JP3664024B2 - Component alignment method and component alignment apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component aligning device and a component aligning method, and more particularly, to a component aligning device for aligning chip-shaped components such as ceramic electronic component elements at predetermined intervals so as not to contact each other. The present invention relates to a part alignment method.
[0002]
[Prior art and problems to be solved by the invention]
For example, in the process of manufacturing a ceramic electronic component such as a multilayer ceramic capacitor, a process for firing a large number of chip-shaped unfired elements at the same time, or a process for forming external electrodes on a large number of chip-shaped elements after firing. There is a process of applying paste and baking. And conventionally, in such a process,
(1) When many elements are placed on a fired sheath and fired in a state where the elements are in contact with each other, alumina powder, zirconia powder, etc. Sprinkle anti-adhesion powder on the surface of the element to perform firing and baking,
(2) Using a transfer plate in which a plurality of through holes into which individual elements are transferred are provided at a predetermined pitch, after transferring the elements into the through holes, the transfer plate is removed and the elements are aligned so that the elements do not contact each other. A method of firing or baking in a state has been used.
[0003]
However, in the above method (1), the working environment is lowered by the powder for preventing adhesion such as alumina powder and zirconia powder, or a process for separating the fired element from the powder for preventing adhesion is required. Due to this, the manufacturing cost is increased, or due to the poor matching between the powder for preventing adhesion such as alumina powder and zirconia powder and the external electrode, the external electrode is then plated for the purpose of improving solderability. However, there is a problem in that defective plating is caused.
[0004]
Further, in the case of the method using the transfer plate described in (2) above, the element may be transferred into the through hole in an unstable posture. In such a case, during transportation to the firing furnace or in the firing furnace. During firing, the elements fall over, and the elements come into contact with each other, and there is a problem that the adhesion (sticking) between the elements occurs and the yield decreases. In order to avoid such a situation, it is necessary to increase the pitch of the through holes of the transfer plate so that the elements do not come into contact with each other even if the elements fall down in any direction after alignment. There is a problem that the number of elements that can be aligned on the firing jig (conveying jig) is reduced and productivity is lowered.
[0005]
SUMMARY OF THE INVENTION The present invention solves the above problems, and a component alignment apparatus and component alignment that can efficiently align components such as electronic component elements at a predetermined pitch so as not to contact each other. It aims to provide a method.
[0006]
[Means for Solving the Problems]
In order to achieve the above-mentioned object, the component alignment method of the present invention (Claim 1) includes:
Method for aligning substantially rectangular parallelepiped parts having dimensions of width direction (width) W, thickness direction dimension (thickness) T, longitudinal direction dimension (length) L (where L> W, L> T) Because
It is larger than the diagonal dimension of the plane (WT surface) defined by the width W and the thickness T of the component, and is defined by the plane (LW surface) defined by the length L and the width W, the length L and the thickness T. A first plate in which a plurality of first through holes having a substantially circular planar shape having a smaller diameter than the diagonal dimension of the plane (LT plane) are arranged in a predetermined alignment position, and the LW plane and the LT plane A plurality of second plates arranged so that the second through-holes having a diameter larger than the diagonal dimension of the substantially circular planar shape have a predetermined alignment position, and support and support the aligned components A step of combining the transport jig for performing a state in which the second plate is disposed on the lower surface side of the first plate and the transport jig is disposed on the lower surface side of the second plate;
In a state where a predetermined positional deviation is caused in the first through hole and the second through hole, the component is transferred to the first through hole in such a posture that the WT surface is an upper and lower surface;
By moving at least one of the first plate and the second plate and substantially overlapping the positions of the first through hole and the second through hole, the components are transferred from the first through hole to the second through hole and conveyed. And a step of dropping onto a jig.
[0007]
On the lower surface side of the first plate in which a plurality of first through holes having a diameter larger than the diagonal dimension of the WT surface of the component and smaller than the diagonal dimension of the LW surface and the LT surface are arranged, the LW surface and the LT surface A second plate having a plurality of second through holes having a diameter larger than the diagonal dimension of the first plate and moving at least one of the first plate and the second plate, In a state where a predetermined positional deviation is generated in the two through holes, after the component is transferred into the first through hole, at least one of the first plate and the second plate is moved to move the first through hole and the second through hole. By substantially overlapping the positions of the holes, the components in the first through-hole are reliably transferred into the second through-hole so that the components do not contact each other on the conveying jig. , It becomes possible to align efficiently.
