JP3706010B2 - Box for protecting electronic components - Google Patents

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Publication number
JP3706010B2
JP3706010B2 JP2000250611A JP2000250611A JP3706010B2 JP 3706010 B2 JP3706010 B2 JP 3706010B2 JP 2000250611 A JP2000250611 A JP 2000250611A JP 2000250611 A JP2000250611 A JP 2000250611A JP 3706010 B2 JP3706010 B2 JP 3706010B2
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JP
Japan
Prior art keywords
housing member
circuit board
electronic component
base member
protecting
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JP2000250611A
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Japanese (ja)
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JP2002062174A (en
Inventor
孝行 斉藤
信弥 五十嵐
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Hitachi Ltd
Hitachi Automotive Systems Engineering Co Ltd
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Hitachi Ltd
Hitachi Car Engineering Co Ltd
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Priority to JP2000250611A priority Critical patent/JP3706010B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は、電子部品を保護する箱体に係り、特に内燃機関の空燃費制御等に用いる各種センサ等、自動車用電子部品を保護する箱体及びその箱体により保護された電子部品を使用した制御システムに関する。
【0002】
【従来の技術】
回路基板をベース部材上に搭載し、ハウジング部材や回路カバー等の別部品で保護する箱体や、ハウジング部材の内外で電気信号の入出力を行うために回路基板とハウジング部材に設けられた金属端子とが金属製ワイヤにより接続されている電子部品の箱体は、特開平11−14423号公報等により公知である。さらに、箱体の組立てに圧入寸法の凹凸を用いるのも公知技術である。
【0003】
【発明が解決しようとする課題】
ところで、上記電子部品を保護する箱体において、内燃機関など周囲温度が変わり易い環境においても、金属製ワイヤが熱歪みにより劣化し難く、更に複数の部品から構成される場合であっても、精度良く組立て可能な箱体が望まれている。
【0004】
しかし、上述した公知技術では、箱体による、金属製ワイヤの保護に関する記述が無く、また、単純な凹凸構造により金属製ワイヤの耐久寿命を延ばすという記載は無い。
【0005】
ここで、金属製ワイヤが熱歪みにより劣化し難く、精度良く組立て可能な箱体を実現するためには、次の(1)〜(3)の3つの条件を満足する必要がある。
【0006】
(1)金属製ワイヤの接続部2箇所が相対的に変位しない構造であること。
(2)部品の組立て性・組立て精度が良好であること。
(3)箱体が単純であり、金属製ワイヤより良好な耐久性を有すること。
【0007】
本発明の目的は、上記3つの条件を満たし、内燃機関など周囲温度が変わり易い環境においても、金属製ワイヤが熱歪みにより劣化し難く、更に複数の部品から構成される場合であっても、精度良く組立て可能な電子部品を保護する箱体を実現することである。
【0008】
上記目的を達成するため、本発明は、次のように構成される。
(1)回路基板を固定するベース部材と、このベース部材と接着又は溶着され、上記回路基板を内装保護するハウジング部材とを備え、上記ハウジング部材に設けられた、ハウジング内部と外部とを電気的に導通するための金属端子と上記回路基板とが金属製ワイヤ等の導電性の別部材を介して接続されている電子部品を保護する箱体において、上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記金属製ワイヤの接続部近傍で、上記ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめ合いとなる凹凸部を有し、互いに機械的に結合される
【0009】
(2)好ましくは、上記(1)において、上記ベース部材とハウジング部材とは結合後に気密性を有し、上記凹凸部が上記回路基板の設置空間と外部との気密性を害さない位置に配置されている。
【0010】
(3)また、好ましくは、上記(1)又は(2)において、上記ベース部材及びハウジング部材の双方に設けた凹凸部の形成箇所が、周囲の温度変化に応じてベース部材やハウジング部材、更には組立てに用いる接着剤などが大きく変形する部分の箇所である。
【0011】
(4)また、好ましくは、上記(1)、(2)、(3)において、上記ベース部材及びハウジング部材の双方に設けた凹凸部の形成箇所が、上記回路上の発熱部に近辺で配線された上記金属製ワイヤ等の近傍である。
【0012】
(5)また、好ましくは、上記(1)、(2)、(3)、(4)において、上記ベース部材とハウジング部材とをそれぞれ異種材料で構成し、上記凹凸部は、上記ベース部材とハウジング部材とのうちの機械的強度に優れる材料で構成された側を凹部、機械的強度に劣る材料で構成された側を凸部に形成した。
【0013】
(6)回路基板を固定するベース部材と、上記回路基板を内装保護するハウジング部材と、上記ハウジング部材に設けられた、ハウジング内部と外部とを電気的に導通するための金属端子と、を備え、上記回路基板から、少なくとも2方向以上に金属製ワイヤ等の導電性の別部材を介して接続されている電子部品を保護する箱体において、 上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記回路基板のある1方向と金属製ワイヤで接続されたハウジング部材上の金属端子近傍で、上記ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめあいとなる凹凸部を有し、互いに結合している。
【0015】
)発熱抵抗体からなる流量測定部を内蔵する副空気通路部と、上記発熱抵抗体を加熱制御する回路基板を内包し、主空気通路へ取付けるためのフランジ部と電気信号の入出力を行うためのコネクタ部が一体化され、プラスチック材からなるハウジング部材と、上記副空気通路と上記ハウジング部材とが固着され、機械的強度を有する平板状であり、上記ハウジング部材と接着又は溶着される金属ベース部材と、上記ハウジング部材に設けられ、ハジング内部と外部を電気的に導通するための金属端子と、を有し、上記回路基板が金属製ワイヤ等の導電性の別部材を介して接続される電子部品の保護箱体を備える発熱抵抗式空気流量測定装置において、上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記副通路側に近く、上記フランジ部より遠くに位置する回路基板の一部分と上記金属製ワイヤで接続されたハウジング部材上の金属端子の近傍で、ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめあいとなる凹凸部を有している。
【0016】
)発熱抵抗体からなる流量測定部を内蔵する副空気通路部と、上記発熱抵抗体を加熱制御する回路基板を内包し、主空気通路へ取付けるためのフランジ部と電気信号の入出力を行うためのコネクタ部が一体化され、プラスチック材からなるハウジング部材と、上記副空気通路と上記ハウジング部材とが固着され、機械的強度を有する平板状であり、上記ハウジング部材と接着又は溶着される金属ベース部材と、上記ハウジング部材に設けられ、ハジング内部と外部を電気的に導通するための金属端子と、を有し、上記回路基板が金属製ワイヤ等の導電性の別部材を介して接続される電子部品の保護箱体を備える発熱抵抗式空気流量測定装置において、上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記副通路側に位置する回路基板の部分と上記金属製ワイヤで接続されたハウジング部材上の金属端子近傍で、ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめあいとなる凹凸部を有している。
【0017】
)好ましくは、上記(6)において、上記回路基板と上記凹凸部から遠い箇所にある金属端子とを接続する金属製ワイヤの長さが、上記回路基板と上記凹凸部近傍の金属端子とを接続する金属製ワイヤより長い。
【0018】
