JP3686649B2 - Conductive heat conductive sheet and method for producing the same - Google Patents
Conductive heat conductive sheet and method for producing the same Download PDFInfo
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- JP3686649B2 JP3686649B2 JP2002324018A JP2002324018A JP3686649B2 JP 3686649 B2 JP3686649 B2 JP 3686649B2 JP 2002324018 A JP2002324018 A JP 2002324018A JP 2002324018 A JP2002324018 A JP 2002324018A JP 3686649 B2 JP3686649 B2 JP 3686649B2
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Description
【０００１】
【発明の属する技術分野】
本発明は、基材に導電性を有する熱伝導フィラーを充填し、混練・成形してなる導電性熱伝導シートに関する。
【０００２】
【従来の技術】
従来より、シリコーン等の基材に熱伝導フィラーを充填し、混練・成形してなる熱伝導シートが考えられている。この種の熱伝導シートは、電気・電子装置の内部において、例えば、発熱源となる電子部品と、放熱板や筐体パネル等といったヒートシンクとなる部品（以下、単にヒートシンクという）との間に介在させるように配置して使用される。このように熱伝導シートを配置した場合、電子部品等が発生する熱をヒートシンク側へ良好に逃がすことができる。このため、この種の熱伝導シートは、例えばＣＰＵの高速化等のために不可欠な素材として注目を集めている。
【０００３】
また、上記熱伝導フィラーとして導電性を有するものを使用して、熱伝導シートに導電性を付与することも考えられている（例えば、特許文献１，２参照。）。この場合、上記電子部品等の一部を接地して、ノイズの除去を図ることができる。
【０００４】
【特許文献１】
実公平７−１１５１９号公報
【特許文献２】
特開平５−２９１７７７号公報
【０００５】
【発明が解決しようとする課題】
ところが、このような導電性熱伝導シートでは、熱伝導性と導電性とを両立させることが困難であった。特に、導電性に関しては、表面にスキン層が形成されるなどの理由によってなかなか充分な導電性が得られず、１０5 Ω・ｃｍ程度が一般的であった。そこで、本発明は、良好な導電性を有する導電性熱伝導シートの提供を目的としてなされた。
【０００６】
【課題を解決するための手段及び発明の効果】
上記目的を達するためになされた請求項１記載の発明は、基材に、導電性を有する熱伝導フィラーを充填し、混練してシート状に成形してなる導電性熱伝導シートであって、上記基材が、末端にビニル基を持ったポリジオルガノシロキサンとケイ素原子結合水素原子を持ったポリジオルガノシロキサンとを、２：３〜１：３（望ましくは１：２）の重量割合で混練してなることを特徴としている。
【０００７】
本願出願人は、末端にビニル基を持ったポリジオルガノシロキサン（以下、シリコーンＡという）とケイ素原子結合水素原子を持ったポリジオルガノシロキサン（以下、シリコーンＢという）とを混練してシートを成形する場合、シリコーンＡの割合を減らすことにより、スキン層の形成を抑制することができることを発見した。但し、シリコーンＡの割合を減らし過ぎると、シートの柔軟性がなくなり、シートが脆くなる。一方、シリコーンＡが多過ぎると、スキン層が形成されて導電性が低下し、更に、架橋が不充分となる可能性が生じる。例えば、シリコーンＡのみではシート状に固めることができない。
【０００８】
本発明では、シリコーンＡとシリコーンＢとを２：３〜１：３の重量割合で混練しているので、シートの機械的特性を確保しつつスキン層が形成されるのを良好に抑制することができ、延いては、シートの導電性を良好に向上させることができる。また、本発明では、このような基材からなるシートに導電性を有する熱伝導フィラーが充填されるので、熱伝導性及び導電性を一層向上させることができる。このため、本発明の導電性熱伝導シートでは、良好な熱伝導性を確保したままで導電性を極めて良好に向上させることができ、熱伝導性と導電性とを両立させることができる。
【０００９】
請求項２記載の発明は、請求項１または２記載の構成に加え、上記熱伝導フィラーが粉末状または繊維状のニッケルコーティンググラファイトまたはニッケルであることを特徴としている。
粉末状または繊維状のニッケルコーティンググラファイトやニッケルは、熱伝導性及び導電性に極めて優れたフィラーである。また、粉末状または繊維状のニッケルコーティンググラファイトまたはニッケルをフィラーとして混練した場合、電磁波ノイズを吸収することも可能となる。従って、本発明では、請求項１記載の発明の効果に加えて、熱伝導性及び導電性を一層良好に両立させると共に、電磁波ノイズをも吸収することができるといった効果が生じる。
【００１０】
請求項３記載の発明は、基材に、導電性を有する熱伝導フィラーを充填し、混練してシート状に成形して導電性熱伝導シートとする導電性熱伝導シートの製造方法であって、上記基材として、末端にビニル基を持ったポリジオルガノシロキサンとケイ素原子結合水素原子を持ったポリジオルガノシロキサンとを、２：３〜１：３の重量割合で混練して使用することを特徴としている。
【００１１】
