JP3564864B2 - Method of manufacturing inkjet head - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an ink jet head used in an ink jet recording apparatus, and more particularly to a method for forming a large number of ink jet heads on one substrate and then separating the heads into individual ink jet heads.
[0002]
[Prior art]
Ink jet printers have many advantages such as extremely low noise during recording, high-speed printing, and the ability to use inexpensive plain paper with high ink flexibility. Among them, the so-called ink-on-demand method, which discharges ink droplets only when recording is necessary, is currently the mainstream because it does not require collection of ink droplets unnecessary for recording.
[0003]
A conventional method of manufacturing an ink jet head is disclosed in, for example, Japanese Patent Publication No. 6-98772. In this manufacturing method, a plurality of head flow path walls and pressure generating elements are arranged and formed on one support, and a glass plate is bonded to form a plurality of heads, and then cut and separated by a dicing method. Then, the individual ink jet heads were completed.
[0004]
[Problems to be solved by the invention]
By the way, as disclosed in Japanese Patent Publication No. 6-98772, a method of simply forming an ink flow path and a pressure generating element on a support, joining a flat plate thereon, and then separating and cutting the individual heads. Then, it is very difficult to connect the pressure generating element to an external drive circuit.
[0005]
For example, it is conceivable to form a terminal in a small area exposed between the support and the flat plate, and connect an external drive circuit to the terminal. It cannot be expected that a good conduction will be obtained.
[0006]
Further, a method of providing a through hole in a support or a flat plate to connect the external drive circuit to the pressure generating element is also conceivable. However, the manufacturing process becomes complicated, and ink is not leaked from these holes. Ingenuity is required, and the material of the substrate must be selected to be suitable for such processing. In any case, the original advantage of manufacturing a large number of ink jet heads from one bonded substrate simply and inexpensively is impaired.
[0007]
The present invention has been made to solve such a problem, and an object of the present invention is to provide a method capable of easily and inexpensively manufacturing a large number of ink jet heads at a time.
[0008]
[Means for Solving the Problems]
The present invention provides a method for manufacturing an inkjet head, comprising joining at least two or more substrates, thereby dividing a plurality of inkjet heads arranged and formed in the substrates into individual inkjet heads by cutting. Of multiple inkjet heads on a single substrate Including nozzle groove A concave portion which is a part of the discharge portion is formed in the column direction, and a terminal portion for supplying a signal or power to a pressure generating means attached to the discharge portion of each of the ink jet heads is provided for each of the discharge portions. A plurality of third substrates, each of which is formed in a rectangular shape having a shorter side slightly wider than the width of the concave portion in a direction perpendicular to the column direction and having a shorter side, is disposed at a position adjacent to the first portion. After forming each of the discharge portions by bonding the concave portions of the substrate to positions covering the respective column directions, the discharge portions are formed in the column direction with respect to the concave portions in communication with the respective discharge portions. Cutting and dividing the nozzle groove in a direction perpendicular to the row direction After the nozzle is opened, the cut surface on which the nozzle is formed is polished, and then each of the ejection sections and the terminal section related to the ejection section adjacent thereto are cut and separated to form an individual inkjet head. It is characterized by the following.
[0009]
in this way, Of the recess in the direction perpendicular to the column direction Width slightly larger than width Formed into a rectangle with the short side as Since each of the plurality of third substrates is joined to a position covering each recess of the first substrate to form each ejection portion, the terminal portions are exposed after joining the two substrates. Therefore, each of the inkjet heads obtained by cutting the bonded substrate at a predetermined position has a terminal portion capable of maintaining sufficient connection strength and sufficient conductivity with an external drive circuit and each pressure generating means. Is formed. The ink jet head obtained in this way is securely connected to an external drive circuit, and by appropriately driving the pressure generating means, pressure is generated at each of the discharge portions, ink droplets are discharged, and the recording medium is discharged. Printing is performed.
[0010]
In the nozzle for discharging the ink droplets, grooves serving as a part of the nozzle communicating with each discharge unit may be formed in advance in a row on the first substrate. , Each discharge section The nozzle hole communicating with 3 May be formed in a row on the substrate. In any case, a flow path including a discharge portion and a nozzle communicating with the discharge portion is formed only by bonding the two substrates.