10)また、好ましくは、上記()において、上記凹凸部から遠い箇所にある金属端子と回路基板とを接続する金属製ワイヤは、上記回路基板にて、この回路基板の中心部に近い位置に接続される。
【0019】
11)また、好ましくは、上記(10)において、上記金属製ワイヤと上記回路基板との間に、上記回路基板上に配置されたチップ部品や印刷抵抗体などがレイアウトされている。
【0020】
12)また、好ましくは、上記(1)から()、(9))から(11)のうちのいずれか一項記載の電子部品を保護する箱体において、ベース部材が金属材料、ハウジング部材が主に樹脂で構成された材料を有することを特徴とする電子部品を保護する箱体。
【0021】
13)また、好ましくは、上記(1)から(4)、(6)、(9)から(12)のうちのいずれか一項記載の電子部品を保護する箱体において、上記凹凸部は、ベース部材側に凹形状が形成され、ハウジング部材側に凸形状が形成されている。
【0022】
14)また、好ましくは、上記(1)から(4)において、上記凹凸部は、ベース部材側に凹形状が形成され、ハウジング部材側に凸形状が形成されている。
【0023】
15)エンジン回転速度信号と、発熱抵抗式空気流量測定装置からの内燃機関への空気流量信号とに基づいて、内燃機関への燃料噴射量と、空気流量とを制御する内燃機関の制御装置において、上記発熱抵抗式空気流量測定装置は、発熱抵抗体からなる流量測定部を内蔵する副空気通路部と、上記発熱抵抗体を加熱制御する回路基板を内包し、主空気通路へ取付けるためのフランジ部と電気信号の入出力を行うためのコネクタ部が一体化され、プラスチック材からなるハウジング部材と、上記副空気通路と上記ハウジング部材とが固着され、機械的強度を有する平板状であり、上記ハウジング部材と接着又は溶着される金属ベース部材と、上記ハウジング部材に設けられ、ハジング内部と外部を電気的に導通するための金属端子と、を有し、上記回路基板が金属製ワイヤ等の導電性の別部材を介して接続される電子部品の保護箱体を備え、上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記副通路側に位置する回路基板の部分と上記金属製ワイヤで接続されたハウジング部材上の金属端子近傍で、ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめあいとなる凹凸部を有している。
【0024】
【発明の実施の形態】
図1は、本発明である電子部品を保護する箱体の第1の実施形態であり、発熱抵抗式空気流量測定装置に適用した場合の概略断面図である。また、図2は図1の回路モジュールを図1に示したP方向から見た側面図である。
図1、図2において、流体の流量を検出する発熱抵抗体1と、吸入空気の温度を検出して温度補償を行うための感温抵抗体2とはターミナル部材3に固定され、アルミワイヤ4により回路基板5と電気的に接続されている。
【0025】
更に、回路基板5と電気信号の入出力端子6との接続もアルミワイヤ4で行い、 ターミナル部材3と入出力端子6とはハウジング部材7に保持される構成となっている。
【0026】
また、回路基板5とベース部材8、ベース部材8とハウジング部材7、ハウジング部材7と回路カバー9とが、それぞれ接着剤にて固着されて発熱抵抗式空気流量測定装置が構成され、実際には主通路10等に設けられた穴より、この通路10内に挿入されて使用される。
ここに挙げた発熱抵抗式空気流量測定装置をはじめとして、自動車のエンジンルーム内部に装着される各種制御センサ等電子部品においては、通常−40℃から130℃の温度環境に耐える性能が要求されている。
【0027】
例えば、上記空気流量測定装置のように、アルミワイヤ4によるボンディング接続が行われている場合には、冷熱サイクルによりワイヤ4自身が劣化してしまうという問題点を解決しなければならない。
ここで、アルミワイヤ4劣化のメカニズムを説明する。
冷熱サイクルにより、ハウジング部材7を構成する樹脂が熱膨張、収縮を起こす。ところが、ベース部材8が別部品、別材料として構成されているため、ハウジング部材7とベース部材8とが異なる方向に変位を繰り返す。
【0028】
つまり、ベース部材8上の回路基板5とハウジング部材7上を繋ぐアルミワイヤ4が伸び縮みを繰り返し、熱歪みを生じる。この冷熱サイクルが数百サイクル繰り返されるとワイヤ4自身に皺が入り、劣化が進むと最悪の場合、ワイヤ4の断線故障に至る。
このため、自動車のエンジンルーム内部等、温度環境が厳しい箇所に装着される場合には、ハウジング部材7とベース部材8間の熱変位を抑える工夫が求められている。
そこで、図1に示した例では、ハウジング部材7側に圧入ピン11を形成し、ベース部材8側に、圧入ピン11が挿入される圧入穴12を形成した。
【0029】
一般的に、温度変化が生じると、部品の中心付近を境に膨張や収縮が起こるので、図1の例の場合、向かって下側、即ちハウジング部材7の中心からより遠い位置のアルミワイヤ4近傍に、圧入ピン11と圧入穴12とを形成した。
【0030】
つまり、圧入ピン11と圧入穴12とを形成した位置は、アルミワイヤ4の劣化が問題となる位置である。
【0031】
この構成により、ハウジング部材7とベース部材8と間の熱変位が抑制され、回路基板5とターミナル部材3との間隔の変動が抑制されて、熱変位、即ちアルミワイヤ4の劣化を抑えることが可能になる。
また、圧入ピン11と圧入穴12との設置により、部品の組立て性や組立て精度が向上する。つまり、ピン11と穴12とは圧入構造であるため、ハウジング部材7とベース部材8とを互いに固定(機械的に結合)することができるので、生産ライン上において部品の嵌合時に組立てばらつきが低減でき、更に両者を接着する場合には接着剤が硬化するまでの搬送時に理想的な組立て後の姿勢を維持することができる。
以上のように、本発明の第1の実施形態によれば、ハウジング部材7側に圧入ピン11を形成し、ベース部材8側に、圧入ピン11が挿入される圧入穴12を形成したので、アルミワイヤ4の劣化を抑えることができ、内燃機関など周囲温度が変わり易い環境においても、金属製ワイヤが熱歪みにより劣化し難く、更に複数の部品から構成される場合であっても、精度良く組立て可能な電子部品を保護する箱体及び発熱抵抗式空気流量測定装置を実現することができるという効果がある。
図3は本発明の第2実施形態を示す概略断面図である。
図3において、ハウジング部材7とベース部材8とは互いに接着剤で組立てるための接着構13を有しており、更に回路カバー9がハウジング部材7に接着されることで回路基板5が設置される空間は密閉される。
【0032】
ところが、接着構13の内側、つまり、回路基板5が配置される側に圧入ピン11と圧入穴12とを形成してしまうと、圧入ピン11と圧入穴12とに間隙が形成され、回路基板5が配置された空間を完全密閉ができなくなるため、腐食性ガスの侵入等により回路基板5が腐食等される場合がある。
【0033】
そこで、接着構13の外側に圧入ピン11と圧入穴12とを形成することにより、回路基板5の設置空間と外部との気密性を確保した。
【0034】
以上のように、本発明の第2の実施形態によれば、第1の実施形態と同様な効果を得ることができる他、回路基板5の設置空間と外部との気密性が確保され、腐食性ガスの侵入等により回路基板5が腐食等されることを防止することができる。
図4は本発明の第3の実施形態を示す概略側面図及びこの側面図のA−A線に沿った断面図である。
一般に、高温発熱する部品の近くに配線されたワイヤは、その他のワイヤより多くの熱履歴があるため、熱歪みの影響を大きく受けてしまう。このため、圧入ピン11と圧入穴12との形成位置を、回路基板5上にマウントされている発熱部品14の近くに配線されたアルミワイヤ4の近傍とした。
【0035】
その他の構成は、図3に示した第2の実施形態と同様となっている。
【0036】
以上のように、本発明の第3の実施形態によれば、第2の実施形態と同様な効果を得ることができる他、基板側発熱体の影響を抑えることができるという効果がある。
図5は本発明の第4の実施形態を示す概略断面図である。
ハウジング部材7を樹脂成型品、ベース部材8をアルミのプレス成型品というように、機械的強度の異なる材料で両者を成型した場合、圧入ピンを樹脂で成型すると、ピンの設置位置、数量によっては冷熱サイクルでピンが折損してしまう。
【0037】
そこで、図5に示すように、ベース部材8側に金属圧入ピン15を形成し、ハウジング部材7側に金属圧入ピン15が挿入されるを穴を形成することで圧入ピンの折損を防止した。
【0038】
その他の構成は、図3に示した第2の実施形態と同様となっている。
【0039】
以上のように、本発明の第4の実施形態によれば、第2の実施形態と同様な効果を得ることができる他、圧入ピンの折損を防止することができるという効果がある。
図6は本発明の第5の実施形態を示す概略断面図である。
前述した通り、一般的に温度変化が生じると、部品の中心付近を境に膨張や収縮が起こるため、部品の端の方は熱変形が大きい。
【0040】
このため、図6に示した本発明の第5の実施形態の場合、ハウジング部材7の中心からより遠い位置のアルミワイヤ4の近傍に金属圧入ピン15或いは圧入ピン11等を形成する。また、ハウジング部材7にフランジ19部が一体成型されている場合、主通路10とフランジ19とをねじ止め等で固定すると、ハウジング部材7の中でもフランジ19から遠い箇所が最も熱変形が大きい。
【0041】
