JP3690098B2 - Inkjet recording head - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
In the present invention, a part of the pressure generating chamber communicating with the nozzle opening for ejecting ink droplets is constituted by a vibration plate, and a piezoelectric layer is formed on the surface of the vibration plate. The present invention relates to an ink jet recording head to be ejected.
[0002]
[Prior art]
A part of the pressure generation chamber that communicates with the nozzle opening that ejects ink droplets is composed of a diaphragm, and the diaphragm is deformed by a piezoelectric vibrator to pressurize the ink in the pressure generation chamber and eject ink droplets from the nozzle opening. Two types of ink jet recording heads have been put into practical use, one using a piezoelectric vibrator in a longitudinal vibration mode in which a piezoelectric vibrator extends and contracts in the axial direction and one using a piezoelectric vibrator in a flexural vibration mode. Yes.
[0003]
The former can change the volume of the pressure generation chamber by bringing the end face of the piezoelectric vibrator into contact with the vibration plate, making it possible to manufacture a head suitable for high-density printing. There is a problem that the manufacturing process is complicated because it requires a difficult process of cutting into a comb-tooth shape in accordance with the arrangement pitch of the above and an operation of positioning and fixing the cut piezoelectric vibrator in the pressure generating chamber.
[0004]
On the other hand, in the latter case, a piezoelectric vibrator can be formed on the diaphragm by a relatively simple process of attaching a green sheet of piezoelectric material in accordance with the shape of the pressure generating chamber and firing it. In order to use vibration, a certain area is required, and there is a problem that high-density arrangement is difficult.
[0005]
On the other hand, in order to eliminate the inconvenience of the latter recording head, a uniform piezoelectric material layer is formed by a film forming technique over the entire surface of the diaphragm as seen in Japanese Patent Laid-Open No. 5-286131. A material in which a piezoelectric layer is formed by cutting a material layer into a shape corresponding to a pressure generation chamber by a lithography method so as to be independent for each pressure generation chamber has been proposed.
[0006]
This eliminates the need to affix the piezoelectric vibrator to the diaphragm, so that not only can the piezoelectric vibrator be created by a precise and simple technique called lithography, but also the thickness of the piezoelectric vibrator can be reduced. There is an advantage that it can be made thin and can be driven at high speed.
[0007]
In this case, for example, a silicon single crystal substrate is used as the substrate, and a flow path such as a pressure generation chamber or a reservoir is formed by anisotropic etching, and the opening area of the pressure generation chamber is made as small as possible to achieve a recording density. It is possible to improve.
[0008]
[Problems to be solved by the invention]
However, in order to increase the recording density, the thickness of the partition wall defining the pressure generating chamber has to be reduced, thereby reducing the rigidity of the partition wall defining the pressure generating chamber, thereby causing crosstalk and ink droplet ejection. There are problems such as defects.
[0009]
In view of such circumstances, it is an object of the present invention to provide an ink jet recording head capable of preventing crosstalk and ink droplet ejection failure with improved recording density.
[0010]
[Means for Solving the Problems]
A first aspect of the present invention that solves the above-described problems includes a row of pressure generation chambers that communicate with a nozzle opening on one side and is partitioned by a plurality of partition walls, and a portion of the pressure generation chamber is configured on the other side. A flow path forming substrate having a piezoelectric vibrator comprising a vibrating plate and a piezoelectric active portion formed in a region facing the pressure generating chamber, and the pressure bonded to the one surface side of the flow path forming substrate In an ink jet recording head comprising a sealing plate for sealing a generation chamber, a first backing made of the same material as the flow path forming substrate is provided on the opposite side of the flow path forming substrate from the sealing plate. In the ink jet recording head, a material and a second backing material made of the same material as the sealing plate are formed.
[0011]
In the first aspect, warping during joining can be prevented with a plurality of backing materials, and further, crosstalk can be prevented, and the entire balance when joined can be prevented, preventing warping. Is done.
[0012]
According to a second aspect of the present invention, in the first aspect, the first backing material is directly bonded to the flow path forming substrate, and the second backing material forms the flow path of the first backing material. The inkjet recording head is bonded to the side opposite to the substrate.
[0013]
In the second aspect, the first backing material and the second backing material can balance the flow path forming substrate and the sealing plate, thereby preventing warpage and crosstalk.
[0014]
According to a third aspect of the present invention, in the second aspect, the first backing material includes a recess formed of a space that does not hinder driving of each piezoelectric vibrator, and the partition wall of the flow path forming substrate. An ink jet recording head having a partition wall joined to opposing regions to partition the concave portion.