[0011]
Also, The present invention relates to an inkjet head In the manufacturing method, the method further comprises: 2 Bonding the substrate to the bottom surface of the first substrate, forming a diaphragm in advance on the bottom surface of each concave portion of the first substrate, 2 When the two substrates are bonded to each other, a counter electrode is formed in advance at a position facing each of the vibration plates with a predetermined gap.
[0012]
For example, an ink jet head employing a pressure generating element such as a bubble type or a piezo type can be applied to the invention according to claim 1, but the electrostatic force generated on the diaphragm and the counter electrode is used for the pressure generating means. It is not necessary to separately add a heating resistor and a piezoelectric body, and the 2 By joining the substrates described above, a pressure generating element can be obtained, so that the manufacturing process can be simplified most. Such an ink jet head using an electrostatic force for the pressure generating means can be manufactured in a larger amount and at a lower cost by the invention according to the fourth aspect.
[0013]
Also, The present invention Forming a common terminal commonly connected to each diaphragm at a position on the first substrate adjacent to the discharge section, and forming an individual terminal connected to each counter electrode at a position adjacent to the common terminal; Thus, for example, by connecting an FPC to each terminal arranged as described above, the individually separated inkjet heads can be more easily connected to an external drive circuit.
[0014]
Also, The present invention From the point that each concave portion of the discharge portion can be formed finely by using anisotropic etching, 1 The substrate is preferably a silicon substrate, and the bonding of the substrates is performed by using anodic bonding that does not require an adhesive layer made of an adhesive or the like, so that a more accurate inkjet head can be manufactured.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
(Structure of inkjet head)
Hereinafter, a preferred embodiment of an ink jet head according to the present invention will be described with reference to FIGS.
[0016]
FIG. 1 is an exploded perspective view of an ink-jet head according to an embodiment of the present invention, and is a partial cross-sectional view. The present embodiment shows an example of an edge ejection type in which ink droplets are ejected from a nozzle hole provided at an end of a substrate, but a face ejection in which ink droplets are ejected from a nozzle hole provided in an upper surface of the substrate. It may be a type. FIG. 2 is a perspective view of the entire assembled inkjet head, and FIG. 3 is a cross-sectional side view of an ink flow path of the inkjet head.
[0017]
The inkjet head 10 of the present embodiment has a laminated structure in which three substrates 1, 2, and 3 having a structure described in detail below are stacked and joined. For simplicity of description, an example in which one ink jet head is obtained after bonding the respective substrates will be described.
[0018]
The intermediate first substrate 1 is a silicon substrate, and a plurality of nozzle grooves 11 formed at equal intervals in parallel from one end on the surface of the substrate 1 so as to form a plurality of nozzle holes 4. A concave portion 12 which communicates with the groove 11 and forms a discharge chamber 6 which is a pressure generating portion having a diaphragm 5 as a bottom wall, and an ink flow which forms an orifice 7 provided at a rear portion of the concave portion 12 A narrow groove 13 for the inlet, a concave portion 14 that forms a reservoir 8 that is an ink supply unit for supplying ink to each ejection chamber 6, and a filter 51 provided at a rear portion of the concave portion 14 are formed. And a filter groove 52 to be used.
[0019]
In the present embodiment, the facing distance between the diaphragm 5 and the electrode arranged opposite thereto, that is, the length G of the gap portion 16 (see FIG. 3, hereinafter referred to as “gap length”) is the concave portion 15. The spacing means is constituted by the recess 15 for the vibration chamber formed in the second substrate 2 so that the difference between the depth of the electrode and the thickness of the electrode is obtained. As another example, the concave portion may be formed on the lower surface of the first substrate 1. Here, the depth of the recess 15 is set to 0.3 μm by etching. The pitch of the nozzle grooves 11 is 0.509 mm, and the width thereof is 60 μm.