このため、本発明では、請求項１記載の発明と同様に、得られるシートの機械的特性を確保しつつスキン層が形成されるのを良好に抑制することができ、延いては、シートの導電性を良好に向上させることができる。従って、本発明では、良好な熱伝導性を有し、かつ導電性が極めて良好に向上した導電性熱伝導シートを、容易に製造することができる。
【００１２】
【発明の実施の形態】
次に、本発明の実施の形態を、図面と共に説明する。図１は、本発明が適用された導電性熱伝導シートの構成を模式的に表す説明図である。図１に示すように、本実施の形態の導電性熱伝導シートは、基材１に導電性を有する熱伝導フィラー３を５０〜９０ｗｔ％充填し（望ましくは７５〜９０ｗｔ％）、混練・成形してなるものである。なお、基材１は、末端にビニル基を持ったポリジオルガノシロキサン（シリコーンＡ）とケイ素原子結合水素原子を持ったポリジオルガノシロキサン（シリコーンＢ）とを、２：３〜１：３の重量割合で混練して構成されている。
【００１３】
【実施例】
次に、熱伝導フィラー３としてニッケルコーティンググファイト粉末（平均粒径３０μｍ：ＮＯＶＡＭＥＴ製）を、シリコーンＡとして「ＣＹ５２−２７６Ａ」（商品名：東レダウ製）を、シリコーンＢとして「ＣＹ５２−２７６Ｂ」（商品名：東レダウ製）を、それぞれ使用して、実際に導電性熱伝導シートを作成した。
【００１４】
すなわち、上記シリコーンＡ，Ｂを混練して基材１とし、その基材１及び上記熱伝導フィラー３を２本ロールの混練機を用いて混練した後、成形し、シート状の導電性熱伝導シートを成形した。なお、熱伝導フィラー３は、基材１に対して８０ｗｔ％混練した。また、上記混練の方法としては、２本ロールを用いて混練する方法の他、真空脱泡ミキサー，ニーダ，バンバリーミキサー等の種々の方法を適用することができる。得られた導電性熱伝導シートの導電性を表１に示す。
【００１５】
【表１】
【００１６】
本願出願人は、シリコーンＡとシリコーンＢとを混練してシートを成形する場合、シリコーンＡの割合を減らすことにより、スキン層の形成を抑制することができることを発見した。但し、シリコーンＡの割合を減らし過ぎると、シートの柔軟性がなくなり、シートが脆くなる。一方、シリコーンＡが多過ぎると、スキン層が形成されて導電性が低下し、更に、架橋が不充分となる可能性が生じる。例えば、シリコーンＡのみではシート状に固めることができない。
【００１７】
上記実施例では、シリコーンＡ，Ｂを上記割合で混練したことにより、シートの機械的特性を確保しつつ、基材１の表面にスキン層が形成されるのを極めて良好に防止することができ、延いては、前述のように導電性を向上させることができた。また、上記実施例では、上記機械的特性を確保したことにより、ヒートシンクや電子部品への密着性も良好に確保することができ、引裂強度も良好に向上させることができた。この引裂強度の向上により、上記実施例では、アッセンブリ性（貼り替え易さ）も向上させることができた。更に、上記実施例では、ゲル状物質である上記各ポリジオルガノシロキサンを基材１として用いたため、熱伝導率も２．１Ｗ／ｍ・Ｋと良好であった。
【００１８】
このため、上記実施例では、電子部品等が発生する熱をヒートシンク側へ良好に逃がすことができると共に、その電子部品等の一部を良好に接地してノイズの除去及び電磁波ノイズの吸収を図ることができる。また、アッセンブリ性も向上しているので、経済性にも優れている。
【００１９】
なお、本発明は上記実施例に何等限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の形態で実施することができる。例えば、熱伝導フィラーとしては、ニッケルコーティンググラファイト粉末の代わりに、繊維状のニッケルコーティンググラファイト，ニッケル粉末，ニッケル繊維等を使用してもよく、この場合もほぼ同様の作用・効果が得られるものと推察される。また、それ以外の熱伝導フィラー（例えば、銅，アルミ，鉄，金，クロム等）を使用することも考えられる。更に、シリコーンＡ，Ｂの混合比は、請求項１または３に記載した範囲内で変更してもよい。
【図面の簡単な説明】
【図１】 本発明が適用された導電性熱伝導シートの構成を模式的に表す説明図である。
【符号の説明】
１…基材 ３…熱伝導フィラー[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a conductive heat conductive sheet obtained by filling a base material with a conductive heat conductive filler, kneading and molding.
[0002]
[Prior art]
Conventionally, a heat conductive sheet obtained by filling a base material such as silicone with a heat conductive filler, kneading and molding has been considered. This type of heat conductive sheet is interposed between an electronic component that serves as a heat source and a heat sink component (hereinafter simply referred to as a heat sink), such as a heat sink or a housing panel, within an electric / electronic device. It is arranged and used so that When the heat conductive sheet is arranged in this way, the heat generated by the electronic components and the like can be released to the heat sink side satisfactorily. For this reason, this type of heat conductive sheet is attracting attention as an indispensable material for, for example, speeding up the CPU.