このため、図6の例の場合、フランジ19からより遠い位置のアルミワイヤ4の近傍に金属圧入ピン15、或いは圧入ピン11等を形成する。その他の構成は、図3に示した第2の実施形態と同様となっている。
【0042】
以上のように、本発明の第5の実施形態によれば、第4の実施形態と同様な効果を得ることができる他、回路基板5と副空気通路18に配置されたターミナル部材3の間隔が保たれ、熱変位、即ちアルミワイヤ4の劣化を抑えることが可能になるという効果がある。
図7は本発明の第6の実施形態を示す概略側面図及びこの側面図のB−B線に沿った断面図である。
ハウジング部材7を樹脂成型品、ベース部材8をアルミのプレス成型品というように、機械的強度の異なる材料で両者を成型した場合、前述した通り、圧入ピン11を樹脂で成型すると、ピンの設置位置、数量によっては冷熱サイクルでピンが折損してしまう。
このため、この第6の実施形態では、アルミワイヤ4の劣化が最も問題となる位置だけに樹脂の圧入ピン11を配置し、ピンの折損を防止している。ところが、この時、圧入ピン11が形成されていない側に配線されているアルミワイヤ4の耐久性が問題になる場合がある。
【0043】
そこで、圧入ピン11が設置されていない側に配線されているアルミワイヤ4については、ワイヤ接続部を回路基板5の中心部へ移動し、アルミワイヤ4の長さをより長く構成した。
この構成により、長いワイヤ4-2は歪み量を相対的に小さくすることで劣化を防止し、短いワイヤ4-1は圧入構造で劣化を防止できる。また、ハウジング部材7を大きくすることなくワイヤ4の長さを長くすることができ、更に圧入ピン11や圧入穴12の数を最小限に止めることができるため、電子部品全体のコンパクト化も可能になる。
【0044】
なお、他の構成は、図3に示した例と同様となっている。
【0045】
以上のように、本発明の第6の実施形態によれば、第2の実施形態と同様な効果を得ることができる他、回路基板5とターミナル部材3の間隔が保たれ、熱変位、即ちアルミワイヤ4の劣化を抑えることが可能になるという効果がある。
【0046】
図8は本発明の第7の実施形態例を示す概略側面図及び部分拡大図である。
図8において、アルミワイヤ4の長さを長く構成するため、アルミワイヤ4の接続部を回路基板5の中心部へ移動し、回路を構成する抵抗体16やチップ部品17等をアルミワイヤ4のループ下に配置している。つまり、金属製ワイヤであるアルミワイヤ4と回路基板5との間に、この回路基板5上に配置されたチップ部品17や印刷抵抗体などがレイアウトされている。
【0047】
この構成により基板のパターンレイアウトスペースを有効に利用でき、電子部品全体のコンパクト化が図れる。
他の構成は、図3に示した例と同様となっている。
【0048】
以上のように、本発明の第6の実施形態によれば、第2の実施形態と同様な効果を得ることができる他、基板のパターンレイアウトスペースを有効に利用でき、電子部品全体のコンパクト化が図れるという効果がある。
図9は、本発明の第8の実施形態を示す図であり、発熱抵抗式空気流量測定装置として電子燃料噴射方式の内燃機関の制御システムに適用した場合の例である。
図9において、エアクリーナ51から吸入された吸入空気52は吸入ダクト53、スロットルボディ54及び燃料が供給されるインジェクタ55を備えた吸気マニホールド56を経て、エンジンシリンダ57に吸入される。一方、エンジンシリンダで発生したガス58は排気マニホールド59を経て排出される。
【0049】
発熱抵抗式空気流量測定装置の回路モジュール60から出力される空気流量信号及び圧力信号、吸気温度センサ61からの吸入空気温度信号、スロットル角度センサ62から出力されるスロットルバルブ角度信号、排気マニホールド59に設けられた酸素濃度計63から出力される酸素濃度信号及び、エンジン回転速度計64から出力されるエンジン回転速度信号等、これらを入力するコントロールユニット65はこれらの信号を逐次演算して最適な燃料噴射量とアイドルエアコントロールバルブ開度を求め、その値を使って上記インジェクタ55及びアイドルコントロールバルブ66を制御する。
【0050】
以上のように、本発明の第8の実施形態によれば、発熱抵抗式空気流量測定装置の回路モジュール60として、上述した本発明の第1〜第7の実施形態のうちの、いずれかの電子部品を保護する箱体を用いるようにしたので、金属製ワイヤが熱歪みにより劣化し難く、更に複数の部品から構成される場合であっても、精度良く組立て可能な電子部品を保護する箱体を有する発熱抵抗式空気流量測定装置を備えた内燃機関の制御システムを実現することができる。
【0051】
図10は、本発明による電子部品を保護する箱体構造を用いた場合のボンディングワイヤ強度と、従来技術による電子部品を保護する箱体構造を用いた場合のボンディングワイヤ強度とを比較するグラフである。このグラフにおいて、縦軸はボンディングワイヤの強度を示し、横軸は冷熱サイクル数を示す。
【0052】
なお、試験条件は、300μmのアルミワイヤを用いて、−40℃と130℃とを各30分ずつ繰り返した。図10において、黒丸印は、本発明のものを示し、黒三角印は、従来の技術のものを示す。
【0053】
劣化許容範囲は、350kgfを初期強度とすれば、250kgfまでである。従来技術のものは、冷熱サイクルが約300程度で許容範囲外となり、1000サイクル以上となると、強度0となる。
【0054】
これに対して、本発明のものは、3000サイクルでも必要強度を維持することができた。
【0055】
この図10に示す試験結果のように、本発明によれば、ボンディングワイヤの強度は、従来技術に比較して格段と向上されたことがわかる。
【0056】
【発明の効果】
以上のように、本発明によれば、内燃機関など周囲温度が変わり易い環境においても、金属製ワイヤが熱歪みにより劣化し難く、更に複数の部品から構成される場合であっても、精度良く組立て可能な電子部品を保護する箱体を実現することができる。
【0057】
つまり、以下の(1)〜(3)に示す効果を得ることができる。
(1)金属製ワイヤの近傍に圧入公差の凹凸部を設けることで、回路基板とターミナル部材の間隔が保たれ、部品間の熱変位、即ち金属製ワイヤの劣化を抑えることが可能になる。
【0058】
(2)金属製ワイヤの近傍に圧入公差の凹凸部を設けることで、生産ライン上において部品の嵌合時に組立てばらつきが低減でき、更に両者を接着する場合には接着剤が硬化するまでの搬送時に理想的な組立て後の姿勢を保つことができる。
【0059】
(3)金属製ワイヤの劣化が最も問題となる位置に圧入公差の凹凸部を設け、凹凸部が設置されていない側に配線されている金属製ワイヤについては、ワイヤ接続部を回路基板の中心部へ移動し、ワイヤ長さを長く構成することで、電子部品に配線される全ての金属製ワイヤの耐久性を確保し、更なる電子部品のコンパクト化が達成できる。
【0060】
また、本発明によれば、内燃機関など周囲温度が変わり易い環境においても、金属製ワイヤが熱歪みにより劣化し難く、更に複数の部品から構成される場合であっても、精度良く組立て可能な電子部品を保護する箱体有する発熱抵抗式空気流量測定装置を実現することができる。
【0061】
また、上記発熱抵抗式空気流量測定装置を備えた内燃機関の制御システムを実現することができる。
【図面の簡単な説明】
【図1】本発明の第1の実施形態の概略断面図である。
【図2】図1の回路モジュールをP方向から見た側面図である。
【図3】本発明の第2の実施形態を示す概略断面図である。
【図4】本発明の第3の実施形態を示す概略側面図及び断面図である。
【図5】本発明の第4の実施形態を示す概略断面図である。
【図6】本発明の第5の実施形態を示す概略断面図である。
【図7】本発明の第6の実施形態を示す概略側面図及び断面図である。
【図8】本発明の第7の実施形態を示す概略側面図及び部分拡大図である。
【図9】本発明の第8の実施形態を示す概略正面図である。
【図10】本発明と従来技術とを比較するグラフである。
【符号の説明】
1 発熱抵抗体
2 感温抵抗体
3 ターミナル部材
4 アルミワイヤ
5 回路基板
6 入出力端子
7 ハウジング部材
8 ベース部材
9 回路カバー
10 主通路
11 圧入ピン
12 圧入穴
13 接着溝
14 発熱部品
15 金属圧入ピン
16 抵抗体
17 チップ部品
18 副空気通路
19 フランジ
51 エアクリーナ
52 吸入空気
53 吸入ダクト
54 スロットルボディ
55 インジェクタ
56 吸気マニホールド
57 エンジンシリンダ
58 ガス
59 排気マニホールド
60 回路モジュール
61 吸気温センサ
62 スロットル角度センサ
63 酸素濃度計
64 回転速度計
65 コントロールユニット
66 アイドルエアコントロールバルブ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a box body that protects electronic parts, and in particular, various sensors used for air fuel consumption control of an internal combustion engine, etc., and a box body that protects electronic parts for automobiles and electronic parts protected by the box body are used. It relates to the control system.