[0020]
In addition, when the common terminal 17 is provided to the first substrate 1, it is important that the work function of the metal material as the semiconductor and the electrode is large. , Or chrome is used as an underlayer, and gold is used. However, the present invention is not limited to this embodiment. When the substrate 1 is a P-type semiconductor, the work function of the common terminal material is larger than that of the common terminal material. Any material may be used. In the case of an N-type semiconductor, any material may be used as long as the work function of the common terminal material is smaller.
[0021]
A borosilicate glass is used for the lower second substrate bonded to the lower surface of the first substrate 1, and a vibration chamber 9 is formed for mounting electrodes below the vibration plate 5 of the first substrate 1. Recess 15 is provided. The vibration chamber 9 is formed by joining the second substrate 2, and an ITO conductive film is sputtered at a position corresponding to the vibration plate 5 on the second substrate 2 by 0.1 μm, and the vibration chamber 9 is substantially formed. The counter electrode 21 is formed by forming an ITO pattern in the same shape. The counter electrode 21 has a lead part 22 and a terminal part 23.
[0022]
The upper third substrate 3 bonded to the upper surface of the first substrate 1 is made of borosilicate glass, like the second substrate 2. By joining the third substrate 3, the nozzle hole 4, the discharge chamber 6, the orifice 7, the reservoir 8, and the filter 51 are formed. The reservoir 8 is provided with a convex portion 19 for increasing the strength so that the concave portion does not collapse when the first substrate and the third substrate are joined. In the present embodiment, the filter 51 also serves as an ink supply port, is connected to the connection pipe 32, and is connected to an ink tank (not shown) via the tube 33.
[0023]
Next, the first substrate 1 and the second substrate 2 are anodically bonded at a temperature of 300 to 500 ° C. and a voltage of 500 to 1000 V, and the first substrate 1 and the third substrate 3 are bonded under the same conditions. The ink jet head is assembled as shown in FIG. The gap length G formed between the diaphragm 5 and the counter electrode 21 on the second substrate 2 after the bonding of the anode is the difference between the depth of the recess 15 and the thickness of the counter electrode 21. In the embodiment, the thickness is 0.2 μm. Further, a silicon oxide film is formed on the surface of the vibration plate 5 of the substrate 1 by thermal oxidation so that short-circuit breakdown does not occur even when the counter electrode 21 and the vibration plate 5 come into contact with each other. If the thermal oxide film as the insulating film is too thick, it causes the electric field to weaken. In this embodiment, the thickness of the thermal oxide film is 0.13 μm.
[0024]
After assembling the ink jet head as described in FIG. 2, the drive circuit 40 is connected between the common terminal 17 and the terminal portion 23 of the counter electrode 21 by the FPC 49, thereby forming an ink jet printer. The ink 103 is supplied from an ink tank (not shown) to the inside of the first substrate 1 via the filter 51, and fills the reservoir 8, the discharge chamber 6, and the like. Then, as shown in FIG. 3, the ink in the ejection chamber 6 is ejected as ink droplets 104 from the nozzle holes 4 when the inkjet head 10 is driven, and is printed on the recording paper 105.
[0025]
FIG. 4 is a partially detailed plan enlarged view of the substrate 1. The substrate 1 of the inkjet head shown in the embodiment of the present invention is formed by anisotropically etching single crystal silicon. Anisotropic etching is etching performed using the fact that the etching rate varies depending on the etching direction. In the present embodiment, utilizing the fact that the etching rate of the single crystal silicon (100) plane is about 40 times or more faster than that of the (111) plane, the above-described nozzle groove 11, concave section 12, narrow groove 13, concave section 14, and A filter groove 52 is formed. The inner nozzle groove 11, the narrow groove 13, and the filter groove 52 are V-shaped grooves each having a (111) plane having a low etching rate. That is, the cross-sectional shapes of the nozzle groove 11, the narrow groove 13, and the filter groove 52 are configured to be triangular. The width of the nozzle groove 11 is 60 μm, and the narrow groove 13 has three flow paths arranged in parallel, and has a width of 55 μm. The width of the filter groove 52 is 50 μm, and 54 concave grooves 14 communicate in parallel. The recesses 12 and 14 are trapezoidal grooves having a (100) bottom surface and a (111) side surface. The groove depth of the concave portions 12 and 14 is determined by adjusting the etching time. On the other hand, since the nozzle groove 11, the narrow groove 13, and the filter groove 51, which are V-shaped grooves, are composed only of the (111) plane having a low etching rate, the depth thereof is determined only by the groove width without depending on the etching time.
