JP3641867B2 - Exposure apparatus and temperature control method for exposure apparatus - Google Patents

Exposure apparatus and temperature control method for exposure apparatus Download PDF

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JP3641867B2
JP3641867B2 JP04952796A JP4952796A JP3641867B2 JP 3641867 B2 JP3641867 B2 JP 3641867B2 JP 04952796 A JP04952796 A JP 04952796A JP 4952796 A JP4952796 A JP 4952796A JP 3641867 B2 JP3641867 B2 JP 3641867B2
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air
exposure apparatus
flow path
equipment
wafer stage
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JPH09219364A (en
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斉 清水
卓 笠島
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Sony Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature

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  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、露光装置及び露光装置の調温方法に関し、更に詳細には調温用空気の流過に伴うトラブルが発生しないように改良された露光装置及び露光装置の調温方法に関するものである。
【０００２】
【従来の技術】
半導体装置の製造では、ウエハ上に塗布したフォトレジストに所望のパターンを露光する工程が必ずと言って良いくらい実施されている。一般に露光工程では、予め作製したマスクを介して、そのマスクパターンを光線やＸ線でフォトレジスト上に転写する露光装置が使用されている。
露光装置を使って露光する際、露光装置の温度を所定の温度に維持していないと、焦点のずれ、倍率誤差等の露光不良が生じるので、通常、空調設備を設けて、所定の温度に調整された空気を露光装置に流入させ、それにより露光装置を調温している。
【０００３】
従来の露光装置、例えばマスクアライナーに設けられた調温設備は、図４に示すように、所定温度の空気を流出する空調設備（エアコンディショナ）（図示せず）と、空調設備から露光装置本体に空気を送入する入口ダクトと、入口ダクトから送入された空気をウエハステージのステージ移動装置及びマスク位置合わせ装置を含む駆動設備に流入、流過させ、次いで駆動設備を流過した空気をウエハステージ及びマスクを含む光学系設備に導入する空気流路とを備えている。
以上の構成の調温設備により、空調設備から所定温度の空気、例えば２２℃の空気を露光装置本体に送入して、露光装置の温度を所定温度に維持していた。
【０００４】
【発明が解決しようとする課題】
しかし、上述した調温設備を備えた露光装置には、以下に挙げるような問題があった。
第１には、露光装置本体内部の設備内でダストが浮遊し、ウエハ及びマスクに付着して、解像不良が発生したり、或いは露光工程の後の工程で不良品が発生すると言う問題があった。第２には、従来の調温設備は調温安定性が欠けるために、光学系設備の動作、性能が不安定になり、フォーカス面がずれて解像不良が生じたり、倍率誤差が発生すると言う問題があった。例えば、露光装置本体の内部温度が１℃上下すると、フォーカス面が２〜３μm ずれ、倍率誤差も０．２〜０．５μm になる。これでは、所定性能の半導体装置を製造することはできない。第３には、露光装置の動作時に、調温用空気の吹き出し口が塞がれると言う問題があった。
【０００５】
そこで、本発明の目的は、ダストがウエハ、マスク等に付着しないように改良され、かつ温度安定性の高い調温設備を備えた露光装置を提供することであり、またそのような露光装置の調温方法を提供することである。
【０００６】
【課題を解決するための手段】
本発明者は、上に挙げた問題の発生原因を研究した結果、以下のようにその原因を突き止め、その対策を見い出した。
先ず、第１の問題の発生原因は、従来の調温設備では、調温用空気がステージ駆動用モータ、歯車等の可動部品を多数有する駆動設備を通って光学系設備に流入しているために、調温用空気は、可動部品から発生するダストを伴って光学系設備に流入し、そこでダストを浮遊させることにある。
そこで、調温用の清浄な空気を先ず光学系設備に流入、流過させ、次いで、光学系設備を流過した空気を駆動設備に流入、流過させることにより、また、調温用の清浄な空気を光学系設備と駆動設備とに分流し、それぞれ別個に流過させることにより、駆動設備で発生するダストを光学系設備に入れないようにする。
【０００７】
第２の問題の発生原因は、光学系設備の光源、例えば水銀ランプから放熱される熱が、光学系設備に留まり局部的に温度を上昇させることにある。そこで、露光装置内部の滞留する空気を強制的に吸引排気する排気設備を設けることにより、熱の局部的停滞を防止する。また、排気設備を設けることにより、露光装置内部に滞留するダストを排出することもできる。