[0003]
In addition, it is also considered to impart conductivity to the heat conductive sheet by using a conductive material as the heat conductive filler (see, for example, Patent Documents 1 and 2). In this case, noise can be removed by grounding a part of the electronic component or the like.
[0004]
[Patent Document 1]
Japanese Utility Model Publication No.7-11519 [Patent Document 2]
JP-A-5-291777 [0005]
[Problems to be solved by the invention]
However, in such a conductive heat conductive sheet, it is difficult to achieve both heat conductivity and conductivity. In particular, with respect to conductivity, sufficient conductivity cannot be obtained because of the formation of a skin layer on the surface, and about 10 5 Ω · cm is generally used. Then, this invention was made | formed for the purpose of provision of the electroconductive heat conductive sheet which has favorable electroconductivity.
[0006]
[Means for Solving the Problems and Effects of the Invention]
The invention according to claim 1 made to achieve the above object is a conductive heat conductive sheet obtained by filling a base material with a conductive heat conductive filler, kneaded and formed into a sheet shape , The base material is kneaded with a polydiorganosiloxane having a vinyl group at the terminal and a polydiorganosiloxane having a silicon-bonded hydrogen atom in a weight ratio of 2: 3 to 1: 3 (preferably 1: 2). It is characterized by.
[0007]
The applicant of the present application kneads a polydiorganosiloxane having a vinyl group at the terminal (hereinafter referred to as silicone A) and a polydiorganosiloxane having a silicon atom-bonded hydrogen atom (hereinafter referred to as silicone B) to form a sheet. In this case, it was discovered that the formation of the skin layer can be suppressed by reducing the proportion of silicone A. However, if the ratio of silicone A is reduced too much, the sheet becomes inflexible and the sheet becomes brittle. On the other hand, when there is too much silicone A, a skin layer will be formed, electroconductivity will fall, and also bridge | crosslinking may become inadequate. For example, silicone A alone cannot be hardened into a sheet.