[0026]
The nozzle groove 11, the narrow groove 13, and the filter groove 52 are portions that are sensitive to characteristics such as the amount and speed of ejected ink in the ink flow path, and require the highest processing accuracy. In the embodiment of the present invention, these portions requiring high processing accuracy are configured using a surface having a low etching rate, and are processed by anisotropic etching, so that channels having different dimensions can be formed at once with high precision. Is making it possible to get.
[0027]
The ink jet head 10 thus obtained is mounted on, for example, a recording apparatus shown in FIG. In the figure, reference numeral 300 denotes a platen for transporting the recording paper 105, and 301 denotes an ink tank for storing ink therein, which supplies ink to the inkjet head 10 via an ink supply tube 306. Reference numeral 302 denotes a carriage that moves the inkjet head 10 in a direction perpendicular to the direction in which the recording paper 105 is conveyed. By discharging the ink 104 from the inkjet head 10 as needed by the drive circuit 40 while moving the carriage 302, it is possible to print any character or image on the recording paper 105. Reference numeral 303 denotes a pump which, when performing a recovery operation at the time of ink ejection failure of the ink jet head 10 or refilling the ink, sucks the ink through the cap 304 and the waste ink collecting tube 308 and discharges the ink to the discharged ink reservoir 305. Plays the function of collecting.
[0028]
(Driving method of inkjet head)
Hereinafter, the driving method of the inkjet head according to the present invention will be described with reference to FIGS.
[0029]
FIGS. 5A to 5C are side sectional views of the ink jet head according to the embodiment of the present invention, particularly illustrating a state until the ink is ejected by the deformation of the diaphragm from the standby state. It is. FIGS. 6A to 6C are schematic diagrams showing states of voltages applied between the diaphragm and the electrodes in the states of FIGS. 5A to 5C, respectively. Hereinafter, an example of the operation of the ink jet head of the present invention will be described with reference to these drawings.
[0030]
FIG. 5A is a side sectional view of the ink jet head in a standby state, and FIG. 6A is a schematic diagram showing a potential between the diaphragm 5 and the counter electrode 21 at that time.
[0031]
At this time, the ink jet head is filled with ink in the ink flow path, and is in a standby state when discharging ink. Next, as shown in FIG. 6B, when a voltage is applied between the diaphragm 5 and the counter electrode 21 to generate a potential difference from the standby state, an electrostatic attraction force acts on the diaphragm 5 and the counter electrode 21. Then, the diaphragm 5 is attracted to the counter electrode 21. At this time, as shown in FIG. 5B, the pressure in the discharge chamber 6 is reduced by the vibration plate 5 sucked by the counter electrode 21, and ink is supplied from the reservoir 8 to the discharge chamber 6 in the direction of arrow B. . At the same time, the meniscus 102 formed in the nozzle 4 is also sucked in the direction of the discharge chamber 6. Next, as shown in FIG. 6C, when the timing at which the ink is sufficiently supplied is selected, the application of the voltage is stopped, and the electric charge stored in the diaphragm 5 and the counter electrode 21 is discharged. As shown in c), the diaphragm 5 is released from the force of the electric field and is restored to the discharge chamber 6 by its own restoring force. At this time, the ink droplet 104 is ejected from the nozzle hole 4 by the pressure generated in the ejection chamber 6. At the same time, the ink in the ejection chamber 6 passes through the orifice 7 in the direction of arrow C and is discharged to the reservoir 8. Thereafter, the vibration of the ink in the ink flow path is attenuated by the flow path resistance and converges, and the state again returns to the standby state shown in FIG. 5A, where the next ink can be ejected.