[0008]
Moreover, since the 2nd through-hole arrange | positioned in the 2nd plate has a diameter larger than the diagonal dimension of LW surface of components, and LT surface, there exists a possibility that components may be transferred with the stable attitude | position. Since it is high and it is suppressed that it will be in the state which components contacted so much, it becomes possible to improve reliability.
In addition, since the planar shapes of the first through hole and the second through hole are both substantially circular, the directivity of the component does not become a problem, and the component can be reliably made into the first through hole and the second through hole. Since it is transferred, high reliability can be realized.
[0009]
According to a second aspect of the present invention, there is provided the component aligning method according to the first aspect of the present invention, in which the component that has been transferred to the second through hole of the second plate and dropped on the conveying jig is vibrated or swung. It is characterized by being aligned on the conveying jig in such a posture as to be the lower surface.
[0010]
For example, when the longitudinal direction of the component is in the vertical direction, the component is turned over by oscillating or swinging the component fed into the second through hole of the second plate, so that the longitudinal direction is horizontal. It becomes possible to align the parts on the conveying jig with a stable posture in the direction. Therefore, it is possible to make the interval between parts as small as necessary so as not to contact each other, and it is possible to increase the alignment density of the parts and improve the productivity. become.
[0011]
The component aligning device of the present invention (Claim 3)
Apparatus for aligning substantially rectangular parallelepiped parts having dimensions of width direction (width) W, thickness direction dimension (thickness) T, longitudinal direction dimension (length) L (where L> W, L> T) Because
The diameter is larger than the diagonal dimension of the plane (WT surface) defined by the width W and the thickness T of the component, and depends on the plane (LW surface), the length L and the thickness T defined by the length L and the width W. A first plate in which a plurality of first through holes smaller than the diagonal dimension of the prescribed plane (LT surface) are arranged in a predetermined alignment position;
A plurality of second through holes disposed on the lower surface side of the first plate and having a diameter larger than the diagonal dimension of the LW surface and the LT surface are arranged in a predetermined alignment positional relationship. Two plates,
By moving at least one of the first plate and the second plate, the mutual positional relationship between them is (a) the component is interfered with the second plate and transferred from the first through hole to the second through hole. So that a predetermined positional deviation occurs between the first through hole and the second through hole disposed in each, and (b) a posture in which the WT surface is an upper and lower surface. Then, the plate is controlled so that the first through hole and the second through hole disposed in the first plate and the second plate are substantially overlapped so as to be transferred from the first through hole to the second through hole. Position control means;
And a conveying jig that supports and conveys the component that is transferred to the second through hole of the second plate.
[0012]
As described above, by using the component aligning apparatus including the first plate, the second plate, the plate position control means, and the conveying jig, the component aligning method according to claim 1 of the present application described above is reliably performed. And the components can be efficiently aligned at a predetermined pitch so that they do not touch each other.
[0013]
According to a fourth aspect of the present invention, the thickness of the first plate and the second plate is equal to or greater than the dimension (length) L in the longitudinal direction of the component.
[0014]
By making the thickness of the first plate and the second plate equal to or larger than the dimension (length) L in the longitudinal direction of the part, the longitudinal direction of the part is the thickness direction of the first plate and the second plate. Even when it is transferred in a posture such that it is parallel to the first plate, the first plate and the second plate can be moved without damaging the components, and the reliability can be improved.
[0015]
The component aligning apparatus according to claim 5 is configured such that the component placed in the second through hole of the second plate is vibrated or oscillated so that the LW surface or the LT surface is a vertical surface. A vibration / swing application means for aligning on the transport jig is provided.
[0016]
By adopting the configuration including the vibration / swing application means, the part aligning method according to claim 2 of the present application described above can be performed reliably, for example, when the longitudinal direction of the part is vertical. It is possible to align the parts on the conveying jig in a stable posture in which the parts are turned over and the longitudinal direction becomes the horizontal direction. Therefore, it is possible to make the interval between parts as small as necessary so as not to contact each other, and it is possible to increase the alignment density of the parts and improve the productivity. become.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the features of the present invention will be described in more detail with reference to embodiments of the present invention.
