JP3554593B2 - Substrate transfer device - Google Patents

Description

[0001]
[Industrial applications]
The present invention relates to, for example, an electronic component mounting device that mounts electronic components on a substrate, and to a substrate transfer device that sends a substrate from a loading / conveying path to a mounting table, and sends the substrate from the mounting table to a carry-out / transport path.
[0002]
[Prior art]
Conventionally, as this type of substrate transfer device, one described in Japanese Patent Application Laid-Open No. 63-294000 is known. As shown in FIG. 11, the substrate transfer device 100 includes a sending member 101 that is applied to the substrate B and directly moves the same, a belt mechanism 102 that moves the sending member 101 in the transfer direction, and a sending member 101. And a reciprocating member 103 interposed between the belt mechanisms 102. The two arms 101a and 101a of the feeding member 101 mount the substrate B introduced into the carry-in conveyance path on a mounting table and mount electronic components. The completed substrates A are simultaneously transferred from the mounting table to the unloading transport path. The feeding member 101 is configured to be able to advance and retreat in the transfer direction by a guide rail 104, and similarly, the reciprocating member 103 is also configured to be able to advance and retreat in the transfer direction by a guide rail 105. One end of the reciprocating member 103 is fixed to the timing belt 106 of the belt mechanism 102, and the feeding member 101 is locked at the other end.
[0003]
That is, the reciprocating member 103 is configured by attaching the fixed holding member 112 and the moving holding member 113 to the member main body 111, and the connecting portion is held between these two holding members 112, 113. The feeding member 101 is locked to the reciprocating member 103. The movable holding member 113 is rotatably attached to the member main body 111 and is urged in a holding direction by a coil spring 114. When the substrate B is supported on a mounting table or the like when transferring the substrate B, the transfer It receives a braking force via the member 101 and rotates to open. The rotation of the movable holding member 113 is detected by a sensor 107 facing one end of the movable holding member 113, so that a transfer failure of the substrate B can be detected.
[0004]
[Problems to be solved by the invention]
In such a conventional substrate transfer apparatus 100, in order to detect a transfer failure of the substrate B, it is necessary to interpose the reciprocating member 103 between the feeding member 101 and the belt mechanism 102, and the structure becomes complicated. At the same time, it is necessary to movably provide wiring for a signal for a sensor, a power supply, and the like.
[0005]
On the other hand, in this type of substrate transfer apparatus, the substrate is transported in one direction as a standard, and only this standard specification is manufactured. There is an increasing number of people who want to make changes after delivery, and want to be able to make changes at any time in either the forward or reverse direction. Therefore, in recent years, there has been a demand for a structure that can easily respond to such a request.
[0006]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate transfer apparatus that can detect a transfer failure of a substrate with a simple structure and can easily cope with reversal of the transfer direction of the substrate due to the structure.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention includes a feeding member configured to be able to move forward and backward in a transfer direction, and a belt mechanism for moving the feeding member forward and backward, and the feeding member applied to the substrate is moved forward and backward by the belt mechanism. In the substrate transfer device for transferring the substrate from one base to the other base, the belt mechanism includes a belt to which the feeding member is fixed, the belt being stretched over, and a belt extending direction of the belt. A pair of pulleys configured to be minutely movable, a pair of biasing means for biasing each pulley in the belt tension direction, and each pulley moving in the belt slack direction against each biasing means. And a pair of detecting means for detecting With respect to the urging means arranged in front of the transfer direction, the urging means arranged in the front is configured with a large urging force. It is characterized by the following. Are provided.
[0008]
In this case, each of the pair of biasing means is constituted by a coil spring, and the coil spring arranged in front of the coil spring arranged in front of the transfer direction may be constituted by one having a large spring force. ,preferable.
[0009]
[Action]
According to the substrate transfer apparatus of claim 1, when the substrate is transferred, if the substrate is supported by some factor, the running of the belt is braked, and the front side in the transfer direction of the belt is greatly loosened across the feeding member fixing point, The other side is tight. As a result, the pulley located forward in the transfer direction is slightly moved in the loosening direction, that is, inward, against the urging means. When the pulley moves in the slack direction of the belt in this way, this movement is detected by the detecting means, and a transfer failure of the substrate is detected. In this case, since the urging means and the sensor are provided for each of the pair of pulleys, when the transfer direction of the substrate is reversed, it is easy to respond simply by reversing the traveling direction of the belt. it can. Further, by configuring the biasing means disposed on the front side with a large biasing force with respect to the biasing means disposed on the front side in the transfer direction, the biasing means disposed on the front side allows the above-described substrate to be moved. A transfer failure can be detected, and at this time, the slack generated in the belt can be absorbed by the urging means disposed in front. Therefore, it is possible to prevent the belt from falling off the pulley without requiring a tension pulley or the like. In addition, as described above, the detection of the transfer failure is performed by the pulley-side detection unit located in the transport direction, which is directly subjected to the belt tension when the substrate is supported.
[0010]
According to the substrate transfer device of the second aspect, the coil spring disposed on the front side is configured to have a larger spring force than the coil spring disposed on the front side in the transfer direction, so that the coil spring disposed on the front side is formed. Accordingly, the above-described transfer failure of the substrate can be detected, and at this time, the slack generated in the belt can be absorbed by the coil spring disposed on the front side. Therefore, it is possible to prevent the belt from falling off the pulley without requiring a tension pulley or the like. Moreover, when the transfer direction of the substrate is reversed, it is possible to easily cope with this by simply reversing the running direction of the belt and replacing the front and rear coil springs.