[0032]
In the above-described driving method, in the standby state, the diaphragm is not deformed, and during driving, by deforming the diaphragm, once the pressure in the discharge chamber is reduced, immediately after that, the force applied to the diaphragm is released. In this method, the pressure is increased to eject ink droplets (so-called pulling). In a standby state, the diaphragm is constantly deformed, and the diaphragm is opened only when ink is ejected (so-called pulling). Pressing). With the pulling method shown in the example, it is possible to increase the amount of ejected ink and drive with excellent frequency characteristics of the amount of ejected ink. In any case, the operation and effect of the present invention are the same even if the driving force and the driving method are different.
[0033]
(Method of manufacturing inkjet head)
Hereinafter, the method for manufacturing the ink jet head of the present invention will be described in detail with reference to FIGS.
[0034]
FIG. 8 is a diagram illustrating a method of manufacturing a plurality of inkjet heads by overlapping and joining three substrates 1, 2, and 3 in the method of manufacturing an inkjet head according to the present invention.
[0035]
By joining the substrate 1 and the substrate 3, an ejection unit including a nozzle 4 for ejecting ink droplets, an ejection chamber 6, an orifice 7, a common ink chamber 8, and a filter 51 serving as an ink intake port is obtained. On the other hand, by joining the substrate 1 and the substrate 2, an electrostatic actuator (vibrating plate 5 and the counter electrode 21) and individual terminals 23 connected to each electrostatic actuator, which are pressure generating means of each head, are obtained. .
[0036]
When the substrate 1 and the substrate 3 are joined, a flow path pattern 70 (concave portion) that forms one discharge portion is formed on one wafer-shaped silicon substrate 1 as shown in FIG. A plurality of sets are formed in a row. Each channel pattern 70 is composed of the grooves or recesses 11, 12, 13, 14, and 51 shown in FIG. 1. In the present embodiment, three channel patterns are provided at both end rows, and five central rows are provided. Since five flow path patterns are formed per row, a total of 31 inkjet heads can be obtained from one silicon wafer. As shown in FIG. 8, the substrate 3 is a rectangular borosilicate glass substrate having a width slightly larger than the width of the flow path pattern and being slightly longer than the radius of the wafer-shaped substrate 1. Substrates 3 having such a shape are prepared for the number of rows of the flow path patterns 70 formed on the substrate 1 (in the case of the present embodiment, seven are prepared, and each of the substrates 3 is provided with the flow path patterns arranged in a row. Join at the position to cover.
[0037]
On the other hand, for the lower second substrate to be joined to the lower surface of the first substrate 1, borosilicate glass substantially the first substrate is used. On the second substrate 2, a wiring pattern 71 composed of the groove 15 shown in FIG. 1, the counter electrode 21 formed on the bottom of the groove 15, and the lead portion 22 connecting the individual terminal 23 and the counter electrode 21 is formed. A plurality of sets are arranged and formed at positions corresponding to the road pattern 70.
[0038]
Hereinafter, a method of forming a flow path pattern 70 (concave portion) serving as a discharge portion on the silicon substrate 1 will be described by taking the filter 51 as an example.
[0039]
FIG. 9 is a view for explaining a groove forming process of the substrate 1 in the method of manufacturing an ink jet head according to the present invention. Each figure shows a cross section of a portion of the substrate 1 where the filter groove 52 is formed. Reference numeral 61 denotes a 6000 ° -thick SiO2 thermal oxide film formed by thermal oxidation at 1100 ° C. on the surface of the substrate 1 made of single-crystal Si. Reference numeral 62 denotes a resist which is a photosensitive resin applied to the surface of the substrate 1.
[0040]
FIG. 9A shows that after applying and drying a resist 61 on the surface of the substrate 1 after the thermal oxidation, the resist 61 is irradiated and exposed to ultraviolet light using a positive mask in which a pattern is drawn only on a portion where the filter groove 52 is to be formed. , Developed, rinsed and dried. Here, referring to the width of the pattern, the width of the pattern for forming the filter groove 52 is smaller than the width of the pattern for forming the nozzle groove 11 and the narrow groove 13 shown in FIG.
[0041]
Next, the oxide film is etched with an etching solution (BHF) in which hydrofluoric acid and ammonium fluoride are mixed at a ratio of 1: 6 (volume ratio). Thus, the oxide film of the pattern portion where the filter groove 52 is to be formed is removed. Thereafter, when the resist 61 is peeled, the state shown in FIG. 9B is obtained. At this time, at the same time, the oxide film of the pattern portion for forming the groove serving as the ink flow path and the ink supply portion is also removed.
