JP3756154B2 - Image sensor with excellent sensing effect - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an image sensor having a kind of good sensing function, and more particularly to an image sensor in which an image sensing chip is installed flat and has a good sensing function.
[0002]
[Prior art]
FIG. 1 is a display diagram of a known image sensor package structure, which includes a substrate 10, which has a first surface 12 and a second surface 14, and a signal input end 15 is formed on the first surface 12. The signal output end 16 is formed on the second surface 14. The convex edge layer 18 includes an upper surface 20 and a lower surface 22, and the lower surface 22 is bonded onto the first surface 12 of the substrate 10 to form the groove 10 with the substrate 10. The image sensing chip 26 is provided in the concave groove 24 formed by the substrate 10 and the convex edge layer 18, and is fixed on the first surface 12 of the substrate 10. The plurality of conductive wires 28 include a first end point 30 and a second end point 32, the first end point 30 is electrically connected to the image sensing chip 26, and the second end point 32 is electrically connected to the signal input end 15 of the substrate 10. It is connected. The light transmitting layer 34 is bonded to the upper surface 20 of the convex edge layer 18.
[0003]
When the first surface 12 of the substrate 10 is uneven or the flat condition cannot be achieved, the image sensing chip 26 cannot be fixed flat on the substrate 10, so that the sensing effect of the image sensing chip 26 becomes poor. .
[0004]
[Problems to be solved by the invention]
For this reason, a structure of an image sensor having a good image sensing function is required.
[0005]
A main object of the present invention is to provide a structure of an image sensor having a good sensing effect, which has a function of fixing an image sensing chip flat and achieves a good sensing effect.
[0006]
[Means for Solving the Problems]
The invention of claim 1 is an image sensor having an excellent sensing effect.
A substrate having an upper surface and a lower surface, provided with a plurality of signal input ends on a peripheral edge of the upper surface, and provided with a plurality of convex portions having the same height at a central portion of the upper surface;
Is a rail-shaped structure, are installed on the periphery of the substrate comprises a groove wherein the substrate and the cross-section to form a U-shape, and the said plurality of signal input terminals and a plurality of said Totsukatamari of the substrate A convex edge layer positioned in the groove,
Comprises a plurality of bonding pads, and the image sensing chip which is installed on the Totsukatamari formed on the upper surface of the substrate,
A plurality of wires for electrically connecting the bonding pads of the image sensing chip to the signal input end of the substrate,
A translucent layer installed on the convex edge layer and covering the image sensing chip;
It is an image sensor with an excellent sensing effect.
According to a second aspect of the present invention, in the image sensor having the excellent sensing effect according to the first aspect, the substrate includes a plurality of mutually arranged metal pieces and one intermediate plate, and the intermediate plate has a plurality of perforations. is provided, it is coated these metal pieces and the intermediate plate in the injection material by an injection molding method, and exposed from the injection-material these metal pieces to form a plurality of signal output terminals and said plurality of signal input terminals, and wherein the injecting material is projected from the perforation of the intermediate plate forms the Totsukatamari, and an image sensor that includes a superior sensing effect.
Invention 請 Motomeko 3, comprises an image sensor which includes a superior sensing effect according to claim 1, characterized in that the substrate and the convex edge layer was formed by injection molding method, an excellent sensing effect Image sensor.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
The present invention provides a kind of image sensor, which has an upper surface and a lower surface, a plurality of signal input ends formed at the periphery of the upper surface, and a plurality of convex portions of the same height formed at the central portion. And a bowl-shaped structure that is installed on the periphery of the substrate to form a U-shape with the substrate to form a groove, and a plurality of signal input ends and a plurality of convex masses on the substrate are formed into the groove. A convex edge layer positioned inside, an image sensing chip installed on a convex lump formed on the upper surface of the substrate, and a plurality of electrically connecting the image sensing chip to a signal input end of the substrate A conductive wire and a translucent layer that covers the image sensing chip on the convex edge layer are provided.
[0008]
In this way, the image sensing chip is installed on the convex block of the substrate, thereby obtaining good flatness and having an excellent sensing function.
[0009]
【Example】
2 and 3 are sectional views of the image sensor of the present invention. As shown in the figure, the present invention includes a substrate 40, a convex edge layer 42, an image sensing chip 44, a plurality of conductive wires 46, and a light transmitting layer 48. It has.
[0010]
The substrate 40 is composed of a plurality of metal pieces 50 and an intermediate plate 52, and a plurality of perforations 53 are provided in the intermediate plate 52, and the plurality of metal pieces 50 and the intermediate plate 52 are covered with an injection material by an injection molding method. Thus, an upper surface 54 and a lower surface 55 are formed on the substrate 40, and a first plate 56, a second plate 58 and a third plate 60 are provided on each one metal piece 50, and the first plate 56 is the upper surface of the substrate 40 54 is exposed to form a signal input end, and the second plate 58 is exposed from the lower surface 55 of the substrate 40 to form a signal output end. Convex lump 68 that protrudes into the area is formed.
[0011]
The convex edge layer 42 has a saddle-shaped structure, which is joined to the substrate 40 by an injection molding method, is located at the periphery of the substrate 40, forms a U-shape with the substrate 40, and has a concave groove 62. The first plate 56 (signal input end) and the plurality of convex lumps 68 are positioned in the concave groove 62, and a concave chamber 64 is formed at the upper end thereof.
[0012]
A plurality of bonding pads 66 are provided on the image sensing chip 44, and the image sensing chip 44 is installed on a convex block 68 formed on the upper surface 54 of the substrate 40. As a result, the plurality of protrusions 68 are formed at the same height, so that the image sensing chip 44 is flatly fixed on the substrate 40, that is, even when the upper surface 54 of the substrate 40 is uneven. The image sensing chip 44 can be positioned flat, and a good sensing effect can be obtained.
[0013]
A plurality of conductive wires 46 are used to electrically connect the bonding pads 66 of the image sensing chip 44 to the first plate 56 (signal input end) of the substrate 40.
[0014]
The light transmissive layer 48 is made of light transmissive glass, which covers the inside of the concave chamber 64 formed by the convex edge layer 42 and covers the image sensing chip 44.
[0015]
The following is the manufacturing process of this example. Please refer to FIG. First, a plurality of mutually arranged metal pieces 50 are provided, a first plate 56, a second plate 58, and a third plate 60 are formed on each metal piece 50 by a pressurization method, and the intermediate plate 52 is set to correspond to two. It is installed in the middle of the metal piece 50 to be used.
[0016]
As shown in FIG. 4, each metal piece 50 and the intermediate plate 52 are covered with an injection material by an injection molding method, the substrate 40 and the convex edge layer 42 are formed, and the first metal piece 50 is first formed. The plate 56 is exposed from the upper surface 54 of the substrate 40 to be a signal input end, the second plate 58 is exposed from the lower surface of the substrate 40 to be a signal output end, and the substrate is placed in the perforation 53 of the intermediate plate 52. A convex mass 68 protruding from the upper surface 54 of 40 is formed, and each single convex mass 68 has the same height.
[0017]
【The invention's effect】
Thus, when the image sensing chip 44 is placed on the convex block 68 of the substrate 40, since the plurality of convex blocks 68 are formed by the injection molding method, all are precisely controlled at the same altitude. Even if the upper surface 54 of the fork 40 is uneven, the image sensing chip can be fixed flat, whereby the image sensing chip can have a good sensing effect.
[0018]
The above description does not limit the scope of the present invention, and any modification or alteration in detail that can be made based on the present invention shall belong to the claims of the present invention.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a known image sensor package structure.
FIG. 2 is a combined sectional view of the present invention.
FIG. 3 is a first display diagram of the present invention.
FIG. 4 is a second display diagram of the present invention.
[Explanation of symbols]
40 Substrate 42 Convex edge layer 44 Image sensing chip 46 Conductive wire 48 Translucent layer 50 Metal piece 52 Intermediate plate 53 Perforation 54 Upper surface 55 Lower surface 56 First plate 58 Second plate 60 Third plate 62 Concave groove 64 Concave chamber 66 Bonding Pad 68

