JP3620785B2 - Disc medium processing method and disc substrate holding jig - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of processing a magnetic disk medium used as a magnetic storage medium of a hard disk device or a disk medium such as a compact disk, and handling of a disk substrate and chucking to a processing machine or the like in each manufacturing process. The present invention relates to a holding jig to be used.
[0002]
[Prior art]
The information storage disk media mentioned above have been rapidly reduced in size and increased in storage capacity with the spread of personal computers. There are various substrate materials for this disk medium, such as plastic, aluminum, and glass, and the thickness of the substrate is 1 mm or less. Taking a magnetic disk medium as an example, in a disk medium manufacturing process, as is well known, a Ni-P underlayer is formed on a disk substrate by an electroless plating method, and is put into a processing process, and its surface is polished. After applying texture processing above, each layer of Cr intermediate layer, Co alloy magnetic layer, and amorphous carbon protective layer is continuously formed by sputtering, and after final polishing is finished to a smooth surface, fluorocarbon liquid lubrication Apply agent to complete. Furthermore, the completed disk medium is shipped as a product after undergoing an appearance inspection and a performance test of information writing / reading.
[0003]
In each of the above machining steps, inspection and testing steps, all the disks are handled one by one by robot operation, etc., chucked on the spindle shafts of various processing machines and test equipment, and the work is performed while rotating the disks. A single-wafer processing method is employed, and for transfer between processes, a plurality of disk substrates are conveyed one by one in a vertical orientation with the outer peripheral edge dropped into an arc-shaped groove of a transfer cassette. I am doing so.
[0004]
Next, FIGS. 7 and 8 show the structure of a chuck equipped on a disk substrate handling hand used in a conventional manufacturing process and a spindle shaft of various processing machines. 7 (a) and 7 (b), reference numeral 1 denotes a disk-shaped disk substrate having a hole 1a in the center, and the hand 2 has a pair of arms 2a for holding the outer peripheral edge of the disk substrate 1 from the left and right sides. The arm 2a is configured to open and close in the direction of the arrow by driving the motor 4 via the rack / pinion mechanism 3. Further, a V-shaped concave groove 2b is formed in the tip claw portion of the arm 2a so that the claw portion does not come into contact with the plate surface of the disc as much as possible when the disc substrate 1 is gripped.
[0005]
In FIG. 8, the chuck 5 comprises a chuck body 5a attached to the top of the spindle shaft and a pair of chuck claws 5b which are incorporated in the inside thereof and move in the radial direction. Is placed on the top surface of the chuck body 5a, and the chuck claw 5a fitted in the center hole 1a of the substrate is moved outward from the standby position and pressed against the inner periphery of the disk substrate 1 to chuck the chuck claw 5a and the chuck body. The disk substrate 1 is pressed between and held by 5a. Also in this chuck 5, consideration is given to forming a tapered surface at the tip of the chuck body 5a and the chuck claw 5b so as not to contact the plate surface of the disk substrate 1 as much as possible.
[0006]
As described above, conventionally, in each process of the manufacturing process, the disk substrate 1 is handled by gripping the outer peripheral edge of the disk substrate 1 with the hand 2 shown in FIG. The claw 5b of the chuck 5 shown in FIG. 8 is inserted and held in the hole 1a, and the outer peripheral edge of the disk substrate is dropped into the groove of the cassette when the cassette is transferred between processes.
[0007]
[Problems to be solved by the invention]
By the way, in the conventional disk medium processing method, as described above, the disk substrate is handled in each step and chucked to the processing machine by directly holding the disk substrate with a hand or a chuck. .
[0008]
On the other hand, as described above, as the storage density of information storage media increases, the diameter and thickness of the disk have been rapidly reduced, and the recording layer area formed on the surface of the disk has reached the edge of the disk. It has expanded to.
[0009]
For this reason, when the outer periphery of the disk substrate is directly gripped and handled by the hand as in the conventional method, the probability that the outer peripheral edge of the substrate is damaged or soiled due to contact with the hand increases. In addition, when chucking the disk substrate to the spindle shaft of the processing machine and inspection device in each process, the chuck of the processing machine and inspection device touches the inner peripheral edge of the disk each time. The probability of occurrence of dirt increases.
