JP3708843B2 - Transmission / reception end circuit device - Google Patents

Transmission / reception end circuit device Download PDF

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JP3708843B2
JP3708843B2 JP2001175487A JP2001175487A JP3708843B2 JP 3708843 B2 JP3708843 B2 JP 3708843B2 JP 2001175487 A JP2001175487 A JP 2001175487A JP 2001175487 A JP2001175487 A JP 2001175487A JP 3708843 B2 JP3708843 B2 JP 3708843B2
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circuit
transmission
circuit system
filter
reception
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JP2002033674A (en
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信也 中井
伊藤　　誠
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TDK Corp
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TDK Corp
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Description

【０００１】
【産業上の利用分野】
本発明は、送受信端回路装置に関し、より詳しくは、例えば携帯電話，コードレス電話等の移動通信機器における送受信端に適用して好適な送受信端回路装置に関する。
【０００２】
【従来の技術】
例えば、１．９ＧＨｚ帯の高周波を用いる移動通信機器における送受信端回路装置として、従来、図７に示すものが知られている。
【０００３】
同図に示す送受信端回路装置５０は、１．９ＧＨｚ帯の電波をアンテナ５１により受信して電気信号に変換し、高周波スイッチ５２を介して前記電気信号を取り込んで高周波アンプ５３，バンドパスフィルタ５４，ミキサ回路５５により信号処理して後段の図示しない中間周波処理回路に導くようになっている。
【０００４】
ところで、上述した送受信端回路装置５０の場合、高周波アンプ５３，バンドパスフィルタ５４，ミキサ回路５５を各々図８に示すようにガラスエポキシ基板（又はアルミナ等のセラミック基板）６１，６２，６３に各々チップ部品を用いて組み込む構成としている。
【０００５】
このため、高周波アンプ５３を組み込むガラスエポキシ基板６１として９８mm2（７×１４mm）程度、バンドパスフィルタ５４を組み込むガラスエポキシ基板６２として４９mm2（７×７mm）程度、ミキサ回路５５を組み込むガラス基板６３として１１２mm2（７×１６mm）程度の占有面積が必要となり、結局全体では２５９ｍｍ2程度の占有面積となってしまい、移動通信機器の大型化を招くという問題があった。
【０００６】
【発明が解決しようとする課題】
本発明は、上述した事情に鑑みてなされたものであり、占有面積の大幅な縮減が可能で、移動通信機器の小型化に寄与し得る送受信端回路装置を提供することを目的とするものである。
【０００７】
【課題を解決するための手段】
請求項１に記載の発明は、（１）送信回路系と受信回路系とを切り替える高周波スイッチ、アイソレータ、サーキュレータ、及びフィルタの内の少なくとも高周波スイッチを含んで構成されるアンテナ回路系と、送信アンプ、ミキサ回路、及びローパス又はバンドパスのフィルタの内の少なくともフィルタを含んで構成される送信回路系と、前記の回路系を支持する、前記の回路系の所定の接地される箇所と電気的に接続された複数の接地電極が４つの側面上にそれぞれ形成され、かつ、前記の回路系の所定の箇所と接続された複数の非接地電極が側面上に形成された積層基板と、前記積層基板内に積層された、少なくとも 1 層が、前記接地電極に接続される４方向への引き出し電極を有し、かつ、前記積層基板の１層のほぼ全面に形成された単一の連続導体層からなる接地層と、を具備した高周波帯に用いられる面実装型の送受信端回路装置であって、前記回路系中の一部の回路部は、前記積層基板中に組み込まれ、及び前記回路系中の残余の回路部は、チップ部品を用いて構成され、かつ、前記積層基板上に搭載される、ことを特徴とする。
【０００８】
請求項２に記載の発明は、請求項１に記載の発明の特徴に加えて、（１）高周波アンプ、ミキサ回路、及びフィルタの内の少なくともフィルタを含んで構成される受信回路系、を更に有することを特徴とする。
【００１３】
【作用】