第３の問題は、第１の問題解決の対策を講じ、かつ調温用空気の経路が露光装置の動作中でも遮られないようにすることにより、解決できる。
【０００８】
上記目的を達成するために、以上の知見に基づき、本発明に係る露光装置（以下、第１発明と言う）は、所定温度の空気を露光装置本体に送入する空調設備と、
空調設備から送入された空気をウエハステージ及びマスクを含む光学系設備に導入し、次いでウエハステージ移動装置及びマスク位置合わせ装置を含む駆動設備に流入させる空気流路と、
空気流路の出口から空気を吸引排気する排気設備と
を備えることを特徴としている。
【０００９】
本発明では、露光装置本体の形式は、特に制約はなく、本発明はコンタクト露光装置、プロキシミティ露光装置、等倍投影露光装置、縮小投影露光装置等に適用できる。
本発明で使用する排気設備は、吸引排気タイプの既知の排気設備である。
【００１０】
上記目的を達成するために、更に好ましくは、本発明に係る露光装置（以下、第２発明と言う）は、所定温度の空気を露光装置本体に送入する空調設備と、
空調設備から送入された空気を複数個の空気流路に分流する分岐部と、
各空気流路の出口から空気を吸引排気する排気設備と
を備えることを特徴とする露光装置。
【００１１】
本発明の実施態様は、前記空気流路が、分岐部からウエハステージ及びマスクを含む光学系設備を経て出口に到る経路と、
分岐部からウエハステージ移動装置及びマスク位置合わせ装置を含む駆動設備を経て出口に到る経路と
を備えている。
更には、光学系設備を流れる流路を水銀ランプ等の光源を流れる流路と光源以外のウエハステージ及びマスクを含む光学系設備を流れる流路とに分け、分岐部からウエハステージ移動装置及びマスク位置合わせ装置を含む駆動設備を経て出口に到る経路に加えて、分岐部から光源を経て出口に到る経路と、分岐部からウエハステージ及びマスクを含む光学系設備を経て出口に到る経路とを備えても良い。
【００１２】
また、露光装置の本発明に係る調温方法は、露光装置の調温方法において、
空調設備から送入された空気を、少なくともウエハステージ及びマスクを含む光学系設備に向かう流路と、ウエハステージのステージ移動装置及びマスク位置合わせ装置を含む駆動設備に向かう流路と、光源を含む発熱源設備に向かう流路とに分流し、それぞれの設備を流過させた後に、排気設備により吸引排気することを特徴としている。
【００１３】
【発明の実施の形態】
以下に、添付図面を参照し、実施例を挙げて本発明の実施の形態を具体的かつ詳細に説明する。
実施例１
本実施例は、第１発明の実施例であって、図１は本実施例の調温用空気の流れを示すフローチャートである。
本実施例の露光装置に設けられた調温設備は、図１に示すように、エアコンディショナ１２、ウエハステージ及びマスクを含む光学系設備に入り、そこを経てウエハステージ移動装置及びマスク位置合わせ装置を含む駆動設備に入り、更に出口に到る調温用空気流路１４、及び排気設備１６を備えている。
更に、調温設備は、エアコンディショナ１２と空気流路１４の入口とを接続し、かつ除塵用フィルタ（図示せず）を空気流路１４との接続口に有する入口ダクト１８と、気流路１４の出口と排気設備１６とを接続する出口ダクト２０とを備えている。
【００１４】
エアコンディショナ１２から送出された所定温度の調温用空気、例えば２２℃の調温用空気は、入口ダクト１８及びフィルタを通って空気流路１４の入口に入り、光学系設備、次いで駆動設備を流過して空気流路１４の出口から出口ダクト２０を経て排気設備１６により外部に排出される。
【００１５】
以上の構成により、光学系設備は清浄な調温用空気により温度調節されるので、従来の露光装置のようにウエハ及びマスクへのダスト付着による露光不良が発生しない。また、排気設備１６によって露光装置内の空気が強制排気されるので、従来の露光装置のように水銀ランプ等の光源より放熱された熱が露光装置内部に停滞するようなことは生じない。よって、温度安定性が向上する。
【００１６】
実施例２
本実施例は、第２発明の実施例であって、図２は本実施例の調温用空気の流れを示すフローチャート、及び図３は本実施例の露光装置の斜視図である。
本実施例の露光装置３０は、図２及び図３に示すように、エアコンディショナ３２、ウエハステージ及びマスクを含む光学系設備に調温用空気を流す第１空気流路３４、ウエハステージ移動装置及びマスク位置合わせ装置を含む駆動設備に調温用空気を流す第２空気流路３６、及び排気設備３８を備え、更にフィルタ４０（図３参照）を介して清浄な空気をエアコンディショナ１２から送出する入口ダクト４２と、入口ダクト４２から第１及び第２空気流路３４、３６に調温用空気を分流する分岐部４４と、第１空気流路３４、３６の出口と排気設備１６とを接続する出口ダクト４６とを備えている。
【００１７】
エアコンディショナ３２から送出された所定温度の調温用空気、例えば２２℃の調温用空気は、フィルタ４０及び入口ダクト４２を通って分岐部４４で第１及び第２空気流路３４、３６に分流する。分流した調温用空気は、それぞれ第１及び第２空気流路３４、３６を流過し、出口ダクト４６を経て排気設備３８により外部に排出される。
【００１８】
以上の構成により、光学系設備は、駆動設備とは別個に、清浄な調温用空気により温度調節されるので、従来の露光装置のようにウエハ及びマスクへのダスト付着による露光不良が発生しない。また、排気設備３８によって露光装置内の空気が強制排気されるので、従来の露光装置のように水銀ランプ等の光源より放熱された熱が露光装置内部に停滞するようなことは生じない。よって、温度安定性が向上する。
