JP3654198B2 - Head gimbal assembly - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a head gimbal assembly (HGA) in a magnetic disk device or a magneto-optical disk device.
[0002]
[Prior art]
In HGA, forming a lead pattern for a magnetic head on the metal suspension is known from, for example, Japanese Patent Application Laid-Open Nos. 6-215513 and 3-71477.
[0003]
JP-A-6-215513 discloses that a wiring pattern for a magnetic head is formed on a load beam by patterning using photolithography. On the other hand, Japanese Patent Application Laid-Open No. 3-71477 describes a suspension in which a metal layer having a conductor portion for electrical connection is bonded to one side of a flexible sheet and stainless steel is bonded to the other side. Yes.
[0004]
[Problems to be solved by the invention]
In any of these known techniques, the lead pattern connected to the magnetic head is formed on the base metal via an insulating layer. For this reason, a capacitor is formed between the lead pattern and the base metal. Since the base metal is at the ground level, the parasitic capacitance C is between the lead pattern and the ground. _G Will occur. When such a parasitic capacitance occurs, this parasitic capacitance C _G A resonance phenomenon occurs at the data transfer frequency due to the parasitic inductance of the lead pattern and the inductance component of the magnetic head. This resonance phenomenon will be described below.
[0005]
1 and 2 show equivalent circuits on the write head side and the read head side in a conventional HGA having a composite magnetic head, respectively. In these drawings, 10 indicates an inductive write magnetic head, 11 indicates a lead pattern thereof, 20 indicates a magnetoresistive effect type read magnetic head, and 21 indicates an equivalent circuit of the lead pattern.
[0006]
In FIG. 1, parasitic capacitance C _G Is C _G = 40 pF, lead pattern parasitic inductance L _L Is L _L = 20 nH, inductance component L of inductive write magnetic head _H Is L _H = 90 nH or so, the write resonance frequency f ₀ Is
f ₀ = 1 / 2π√ (LC)
≒ 1 / 2π√ {(L _H + L _L ) C _G }
≒ 76MHz
It becomes. That is, it resonates at about 76 MHz, and writing data transfer at a higher frequency becomes impossible. However, L ≒ L _H + L _L , C ≒ C _G (C _G ≫C _L , C _L Is a parasitic capacitance between lead patterns).
[0007]
Similarly, in FIG. 2, the parasitic capacitance C _G Is C _G = 40 pF, lead pattern parasitic inductance L _L Is L _L = 20 nH, inductance component l of magnetoresistive read magnetic head _P Is l _P = 30 nH or so, the read resonance frequency f ₀ Is
f ₀ = 1 / 2π√ (LC)
≒ 1 / 2π√ {(l _P + L _L ) C _G }
≒ 116MHz
It becomes. That is, it resonates at about 116 MHz, and read data transfer at a higher frequency becomes impossible. However, L ≒ l _P + L _L , C ≒ C _G (C _G ≫C _L , C _L Is a parasitic capacitance between lead patterns).
[0008]
Accordingly, it is an object of the present invention to provide an HGA that allows high-speed data transfer for writing and reading by shifting the resonance point to the high frequency side by reducing the parasitic capacitance between the lead pattern and the ground.
[0009]
[Means for Solving the Problems]
The present invention relates to an HGA having a magnetic head slider, a metal suspension that supports the magnetic head slider, and a magnetic head lead pattern formed on the suspension via an insulator. In particular, according to the present invention, The metal suspension below the lead pattern for the magnetic head is provided with a recess for reducing the parasitic capacitance. .
[0010]
By partially removing the metal flexure and the load beam below the magnetic head lead pattern, the parasitic capacitance between the lead pattern and the metal suspension is reduced. That is, in order to reduce the parasitic capacitance, (1) the distance d between the metal suspension and the lead pattern is increased, or (2) the dielectric constant ε of the insulator between the metal suspension and the lead pattern. ₀ (3) The capacitance C≈ε may be reduced by reducing the facing area S between the metal suspension and the lead pattern. ₀ It can be understood from the equation of S / d.