[0010]
The present invention has been made in view of the above points. The object of the present invention is to handle the disc substrate without touching the outer periphery of the disc substrate at all, and the chuck of the processing machine can directly handle the disc on the inner periphery of the disc. An object of the present invention is to provide an improved disk medium processing method and a disk substrate gripping jig so as to improve the quality and yield of the disk medium while avoiding touching the disk.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, according to the processing method of the present invention, a detachable gripping jig is mounted in the center hole of the disk substrate to be put into the disk medium manufacturing process, and in this state the disk is inserted via the jig. Substrate handling, transfer between processes, and chucking to processing machines and inspection / test equipment are performed, and the gripping jig is removed from the disk after processing in each process is completed. 1).
[0012]
According to this method, the holding jig is attached when the disk substrate is put into the machining process, and the disk is kept attached until each machining process and the inspection and test process of the completed disk medium are completed. Handling, transfer between processes, chucking to a processing machine, etc., there is no disc substrate that touches the disc in the middle of each process other than the gripping jig that was originally mounted. It can effectively prevent the occurrence of dirt.
[0013]
Further, according to the present invention, the disk substrate holding jig is configured as a ring-shaped bush, and a V-shaped peripheral groove that fits with the inner peripheral edge of the disk substrate is formed on the outer peripheral surface thereof, and the driving is performed. The bush is radially expanded and contracted by the means to be clamped and unclamped to the disk substrate (Claim 2). Specifically, the configuration can be realized in the following manner. it can.
[0014]
(1) A ring-shaped bush is composed of a plurality of arc-shaped segments divided in the circumferential direction and a drive spring interposed between the segments, and the bush is expanded in the radial direction by the spring force of the drive spring. , Contract (claim 3).
[0015]
(2) In the preceding paragraph (1), the drive spring is overcome by a bias spring made of a normal spring material that works in the direction of expanding each segment of the bush, and the bias spring is overcome by the shape recovery force by heating, and the segments are drawn. A bias type bi-directional element combined with a tension coil spring made of a shape memory alloy is mounted and clamped by attaching the bush to the center hole of the disk substrate by the spring force of the bias spring. The tension spring is heated, and the bush is contracted and unclamped by its shape recovery force.
[0016]
(3) In addition, the drive spring in the preceding item (1) is made of a shape memory alloy compression coil spring that pushes each segment of the bush with a shape recovery force by heating, and a shape memory alloy that draws the segment with a shape recovery force by heating. This is a differential two-way element combined with a tension coil spring. When a bush is mounted on a disk substrate, a compression coil spring made of shape memory alloy is heated and clamped by its shape recovery force. The tension spring of the shape memory alloy is heated, and the bush is contracted and unclamped by its shape recovery force.
[0017]
(4) Further, in the preceding paragraphs (3) and (4), each segment of the bush is provided with an electrode for passing an electric current to each coil spring made of shape memory alloy. Clamping and unclamping are performed (claim 6).
[0018]
(5) Further, in the gripping jig according to (1), in another aspect of the present invention, a shaft portion in which both ends protrude from the end face of the bush is combined with the inside of the ring-shaped bush, and the shaft portion is divided into a plurality of portions. It is integrally coupled to one of the segments, and the shaft is gripped by a hand to handle the disc, chuck it to the processing machine, and support the shaft protruding from both ends to transfer the cassette ( Claim 7).
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the illustrated examples.
[0020]
First, a disk medium processing method corresponding to claim 1 of the present invention will be described with reference to FIG. 1, taking a magnetic disk applied to a hard disk device as an example.
[0021]
That is, the magnetic disk is put into a processing step after forming a Ni-P underlayer by an electroless plating method on the surface of a disk-shaped disk substrate 1 made of a material such as aluminum, glass or plastic. Surface polishing, texture processing, magnetic layer formation by sputtering, polishing, and application of liquid lubricant layer by spin coating, etc. in order, followed by inspection, writing and reading of information in the test process The magnetic disk 1A that passed the test is shipped as a product.
