JP3608332B2 - PCB mounting structure - Google Patents

PCB mounting structure Download PDF

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Publication number
JP3608332B2
JP3608332B2 JP04827597A JP4827597A JP3608332B2 JP 3608332 B2 JP3608332 B2 JP 3608332B2 JP 04827597 A JP04827597 A JP 04827597A JP 4827597 A JP4827597 A JP 4827597A JP 3608332 B2 JP3608332 B2 JP 3608332B2
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JP
Japan
Prior art keywords
circuit board
printed circuit
mounting structure
radiating member
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP04827597A
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Japanese (ja)
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JPH10242672A (en
Inventor
悟志 寺本
洋史 小西
▲頼▼信 村山
晃弘 岸本
文俊 長崎
博司 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
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Publication date
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Priority to JP04827597A priority Critical patent/JP3608332B2/en
Publication of JPH10242672A publication Critical patent/JPH10242672A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品を搭載したプリント基板実装構造に関し、詳しくは、プリント基板の強度を高め、反りを抑制し、高域の輻射雑音の低減を図とうとするものである。
【０００２】
【従来の技術】
従来、電子部品を搭載した略扇形状のプリント基板は、図７に示すように、発熱部品３を取付けた放熱部材４を備えたものはあるが、放熱部材４はプリント基板２の補強をおこなうことができないものであった。
又、従来にあっては、商用電源入力部に商用電源入力側からノーマルモード・コモンモードフィルタ、低域フィルタの順に配置するものや、商用電源入力側から低域フィルタ、高域フィルタ、ノーマルモードフィルタの順に配置するものである。従来の構成では高域の輻射雑音の低減に限度があった。
【０００３】
【発明が解決しようとする課題】
従来、電子部品を搭載した略扇形状のプリント基板は、大形電子部品（例えば電源用のトランス、コンデンサなど）を搭載する場合に強度を確保するためにプリント基板を大きくしていたが、部品実装密度を下げるものとなっていた。従って、プリント基板の小形化を進めるには強度面での問題があった。
【０００４】
本発明はこのような問題を解消しようとするものであり、放熱部材を有効に利用しプリント基板の強度を高めると共に、半田付け時のプリント基板の反りを抑制し、又、高域の輻射雑音を低減するプリント基板実装構造を提供することを目的とする。
【０００５】
【課題を解決するための手段】
請求項１の発明においては、電子部品１を搭載した略扇形状のプリント基板２と、発熱部品３を取付けた放熱部材４を備えたプリント基板実装構造において、前記放熱部材４を略扇形状のプリント基板２の内側にまたがるように配置し、放熱部材の両端をプリント基板２に固定したことを特徴とするものである。
【０００６】
請求項２の発明においては、商用電源入力部に商用電源入口側から高域フィルタ５、低域フィルタ６、ノーマルモードフィルタ７の順に配置することを特徴とするものである。
【０００７】
【発明の実施の形態】
本発明の実施の形態を図面に基づいて詳述する。
〔実施例１〕
本実施例は、図１に示すように、電子部品１を搭載した略扇形状のプリント基板２と、発熱部品３を取付けた放熱部材４と、例えば、電源用のトランス２３、コンデンサ２２などの大形電子部品１Ａから構成される。
【０００８】
発熱部品３を取付けた放熱部材４は発熱部品３の熱に応じて適宜に大きさを替える。実施例では、アルミ板を使用しているが、鉄、銅板など放熱効果があり、かつ強度のあるものでも同等の効果が得られる。
プリント基板２と放熱部材４の固定はネジ８とナットで締め付ける。また、半田付けなどでも同等の効果が得られる。
【０００９】
以上から、放熱部材４によって、プリント基板２の補強を図ると共に、半田付け時のプリント基板２の反りを抑制することが可能となり、従来と同程度の強度では小形化が可能となる。
〔実施例２〕
本発明の実施例を図２に基づいて説明する。
【００１０】
本実施例は、電子部品１を搭載した略扇形状のプリント基板２と、発熱部品３を取付けた放熱部材４と、電源からの入力端子１３と、電源回路部１０と、インバータ回路部１１と、負荷への出力端子１２とから構成される。
電源回路部１０は商用電源から任意の電圧の直流電源に変換する機能をもち、ノイズフィルタ、整流回路、チョッパー回路、電源用コンデンサ２２、制御回路などから構成される。インバータ回路部１１は直流電源から任意の電圧、周波数の電源に変換する機能をもち、スイッチング素子、共振用インダクタンス２９、共振用コンデンサ２７、制御回路などから構成される。
【００１１】
略扇形状のプリント基板２の中心を境に、図２に示すように、一方に電源回路部１０、他方にインバータ回路部１１を配置する。又、略扇形状のプリント基板２の中心を境に、一方に入力端子１３、他方に出力端子１２を配置する。
又、他の実施例と反対の配置でも同等の効果が得られる。
以上から、電子部品１…の重量のバランスが良くなり、プリント基板の補強を図ると共に、半田付け時のプリント基板２の反りを抑制することが可能となり、従来と同程度の強度では小形化が可能になる。
【００１２】
〔実施例３〕
本発明の実施例を図３に基づいて説明する。
本実施例は、電子部品１を搭載した略扇形状のプリント基板２と、発熱部品を取付けた放熱部材４と、電源からの入力端子１３と、電源回路部１０と、スイッチング部１３と、予熱回路部１５と、インバータ共振回路部１６と、負荷への出力端子１３とから構成される。
【００１３】
電源回路部１０はノイズフィルタ、整流回路、制御回路などから構成される。スイッチング部１４はチョッパー電源用スイッチング素子、チョッパー電源用ダイオード、インバータ用スイッチング素子などから構成される。
予熱回路１５は予熱トランス３１、予熱共振用コンデンサ３０などから構成される。
【００１４】
インバータ共振回路部１６は共振用インダクタンス２９、共振用コンデンサ２７などから構成される。本発明の大きいスイッチング部１４と、インバータ共振回路部１６と、発熱の小さい電源回路部１０と、予熱回路部１５とを分離し、電源回路部１０、スイッチング部１４、予熱回路部１５、インバータ回路共振回路部１６と発熱の大きいものと小さいものを交互に設置する。このことで、電子部品１…の温度を均一化する。
【００１５】
また、実施例と反対の配置でも同等の効果が得られる。
以上から、電子部品１…の温度を均一化することが可能となり、各部品の信頼性が向上した。
〔実施例４〕
本発明の実施例を図４に基づいて説明する。
【００１６】
本実施例は、電子部品１を搭載した略扇形状のプリント基板１２と、発熱部品を取付けた放熱部材４と、電源からの入力端子１３と、電源回路部１０と、スイッチング部１４と、予熱回路部１５と、インバータ共振回路部１１と、負荷への出力端子１２と、電源用コンデンサグランド２６と、各部のメイン回路１７、制御回路１８から構成される。
【００１７】
電源用コンデンサグランド２６を中心として、各部のメイン回路１７、制御回路１８に放射状にグランドライン１９を接続する。
以上から、各回路１０、１４、１５、１１間の相互干渉を低減でき、各部品の信頼性が向上した。また、雑音が低減できた。
〔実施例５〕
本発明の実施例を図５に基づいて説明する。
【００１８】
本実施例は、電子部品１を搭載した略扇形状のプリント基板２と、発熱部品を取付けた放熱部材４と、電源からの入力端子１３と、インバータ点灯回路２１と、負荷への出力端子１２とランプソケット２０とから構成される。
インバータ点灯回路部２１は電源回路部１０、スイッチング部１４、予熱回路部１５、インバータ共振回路部１６などから構成される。
【００１９】
出力端子１２とランプソケット２０との配置をランプフィラメント部の熱影響を少なくし、ランプ始動性能の低下を招かないように、その距離Ｘを１ｃｍ以上５０ｃｍ以下とする。
また、実施例と反対の配置でも同等の効果が得られる。
以上から、以下の点が可能となった。
【００２０】