[0011]
However, regarding (1), increasing the thickness of the insulator between the metal suspension and the lead pattern in order to increase the distance d results in a functional problem because the flexibility of the suspension is impaired. . Regarding (2), the currently used polyimide (ε ₀ = 3.3) Almost no insulating material has a smaller dielectric constant and functions as an interlayer insulating film. Therefore, according to the present invention, the metal flexure and the load beam below the magnetic head lead pattern are partially removed to reduce the opposing area S between the metal suspension and the lead pattern, thereby reducing the parasitic capacitance. Yes. In order to reduce the facing area S, it is conceivable to reduce the width of the lead pattern. However, this causes an increase in DC resistance, leading to deterioration of signal transfer characteristics. In order not to increase the DC resistance, it may be possible to increase the thickness of the lead pattern by reducing the width of the lead pattern. However, not only is it difficult to create such a thin and thick lead pattern, but also the flexibility of the suspension Will greatly deteriorate the performance.
[0015]
The suspension is composed of a metal load beam and a metal flexure placed on the load beam and having a magnetic head lead pattern formed thereon, and a plurality of recesses are formed in the metal flexure below the magnetic head lead pattern. It is preferable to be provided.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings.
[0017]
FIG. 3 is a plan view showing a reference example of an HGA related to the present invention, and FIG. 4 is a cross-sectional view taken along line AA of FIG.
[0018]
In these drawings, 30 is a flexible flexure for supporting the magnetic head slider 31 at one end, 32 is a load beam for supporting and fixing the flexure 30, and 33 is a base plate fixed to the base of the load beam 32. Respectively. In addition, you may comprise the base part of the load beam 32 as a flexure, without providing a flexure separately.
[0019]
In this reference example, the flexure 30 is made of a stainless steel plate (for example, SUS304TA) having a thickness of about 25 μm. On the flexure 30, four lead patterns 34a to 34d by thin film patterns are formed over almost the entire length as input / output signal lines. One end of each of the lead patterns 34a to 34d is connected to four connection terminals (not shown) by a thin film pattern directly connected to the magnetic head slider 31, and the other end is connected by a thin film pattern for connection to an external circuit. It is connected to terminals 35a-35d.
[0020]
The thin film pattern is formed by a known patterning method in which a printed board is laminated on a metal thin plate. That is, as is apparent from FIG. 4, a polyimide layer (lower insulating layer) 36 having a thickness of about 5 μm, patterned copper layers (lead patterns) 34a to 34d having a thickness of about 4 μm, and a polyimide layer having a thickness of about 5 μm. (Upper insulating layer) 37 is laminated on the flexure 30 in this order, or a pre-laminated layer is laminated on the flexure 30. However, in the connection terminals (35a to 35d), a nickel layer and a gold layer are laminated on the copper layer, and no upper insulating layer is formed thereon. In FIG. 3, the lead patterns 34a to 34d are represented by solid lines for easy understanding.
[0021]
The load beam 32 is made of a stainless steel plate having a thickness of about 62 to 76 μm, and fixes and supports the flexure 30 at several places. This fixation between the flexure 30 and the load beam 32 is performed at a plurality of welding points by laser welding or the like.
[0022]
The base plate 33 is made of stainless steel or iron, and is fixed to the base of the load beam 32 at a plurality of welding points as described above.
[0023]
The most important configuration in this reference example is that a plurality of through holes 38 are formed in the stainless steel plate of the flexure 30 by, for example, etching. That is, by providing a plurality of stainless steel plate through holes 38 in a portion of the flexure 30 positioned below the lead patterns 34a to 34d, the lead pattern is substantially reduced by reducing the area of the flexure which is an electrode facing the lead pattern. Capacitance C due to the capacitor formed by the _G Is decreasing. In this reference example, the distance between the electrodes of the capacitor is actually increased by using the load beam 32 as an electrode facing the lead pattern in the through hole 38. Further, by providing the through hole in the flexure, the mass of the suspension itself can be reduced, so that the mechanical resonance characteristics and dynamic vibration characteristics of the entire suspension can be greatly improved.