上述した構成の送受信端回路装置によれば、送信回路系と受信回路系とを切り替える高周波スイッチ、アイソレータ、サーキュレータ、及びフィルタの内の少なくとも高周波スイッチを含んで構成されるアンテナ回路系と、送信アンプ、ミキサ回路、及びローパス又はバンドパスのフィルタの内の少なくともフィルタを含んで構成される送信回路系と、前記の回路系を支持する、前記の回路系の所定の接地される箇所と電気的に接続された複数の接地電極が４つの側面上にそれぞれ形成され、かつ、前記の回路系の所定の箇所と接続された複数の非接地電極が側面上に形成された積層基板と、前記積層基板内に積層された、少なくとも 1 層が、前記接地電極に接続される４方向への引き出し電極を有し、かつ、前記積層基板の１層のほぼ全面に形成された単一の連続導体層からなる接地層と、を具備した高周波帯に用いられる面実装型の送受信端回路装置であって、前記回路系中の一部の回路部は、前記積層基板中に組み込まれ、及び前記回路系中の残余の回路部は、チップ部品を用いて構成され、かつ、前記積層基板上に搭載される、ことを特徴とするものであるから、送信回路系と受信回路系とでアンテナ回路系を共有することができ、更にアンテナ回路系と送信回路系とが積層基板に関して集積されるため、本体のみの占有面積で高周波回路における処理を一貫して行うことが可能となり、それを搭載する移動通信機器の小型化を実現できる。
【００１４】
また、高周波アンプ、ミキサ回路、及びフィルタの内の少なくともフィルタを含んで構成される受信回路系、を更に有するため、アンテナ回路系と送信回路系と受信回路系とが積層基板に関して集積され、本体のみの占有面積で高周波回路における処理を更に一貫して行うことが可能となり、それを搭載する移動通信機器のさらなる小型化を実現できる。
【００１６】
【実施例】
以下に、本発明の実施例を詳細に説明する。
【００１７】
図1に示す送受信端回路装置1は、例えば１．９ＧＨｚの高周波回路を用いる携帯電話、コードレス電話等の移動通信機器に使用されるものであり、図2に示すように、平面の面積が８５mm2（５mm×１７mm）の接地層と接地層以外の複数の電極層を積層してなる積層基板を用いた本体2に高周波帯で使用する複数の回路部のうち、少なくとも一つの回路部を組み込むとともに、複数の回路部のうちチップ部品を用いて構成した例えば2種の回路部を本体2上に搭載したものである。
【００１８】
前記本体２の外周には、接地電極Ｇ，高周波入力用の入力電極３，後述するバンドパスフィルタ１５用のフィルタ入力電極４，フィルタ出力電極５，フィルタタップ電極６，７，電源用電極８，９，ローカル信号電極１０，中間周波数出力電極１１を各々本体２の少なくとも下面に至るように設けて、面実装型としている。
【００１９】
本体2に組み込む回路部は、図４に等価的に示す１．９ＧＨｚ帯のバンドパスフィルタ１５としている。また、本体２に搭載する２種の回路部は、バンドパスフィルタ１５の前段に配置するトランジスタＴＲ，抵抗Ｒ，コンデンサC等のチップ部品を用いた高周波アンプ１４及び後段に配置するミキサ回路１６としている。
【００２０】
ここで、前記本体２及びバンドパスフィルタ１５について図３を参照して詳述する。
【００２１】
この本体２は、図３に示すように、平面の面積が８５mm2（５mm×１７mm）と同一の第１乃至第５の基板（ガラス基板又はセラミック基板）２１乃至２５を積層し、その外周に既述した接地電極G，入力電極３，フィルタ入力電極４，フィルタ出力電極層５，フィルタタップ電極６，７，電源用電極８，９，ローカル信号電極１０，中間周波数出力電極１１を設けたものである。
【００２２】
最上部の第１の基板２１上には、前記高周波アンプ１４及びミキサ回路１６を搭載するようになっている。
【００２３】
前記第2の基板２２の上面には、図３に示すように、長方形状の接地層３１が形成され、この接地層３１の両端部は本体２の両端面に形成した接地電極Gに接続し、また、接地層３１の両側部は本体２の両側面に形成した合計５箇所の接地電極Gに各々接続している。
【００２４】
また、上から３番目の第３の基板２３の上面には、フィルタタップ電極７，６に各々接続され、後述する第１，第２の容量電極層２６ａ，２６ｂに対応する領域まで展開した第３，第４の容量電極層２７ａ，２７ｂを形成している。
【００２５】
上から４番目の第４の基板２４の上面には、フィルタ入力電極４，フィルタ出力電極５に各々接続され、この第３の基板２３の上面に対称形状に展開した第１，第２の容量電極層２６ａ，２６ｂを形成している。
【００２６】
そして、第１の容量電極層２６ａと第３の容量電極層２７ａとの重なり領域により、図４に示す入力コンデンサＣ１を形成し、第２の容量電極層２６ｂと第４の容量電極層２７ｂとの重なり領域により、図４に示す出力コンデンサＣ２を形成している。
【００２７】
さらに、第３の容量電極層２７ａと前記接地層３１との重なり領域により、並列コンデンサＣ３を、第４の容量電極層２７ｂと前記接地層３１との重なり領域により、並列コンデンサＣ４を各々形成している。
【００２８】
前記第５の基板２５の上面には、本体２の端面に形成した接地電極Gに各々端部を接続した略L状のー対の導体層２８ａ，２８ｂが対称形状に形成され、コイル素子L１，Ｌ２を形成するようになっている。コイル素子Ｌ１，Ｌ２は、図４に示すように、相互インダクタンスMで磁気結合するようになっている。