[0042]
Further, the single crystal Si as the substrate 1 is etched with an aqueous solution of potassium hydroxide (KOH) and ethanol. At this time, since the (100) plane of the single crystal Si is etched at a speed 40 times the etching speed of the (111) plane, the (111) plane is exposed as a result. FIG. 9C shows a state after the single crystal silicon is etched. At this time, the filter groove 52 is formed only of the (111) plane of single crystal Si. Since the filter groove 52 is formed of the (111) plane having a low etching rate, the etching hardly proceeds, and the filter groove 52 is formed with a stable width and depth with respect to the pattern width of the mask. Similarly, it is possible to form the groove shape with high accuracy for other ink flow paths and ink supply units.
[0043]
At the end of the groove formation, after washing with hot sulfuric acid, steam washing with isopropyl alcohol,
The thermal oxide film on the surface is removed by BHF. FIG. 9D shows a state after the formation of the groove after the thermal oxide film is removed.
[0044]
Thereafter, the common terminal 17 is formed at a position adjacent to each flow path pattern, and a thermal oxide film serving as a protective film is formed again to complete the substrate 1. A hole 24 for exposing the individual terminal 23 formed on the substrate 2 when the substrate 1 is bonded to the substrate 2 is provided at a position adjacent to each common terminal of the substrate 1.
[0045]
Next, a procedure for bonding the substrates thus formed will be described. As mentioned above, wiring pattern 71 On the substrate 2 on which the individual terminals 23 are regularly formed in a row, the substrate 1 on which the flow path pattern 70, the common terminal 17, and the holes 24 are regularly formed in a row is positioned. Positioning is performed by adjusting the position of each substrate while observing the indicia 72 engraved on each substrate with a microscope. After the positioning, the two substrates 1 and 2 are joined by performing anodic bonding. Thereby, the individual terminals 23 are formed at positions adjacent to the respective common terminals 17 provided on the surface of the bonded substrate 1. Thereafter, each substrate 3 is positioned at a predetermined position at once by a jig (not shown) for holding each substrate 3 at equal intervals and in parallel. A predetermined voltage is simultaneously applied between the thus positioned substrate 1 and the plurality of substrates 3 to perform anodic bonding.
[0046]
in this way, Slightly larger than the width of the flow path pattern 70 Multiple first with width 3 Substrate 3 Are joined at positions covering the respective flow path patterns 70 of the first substrate to form the respective discharge portions. Therefore, in a state after the respective substrates are joined, the substrates 1 or the other than the respective flow path patterns 70 3 Is exposed to the outside, and the terminals 17 and 23 for supplying signals and power to the pressure generating means are already prepared. Therefore, a large number of ink jet heads can be obtained only by cutting the substrate by the method described below.
[0047]
FIG. 10 is an enlarged view showing a part of a cross section between the silicon substrate 1 and the substrate 2 of the bonded substrates, and shows a portion separated into individual inkjet heads.
[0048]
The inkjet heads 10a and 10b to be separated are arranged so that the nozzle 4 and the filter unit 51 face each other on a pattern. The bonded substrate is first cut in a direction perpendicular to the column direction (the long direction of the substrate 3) (hereinafter, this direction is referred to as a row direction). In other words, the ink-jet head is separated in the row direction by removing the cutting allowance ta of the adjacent pattern. The pattern of the filter unit 51 overlaps with the cutting margin ta for tb, and the pattern of the nozzle 4 overlaps with the cutting margin ta for tc.
[0049]
For example, when cutting / separating by dicing, after separating into individual inkjet heads based on the filter part 51 side using a grindstone slightly narrower than the cutting allowance ta, the nozzle 4 part is polished and repelled. Perform post-treatment such as water treatment.
[0050]
Since the area of the opening of the filter 51 is narrowest relative to the outside of the head, cutting the filter groove and manufacturing the head prevents foreign matter from entering the head during handling during manufacturing. It is possible to prevent it.