[0008]
In the present invention, since silicone A and silicone B are kneaded in a weight ratio of 2: 3 to 1: 3, it is possible to satisfactorily suppress the formation of a skin layer while ensuring the mechanical properties of the sheet. As a result, the conductivity of the sheet can be improved satisfactorily. Moreover, in this invention, since the heat conductive filler which has electroconductivity is filled in the sheet | seat which consists of such a base material, heat conductivity and electroconductivity can be improved further. For this reason, in the electroconductive heat conductive sheet of this invention, electroconductivity can be improved very favorable, ensuring favorable heat conductivity, and heat conductivity and electroconductivity can be made compatible.
[0009]
The invention described in claim 2 is characterized in that, in addition to the structure described in claim 1 or 2, the thermal conductive filler is powdered or fibrous nickel-coated graphite or nickel.
Powdered or fibrous nickel-coated graphite or nickel is a filler that is extremely excellent in thermal conductivity and conductivity. Moreover, when powdered or fibrous nickel-coated graphite or nickel is kneaded as a filler, electromagnetic wave noise can be absorbed. Therefore, in the present invention, in addition to the effect of the first aspect of the invention, there is an effect that both the thermal conductivity and the conductivity can be made better and electromagnetic noise can be absorbed.
[0010]
Invention of Claim 3 is a manufacturing method of the electroconductive heat conductive sheet which makes a base material fill with the heat conductive filler which has electroconductivity, knead | mixes and shape | molds it into a sheet-like heat conductive sheet, The base material is characterized in that a polydiorganosiloxane having a vinyl group at the terminal and a polydiorganosiloxane having a silicon atom-bonded hydrogen atom are kneaded at a weight ratio of 2: 3 to 1: 3. It is said.
[0011]
For this reason, in the present invention, as in the first aspect of the invention, it is possible to satisfactorily suppress the formation of the skin layer while ensuring the mechanical properties of the obtained sheet. The conductivity can be improved satisfactorily. Therefore, in the present invention, it is possible to easily produce a conductive heat conductive sheet having good heat conductivity and having extremely improved conductivity.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view schematically showing the configuration of a conductive heat conductive sheet to which the present invention is applied. As shown in FIG. 1, in the conductive heat conductive sheet of the present embodiment, the base material 1 is filled with 50 to 90 wt% of conductive heat conductive filler 3 (preferably 75 to 90 wt%), and kneaded and molded. It is made. The base material 1 is composed of a polydiorganosiloxane having a vinyl group at the terminal (silicone A) and a polydiorganosiloxane having a silicon atom-bonded hydrogen atom (silicone B) in a weight ratio of 2: 3 to 1: 3. And kneaded.
[0013]
【Example】
Next, nickel coated gufite powder (average particle size 30 μm: manufactured by NOVAMET) is used as the heat conductive filler 3, “CY52-276A” (trade name: manufactured by Toray Dow) is used as the silicone A, and “CY52-276B” is used as the silicone B (Product name: manufactured by Toray Dow Co., Ltd.) was used to actually create a conductive heat conductive sheet.
[0014]
That is, the silicones A and B are kneaded to form a base material 1, the base material 1 and the heat conductive filler 3 are kneaded using a two-roll kneader, and then molded to form a sheet-like conductive heat conductive material. A sheet was formed. The heat conductive filler 3 was kneaded with 80 wt% of the base material 1. As the kneading method, various methods such as a vacuum defoaming mixer, a kneader, and a Banbury mixer can be applied in addition to a method of kneading using two rolls. Table 1 shows the conductivity of the obtained conductive heat conductive sheet.
[0015]
[Table 1]
[0016]
The present applicant has discovered that when a sheet is formed by kneading silicone A and silicone B, the formation of the skin layer can be suppressed by reducing the proportion of silicone A. However, if the ratio of silicone A is reduced too much, the sheet becomes inflexible and the sheet becomes brittle. On the other hand, when there is too much silicone A, a skin layer will be formed, electroconductivity will fall, and also bridge | crosslinking may become inadequate. For example, silicone A alone cannot be hardened into a sheet.
[0017]
In the above embodiment, by kneading the silicones A and B at the above ratio, it is possible to very well prevent the skin layer from being formed on the surface of the substrate 1 while ensuring the mechanical properties of the sheet. As a result, the conductivity could be improved as described above. Moreover, in the said Example, since the said mechanical characteristic was ensured, the adhesiveness to a heat sink and an electronic component was able to be ensured favorable, and the tearing strength was also able to be improved favorably. Due to the improvement of the tear strength, the assembly property (easiness of reattachment) could be improved in the above examples. Further, in each of the above examples, since each of the polydiorganosiloxanes that are gel substances was used as the base material 1, the thermal conductivity was as good as 2.1 W / m · K.