【００２９】
そして、第５の基板２５の下面には、図３で最下欄に示すように、前記接地層３１と略同様な形状の接地層３１ａを形成している。
【００３０】
上述した各基板２１乃至２５を利用した立体的な構造により、平面の占有面積が８５mm2と従来例よりも大幅に小さい構成で高周波アンプ１４，バンドパスフィルタ１５，ミキサ回路１６の３種の回路部のー体構造を実現している。
【００３１】
図5は、前記送受信端回路装置１を用いた１．９ＧＨｚ帯の携帯電話の高周波回路ブロックを示すものであり、この高周波回路ブロックは、１．９ＧＨｚ帯の電波を送受信するアンテナ３１と、送受信用のバンドパスフィルタ３２と、送受信の切り換えを行う高周波スイッチ３３と、この高周波スイッチ３３に接続した送信回路系を構成する前記送受信端回路装置１と、この送受信端回路装置１の出力信号を処理する中間周波回路系３４と、前記高周波スイッチ３３に接続したアイソレータ３５又はサーキュレータと、前記アイソレータ３５に接続した送信回路系４１を構成する送信アンプ４０と、この送信アンプ４０に接続したバンドパスフィルタ３９と、バンドパスフィルタ３９に接続したミキサ回路３８と、このミキサ回路３８に接続したデータ入力回路系３６と、送受信端回路装置１のミキサ回路１６，送信回路系４１のミキサ回路３８に各々高周波信号を送り出すチャンネルコントロールを行うシンセサイザ回路系３７とを具備している。
【００３２】
前記送受信端回路装置１としては、上述した高周波アンプ１４，ミキサ回路１６を搭載する場合の他、前記高周波スイッチ３３，アイソレータ３５のうちから選ばれる任意の回路部を含む構成としてもよい。
【００３３】
以上詳述した送受信端回路装置１によれば、高周波帯で使用する複教の回路部、即ち、高周波アンプ１４，バンドパスフィルタ１５，ミキサ回路１６のうち、バンドパスフィルタ１５を第１乃至第５の基板２１乃至２５を用いた本体２に組み込み、高周波アンプ１４，ミキサ回路１６を第１の基板２１上に搭載したものであるから、前記本体２のみの占有面積８５mm2で高周波帯で使用する各回路部の機能を発揮させることができ、これにより、送受端回路装置１自体の占有面積を従来例より大幅に縮減して移動通信機器の小型化を実現できる。
【００３４】
また、前記残余の回路部を、高周波アンプ１４，高周波スイッチ３３，アイソレータ３５，ミキサ回路１６から選ぶことにより、少なくとも一つの回路部としてのバンドパスフィルタ１５及びこのバンドパスフィルタ１５の前後に配置される残余の回路部を前記本体２のみの占有面積で構成でき、これにより、送受信端回路装置１自体の占有面積を従来例より大幅に縮減しつつ１．９ＧＨｚ帯の携帯電話，コードレス電話等の移動通信機器を構成できる。
【００３５】
また、図６に示すように、送受信端回路装置１Ａを構成するための前記基板２１乃至２５に内蔵するものとしては、前記バンドパスフィルタ１５の一部または全部のみならず、アンテナ３１側のバンドパスフィルタ３２の一部または全部、さらには、シンセサイザ回路系３７の出力端に構成される図６に示すバンドパスフィルタ４２の一部または全部をも任意に組み合わせて内蔵することが可能である。
【００３６】
本発明は、上述した実施例に限定されるものではなく、その要旨の範囲内で種々の変形が可能である。
【００３７】
例えば、上述した実施例では、全てバンドパスフィルタを例にとって説明したが、同様な構造を有するものであれば例えばローパスフィルタでも適用可能である。また、前記バンドパスフィルタの構成要素は、伝送線路、インダクタンス素子、あるいはキャパシタンス素子である。従って、送受信端回路装置を構成する伝送線路、インダクタンス素子、あるいはキャパシタンス素子がフィルタを構成しているものに限らず、それらの一部または全部を、接地層と接地層以外の複数の電極層を積層してなる積層基板を用いた本体に組み込んで内蔵することができる。
【００３８】
さらに、上述した実施例では、受信回路系を前記基板２１乃至２５に組み込む場合を説明したが、同様な構成により送信回路系４１を構成することも可能である。同様に、アンテナと受信回路系、及び送信回路系を結ぶ回路系をアンテナ回路系（アンテナを含む）とすれば、該アンテナ回路系にも適用が可能であり、各回路系に伝送線路、インダクタンス素子、あるいはキャパシタンス素子があれば、それらの一部あるいは全部をにも適用が可能である。
【００３９】
【発明の効果】
以上詳述した本発明によれば、上述した構成としたので、以下の効果を奏する。
【００４０】
