JP3658140B2 - Vacuum arc evaporation system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vacuum arc deposition apparatus for forming a film by adhering an evaporated material evaporated from a target surface by vacuum arc discharge to a substrate surface.
[0002]
[Prior art]
Vacuum arc deposition is a film forming technique that is widely used for hard coating of TiN on tools, for example. FIG. 2 shows an example of the apparatus. In this apparatus, a target 52, which is an evaporation material, is attached to and supported by a cathode member 53 in a vacuum chamber 51.
[0003]
When a vacuum arc discharge is generated by applying an arc voltage from the arc power supply 55 to the cathode member 53 and the anode (anode member) 54 in a state where the inside of the vacuum chamber 51 is evacuated by a vacuum pump (not shown), the evaporation surface of the target 52 An arc spot where current is concentrated is generated in 52a, and the target material is locally evaporated. This evaporating substance is deposited on the surface of the substrates 57... Set on the substrate table 56, and a film is formed.
[0004]
The cathode member 53 provided through the vacuum chamber 51 is electrically insulated from the vacuum chamber 51 by interposing an insulator 58 between the cathode member 53 and the vacuum chamber 51.
On the other hand, the arc spot moves randomly on the evaporation surface 52a of the target, but if it moves to a portion other than the evaporation surface 52a, the impurity element evaporates to adversely affect film formation and damage peripheral components. . In order to prevent this, an arc stabilizing ring 59 for confining the arc spot in the evaporation surface 52a is disposed around the target 52. The arc stabilizing ring 59 is electrically insulated from the target 52 and the cathode member 53 by providing a slight gap from the outer periphery of the target 52.
[0005]
Further, in the illustrated apparatus, an evaporation source cover 60 called a shield is disposed around the target 52 and the cathode member 53. By this evaporation source cover 60 having the tip side close to the outer periphery of the arc stabilization ring 59, it is possible to suppress the vapor generated on the surface of the target 52 from flowing to the back side of the target 52, and thereby to the insulator 58 described above. The vapor is prevented from adhering, and the insulation between the vacuum chamber 51 and the cathode member 53 is maintained. Note that the evaporation source cover 60 itself is also insulated by interposing an insulator 61 between the evaporation source cover 60 and the evaporation source cover 60 or the arc stabilization ring 59. Thus, even if they are in contact with each other, the arc discharge state does not change greatly immediately.
[0006]
On the other hand, the substrate table 56 is also electrically insulated from the vacuum chamber 51 by setting the substrate table 56 through an insulator 62 provided on the wall surface of the vacuum chamber 51. During the film formation, a negative bias voltage is applied from the bias power source 63 to the substrate 57 via the substrate table 56.
By the way, in the apparatus as described above, the cathode member 53 and the anode 54, the annular body surrounding the cathode member 53 such as the arc stabilizing ring 59 and the evaporation source cover 60, and the components such as the vacuum chamber 51, etc. It is important that electrical insulation is maintained. If the insulation between these components decreases, a malfunction occurs, and stable vacuum arc discharge cannot be maintained. In addition, even when the insulation between the substrate table 56 and the vacuum chamber 51 deteriorates due to dirt on the surface of the insulator 62 during this period, a predetermined bias voltage cannot be applied to the substrate 57, resulting in poor film formation. .
[0007]
For this reason, for example, vapor evaporated from the target 52 directly deposits and accumulates on the insulators 58, 61, 62 formed of insulators, a gap between the arc stabilizing ring 59 and the target 52, and the like. It has a structure that never happens. However, scatter (scattering / scattering) due to process gas molecules, etc., does not completely prevent the vapor from wrapping around. For this reason, adhesion deposition gradually progresses with a small amount. Decrease gradually.
[0008]
In order to cope with this, conventionally, when the vacuum chamber 51 is opened in order to take out the substrate 57 or set the substrate of the next lot after the film formation process is finished, each component described above by the operator Insulation resistance is measured in the meantime, and when a decrease in insulation is found in this measurement, maintenance work is performed to restore insulation.
[0009]
[Problems to be solved by the invention]
However, conventionally, it takes time to measure the insulation resistance performed by the operator on the above-mentioned many components, and as a result, the problem arises that the overall cycle time becomes longer and the productivity is lowered. Yes.