インバータ点灯回路部２１の配線の劣化防止ができる。配線を短くできることによりランプ始動電圧の低減を図ることができる。配線輻射雑音の低減等を図ることができる。
〔実施例６〕
本発明の実施例を図６に基づいて説明する。
【００２１】
本実施例は、雑音低減のための商用電源入力部に商用電源入力側から高域フィルタ５、低域フィルタ６、ノーマルモードフィルタ７の順に配置する。
以上から、以下の点が可能となった。
８０〜１００ＭＨｚ付近の高域の輻射雑音の低減がおこなえる。
【００２２】
【発明の効果】
請求項１の発明においては、電子部品を搭載した略扇形状のプリント基板と、発熱部品を取付けた放熱部材を備えたプリント基板実装構造において、前記放熱部材を略扇形状のプリント基板の内側にまたがるように配置し、その両端をプリント基板に固定したから、プリント基板の補強および、半田付け時のプリント基板の反りを抑制することができる。
【００２３】
請求項２の発明においては、電子部品を搭載したプリント基板において、商用電源入力部に商用電源入口側から高域フィルタ、低域フィルタ、ノーマルモードフィルタの順に配置するから、高域の輻射雑音を低減することができるという利点がある。
【図面の簡単な説明】
【図１】本発明の実施例１を示し、（ａ）は平面図、（ｂ）は放熱部材を示す平面図である。
【図２】実施例２の説明図である。
【図３】実施例３の説明図である。
【図４】実施例４の説明図である。
【図５】実施例５の説明図である。
【図６】実施例６の回路図である。
【図７】従来例の説明図である。
【符号の説明】
１ 電子部品
２ プリント基板
３ 発熱部品
４ 放熱部材
５ 高域フィルタ
６ 低域フィルタ
７ ノーマルモードフィルタ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed circuit board mounting structure on which an electronic component is mounted. Specifically, the present invention is intended to increase the strength of the printed circuit board, suppress warping, and reduce high-frequency radiation noise.
[0002]
[Prior art]
Conventionally, as shown in FIG. 7, a substantially fan-shaped printed circuit board on which electronic components are mounted includes a heat radiating member 4 to which a heat generating component 3 is attached. However, the heat radiating member 4 reinforces the printed circuit board 2. It was something that could not be done.
Also, in the past, normal mode / common mode filter and low-pass filter are arranged in the order from the commercial power input side to the commercial power input part, and low-pass filter, high-pass filter, normal mode from the commercial power input side. They are arranged in the order of filters. The conventional configuration has a limit in reducing high-frequency radiation noise.
[0003]
[Problems to be solved by the invention]
Conventionally, generally fan-shaped printed circuit boards equipped with electronic components have been enlarged to ensure strength when mounting large electronic components (for example, transformers and capacitors for power supplies). The packaging density was lowered. Accordingly, there has been a problem in strength in order to reduce the size of the printed circuit board.
[0004]
The present invention is intended to solve such a problem, and effectively uses a heat dissipating member to increase the strength of the printed circuit board, suppress warping of the printed circuit board during soldering, and radiate high-frequency noise. An object of the present invention is to provide a printed circuit board mounting structure that reduces the above-described problem.
[0005]
[Means for Solving the Problems]
In the invention of claim 1, in the printed circuit board mounting structure including the substantially fan-shaped printed circuit board 2 on which the electronic component 1 is mounted and the heat radiating member 4 to which the heat generating component 3 is attached, the heat radiating member 4 has a substantially fan-shaped structure. It is arranged so as to straddle the inside of the printed circuit board 2, and both ends of the heat dissipation member are fixed to the printed circuit board 2.
[0006]
The invention of claim 2 is characterized in that the high-pass filter 5, the low-pass filter 6, and the normal mode filter 7 are arranged in this order from the commercial power supply inlet side to the commercial power input unit.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described in detail with reference to the drawings.
[Example 1]
In the present embodiment, as shown in FIG. 1, a substantially fan-shaped printed circuit board 2 on which an electronic component 1 is mounted, a heat dissipation member 4 to which a heat generating component 3 is attached, a power transformer 23, a capacitor 22, and the like. It consists of a large electronic component 1A.
[0008]
The size of the heat radiating member 4 to which the heat generating component 3 is attached is appropriately changed according to the heat of the heat generating component 3. In the embodiment, an aluminum plate is used, but there is a heat dissipation effect such as iron or copper plate, and the same effect can be obtained even if it is strong.