請求項１に記載の発明によれば、送信回路系と受信回路系とを切り替える高周波スイッチ、アイソレータ、サーキュレータ、及びフィルタの内の少なくとも高周波スイッチを含んで構成されるアンテナ回路系と、送信アンプ、ミキサ回路、及びローパス又はバンドパスのフィルタの内の少なくともフィルタを含んで構成される送信回路系と、前記の回路系を支持する、前記の回路系の所定の接地される箇所と電気的に接続された複数の接地電極が４つの側面上にそれぞれ形成され、かつ、前記の回路系の所定の箇所と接続された複数の非接地電極が側面上に形成された積層基板と、前記積層基板内に積層された、少なくとも 1 層が、前記接地電極に接続される４方向への引き出し電極を有し、かつ、前記積層基板の１層のほぼ全面に形成された単一の連続導体層からなる接地層と、を具備した高周波帯に用いられる面実装型の送受信端回路装置であって、前記回路系中の一部の回路部は、前記積層基板中に組み込まれ、及び前記回路系中の残余の回路部は、チップ部品を用いて構成され、かつ、前記積層基板上に搭載される、ことを特徴とするものであるから、送信回路系と受信回路系とでアンテナ回路系を共有することができ、更にアンテナ回路系と送信回路系とが積層基板に関して集積されるため、本体のみの占有面積で高周波回路における処理を一貫して行うことが可能となり、それを搭載する移動通信機器の小型化を実現できる送受信端回路装置を提供できる。
【００４１】
請求項２に記載の発明によれば、高周波アンプ、ミキサ回路、及びフィルタの内の少なくともフィルタを含んで構成される受信回路系、を更に有するため、アンテナ回路系と送信回路系と受信回路系とが積層基板に関して集積され、本体のみの占有面積で高周波回路における処理を更に一貫して行うことが可能となり、それを搭載する移動通信機器のさらなる小型化を実現できる送受信端回路装置を提供できる。
【図面の簡単な説明】
【図１】本発明の送受信端回路装置の実施例を示す斜視図
【図２】本実施例の送受信端回路装置における本体の占有面積を示す説明図
【図３】本実施例の送受信端回路装置における本体の分解斜視図
【図４】本実施例の送受信端回路装置における本体に組み込んだ回路部の等価回路図
【図５】本実施例の送受信端回路装置を使用した移動通信機器のー例の高周波回路ブロック図
【図６】本実施例の送受信端回路装置を使用した移動通信機器の他の例の高周波回路ブロック図
【図７】従来の送受信端回路装置を使用した高周波回路ブロック図
【図８】従来の送受信端回路装置の占有面積を示す説明図
【符号の説明】
１ 送受信端回路装置
２ 本体
１４ 高周波アンプ
１５ バンドパスフイルタ
１６ ミキサ回路
２１乃至２５ 基板
３２ バンドパスフイルタ
３３ 高周波スイッチ
３５ アイソレータ[0001]
[Industrial application fields]
The present invention relates to a transmission / reception terminal circuit device, and more particularly to a transmission / reception terminal circuit device suitable for application to a transmission / reception terminal in a mobile communication device such as a mobile phone or a cordless telephone.
[0002]
[Prior art]
For example, what is conventionally shown in FIG. 7 is known as a transmission / reception end circuit device in a mobile communication device using a high frequency of 1.9 GHz band.
[0003]
The transmission / reception end circuit device 50 shown in the figure receives a 1.9 GHz band radio wave by an antenna 51 and converts it into an electric signal, takes in the electric signal via a high frequency switch 52, and receives a high frequency amplifier 53 and a band pass filter 54. The signal is processed by the mixer circuit 55 and led to an intermediate frequency processing circuit (not shown) in the subsequent stage.
[0004]
By the way, in the case of the transmission / reception end circuit device 50 described above, the high frequency amplifier 53, the band pass filter 54, and the mixer circuit 55 are respectively placed on glass epoxy substrates (or ceramic substrates such as alumina) 61, 62, 63 as shown in FIG. It is configured to incorporate using chip parts.