[0002]
[Prior art]
A circuit board mounted on a base member and protected by a separate part such as a housing member or a circuit cover, or a metal provided on the circuit board and the housing member for input / output of electrical signals inside or outside the housing member A box of an electronic component in which a terminal is connected by a metal wire is known from Japanese Patent Application Laid-Open No. 11-14423. Furthermore, it is a known technique to use depressions and projections of press fit dimensions for assembling the box.
[0003]
[Problems to be solved by the invention]
By the way, in the box body for protecting the electronic parts, even in an environment where the ambient temperature is easily changed such as an internal combustion engine, even if the metal wire is not easily deteriorated due to thermal distortion, and is composed of a plurality of parts, the accuracy can be improved. A box that can be assembled well is desired.
[0004]
However, in the above-described known technology, there is no description regarding the protection of the metal wire by the box, and there is no description that the durable life of the metal wire is extended by a simple uneven structure.
[0005]
Here, the following three conditions (1) to (3) must be satisfied in order to realize a box body in which the metal wire is not easily deteriorated due to thermal strain and can be assembled with high accuracy.
[0006]
(1) The structure is such that the two connection portions of the metal wire are not relatively displaced.
(2) Good assembly and accuracy of parts.
(3) The box is simple and has better durability than a metal wire.
[0007]
The object of the present invention is to satisfy the above three conditions, even in an environment such as an internal combustion engine where the ambient temperature is likely to change, even when the metal wire is not easily deteriorated due to thermal strain, and further comprises a plurality of parts. It is to realize a box that protects electronic components that can be assembled with high accuracy.
[0008]
In order to achieve the above object, the present invention is configured as follows.
(1) A base member that fixes the circuit board and a housing member that is bonded or welded to the base member and protects the circuit board from the interior are provided. In a box body that protects an electronic component in which a metal terminal for electrical connection and the circuit board are connected via another conductive member such as a metal wire, the base member and the housing member are bonded to each other. In the vicinity of the connection portion of the metal wire, both the base member and the housing member have press-fitting or uneven portions that are close to press-fitting, and mechanically connected to each other. Combined [0009]
(2) Preferably, in the above (1), the base member and the housing member are hermetically sealed after being joined, and the uneven portion is disposed at a position where the airtightness between the installation space of the circuit board and the outside is not impaired. Has been.
[0010]
(3) Preferably, in the above (1) or (2), the uneven portion provided on both the base member and the housing member is formed on the base member or the housing member according to the surrounding temperature change. Is a portion where the adhesive used for assembly is greatly deformed.
[0011]
(4) Preferably, in the above (1), (2), and (3), the uneven portion provided on both the base member and the housing member is wired near the heat generating portion on the circuit. This is the vicinity of the above-described metal wire or the like.
[0012]
(5) Preferably, in the above (1), (2), (3), and (4), the base member and the housing member are made of different materials, respectively, and the concavo-convex portion is the same as the base member. Of the housing member, a side made of a material having excellent mechanical strength was formed as a concave portion, and a side formed from a material inferior in mechanical strength was formed as a convex portion.
[0013]
(6) A base member that fixes the circuit board, a housing member that protects the circuit board from the interior, and a metal terminal that is provided on the housing member and electrically connects the inside and outside of the housing. The base member and the housing member are bonded to each other in the box that protects the electronic component connected to the circuit board from the circuit board via another conductive member such as a metal wire in at least two directions . In the vicinity of the metal terminal on the housing member connected to one direction of the circuit board with a metal wire, a groove is formed, and both the base member and the housing member are press-fitted, or a fit close to press-fitting, respectively. And have a concavo-convex portion to be bonded to each other.
[0015]
( 7 ) A sub air passage portion including a flow rate measuring portion made of a heat generating resistor and a circuit board for controlling the heating of the heat generating resistor, and a flange portion for mounting to the main air passage and input / output of electric signals The connector part for carrying out is integrated, the housing member which consists of a plastic material, the said subair passage, and the said housing member are fixed, it is the flat form which has mechanical strength, and it adheres or welds with the said housing member. A metal base member and a metal terminal provided on the housing member for electrically conducting the housing inside and outside, and the circuit board is connected via another conductive member such as a metal wire in the heating resistor type air flow rate measuring device comprising a protective housing body of the electronic component to be, together with the groove for the base member and the housing member to be bonded to each other are formed, Both the base member and the housing member are press-fitted in the vicinity of the metal terminal on the housing member connected to the part of the circuit board located near the auxiliary passage side and far from the flange portion and the metal wire, or It has an uneven part that fits close to press-fitting.
[0016]
( 8 ) A sub air passage portion including a flow rate measuring unit composed of a heating resistor, and a circuit board for controlling the heating of the heating resistor, and a flange portion for mounting on the main air passage and input / output of electric signals The connector part for carrying out is integrated, the housing member which consists of a plastic material, the said subair passage, and the said housing member are fixed, it is the flat form which has mechanical strength, and it adheres or welds with the said housing member. A metal base member and a metal terminal provided on the housing member for electrically conducting the housing inside and outside, and the circuit board is connected via another conductive member such as a metal wire in the heating resistor type air flow rate measuring device comprising a protective housing body of the electronic component to be, together with the groove for the base member and the housing member to be bonded to each other are formed, In the vicinity of the metal terminal on the housing member connected by the metal wire to the portion of the circuit board located on the sub-passage side, both the base member and the housing member are respectively press-fitted or uneven portions that fit close to press-fitting. have.
[0017]
(9) Preferably, the Oite to (6), the length of the metal wire for connecting the metal terminal on the far point from the circuit board and the uneven portion is, the circuit board and the uneven portion near the metal Longer than the metal wire connecting the terminal.
[0018]
( 10 ) Preferably, in ( 9 ) above, the metal wire connecting the metal terminal and the circuit board located far from the uneven portion is close to the center of the circuit board in the circuit board. Connected to position.
[0019]
( 11 ) Preferably, in the above ( 10 ), a chip component or a printed resistor arranged on the circuit board is laid out between the metal wire and the circuit board.
[0020]
( 12 ) Preferably, in the box for protecting the electronic component according to any one of (1) to ( 6 ), ( 9) ) to ( 11 ), the base member is a metal material, a housing A box for protecting an electronic component, characterized in that the member has a material mainly composed of resin.