Also, when an operator directly accesses the cathode member 53 or the substrate table 56 to which an external power source such as an arc power source 55 or a bias power source 63 is connected, it is necessary to proceed with caution while paying sufficient attention to safety. Therefore, there is a problem that the work becomes complicated.
[0010]
Furthermore, since a decrease in insulation is first discovered in the measurement operation at the time when the vacuum chamber 51 is opened, if a decrease in insulation is detected, the downtime of the device is unscheduled for subsequent maintenance. become longer. At this time, the substrate to be formed next is left for a long time after the completion of the previous process (for example, the cleaning process), thereby causing a problem of variation in quality.
[0011]
The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a vacuum arc deposition apparatus that can improve productivity and workability and can stably form a film with excellent quality. There is to do.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, a vacuum arc vapor deposition apparatus according to claim 1 of the present invention applies an arc voltage to both electrode members of a cathode member and an anode member to which a target is attached, and during this arc voltage application period. In a vacuum arc deposition system that forms a film by evaporating the target surface by the generated vacuum arc discharge and depositing the evaporated substance on the substrate surface, each measured component of both electrode members and the ring surrounding the target is electrically opened and closed. And connected to the resistance measuring means via the means, and the conduction of each measured part to the resistance measuring means is interrupted during the arc voltage application period, while each measured part is not operated during the non-operation period other than the arc voltage application period. Control means for measuring the insulation resistance between the selected pair of parts to be measured is provided by controlling the electrical opening and closing means to sequentially select a pair of them and to conduct to the resistance measuring means. It is characterized in that it is.
[0013]
According to the apparatus having the above configuration, the insulation between the electrode member and the ring member of the cathode member and the anode member is automatically measured during the non-operation period other than the arc voltage application period. As a result, since it is not necessary for the operator to directly access the electrode member to which the arc power supply is connected, safety concerns are eliminated, the work becomes easier, and the measurement can be completed in a shorter time. Productivity is improved.
[0014]
The vacuum arc deposition apparatus according to claim 2, wherein a substrate support member to which a bias voltage is applied during an arc voltage application period and a vacuum chamber are connected to a resistance measuring unit through an electrical switching unit, and the control unit is inoperative In this period, the substrate support member and the vacuum chamber are used as a component pair to be measured, and the insulation resistance between the substrate support member and the vacuum chamber is further measured.
[0015]
According to this configuration, since the insulation resistance between the substrate support member to which the bias voltage is applied and the vacuum chamber is also automatically measured, fluctuations in the bias voltage can be suppressed, thereby stabilizing the film with excellent quality. Can be produced.
The vacuum arc vapor deposition apparatus according to claim 3, wherein the parts to be measured are connected to each other, and the switching means for sequentially selecting and connecting the parts to be measured according to the instruction signal from the control means to the resistance measuring means. In this case, it is possible to measure the insulation resistance for each pair of parts to be measured by providing only one resistance measuring means. The overall configuration can be made simpler.
[0016]
The vacuum arc vapor deposition apparatus according to claim 4, together with the measurement of the insulation resistance between each pair of parts to be measured, during the non-operation period between the stop of the vacuum arc discharge and the opening of the vacuum chamber door, The measurement resistance value is compared with a preliminarily stored allowable resistance value to determine pass / fail, and when there is a defective portion, control is performed to display the defective portion on the display means.
[0017]
According to this configuration, whether or not the insulation is good is also determined by the control means, and when there is a defective portion, the vacuum chamber is opened to the atmosphere after the end of the arc voltage application period (hereinafter also referred to as a film forming process). The defective part is displayed up to the point of time. For this reason, maintenance etc. of a required location can be performed immediately after opening a vacuum chamber. In addition, since the presence or absence of maintenance can be determined before the vacuum chamber is opened, pretreatment such as cleaning of the substrate can be performed at an appropriate timing, and variation in time from the previous process to loading the substrate into the vacuum arc deposition apparatus Is suppressed, and it is possible to stably form a film having excellent quality.