[0024]
In this reference example, the shape of the through hole 38 is an ellipse. However, this shape may be a rectangle, another polygon, or any other shape. Good. Moreover, the shape of each through hole may be the same as each other, or may be different. The size of the through hole 38 is not limited to that shown in the figure, and may be different from each other. However, the through hole 38 is formed so as to ensure the spring property necessary for the magnetic head slider 31 to move freely so as to satisfy the basic function as a flexure, and at a position other than the welding point with the load beam 32. Form. It is possible to remove all the metal parts unnecessary for securing the basic function of the flexure 30 by forming the through-holes 38. _G It is desirable to reduce significantly. Parasitic capacitance C by removing 1/2 of flexure area _G Is about 20 pF. If the area is further reduced, the parasitic capacitance C is increased accordingly. _G Decreases.
[0025]
By forming the plurality of through holes 38 in this way, the lower insulating layer 36, the lead patterns 34a to 34d and the upper insulating layer 37 stacked on the flexure 30 have a structure in which the through holes are bridged. In order to maintain the strength, it is preferable to increase the thickness of the insulating layers 36 and 37 within an allowable range and to increase the thickness and width of the lead patterns 34a to 34d.
[0026]
FIG. 5 is a plan view showing an embodiment of the HGA of the present invention, and FIG. 6 is a cross-sectional view taken along the line BB of FIG.
[0027]
In these figures, 50 is a flexible flexure for supporting the magnetic head slider 51 at one end, 52 is a load beam for supporting and fixing the flexure 50, and 53 is a base plate fixed to the base of the load beam 52. Respectively. In addition, you may comprise the base part of the load beam 52 as a flexure, without providing a flexure separately.
[0028]
In this embodiment, the flexure 50 is made of a stainless steel plate (for example, SUS304TA) having a thickness of about 25 μm. On the flexure 50, four lead patterns 54a to 54d by thin film patterns are formed over almost the entire length as input / output signal lines. One end of each of the lead patterns 54a to 54d is connected to four connection terminals (not shown) by a thin film pattern directly connected to the magnetic head slider 51, and the other end is connected by a thin film pattern for connection to an external circuit. The terminals 55a to 55d are connected.
[0029]
The thin film pattern is formed by a known patterning method in which a printed board is laminated on a metal thin plate. That is, as is apparent from FIG. 6, a polyimide layer (lower insulating layer) 56 having a thickness of about 5 μm, patterned copper layers (lead patterns) 54a to 54d having a thickness of about 4 μm, and a polyimide layer having a thickness of about 5 μm. (Upper insulating layer) 57 is laminated on flexure 50 in this order, or a pre-laminated layer is laminated on flexure 50. However, in the connection terminals (55a to 55d), a nickel layer and a gold layer are laminated on the copper layer, and no upper insulating layer is formed thereon. In FIG. 5, the lead patterns 54a to 54d are represented by solid lines for easy understanding.
[0030]
The load beam 52 is made of a stainless steel plate having a thickness of about 62 to 76 μm, and fixes and supports the flexure 50 at several places. This fixation between the flexure 50 and the load beam 52 is performed at a plurality of welding points by laser welding or the like.
[0031]
The base plate 53 is made of stainless steel or iron, and is fixed to the base of the load beam 52 at a plurality of welding points as described above.
[0032]
The most important configuration in the present embodiment is that a plurality of through holes 58 are formed in the stainless steel plate of the flexure 50 by, for example, etching, and a plurality of through holes 59 are also formed in the load beam 52 by, for example, etching. is there. That is, a plurality of stainless steel plate through holes 58 are provided in a portion of the flexure 50 positioned below the lead patterns 54a to 54d, and a plurality of through holes 59 are provided in the load beam 52 below the through holes 58, respectively. . Thereby, the area of the flexure and load beam, which are electrodes facing the lead pattern, is substantially reduced, so that the parasitic capacitance C due to the capacitor formed by the lead pattern, the flexure and the load beam is obtained. _G Is decreasing. Also, by providing through holes in the flexure and the load beam, the mass of the suspension itself can be reduced, so that the mechanical resonance characteristics and dynamic vibration characteristics of the entire suspension can be greatly improved.