[0015]
In the third aspect, the flow path forming substrate can be tightly held by the partition wall of the first backing material, and warpage and crosstalk are further prevented.
[0016]
According to a fourth aspect of the present invention, in the third aspect, the width of the partition wall of the first backing material is smaller than the width of the partition wall of the flow path forming substrate. It is in.
[0017]
In the fourth aspect, the partition wall does not increase the rigidity of the diaphragm that seals the pressure generation chamber.
[0024]
According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the sealing plate is a nozzle plate having a nozzle opening that communicates with each of the pressure generating chambers. In the recording head.
[0025]
In the fifth aspect, ink is ejected from the nozzle opening of the sealing plate.
[0026]
According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the pressure generating chamber is formed on a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric vibrator is formed and lithographically processed. In the ink jet recording head, the ink jet recording head is formed.
[0027]
In the sixth aspect, an ink jet recording head having high-density nozzle openings can be manufactured in a large amount and relatively easily.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on embodiments.
[0029]
(Embodiment 1)
FIG. 1 is an assembled perspective view showing an ink jet recording head according to Embodiment 1 of the present invention, and FIG. 2 is a view showing a sectional structure in the longitudinal direction and width direction of one pressure generating chamber.
[0030]
As shown in the drawing, the flow path forming substrate 10 is composed of a silicon single crystal substrate having a plane orientation (110) in this embodiment. As the flow path forming substrate 10, one having a thickness of about 150 to 300 μm is usually used, preferably about 180 to 280 μm, more preferably about 220 μm. This is because the arrangement density can be increased while maintaining the rigidity of the partition between adjacent pressure generating chambers.
[0031]
One surface of the flow path forming substrate 10 is an opening surface, and an elastic film 50 having a thickness of 1 to 2 μm made of silicon dioxide previously formed by thermal oxidation is formed on the other surface.
[0032]
On the other hand, two rows 13 of pressure generating chambers 12 partitioned by a plurality of partition walls 11 and two rows of pressure are formed on the opening surface of the flow path forming substrate 10 by anisotropic etching of the silicon single crystal substrate. A reservoir 14 arranged in a substantially U-shape so as to surround three sides of the row 13 of the generation chamber 12 and an ink supply port 15 that connects the pressure generation chamber 12 and the reservoir 14 with a certain fluid resistance are formed. Yes. Note that an ink introduction hole 16 for supplying ink from the outside to the reservoir 14 is formed in a substantially central portion of the reservoir 14.
[0033]
Here, in the anisotropic etching, when the silicon single crystal substrate is immersed in an alkaline solution such as KOH, the first (111) plane perpendicular to the (110) plane is gradually eroded and the first (111) ) Surface and an angle of about 70 degrees and the above (110) and a second (111) surface of about 35 degrees appear, and the (111) surface compared to the etching rate of the (110) surface. The etching rate is about 1/180. By this anisotropic etching, precision processing can be performed based on the parallelogram depth processing formed by two first (111) surfaces and two oblique second (111) surfaces. The pressure generating chambers 12 can be arranged with high density.
[0034]
In the present embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane and the short side is formed by the second (111) plane. The pressure generation chamber 12 is formed by etching until it substantially passes through the flow path forming substrate 10 and reaches the elastic film 50. Here, the amount of the elastic film 50 that is affected by the alkaline solution for etching the silicon single crystal substrate is extremely small. Each ink supply port 15 communicating with one end of each pressure generation chamber 12 is formed shallower than the pressure generation chamber 12. That is, the ink supply port 15 is formed by etching (half etching) the silicon single crystal substrate halfway in the thickness direction. Half etching is performed by adjusting the etching time.
[0035]
Further, a nozzle plate 18 having a nozzle opening 17 communicating with the side opposite to the ink supply port 15 of each pressure generating chamber 12 is provided on the opening surface side of the flow path forming substrate 10 with an adhesive, a heat-welded film, or the like. It is fixed through. The nozzle plate 18 has a thickness of, for example, 0.1 to 1 mm and a linear expansion coefficient of 300 ° C. or less, for example, 2.5 to 4.5 [× 10 ⁻⁶ / ° C.], or Made of non-rust steel. The nozzle plate 18 entirely covers one surface of the flow path forming substrate 10 on one side, and also serves as a reinforcing plate that protects the silicon single crystal substrate from impact and external force.
