JP3657236B2 - Heating device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heating apparatus mounted on, for example, a culture apparatus.
[0002]
[Prior art]
For various analyzes using biological samples, for example, microplates having a large number of wells (holes) such as 96 or 384 are used.
[0003]
Prior to the analysis, a biological sample (microorganism) is placed in each well of the microplate and cultured in a state where it is heated for a predetermined time.
[0004]
Such heating of the microplate has been conventionally performed by placing the microplate on a flat heating plate.
[0005]
However, in such a method, a considerable gap is generated between the surface of the heating plate and the bottom of each well inside the leg (outer wall) of the microplate, and the thermal conductivity to each well is low. In particular, a well near the center of the microplate is inferior in thermal conductivity to a well near the outer periphery, and temperature distribution (temperature unevenness) is likely to occur.
[0006]
If such temperature unevenness occurs during heating, the same culture condition is not given to the biological sample in each well, which affects the reliability of the analysis result.
[0007]
[Problems to be solved by the invention]
An object of the present invention is to provide a heating device that has high heat conduction efficiency with respect to a microplate and can suppress temperature unevenness.
[0008]
[Means for Solving the Problems]
Such an object is achieved by the present inventions (1) to (5) below.
[0009]
(1) A base for mounting and heating the microplate is provided.
The base is a heat transfer portion that protrudes from the surface with which the legs of the microplate abut, and has a heat transfer portion that can be inserted into a recess formed on the bottom side of the microplate,
When the microplate is placed on the base, the heat transfer section approaches the bottom surface of the microplate in a non-contact manner.
[0010]
(2) The heating device according to (1), wherein the heat transfer unit is configured by a heating plate or a heating block.
[0011]
(3) The heating device according to (1) or (2), wherein a planar shape of the heat transfer unit is a shape corresponding to a planar shape of a recess formed on a bottom side of the microplate.
[0013]
(4) The heating apparatus according to any one of (1) to (3), further including a cooling unit that cools the base and / or the heat transfer unit.
[0014]
(5) The heating device according to (4), wherein the cooling unit includes a Peltier element.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the heating apparatus of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
[0016]
FIG. 1 is a cross-sectional side view showing a first embodiment of the heating device of the present invention. In the following description, the upper side in FIG. 1 (the same applies to FIGS. 2 and 3) is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”.
[0017]
A heating apparatus 1 shown in FIG. 1 includes a base (base) 2 on which a microplate is placed and heated. Here, before describing the configuration of the heating device 1, the configuration of the microplate 10 will be described first.
[0018]
The microplate (sample storage container) 10 has a large number of wells (holes) 11 and leg portions 13 formed on the outer periphery thereof, and these are integrally formed of a resin material.
[0019]
The wells 11 are arranged in a matrix, for example, 12 rows × 8 columns and 24 rows × 16 columns. In the illustrated configuration, the bottom 12 of each well 11 has a rounded shape, but may have a flat shape. A specimen, for example, a biological sample (not shown) is placed inside each well 11.
[0020]
The leg portion 13 is composed of a wall-like member formed so as to surround the entire circumference of the microplate 10. It is mounted by abutting on.
[0021]
The bottom portion 12 of each well 11 is located above the lower end of the leg portion 13 by a predetermined distance (for example, about 2 mm), and a recess 14 is formed on the bottom side of the microplate 10, that is, below the well 11. Has been. As described above, in the microplate 10 in which the wells 11 are arranged in a matrix, the planar shape of the recess 14 is substantially rectangular.
[0022]
The base 2 has a plate shape or a block shape, and is made of, for example, various metal materials such as stainless steel, aluminum, titanium, copper, or an alloy containing these.
[0023]
A heater (heat source) 3 that is activated by energization of an energization means (not shown) is installed inside the base 2. The kind of heater 3 is not specifically limited, For example, a rod-shaped heater, a heating wire, a ceramic heater, a rubber heater, etc. are mentioned.
[0024]
Such a heater is not limited to being installed inside the base 2, and may be joined to the outside of the base 2.
[0025]
The base 2 is provided with a heat transfer section 4 protruding from its upper surface 21 (preferably fixed by welding, brazing, fitting or the like). The microplate 10 is placed on the base 2 so as to cover the heat transfer section 4. That is, when the microplate 10 is placed on the base 2, the heat transfer section 4 is inserted into the recess 14 formed on the bottom side of the microplate 10. In this case, the upper surface 41 of the heat transfer unit 4 approaches the bottom 12 of each well 11 but is not in contact with it.
[0026]
With such a configuration, the heat of the base 2 is efficiently transferred to each well 11 via the heat transfer section 4. That is, the heat transfer section 4 having a certain heat capacity and excellent in heat transfer occupies the concave portion 14 and the upper surface 41 is close to the bottom 12 of each well 11. Heat transfer efficiency is improved.
[0027]
As such a heat transfer part 4, what is comprised with the heating plate or the heating block is preferable. Although it does not specifically limit as a constituent material of the heat-transfer part 4, For example, various metal materials, such as stainless steel, aluminum, titanium, copper, or an alloy containing these, are preferable. This is because such a material is excellent in thermal conductivity.
[0028]
The planar shape of the heat transfer unit 4 is preferably a shape corresponding to the planar shape of the recess 14 of the microplate 10. For example, when the planar shape of the recess 14 is rectangular as described above, the planar shape of the heat transfer unit 4 is also substantially rectangular. Thereby, the heat transfer efficiency at the time of heating each well 11 further improves, and temperature distribution becomes uniform.