[0005]
For this reason, the glass epoxy substrate 61 incorporating the high frequency amplifier 53 is about 98 mm 2 (7 × 14 mm), the glass epoxy substrate 62 incorporating the band-pass filter 54 is about 49 mm 2 (7 × 7 mm), and the glass substrate 63 incorporating the mixer circuit 55. As a result, an occupied area of about 112 mm 2 (7 × 16 mm) is required, and as a result, the entire occupied area is about 259 mm 2 , resulting in an increase in the size of the mobile communication device.
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a transmission / reception terminal circuit device capable of greatly reducing the occupation area and contributing to downsizing of a mobile communication device. is there.
[0007]
[Means for Solving the Problems]
The invention according to claim 1 is: (1) an antenna circuit system including at least a high-frequency switch among a high-frequency switch, an isolator, a circulator, and a filter that switches between a transmission circuit system and a reception circuit system; and a transmission amplifier A transmission circuit system including at least a filter of a mixer circuit and a low-pass or band-pass filter, and a predetermined grounded portion of the circuit system that supports the circuit system and electrically A laminated substrate in which a plurality of connected ground electrodes are respectively formed on four side surfaces, and a plurality of non-grounded electrodes connected to predetermined portions of the circuit system are formed on the side surfaces; and the laminated substrate At least one layer laminated inside has an extraction electrode in four directions connected to the ground electrode, and is formed on almost the entire surface of one layer of the laminated substrate. A surface-mounting type transmission / reception end circuit device used in a high-frequency band comprising a ground layer made of a single continuous conductor layer , wherein a part of the circuit unit in the circuit system is incorporated in the laminated substrate In addition, the remaining circuit portion in the circuit system is configured using a chip component and mounted on the multilayer substrate.
[0008]
According to a second aspect of the present invention, in addition to the features of the first aspect of the invention, (1) a high-frequency amplifier, a mixer circuit, and a receiving circuit system including at least a filter among the filters are further provided. It is characterized by having.
[0013]
[Action]
According to the transmission / reception end circuit device having the above-described configuration, the antenna circuit system including at least the high-frequency switch among the high-frequency switch, the isolator, the circulator, and the filter that switches between the transmission circuit system and the reception circuit system, and the transmission amplifier A transmission circuit system including at least a filter of a mixer circuit and a low-pass or band-pass filter, and a predetermined grounded portion of the circuit system that supports the circuit system and electrically A laminated substrate in which a plurality of connected ground electrodes are respectively formed on four side surfaces, and a plurality of non-grounded electrodes connected to predetermined portions of the circuit system are formed on the side surfaces; and the laminated substrate At least one layer laminated inside has a lead- out electrode in four directions connected to the ground electrode, and on almost the entire surface of one layer of the laminated substrate. A surface mounting type transmission / reception end circuit device used in a high frequency band comprising a ground layer formed of a single continuous conductor layer , wherein a part of the circuit unit in the circuit system includes the laminated substrate And the remaining circuit portion in the circuit system is configured by using chip components and mounted on the multilayer substrate. Since the antenna circuit system can be shared with the receiving circuit system, and the antenna circuit system and the transmitting circuit system are integrated with respect to the laminated substrate, the processing in the high-frequency circuit can be performed consistently with only the area occupied by the main body. This makes it possible to reduce the size of the mobile communication device on which it is mounted.
[0014]
In addition, the antenna circuit system, the transmission circuit system, and the reception circuit system are integrated with respect to the multilayer substrate because the antenna circuit system, the transmission circuit system, and the reception circuit system are further integrated. It is possible to perform the processing in the high-frequency circuit more consistently with only the occupied area, and it is possible to realize further miniaturization of the mobile communication device equipped with the processing.
[0016]
【Example】
Examples of the present invention will be described in detail below.
[0017]
The transmission / reception terminal circuit device 1 shown in FIG. 1 is used for a mobile communication device such as a cellular phone and a cordless phone using a high frequency circuit of 1.9 GHz, for example, and has a plane area of 85 mm as shown in FIG. 2 Incorporate at least one of a plurality of circuit units to be used in a high frequency band into the main body 2 using a laminated substrate formed by laminating a ground layer (5 mm × 17 mm) and a plurality of electrode layers other than the ground layer. In addition, for example, two types of circuit parts configured using chip parts among a plurality of circuit parts are mounted on the main body 2.
[0018]
Around the outer periphery of the main body 2 are a ground electrode G, an input electrode 3 for high frequency input, a filter input electrode 4 for a bandpass filter 15 to be described later, a filter output electrode 5, filter tap electrodes 6 and 7, a power supply electrode 8, 9, the local signal electrode 10 and the intermediate frequency output electrode 11 are provided so as to reach at least the lower surface of the main body 2, respectively, to be a surface mount type .
