JP3730765B2 - Molten solder jet device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a molten solder jet device for a jet solder bath.
[0002]
[Prior art]
As shown in Japanese Patent Publication No. 59-5392, a conventional molten solder jet apparatus directly fixes a nozzle for molten solder jet to a molten solder supply portion that receives pressurized supply of molten solder from a pump.
[0003]
[Problems to be solved by the invention]
With this type of nozzle, it is not easy to adjust the level of the workpiece conveyed on the nozzle. For example, if the workpiece transfer level or transfer angle is changed, or if the nozzle removal operation is repeated during maintenance, the nozzle level is likely to be distorted, which is an obstacle to continued good soldering. .
[0004]
The present invention has been made in view of these points, and an object of the present invention is to provide a molten solder jet device that can easily level the nozzle for molten solder jet and can maintain level reproducibility. is there.
[0005]
[Means for Solving the Problems]
請 Motomeko invention described in 1, and the molten solder to be supplied portion for receiving a pressurized supply of molten solder, the adjusting plate, wherein fitted into the molten solder supply target portion, said by the molten solder to be supplied portion on A nozzle for a molten solder jet detachably fixed to an adjustment plate, an adjustment mechanism for adjusting a vertical position and an inclination angle of the adjustment plate with respect to the molten solder supply portion, the molten solder supply portion, and the adjustment A leak prevention body having elasticity interposed in a fitting gap with the plate, and the adjustment mechanism is adjusted in height by being screwed vertically to the adjustment plate on one side and the other side of the nozzle, respectively. It is a molten solder jet device comprising a screw and a fixing screw that presses and fixes the lower ends of these height adjustment screws to members in place.
[0006]
Then, the vertical position and inclination angle of the nozzle are adjusted by adjusting the vertical position and inclination angle of the adjustment plate with respect to the molten solder supply portion by the adjustment mechanism. At this time, while preventing solder leakage, etc. inclination angle adjustment of the nozzle Permitted at the gap ability from the fitting clearance by the leakage prevention member and the molten solder to be supplied portion and said adjustment plate having elasticity It becomes. In particular, by adjusting the mounting height of the adjustment plate with the height adjustment screws on one side and the other side of the nozzle, the conveyance angle of the work carried in from one side of the nozzle and carried out from the other side can be adjusted. Respond to changes. Even if the nozzle detaching operation is repeated by detaching the fixing screw, the level reproducibility of the nozzle can be ensured unless the height adjusting screw is moved.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIG. 1 and another embodiment with reference to FIG.
[0008]
As shown in FIG. 1, solder melted by a heater (not shown), that is, molten solder 12 is accommodated in a solder tank 11. In the solder tank 11, an impeller pump 13 for sucking and discharging molten solder by, for example, rotating blades is provided.
[0009]
In the solder tank 11, a communication pipe 14 is provided as a molten solder supply portion that receives the pressurized supply of molten solder from the pump 13. The upper part of the communication pipe 14 is formed straight in the vertical direction.
[0010]
A cylindrical portion 16 formed at the central portion of the adjustment plate 15 is fitted to the upper portion of the communication pipe 14 so as to be movable up and down. A sufficient fitting gap 17 is provided between the upper portion of the communication pipe 14 and the cylindrical portion 16 of the adjustment plate 15 on the workpiece carry-in side and the workpiece carry-out side. Each of the leak prevention bodies 18 having the property is interposed.
[0011]
The leak prevention body 18 shown in the figure is a pair of leaf springs bent in a substantially U-shape. The mounting portion 21 is fixed to the inner wall surface of the cylindrical portion 16 of the adjustment plate 15 with a screw and the communication tube 14 side. The narrowed portion 22, the seal portion 23 that comes into contact with the communication pipe 14, and the opening portion 24 that is folded back through the seal portion 23 so as to expand downward are sequentially bent.
[0012]
The leak prevention body 18 may be replaced by not only a leaf spring but also heat-resistant rubber.
[0013]
The adjustment plate 15 is integrally provided with a horizontal nozzle mounting portion 25 on the upper side of the cylindrical portion 16, and a horizontal adjustment mechanism mounting portion 27 is integrally provided on the nozzle mounting portion 25 via a vertical plate portion 26. Yes.
[0014]
A nozzle 28 for molten solder jet is detachably fixed to the nozzle mounting portion 25 of the adjustment plate 15 by a screw 29 coaxially with the communication pipe 14. A porous plate 32 is attached to the upper surface opening 31 of the nozzle 28, and the protruding solder waves 34 are irregularly jetted from a large number of holes 33 formed in the porous plate 32.
[0015]
On the upper side of the solder bath 11, a conveyor 35 for conveying a workpiece W such as a component mounting board on the upper side of the perforated plate 32 is disposed. The conveyor 35 conveys the workpiece W by sandwiching the workpiece W between conveying claws protruding from a pair of endless chains that are elongated.
[0016]
An adjustment mechanism 36 that adjusts the vertical position and the inclination angle of the adjustment plate 15 with respect to the communication pipe 14 is provided on the adjustment mechanism attachment portion 27 that is located on the workpiece carry-in side and the workpiece carry-out side from the nozzle attachment portion 25 of the adjustment plate 15. It has been.
