laser beam.
[0002]
[Prior art]
As an example of the optical pickup device, as disclosed in Japanese Patent Laid-Open No. 8-329511, the light receiving element is provided with connection terminals on the left and right sides and provided with a connection terminal formed in an L shape toward the light receiving surface. A large printed circuit board is soldered so that the light receiving surface faces the printed circuit board, and a hole is provided in the center of the printed circuit board for the reflected light from the recording medium to pass through and irradiate the light receiving element. The printed circuit board and the frame are in contact with each other and filled with an adhesive so as to be supported.
[0003]
As another method, a light receiving element in which a plurality of connection terminals are arranged on the left and right are provided with connection terminals formed in an L shape in the direction of the light receiving surface, and a printed circuit board having an area similar to that of the light receiving element is provided. The connection terminal is soldered so as to face the light receiving surface, and the printed circuit board has a hole through which reflected light from the recording medium passes and irradiates the light receiving element at the center, and positioning concave portions at both ends, and the body frame Is provided with two positioning projections that abut both side surfaces of the light receiving element, the printed circuit board is opposed to the concave portion with the light receiving surface facing the frame direction, and the protrusion and the upper surface of the light receiving element are UV-bonded by an adhesive. It is configured to be supported by an adhesive.
[0004]
As another method, the printed circuit board on which the light receiving element is mounted is provided with a space so that the light receiving element is disposed in the center, and the light receiving element having the connection terminals on the left and right is disposed in the space of the printed circuit board. In addition, the printed circuit board and the connection terminal of the light receiving element are supported by soldering, and the printed circuit board on which the light receiving element is mounted is provided with a hole through which reflected light from the recording medium passes and irradiates the light receiving element. The printed circuit board is fixed with a screw so that the light receiving element matches the hole through which the reflected light from the recording medium provided in the plate passes.
[0005]
[Problems to be solved by the invention]
When the light receiving element is operated, heat is generated, and the power conversion circuit of the light receiving element changes in resistance value due to temperature. This is a change in the converted voltage level in response to a change in temperature. This change also occurs due to the ambient temperature and heat generation of the light receiving element itself, and self-heating causes a change in voltage level when the power supply voltage of the light receiving element is turned on and when time elapses.
[0006]
In drives that use an optical pickup, this voltage level is automatically adjusted appropriately by various circuits when the power is turned on or when the disk is replaced. If this is set when the power is turned on, the level adjusted over time is appropriate. The case where it deviates from a certain value is considered. When the adjusted level deviates from the appropriate value, the reproduction and recording performance of the disc deteriorates, and in the worst case, the recording damage of the CD-R disc occurs.
[0007]
The present invention is intended to provide an optical pickup device that solves such problems.
[0008]
[Means for Solving the Problems]
The optical pickup device according to the present invention is provided with a plate having excellent heat conductivity and heat dissipation attached to a housing in which various optical components are assembled, and a recess in which a light receiving element is loosely fitted is provided on the plate. A hole through which the reflected light passes and an adhesive hole are provided, and the adhesive filled in the adhesive hole in a state of loosely fitting so that the hole through which the reflected light passes in the concave portion and the detection part of the light receiving element are aligned. The light receiving element is adhered and adhered to the plate.
[0009]
【Example】
FIG. 1 is an exploded perspective view showing a main part of an optical pickup device according to an embodiment of the present invention. 2 is a cross-sectional view taken along the line AA ′ showing a state in which the light receiving element is bonded and fixed to the frame shown in FIG.
[0010]
In FIG. 1, reference numeral 1 denotes a housing in which various optical components of the pickup device are incorporated, 1 a denotes a housing through hole through which reflected light from a recording medium provided in the housing 1 passes, and 2 denotes a light receiving portion in the direction of the housing 1. Is a light receiving element provided with a plurality of terminals, the detection portion 2a provided on the light receiving surface is provided at a position shifted from the center, and a flexible printed circuit board 3 is provided on the rear surface of the light receiving element 2. Glued and connected.
[0011]
4 is a plate made of aluminum excellent in heat conductivity and heat dissipation to which the light receiving element 2 is mounted, 4a is a mounting recess for loosely mounting the light receiving surface of the light receiving element 2 on the plate 4, and 4b is the mounting recess. 4a is provided with a hole at a position that coincides with the housing hole 1a, and a plate through-hole 4c is provided at a position that coincides with the detection portion 2a of the light receiving element 2 and a hole is provided at the center of the mounting recess 4a. , An adhesion hole for adhering the hole and the light receiving surface of the light receiving element 2.
[0012]
Reference numeral 5 denotes a plate base made of aluminum which is disposed between the plate 4 and the housing 1 and holds the plate 4 and has excellent heat conductivity and heat dissipation . 5a denotes a plate through hole 4b and a housing through hole in the plate base 5. A plate base through hole 6 provided at a position coinciding with the hole 1 a is an iron cover that presses the flexible printed circuit board 3 and the light receiving element 2 and attaches to the plate base 5.
[0013]
7a and 7b are provided in the plate base 5 and screw holes for attaching the plate 4 and the cover 6 to which the light receiving element 2 is attached, and 8a and 8b are positions where the plate through hole 4b and the plate base through hole 5a coincide. The plate mounting holes 9a and 9b are provided with holes corresponding to the screw holes 7a and 7b, and cover mounting holes to which the cover 6 is mounted.
[0014]
10a denotes a mounting screw that is attached to the screw hole 7a via the cover attachment hole 9a and the plate attachment hole 8a, and 10b denotes a screw hole that attaches to the screw hole 7b via the cover attachment hole 9b and the plate attachment hole 8b in the same manner as the attachment screw 10a. , 11a and 11b are plate base mounting screw holes which are provided on the same surface as the housing through hole 1a of the housing 1 and to which the plate base 5 is mounted.
[0015]
Reference numerals 12a and 12b denote plate base mounting holes for mounting the plate base 5 in contact with the housing 1, and are screwed to the plate base mounting screw holes 11a and 12b by plate mounting screws 13a and 14b. The plate base mounting holes 12a and 12b are free from play with the diameters of the plate mounting screws 13a and 13b when the plate base 5 is mounted, so that the reflected light from the recording medium is accurately reflected on the light receiving element 2. It is configured to be adjusted and screwed to receive light.
[0016]
14 is a Z-axis adjustment hole for adjusting the plate base 5 in the Z-axis direction, 16 is screwed into the Z-axis adjustment hole 14, and the tip of the screw presses against the contact surface 16 of the housing 1. The base 5 is configured to be displaced in the Z-axis direction so that the light receiving element 2 accurately receives the reflected light from the recording medium.
[0017]
Next, the assembly method will be described. First, the light receiving surface of the light receiving element 2 in which the flexible printed circuit board 3 is bonded and connected to the mounting recess 4a provided in the plate 4 is connected to the detection portion 2a of the light receiving element 2 and the plate through hole 4b. Match and loose fit. The light receiving element 2 and the plate 4 are bonded together by loosely fitting and holding the close contact state, and filling the bonding hole 4c with UV bonding, that is, filling with an adhesive and curing.
[0018]
The plate 4 on which the light receiving element 2 is mounted holds a state in which the cover 6 is pressed from the back of the light receiving element 2 to which the flexible printed circuit board 3 is bonded, and is attached via the cover mounting hole 9a and the plate mounting hole 8a by the mounting screw 10a. Screwed into the screw hole 7a. Similarly, the mounting screw 10b is screwed to the screw hole 7b through the cover mounting hole 9b and the plate mounting hole 8b. In the state in which the plate base 5 to which the components are attached in this manner further aligns the housing through hole 1a and the plate base translucent light 5a, the plate mounting screws 13a and 14b are connected to the plate base mounting screws 12a and 12b. It is attached to the holes 11a and 12b.
[0019]
Next, when the Z-axis adjusting screw 15 is screwed through the Z-axis adjusting hole 14 and the contact surface 16 is pressed, the plate base 5 is urged in the Z-axis direction, and the light receiving element 2 receives reflected light from the recording medium. The Z-axis adjusting screw 15 is adjusted so that the optical axis accurately irradiates the light receiving element 2.
[0020]
As a result, the reflected light from the recording medium is irradiated from the housing through hole 1a through the plate base through hole 5a and the plate through hole 4b to the detection unit 2a of the light receiving element 2.
[0021]
【The invention's effect】
The present invention adheres a light receiving element to a plate by filling an adhesive into a bonding hole of the plate in a state where a light receiving surface of the light receiving element is in close contact with a recess provided in a plate having excellent thermal conductivity and heat dissipation. Thus, the assembling work for adhering the light receiving element to the plate is simplified, and the heat generated by the light receiving element can be effectively transmitted to the plate and dissipated.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a main part of an optical pickup device showing an embodiment of the present invention.
2 is a cross-sectional view taken along the line AA ′ in a state where a light receiving element is bonded and fixed to the frame shown in FIG. 1;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Housing 2 Light receiving element 2a Detection part 4 Plate 4a Mounting recessed part 4b Plate through-hole 4c Bonding hole 5 Plate base

