JP3685665B2 - Semiconductor media holder - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a holder for holding a plurality of semiconductor media connected to each other for various types of semiconductor media containing an IC circuit and a semiconductor memory, such as an IC card, a memory card, and a memory stick. is there.
[0002]
[Prior art]
Conventionally, various memory cards and memory sticks have been provided as signal recording media for digital cameras and audio devices. This type of semiconductor media is lighter and smaller than recording media such as compact discs and magneto-optical discs. Therefore, it is excellent in portability and is becoming mainstream as a recording medium for portable electronic devices.
[0003]
[Problems to be solved by the invention]
However, since semiconductor media such as memory cards and memory sticks have a smaller storage capacity than recording media such as compact discs and magneto-optical discs, a plurality of semiconductor media are required to record a large amount of data. Become.
A plurality of semiconductor media on which data is recorded in this way may be lost when they are independent from each other, and there is still a problem that it is difficult to organize and store or carry the data.
In addition, since the terminal portion having a plurality of electrical contacts remains exposed and does not have a configuration corresponding to a shutter in a compact disk or a magneto-optical disk, the semiconductor medium is subjected to mechanical shock. There was a risk of rusting due to damage.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor media holder that makes it easy to organize and carry a plurality of semiconductor media and prevent damage and rust of terminal portions of the semiconductor media.
[0005]
[Means for solving the problems]
The semiconductor media holder according to the present invention is for holding a plurality of semiconductor media in a state of being connected to each other, and covers a terminal portion of the semiconductor media and can be engaged with the semiconductor media; A plurality of cap portions engaged with the semiconductor medium are integrally provided with a connecting portion for connecting the cap portions to each other.
[0006]
According to the semiconductor media holder of the present invention, when a plurality of semiconductor media are organized and stored or carried, the cap portion of the holder is attached to the terminal portion of each semiconductor media, and the connecting portions of these holders are connected to each other. Link.
As a result, the terminal portion of each semiconductor medium is covered and protected by the cap portion of the holder, and damage caused by mechanical impact and rust caused by water adhesion are prevented.
In addition, since the plurality of semiconductor media are connected to each other through a holder and are combined into one, it is convenient for organizing and storing and is easy to carry.
[0007]
In a specific configuration, the cap portion and the connecting portion are formed by integrally molding resin. This reduces the weight of the holder and facilitates carrying.
[0008]
In a specific configuration, the cap portion is formed with a soft locking structure with irregularities at the engaging portion with the semiconductor medium. Accordingly, the holder can be easily attached to and detached from the semiconductor medium, and the connection between the semiconductor medium and the holder in the mounted state can be strengthened.
[0009]
Further, specifically, the connecting portion protrudes from the cap portion and has a through hole. Therefore, by passing the string through the through hole of the connecting portion, the cap portions engaged with the plurality of semiconductor media are connected to each other.
[0010]
【The invention's effect】
According to the semiconductor media holder of the present invention, it is easy to organize and carry a plurality of semiconductor media, and it is possible to prevent damage and rust of the terminal portions of the semiconductor media.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.
1. First embodiment As shown in FIG. 1, a semiconductor medium (1) includes a stick-shaped main body (11) containing a semiconductor memory (not shown), and the main body (11) has a plug shape. The terminal portion (12) is projected. The terminal portion (12) is provided with a plurality of contacts (13) for writing and reading data to and from the semiconductor memory.
Conventionally, the terminal portion (12) of the semiconductor medium (1) has been exposed.
[0012]
The holder (2) according to the present invention is an integrally molded product of resin, and has a cylindrical cap portion (21) having a media accommodation chamber (22) in which the terminal portion (12) of the semiconductor media (1) is to be accommodated. And a ring-shaped connecting portion (23) projecting from the cap portion (21). The connecting portion (23) has a through hole (24).
[0013]
Covering the terminal part (12) of the semiconductor media (1) with the cap part (21) of the holder (2), the inner peripheral surface of the cap part (21) is closely fitted to the outer peripheral surface of the terminal part (12). The holder (2) is attached to the semiconductor medium (1) with a connection strength that cannot be easily removed from the semiconductor medium (1).
As a result, as shown in FIG. 2, the terminal portion of the semiconductor medium (1) is covered with the cap portion (21) of the holder (2).
[0014]
When storing or carrying a plurality of semiconductor media (1), as shown in FIG. 3, a holder (2) is attached to each semiconductor media (1), and through holes (24) of these holders (2) are mounted. Put them together through the string (3).
[0015]
When storing and carrying a plurality of semiconductor media (1) using the holder (2) of the present invention, the terminal portion (12) of the semiconductor media (1) is covered with the cap portion (21) of the holder (2). Therefore, damage to the terminal part (12) and generation of rust are prevented. Further, since the plurality of semiconductor media (1) are grouped together by the string (3), it is easy to carry and there is no risk of losing some of the semiconductor media (1) therein.