In this embodiment, a chip-shaped electronic component element (hereinafter also simply referred to as “component”) coated with a conductive paste that becomes an external electrode after baking is placed on a transport jig that also functions as a firing jig. A description will be given by taking as an example a case where alignment is performed at a predetermined interval so as not to contact each other.
[0018]
FIG. 1 is an exploded perspective view showing a configuration of a main part of a component aligning apparatus according to this embodiment, FIG. 2 is a cross-sectional view of the main part, and FIG. 3 is a chip shape coated with a conductive paste targeted for alignment in this embodiment. It is a perspective view which shows this electronic component element (component).
[0019]
The component aligning device of this embodiment includes a first plate 10 in which a plurality of first through holes (alignment holes) 11 into which the component 1 is transferred are arranged in a predetermined alignment position, and the first plate 10. A second plate 20 provided with a plurality of second through holes (alignment holes) 21 arranged on the lower surface side at the same pitch as the first through holes 11, into which the component 1 is transferred, and the second plate 20 is arranged on the lower surface side of the second plate 20, and the first jig 10 is moved by moving the first plate 10 by supporting the component 1 transferred to the second through hole 21 of the second plate 20 in an aligned state. Plate position control means 40 that controls the first plate 10 and the second plate 20 to have a predetermined positional relationship, and the component 1 that has been transferred to the second through hole 21 of the second plate 20 and dropped onto the conveying jig 30 Vibration for applying vibration / swing / And a swing applying means 50.
[0020]
In this embodiment, the components 1 to be aligned are in a state in which the conductive paste 3 for forming external electrodes is applied to both end sides of the electronic component element 2, and the size is the width direction dimension. (Width) is W (= 0.5 mm), thickness direction dimension (thickness) is T (= 0.5 mm), longitudinal direction dimension (length) is L (= 1.0 mm), and length L is It is larger than the width W and the height T.
[0021]
The first plate 10 is made of metal, and its thickness T1 is substantially equal to the length L of the component 1. The first through hole 11 provided in the first plate 10 is a through hole having a circular planar shape, and the diameter D1 is a rectangular plane (WT surface S1) defined by the width W and the thickness T of the component 1. ) To be smaller than the diagonal dimension of the plane defined by the length L and the width W (LW surface S2) and the plane defined by the length L and the thickness T (LT plane S3). Is set to
[0022]
The second plate 20 disposed on the lower surface side of the first plate 10 is made of metal, and its thickness T2 is set to be larger than the length L of the component 1. The second through hole 21 provided in the second plate 20 is a through hole having a circular planar shape, and the diameter D2 thereof is set to be larger than the diagonal dimension of the LW surface S2 and the LT surface S3. ing.
[0023]
Furthermore, the conveying jig 30 disposed on the lower surface side of the second plate 20 is formed of a heat-resistant ceramic material such as alumina so that it can be put together with the component 1 into a heat treatment furnace (not shown). It is configured to function as a heat treatment sheath.
[0024]
Further, the plate position control means 40 moves the first plate 10 so that the component 1 in which the mutual positional relationship between the first plate 10 and the second plate 20 is transferred into the first through hole 11 is changed to the second plate. A positional relationship in which a predetermined misalignment occurs between the first through hole 11 and the second through hole 21 so that the first through hole 11 is prevented from being transferred to the second through hole 21 due to interference with the first through hole 11. And the 1st through-hole 11 and the 2nd through-hole 21 substantially overlap so that the components 1 may be transferred from the 1st through-hole 11 to the 2nd through-hole 21 in the attitude | position in which the WT surface S1 becomes an up-and-down surface. It is configured so that it can be controlled to be in a positional relationship.
[0025]
In this embodiment, only the first plate 10 is moved by the plate position control means 40. However, the second plate 20 can be moved. It is also possible to configure to move both the plate 10 and the second plate 20.
[0026]
Further, the vibration / swing application means 50 vibrates or swings the component 1 that has been transferred to the second through-hole 21 of the second plate 20 and dropped onto the conveying jig 30, and takes a stable posture on the component. As shown by arrows A, B, C, and D in FIG. 6, vibration (or rocking) is applied to the component 1 in the vertical direction (vertical direction) and the horizontal direction (horizontal direction). It is configured to be able to. Note that the direction of vibration / swing is not limited to the vertical direction and the horizontal direction, and it is needless to say that the structure can be configured so that the vibration / swing is applied in an oblique direction.