Claims (3)

In image sensor with excellent sensing effect,
A substrate having an upper surface and a lower surface, provided with a plurality of signal input ends on a peripheral edge of the upper surface, and provided with a plurality of convex portions having the same height at a central portion of the upper surface;
Is a rail-shaped structure, are installed on the periphery of the substrate comprises a groove wherein the substrate and the cross-section to form a U-shape, and the said plurality of signal input terminals and a plurality of said Totsukatamari of the substrate A convex edge layer positioned in the groove,
Comprises a plurality of bonding pads, and the image sensing chip which is installed on the Totsukatamari formed on the upper surface of the substrate,
A plurality of wires for electrically connecting the bonding pads of the image sensing chip to the signal input end of the substrate,
A translucent layer installed on the convex edge layer and covering the image sensing chip;
An image sensor with an excellent sensing effect. 2. An image sensor having an excellent sensing effect according to claim 1, wherein the substrate includes a plurality of mutually arranged metal pieces and one intermediate plate, and the intermediate plate is provided with a plurality of perforations, and an injection molding method. the coated these metal pieces and the intermediate plate by an injection material, and the metal piece is exposed from the injection-material to form a plurality of signal output terminals and said plurality of signal input terminals, and the injection material between intermediate plate characterized in that projecting from the perforation forming the Totsukatamari, image sensor equipped with superior sensing effect.   2. The image sensor having an excellent sensing effect according to claim 1, wherein the substrate and the convex layer are formed by an injection molding method.

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