[0021]
( 13 ) Preferably, in the box for protecting an electronic component according to any one of (1) to (4), ( 6), and (9) to (12) , the uneven portion is A concave shape is formed on the base member side, and a convex shape is formed on the housing member side.
[0022]
( 14 ) Preferably, in the above (1) to (4), the concavo-convex portion has a concave shape on the base member side and a convex shape on the housing member side.
[0023]
( 15 ) A control device for an internal combustion engine that controls the fuel injection amount to the internal combustion engine and the air flow rate based on the engine rotation speed signal and the air flow rate signal to the internal combustion engine from the heating resistance type air flow measurement device The heating resistance type air flow rate measuring device includes a sub air passage portion including a flow rate measuring portion made of a heating resistor, and a circuit board for controlling the heating of the heating resistor, and is attached to the main air passage. The flange part and the connector part for inputting and outputting electric signals are integrated, and the housing member made of plastic material, the sub air passage and the housing member are fixed, and has a flat plate shape having mechanical strength, A metal base member that is bonded or welded to the housing member; and a metal terminal that is provided on the housing member and electrically connects the inside and outside of the housing. , Comprising a protective housing body of the electronic component in which the circuit board is connected via a separate electrically conductive member such as metal wire, with a groove for the base member and the housing member to be bonded to each other are formed, In the vicinity of the metal terminal on the housing member connected to the portion of the circuit board located on the side of the sub-passage and the metal wire, both the base member and the housing member are press-fitted, or uneven portions that fit close to press-fitting. have.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a schematic cross-sectional view showing a first embodiment of a box body for protecting an electronic component according to the present invention, which is applied to a heating resistance type air flow measuring device. FIG. 2 is a side view of the circuit module of FIG. 1 viewed from the P direction shown in FIG.
In FIG. 1 and FIG. 2, a heating resistor 1 for detecting the flow rate of fluid and a temperature sensitive resistor 2 for detecting the temperature of intake air and performing temperature compensation are fixed to a terminal member 3, and an aluminum wire 4 Thus, the circuit board 5 is electrically connected.
[0025]
Further, the circuit board 5 and the input / output terminal 6 for electrical signals are also connected by the aluminum wire 4, and the terminal member 3 and the input / output terminal 6 are held by the housing member 7.
[0026]
In addition, the circuit board 5 and the base member 8, the base member 8 and the housing member 7, and the housing member 7 and the circuit cover 9 are fixed with an adhesive to constitute a heating resistance type air flow measuring device. It is used by being inserted into this passage 10 from a hole provided in the main passage 10 or the like.
In addition to the heating resistance type air flow measurement device listed here, various electronic components such as various control sensors installed in the engine room of an automobile are required to have a capability to withstand a temperature environment of -40 ° C to 130 ° C. Yes.
[0027]
For example, when the bonding connection by the aluminum wire 4 is performed as in the air flow rate measuring device, the problem that the wire 4 itself deteriorates due to the cooling / heating cycle must be solved.
Here, the mechanism of deterioration of the aluminum wire 4 will be described.
Due to the cooling / heating cycle, the resin constituting the housing member 7 undergoes thermal expansion and contraction. However, since the base member 8 is configured as a separate part or material, the housing member 7 and the base member 8 are repeatedly displaced in different directions.
[0028]
That is, the aluminum wire 4 that connects the circuit board 5 on the base member 8 and the housing member 7 repeatedly expands and contracts, resulting in thermal distortion. If this cooling and heating cycle is repeated several hundreds of times, the wire 4 itself is wrinkled, and when the deterioration progresses, in the worst case, the wire 4 is broken.
For this reason, when mounting | wearing in places with severe temperature environments, such as the inside of the engine room of a motor vehicle, the device which suppresses the thermal displacement between the housing member 7 and the base member 8 is calculated | required.
Therefore, in the example shown in FIG. 1, the press-fit pin 11 is formed on the housing member 7 side, and the press-fit hole 12 into which the press-fit pin 11 is inserted is formed on the base member 8 side.
[0029]
In general, when temperature changes, expansion and contraction occur near the center of the part. In the case of the example of FIG. 1, the aluminum wire 4 located on the lower side, that is, farther from the center of the housing member 7. A press-fit pin 11 and a press-fit hole 12 were formed in the vicinity.
[0030]
That is, the position where the press-fit pin 11 and the press-fit hole 12 are formed is a position where deterioration of the aluminum wire 4 becomes a problem.
[0031]
With this configuration, thermal displacement between the housing member 7 and the base member 8 is suppressed, and fluctuations in the distance between the circuit board 5 and the terminal member 3 are suppressed, thereby suppressing thermal displacement, that is, deterioration of the aluminum wire 4. It becomes possible.
Further, the installation of the press-fit pin 11 and the press-fit hole 12 improves the assembling property and the assembling accuracy of the parts. That is, since the pin 11 and the hole 12 have a press-fit structure, the housing member 7 and the base member 8 can be fixed (mechanically coupled) to each other. In addition, when both are bonded, an ideal post-assembly posture can be maintained during conveyance until the adhesive is cured.
As described above, according to the first embodiment of the present invention, the press-fit pin 11 is formed on the housing member 7 side, and the press-fit hole 12 into which the press-fit pin 11 is inserted is formed on the base member 8 side. Deterioration of the aluminum wire 4 can be suppressed, and even in an environment such as an internal combustion engine where the ambient temperature is likely to change, the metal wire is not easily deteriorated due to thermal distortion, and even when it is composed of a plurality of parts, it is accurate. There is an effect that it is possible to realize a box body and a heating resistance type air flow rate measuring device that protects electronic components that can be assembled.
FIG. 3 is a schematic sectional view showing a second embodiment of the present invention.
In FIG. 3, the housing member 7 and the base member 8 have an adhesive structure 13 for assembling with each other with an adhesive, and the circuit cover 5 is further adhered to the housing member 7 to install the circuit board 5. The space is sealed.
[0032]
However, if the press-fit pin 11 and the press-fit hole 12 are formed inside the adhesive structure 13, that is, the side where the circuit board 5 is arranged, a gap is formed between the press-fit pin 11 and the press-fit hole 12, and the circuit board is formed. Since the space where 5 is disposed cannot be completely sealed, the circuit board 5 may be corroded due to the invasion of corrosive gas.
[0033]
Therefore, by forming the press-fit pins 11 and the press-fit holes 12 outside the bonding structure 13, the airtightness between the installation space of the circuit board 5 and the outside is ensured.
[0034]
As described above, according to the second embodiment of the present invention, the same effect as that of the first embodiment can be obtained, and the airtightness between the installation space of the circuit board 5 and the outside is ensured, and corrosion is prevented. It is possible to prevent the circuit board 5 from being corroded or the like due to the invasion of the property gas.
FIG. 4 is a schematic side view showing a third embodiment of the present invention and a cross-sectional view taken along line AA of this side view.
In general, a wire wired near a component that generates heat at a high temperature has a larger thermal history than other wires, and thus is greatly affected by thermal distortion. For this reason, the formation position of the press-fit pin 11 and the press-fit hole 12 is set in the vicinity of the aluminum wire 4 wired in the vicinity of the heat generating component 14 mounted on the circuit board 5.
[0035]
Other configurations are the same as those of the second embodiment shown in FIG.
[0036]
As described above, according to the third embodiment of the present invention, the same effect as that of the second embodiment can be obtained, and the effect of the substrate-side heating element can be suppressed.
FIG. 5 is a schematic sectional view showing a fourth embodiment of the present invention.
If the housing member 7 is a resin molded product and the base member 8 is an aluminum press-molded product, both of them are molded with materials having different mechanical strengths. If the press-fit pin is molded with resin, depending on the installation position and quantity of the pin, The pin breaks during the cold cycle.
[0037]
Therefore, as shown in FIG. 5, the metal press-fit pin 15 is formed on the base member 8 side, and the hole into which the metal press-fit pin 15 is inserted is formed on the housing member 7 side to prevent breakage of the press-fit pin.