[0027]
Next, a method for aligning components using the component aligning apparatus configured as described above will be described.
(1) First, the first plate 10 is moved by the plate position control means 40, and the positional relationship between the first plate 10 and the second plate 20 is shifted between the first through hole 11 and the second through hole 21. The positional relationship is such that the component 1 is not transferred into the second through hole 21 of the second plate 20 after being transferred into the first through hole 11 of the first plate 10.
(2) Then, as shown in FIG. 4, the component 1 is transferred into the first through holes 11 of the first plate 10.
(3) And, if there is an excess part 1 on the first plate 10, after removing it, the first plate 10 is moved in a predetermined direction (in the direction of the arrow C or D as shown in FIG. 5). The first through hole 11 provided in the first plate 10 and the second through hole 21 provided in the second plate 20 are substantially overlapped with each other. As a result, the component 1 is transferred from the first through hole 11 to the second through hole 21 in a posture in which the WT surface S1 is an upper and lower surface.
(4) Then, as shown in FIG. 6, the vibration / swing application means 50 causes the part 1 that has been transferred to the second through hole 21 of the second plate 20 and dropped onto the conveying jig 30 to move to the arrow A, The vibration / swing is applied in the directions of B, C, and D to cause the component 1 to roll over, the WT surface S1 becomes the left and right end surfaces, and the LW surface or LT surface becomes the upper and lower surfaces (that is, the longitudinal direction is horizontal). The component 1 is aligned on the conveying jig 30 with a stable posture as shown in FIG.
After the components 1 are aligned in this way, the first plate 10 and the second plate 20 are removed, and the components are aligned on the conveying jig 30 at a predetermined interval so as not to contact each other. The conductive paste 3 is baked by conveying the component 1 together with the conveying jig 30 and placing it in a heat treatment furnace.
[0028]
As described above, in the component aligning device according to the embodiment of the present invention, the diameter is larger than the diagonal size of the WT surface S1 of the component 1 and smaller than the diagonal size of the LW surface S2 and the diagonal size of the LT surface S3. A first plate 10 provided with a first through hole 11 having D1 and a second through hole 21 having a diameter larger than the diagonal dimension of the LW surface S2 and the diagonal dimension of the LT surface S3 are provided. After the component 1 is transferred into the first through hole 11 in a state where the first through hole 11 and the second through hole 12 are shifted in a predetermined position using the second plate 20 in combination, the first plate 10 Since the first through hole 11 and the second through hole 12 substantially overlap each other, the component 1 is transferred from the first through hole 11 to the second through hole 21 and placed on the conveying jig 30. To ensure alignment at predetermined intervals Kill.
[0029]
Further, since the component 1 that has been transferred to the second through hole 21 of the second plate 20 is vibrated / swung by the vibration / swing applying means 50, the component 1 is turned over and the longitudinal direction is horizontal. It can be surely aligned on the conveying jig 30 in a stable posture.
In addition, since the planar shapes of the first through-hole 11 and the second through-hole 21 are both substantially circular, the directionality of the component 1 does not become a problem, and the component 1 is reliably connected to the first through-hole 11 and Since it is transferred to the second through hole 21, the reliability can be improved.
[0030]
In addition, since the diameter D2 of the 2nd through-hole 21 arrange | positioned at the 2nd plate 20 is larger than the diagonal dimension of LW surface S2 of a component, and the diagonal dimension of LT surface S3, the component 1 is reliably rolled over. Can take a stable posture.
[0031]
Further, since the thicknesses T1 and T2 of the first plate 10 and the second plate 20 are equal to or greater than the length L of the component 1, the direction in which the dimension of the component 1 is larger (in this embodiment, the length L In the state where the component 1 is swung into the first through-hole 11 or the second through-hole 21 in a posture such that the first plate 10 and the second plate 20 are parallel to the thickness direction of the first plate 10 and the second plate 20. In addition, even when the second plate 20 is moved, it is possible to avoid damaging the component 1 and to improve the reliability.
[0032]
Moreover, in the said embodiment, although it has comprised so that the component 1 may be made into the stable attitude | position by applying a vibration / fluctuation to the component 1 transferred in the 2nd through-hole 21, for example, after alignment, components are When the components are aligned at a predetermined interval so that the components do not contact each other even if they fall down (that is, the arrangement pitch of the second through holes 21 arranged in the second plate 20 is appropriate) However, the present invention includes such a case within the scope of the right.