[0029]
In the illustrated configuration, a heater is not built in the heat transfer section 4 itself, but a heater similar to the heater 3 may be installed (built in).
[0030]
In addition, the upper surface 41 of the heat transfer unit 4 is a surface facing the bottom 12 of the well 11, but the upper surface 41 is preferably a flat surface. Thereby, the temperature distribution at the time of heating each well 11 can be made more uniform.
[0031]
FIG. 2 is a sectional side view showing a second embodiment of the heating device of the present invention. Hereinafter, although this 2nd Embodiment is described, the description is abbreviate | omitted about the matter similar to the above-mentioned 1st Embodiment, and it demonstrates centering around difference.
[0032]
The heating device 1 shown in FIG. 2 has a configuration in which a base 2 and a heat transfer unit 4 are integrated. That is, the base 2 is formed with a groove 22 opened on the upper surface 21 thereof. The groove 22 can be inserted into the leg portion 13 of the microplate 10.
[0033]
For example, if the leg portion 13 is formed in an annular shape over the entire circumference of the microplate 10, the groove 22 is also formed in the same shape and arrangement.
[0034]
A land portion is formed in an inner portion surrounded by the groove 22, and the land portion constitutes the heat transfer portion 4.
[0035]
When the microplate 10 is loaded so that the leg portion 13 enters the groove 22, the heat transfer portion 4 is inserted into the recess 14 formed on the bottom side of the microplate 10. In this case, the upper surface 41 of the heat transfer unit 4 approaches the bottom 12 of each well 11 but is not in contact with it.
[0036]
FIG. 3 is a sectional side view showing a third embodiment of the heating device of the present invention. Hereinafter, although this 3rd Embodiment is described, the description is abbreviate | omitted about the matter similar to the above-mentioned 1st Embodiment, and it demonstrates centering around difference.
[0037]
The heating device 1 shown in FIG. 3 includes a cooling means for cooling the base 2. That is, the Peltier element 5 is joined to the upper surface of the base 2 as a cooling means. The Peltier element 5 has a heat generating part (heating part) 51 on one side and a heat absorbing part (cooling part) 52 on the other side, and the heat generating part (heating part) is energized by energizing means (not shown). While 51 generates heat, it is absorbed by an endothermic part (cooling part) 52 and cooled.
[0038]
In the present embodiment, such a Peltier element 5 is installed on the base 2 such that the heat absorbing portion 52 is in contact with the upper surface of the base 2.
[0039]
For example, when the heating of the microplate 10 is completed by the operation of the heater 3, the heater 3 is turned off and the Peltier element 5 is energized. Thereby, the Peltier element 5 operates and the base 2 is absorbed and cooled. When the temperature of the base 2 is lowered, the temperature of the heat transfer section 4 is similarly lowered, and each well 11 in the vicinity thereof is cooled.
[0040]
By providing such a cooling means, it is possible not only to heat the microplate 10 but also to cool it. In addition, when obtaining a predetermined temperature history (temperature change pattern over time), the temperature control is performed. Can be performed promptly and appropriately.
[0041]
Further, the function (action / effect) of the heat transfer section 4 described above is the same for the cooling in the cooling means, and the temperature distribution during the cooling can be made uniform.
[0042]
In addition, the installation position of the Peltier element (cooling means) 5 is not limited to the illustrated one, and can be installed, for example, in the base 2 or on the lower surface, or in the heat transfer section 4 or on the surface. You can also
[0043]
As mentioned above, although the heating apparatus of this invention was demonstrated about each embodiment of illustration, this invention is not limited to these, Each part which comprises a heating apparatus is arbitrary which can exhibit the same function. It can be replaced with that of the configuration.
[0044]
【The invention's effect】
As described above, according to the present invention, the heat conduction efficiency with respect to the microplate is high, and the temperature distribution can be made uniform.
[0045]
In addition, since the heat conduction efficiency is high, it is possible to perform rapid heating and the like. As a result, for example, when obtaining a predetermined temperature history, the temperature control can be performed quickly and appropriately.
[Brief description of the drawings]
FIG. 1 is a cross-sectional side view showing a first embodiment of a heating device of the present invention.
FIG. 2 is a sectional side view showing a second embodiment of the heating device of the present invention.
FIG. 3 is a sectional side view showing a third embodiment of the heating device of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Heating apparatus 2 Base 21 Upper surface 22 Groove 3 Heater 4 Heat-transfer part 41 Upper surface 5 Peltier element 51 Heating part (heating part)
52 Endothermic part (cooling part)
10 Microplate 11 Well 12 Bottom 13 Leg 14 Recess

Claims (5)

It is equipped with a base for placing and heating a microplate,
The base is a heat transfer portion that protrudes from the surface with which the legs of the microplate abut, and has a heat transfer portion that can be inserted into a recess formed on the bottom side of the microplate,
When the microplate is placed on the base, the heat transfer section approaches the bottom surface of the microplate in a non-contact manner.   The heating apparatus according to claim 1, wherein the heat transfer unit is configured by a heating plate or a heating block.   3. The heating device according to claim 1, wherein a planar shape of the heat transfer portion corresponds to a planar shape of a recess formed on a bottom side of the microplate.   The heating apparatus according to any one of claims 1 to 3, further comprising cooling means for cooling the base and / or the heat transfer section.   The heating apparatus according to claim 4, wherein the cooling means is configured by a Peltier element.

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