Claims (1)

レーザー素子より放射するレーザービームを対物レンズにより収束さて記録媒体に照射し、前記記録媒体からの反射光を受光素子にて受光する光ピックアップ装置であり、各種光学部品が組込まれるハウジングに熱伝導性及び放熱性に優れたプレートを取付け、該プレートに受光素子が遊嵌される凹部を設けるとともに、該凹部内に前記反射光が通過する孔と接着孔を設け、該凹部内の反射光が通過する孔と受光素子の検出部が一致するように遊嵌させた状態で前記接着孔内に充填する接着剤により該プレートに受光素子を密着して接着したことを特徴とする光ピックアップ装置。The laser beam emitted from the laser element is irradiated on a recording medium by converging by the objective lens, an optical pickup device that received by the light receiving element the reflected light from the recording medium, the heat in a housing that various optical components are incorporated A plate having excellent conductivity and heat dissipation is attached, and a concave portion in which the light receiving element is loosely fitted is provided in the plate , and a hole and an adhesive hole through which the reflected light passes are provided in the concave portion, and the reflected light in the concave portion is provided. An optical pickup device characterized in that a light receiving element is adhered and adhered to the plate with an adhesive filling the adhesive hole in a state in which the hole through which the light passes and the detection portion of the light receiving element are loosely fitted. .
JP2001032757A 2001-02-08 2001-02-08 Optical pickup device Expired - Fee Related JP3778799B2 (en)

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JP3778799B2 true JP3778799B2 (en) 2006-05-24

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JP2010277625A (en) * 2009-05-27 2010-12-09 Pioneer Electronic Corp Photodetector, optical pickup, and optical recording and reproducing device
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