[0033]
Moreover, although the said embodiment demonstrated the case where the 1st through-hole 11 was made into the column-shaped shape with a constant diameter from an upper end side to a lower end side, as shown in FIG. It is also possible to configure so that the component 1 is efficiently transferred into the first through hole 11 by chamfering and providing an inclined surface (guide surface) 11a. Although not particularly shown, it is also possible to provide an inclined surface (guide surface) at the upper end of the second through hole 21 so that the component 1 can be easily transferred into the second through hole 21. is there.
[0034]
Moreover, although the said embodiment demonstrated the case where the chip-shaped electronic component element (component) which apply | coated the electrically conductive paste used as an external electrode after baking was aligned on the conveyance jig which functions also as a baking jig, it demonstrated. The present invention has no particular restrictions on the types of parts to be aligned and the types of transport jigs, and can be widely applied when various parts are aligned on various transport jigs.
[0035]
The invention of the present application is not limited to the above embodiment in other points as well, but the specific shapes of the first plate and the second plate, the dimensions of the first and second through holes, the arrangement pitch, Various applications and modifications are made within the scope of the invention regarding the number of arrangement, the shape of the conveying jig, the structure, the constituent materials, the specific configuration of the plate position control means and the vibration / swing application means, etc. Is possible.
[0036]
【The invention's effect】
As described above, the component alignment method of the present invention (Claim 1) has a plurality of first through holes having a diameter larger than the diagonal dimension of the WT surface of the component and smaller than the diagonal dimension of the LW surface and the LT surface. A second plate having a plurality of second through holes having a diameter larger than the diagonal dimension of the LW surface and the LT surface is disposed on the lower surface side of the individually disposed first plate. And at least one of the second plate is moved to cause the first through-hole and the second through-hole to have a predetermined positional shift, and after the components are transferred into the first through-hole, Since at least one of the two plates is moved so that the positions of the first through hole and the second through hole are substantially overlapped, the component in the first through hole is transferred into the second through hole. Swing from the first through hole to the second through hole and contact each other on the transport jig. So as not to, it is possible to reliably align at predetermined intervals.
Moreover, since the 2nd through-hole arrange | positioned in the 2nd plate has a diameter larger than the diagonal dimension of LW surface of components, and LT surface, there exists a possibility that components may be transferred with the stable attitude | position. Since it is high and it is suppressed that it will be in the state which components contacted so much, it becomes possible to improve reliability.
In addition, since the planar shapes of the first through hole and the second through hole are both substantially circular, the directivity of the component does not become a problem, and the component can be reliably made into the first through hole and the second through hole. Since it is transferred, high reliability is obtained.
[0037]
Further, as in the part alignment method according to claim 2, when the part that is transferred into the second through hole of the second plate is vibrated or oscillated, for example, the longitudinal direction of the part is a vertical direction. In such a case, it is possible to align the parts on the conveying jig in a stable posture in which the parts are rolled over and the longitudinal direction is horizontal. Therefore, it is possible to make the interval between the parts as small as necessary so as not to contact each other, and it is possible to increase the alignment density of the parts and improve the productivity. .
[0038]
Further, as described above, the component aligning device of the present invention (Claim 3) includes the first plate, the second plate, the plate position control means, and the conveying jig, and by using this component aligning device, Thus, the part aligning method according to claim 1 of the present invention can be reliably implemented, and the parts can be efficiently aligned at a predetermined pitch so as not to contact each other on the conveying jig.
[0039]
Further, when the thicknesses of the first plate and the second plate are equal to or larger than the longitudinal dimension (length) L of the part as in the part aligning apparatus of claim 4, the part has its longitudinal length. It is possible to move the first plate and the second plate without damaging the parts even when the direction is transferred in a posture that is parallel to the thickness direction of the first plate and the second plate. , It becomes possible to improve the reliability.
[0040]
Further, as in the component aligning device according to claim 5, by adopting the configuration including the vibration / swing application means, the component aligning method according to claim 3 of the present invention can be surely carried out to stabilize the component. It becomes possible to align on a conveyance jig by this, and it becomes possible to make this invention further effective.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a main configuration of a component aligning device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a main part of the component aligning device according to the embodiment of the present invention.
FIG. 3 is a perspective view showing a chip-like electronic component element (component) coated with a conductive paste to be aligned in the embodiment of the present invention.