The printed circuit board 2 and the heat dissipation member 4 are fixed with screws 8 and nuts. The same effect can be obtained by soldering.
[0009]
From the above, it is possible to reinforce the printed circuit board 2 by the heat radiating member 4 and to suppress warping of the printed circuit board 2 during soldering, and it is possible to reduce the size of the printed circuit board 2 with the same strength as the conventional one.
[Example 2]
An embodiment of the present invention will be described with reference to FIG.
[0010]
In this embodiment, a substantially fan-shaped printed circuit board 2 on which an electronic component 1 is mounted, a heat radiating member 4 to which a heat generating component 3 is attached, an input terminal 13 from a power source, a power circuit unit 10, an inverter circuit unit 11, And an output terminal 12 to the load.
The power supply circuit unit 10 has a function of converting a commercial power supply into a DC power supply having an arbitrary voltage, and includes a noise filter, a rectifier circuit, a chopper circuit, a power supply capacitor 22, a control circuit, and the like. The inverter circuit unit 11 has a function of converting a DC power source into a power source having an arbitrary voltage and frequency, and includes a switching element, a resonance inductance 29, a resonance capacitor 27, a control circuit, and the like.
[0011]
With the center of the substantially fan-shaped printed circuit board 2 as a boundary, as shown in FIG. 2, the power supply circuit unit 10 is arranged on one side and the inverter circuit unit 11 is arranged on the other side. Further, the input terminal 13 is arranged on one side and the output terminal 12 is arranged on the other side with the center of the substantially fan-shaped printed circuit board 2 as a boundary.
In addition, the same effect can be obtained even in an arrangement opposite to that of the other embodiments.
From the above, the weight balance of the electronic components 1 can be improved, the printed circuit board can be reinforced and the warping of the printed circuit board 2 during soldering can be suppressed, and the size can be reduced with the same strength as before. It becomes possible.
[0012]
Example 3
An embodiment of the present invention will be described with reference to FIG.
In this embodiment, a substantially fan-shaped printed circuit board 2 on which an electronic component 1 is mounted, a heat dissipating member 4 to which a heat generating component is attached, an input terminal 13 from a power source, a power circuit unit 10, a switching unit 13, a preheating The circuit unit 15, the inverter resonance circuit unit 16, and an output terminal 13 to the load are configured.
[0013]
The power supply circuit unit 10 includes a noise filter, a rectifier circuit, a control circuit, and the like. The switching unit 14 includes a chopper power switching element, a chopper power diode, an inverter switching element, and the like.
The preheating circuit 15 includes a preheating transformer 31, a preheating resonance capacitor 30, and the like.
[0014]
The inverter resonance circuit unit 16 includes a resonance inductance 29, a resonance capacitor 27, and the like. The large switching unit 14, the inverter resonance circuit unit 16, the power generation circuit unit 10 with low heat generation, and the preheating circuit unit 15 of the present invention are separated, and the power supply circuit unit 10, the switching unit 14, the preheating circuit unit 15, and the inverter circuit are separated. The resonance circuit unit 16 and the one with large heat generation and the one with small heat generation are alternately installed. This makes the temperature of the electronic components 1... Uniform.
[0015]
In addition, the same effect can be obtained even with an arrangement opposite to that of the embodiment.
As described above, the temperatures of the electronic components 1 can be made uniform, and the reliability of each component is improved.
Example 4
An embodiment of the present invention will be described with reference to FIG.
[0016]