[0022]
Here, when the disk substrate 1 is put into the machining process, a detachable bush 6 is attached to the center hole 1a of the disk substrate 1 as a separately prepared disk gripping jig. The disk substrate is handled, chucked to each processing machine, and transferred between processes while the is mounted. Then, after the processing, inspection, and testing of the disk are completed, the bush 6 is removed from the magnetic disk (product) 1A, the product is sent to shipment, and the bush 6 is again mounted on the disk substrate 1 to be put into the processing process. And shall be used repeatedly.
[0023]
Next, an embodiment of a disc holding jig (bush) corresponding to claims 2 to 4 of the present invention will be described with reference to FIGS. That is, the bush 6 is composed of a combination of an arc-shaped segment 6a divided into three in the circumferential direction and drive springs 6c and 6d that are interposed between the end faces of the segments 6a to expand and contract the bush in the radial direction. Thus, a V-shaped circumferential groove 6 b that fits with the inner peripheral edge of the disk substrate 1 is formed on the outer peripheral surface of each segment 6 a. Here, the drive springs 6c and 6d are arranged in parallel and both ends thereof are coupled to the end faces of the segments 6a, and one spring 6c is a bias spring (made of a normal spring material that works in the direction of expanding each segment 6a). The other spring 6d is a tension coil spring made of a shape memory alloy that overcomes the bias spring 6c by the shape recovery force by heating and pulls the segment 6a, and the springs 6c and 6d constitute a bias type two-way element. doing.
[0024]
Note that the shape memory alloy tension coil spring 6d is subjected to heat treatment in a contracted state to store the shape. In addition, the material and the wire diameter of the shape memory alloy are selected so that the spring force in a state where the shape is recovered by heating has a larger spring constant than that of the bias spring 6c.
[0025]
With such a configuration, at normal temperature, each segment 6a of the bush 6 is pushed outward by receiving the spring force of the bias spring 6c, and the state shown in FIGS. 2 (a) and 2 (b) is obtained. In this state, the tension coil spring 6d made of a shape memory alloy is easily extended (plastically deformed) only by a slight yield stress. On the other hand, when the tension coil spring 6d made of shape memory alloy is heated to the transformation temperature or higher from the above state, the shape of the spring 6d recovers, and the segment 6a is pulled by the shape recovery force at that time. As a result, the bush 6 is contracted in the radial direction as shown in FIGS.
[0026]
Therefore, when the bush 6 is contracted to the state shown in FIGS. 2C and 2D and inserted into the center hole 1a of the disk substrate 1 and then returned to room temperature, the bush 6 is pushed outward by the spring force of the bias spring 6c. As shown in FIG. 2B, the disc substrate 1 is clamped to the inner periphery. When the bush 6 is removed from the disk substrate 1, the shape memory alloy spring 6d is heated. As a result, the outer diameter of the bush 6 shrinks to the state shown in FIG. In addition, since this clamping and unclamping operation can be performed without applying external force to the bush, there is no risk of unnecessary force being applied to the disk, and the shape memory alloy recovers its shape by heating in a very short time, so the disk substrate is heated. There is no negative impact.
[0027]
Next, an embodiment corresponding to claims 5 and 6 of the present invention will be described with reference to FIGS. In this embodiment, a differential two-way element is configured using two coil springs made of a shape memory alloy as a drive spring for expanding and contracting the bush 6 in the radial direction. Between the end faces of the segments 6a of the bush 6 described in the above, the compression spring 6e made of a shape memory alloy that works in the direction of expanding the segments 6a of the bush 6 with the shape recovery force by heating, and the shape recovery force by heating. They are connected via a tension coil spring 6d (see FIG. 2) made of a shape memory alloy that works to pull the segment 6a. Here, in the compression coil spring 6e, the shape recovery force when heated is larger than the drag (yield stress) of the tension coil spring 6d in the cooled state, and the shape recovery force when the tension coil spring 6d is heated is cooled. The material and wire diameter of each coil spring are determined so as to be larger than the drag force of the compression coil spring 6e in the state. In the illustrated embodiment, energizing electrodes 6f and 6g are formed on the end surfaces of the segments 6a with the coil springs 6e and 6d interposed therebetween, and the electrode surfaces are exposed on the surface of the segments 6a.