[0018]
The vacuum arc vapor deposition apparatus according to claim 5, wherein the control means closes each pair of parts to be measured during a non-operation period between the time when the vacuum chamber is closed and the predetermined vacuum degree is reached after the vacuum chamber door is closed. Along with the measurement of the insulation resistance between them, the measured resistance value is compared with a preliminarily stored allowable resistance value, and control is performed to determine pass / fail, and when there is a defective portion, the arc voltage is applied to both electrode members. It is characterized in that an interlock circuit is provided for holding in a stopped state.
[0019]
According to this configuration, when the insulating measurement is performed between the time when the substrate is set in the vacuum chamber and the film forming process is started, and there is a defective portion of the insulating property, the film forming process is performed by the interlock circuit. Therefore, defective coating is prevented in advance.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Next, an embodiment of the present invention will be described with reference to FIG.
As shown in the figure, the vacuum arc vapor deposition apparatus in this embodiment includes an evaporation source unit 2 in the vicinity of the inner surface of one side wall 1a in the vacuum chamber 1, and a substrate table (substrate holding member) 3 on the bottom wall 1b. Each is provided.
[0021]
The evaporation source unit 2 is provided with a cathode member 4. The cathode member 4 has a disk-shaped attachment portion 4a and a small-diameter circle extending rearward (rightward in the drawing) from the center of the back surface of the attachment portion 4a. It is formed in a shape having a columnar shaft portion 4b. The cathode member 4 is fixed so that the shaft portion 4b penetrates the side wall 1a of the vacuum chamber 1 and the mounting portion 4a is spaced apart from the side wall 1a by a predetermined distance and is positioned substantially in parallel.
[0022]
A first insulating ring 5 is interposed between the side wall 1a and the shaft portion 4b, thereby ensuring the airtightness of this portion and electrically insulating the cathode member 4 and the vacuum chamber 1 from each other. Has been. A substantially disc-shaped target 6 made of a metal material such as Ti is attached to the front surface (left end surface in the figure) of the attachment portion 4a of the cathode member 4.
[0023]
An arc stabilizing ring 7 is disposed on the outer periphery on the front side of the target 6. The arc stabilizing ring 7 is provided with a slight gap between the arc stabilizing ring 7 and the target 6, thereby being electrically insulated from the target 6. At the time of film formation to be described later, an arc spot with concentrated discharge energy moves randomly on the surface of the target 6, that is, the evaporation surface 6 a along with the vacuum arc discharge, and this arc spot is moved by the arc stabilization ring 7. 6 is confined within the evaporation surface 6a.
[0024]
Further, the evaporation source unit 2 is provided with a cylindrical evaporation source cover 8 called a shield surrounding the target 6 and the cathode member 4 outside the arc stabilizing ring 7. The evaporation source cover 8 is erected on the side wall 1a of the vacuum chamber 1 via the second insulating ring 9, and the tip (left end in the figure) side surrounds the arc stabilizing ring 7 and is located close to the outer periphery thereof. It becomes the shape to do. As a result, the vapor evaporated on the evaporation surface 6a of the target 6 is prevented from entering the back side of the target 6, and the vapor is attached to the first insulating ring 5 between the vacuum chamber 1 and the cathode member 4. The deterioration of the insulation is suppressed.
[0025]
A tapered annular anode (anode member) 10 is disposed at a position slightly outside the front of the evaporation source cover 8. The anode 10 is connected to the plus terminal of the arc power source 11, and the mounting portion 4 b of the cathode member 4 is connected to the minus terminal of the arc power source 11. A direct-current arc voltage for generating a vacuum arc discharge described later is applied from the arc power source 11 between the target 6 attached to the cathode member 4 and the anode 10.
[0026]
On the other hand, the substrate table 3 has a shape having a large-diameter disk-like substrate placement portion 3a and a small-diameter columnar shaft portion 3b extending downward from a central portion of the lower surface of the substrate placement portion 3a. Is formed. The shaft portion 3b passes through the bottom wall 1b of the vacuum chamber 1 and is attached to the bottom wall 1b so that the substrate placement portion 3a is spaced apart from the bottom wall 1b by a predetermined distance and is substantially parallel. Yes. A third insulating ring 12 is interposed between the bottom wall 1b and the shaft portion 3b, thereby ensuring the airtightness of this portion and electrically insulating the substrate table 3 from the vacuum chamber 1. Has been.