[0019]
The circuit section incorporated in the main body 2 is a 1.9 GHz band-pass filter 15 equivalently shown in FIG. The two types of circuit units mounted on the main body 2 are a high-frequency amplifier 14 using chip parts such as a transistor TR, a resistor R, and a capacitor C arranged at the front stage of the bandpass filter 15 and a mixer circuit 16 arranged at the rear stage. Yes.
[0020]
Here, the main body 2 and the band pass filter 15 will be described in detail with reference to FIG.
[0021]
As shown in FIG. 3, the main body 2 is formed by laminating first to fifth substrates (glass substrates or ceramic substrates) 21 to 25 having a plane area of 85 mm 2 (5 mm × 17 mm) and the outer periphery thereof. Provided with the ground electrode G, the input electrode 3, the filter input electrode 4, the filter output electrode layer 5, the filter tap electrodes 6 and 7, the power supply electrodes 8 and 9, the local signal electrode 10, and the intermediate frequency output electrode 11 described above It is.
[0022]
The high frequency amplifier 14 and the mixer circuit 16 are mounted on the uppermost first substrate 21.
[0023]
As shown in FIG. 3, a rectangular ground layer 31 is formed on the upper surface of the second substrate 22, and both end portions of the ground layer 31 are connected to ground electrodes G formed on both end surfaces of the main body 2. In addition, both side portions of the ground layer 31 are connected to a total of five ground electrodes G formed on both side surfaces of the main body 2.
[0024]
Further, the third substrate 23 third from the top is connected to the filter tap electrodes 7 and 6, respectively, and is expanded to regions corresponding to first and second capacitor electrode layers 26a and 26b described later. 3 and 4th capacity electrode layers 27a and 27b are formed.
[0025]
The first and second capacitors are connected to the filter input electrode 4 and the filter output electrode 5 on the upper surface of the fourth substrate 24 that is fourth from the top, and are developed symmetrically on the upper surface of the third substrate 23. Electrode layers 26a and 26b are formed.
[0026]
Then, the input capacitor C1 shown in FIG. 4 is formed by the overlapping region of the first capacitor electrode layer 26a and the third capacitor electrode layer 27a, and the second capacitor electrode layer 26b, the fourth capacitor electrode layer 27b, The output capacitor C2 shown in FIG. 4 is formed by the overlapping region.
[0027]
Further, a parallel capacitor C3 is formed by the overlapping region of the third capacitor electrode layer 27a and the ground layer 31, and a parallel capacitor C4 is formed by the overlapping region of the fourth capacitor electrode layer 27b and the ground layer 31. ing.
[0028]
On the upper surface of the fifth substrate 25, a substantially L-shaped pair of conductor layers 28a, 28b each having an end connected to the ground electrode G formed on the end surface of the main body 2 are formed symmetrically, and the coil element L1 is formed. , L2 are formed. The coil elements L1 and L2 are magnetically coupled by mutual inductance M as shown in FIG.
[0029]
Then, on the lower surface of the fifth substrate 25, as shown in the lowermost column in FIG. 3, a ground layer 31a having the same shape as the ground layer 31 is formed.
[0030]
Due to the three-dimensional structure using each of the substrates 21 to 25 described above, the three-dimensional circuits of the high-frequency amplifier 14, the band-pass filter 15, and the mixer circuit 16 are configured with a plane occupying area of 85 mm 2 and significantly smaller than the conventional example. The body structure of the part is realized.
[0031]
FIG. 5 shows a high-frequency circuit block of a 1.9 GHz band mobile phone using the transmission / reception end circuit device 1, and this high-frequency circuit block is connected to an antenna 31 for transmitting / receiving a 1.9 GHz band radio wave and transmitted / received. Band-pass filter 32, high-frequency switch 33 for switching between transmission and reception, transmission / reception terminal circuit device 1 constituting the transmission circuit system connected to this high-frequency switch 33, and processing of the output signal of this transmission / reception terminal circuit device 1 An intermediate frequency circuit system 34, an isolator 35 or a circulator connected to the high frequency switch 33, a transmission amplifier 40 constituting a transmission circuit system 41 connected to the isolator 35, and a bandpass filter 39 connected to the transmission amplifier 40. A mixer circuit 38 connected to the band-pass filter 39 and a mixer circuit 38 A data input circuit system 36, and a synthesizer circuit system 37 that performs channel control for sending high-frequency signals to the mixer circuit 16 of the transmission / reception terminal circuit device 1 and the mixer circuit 38 of the transmission circuit system 41, respectively.