[0036]
Here, the size of the pressure generation chamber 12 that applies ink droplet discharge pressure to the ink and the size of the nozzle opening 17 that discharges the ink droplet are optimized in accordance with the amount of ink droplet to be discharged, the discharge speed, and the discharge frequency. The For example, when 360 ink droplets are recorded per inch, it is necessary to accurately form the nozzle openings 17 with a groove width of several tens of μm.
[0037]
On the other hand, on the elastic film 50 opposite to the opening surface of the flow path forming substrate 10, a lower electrode film 60 having a thickness of, for example, about 0.5 μm and a piezoelectric film having a thickness of, for example, about 1 μm. 70 and an upper electrode film 80 having a thickness of, for example, about 0.1 μm are laminated by a process described later to constitute a piezoelectric vibrator (piezoelectric element). As described above, in the region facing the pressure generation chambers 12 of the elastic film 50, the piezoelectric vibrator is provided independently for each pressure generation chamber 12, but in this embodiment, the lower electrode film 60 is Although the common electrode of the piezoelectric vibrator is used and the upper electrode film 80 is an individual electrode of the piezoelectric vibrator, there is no problem even if it is reversed for the convenience of the drive circuit and wiring. In any case, a piezoelectric active part is formed for each pressure generating chamber 12.
[0038]
Further, a first backing material 110 is fixed on the elastic film 50 on the piezoelectric active part side, and a second backing material 120 is fixed on the upper surface thereof.
[0039]
The first backing material 110 is made of a material having a linear expansion coefficient that is close to the linear expansion coefficient of the flow path forming substrate 10, and does not hinder the driving of the piezoelectric vibrator in a region facing each pressure generation chamber 12. A groove portion 111 having a space is provided, and the groove portion 111 is formed so as to penetrate the first backing material 110 and is partitioned by partition walls 112. The partition wall 112 is formed in a region facing the partition wall 11 of the flow path forming substrate 10. In this embodiment, the partition wall 112 is formed to be narrower than the partition wall 11. The first backing material 110 is fixed to an end portion of the flow path forming substrate 10 and a region facing the partition wall 11 with an adhesive or the like. At this time, it is preferable that the first backing material 110 is removed up to the lower electrode film 60 and directly adhered onto the elastic film 50 as in the present embodiment. The piezoelectric layer 70 may be removed and adhered to the lower electrode film 60. In any case, the flow path forming substrate 10 and the first backing plate 110 are joined well.
[0040]
The material of the first backing material 110 is preferably a material having a linear expansion coefficient as close as possible to the flow path forming substrate 10. In the present embodiment, a single silicon material that is the same material as the flow path forming substrate 10 is used. A crystal substrate was used. Further, the size of the groove portion 111 defined in the first backing material 110 is not particularly limited as long as it has a size that does not hinder the driving of the piezoelectric vibrator, but in the present embodiment, the partition wall Since the width of 112 is narrower than that of the partition wall 11, the partition wall 112 does not press the diaphragm in the region facing the pressure generating chamber 12 and the rigidity thereof is not increased.
[0041]
On the other hand, the second backing material 120 is made of a material having a linear expansion coefficient close to the linear expansion coefficient of the nozzle plate 18, and is fixed to the upper surface of the first backing material 110 to completely seal the groove portion 111 of the first backing material 110. To do.
[0042]
The material of the second backing material 120 may be any material as long as it has a linear expansion coefficient as close as possible to the nozzle plate 18, but in the present embodiment, the same material as the nozzle plate 18, such as glass ceramic, is used. When silicon is used as the material of the first backing material 110, it is preferable to use a material having a linear expansion coefficient close to that of silicon for the second backing material 120. The shape of the second backing material 120 is not particularly limited, but is preferably a shape that approximates the nozzle plate 18.
[0043]
In addition, the order of joining the first backing material 110 and the second backing material 120 is not particularly limited, but it is preferable that the joining is performed in an order in which the overall balance is achieved. That is, when the flow path forming substrate 10 and the nozzle plate 18 are bonded in advance, it is preferable that the first backing material 110 and the second backing material 120 are bonded and then bonded together.
[0044]
Here, a process of forming the piezoelectric film 70 and the like on the flow path forming substrate 10 made of a silicon single crystal substrate will be described with reference to FIGS.
[0045]
As shown in FIG. 3A, first, an elastic film 50 made of silicon dioxide is formed by thermally oxidizing a silicon single crystal substrate wafer to be the flow path forming substrate 10 in a diffusion furnace at about 1100 ° C.