[0016]
As shown in FIG. 4, a concave portion (25) is formed on the inner peripheral surface of the cap portion (21) of the holder (2), while a convex portion (on the outer peripheral surface of the terminal portion (12) of the semiconductor medium (1) is formed. It is also possible to form a soft locking structure by the concave portion (25) and the convex portion (14) by forming 14).
As a result, it is possible to increase the connection strength while maintaining the mounting operability of the holder (2) with respect to the semiconductor medium (1).
[0017]
Second embodiment As shown in FIG. 5, the semiconductor medium (4) includes a flat rectangular parallelepiped body (41) containing a semiconductor memory (not shown), and the body (41) includes: A plate-like terminal portion (42) is projected. A slit (43) is formed in the terminal portion (42), and a plurality of contacts (44) for writing and reading data to and from the semiconductor memory are disposed on the inner surface of the slit (43).
Conventionally, the terminal portion (42) of the semiconductor medium (4) is left exposed.
[0018]
The holder (5) according to the present invention is an integrally molded product of resin, and is a rectangular tube-shaped cap portion (51) having a media accommodation chamber (52) in which the terminal portion (42) of the semiconductor media (4) is to be accommodated. ) And a mountain-shaped connecting portion (53) protruding from the cap portion (51), and a through hole (54) is formed in the connecting portion (53).
[0019]
Covering the terminal part (42) of the semiconductor media (4) with the cap part (51) of the holder (5), the inner peripheral surface of the cap part (51) is closely fitted to the outer peripheral surface of the terminal part (42). The holder (5) is attached to the semiconductor medium (4) with a connection strength that cannot be easily removed from the semiconductor medium (4).
As a result, the terminal part (42) of the semiconductor medium (4) is covered with the cap part (51) of the holder (5).
[0020]
When storing or carrying a plurality of semiconductor media (4), as shown in FIG. 6, a holder (5) is attached to the semiconductor media (4), and the through holes (54) of these holders (5) are installed. Collect it together through the string (3).
[0021]
In storing and carrying a plurality of semiconductor media (4) using the holder (5) of the present invention, the terminal portion (42) of the semiconductor media (4) is covered with the cap portion (51) of the holder (5). Therefore, damage to the terminal part (42) and rusting are prevented. Further, since the plurality of semiconductor media (4) are grouped together by the string (3), it is easy to carry and there is no possibility of losing some of the semiconductor media (4) therein.
[0022]
In addition, it is also possible to provide a soft locking structure with a concavo-convex shape in the engaging part of the cap part (51) of the holder (5) and the terminal part (42) of the semiconductor medium (4).
As a result, it is possible to increase the connection strength while maintaining the mounting operability of the holder (5) with respect to the semiconductor medium (4).
[0023]
Each part configuration of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims. For example, the semiconductor media that are the subject of the present invention are not limited to those in which the terminal portion protrudes from the end of the media body, and may be those in which the terminal portion is installed on the surface of the flat plate-like body. The holder may be formed with a bag-like cap portion that can cover the surface of the flat plate-like main body.
The connecting portion of the holder is not limited to a ring shape, and various known connecting structures such as a C-shaped member provided with a retaining structure using elasticity can be used.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an appearance of a semiconductor medium and a cross section of a holder in a first embodiment of the present invention.
FIG. 2 is a perspective view showing a state in which a holder is attached to a semiconductor medium in the first embodiment.
FIG. 3 is a diagram showing a state in which a plurality of semiconductor media are connected to each other using a holder in the first embodiment.
FIG. 4 is a partially broken front view showing an example in which a soft locking structure is provided at an engaging portion between a semiconductor medium and a holder.
FIG. 5 is a perspective view showing a semiconductor medium and a holder in a second embodiment of the present invention.
FIG. 6 is a diagram showing a state in which a plurality of semiconductor media are connected to each other using a holder in the second embodiment.
[Explanation of symbols]
(1) Semiconductor media
(11) Body
(12) Terminal section
(2) Holder
(21) Cap part
(23) Connecting part
(24) Through hole
(3) String
(4) Semiconductor media
(41) Main unit
(42) Terminal section
(5) Holder
(51) Cap part
(52) Media compartment
(53) Connecting part
(54) Through hole

Claims (4)

A holder for holding a plurality of semiconductor media connected to each other for a semiconductor media in which a terminal for inputting or outputting a signal is provided in a main body incorporating a semiconductor, the terminal of the semiconductor media A semiconductor media holder comprising: a cap portion that covers the portion and engages with the semiconductor medium; and a connecting portion for connecting the plurality of cap portions engaged with the plurality of semiconductor media together. . The holder according to claim 1, wherein the cap portion and the connecting portion are formed by integrally molding resin. The holder according to claim 2, wherein the cap portion has a concave and convex soft locking structure formed at an engaging portion with the semiconductor medium. The connecting portion is provided so as to protrude from the cap portion and has a through hole, and the cap portion engaged with a plurality of semiconductor media can be connected to each other by passing a string through the through hole. The holder according to any one of claims 1 to 3.

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