[0017]
These adjustment mechanisms 36 include a height adjustment screw 37 screwed in the vertical direction to each adjustment mechanism mounting portion 27 of the adjustment plate 15, and a lower end of these height adjustment screws 37 on the inner surface of the solder bath 11, respectively. It is provided with a fixing screw 39 which is pressed against and fixed to a receiving plate 38 as a fixed-position member attached integrally.
[0018]
The height adjusting screw 37 has a hexagonal convex portion 41 that is rotated by a tool such as a box driver at the upper end of the screw, and the fixing screw 39 is a hexagonal head that is rotated by a tool such as a box driver. The portion 42 is engaged with the adjustment mechanism mounting portion 27 of the adjustment plate 15, and the screw shaft portion is screwed into the receiving plate 38.
[0019]
Next, the operation of the embodiment shown in FIG. 1 will be described.
[0020]
Loosen the fixing screw 39 of the adjusting mechanism 36, adjust the vertical position and inclination angle of the adjusting plate 15 with respect to the communication pipe 14 by turning the height adjusting screw 37, and finally tighten the fixing screw 39 to By fixing the adjustment state by the height adjusting screw 37, the vertical position and inclination angle of the nozzle 28 are adjusted.
[0021]
For example, when the height adjustment screws 37 on the workpiece carry-in side and the workpiece carry-out side of the nozzle 28 are rotated equally to adjust the mounting heights on the work carry-in side and the workpiece carry-out side of the adjustment plate 15 respectively, The distance 28 between the perforated plate 32 and the workpiece W can be adjusted by moving and adjusting 28 only in the vertical direction.
[0022]
In this case, the seal part 23 of the elastic leak prevention body 18 slides on the outer surface of the communication pipe 14 and prevents solder leakage from the fitting gap 17 between the communication pipe 14 and the cylindrical part 16 of the adjusting plate 15. To do. The inclined shapes of the throttle portion 22 and the opening portion 24 of the leak preventing body 18 make the movement of the seal portion 23 sliding on the outer surface of the communication pipe 14 smooth.
[0023]
On the other hand, the amount of rotation of the height adjustment screw 37 is made different on the work carry-in side and the work carry-out side of the nozzle 28, and the vertical adjustment amount of the adjustment mechanism mounting portion 27 is made different on the work carry-in side and the work carry-out side of the adjustment plate 15. By doing so, the inclination angle of the nozzle 28 and the porous plate 32 can be adjusted.
[0024]
In this case, the elastic leak prevention body 18 is deformed freely when the throttle portion 22 receives a pressing force from the communication pipe 14, and the seal portion 23 is always in contact with the outer surface of the communication pipe 14. Since solder leakage from the fitting gap 17 between the cylinder 14 of the adjustment plate 15 and the adjustment plate 15 is prevented, the inclination angle of the nozzle 28 and the porous plate 32 can be adjusted within the range of the fitting gap 17.
[0025]
For this reason, even when the conveyance angle of the work W carried in from the right side of the nozzle 28 and carried out from the left side is changed, the change can be easily handled. Moreover, even if the nozzle attaching / detaching operation is repeated by attaching / detaching the fixing screw 39 for maintenance or the like, the level reproducibility of the nozzle 28 can be ensured unless the height adjusting screw 37 is moved.
[0026]
Next, FIG. 2 is an example in which the present invention is applied to an electromagnetic induction pump type solder bath. In this figure, parts similar to those in FIG.
[0027]
The solder tank 11 is supported by a frame 52 integrally provided on the base 51, and electromagnetic induction pumps 53 and 54 are provided on the work carry-in side and the work carry-out side of the solder tank 11, respectively.
[0028]
These electromagnetic induction pumps 53 and 54 are configured to wind a large number of induction coils 56 in the vertical direction along the outer surface of the vertical plate portion 55 of the side concave portion provided on the work carry-in side and the work carry-out side of the solder tank 11. A primary core 57 made of an E-shaped laminated iron core is fixed in close contact with the vertical plate portion 55, and on the other hand, inside the vertical plate portion 55, in the vertical direction via a molten solder rising gap 58, an I-type laminated iron core Secondary iron cores 59 made of each are arranged.
[0029]
A suction port 61 is provided at the lower end portion of the secondary iron core 59, and a nozzle mounting base portion 62 as a molten solder supply portion is integrally provided at the upper end portion of the secondary iron core 59. Thus, the discharge port 63 of the molten solder rising gap 58 is opened, and the adjustment plate 15a, 15b of the adjustment plate 15a, 15b is connected to the outer portion 62a formed straight in the vertical direction by the nozzle mounting portion 62 via the elastic leak prevention body 18. The cylindrical portion 16 is fitted, and the primary nozzle 64 and the secondary nozzle 65 are respectively attached via the adjusting plates 15a and 15b.