In the present embodiment, a substantially fan-shaped printed circuit board 12 on which the electronic component 1 is mounted, a heat radiation member 4 to which a heat generating component is attached, an input terminal 13 from a power source, a power circuit unit 10, a switching unit 14, a preheating The circuit unit 15, the inverter resonance circuit unit 11, the output terminal 12 to the load, the power supply capacitor ground 26, the main circuit 17 and the control circuit 18 of each unit.
[0017]
A ground line 19 is connected radially to the main circuit 17 and the control circuit 18 in each part with the power supply capacitor ground 26 as the center.
From the above, mutual interference between the circuits 10, 14, 15, and 11 can be reduced, and the reliability of each component is improved. In addition, noise could be reduced.
Example 5
An embodiment of the present invention will be described with reference to FIG.
[0018]
In this embodiment, a substantially fan-shaped printed circuit board 2 on which an electronic component 1 is mounted, a heat radiating member 4 to which a heat generating component is attached, an input terminal 13 from a power source, an inverter lighting circuit 21, and an output terminal 12 to a load. And the lamp socket 20.
The inverter lighting circuit unit 21 includes a power supply circuit unit 10, a switching unit 14, a preheating circuit unit 15, an inverter resonance circuit unit 16, and the like.
[0019]
The distance X is set to 1 cm or more and 50 cm or less so that the arrangement of the output terminal 12 and the lamp socket 20 reduces the thermal influence of the lamp filament portion and does not cause deterioration of the lamp starting performance.
In addition, the same effect can be obtained even with an arrangement opposite to that of the embodiment.
From the above, the following points became possible.
[0020]
Deterioration of the wiring of the inverter lighting circuit unit 21 can be prevented. The lamp starting voltage can be reduced by shortening the wiring. Wiring radiation noise can be reduced.
Example 6
An embodiment of the present invention will be described with reference to FIG.
[0021]
In the present embodiment, the high-pass filter 5, the low-pass filter 6, and the normal mode filter 7 are arranged in this order from the commercial power input side to the commercial power input unit for noise reduction.
From the above, the following points became possible.
It is possible to reduce high-frequency radiation noise in the vicinity of 80 to 100 MHz.
[0022]
【The invention's effect】
In the invention of claim 1, in a printed circuit board mounting structure comprising a substantially fan-shaped printed circuit board on which electronic components are mounted and a heat radiating member to which a heat generating component is attached, the heat radiating member is placed inside the substantially fan-shaped printed circuit board. Since it arrange | positions so that it may straddle and the both ends were fixed to the printed circuit board, the reinforcement of a printed circuit board and the curvature of the printed circuit board at the time of soldering can be suppressed.
[0023]
In the invention of claim 2, in the printed circuit board on which the electronic component is mounted, since the high frequency filter, the low frequency filter, and the normal mode filter are arranged in this order from the commercial power supply inlet side to the commercial power input portion, There is an advantage that it can be reduced.
[Brief description of the drawings]
1A and 1B show a first embodiment of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a plan view showing a heat dissipation member;
FIG. 2 is an explanatory diagram of a second embodiment.
FIG. 3 is an explanatory diagram of a third embodiment.
4 is an explanatory diagram of Embodiment 4. FIG.
5 is an explanatory diagram of Embodiment 5. FIG.
6 is a circuit diagram of Embodiment 6. FIG.
FIG. 7 is an explanatory diagram of a conventional example.
[Explanation of symbols]
1 Electronic Component 2 Printed Circuit Board 3 Heating Component 4 Heat Dissipation Member 5 High-pass Filter 6 Low-pass Filter 7 Normal Mode Filter