[0033]
In the present embodiment, the shape of the through holes 58 and 59 is an ellipse. However, this shape may be a rectangle, another polygon, or any other shape. May be. The shapes of the through holes 58 or the through holes 58 and 59 may be the same or different from each other. The sizes of the through holes 58 and 59 are not limited to those shown in the figure, and may be different sizes. Furthermore, in this embodiment, the through hole 58 has a size larger than the through hole 59, but both may have the same size, or the through hole 58 may have a smaller size than the through hole 59. However, the through hole 58 is formed so as to ensure the spring property necessary for the magnetic head slider 51 to freely move so as to satisfy the basic function as a flexure, and at a position other than the welding point with the load beam 52. Form. The through hole 59 is also formed at a position other than the welding point with the flexure 50. It is possible to remove all unnecessary metal parts for securing the basic functions of the flexure 50 and the load beam 52 by forming the through holes 58 and 59. _G It is desirable to reduce significantly. Parasitic capacitance C by removing 1/2 of flexure and load beam area _G Is about 20 pF. If the area is further reduced, the parasitic capacitance C is increased accordingly. _G Decreases.
[0034]
By forming the plurality of through holes 58 in this way, the lower insulating layer 56, the lead patterns 54a to 54d and the upper insulating layer 57 laminated on the flexure 50 have a structure in which the through holes are bridged. In order to maintain the strength, it is preferable to increase the thickness of the insulating layers 56 and 57 within an allowable range and increase the thickness and width of the lead patterns 54a to 54d.
[0035]
FIG. 7 is a plan view showing another embodiment of the HGA of the present invention, and FIG. 8 is a sectional view taken along the line CC of FIG.
[0036]
In these drawings, 70 is a flexible flexure for supporting the magnetic head slider 71 at one end, 72 is a load beam for supporting and fixing the flexure 70, and 73 is a base plate fixed to the base of the load beam 72. Respectively. The base of the load beam 72 may be configured as a flexure without providing a flexure separately.
[0037]
In this embodiment, the flexure 70 is made of a stainless steel plate (for example, SUS304TA) having a thickness of about 25 μm. On the flexure 70, four lead patterns 74a to 74d by thin film patterns are formed over almost the entire length as input / output signal lines. One end of each of the lead patterns 74a to 74d is connected to four connection terminals (not shown) by a thin film pattern directly connected to the magnetic head slider 71, and the other end is connected by a thin film pattern for connection to an external circuit. The terminals 75a to 75d are connected.
[0038]
The thin film pattern is formed by a known patterning method in which a printed board is laminated on a metal thin plate. That is, as is apparent from FIG. 8, a polyimide layer (lower insulating layer) 76 having a thickness of about 5 μm, patterned copper layers (lead patterns) 74a to 74d having a thickness of about 4 μm, and a polyimide layer having a thickness of about 5 μm. (Upper insulating layer) 77 is previously laminated in this order and bonded to flexure 70. However, in the connection terminals (75a to 75d), a nickel layer and a gold layer are laminated on the copper layer, and no upper insulating layer is formed thereon. In FIG. 7, the lead patterns 74a to 74d are represented by solid lines for easy understanding.
[0039]
The load beam 72 is made of a stainless steel plate having a thickness of about 62 to 76 μm, and fixes and supports the flexure 70 at several places. This fixation between the flexure 70 and the load beam 72 is performed at a plurality of welding points by laser welding or the like.
[0040]
The base plate 73 is made of stainless steel or iron, and is fixed to the base of the load beam 72 at a plurality of welding points as described above.