[0051]
Thereafter, separation is performed in the column direction to obtain individual inkjet heads. In the present embodiment, before separation in the row direction, a scribe (groove) is previously provided between the inkjet heads 10b and 10d adjacent in the row direction. ) Is formed. For this reason, after separating in the row direction and after performing the water-repellent treatment of the nozzle portion, it is possible to cut (break) easily and quickly.
[0052]
Various cutting methods other than the above-mentioned methods can be cited, but cutting in the row direction includes cutting of the nozzle portion, and precision is required. Therefore, grinding and cutting by dicing is desirable, and the column direction is the row direction. Since a high degree of accuracy is not required, a method of breaking after easy scribe is desirable.
[0053]
As described above, for the individual inkjet heads obtained by cutting the bonded substrate at predetermined positions, the external drive circuit and each pressure generating means must have sufficient connection strength and sufficient conductivity. In this way, it is possible to mass-produce an ink-jet head having terminals that can be reliably connected to an external drive circuit by simply joining and cutting each substrate. Play.
[0054]
In the above-described embodiment, the electrostatic attraction force is used as the pressure generating means. However, a piezoelectric element is attached to the surface of the vibration plate 5 on the side opposite to the discharge chamber 6 as the pressure generating means, and an electric pulse is appropriately applied to the piezoelectric element. The voltage may be applied to deform the diaphragm. Also, the method and effect of the present invention are the same as those of the present invention, even in a method in which a heating resistor element is provided in the ejection chamber 6 as the pressure generating means, and the ink is heated and expanded by the heating resistor element to obtain a pressure for ejecting the ink. Is obtained. As described above, the present invention is not limited to the pressure generating means using the electrostatic attraction force, but the pressure generating means using the electrostatic force generated on the diaphragm and the counter electrode as the pressure generating means is separately provided. It is not necessary to attach a heating resistor or a piezoelectric body, and the 2 By joining the substrates described above, a pressure generating element can be obtained, so that there is an effect that the manufacturing process can be simplified most.
[0055]
【The invention's effect】
INDUSTRIAL APPLICABILITY As described above, according to the present invention, at least two or more substrates are joined, and a plurality of inkjet heads arranged and formed in the substrates are cut and divided into individual inkjet heads. In the manufacturing method, a plurality of inkjet heads are provided on a first substrate. Including nozzle groove A concave portion which is a part of the discharge portion is formed in the column direction, and a terminal portion for supplying a signal or power to a pressure generating means attached to the discharge portion of each of the ink jet heads is provided for each of the discharge portions. Each of a plurality of third substrates formed in a rectangular shape having a shorter side with a width slightly larger than the width of the concave portion in the direction perpendicular to the column direction, which is arranged at a position adjacent to the After forming each discharge portion by joining the concave portion at a position covering each column direction, the discharge portion is formed on the column direction side with respect to the concave portion in communication with each discharge portion. Cutting and dividing the nozzle groove in a direction perpendicular to the row direction After the nozzle is opened, the cut surface on which the nozzle is formed is polished, and then each of the discharge sections and the terminal section related to the discharge section adjacent thereto are cut and separated in the column direction to form an individual inkjet. By using a head, an effect can be obtained in that an ink jet head having terminals that can be reliably connected to an external drive circuit can be mass-produced inexpensively simply by joining and cutting each substrate patterned in place.
[0056]
Also, According to the present invention, an inkjet head In the manufacturing method, the method further comprises: 2 Bonding the substrate to the bottom surface of the first substrate, forming a diaphragm in advance on the bottom surface of each concave portion of the first substrate, 2 When the two substrates are bonded to each other, a counter electrode is formed in advance at a position facing each of the vibration plates with a predetermined gap, so that an inkjet head using an electrostatic actuator is formed. A manufacturing method can be provided. Ink jet heads using electrostatic force for such a pressure generating means method, Book The invention makes it possible to produce larger quantities and less expensively than other types.