[0038]
Other configurations are the same as those of the second embodiment shown in FIG.
[0039]
As described above, according to the fourth embodiment of the present invention, the same effect as that of the second embodiment can be obtained, and the press-fit pin can be prevented from being broken.
FIG. 6 is a schematic sectional view showing a fifth embodiment of the present invention.
As described above, in general, when a temperature change occurs, expansion and contraction occur near the center of the part, so that the end of the part is more thermally deformed.
[0040]
For this reason, in the case of the fifth embodiment of the present invention shown in FIG. 6, the metal press-fit pin 15 or the press-fit pin 11 is formed in the vicinity of the aluminum wire 4 at a position farther from the center of the housing member 7. Further, in the case where the flange 19 is integrally formed with the housing member 7, when the main passage 10 and the flange 19 are fixed by screwing or the like, a portion of the housing member 7 far from the flange 19 is most thermally deformed.
[0041]
For this reason, in the example of FIG. 6, the metal press-fit pin 15, the press-fit pin 11, or the like is formed in the vicinity of the aluminum wire 4 farther from the flange 19. Other configurations are the same as those of the second embodiment shown in FIG.
[0042]
As described above, according to the fifth embodiment of the present invention, the same effect as that of the fourth embodiment can be obtained, and the distance between the terminal member 3 disposed in the circuit board 5 and the auxiliary air passage 18 can be obtained. Is maintained, and it is possible to suppress thermal displacement, that is, deterioration of the aluminum wire 4.
FIG. 7: is the schematic side view which shows the 6th Embodiment of this invention, and sectional drawing along the BB line of this side view.
When the housing member 7 is molded from resin and the base member 8 is molded from aluminum, both of which are molded from materials with different mechanical strengths, as described above, when the press-fit pin 11 is molded from resin, the pins are installed. Depending on the position and quantity, the pin breaks during the cooling cycle.
For this reason, in the sixth embodiment, the resin press-fit pins 11 are arranged only at the positions where the deterioration of the aluminum wire 4 is most problematic, thereby preventing the pins from being broken. However, at this time, the durability of the aluminum wire 4 wired on the side where the press-fit pin 11 is not formed may be a problem.
[0043]
Therefore, for the aluminum wire 4 wired on the side where the press-fit pin 11 is not installed, the wire connecting portion is moved to the center portion of the circuit board 5 to make the length of the aluminum wire 4 longer.
With this configuration, the long wire 4-2 can be prevented from being deteriorated by relatively reducing the strain amount, and the short wire 4-1 can be prevented from being deteriorated by the press-fitting structure. Further, since the length of the wire 4 can be increased without increasing the size of the housing member 7 and the number of press-fit pins 11 and press-fit holes 12 can be minimized, the entire electronic component can be made compact. become.
[0044]
Other configurations are the same as the example shown in FIG.
[0045]
As described above, according to the sixth embodiment of the present invention, the same effect as that of the second embodiment can be obtained, the distance between the circuit board 5 and the terminal member 3 is maintained, and thermal displacement, that is, There is an effect that the deterioration of the aluminum wire 4 can be suppressed.
[0046]
FIG. 8 is a schematic side view and a partially enlarged view showing a seventh embodiment of the present invention.
In FIG. 8, in order to make the length of the aluminum wire 4 longer, the connecting portion of the aluminum wire 4 is moved to the center of the circuit board 5, and the resistor 16, the chip component 17, etc. constituting the circuit are connected to the aluminum wire 4. It is placed under the loop. That is, a chip component 17 or a printed resistor disposed on the circuit board 5 is laid out between the aluminum wire 4 that is a metal wire and the circuit board 5.
[0047]
With this configuration, the pattern layout space of the substrate can be used effectively, and the entire electronic component can be made compact.
Other configurations are the same as the example shown in FIG.
[0048]
As described above, according to the sixth embodiment of the present invention, the same effects as those of the second embodiment can be obtained, the pattern layout space of the substrate can be used effectively, and the entire electronic component can be made compact. Is effective.
FIG. 9 is a diagram showing an eighth embodiment of the present invention, which is an example in the case of being applied to an electronic fuel injection type internal combustion engine control system as a heating resistance type air flow rate measuring device.
In FIG. 9, the intake air 52 drawn from the air cleaner 51 is drawn into the engine cylinder 57 via an intake manifold 56 having an intake duct 53, a throttle body 54, and an injector 55 to which fuel is supplied. On the other hand, the gas 58 generated in the engine cylinder is discharged through the exhaust manifold 59.
[0049]
An air flow signal and pressure signal output from the circuit module 60 of the heating resistance type air flow measuring device, an intake air temperature signal from the intake temperature sensor 61, a throttle valve angle signal output from the throttle angle sensor 62, and an exhaust manifold 59 The control unit 65 that inputs the oxygen concentration signal output from the provided oxygen concentration meter 63 and the engine rotation speed signal output from the engine rotation speed meter 64, etc., sequentially calculates these signals to obtain the optimum fuel. The injection amount and the idle air control valve opening are obtained, and the injector 55 and the idle control valve 66 are controlled using the values.
[0050]
As described above, according to the eighth embodiment of the present invention, any one of the above-described first to seventh embodiments of the present invention is used as the circuit module 60 of the heating resistance type air flow rate measuring device. A box that protects electronic components can be assembled with high accuracy even when the metal wire is not easily deteriorated due to thermal distortion and is composed of multiple components. The control system of the internal combustion engine provided with the heating resistance type air flow measuring device having the body can be realized.
[0051]
FIG. 10 is a graph comparing the bonding wire strength when the box structure protecting the electronic component according to the present invention is used and the bonding wire strength when using the box structure protecting the electronic component according to the prior art. is there. In this graph, the vertical axis represents the strength of the bonding wire, and the horizontal axis represents the number of thermal cycles.
[0052]
As test conditions, 300 μm aluminum wire was used, and −40 ° C. and 130 ° C. were repeated for 30 minutes each. In FIG. 10, black circles indicate the present invention, and black triangles indicate the prior art.
[0053]
The allowable deterioration range is up to 250 kgf when 350 kgf is the initial strength. In the prior art, the cold cycle is about 300, which is outside the allowable range, and when the cycle is 1000 cycles or more, the strength becomes zero.
[0054]
On the other hand, the thing of this invention was able to maintain required intensity | strength even in 3000 cycles.
[0055]
As can be seen from the test results shown in FIG. 10, according to the present invention, the strength of the bonding wire is remarkably improved as compared with the prior art.
[0056]
【The invention's effect】
As described above, according to the present invention, even in an environment such as an internal combustion engine where the ambient temperature is likely to change, the metal wire is not easily deteriorated due to thermal strain, and even when it is composed of a plurality of parts, the accuracy is high. A box body that protects electronic components that can be assembled can be realized.
[0057]
That is, the following effects (1) to (3) can be obtained.
(1) By providing the press-fitting tolerance irregularities in the vicinity of the metal wire, the distance between the circuit board and the terminal member can be maintained, and thermal displacement between components, that is, deterioration of the metal wire can be suppressed.
[0058]
(2) By providing the press-fitting tolerance irregularities in the vicinity of the metal wire, assembly variations can be reduced when parts are fitted on the production line, and when both are bonded, transport until the adhesive is cured. Sometimes the ideal post-assembly posture can be maintained.
[0059]
(3) As for the metal wire wired on the side where the unevenness portion is not provided and the unevenness portion of the press-fitting tolerance is provided at the position where the deterioration of the metal wire is most problematic, the wire connection portion is the center of the circuit board. By moving to the part and configuring the wire length to be long, the durability of all the metal wires wired to the electronic component can be ensured, and further downsizing of the electronic component can be achieved.
[0060]
Further, according to the present invention, even in an environment where the ambient temperature is easily changed, such as an internal combustion engine, the metal wire is not easily deteriorated due to thermal distortion, and can be assembled with high accuracy even when it is composed of a plurality of parts. A heating resistance type air flow rate measuring device having a box for protecting electronic components can be realized.