[0027]
The substrate table 3 and the vacuum chamber 1 are connected to a bias power source 13, whereby a plurality of substrates 14 placed on the substrate table 3 have a negative bias voltage with respect to the potential of the vacuum chamber 1. It is configured to be applied via the substrate table 3.
Although not shown, a vacuum exhaust system is further connected to the vacuum chamber 1, and a gas introduction system for supplying a process gas such as nitrogen gas is connected to the vacuum chamber 1. Further, the evaporation source unit 2 is further provided with an arc ignition mechanism at a position near the evaporation surface 6a of the target 6.
[0028]
Next, the film forming process in the above apparatus will be described by taking, for example, a case where a TiN film is formed by attaching a Ti target 6 to the cathode member 4.
First, when a substrate (not shown) in the vacuum chamber 1 is opened and closed and the substrates 14 are set on the substrate table 3, evacuation of the vacuum chamber 1 is started by the evacuation system. When a predetermined degree of vacuum is reached, a predetermined bias voltage is applied from the bias power source 13 to the substrates 14 on the substrate table 3, and a predetermined arc voltage is applied from the arc power source 11 to the cathode member 4 and the anode 10. Is applied.
[0029]
In this state, when a high voltage is applied between the arc ignition mechanism and the target 6, a trigger discharge occurs between them, and this trigger discharge triggers a vacuum arc discharge between the target 6 and the anode 10. Will occur. Due to this vacuum arc discharge, points called arc spots where energy is concentrated on the evaporation surface 6a of the target 6 appear. In the area of the arc spot, the target surface is locally evaporated and ionized to generate a metal ion plasma. The metal ions in the plasma are guided to the substrate 14 side. At this time, nitrogen gas is introduced as a process gas into the vacuum chamber 1 through the gas introduction system, so that the metal ions react with the process gas. Then, a TiN film is formed on the surface of the substrate 14.
[0030]
The vacuum arc discharge is continued for a predetermined time until the film thickness reaches a desired thickness, and then the arc power supply 11 and the bias power supply 13 are turned off to stop the discharge. 14 ... Inert gas for cooling is introduced and the room is returned to atmospheric pressure. When the substrates 14 are lowered to a predetermined temperature, the door of the vacuum chamber 1 is opened and the substrates 14 are taken out. Then, new substrates 14 are set on the substrate table 3, This process is repeated.
[0031]
By the way, in the said apparatus, the cathode member 4 of the evaporation source unit 2 is electrically insulated from the vacuum chamber 1 by interposing the 1st insulating ring 5 between these. This is to prevent the vacuum chamber 1 from becoming a cathode and evaporating when the cathode member 4 and the vacuum chamber 1 are electrically connected to prevent this. Further, the evaporation source cover 8 is also insulated from the vacuum chamber 1 by the second insulating ring 9. This is to prevent an abnormal operation from occurring immediately even if some deformation occurs and the evaporation source cover 8 contacts the arc stabilization ring 7.
[0032]
The substrate table 3 is also electrically insulated from the vacuum chamber 1 by the third insulating ring 12 so that a predetermined bias voltage can be applied to the substrates 14 from the bias power supply 13. The film formation process described above is based on the premise that the insulation between the above-described components including the ring such as the arc stabilization ring 7 surrounding the target 6 and the evaporation source cover 8 outside thereof is maintained. It is performed stably.
[0033]
Therefore, in the above apparatus, it is very important to ensure insulation between the components. For this reason, in this embodiment, the measurement of the insulation resistance between the component parts is performed by applying an arc voltage to the cathode member 4 and the anode 10 to generate the vacuum arc discharge (hereinafter, this period is formed). It is automatically performed during a non-operation period other than the film process. Next, a configuration for that purpose will be described.
[0034]
That is, as shown in FIG. 1, the evaporation source cover 8, the cathode member 4, the arc stabilizing ring 7, the anode 10, the vacuum chamber 1, and the substrate table 3 are measured parts, respectively, and the insulation resistance is measured from these parts. Signal line I ₁ ~ I ₆ Is pulled out and these signal lines I ₁ ~ I ₆ Is connected to a switching unit (switching means) 21. In this switching unit 21, six signal lines I ₁ ~ I ₆ Among them, predetermined two are sequentially selected and connected to an insulation resistance meter (resistance measuring means) 22, and a measurement value at the resistance meter 22 is input to a controller (control means) 23. .