[0041]
The most important configuration in the present embodiment is that a plurality of concave portions (blind holes) 78 are formed in the flexure 70 by, for example, half etching. That is, a plurality of recesses 78 are provided in portions of the flexure 70 located below the lead patterns 74a to 74d, and the distance between the electrodes of the capacitor by the lead pattern and the flexure which is the electrode facing the lead pattern is increased. Capacity C _G Is decreasing. In addition, since the mass of the suspension itself can be reduced by providing the recesses in the flexure, the mechanical resonance characteristics and dynamic vibration characteristics of the entire suspension can be greatly improved.
[0042]
In the present embodiment, the shape of the recess 78 is an ellipse. However, the shape may be a rectangle, another polygon, or any other shape. . Moreover, the shape of each recessed part may mutually be the same, and may differ. The size of the recess 78 is not limited to that shown in the figure, and may be different from each other. However, the concave portion 78 is formed so as to ensure the spring property necessary for the magnetic head slider 71 to move freely so as to satisfy the basic function as a flexure, and is formed at a position other than the welding point with the load beam 72. To do. A recess 78 is formed in a portion unnecessary for securing the basic function of the flexure 70, but the parasitic capacitance C _G It is desirable to reduce significantly.
[0043]
By forming the plurality of recesses 78 in this way, the lower insulating layer 76, the lead patterns 74a to 74d, and the upper insulating layer 77 laminated on the flexure 70 have a structure in which the recesses are bridged. In order to maintain it, it is preferable to increase the thickness of the insulating layers 76 and 77 within an allowable range and increase the thickness and width of the lead patterns 74a to 74d.
[0044]
9 is a plan view showing another reference example of the HGA related to the present invention, and FIG. 10 is a cross-sectional view taken along the line DD of FIG.
[0045]
In these figures, 90 is a flexible flexure for supporting the magnetic head slider 91 at one end, 92 is a load beam for supporting and fixing the flexure 90, and 93 is a base plate fixed to the base of the load beam 92. Respectively. The base of the load beam 92 may be configured as a flexure without providing a flexure separately.
[0046]
In this reference example, the flexure 90 is constituted by a stainless steel mesh plate having a thickness of about 25 μm. On the flexure 90, four lead patterns 94a to 94d by thin film patterns are formed over almost the entire length as input / output signal lines. One end of each of the lead patterns 94a to 94d is connected to four connection terminals (not shown) by a thin film pattern directly connected to the magnetic head slider 91, and the other end is connected by a thin film pattern for connection to an external circuit. The terminals 95a to 95d are connected.
[0047]
The thin film pattern is formed by a known patterning method in which a printed board is laminated on a metal thin plate. That is, as is apparent from FIG. 10, a polyimide layer (lower insulating layer) 96 having a thickness of about 5 μm, patterned copper layers (lead patterns) 94a to 94d having a thickness of about 4 μm, and a polyimide layer having a thickness of about 5 μm. The (upper insulating layer) 97 is laminated on the flexure 90 in this order, or a pre-laminated layer is laminated on the flexure 90. However, in the connection terminals (95a to 95d), a nickel layer and a gold layer are laminated on the copper layer, and no upper insulating layer is formed thereon. In FIG. 9, the lead patterns 94a to 94d are shown by solid lines for easy understanding.
[0048]
The load beam 92 is made of a stainless steel plate having a thickness of about 62 to 76 μm, and fixes and supports the flexure 90 at several places. This fixation between the flexure 90 and the load beam 92 is performed at a plurality of welding points by laser welding or the like.
[0049]
The base plate 93 is made of stainless steel or iron, and is fixed to the base of the load beam 92 at a plurality of welding points as described above.