【００１９】
実施例１及び実施例２の構成を備える露光装置では、２２℃の調温用空気を導入して、露光装置内部温度を２２±０．５℃に維持できる調温安定度を達成できた。一方、従来の露光装置での調温安定度は、２２±２℃で、実施例２の露光装置に比べて遙に調温安定度が劣っていた。
【００２０】
【発明の効果】
本発明によれば、所定温度の空気を露光装置本体に送入する空調設備と、空調設備から送入された空気をウエハステージ及びマスクを含む光学系設備に導入し、次いでウエハステージ移動装置及びマスク位置合わせ装置を含む駆動設備に流入させる空気流路と、空気流路の出口から空気を吸引排気する排気設備とを備えることにより、ウエハ及びマスクにダストが付着するようなことがなく、調温安定性及び光学系安定性が良好な露光装置を実現している。
本発明に係る露光装置を使用することにより、露光工程の生産性が向上し、製品歩留りが向上する。
【図面の簡単な説明】
【図１】本発明に係る露光装置の実施例１の調温用空気の流れを示すフローチャートである。
【図２】本発明に係る露光装置の実施例２の調温用空気の流れを示すフローチャートである。
【図３】本発明に係る露光装置の実施例２の斜視図である。
【図４】従来の露光装置の斜視図である。
【符号の説明】
１２……エアコンディショナ、１４……調温用空気流路、１６……排気設備、１８……入口ダクト、２０……出口ダクト、３０……実施例２の露光装置、３２……エアコンディショナ、３４……第１空気流路、３６……第２空気流路、３８……排気設備、４０……フィルタ、４２……入口ダクト、４４……出口ダクト。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an exposure apparatus and a temperature control method for the exposure apparatus, and more particularly, to an exposure apparatus improved and a temperature control method for the exposure apparatus so as not to cause troubles due to the flow of temperature control air. .
[0002]
[Prior art]
In the manufacture of a semiconductor device, a process of exposing a desired pattern to a photoresist applied on a wafer is performed to the extent that it can be said that it is necessarily performed. In general, in an exposure process, an exposure apparatus is used that transfers a mask pattern onto a photoresist with light rays or X-rays through a mask prepared in advance.
When performing exposure using an exposure apparatus, if the exposure apparatus temperature is not maintained at a predetermined temperature, exposure failure such as defocusing and magnification error will occur. The adjusted air is introduced into the exposure apparatus, thereby adjusting the temperature of the exposure apparatus.
[0003]
As shown in FIG. 4, a conventional exposure apparatus, for example, a temperature adjustment facility provided in a mask aligner, includes an air conditioner (air conditioner) (not shown) for flowing out air at a predetermined temperature, and an exposure apparatus from the air conditioner. The inlet duct that feeds air into the main body, and the air that is fed from the inlet duct flows into the driving equipment including the stage moving device and the mask alignment device of the wafer stage, and then flows through the driving equipment. And an air flow path for introducing into an optical system facility including a wafer stage and a mask.
