JP3703406B2 - Reactive fluorine gas removal treatment agent and reactive fluorine gas removal method - Google Patents
Reactive fluorine gas removal treatment agent and reactive fluorine gas removal method Download PDFInfo
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- JP3703406B2 JP3703406B2 JP2001165871A JP2001165871A JP3703406B2 JP 3703406 B2 JP3703406 B2 JP 3703406B2 JP 2001165871 A JP2001165871 A JP 2001165871A JP 2001165871 A JP2001165871 A JP 2001165871A JP 3703406 B2 JP3703406 B2 JP 3703406B2
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- gas
- reactive fluorine
- treatment agent
- carbon dioxide
- gas removal
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Description
【0001】
【発明の属する技術分野】
本発明は、主として半導体製造工程などで使用されるフッ化水素、フッ素、六フッ化タングステン、四フッ化珪素、及び三フッ化硼素等の反応性フッ素系ガスを排出するにあたって、この反応性フッ素系ガスを無害化する除害処理剤および除害方法に関する。
【0002】
【従来の技術】
半導体工業分野においては、CVD、真空蒸着、スパッタリング等による半導体の製造工程で反応性フッ素系ガスが使用されている。また、PFC(パーフルオロ化合物ガス)のような安定なフッ素化合物を使用する工程においても、プラズマによって反応性フッ素系ガスが副生される。
従来、この反応性フッ素系ガスを排出するにあたっては、この反応性フッ素系ガスを処理剤に接触させて吸収除去し無害化する除害処理が行われている。
この除害処理剤としては、水酸化カルシウム(Ca(OH)2)を主成分とするソーダライムが多く用いられている。
【0003】
【発明が解決しようとする課題】
しかしながら、この処理方法で使用されている除害処理剤では、その反応性フッ素系ガスの吸収処理能力が低いため、より処理能力の高い除害処理剤が望まれていた。
本発明は、上記した事情に鑑みなされたもので、反応性フッ素系ガスの除害処理能力に優れた反応性フッ素系ガスの除害処理剤および反応性フッ素系ガスの除害方法を提供することを目的とする。
【0004】
【課題を解決するための手段】
かかる課題を解決するため、
請求項1にかかる発明は、水酸化カルシウムを主成分とする処理剤を、二酸化炭素濃度100ppm〜500ppmの二酸化炭素含有窒素ガスに接触させて処理して得られたものであることを特徴とする反応性フッ素系ガスの除害処理剤である。
【0005】
請求項2にかかる発明は、水酸化カルシウムを主成分とする処理剤を、二酸化炭素濃度100ppm〜500ppmの二酸化炭素含有窒素ガスに接触させて処理した後、該処理剤に、反応性フッ素系ガスを含有するガスを接触処理させることを特徴とする反応性フッ素系ガスの除害方法である。
【0006】
【発明の実施の形態】
本発明の反応性フッ素系ガスの除害処理剤は、半導体製造工程などから排出されるガス中に含まれる反応性フッ素系ガスを無害化する除害処理剤であって、水酸化カルシウムを主成分とする処理剤(以下、水酸化カルシウム含有処理剤または処理剤ということがある)を、二酸化炭素濃度100ppm〜500ppmの二酸化炭素含有窒素ガスと接触させて処理して得られたものである。水酸化カルシウム含有処理剤としては、ソーダライムを含むものを用いることができる。
【0009】
このとき、二酸化炭素(CO 2 )含有窒素ガス中のCO 2 濃度を100ppm以上500ppm以下とすることで、反応性フッ素系ガスの除害処理能力を高めることができる。
これは、水酸化カルシウム含有処理剤の一部がCO2によって炭酸カルシウムとなることによって、その表面に体積膨張により微細な割れが起き、表面積が大きくなることによるものと推測される。
CO2濃度が上記範囲未満であると、除害処理能力を高める十分な効果が得られない。またCO2濃度が上記範囲を越えると、水酸化カルシウム含有処理剤の炭酸カルシウム化が過剰となり、反応性フッ素系ガスの除害処理能力が低下する。
【0010】
以下、本発明の反応性フッ素系ガスの除害処理剤を用いて反応性フッ素系ガスを除害する方法の一例について説明する。
図1に示すように、充填筒1に、水酸化カルシウム含有処理剤(例えばソーダライム)Mを充填する。
弁2及び弁3を開にし、弁12及び13を閉にして、二酸化炭素含有窒素ガスNgを、管路4より弁2、管路5を介して充填筒1に導入し、管路6、弁3、管路7を介して導出する。これによって、充填筒1内の処理剤Mを二酸化炭素含有窒素ガスNgに接触させ、除害処理剤M0を得る。
処理剤Mを二酸化炭素含有窒素ガスに接触させることによって、処理剤Mを覆っている水分含有成分を除去することができる。このため、処理剤M表面が露出した除害処理剤M0が得られる。
【0011】
次いで、弁2、3を閉にし、二酸化炭素含有窒素ガスNgの充填筒1への導入を停止する。次いで、弁12、13を開にして、半導体製造工程等の被処理ガス源10から、反応性フッ素系ガスを含有する被処理ガスFgを、管路8、弁12、管路5を介して充填筒1に導入し、除害処理剤M0に接触させる。
除害処理剤M0は、上記二酸化炭素含有窒素ガス処理によって、水分含有成分が除去された状態となっているため、この水分含有成分に妨げられることなく、被処理ガスFg中の反応性フッ素系ガスを効率よく吸収する。
このため、充填筒1を経た被処理ガスFgは、反応性フッ素系ガスが除去されて無害化された状態で、管路6、9を通して放出ガスF0として導出される。