[0050]
In the present reference example, the most important configuration is that a portion 90b of the flexure 90 excluding the end 90a carrying the magnetic head slider 91 is a plane as shown in FIG. 11 partially showing the flexure plane excluding the lead pattern. The point is that it has a mesh structure. Thereby, the parasitic capacitance C by the capacitor formed by the lead pattern and the flexure is reduced by substantially reducing the area of the flexure that is the electrode facing the lead pattern. _G Is decreasing. Moreover, since the mass of the suspension itself can be reduced by making the flexure have a mesh structure, the mechanical resonance characteristics and dynamic vibration characteristics of the entire suspension can be greatly improved.
[0051]
The mesh structure described above is a structure that can ensure the spring property necessary for the magnetic head slider 91 to freely move so as to satisfy the basic function as a flexure.
[0052]
FIG. 12 is a perspective view schematically showing a configuration of a main part of an example of a hard disk device provided with the HGA of the present invention.
[0053]
In the figure, reference numeral 120 denotes a plurality of magnetic disk media rotating around an axis 121, and 122 denotes an assembly carriage device for positioning the magnetic head slider on the track. The assembly carriage device 122 mainly includes a carriage 124 that can rotate around a shaft 123, and an actuator 125 that is configured to rotate the carriage 124, such as a voice coil motor (VCM).
[0054]
The carriage 124 is attached with a base portion of a plurality of drive arms 126 stacked in the direction of the shaft 123, and an HGA 127 is fixed to the front end portion of each drive arm 126. Each HGA 127 is provided at the tip of the drive arm 126 so that the magnetic head slider 128 provided at the tip of the HGA 127 faces the surface of each magnetic disk medium 120.
[0055]
In this example, only each drive arm 126 or the carriage 124 including each drive arm 126 is formed of a non-conductive material such as plastic or ceramic. As a modification of this embodiment, the drive arm 126 may be made of metal, and the bearing portion of the shaft 123 of the carriage 124 may be formed of a nonconductive material such as plastic or ceramic. As a result, the HGA 127 is electrically insulated from the housing ground of the hard disk device.
[0056]
FIG. 13 shows an equivalent circuit of the lead pattern portion in this example. In the figure, parasitic capacitance C _G Is C _G ≒ 40pF, minimal parasitic capacitance C of lead pattern caused by HGA insulation _V Is C _V If it is ≈5 pF, the combined parasitic capacitance C _G ´ is
C _G '= C _G C _V / (C _G + C _V )
≒ 40 × 5 / (40 + 5)
≒ 4.4pF
It becomes. As described above, since the HGA floats from the housing ground, a substantial parasitic capacitance C between the lead pattern and the ground is obtained. _G ′ Is greatly reduced.
[0057]
Thus, if the HGA is completely isolated from the ground in a direct current manner, troubles due to the generation of static electricity may occur. Therefore, in actuality, as shown in the equivalent circuit shown in FIG. A high resistance pure resistor RH is inserted between the body ground.
[0058]
FIG. 15 is a partial cross-sectional view schematically showing a part of the configuration of another example of a hard disk drive equipped with the HGA of the present invention.
[0059]
In the figure, 150 is a drive arm attached to the carriage, 151 is a base plate of HGA attached to the drive arm 150, 152 is a flexible flexure for carrying the magnetic head slider 153 at one end, 154 Shows the HGA load beams for supporting and fixing the flexure 152, respectively. The base of the load beam 154 is fixed to the base plate 151.
[0060]
The HGA base plate 151 is fixed to the drive arm 150 via a non-conductive member (or sheet) 155, whereby the HGA is electrically insulated from the housing ground of the hard disk device. . Since the HGA floats from the housing ground, the substantial parasitic capacitance C between the lead pattern and the ground _G ′ Is greatly reduced.
[0061]
Thus, if the HGA is completely isolated from the ground in a direct current manner, troubles due to the generation of static electricity may occur. Therefore, in actuality, as shown in the equivalent circuit shown in FIG. A high resistance pure resistor RH is inserted between the body ground.
[0062]
All the embodiments described above are illustrative of the present invention and are not intended to be limiting, and the present invention can be implemented in other various modifications and changes. Therefore, the scope of the present invention is defined only by the claims and their equivalents.