[0061]
Further, it is possible to realize an internal combustion engine control system including the heating resistance type air flow rate measuring device.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a first embodiment of the present invention.
FIG. 2 is a side view of the circuit module of FIG. 1 viewed from the P direction.
FIG. 3 is a schematic cross-sectional view showing a second embodiment of the present invention.
FIGS. 4A and 4B are a schematic side view and a cross-sectional view showing a third embodiment of the present invention. FIGS.
FIG. 5 is a schematic sectional view showing a fourth embodiment of the present invention.
FIG. 6 is a schematic cross-sectional view showing a fifth embodiment of the present invention.
7A and 7B are a schematic side view and a cross-sectional view showing a sixth embodiment of the present invention.
FIG. 8 is a schematic side view and a partially enlarged view showing a seventh embodiment of the present invention.
FIG. 9 is a schematic front view showing an eighth embodiment of the present invention.
FIG. 10 is a graph comparing the present invention with the prior art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Heating resistor 2 Temperature sensitive resistor 3 Terminal member 4 Aluminum wire 5 Circuit board 6 Input / output terminal 7 Housing member 8 Base member 9 Circuit cover 10 Main passage 11 Press-fitting pin 12 Press-fitting hole 13 Adhesive groove 14 Heating component 15 Metal press-fitting pin 16 Resistor 17 Chip part 18 Sub air passage 19 Flange 51 Air cleaner 52 Intake air 53 Intake duct 54 Throttle body 55 Injector 56 Intake manifold 57 Engine cylinder 58 Gas 59 Exhaust manifold 60 Circuit module 61 Intake temperature sensor 62 Throttle angle sensor 63 Oxygen concentration Total 64 Tachometer 65 Control unit 66 Idle air control valve

Claims (15)

回路基板を固定するベース部材と、このベース部材と接着又は溶着され、上記回路基板を内装保護するハウジング部材とを備え、上記ハウジング部材に設けられた、ハウジング内部と外部とを電気的に導通するための金属端子と上記回路基板とが金属製ワイヤ等の導電性の別部材を介して接続されている電子部品を保護する箱体において、
上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記金属製ワイヤの接続部近傍で、上記ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめ合いとなる凹凸部を有し、互いに機械的に結合されることを特徴とする電子部品を保護する箱体。
A base member that fixes the circuit board and a housing member that is bonded or welded to the base member and protects the circuit board from the interior are provided to electrically connect the inside and outside of the housing provided on the housing member. In a box that protects an electronic component in which a metal terminal for the circuit board and the circuit board are connected via another conductive member such as a metal wire,
A groove for bonding the base member and the housing member to each other is formed, and both the base member and the housing member are press-fitted or fitted close to press-fitting in the vicinity of the connection portion of the metal wire. A box body for protecting an electronic component, wherein the electronic component has an uneven portion and is mechanically coupled to each other.
請求項1記載の電子部品を保護する箱体において、上記ベース部材とハウジング部材とは結合後に気密性を有し、上記凹凸部が上記回路基板の設置空間と外部との気密性を害さない位置に配置されていることを特徴とする電子部品を保護する箱体。  2. The box body for protecting an electronic component according to claim 1, wherein the base member and the housing member have airtightness after being joined, and the uneven portion does not impair the airtightness between the installation space of the circuit board and the outside. A box body for protecting an electronic component characterized by being arranged in 請求項1又は2記載の電子部品を保護する箱体において、上記ベース部材及びハウジング部材の双方に設けた凹凸部の形成箇所が、周囲の温度変化に応じてベース部材やハウジング部材、更には組立てに用いる接着剤などが大きく変形する部分の箇所であることを特徴とする電子部品を保護する箱体。  3. A box body for protecting an electronic component according to claim 1 or 2, wherein the uneven portions provided on both the base member and the housing member are formed according to a change in ambient temperature. A box body for protecting an electronic component, characterized in that it is a portion of a portion where an adhesive or the like used in the process is greatly deformed. 請求項1、2、3のうちのいずれか一項記載の電子部品を保護する箱体において、上記ベース部材及びハウジング部材の双方に設けた凹凸部の形成箇所が、上記回路上の発熱部に近辺で配線された上記金属製ワイヤ等の近傍であることを特徴とする電子部品を保護する箱体。  The box for protecting the electronic component according to any one of claims 1, 2, and 3, wherein the uneven portion provided on both the base member and the housing member is a heating portion on the circuit. A box for protecting an electronic component, characterized by being in the vicinity of the metal wire or the like wired in the vicinity. 請求項1、2、3、4のうちのいずれか一項記載の電子部品を保護する箱体において、上記ベース部材とハウジング部材とをそれぞれ異種材料で構成し、上記凹凸部は、上記ベース部材とハウジング部材とのうちの機械的強度に優れる材料で構成された側を凹部、機械的強度に劣る材料で構成された側を凸部に形成したことを特徴とする電子部品を保護する箱体。  The box body protecting the electronic component according to any one of claims 1, 2, 3, and 4, wherein the base member and the housing member are made of different materials, respectively, and the uneven portion includes the base member. A box body for protecting an electronic component characterized in that a side made of a material having excellent mechanical strength is formed as a concave portion and a side made of a material inferior in mechanical strength is formed as a convex portion. . 回路基板を固定するベース部材と、上記回路基板を内装保護するハウジング部材と、上記ハウジング部材に設けられた、ハウジング内部と外部とを電気的に導通するための金属端子と、を備え、上記回路基板から、少なくとも2方向以上に金属製ワイヤ等の導電性の別部材を介して接続されている電子部品を保護する箱体において、
上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記回路基板のある1方向と金属製ワイヤで接続されたハウジング部材上の金属端子近傍で、上記ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめあいとなる凹凸部を有し、互いに結合していることを特徴とする電子部品を保護する箱体。
A base member for fixing the circuit board; a housing member for protecting the interior of the circuit board; and a metal terminal provided in the housing member for electrically conducting the interior and exterior of the housing. In a box that protects an electronic component that is connected from a substrate via another conductive member such as a metal wire in at least two directions,
The base member and the housing member are formed with a groove for bonding to each other, and the base member and the housing member are disposed in the vicinity of the metal terminal on the housing member connected to the circuit board in one direction with a metal wire. A box body for protecting an electronic component, characterized in that both have press-fitting or uneven portions that fit close to press-fitting and are connected to each other.
発熱抵抗体からなる流量測定部を内蔵する副空気通路部と、上記発熱抵抗体を加熱制御する回路基板を内包し、主空気通路へ取付けるためのフランジ部と電気信号の入出力を行うためのコネクタ部が一体化され、プラスチック材からなるハウジング部材と、上記副空気通路と上記ハウジング部材とが固着され、機械的強度を有する平板状であり、上記ハウジング部材と接着又は溶着される金属ベース部材と、上記ハウジング部材に設けられ、ハジング内部と外部を電気的に導通するための金属端子と、を有し、上記回路基板が金属製ワイヤ等の導電性の別部材を介して接続される電子部品の保護箱体を備える発熱抵抗式空気流量測定装置において、
上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記副通路側に近く、上記フランジ部より遠くに位置する回路基板の一部分と上記金属製ワイヤで接続されたハウジング部材上の金属端子の近傍で、ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめあいとなる凹凸部を有していることを特徴とする発熱抵抗式空気流量測定装置。
A sub-air passage section with a built-in flow rate measuring unit composed of a heating resistor and a circuit board for controlling the heating of the heating resistor are included, and a flange section for mounting to the main air path and an electrical signal input / output A metal base member in which a connector part is integrated, a housing member made of a plastic material, the sub air passage and the housing member are fixed, is a flat plate having mechanical strength, and is bonded or welded to the housing member And a metal terminal that is provided in the housing member and electrically connects the inside and outside of the housing, and the circuit board is connected via another conductive member such as a metal wire. In the heating resistance type air flow measuring device equipped with a protective box for the parts,
The base member and the housing member are formed with a groove for bonding to each other, and the housing member is connected to a part of the circuit board located near the sub-passage side and farther from the flange portion by the metal wire. In the vicinity of the upper metal terminal, both of the base member and the housing member have press-fitting or uneven portions that fit close to the press-fitting.