この除害処理を長時間行うことによって、除害処理剤M0は吸収能力が飽和に近づき、放出ガスF0中の反応性フッ素系ガス濃度が高くなり、許容値(例えば3ppm)に達した場合には、除害処理剤M0を新たな処理剤に交換し、この処理剤に上記二酸化炭素含有窒素ガス処理を施した後、被処理ガスFgの処理を行う。
【0012】
<参考例1>
ソーダライムからなる処理剤Mを、直径40mmの充填筒1に高さ20cmとなるように充填した。
この充填筒1に、窒素Ngを24時間にわたって流量20L/minで導入し、この窒素を処理剤Mに接触させて除害処理剤M0を得た。
図1に示す装置を用い、以下に示す被処理ガスFgを充填筒1に空筒速度10cm/sの条件で流した。
・フッ化水素(HF):1.5容量%
・四フッ化珪素(SiF4):0.6容量%
・窒素ガス(N2):97.9容量%
管路9からの放出ガスF0中のフッ化水素(HF)濃度をガス検知器にて測定した結果、放出ガスF0のフッ化水素(HF)濃度が許容濃度(3ppm)に達するまでの時間(破過時間)は400時間であった。
【0013】
<参考例2>
参考例1で用いたものと同様の処理剤Mを大気中に24時間放置した後、直径40mmの充填筒1に高さ20cmとなるように充填した。
この充填筒1に、窒素を流量20L/minで24時間にわたって導入して除害処理剤M0を得た。
参考例1で用いたものと同じ組成の被処理ガスFgを、参考例1と同じ空筒速度で充填筒1に流したところ、破過時間は530時間となった。
【0014】
<参考例3>
参考例1で用いたものと同様の処理剤Mを、そのまま直径40mmの充填筒1に高さ20cmとなるように充填した。
この充填筒1に、乾燥空気を流量8L/minで24時間にわたって導入して除害処理剤M0を得た。
参考例1で用いたものと同じ組成の被処理ガスFgを、参考例1と同じ空筒速度で充填筒1に流したところ、破過時間は530時間となった。
【0015】
<実施例>
参考例1で用いたものと同様の処理剤Mを、そのまま直径40mmの充填筒1に高さ20cmとなるように充填した。
この充填筒1に、二酸化炭素100ppmを含む窒素ガスを、流量20L/minで24時間にわたって導入して除害処理剤M0を得た。
参考例1で用いたものと同じ組成の被処理ガスFgを、参考例1と同じ空筒速度で充填筒1に流したところ、破過時間は500時間となった。
【0016】
<比較例>
参考例1で用いたものと同様の処理剤Mを、そのまま直径40mmφの充填筒1に高さ20cmに充填した。
処理剤Mを二酸化炭素含有窒素ガスNgに接触させる処理を行わず、参考例1で用いたものと同じ組成の被処理ガスFgを、参考例1と同じ空筒速度で充填筒1に流したところ、破過時間は180時間となった。
【0017】
上記したように、二酸化炭素含有窒素ガス処理を行う実施例では、二酸化炭素含有窒素ガス処理を行わない比較例に比べ、除害処理剤M0の寿命が大幅に延びたことががわかった。
なお、本発明での処理対象となる反応性フッ素系ガスは、上記フッ化水素、四フッ化珪素に限定されるものでなく、フッ素、六フッ化タングステン、三フッ化硼素等の反応性のフッ素化合物であればいかなるものでも同様の除害処理効果を得ることができる。
【0018】
【発明の効果】
本発明の反応性フッ素系ガスの除害処理剤は、水酸化カルシウムを主成分とする処理剤を二酸化炭素濃度100ppm〜500ppmの二酸化炭素含有窒素ガスと接触させて処理して得られるものであるので、優れた除害能力を得ることができる。さらには、除害処理活用寿命を著しく延長させることが可能となり、運転コストを低減することができる。
【図面の簡単な説明】
【図1】 本発明の反応性フッ素系ガスの除害方法を実施可能な反応性フッ素系ガスの除害装置を示す系統図。
【符号の説明】
1…充填筒、10…被処理ガス源、M…水酸化カルシウムを主成分とする処理剤、M0…除害処理剤、Ng…窒素含有ガス(窒素を含むガス)、Fg…反応性フッ素系ガスを含有する被処理ガス、F0…放出ガス[0001]
BACKGROUND OF THE INVENTION
In the present invention, when reactive fluorine-based gases such as hydrogen fluoride, fluorine, tungsten hexafluoride, silicon tetrafluoride, and boron trifluoride used mainly in semiconductor manufacturing processes are discharged, The present invention relates to an abatement treatment agent and an abatement method for detoxifying a system gas.
[0002]
[Prior art]
In the semiconductor industry, reactive fluorine-based gases are used in semiconductor manufacturing processes such as CVD, vacuum deposition, and sputtering. Also, in the process of using a stable fluorine compound such as PFC (perfluoro compound gas), a reactive fluorine-based gas is by-produced by plasma.
Conventionally, when the reactive fluorine-based gas is discharged, a detoxification process is performed in which the reactive fluorine-based gas is brought into contact with a treatment agent to be absorbed and detoxified.