[0057]
Also, Book As in the invention, a common terminal commonly connected to each diaphragm is formed at a position adjacent to the discharge portion on the first substrate, and an individual terminal connected to each counter electrode is formed at a position adjacent to the common terminal. By forming the terminals, for example, by connecting an FPC to each terminal arranged in this manner, the individually separated inkjet heads can be more easily connected to an external drive circuit. Play.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an inkjet head according to an embodiment of the present invention.
FIG. 2 is a perspective view showing an assembled state of the inkjet head of FIG. 1;
FIG. 3 is a sectional side view of the inkjet head of FIG. 1;
FIG. 4 is a partially enlarged plan view of a substrate of the ink jet head of FIG. 1;
FIG. 5 is a cross-sectional side view illustrating an ink ejection operation of the inkjet head according to the embodiment of the present invention.
FIG. 6 is an explanatory diagram showing states of voltages applied to a diaphragm and a counter electrode of the inkjet head shown in FIG. 5;
FIG. 7 is a schematic diagram of a printer equipped with an inkjet head according to an embodiment of the present invention.
FIG. 8 is a perspective view showing a method for manufacturing a plurality of ink jet heads according to the method for manufacturing an ink jet head of the present invention.
FIG. 9 is a sectional view showing the process of manufacturing the substrate of the inkjet head according to the embodiment of the present invention.
FIG. 10 is an enlarged view showing a part of a cross section between the silicon substrate 1 and the substrate 2 after bonding in FIG. 8;
[Explanation of symbols]
1 First substrate
2 Second substrate
3 Third substrate
4 Nozzle hole
5 diaphragm
6 Discharge chamber
17 Common terminal
21 Counter electrode
23 Individual terminals
70 Flow pattern
71 Wiring pattern

Claims (8)

By bonding at least two or more substrates, a plurality of inkjet heads arranged and formed in the substrates, in the method of manufacturing an inkjet head to be divided into individual inkjet heads by cutting,
On the first substrate, recesses that become part of the discharge units including the nozzle grooves of the plurality of ink jet heads are formed in the column direction, and a signal is generated by the pressure generating means attached to the discharge unit of each of the ink jet heads. Alternatively, a terminal portion for supplying electric power is arranged and formed at a position adjacent to each of the discharge portions,
Each of the plurality of third substrates formed into a rectangle having a shorter side having a width slightly larger than the width of the concave portion in a direction perpendicular to the column direction is formed by dividing the concave portion of the first substrate into each column direction. After forming each of the ejection parts by joining at a position to cover,
The nozzle grooves formed in the column direction with respect to the recessed portions communicating with the respective discharge portions are cut and divided in a direction perpendicular to the column direction to open the nozzles,
Then, after polishing the cut surface on which the nozzle is formed,
A method for manufacturing an ink jet head, wherein each of the discharge sections and the terminal section related to the discharge section adjacent thereto are cut and separated into individual ink jet heads. 2. The method for manufacturing an ink jet head according to claim 1, wherein a groove serving as a part of the nozzle communicating with each of the discharge units is formed in the first substrate. 2. The method for manufacturing an ink jet head according to claim 1, wherein the nozzle communicating with each of the discharge units is formed on the third substrate. 2. The method for manufacturing an ink jet head according to claim 1, further comprising: bonding a second substrate made of an insulator to a bottom surface of the first substrate,
A diaphragm is previously formed on the bottom surface of each of the concave portions of the first substrate,
On the second substrate, when the first and second substrates are joined, a counter electrode is formed in advance at a position facing each of the diaphragms with a predetermined gap. A method for manufacturing an ink jet head, which is characterized in that: 5. The method for manufacturing an ink jet head according to claim 4, wherein a common terminal commonly connected to each of said diaphragms is formed at a position adjacent to said discharge portion on said first substrate. Production method. 6. The method for manufacturing an ink jet head according to claim 5, wherein an individual terminal connected to each of said counter electrodes is formed at a position adjacent to said common terminal. 7. The method for manufacturing an ink jet head according to claim 1, wherein the first substrate is a silicon substrate, and each of the concave portions is formed by using anisotropic etching. Manufacturing method of an inkjet head. 8. The method for manufacturing an ink jet head according to claim 1, wherein anodic bonding is used for bonding between the substrates.

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