[0035]
The controller 23 controls the operation of the evacuation system / gas introduction system in the film formation process and the control signal S to each power supply device such as the arc power supply 11 and the bias power supply 13. _C Is output and the ON / OFF control is performed, and the switching signal S for selecting which signal line is selected for the switching unit 21. _I Are output sequentially. This switching signal S _I Is switched by the switching unit 21 to the controller 23, for example,
(1) Signal line I ₂ ・ I _Three Insulation resistance between (cathode member 4 and arc stabilizing ring 7)
(2) Signal line I ₂ ・ I _Four Insulation resistance between (cathode member 4 and anode 10)
(3) Signal line I ₂ ・ I _Five Insulation resistance between (cathode member 4 and vacuum chamber 1)
(4) Signal line I ₂ ・ I ₁ Insulation resistance between (cathode member 4 and evaporation source cover 8)
(5) Signal line I _Four ・ I _Five Insulation resistance between anode 10 and vacuum chamber 1
(6) Signal line I _Five ・ I ₆ Insulation resistance between (vacuum chamber 1 and substrate table 3)
Are sequentially input from the insulation resistance meter 22.
[0036]
When these measured values are input, the controller 23 is configured to sequentially compare with the allowable resistance value stored in advance and determine the quality and output the determination result to the display device 24. As will be described later, the controller 23 includes an interlock circuit that holds the arc power supply 11 and the bias power supply 13 in an OFF state based on the determination result.
[0037]
Next, a specific control procedure performed by the controller 23 will be described from the time when the vacuum arc discharge is stopped and the film formation on the substrate is finished.
(1) First, the arc power supply 11 is turned off to stop the vacuum arc discharge, and the bias power supply 13 is also turned off to complete the film forming process. Thereafter, an inert gas is introduced for cooling in the vacuum chamber 1, and when the temperature drops below a predetermined temperature, an insulation resistance measurement start command is output to the switching unit 21, and the switching signal S _I Are sequentially output at predetermined time intervals. As a result, the measured insulation resistance values (1) to (6) are sequentially input from the insulation resistance meter 22 to the controller 23.
[0038]
(2) When the measurements {circle around (1)} to {circle around (6)} are completed, the controller 23 compares the preset allowable value with each measured value to determine pass / fail.
(3) If all the measured values are equal to or greater than the allowable values and the insulation is good, the controller 23 displays on the display device 24 that the next film formation process can be performed. If there is an insulation failure location, the controller 23 displays the failure location on the display device 24.
[0039]
Therefore, when a defective portion is displayed on the display device 24 at this time, the operator prepares parts and the like necessary for the insulation recovery work at the display portion at this stage.
After that, when the pressure in the vacuum chamber 1 returns to atmospheric pressure and decreases to a predetermined temperature, the operator opens the vacuum chamber 1 and takes out the processed substrates 14. Next, when the display device 24 indicates that the insulation state is normal, the coating substrate for the next lot is set on the substrate table 3. On the other hand, when a defect is displayed, the maintenance of the defective part is immediately performed to recover the insulation, and then the substrate is set.
[0040]
(4) Thereafter, when the operator closes the vacuum chamber 1 and performs an operation of pressing a start button provided in the controller 23 in order to start the next film forming process, the controller 23 is vacuumed. Start exhaust. And during this evacuation, the above-mentioned insulation resistance is measured again. Thereby, it is confirmed that the maintenance of the location that was the location of poor insulation was performed appropriately. In addition, during the maintenance work or the like, for example, an operator touches each component to change the positional relationship, thereby confirming whether necessary electrical insulation is not impaired.
[0041]
(5) If there is no abnormality in the result of the above remeasurement, the arc power supply 11 and the bias power supply 13 are turned on after the predetermined vacuum degree is reached, and the film forming process is started. If there is an abnormality in the result of re-measurement, the fact is displayed on the display device 24, and an internal interlock circuit is activated to take measures to stop the transition to the film formation process. Display the location.