As this detoxifying agent, soda lime containing calcium hydroxide (Ca (OH) 2 ) as a main component is often used.
[0003]
[Problems to be solved by the invention]
However, since the abatement treatment agent used in this treatment method has a low ability to absorb reactive fluorine-based gas, an abatement treatment agent with higher treatment capability has been desired.
The present invention has been made in view of the above circumstances, and provides a reactive fluorine-based gas removal treatment agent and a reactive fluorine-based gas removal method excellent in reactive fluorine-based gas removal treatment capability. For the purpose.
[0004]
[Means for Solving the Problems]
To solve this problem,
The invention according to
[0005]
In the invention according to claim 2, after the treatment agent containing calcium hydroxide as a main component is contacted with a carbon dioxide-containing nitrogen gas having a carbon dioxide concentration of 100 ppm to 500 ppm, the treatment agent is reacted with a reactive fluorine-based gas. This is a method for removing reactive fluorine-based gas, which comprises subjecting a gas containing hydrogen to contact treatment.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
The reactive fluorine-based gas detoxifying agent of the present invention is a detoxifying agent for detoxifying reactive fluorine-based gas contained in a gas discharged from a semiconductor manufacturing process or the like, and is mainly composed of calcium hydroxide. A treatment agent (hereinafter sometimes referred to as a calcium hydroxide-containing treatment agent or a treatment agent ) as a component is obtained by contacting with a carbon dioxide-containing nitrogen gas having a carbon dioxide concentration of 100 ppm to 500 ppm . As the calcium hydroxide-containing treatment agent, one containing soda lime can be used.
[0009]
At this time, by setting the CO 2 concentration in the carbon dioxide (CO 2 ) -containing nitrogen gas to 100 ppm or more and 500 ppm or less, it is possible to increase the detoxification processing capacity of the reactive fluorine-based gas.
This is presumably because part of the calcium hydroxide-containing treatment agent is converted to calcium carbonate by CO 2 , whereby fine cracks occur on the surface due to volume expansion and the surface area increases.
If the CO 2 concentration is less than the above range, a sufficient effect of increasing the detoxification treatment capacity cannot be obtained. On the other hand, when the CO 2 concentration exceeds the above range, the calcium carbonate-containing treatment agent becomes excessively converted to calcium carbonate, and the detoxification treatment ability of the reactive fluorine-based gas is lowered.