[0032]
The transmission / reception terminal circuit device 1 may include an arbitrary circuit unit selected from the high-frequency switch 33 and the isolator 35 in addition to the case where the high-frequency amplifier 14 and the mixer circuit 16 described above are mounted.
[0033]
According to the transmission / reception end circuit device 1 described in detail above, the band-pass filter 15 of the high-frequency amplifier 14, the band-pass filter 15, and the mixer circuit 16 is used in the first to the second circuits. 5 is incorporated in the main body 2 using the substrates 21 to 25, and the high frequency amplifier 14 and the mixer circuit 16 are mounted on the first substrate 21, so that only the main body 2 has an occupied area of 85 mm 2 and is used in the high frequency band. Thus, the function of each circuit unit can be exhibited, and as a result, the occupied area of the transmission / reception end circuit device 1 itself can be greatly reduced as compared with the conventional example, and the mobile communication device can be downsized.
[0034]
The arrangement of the circuit portion of the residual, high-frequency amplifier 14, the high frequency switch 33, an isolator 35, by selecting the mixer circuit 16, before and after the band-pass filter 15 and the band-pass filter 15 as at least one of the circuit portions The remaining circuit portion can be configured with an occupied area of only the main body 2, thereby reducing the occupied area of the transmission / reception end circuit device 1 itself as compared with the conventional example, and 1.9 GHz band mobile phone, cordless phone, etc. Mobile communication devices can be configured.
[0035]
In addition, as shown in FIG. 6, not only a part or all of the band-pass filter 15 but also a band on the antenna 31 side is incorporated in the substrates 21 to 25 for constituting the transmission / reception end circuit device 1A. A part or all of the pass filter 32 and further a part or all of the band pass filter 42 shown in FIG. 6 configured at the output terminal of the synthesizer circuit system 37 can be incorporated in any combination.
[0036]
The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist thereof.
[0037]
For example, in the above-described embodiments, the band-pass filter has been described as an example, but any low-pass filter can be applied as long as it has a similar structure. The constituent elements of the bandpass filter are a transmission line, an inductance element, or a capacitance element. Therefore, the transmission line, the inductance element, or the capacitance element constituting the transmission / reception end circuit device is not limited to the one constituting the filter, and a part or all of them are provided with a plurality of electrode layers other than the ground layer and the ground layer. It can be incorporated in a main body using a laminated substrate formed by lamination.
[0038]
Further, in the above-described embodiment, the case where the reception circuit system is incorporated in the substrates 21 to 25 has been described. However, the transmission circuit system 41 can be configured by a similar configuration. Similarly, if a circuit system connecting an antenna, a receiving circuit system, and a transmitting circuit system is an antenna circuit system (including an antenna), it can be applied to the antenna circuit system. If there are elements or capacitance elements, some or all of them can be applied.
[0039]
【The invention's effect】
According to the present invention described in detail above, since the above-described configuration is employed, the following effects are obtained.
[0040]
According to the first aspect of the present invention, an antenna circuit system including at least a high-frequency switch among a high-frequency switch, an isolator, a circulator, and a filter that switches between a transmission circuit system and a reception circuit system, a transmission amplifier, A mixer circuit and a transmission circuit system including at least a filter of a low-pass or band-pass filter, and electrically connected to a predetermined grounded portion of the circuit system that supports the circuit system A plurality of ground electrodes formed on four side surfaces, and a plurality of non-ground electrodes connected to predetermined portions of the circuit system are formed on the side surfaces; At least one layer stacked on the substrate has a lead-out electrode in four directions connected to the ground electrode, and is formed on almost the entire surface of one layer of the stacked substrate. A surface-mounting type transmission / reception end circuit device used in a high-frequency band comprising a ground layer made of a single continuous conductor layer , wherein a part of the circuit unit in the circuit system is incorporated in the laminated substrate And the remaining circuit portions in the circuit system are configured using chip parts and mounted on the laminated substrate, so that the transmission circuit system and the reception circuit system Since the antenna circuit system and the transmission circuit system are integrated with respect to the laminated substrate, it is possible to consistently perform processing in the high-frequency circuit with the occupied area of the main body only, It is possible to provide a transmission / reception end circuit device capable of realizing miniaturization of a mobile communication device on which it is mounted.
[0041]
According to the second aspect of the present invention, the antenna circuit system, the transmission circuit system, and the reception circuit system are further provided with the high-frequency amplifier, the mixer circuit, and the reception circuit system including at least the filter. Can be integrated with respect to the multilayer substrate, and the processing in the high-frequency circuit can be performed more consistently with the occupied area of the main body only, and a transmission / reception end circuit device that can realize further miniaturization of the mobile communication device on which the same is mounted can be provided .