With the temperature control equipment configured as described above, air at a predetermined temperature, for example, air at 22 ° C., is sent from the air conditioning equipment to the exposure apparatus main body, and the temperature of the exposure apparatus is maintained at the predetermined temperature.
[0004]
[Problems to be solved by the invention]
However, the exposure apparatus provided with the temperature control equipment described above has the following problems.
First, there is a problem that dust floats in the equipment inside the exposure apparatus main body and adheres to the wafer and the mask, resulting in poor resolution or defective products in the process after the exposure process. there were. Secondly, since the conventional temperature control equipment lacks temperature control stability, the operation and performance of the optical system equipment become unstable, the focus surface shifts and a resolution failure occurs, or a magnification error occurs. There was a problem to say. For example, when the internal temperature of the exposure apparatus main body rises and falls by 1 ° C., the focus surface shifts by 2 to 3 μm, and the magnification error also becomes 0.2 to 0.5 μm. Thus, a semiconductor device having a predetermined performance cannot be manufactured. Third, there is a problem that the temperature control air outlet is blocked during operation of the exposure apparatus.
[0005]
Accordingly, an object of the present invention is to provide an exposure apparatus that is improved so that dust does not adhere to a wafer, a mask, etc., and that has a temperature control facility with high temperature stability. It is to provide a temperature control method.
[0006]
[Means for Solving the Problems]
As a result of studying the cause of occurrence of the above-mentioned problems, the present inventor found the cause as follows and found a countermeasure.
First, the cause of the first problem is that in conventional temperature control equipment, temperature control air flows into the optical system equipment through the drive equipment having many movable parts such as a stage drive motor and gears. In addition, the temperature adjusting air flows into the optical system equipment with dust generated from the movable parts, and the dust is caused to float there.
Therefore, clean air for temperature adjustment first flows into and flows through the optical system equipment, and then the air that has flowed through the optical system equipment flows into and through the drive equipment, and also clean air for temperature control. New air is diverted to the optical system equipment and the drive equipment, and each is separately passed to prevent dust generated in the drive equipment from entering the optical system equipment.
[0007]
The cause of the second problem is that the heat radiated from the light source of the optical system equipment, for example, a mercury lamp, stays in the optical system equipment and locally raises the temperature. Therefore, local stagnation of heat is prevented by providing an exhaust facility for forcibly sucking and exhausting the air staying in the exposure apparatus. Further, by providing an exhaust system, dust staying inside the exposure apparatus can be discharged.
The third problem can be solved by taking measures to solve the first problem and preventing the temperature control air path from being blocked even during the operation of the exposure apparatus.
[0008]
In order to achieve the above object, based on the above knowledge, an exposure apparatus according to the present invention (hereinafter referred to as a first invention) includes an air conditioning facility for sending air at a predetermined temperature into the exposure apparatus body,
An air flow path for introducing air sent from an air conditioning facility into an optical system facility including a wafer stage and a mask, and then flowing into a drive facility including a wafer stage moving device and a mask alignment device;
And an exhaust facility for sucking and exhausting air from the outlet of the air flow path.
[0009]
In the present invention, the type of the exposure apparatus main body is not particularly limited, and the present invention can be applied to a contact exposure apparatus, a proximity exposure apparatus, an equal magnification projection exposure apparatus, a reduced projection exposure apparatus, and the like.
The exhaust equipment used in the present invention is a known exhaust equipment of the suction exhaust type.
[0010]
In order to achieve the above object, more preferably, an exposure apparatus according to the present invention (hereinafter referred to as a second invention) includes an air conditioning facility for sending air at a predetermined temperature into the exposure apparatus main body,
A branching section that divides the air sent from the air conditioning equipment into a plurality of air flow paths;
An exposure apparatus comprising: an exhaust facility that sucks and exhausts air from an outlet of each air flow path.
[0011]
In an embodiment of the present invention, the air flow path is a path from the branch part to the exit through an optical system facility including a wafer stage and a mask,
And a path from the branching section to the exit through driving equipment including a wafer stage moving device and a mask alignment device.
Furthermore, the flow path flowing through the optical system facility is divided into a flow path flowing through a light source such as a mercury lamp and a flow path flowing through an optical system facility including a wafer stage and a mask other than the light source. In addition to the path to the exit through the drive equipment including the alignment device, the path from the branch section to the exit through the light source, and the path from the branch section to the exit through the optical system equipment including the wafer stage and mask And may be provided.