[0028]
With this configuration, as shown in FIG. 3 (a), when the heating power source 7 is connected between the energizing electrodes 6f to energize the compression coil spring 6e of shape memory alloy, the spring 6e is heated by the Joule heat, and the shape The segment 6a is pushed and expanded in the direction of the arrow by the restoring force. Thus, the bush 6 can be mounted and clamped on the disk substrate 1 in the same manner as described in FIGS. 2 (a) and 2 (b). In addition, even if energization heating is stopped from this state and the compression coil spring 6e is returned to room temperature, the clamped state is maintained by the residual spring elasticity of the coil spring. On the other hand, when the heating power source 7 is connected to the energizing electrode 6g from the above state and the tensile coil spring 6d made of shape memory alloy is energized, the tensile coil spring 6d recovers its shape as shown in FIG. While the compression coil spring 6e is deformed in the direction of contraction by the force, the segment 6a is drawn. As a result, the outer diameter of the bush 6 can be reduced and removed from the disk substrate 1 in the same manner as described in FIGS. 2 (c) and 2 (d).
[0029]
Next, an application embodiment corresponding to claim 7 of the present invention is shown in FIGS. In this embodiment, the ring-shaped bush 6 described in each of the previous embodiments is combined with a shaft portion 6h whose both ends protrude vertically from the end face of the bush, and one of the segments 6a obtained by dividing the shaft portion 6h into three segments. The other structure is the same as that shown in FIG. 2 or 3.
[0030]
With this configuration, when the disk substrate is handled or chucked to a processing machine with the bush 6 mounted on the disk substrate 1 as shown in FIG. 4A, the shaft protruding from the bush 6 is used. By gripping the part 6h with a robot hand, handling can be performed with good operability.
[0031]
Next, after the bush 6 of each embodiment shown in FIGS. 2 and 4 is mounted on the disk substrate 1, the support state when the disk is transferred into the cassette between the steps described in FIG. Are shown in FIGS. That is, in FIG. 5, a horizontal support bar 8a is provided in the cassette 8 for transporting the disk, and ring-shaped bushes 6 (see FIG. 2) mounted on the disk substrate 1 as shown in the figure are attached to the support bar 8a one by one. The disk substrate 1 is transferred so that the outer peripheral edge of the disk substrate 1 does not touch the cassette container. In FIG. 6, a disk support step 8b is provided at the middle position of the cassette 8, and the bush 6 (see FIG. 4) having a shaft portion 6h as shown in the drawing is placed one by one in the vertical orientation. The shaft portion 6h of the bush 6 is supported by the support step portion 8b. Also in this example, the outer peripheral edge of the disk substrate 1 does not touch the cassette container.
[0032]
【The invention's effect】
As described above, according to the processing method and the disc gripping jig of the present invention, the following effects can be obtained.
[0033]
(1) First, a detachable gripping jig is attached to the center hole of the disk substrate to be input into the disk medium manufacturing process, and in this state, the disk substrate is handled, transferred between processes, and According to the processing method of chucking the processing machine and the inspection / test apparatus and removing the gripping jig from the disc after the processing in each step is completed, the gripping treatment is performed when the disc substrate is put into the processing step. Since the jig is mounted, the handling of the disk, transfer between processes, and chucking to the processing machine are performed with the jig attached until the process is completed and the inspection and testing process of the completed disk medium is completed. There is nothing on the board that directly touches the disk during each process other than the gripping jig that was originally mounted, which effectively prevents the disk from being scratched and soiled. As a result, the quality and yield of the disk medium can be improved.