[0063]
【The invention's effect】
As described above in detail, according to the present invention, since the metal flexure and the load beam below the magnetic head lead pattern are partially removed, the opposing area between the metal suspension and the lead pattern can be reduced. And the parasitic capacitance between the metal suspension is reduced. As a result, since the parasitic capacitance between the lead pattern and the ground is reduced, the resonance point is shifted to the high frequency side, and high-speed data transfer for writing and reading is possible. Further, by removing a part of the suspension as described above, the mass of the suspension itself can be reduced, so that the mechanical resonance characteristics and dynamic vibration characteristics of the entire suspension can be greatly improved.
[0064]
Furthermore, according to the present invention, the metal flexure below the magnetic head lead pattern is provided with a recess for reducing the parasitic capacitance, so that the distance between the metal flexure and the lead pattern is increased and the facing area is reduced. This can reduce parasitic capacitance. As a result, since the parasitic capacitance between the lead pattern and the ground is reduced, the resonance point is shifted to the high frequency side, and high-speed data transfer for writing and reading is possible. Also, by providing the recesses in this way, the mass can be reduced without greatly reducing the strength of the suspension itself, so that the mechanical resonance characteristics and dynamic vibration characteristics of the entire suspension can be greatly improved.
[Brief description of the drawings]
FIG. 1 is an equivalent circuit on a write head side in a conventional HGA having a composite magnetic head.
FIG. 2 is an equivalent circuit on the read head side in a conventional HGA having a composite magnetic head.
FIG. 3 is a plan view showing a reference example of an HGA related to the present invention.
4 is a cross-sectional view taken along line AA in FIG.
FIG. 5 is a plan view showing an embodiment of the HGA of the present invention.
6 is a cross-sectional view taken along line BB in FIG.
FIG. 7 is a plan view showing another embodiment of the HGA of the present invention.
8 is a cross-sectional view taken along line CC in FIG.
FIG. 9 is a plan view showing another reference example of the HGA related to the present invention.
10 is a cross-sectional view taken along the line DD of FIG.
11 is a diagram showing a partial plane of the flexure excluding the lead pattern in the reference example of FIG. 9;
FIG. 12 is a perspective view schematically showing a configuration of a main part of an example of a hard disk device including the HGA of the present invention.
13 is an equivalent circuit of a suspension portion in the example of FIG.
FIG. 14 is an equivalent circuit of a suspension portion when a high resistance for preventing static electricity is connected in the example of FIG.
FIG. 15 is a partial cross-sectional view schematically showing a partial configuration in another example of a hard disk device including the HGA of the present invention.
[Explanation of symbols]
30, 50, 70, 90, 152 Flexure
31, 51, 71, 91, 128, 153 Magnetic head slider
32, 52, 72, 92, 154 Load beam
33, 53, 73, 93, 151 Base plate
34a to 34d, 54a to 54d, 74a to 74d, 94a to 94d Lead pattern
35a-35d, 55a-55d, 75a-75d, 95a-95d Connection terminal
36, 37, 56, 57, 76, 77, 96, 97 Insulating layer
38, 58, 59 Through hole
78 recess
120 Magnetic disk medium
121, 123 axes
122 Assembly carriage device
124 Carriage
125 Actuator
126, 150 Drive arm
127 HGA
155 Non-conductive member (or sheet)

Claims (2)

  A head gimbal assembly comprising a magnetic head slider, a metal suspension for supporting the magnetic head slider, and a magnetic head lead pattern formed on the suspension via an insulator, the magnetic head lead pattern comprising: A head gimbal assembly, wherein the lower metal suspension is provided with a recess for reducing parasitic capacitance. The suspension includes a metal load beam and a metal flexure mounted on the load beam and having the magnetic head lead pattern formed thereon, and the metal flexure below the magnetic head lead pattern. the head gimbal assembly according to claim 1, wherein a plurality of recesses are provided on the.

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