[0012]
Further, the temperature control method according to the present invention of the exposure apparatus is a temperature control method of the exposure apparatus,
The air sent from the air conditioning equipment includes at least a flow path toward the optical system equipment including the wafer stage and the mask, a flow path toward the drive equipment including the stage moving device and the mask alignment device of the wafer stage, and a light source. It is characterized in that it is divided into a flow path toward the heat source equipment, and after each equipment is passed through, it is sucked and exhausted by the exhaust equipment.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below specifically and in detail with reference to the accompanying drawings.
Example 1
This embodiment is an embodiment of the first invention, and FIG. 1 is a flow chart showing the flow of temperature control air in this embodiment.
As shown in FIG. 1, the temperature control equipment provided in the exposure apparatus of this embodiment enters an optical system equipment including an air conditioner 12, a wafer stage, and a mask, through which the wafer stage moving device and mask alignment are performed. A temperature control air flow path 14 that enters the drive equipment including the apparatus and reaches the outlet, and an exhaust equipment 16 are provided.
Furthermore, the temperature control equipment includes an inlet duct 18 that connects the air conditioner 12 and the inlet of the air flow path 14, and has a dust filter (not shown) at the connection port with the air flow path 14, and an air flow path. 14 and an outlet duct 20 for connecting the exhaust facility 16 to the outlet.
[0014]
Temperature control air having a predetermined temperature, for example, temperature control air of 22 ° C. sent from the air conditioner 12 enters the inlet of the air flow path 14 through the inlet duct 18 and the filter, and the optical system equipment and then the drive equipment And is discharged from the outlet of the air flow path 14 to the outside through the outlet duct 20 and the exhaust facility 16.
[0015]
With the above configuration, the temperature of the optical system equipment is adjusted by clean temperature control air, so that exposure failure due to dust adhesion to the wafer and mask does not occur unlike the conventional exposure apparatus. Further, since the air inside the exposure apparatus is forcibly exhausted by the exhaust facility 16, the heat radiated from the light source such as a mercury lamp does not stagnate inside the exposure apparatus as in the conventional exposure apparatus. Therefore, temperature stability is improved.
[0016]
Example 2
This embodiment is an embodiment of the second invention, FIG. 2 is a flowchart showing the flow of temperature adjusting air of this embodiment, and FIG. 3 is a perspective view of the exposure apparatus of this embodiment.
As shown in FIGS. 2 and 3, the exposure apparatus 30 of the present embodiment includes an air conditioner 32, a first air flow path 34 for flowing temperature adjustment air to an optical system facility including a wafer stage and a mask, and wafer stage movement. The air conditioner 12 is provided with a second air flow path 36 for flowing temperature-controlling air to the drive equipment including the apparatus and the mask alignment device, and an exhaust equipment 38, and further, clean air is passed through the filter 40 (see FIG. 3). From the inlet duct 42, the branch portion 44 for diverting the temperature adjusting air from the inlet duct 42 to the first and second air flow paths 34, 36, the outlets of the first air flow paths 34, 36, and the exhaust system 16. And an outlet duct 46 for connecting the two.
[0017]
The temperature adjusting air having a predetermined temperature sent from the air conditioner 32, for example, the air for adjusting the temperature of 22 ° C., passes through the filter 40 and the inlet duct 42 at the branch portion 44, and the first and second air flow paths 34, 36. Divide into The divided temperature control air flows through the first and second air flow paths 34 and 36, respectively, and is discharged to the outside by the exhaust facility 38 through the outlet duct 46.
[0018]
With the above configuration, the temperature of the optical system equipment is adjusted by clean temperature control air separately from the drive equipment, so that exposure defects due to dust adhesion to the wafer and mask do not occur unlike conventional exposure apparatuses. . Further, since the air in the exposure apparatus is forcibly exhausted by the exhaust facility 38, the heat radiated from the light source such as a mercury lamp does not stagnate inside the exposure apparatus as in the conventional exposure apparatus. Therefore, temperature stability is improved.
[0019]
In the exposure apparatus having the configuration of Example 1 and Example 2, temperature control stability at which the internal temperature of the exposure apparatus can be maintained at 22 ± 0.5 ° C. can be achieved by introducing temperature control air of 22 ° C. On the other hand, the temperature control stability in the conventional exposure apparatus was 22 ± 2 ° C., which was far inferior to that of the exposure apparatus of Example 2.