[0034]
(2) Further, by forming the disc gripping jig with the bush as in claims 2 to 7, handling the disc medium by robot operation, chucking to a processing machine, inspection / test apparatus, or process It is possible to carry cassettes between them without touching the disk substrate at all. Moreover, by adopting a drive spring made of shape memory alloy as the drive means for clamping and unclamping the bush against the disk substrate, the bushing can be clamped and unclamped simply by energizing and heating the shape memory alloy coil spring. Can be done easily. In addition, since this clamping and unclamping operation can be performed without applying external force to the bush, there is no risk of unnecessary force being applied to the disk, and the shape memory alloy recovers its shape by heating in a very short time, so the disk substrate is heated. There is no negative impact.
[Brief description of the drawings]
FIG. 1 is a manufacturing process diagram showing a processing method of a disk medium according to the present invention. FIG. 2 shows an embodiment of a gripping jig according to the present invention. (C) and (d) are a plan view and a side cross-sectional view of a state where the bush is shrunk by rectifying the shape of the drive spring of the shape memory alloy and unclamped from the disk substrate, respectively. FIG. 3 is a block diagram of an embodiment of the present invention different from FIG. 2, in which (a) is a clamped state in which a bush segment is expanded by energizing and heating one shape memory alloy spring, and (b) is the other. FIG. 4 is a configuration diagram of a further different embodiment of the present invention, in which a segment is attracted by energizing a shape memory alloy spring of FIG. (B) is an exploded perspective view of a segment of a bush with a shaft portion. FIG. 5 is a view showing a state in which the disk substrate with the bush shown in FIG. FIG. 7 is a schematic diagram of a disk handling hand used in a conventional disk medium manufacturing process, wherein the disk substrate with the bush of FIG. 4 is housed in a cassette for transfer between processes. FIGS. 8A and 8B are a cross-sectional view and a plan view, respectively, showing a state in which a disk substrate is held by a hand. FIG. 8 is a view of a chuck for holding a disk mounted on a spindle shaft of a processing machine in a conventional disk medium manufacturing process. Schematic diagram [Explanation of symbols]
1 Disc substrate 1a Center hole 6 Bush (disc holding jig)
6a Segment 6b Circumferential groove 6c Bias spring 6d Tension coil spring 6e made of shape memory alloy Compression coil spring 6f, 6g made of shape memory alloy Energizing electrode 6h Shaft portion 7 Heating power supply 8 Cassette 8a Disc support rod 8b Disc support step

Claims (7)

A detachable gripping jig is attached to the center hole of the disk substrate to be introduced into the disk medium manufacturing process, and in this state, the disk substrate is handled, transferred between processes, and a processing machine, inspection / A method of processing a disk medium, wherein chucking is performed on a test apparatus, and a gripping jig is removed from the disk after processing in each step is completed. A V-shaped circumferential groove that fits with the inner peripheral edge of the disk substrate is formed on the outer peripheral surface, and is formed as a ring-shaped bush that is expanded and contracted in the radial direction to be clamped and unclamped to the disk substrate. A jig for holding a disc substrate. 3. A gripping jig according to claim 2, wherein the bush is a combination of a plurality of arc-shaped segments divided in the circumferential direction and a drive spring interposed between the segments to expand and contract the bush in the radial direction. A jig for holding a disk substrate, comprising: 4. The gripping jig according to claim 3, wherein the drive spring overcomes the bias spring by a shape spring force and a bias spring made of a normal spring material that works in the direction of expanding each segment of the bush. A disc substrate gripping jig comprising a combination with a tension coil spring made of a shape memory alloy that attracts the disk. 4. A gripping jig according to claim 3, wherein the drive spring is a compression coil spring made of a shape memory alloy that spreads each segment of the bush by a shape recovery force by heating, and a shape memory that draws each segment by the shape recovery force by heating. A disc substrate gripping jig comprising a combination with an alloy tension coil spring. 6. A holding jig for a disk substrate according to claim 4, wherein an electrode is provided in each segment of the bush to pass a current through a coil spring made of a shape memory alloy. 4. The gripping jig according to claim 3, wherein a shaft portion having both ends projecting from the end surface of the bush is combined with an inner side of the ring-shaped bush, and the shaft portion is integrally coupled to one of the divided segments. A disc substrate holding jig characterized by the above.

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