[0042]
As described above, in the vacuum arc state apparatus according to the present embodiment, the insulation resistance between the components is automatically measured during the non-operation period in which the vacuum arc discharge is stopped. The film forming process on the substrate 14 is executed in a state where the insulating property is ensured. Therefore, it is possible to maintain a stable operating state and perform film formation with excellent quality.
[0043]
In addition, the said embodiment does not limit this invention, A various change is possible within the scope of the present invention. For example, by providing the switching unit 21 as an electrical switching means, a single insulation ohmmeter 22 can sequentially measure the insulation resistance at a plurality of locations, but for each location requiring measurement, for example, from an electromagnetic relay It is also possible to adopt a configuration in which the electrical switching means and the insulation resistance meter are provided in pairs.
[0044]
In the above embodiment, the insulation resistance measurement signal line I is connected to both the evaporation source cover 8 and the arc stabilization ring 7 as an annulus surrounding the target. ₁ ・ I _Three Each of these is used as a part to be measured, and the insulation resistance between the cathode member 4 and the like is measured. However, the present invention provides all of the above-described plurality of rings provided in the vacuum chamber 1. However, it is also possible to adopt a configuration in which at least one part such as the arc stabilizing ring 7 is selected as the part to be measured.
[0045]
Further, in the above description, an example is given in which the control configuration is such that the insulation resistance is measured before and after the vacuum chamber 1 is opened, but the measurement can be performed only during one of the non-operation periods.
Moreover, in the said embodiment, although the vacuum arc vapor deposition apparatus provided with only one evaporation source unit 2 was mentioned as an example, it can be configured by applying the present invention to an apparatus having a plurality of evaporation source units. It is.
[0046]
Furthermore, the present invention is not limited to the device configuration in the above-described embodiment in which the electrode structure is specified, and can also be applied to devices employing other electrode structures. For example, in the above embodiment, the vacuum chamber 1 to the anode 10 are also insulated. However, the anode (anode member) is electrically connected to the vacuum chamber, or the vacuum chamber is not provided with an anode electrode. Some apparatuses have a configuration in which they are used as anodes. In these apparatuses, the present invention can be applied with the vacuum chamber substantially regarded as an anode member.
[0047]
Moreover, although the batch type vacuum arc vapor deposition apparatus was mentioned above as an example, in the range of Claims 1-3 of this invention, it is also possible to apply to an in-line type vacuum arc vapor deposition apparatus. In other words, in an in-line type apparatus in which a replacement chamber between the atmosphere and a vacuum is provided before and after the film formation chamber and the film formation chamber as a vacuum chamber is always kept in a vacuum state, If the insulating property is confirmed in the film formation chamber by opening it to the atmosphere, the operation rate is lowered and sufficient productivity cannot be obtained.
[0048]
Therefore, by applying the present invention to such an in-line apparatus, it is possible to automatically measure the insulation resistance between each component of the film forming chamber from outside the apparatus while keeping the film forming chamber in a vacuum state. Thus, only when a decrease in insulation is discovered, the work frequency can be minimized by returning the film formation chamber to atmospheric pressure and performing the maintenance work. As a result, it is possible to form a film with excellent quality while maintaining higher productivity.
[0049]
【The invention's effect】
As described above, in the vacuum arc vapor deposition apparatus according to claim 1 of the present invention, each measured component of both the electrode member of the cathode member and the anode member and the ring surrounding the target is connected to the resistance measuring means. In addition, during the non-operation period other than the arc voltage application period, the insulation resistance between the measured parts is automatically measured by the control means, so that the worker directly accesses the electrode member to which the arc power source is connected. It is not necessary, and therefore, safety concerns are eliminated, the work is facilitated, and the measurement can be completed in a shorter time, so that productivity is improved.
[0050]
In the vacuum arc vapor deposition apparatus according to claim 2, since the measurement of the insulation resistance between the substrate support member and the vacuum chamber as a part to be measured is further automatically performed, the bias applied to the substrate support member Voltage fluctuations can be suppressed, and this makes it possible to stably produce a film with excellent quality.
In the vacuum arc vapor deposition apparatus according to claim 3, the electrical switching means is constituted by switching means for switching and connecting each pair of parts to be measured to the resistance measuring means. Therefore, only one resistance measuring means is provided. It is possible to measure the insulation resistance for each of a plurality of parts to be measured, thereby making the overall configuration simpler.