[0046]
Next, as shown in FIG. 3B, the lower electrode film 60 is formed by sputtering. As a material of the lower electrode film 60, Pt or the like is suitable. This is because a piezoelectric film 70 described later formed by sputtering or a sol-gel method needs to be crystallized by firing at a temperature of about 600 to 1000 ° C. in an air atmosphere or an oxygen atmosphere after the film formation. It is. That is, the material of the lower electrode film 60 must be able to maintain conductivity at such a high temperature and in an oxidizing atmosphere. In particular, when PZT is used as the piezoelectric film 70, the conductivity due to the diffusion of PbO. It is desirable that there is little change in properties, and Pt is preferred for these reasons.
[0047]
Next, as shown in FIG. 3C, a piezoelectric film 70 is formed. Sputtering can also be used to form the piezoelectric film 70. In this embodiment, a so-called sol in which a metal organic material is dissolved and dispersed in a solvent is applied, dried, gelled, and further baked at a high temperature. A so-called sol-gel method for obtaining a piezoelectric film 70 made of a metal oxide is used. As a material of the piezoelectric film 70, a lead zirconate titanate (PZT) -based material is suitable when used for an ink jet recording head.
[0048]
Next, as shown in FIG. 3D, an upper electrode film 80 is formed. The upper electrode film 80 may be made of a highly conductive material, and many metals such as Al, Au, Ni, and Pt, conductive oxides, and the like can be used. In this embodiment, Pt is formed by sputtering.
[0049]
Next, as shown in FIG. 3E, the upper electrode film 80 and the piezoelectric film 70 are patterned so that a piezoelectric vibrator is provided for each pressure generating chamber 12. FIG. 3E shows a case where the piezoelectric film 70 is patterned with the same pattern as the upper electrode film 80. However, as described above, the piezoelectric film 70 does not necessarily need to be patterned. This is because, when a voltage is applied using the pattern of the upper electrode film 80 as an individual electrode, the electric field is applied only between the upper electrode film 80 and the lower electrode film 60, which is a common electrode. This is because it has no effect. However, in this case, in order to obtain the same excluded volume, it is necessary to apply a large voltage, so it is preferable to pattern the piezoelectric film 70 as well. Thereafter, the lower electrode film 60 may be patterned to remove an unnecessary portion, for example, the vicinity of the inside of the edge on both sides in the width direction of the pressure generating chamber 12. Note that the lower electrode film 60 does not necessarily need to be removed, and when removed, the thickness may be reduced without removing everything.
[0050]
Here, the patterning is performed by forming a resist pattern and then performing etching or the like.
[0051]
The resist pattern is formed by applying a negative resist by spin coating or the like and performing exposure, development and baking using a mask having a predetermined shape. Of course, a positive resist may be used instead of the negative resist.
[0052]
Etching is performed using a dry etching apparatus, for example, an ion milling apparatus. Note that after the etching, the resist pattern is removed by using an ashing device or the like.
[0053]
In addition to the ion milling method, a reactive etching method or the like may be used as the dry etching method. It is also possible to use wet etching instead of dry etching, but it is preferable to use dry etching because the patterning accuracy is somewhat inferior compared to the dry etching method and the material of the upper electrode film 80 is limited. .
[0054]
Next, as shown in FIG. 4A, the insulator layer 90 is formed so as to cover the peripheral edge of the upper electrode film 80 and the side surface of the piezoelectric film 70. A suitable material for the insulator layer 90 is as described above, but in this embodiment, a negative photosensitive polyimide is used.
[0055]
Next, as shown in FIG. 4B, by patterning the insulator layer 90, contact holes 90a are formed in portions facing the communication portions 14. The contact hole 90a is for connecting a lead electrode 100 and an upper electrode film 80 described later.
[0056]
Next, for example, a lead electrode 100 is formed by forming a conductor such as Cr—Au on the entire surface and then patterning it.
[0057]
The above is the film forming process. After forming the film in this way, as shown in FIG. 4C, the silicon single crystal substrate is anisotropically etched with the alkali solution described above to form the pressure generating chamber 12 and the like.
[0058]
In the series of film formation and anisotropic etching described above, a large number of chips are simultaneously formed on a single wafer, and after the completion of the process, a flow path forming substrate 10 having a single chip size as shown in FIG. Divide every time. Further, the divided flow path forming substrate 10 is sequentially bonded and integrated with the nozzle plate 18, the first backing material 110, and the second backing material 120 to form an ink jet recording head.