FIG. 4 is a cross-sectional view showing a state in which a component is transferred into a first through hole in one step of the component alignment method according to an embodiment of the present invention.
FIG. 5 is a cross-sectional view showing a state in which components are transferred from the first through hole to the second through hole in one step of the component aligning method according to the embodiment of the present invention;
FIG. 6 shows a stable posture in which the longitudinal direction of the component is in the horizontal direction by applying vibration / swing to the component in the second through hole in one step of the component aligning method according to the embodiment of the present invention; It is sectional drawing which shows the state which took out.
FIG. 7 is a cross-sectional view showing a modified example of the component aligning device of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Component 2 Electronic component element 3 Conductive paste 10 1st plate 11 1st through-hole (alignment hole)
11a Inclined surface (guide surface)
20 Second plate 21 Second through hole (alignment hole)
30 Transport jig 40 Plate position control means 50 Vibration / swing application means L Component length T Component thickness W Component width T1 First plate thickness T2 Second plate thickness D1 First through hole diameter D2 First 2 Diameter of through hole

Claims (5)

Method for aligning substantially rectangular parallelepiped parts having dimensions of width direction (width) W, thickness direction dimension (thickness) T, longitudinal direction dimension (length) L (where L> W, L> T) Because
It is larger than the diagonal dimension of the plane (WT surface) defined by the width W and the thickness T of the component, and is defined by the plane (LW surface) defined by the length L and the width W, the length L and the thickness T. A first plate in which a plurality of first through holes having a substantially circular planar shape having a smaller diameter than the diagonal dimension of the plane (LT plane) are arranged in a predetermined alignment position, and the LW plane and the LT plane A plurality of second plates arranged so that the second through-holes having a diameter larger than the diagonal dimension of the substantially circular planar shape have a predetermined alignment position, and support and support the aligned components A step of combining the transport jig for performing a state in which the second plate is disposed on the lower surface side of the first plate and the transport jig is disposed on the lower surface side of the second plate;
In a state where a predetermined positional deviation is caused in the first through hole and the second through hole, the component is transferred to the first through hole in such a posture that the WT surface is an upper and lower surface;
By moving at least one of the first plate and the second plate and substantially overlapping the positions of the first through hole and the second through hole, the components are transferred from the first through hole to the second through hole and conveyed. And a step of dropping onto a jig. By swinging or swinging the component that has been transferred to the second through hole of the second plate and dropped onto the transport jig, the component is placed on the transport jig in such a posture that the LW surface or the LT surface is the upper and lower surfaces. 2. The part aligning method according to claim 1, wherein the parts are aligned with each other. Apparatus for aligning substantially rectangular parallelepiped parts having dimensions of width direction (width) W, thickness direction dimension (thickness) T, longitudinal direction dimension (length) L (where L> W, L> T) Because
The diameter is larger than the diagonal dimension of the plane (WT surface) defined by the width W and the thickness T of the component, and depends on the plane (LW surface), the length L and the thickness T defined by the length L and the width W. A first plate in which a plurality of first through holes smaller than the diagonal dimension of the prescribed plane (LT surface) are arranged in a predetermined alignment position;
A plurality of second through holes disposed on the lower surface side of the first plate and having a diameter larger than the diagonal dimension of the LW surface and the LT surface are arranged in a predetermined alignment positional relationship. Two plates,
By moving at least one of the first plate and the second plate, the mutual positional relationship between them is (a) the component is interfered with the second plate and transferred from the first through hole to the second through hole. So that a predetermined positional deviation occurs between the first through hole and the second through hole disposed in each, and (b) a posture in which the WT surface is an upper and lower surface. Then, the plate is controlled so that the first through hole and the second through hole disposed in the first plate and the second plate are substantially overlapped so as to be transferred from the first through hole to the second through hole. Position control means;
A component aligning apparatus comprising: a conveying jig that supports and conveys a component that has been transferred to the second through hole of the second plate. 4. The component alignment apparatus according to claim 3, wherein the thicknesses of the first plate and the second plate are equal to or greater than the longitudinal dimension (length) L of the component. Vibration for aligning the component on the conveying jig in such a posture that the LW surface or the LT surface is the upper and lower surfaces by vibrating or swinging the component that has been transferred to the second through hole of the second plate. 5. The component aligning device according to claim 3, further comprising a swing applying means.

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