発熱抵抗体からなる流量測定部を内蔵する副空気通路部と、上記発熱抵抗体を加熱制御する回路基板を内包し、主空気通路へ取付けるためのフランジ部と電気信号の入出力を行うためのコネクタ部が一体化され、プラスチック材からなるハウジング部材と、上記副空気通路と上記ハウジング部材とが固着され、機械的強度を有する平板状であり、上記ハウジング部材と接着又は溶着される金属ベース部材と、上記ハウジング部材に設けられ、ハジング内部と外部を電気的に導通するための金属端子と、を有し、上記回路基板が金属製ワイヤ等の導電性の別部材を介して接続される電子部品の保護箱体を備える発熱抵抗式空気流量測定装置において、
上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記副通路側に位置する回路基板の部分と上記金属製ワイヤで接続されたハウジング部材上の金属端子近傍で、ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめあいとなる凹凸部を有していることを特徴とする発熱抵抗式空気流量測定装置。
A sub-air passage section with a built-in flow rate measuring unit composed of a heating resistor and a circuit board for controlling the heating of the heating resistor are included, and a flange section for mounting to the main air path and an electrical signal input / output A metal base member in which a connector part is integrated, a housing member made of a plastic material, the sub air passage and the housing member are fixed, is a flat plate having mechanical strength, and is bonded or welded to the housing member And a metal terminal that is provided in the housing member and electrically connects the inside and outside of the housing, and the circuit board is connected via another conductive member such as a metal wire. In the heating resistance type air flow measuring device equipped with a protective box for the parts,
The base member and the housing member are formed with a groove for bonding to each other, and the base member is located in the vicinity of the metal terminal on the housing member connected to the portion of the circuit board located on the side of the sub passage and the metal wire. Both of the member and the housing member are press-fitted or have an uneven portion that fits close to the press-fitting.
請求項6記載の電子部品を保護する箱体において、上記回路基板と上記凹凸部から遠い箇所にある金属端子とを接続する金属製ワイヤの長さが、上記回路基板と上記凹凸部近傍の金属端子とを接続する金属製ワイヤより長いこと特徴とする電子部品を保護する箱体。In the box to protect the electronic component according to claim 6 Symbol mounting, the length of the metallic wire that connects the metal terminal on the far point from the circuit board and the uneven portion is, the circuit board and the uneven portion in the vicinity A box for protecting an electronic component, characterized by being longer than a metal wire connecting a metal terminal. 請求項記載の電子部品を保護する箱体において、上記凹凸部から遠い箇所にある金属端子と回路基板とを接続する金属製ワイヤは、上記回路基板にて、この回路基板の中心部に近い位置に接続されることを特徴とする電子部品を保護する箱体。10. The box body for protecting an electronic component according to claim 9, wherein the metal wire connecting the metal terminal and the circuit board at a location far from the uneven portion is near the center of the circuit board in the circuit board. A box body for protecting an electronic component characterized by being connected to a position. 請求項10記載の電子部品を保護する箱体において、上記金属製ワイヤと上記回路基板との間に、上記回路基板上に配置されたチップ部品や印刷抵抗体などがレイアウトされていることを特徴とする電子部品を保護する箱体。11. A box for protecting an electronic component according to claim 10 , wherein a chip component or a printed resistor disposed on the circuit board is laid out between the metal wire and the circuit board. A box that protects electronic components. 請求項1から、請求項から11のうちのいずれか一項記載の電子部品を保護する箱体において、ベース部材が金属材料、ハウジング部材が主に樹脂で構成された材料を有することを特徴とする電子部品を保護する箱体。The box body for protecting an electronic component according to any one of claims 1 to 6 and claims 9 to 11 , wherein the base member has a metal material and the housing member has a material mainly made of resin. A box that protects the electronic components. 請求項1から4、請求項6、請求項9から12のうちのいずれか一項記載の電子部品を保護する箱体において、上記凹凸部は、ベース部材側に凹形状が形成され、ハウジング部材側に凸形状が形成されていることを特徴とする電子部品を保護する箱体。The box for protecting an electronic component according to any one of claims 1 to 4, claim 6, and claim 9 to 12 , wherein the concave and convex portion has a concave shape on the base member side, and a housing member A box for protecting an electronic component, wherein a convex shape is formed on the side. 請求項1から4のうちのいずれか一項記載の電子部品を保護する箱体において、上記凹凸部は、ベース部材側に凹形状が形成され、ハウジング部材側に凸形状が形成されていることを特徴とする電子部品を保護する箱体。  5. The box body for protecting an electronic component according to claim 1, wherein the concavo-convex portion has a concave shape on the base member side and a convex shape on the housing member side. A box that protects electronic components. エンジン回転速度信号と、発熱抵抗式空気流量測定装置からの内燃機関への空気流量信号とに基づいて、内燃機関への燃料噴射量と、空気流量とを制御する内燃機関の制御装置において、
上記発熱抵抗式空気流量測定装置は、発熱抵抗体からなる流量測定部を内蔵する副空気通路部と、上記発熱抵抗体を加熱制御する回路基板を内包し、主空気通路へ取付けるためのフランジ部と電気信号の入出力を行うためのコネクタ部が一体化され、プラスチック材からなるハウジング部材と、上記副空気通路と上記ハウジング部材とが固着され、機械的強度を有する平板状であり、上記ハウジング部材と接着又は溶着される金属ベース部材と、上記ハウジング部材に設けられ、ハジング内部と外部を電気的に導通するための金属端子と、を有し、上記回路基板が金属製ワイヤ等の導電性の別部材を介して接続される電子部品の保護箱体を備え、上記ベース部材とハウジング部材は互いに接着されるための溝が形成されると共に、上記副通路側に位置する回路基板の部分と上記金属製ワイヤで接続されたハウジング部材上の金属端子近傍で、ベース部材及びハウジング部材の双方がそれぞれ圧入、或いは、圧入にほど近いはめあいとなる凹凸部を有していることを特徴とする内燃機関の制御装置。
In a control device for an internal combustion engine that controls the fuel injection amount and the air flow rate to the internal combustion engine based on the engine rotation speed signal and the air flow rate signal to the internal combustion engine from the heating resistance type air flow measurement device,
The heating resistance type air flow rate measuring device includes a sub air passage portion including a flow rate measuring portion including a heating resistor, and a flange portion for mounting the heating resistor on a circuit board for controlling heating of the heating resistor. And a connector part for inputting and outputting electrical signals, a housing member made of a plastic material, the sub-air passage and the housing member are fixed, and is a flat plate having mechanical strength, and the housing A metal base member that is bonded or welded to the member, and a metal terminal that is provided on the housing member and electrically connects the inside and outside of the housing, and the circuit board is conductive such as a metal wire. another member comprises a protective box body of the electronic component connected via, with grooves for the base member and the housing member to be bonded to each other are formed, the sub passage In the vicinity of the metal terminal on the housing member connected with the portion of the circuit board located at the metal wire, both the base member and the housing member have a concavo-convex portion that is press-fitted or fits close to press-fitting. A control device for an internal combustion engine.
JP2000250611A 2000-08-22 2000-08-22 Box for protecting electronic components Expired - Lifetime JP3706010B2 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
JP2012052974A (en) * 2010-09-03 2012-03-15 Hitachi Automotive Systems Ltd Thermal flow sensor

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JP5241669B2 (en) * 2009-10-02 2013-07-17 日立オートモティブシステムズ株式会社 Flow measuring device
WO2020008875A1 (en) * 2018-07-06 2020-01-09 日立オートモティブシステムズ株式会社 Physical-quantity detection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012052974A (en) * 2010-09-03 2012-03-15 Hitachi Automotive Systems Ltd Thermal flow sensor

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