[0018]
For this reason, in the above-described embodiment, heat generated by the electronic components and the like can be released to the heat sink side, and a part of the electronic components and the like can be grounded to remove noise and absorb electromagnetic noise. be able to. Moreover, since the assemblability is also improved, the economy is excellent.
[0019]
In addition, this invention is not limited to the said Example at all, It can implement with a various form in the range which does not deviate from the summary of this invention. For example, as the heat conductive filler, instead of nickel coated graphite powder, fibrous nickel coated graphite, nickel powder, nickel fiber, etc. may be used. Inferred. It is also conceivable to use other heat conductive fillers (for example, copper, aluminum, iron, gold, chromium, etc.). Furthermore, the mixing ratio of silicones A and B may be changed within the range described in claim 1 or 3.
[Brief description of the drawings]
FIG. 1 is an explanatory view schematically showing a configuration of a conductive heat conductive sheet to which the present invention is applied.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Base material 3 ... Thermal conductive filler
Claims (3)
上記基材が、末端にビニル基を持ったポリジオルガノシロキサンとケイ素原子結合水素原子を持ったポリジオルガノシロキサンとを、２：３〜１：３の重量割合で混練してなることを特徴とする導電性熱伝導シート。A conductive heat conductive sheet formed by filling a base material with a conductive heat conductive filler, kneaded and formed into a sheet shape ,
The base material is obtained by kneading a polydiorganosiloxane having a vinyl group at a terminal and a polydiorganosiloxane having a silicon atom-bonded hydrogen atom in a weight ratio of 2: 3 to 1: 3. Conductive heat conductive sheet.
上記基材として、末端にビニル基を持ったポリジオルガノシロキサンとケイ素原子結合水素原子を持ったポリジオルガノシロキサンとを、２：３〜１：３の重量割合で混練して使用することを特徴とする導電性熱伝導シートの製造方法。A base material is filled with a conductive heat conductive filler, kneaded and formed into a sheet to form a conductive heat conductive sheet, a method for producing a conductive heat conductive sheet,
The base material is characterized in that a polydiorganosiloxane having a vinyl group at a terminal and a polydiorganosiloxane having a silicon atom-bonded hydrogen atom are kneaded at a weight ratio of 2: 3 to 1: 3. A method for producing a conductive heat conductive sheet.
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| JP2002324018A JP3686649B2 (en) | 2002-11-07 | 2002-11-07 | Conductive heat conductive sheet and method for producing the same |
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| JP2002324018A JP3686649B2 (en) | 2002-11-07 | 2002-11-07 | Conductive heat conductive sheet and method for producing the same |
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| JP2004155949A JP2004155949A (en) | 2004-06-03 |
| JP3686649B2 true JP3686649B2 (en) | 2005-08-24 |
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| JP5098009B2 (en) * | 2006-10-25 | 2012-12-12 | 北川工業株式会社 | Conductive heat conductive material |
| CN102276988B (en) * | 2011-06-08 | 2012-10-31 | 北京工业大学 | Mono-component Ni-C filled-type FIP (Form In Place) heat-curing highly-conductive silicone rubber and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS59199756A (en) * | 1983-04-27 | 1984-11-12 | Toshiba Silicone Co Ltd | Conductive silicone rubber composition |
| JPS6144951A (en) * | 1984-08-09 | 1986-03-04 | Toshiba Silicone Co Ltd | Conductive silicone rubber composition |
| JPH0297559A (en) * | 1988-10-03 | 1990-04-10 | Toshiba Silicone Co Ltd | Heat-conductive silicone composition |
| JP3724559B2 (en) * | 2000-12-01 | 2005-12-07 | 信越化学工業株式会社 | Conductive silicone rubber composition |
| JP3999994B2 (en) * | 2002-04-03 | 2007-10-31 | 東レ・ダウコーニング株式会社 | Conductive silicone rubber composition |
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