Claims (2)

電子部品を搭載した略扇形状のプリント基板と、発熱部品を取付けた放熱部材を備えたプリント基板実装構造において、前記放熱部材を略扇形状のプリント基板の内側にまたがるように配置し、放熱部材の両端をプリント基板に固定したことを特徴とするプリント基板実装構造。In a printed circuit board mounting structure comprising a substantially fan-shaped printed circuit board on which electronic components are mounted and a heat radiating member to which a heat generating component is mounted, the heat radiating member is disposed so as to straddle the substantially fan-shaped printed circuit board, and a heat radiating member A printed circuit board mounting structure characterized by fixing both ends of the printed circuit board to the printed circuit board. 商用電源入力部に商用電源入口側から高域フィルタ、低域フィルタ、ノーマルモードフィルタの順に配置することを特徴とする請求項１記載のプリント基板実装構造。2. The printed circuit board mounting structure according to claim 1, wherein a high-pass filter, a low-pass filter, and a normal mode filter are arranged in this order from the commercial power supply inlet side to the commercial power input unit.
JP04827597A 1997-03-03 1997-03-03 PCB mounting structure Expired - Fee Related JP3608332B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04827597A JP3608332B2 (en) 1997-03-03 1997-03-03 PCB mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04827597A JP3608332B2 (en) 1997-03-03 1997-03-03 PCB mounting structure

Publications (2)

Publication Number Publication Date
JPH10242672A JPH10242672A (en) 1998-09-11
JP3608332B2 true JP3608332B2 (en) 2005-01-12

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Family Applications (1)

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JP04827597A Expired - Fee Related JP3608332B2 (en) 1997-03-03 1997-03-03 PCB mounting structure

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JP (1) JP3608332B2 (en)

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JPH10242672A (en) 1998-09-11

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