[0020]
【The invention's effect】
According to the present invention, air conditioning equipment for sending air at a predetermined temperature to the exposure apparatus main body, and air fed from the air conditioning equipment are introduced into an optical system equipment including a wafer stage and a mask, and then a wafer stage moving device and By providing an air flow path for flowing into the drive equipment including the mask alignment device and an exhaust equipment for sucking and exhausting air from the outlet of the air flow path, dust and dirt are not attached to the wafer and the mask. An exposure apparatus having good temperature stability and optical system stability is realized.
By using the exposure apparatus according to the present invention, the productivity of the exposure process is improved and the product yield is improved.
[Brief description of the drawings]
FIG. 1 is a flowchart showing the flow of temperature adjustment air in Embodiment 1 of an exposure apparatus according to the present invention.
FIG. 2 is a flowchart showing the flow of temperature-adjusting air in Embodiment 2 of the exposure apparatus according to the present invention.
FIG. 3 is a perspective view of Embodiment 2 of an exposure apparatus according to the present invention.
FIG. 4 is a perspective view of a conventional exposure apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 12 ... Air conditioner, 14 ... Temperature control air flow path, 16 ... Exhaust equipment, 18 ... Inlet duct, 20 ... Outlet duct, 30 ... Exposure apparatus of Example 2, 32 ... Air conditioner Shona, 34 ... 1st air flow path, 36 ... 2nd air flow path, 38 ... Exhaust equipment, 40 ... Filter, 42 ... Inlet duct, 44 ... Outlet duct.

Claims (3)

所定温度の空気を露光装置本体に送入する空調設備と、空調設備から送入された空気をウエハステージ及びマスクを含む光学系設備に導入し、次いでウエハステージ移動装置及びマスク位置合わせ装置を含む駆動設備に流入させる空気流路と、空気流路の出口から空気を吸引排気する排気設備とを備えることを特徴とする露光装置。 Air conditioning equipment for sending air at a predetermined temperature into the exposure apparatus main body, and air sent from the air conditioning equipment is introduced into an optical system equipment including a wafer stage and a mask, and then includes a wafer stage moving device and a mask alignment device. An exposure apparatus comprising: an air flow path for flowing into a drive equipment; and an exhaust equipment for sucking and exhausting air from an outlet of the air flow path. 所定温度の空気を露光装置本体に送入する空調設備と、空調設備から送入された空気を複数個の空気流路に分流する分岐部と、各空気流路の出口から空気を吸引排気する排気設備とを備える露光装置において、
前記空気流路は、前記分岐部からウエハステージ及びマスクを含む光学系設備を経て出口に到る経路と、前記分岐部からウエハステージ移動装置及びマスク位置合わせ装置を含む駆動設備を経て出口に到る経路とを備えることを特徴とする露光装置。 Air conditioning equipment that feeds air at a predetermined temperature into the exposure apparatus main body, branch parts that divide the air sent from the air conditioning equipment into a plurality of air flow paths, and air is sucked and exhausted from the outlets of the air flow paths. In an exposure apparatus comprising an exhaust facility,
The air flow path passes from the branching section to an outlet through an optical system facility including a wafer stage and a mask, and from the branching section to a outlet through a driving facility including a wafer stage moving device and a mask alignment device. An exposure apparatus. 露光装置の調温方法において、空調設備から送入された空気を、少なくともウエハステージ及びマスクを含む光学系設備に向かう流路と、ウエハステージのステージ移動装置及びマスク位置合わせ装置を含む駆動設備に向かう流路と、光源を含む発熱源設備に向かう流路とに分流し、それぞれの設備を流過させた後に、排気設備により吸引排気することを特徴とする露光装置の調温方法。In a temperature control method for an exposure apparatus, air sent from an air conditioning facility is directed to a flow path toward an optical system facility including at least a wafer stage and a mask, and to a drive facility including a wafer stage stage moving device and a mask alignment device. A temperature control method for an exposure apparatus, characterized in that the flow is divided into a flow path toward the flow path and a flow path toward a heat generation source facility including a light source, and after the respective facilities are passed through, suction and exhaust are performed by an exhaust facility.
JP04952796A 1996-02-13 1996-02-13 Exposure apparatus and temperature control method for exposure apparatus Expired - Fee Related JP3641867B2 (en)

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