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a transmission / reception end circuit device according to the present invention. FIG. 2 is an explanatory diagram showing an area occupied by a main body in the transmission / reception end circuit device according to the embodiment. FIG. 4 is an exploded perspective view of the main body of the apparatus. FIG. 4 is an equivalent circuit diagram of a circuit unit incorporated in the main body of the transmission / reception terminal circuit apparatus of the present embodiment. Example of high-frequency circuit block diagram [FIG. 6] Another example of high-frequency circuit block diagram of a mobile communication device using the transmission / reception end circuit device of this embodiment [FIG. 7] High frequency circuit block diagram of using a conventional transmission / reception end circuit device FIG. 8 is an explanatory diagram showing an occupied area of a conventional transmission / reception end circuit device.
DESCRIPTION OF SYMBOLS 1 Transmission / reception terminal circuit apparatus 2 Main body 14 High frequency amplifier 15 Band pass filter 16 Mixer circuit 21 thru | or 25 Board | substrate 32 Band pass filter 33 High frequency switch 35 Isolator

Claims (2)

送信回路系と受信回路系とを切り替える高周波スイッチ、アイソレータ、サーキュレータ、及びフィルタの内の少なくとも高周波スイッチを含んで構成されるアンテナ回路系と、
送信アンプ、ミキサ回路、及びローパス又はバンドパスのフィルタの内の少なくともフィルタを含んで構成される送信回路系と、
前記の回路系を支持する、前記の回路系の所定の接地される箇所と電気的に接続された複数の接地電極が４つの側面上にそれぞれ形成され、かつ、前記の回路系の所定の箇所と接続された複数の非接地電極が側面上に形成された積層基板と、
前記積層基板内に積層された、少なくとも 1 層が、前記接地電極に接続される４方向への引き出し電極を有し、かつ、前記積層基板の１層のほぼ全面に形成された単一の連続導体層からなる接地層と、
を具備した高周波帯に用いられる面実装型の送受信端回路装置であって、
前記回路系中の一部の回路部は、前記積層基板中に組み込まれ、及び
前記回路系中の残余の回路部は、チップ部品を用いて構成され、かつ、前記積層基板上に搭載される、ことを特徴とする面実装型の送受信端回路装置。An antenna circuit system configured to include at least a high-frequency switch among a high-frequency switch, an isolator, a circulator, and a filter for switching between a transmission circuit system and a reception circuit system;
A transmission circuit system configured to include at least a filter among a transmission amplifier, a mixer circuit, and a low-pass or band-pass filter;
A plurality of ground electrodes that support the circuit system and are electrically connected to a predetermined grounded part of the circuit system are formed on four side surfaces, respectively, and the predetermined part of the circuit system is provided. A laminated substrate having a plurality of non-grounded electrodes connected to each other formed on a side surface ;
A single continuous layer formed on almost the entire surface of one layer of the laminated substrate, wherein at least one layer laminated in the laminated substrate has lead-out electrodes in four directions connected to the ground electrode. A ground layer composed of a conductor layer ;
A surface-mounting type transmission / reception end circuit device used in a high frequency band comprising:
A part of the circuit unit in the circuit system is incorporated in the multilayer substrate, and the remaining circuit unit in the circuit system is configured using a chip component and mounted on the multilayer substrate. A surface-mounting type transmission / reception end circuit device characterized by that. 請求項１に記載の面実装型の送受信端回路装置において、
高周波アンプ、ミキサ回路、及びフィルタの内の少なくともフィルタを含んで構成される受信回路系、を更に有することを特徴とする面実装型の送受信端回路装置。In the surface-mounted transmission / reception end circuit device according to claim 1,
A surface-mounted transmission / reception end circuit device, further comprising: a high-frequency amplifier, a mixer circuit, and a reception circuit system including at least a filter among the filters.
JP2001175487A 2001-06-11 2001-06-11 Transmission / reception end circuit device Expired - Fee Related JP3708843B2 (en)

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JP2001175487A JP3708843B2 (en) 2001-06-11 2001-06-11 Transmission / reception end circuit device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4361547A Division JPH06204912A (en) 1992-12-29 1992-12-29 Transmission/reception terminal circuit device

Related Child Applications (1)

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JP2004216175A Division JP2004297841A (en) 2004-07-23 2004-07-23 Transmitting/receiving terminal circuit device

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JP3708843B2 true JP3708843B2 (en) 2005-10-19

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