[0010]
Hereinafter, an example of a method for detoxifying reactive fluorine-based gas using the reactive fluorine-based gas detoxifying agent of the present invention will be described.
As shown in FIG. 1, a
The valves 2 and 3 are opened, the
By bringing the treatment agent M into contact with the carbon dioxide-containing nitrogen gas , the moisture-containing component covering the treatment agent M can be removed. For this reason, the abatement treatment agent M0 with the surface of the treatment agent M exposed is obtained.
[0011]
Next, the valves 2 and 3 are closed, and the introduction of the carbon dioxide-containing nitrogen gas Ng into the filling
The detoxifying agent M0 is in a state in which the moisture-containing component has been removed by the carbon dioxide-containing nitrogen gas treatment, so that the reactive fluorine system in the gas Fg to be treated is not hindered by the moisture-containing component. Absorbs gas efficiently.
Therefore, the gas to be treated Fg that has passed through the filling
By performing this detoxification treatment for a long time, the detoxification treatment agent M0 is close to saturation in absorption capacity, and the concentration of the reactive fluorine-based gas in the released gas F0 increases and reaches an allowable value (for example, 3 ppm) Replaces the detoxification treatment agent M0 with a new treatment agent, and after the treatment agent is treated with the carbon dioxide-containing nitrogen gas , the treatment gas Fg is treated.
[0012]
< Reference Example 1>
Treatment agent M made of soda lime was filled into a filling
Nitrogen Ng was introduced into the filling
Using the apparatus shown in FIG. 1, the gas to be treated Fg shown below was caused to flow through the filling
・ Hydrogen fluoride (HF): 1.5% by volume
・ Silicon tetrafluoride (SiF 4 ): 0.6% by volume
Nitrogen gas (N 2 ): 97.9% by volume
As a result of measuring the hydrogen fluoride (HF) concentration in the released gas F0 from the pipe 9 with the gas detector, the time until the hydrogen fluoride (HF) concentration in the released gas F0 reaches the allowable concentration (3 ppm) ( The breakthrough time was 400 hours.
[0013]
< Reference Example 2>
The same treatment agent M as that used in Reference Example 1 was left in the atmosphere for 24 hours, and then filled into a filling
Nitrogen was introduced into the filling
When the gas Fg having the same composition as that used in Reference Example 1 was allowed to flow through the filling
[0014]
< Reference Example 3>
The same treatment agent M as that used in Reference Example 1 was filled as it was in a filling
Dry gas was introduced into the filling
When the gas Fg having the same composition as that used in Reference Example 1 was allowed to flow through the filling
[0015]
<Example>
The same treatment agent M as that used in Reference Example 1 was filled as it was in a
Nitrogen gas containing 100 ppm of carbon dioxide was introduced into the filling
When the gas Fg having the same composition as that used in Reference Example 1 was allowed to flow through the filling
[0016]
<Comparative example>
The same treatment agent M as that used in Reference Example 1 was directly filled in a
The treatment agent M without performing the processing of contacting the carbon dioxide-containing nitrogen gas Ng, the treated gas Fg of the same composition as that used in Reference Example 1, was passed to the filling
[0017]
As described above, it was found that in the example in which the carbon dioxide-containing nitrogen gas treatment was performed, the life of the detoxifying agent M0 was greatly extended compared to the comparative example in which the carbon dioxide-containing nitrogen gas treatment was not performed.
The reactive fluorine-based gas to be treated in the present invention is not limited to the above-mentioned hydrogen fluoride and silicon tetrafluoride, but reactive gases such as fluorine, tungsten hexafluoride, boron trifluoride and the like. The same detoxification effect can be obtained with any fluorine compound.
[0018]
【The invention's effect】
The reactive fluorine gas detoxifying agent of the present invention is obtained by bringing a treating agent mainly composed of calcium hydroxide into contact with carbon dioxide-containing nitrogen gas having a carbon dioxide concentration of 100 ppm to 500 ppm. So you can get excellent abatement ability. Furthermore, it is possible to significantly extend the useful life of the abatement treatment, and to reduce the operating cost.
[Brief description of the drawings]
FIG. 1 is a system diagram showing a reactive fluorine-based gas removal apparatus capable of implementing the reactive fluorine-based gas removal method of the present invention.
[Explanation of symbols]
DESCRIPTION OF
Claims (2)
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JP5709606B2 (en) * | 2011-03-30 | 2015-04-30 | 京セラ株式会社 | Decomposition treatment agent |
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