[0059]
At this time, in the present embodiment, the first backing material 110 and the second backing material 120 are fixed to the elastic film 50, thereby preventing warpage during bonding. In addition, the elastic film 50 is sandwiched between the whole and the flow path forming substrate 10 and the nozzle plate 18 can be balanced. Further, the deformation of the elastic plate 50 is limited to a region facing the pressure generation chamber 12 while being received by the partition wall 11 and the partition wall 112 of the first backing material 110. Therefore, when ink droplets are ejected, the stress acting on the pressure generating chamber 12 is prevented from propagating to the partition walls 11 of the flow path forming substrate 10 partitioning the other pressure generating chambers 12, and the occurrence of crosstalk is prevented. The
[0060]
The ink jet head configured in this manner takes in ink from an ink introduction port 16 connected to an external ink supply means (not shown), fills the interior from the reservoir 14 to the nozzle opening 17 with ink, and then external drive circuit (not shown) In accordance with the recording signal from, a voltage is applied between the lower electrode film 60 and the upper electrode film 80 via the lead electrode 100 to cause the elastic film 50 and the piezoelectric film 70 to bend and deform, whereby the pressure generating chamber 12 The internal pressure increases and ink droplets are ejected from the nozzle openings 17.
[0061]
(Embodiment 2)
FIG. 5 is an exploded perspective view of the ink jet recording head according to the second embodiment.
[0062]
As shown in FIG. 5, this embodiment is implemented except that a frame member 130 that defines a through portion 131 that is a space that does not hinder the driving of the piezoelectric vibrator is used instead of the first backing material 110. This is the same as the first embodiment.
[0063]
As a result, since the entire piezoelectric vibrator is held in the through portion 131 of the frame member 130, the warpage of the flow path forming substrate 10 is prevented, and the vibration of the diaphragm is suppressed, thereby generating crosstalk. Can be suppressed.
[0064]
(Other embodiments)
While the embodiments of the present invention have been described above, the basic configuration of the ink jet recording head is not limited to that described above.
[0065]
The ink jet recording head of the above-described embodiment may be further fixed to a fixing member 140 having a recess for holding the flow path forming substrate 10 and the like, as shown in FIG. As a result, the vibration of the diaphragm can be more reliably suppressed, and the occurrence of crosstalk or the like can be prevented.
[0066]
Further, for example, as shown in the cross section of the main part of the ink jet recording head of FIG. 7, the second backing material is formed so that the depth of the groove 111 of the first backing material 110 is large and does not come into contact with the upper electrode film 80. The inner surface of 120 may be filled with a porous material 150 impregnated with silicon oil or the like having a low water content, or may be filled with a dry inert gas. Thereby, intrusion of air in the environment can be prevented, and the piezoelectric film 70 can be isolated from moisture, so that deterioration due to moisture absorption and a decrease in dielectric strength can be prevented.
[0067]
Furthermore, in the above-described embodiment, the reservoir 14 is formed together with the pressure generating chamber 12 on the flow path forming substrate 10, but a member that forms a common ink chamber may be provided on the flow path forming substrate 10.
[0068]
FIG. 8 shows a partial cross section of the ink jet recording head configured as described above. In this embodiment, the sealing plate 160, the common ink chamber forming plate 170, the thin plate 180, and the ink chamber side plate 170 are sandwiched between the nozzle substrate 18A in which the nozzle openings 17A are formed and the flow path forming substrate 10A. A nozzle communication port 31 that communicates the pressure generation chamber 12A and the nozzle opening 17A is disposed so as to penetrate these. That is, the sealing plate 160, the common ink chamber forming plate 190, and the thin plate 180 define the common ink chamber 32, and each pressure generating chamber 12A and the common ink chamber 32 are formed in the sealing plate 160. The ink communication holes 33 communicate with each other.
[0069]
The sealing plate 160 is also provided with an ink introduction hole 34 for introducing ink from the outside into the supply ink chamber 32.
[0070]
Further, the ink chamber side plate 190 located between the thin plate 180 and the nozzle substrate 18A is formed with a through portion 35 at a position facing each supply ink chamber 32, and a nozzle opening generated when ink droplets are ejected. The thin wall 180 is allowed to absorb the pressure toward the side opposite to 17A, so that unnecessary positive or negative pressure is passed to the other pressure generation chamber via the common ink chamber 32. Can be prevented from being added. The thin plate 180 and the ink chamber side plate 190 may be integrally formed.