[0051]
In the vacuum arc vapor deposition apparatus according to claim 4, after the vacuum arc discharge is stopped and before the door of the vacuum chamber is opened, the insulation resistance between each pair of parts to be measured is measured to judge whether it is good or bad. When there is a location, control for displaying the failure location is performed, so that maintenance of a required location can be performed immediately after the vacuum chamber is opened. In addition, since the presence or absence of maintenance can be determined before the vacuum chamber is opened, the substrate pre-treatment can be performed at an appropriate timing, and this leads to variations in time from the previous process until the substrate is loaded into the vacuum arc deposition apparatus. Suppressed and stable film formation with excellent quality can be achieved.
[0052]
In the vacuum arc vapor deposition apparatus according to claim 5, after the vacuum chamber door is closed, the vacuum resistance is started and the insulation resistance between each pair of parts to be measured is measured until the predetermined vacuum degree is reached. Therefore, when there is a defective portion, the film formation process is controlled not to start by the interlock circuit, so that defective coating is prevented in advance.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a vacuum arc vapor deposition apparatus in an embodiment of the present invention.
FIG. 2 is a schematic view showing a configuration of a conventional vacuum arc vapor deposition apparatus.
[Explanation of symbols]
1 Vacuum chamber
3 Substrate table (substrate holding member)
4 Cathode member
6 Target
6a Evaporation surface
7 Arc stabilization ring (ring)
8 Evaporation source cover (ring)
10 Anode (anode member)
11 Arc power supply
13 Bias power supply
14 Board
21 Switching unit (switching means, electrical switching means)
22 Insulation resistance meter (resistance measurement means)
23 Control controller (control means)
24 Display device (display means)
I ₁ ~ I ₆ Insulation resistance measurement signal line

Claims (5)

An arc voltage is applied to both the cathode member and the anode member to which the target is attached, and the target surface is evaporated by a vacuum arc discharge generated during the arc voltage application period so that the evaporated substance adheres to the substrate surface and a film is formed. In the vacuum arc deposition apparatus to be formed,
Each measured component of both electrode members and the ring surrounding the periphery of the target is connected to the resistance measuring means via the electrical switching means; and
During the arc voltage application period, the continuity of each measured component to the resistance measuring means is cut off, while a pair of each measured component is sequentially selected during the non-operating period other than the arc voltage applying period as the resistance measuring means. A vacuum arc vapor deposition apparatus, characterized in that a control means is provided for controlling the electrical switching means to conduct and measuring the insulation resistance between a selected pair of parts to be measured. The substrate support member to which a bias voltage is applied during the arc voltage application period and the vacuum chamber are connected to the resistance measuring means via the electrical switching means,
2. The control unit according to claim 1, wherein the control means further measures an insulation resistance between the substrate support member and the vacuum chamber using the substrate support member and the vacuum chamber as a component pair to be measured during a non-operation period. Vacuum arc deposition equipment. The electrical switching means is configured by switching means for connecting each measured part and selecting a part to be measured in accordance with an instruction signal from the control means and switching and connecting to the resistance measuring means. The vacuum arc deposition apparatus according to claim 1 or 2. In the non-operating period between when the vacuum arc discharge is stopped and before the vacuum chamber door is opened, the control means measures the insulation resistance between each pair of parts to be measured, and the allowable resistance in which the measured resistance value is stored in advance. The vacuum arc vapor deposition apparatus according to claim 1, 2 or 3, wherein the quality is determined by comparing with the value and control is performed to display the defective part on the display means when the defective part exists. . In the non-operation period after the control means closes the vacuum chamber door and starts evacuation until a predetermined degree of vacuum is reached, the measurement resistance is measured together with the measurement of the insulation resistance between each pair of parts to be measured. An interlock circuit that performs control to determine pass / fail by comparing the value with a pre-stored allowable resistance value, and holds the application of the arc voltage to both electrode members in a stopped state when a defective portion exists The vacuum arc vapor deposition apparatus according to claim 1, wherein the vacuum arc vapor deposition apparatus is provided.

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