[0030]
A fitting gap 17 between the outer side portion 62a of the nozzle mounting base portion 62 and the cylindrical portion 16 of the adjusting plates 15a and 15b is closed by a leak preventing body 18 attached to the cylindrical portion 16.
[0031]
The primary nozzle 64 has a perforated plate 32 at its upper surface opening, and a large number of irregular solder waves are jetted through the perforated plate 32. The secondary nozzle 65 has fins 66 that guide the molten solder in a direction opposite to the workpiece conveyance direction.
[0032]
The adjustment plate 15a of the primary nozzle 64 is provided between the receiving plate 38a integrated on the work carry-in side of the solder tank 11 and the receiving plate 38b integrated at the center of the solder tank 11, and the secondary nozzle 65 adjustment plates 15b are provided between the receiving plate 38b integrated at the center of the solder bath 11 and the receiving plate 38c integrated on the work carry-out side of the solder bath 11, respectively. The adjustment screw 37 and the fixing screw 39 are provided so that the vertical position and the inclination angle can be adjusted, as in FIG.
[0033]
A solder melting heater 67 common to the electromagnetic induction pumps 53 and 54 on both sides is arranged in the vertical direction at the center of the solder bath 11. The heater 67 is a sheathed heater that is long in the work transfer direction (perpendicular to the paper surface of FIG. 2).
[0034]
Next, the operation of the embodiment shown in FIG. 2 will be described.
[0035]
The electromagnetic induction pumps 53 and 54 move into the molten solder rising gap 58 by supplying alternating currents such as three-phase alternating current to the induction coils 56 arranged in the vertical direction along the molten solder rising gap 58. A magnetic field is generated, an electromotive force is generated by electromagnetic induction in the conductive molten solder in the molten solder rising gap 58, and a current due to the electromotive force of the molten solder flows in the magnetic flux of the moving magnetic field. An upward thrust is generated in the molten solder in 58, and the molten solder is moved upward.
[0036]
As a result, the molten solder melted by the common heater 67 is sucked from the respective suction ports 61 by the respective electromagnetic induction pumps 53 and 54, and rises in the molten solder rising gap 58 along the vertical plate portion 55 of the solder tank 11. And it discharges from each discharge port 63, and also jets from the primary nozzle 64 and the secondary nozzle 65, and performs the primary soldering and secondary soldering of the workpiece | work W, respectively.
[0037]
The adjustment method of the vertical position and the inclination angle of the primary nozzle 64 and the secondary nozzle 65 is the same as that in FIG.
[0038]
【The invention's effect】
According to the invention 請 Motomeko 1 wherein, engaged adjusting plate is fitted to the molten solder supply target portion for receiving a pressurized supply of molten solder, a nozzle for the molten solder jets into the molten solder supply target portion on the adjustment plate Because the adjustment plate adjusts the vertical position and inclination angle of the adjustment plate with respect to the molten solder supply part, the vertical position and inclination angle of the nozzle can be finely adjusted, and the level of the nozzle relative to the workpiece can be adjusted. Easy and accurate. At this time, since a leakage prevention body having elasticity is interposed in the fitting gap between the molten solder supply portion and the adjustment plate, the fusion of the molten solder supply portion and the adjustment plate is achieved by this elastic leakage prevention body. It is possible to adjust the tilt angle of the nozzle in the fitting gap while preventing leakage of solder from the gap and efficiently utilizing the jet energy of the molten solder pressurized and supplied to the molten solder supply portion. In particular, the adjustment mechanism is fixed by pressing the height adjustment screws screwed in the vertical direction to the adjustment plate on one side and the other side of the nozzle, respectively, and the lower ends of these height adjustment screws against the members in place. Since the fixing screw is provided, the work is carried in from one side of the nozzle and carried out from the other side by adjusting the mounting level of the adjusting plate with the height adjusting screws on one side and the other side of the nozzle. In addition to easily changing the angle, nozzle level reproducibility can be ensured as long as the height adjustment screw is not moved, even if the nozzle removal operation is repeated by removing the fixing screw.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of a molten solder jet device according to the present invention.
FIG. 2 is a cross-sectional view showing another embodiment of a molten solder jet device according to the present invention.
[Explanation of symbols]
12 Molten solder
14 Communication pipe as molten solder supply section
15 Adjustment plate
17 Mating gap
18 Leak preventer
28 nozzles
36 Adjustment mechanism
37 Height adjustment screw
39 Fixing screw

Claims (1)

A molten solder supply section that receives pressure supply of molten solder;
An adjusting plate fitted to the molten solder supply portion;
A nozzle for a molten solder jet detachably fixed to the adjustment plate on the molten solder supply section;
An adjustment mechanism for adjusting a vertical position and an inclination angle of the adjustment plate with respect to the molten solder supply portion;
A leakage preventing body having elasticity interposed in a fitting gap between the molten solder supply portion and the adjustment plate;
The adjustment mechanism is
A height adjustment screw screwed in the vertical direction to the adjustment plate on one side and the other side of the nozzle,
Molten solder ejection device you characterized by comprising respectively a fixing screw for fixing by pressing the member position the lower end of these height adjusting screw.

Images