[0071]
Also in such an embodiment, the first backing material 110 and the second backing material as described above are provided in a region facing the partition wall 11 of the flow path forming substrate 10 on the side opposite to the opening surface of the flow path forming substrate 10A. By fixing 120, the vibration of the vibration film 50 can be suppressed and crosstalk can be prevented well. Further, it corresponds to the common ink chamber forming plate 170, the thin plate 180, and the ink chamber side plate 190. A backing material may be further provided. Thereby, the whole balance at the time of joining is taken, and generation | occurrence | production of curvature is prevented.
[0072]
In each of the embodiments described above, a thin film type ink jet recording head that can be manufactured by applying a film forming and lithography process is taken as an example. However, the present invention is not limited to this example. Ink jet recording heads of various structures, such as those that form pressure generation chambers, those that form a piezoelectric film by attaching a green sheet or screen printing, or those that form a piezoelectric film by crystal growth The present invention can be employed.
[0073]
Further, in each of the above-described embodiments, the connection portion between the upper electrode film and the lead electrode may be provided at any location, and may be any end portion or the central portion of the pressure generation chamber.
[0074]
Further, the example in which the insulator layer is provided between the piezoelectric vibrator and the lead electrode has been described. However, the present invention is not limited to this. For example, without providing the insulator layer, an anisotropic conductive film is provided on each upper electrode. It is good also as a structure which heat-welds and connects this anisotropic conductive film with a lead electrode, and connects using various bonding techniques, such as wire bonding.
[0075]
As described above, the present invention can be applied to ink jet recording heads having various structures as long as the gist of the present invention is not contradicted.
[0076]
【The invention's effect】
As described above, in the present invention, since the backing material made of a plurality of materials is fixed to the side opposite to the pressure generation chamber forming surface of the flow path forming substrate, it is possible to prevent warping during bonding. In addition, there is an effect that vibration of the diaphragm can be suppressed and crosstalk can be prevented.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an ink jet recording head according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the ink jet recording head according to Embodiment 1 of the invention.
FIG. 3 is a diagram showing a thin film manufacturing process according to the first embodiment of the present invention.
FIG. 4 is a diagram showing a thin film manufacturing process according to Embodiment 1 of the present invention.
FIG. 5 is an exploded perspective view of an ink jet recording head according to a second embodiment of the invention.
FIG. 6 is an exploded perspective view of an ink jet recording head according to another embodiment of the present invention.
FIG. 7 is a partial cross-sectional view of an ink jet recording head according to another embodiment of the present invention.
FIG. 8 is a partial cross-sectional view of an ink jet recording head according to another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Flow path formation board | substrate 12 Pressure generation chamber 14 Reservoir 15 Ink supply port 16 Ink introduction port 17 Nozzle opening 18 Nozzle plate 50 Elastic film 60 Lower electrode film 70 Piezoelectric film 80 Upper electrode film 90 Insulator layer 90a Contact hole 100 Lead electrode 110 First backing material 120 Second backing material 130 Frame member 140 Fixing member

Claims (6)

Provided on one side with a row of pressure generating chambers communicating with the nozzle openings and partitioned by a plurality of partition walls, on the other side formed in a region facing the pressure generating chamber and a diaphragm constituting a part of the pressure generating chamber An ink jet comprising: a flow path forming substrate provided with a piezoelectric vibrator formed of a piezoelectric active portion, and a sealing plate that is bonded to the one surface side of the flow path forming substrate and seals the pressure generating chamber In the recording head,
On the opposite side of the flow path forming substrate from the sealing plate, a first backing material made of the same material as the flow path forming substrate, and a second backing material made of the same material as the sealing plate, And an ink jet recording head.   2. The first backing material according to claim 1, wherein the first backing material is directly bonded to the flow path forming substrate, and the second backing material is bonded to the opposite side of the first backing material from the flow path forming substrate. An ink jet recording head.   3. The first backing material according to claim 2, wherein the first backing material is joined to a recess formed of a space that does not hinder driving of each piezoelectric vibrator, and a region facing the partition of the flow path forming substrate. An ink jet recording head having a partition wall for partitioning.   4. The ink jet recording head according to claim 3, wherein a width of the partition wall of the first backing material is smaller than a width of the partition wall of the flow path forming substrate.   5. The ink jet recording head according to claim 1, wherein the sealing plate is a nozzle plate having a nozzle opening communicating with each of the pressure generation chambers.   6. The method according to claim 1, wherein the pressure generating chamber is formed on a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric vibrator is formed by film formation and lithography. An ink jet recording head.

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