[0011]
【Example】
Hereinafter, a case where a substrate transfer device according to an embodiment of the present invention is applied to an electronic component mounting device will be described with reference to the accompanying drawings. FIG. 1 is a front view of the electronic component mounting apparatus, and FIG. 2 is a plan view thereof. As shown in FIGS. 1 and 2, the electronic component mounting apparatus 1 includes a supply system 3 for supplying an electronic component A and a mounting system 4 for mounting the electronic component A on a board B, on both sides of the apparatus main body 2. It is configured. The apparatus main body 2 is provided with an index unit 11 serving as a main body of a drive system, a rotary table 12 connected to the index unit 11, and a plurality of (12) mounting heads 13 mounted on an outer peripheral portion of the rotary table 12. The rotary table 12 is intermittently rotated by the index unit 11 at an intermittent pitch corresponding to the number of the mounting heads 13. When the rotary table 12 rotates intermittently, each mounting head 13 appropriately faces the supply system 3 and the mounting system 4 and, after sucking the electronic component A supplied from the supply system 3, rotates and conveys the electronic component A to the mounting system 4. This is mounted on the substrate B introduced in the above.
[0012]
The supply system 3 has a number of component supply devices 21 corresponding to the type of the electronic component A to be mounted on the board B. The component supply device 21 is slidably guided by a pair of guide rails 22, 22. 23 is provided side by side and detachably. A ball screw 24 is screwed into the supply table 23 in the sliding direction, and the supply table 23 is moved forward and backward by a forward / reverse rotation of a feed motor 25 connected to one end of the ball screw 24, so that the mounting head 13 The component supply device 21 is selectively brought to the suction position. Each component supply device 21 includes a tape reel 26 on which a carrier tape C for electronic components is wound, a tape feeder 27 for unwinding the carrier tape C from the tape reel 26, and a cover tape reel for winding a cover tape of the carrier tape C. 28.
[0013]
The electronic component A is loaded at a predetermined pitch on a carrier tape C composed of a tape body and a cover tape, and is sucked by the mounting head 13 with the cover tape removed. The tape feeder 27 and the cover tape reel 28 are operated in synchronism with the rotary table 12 by the tape feed driving device 14 provided in the apparatus main body 2 to intermittently feed the carrier tape C and intermittently cover the cover tape prior to the suction. And wind it up. The carrier tape C unwound from the tape reel 26 by the tape feeder 17 is intermittently fed according to the loading pitch of the electronic components A, and the cover tape is peeled off immediately before the suction position. Then, the electronic component A that has reached the suction position is sucked by the mounting head 13 descending as needed. On the other hand, the peeled cover tape is wound on a cover tape reel 28, and the tape body after the electronic component A is sucked is finely cut by the tape cutting device 15 provided in the device body 2 to a size corresponding to the loading pitch. It will be cut off.
[0014]
The mounting system 4 includes an XY table 31 for moving the mounted substrate B in the X-axis direction and the Y-axis direction, a carry-in conveyance path 32 and a carry-out conveyance path 33 disposed before and after the XY table 31, and a carry-in conveyance path 32. The upper substrate B is constituted by an XY table 31 and a substrate transfer device 34 for simultaneously transferring the substrate B on the XY table 31 to an unloading conveyance path 33. The XY table 31 includes a Y-axis table 35 on which the substrate B is directly mounted, and an X-axis table 36 on which the Y-axis table 35 is mounted. The Y-axis table 35 is driven by a Y-axis motor 37 via a screw mechanism. The X-axis table 36 is moved forward and backward by the X-axis motor 38 via the screw mechanism. At this time, the X-axis motor 38 and the Y-axis motor 37 are controlled in forward and reverse rotations by a control device (not shown) to move the board B appropriately in the X-axis direction and the Y-axis direction. To the mounting position of the mounting head 13.
[0015]
The substrate B sent to the downstream end of the carry-in transport path 32 is transferred onto the XY table 31 by the substrate transfer device 34, and at the same time, the substrate B on the XY table 31 on which the mounting of the electronic component A is completed is The transfer device 34 transfers the sheet to the unloading conveyance path 33. The board B introduced on the XY table 31 is appropriately moved by the XY table 31, and corresponding to the electronic components A sent one after another by the respective mounting heads 13, the component mounting part faces the mounting position. The electronic component A is received from each mounting head 13. In this way, the board B on which all the electronic components A have been mounted is again transferred from the XY table 31 to the unloading transfer path 33 by the board transfer device 34, and at the same time, a new board B is transferred to the transfer path. 32 to the XY table 31.
[0016]
The apparatus main body 2 has an index unit 11 serving as a main body of a drive system on a support base 16, and the index unit 11 is driven at a constant speed input from a drive motor (not shown) serving as a power source via a worm speed reducer. The rotary motion is converted into power to rotate the rotary table 12 intermittently, and is synchronized (interlocked) with the intermittent cycle of the rotary table 12 via an output shaft (not shown). The cutting device 15 is operated, and the mounting head elevating devices 51 and 52 and the nozzle selecting device 53, which will be described later, are operated.
[0017]
The turntable 12 is fixed to a vertical shaft 41 hanging from the index unit 11, and is intermittently rotated clockwise in a plan view. Twelve mounting heads 13 are attached to the outer peripheral portion of the turntable 12 at equal intervals in the circumferential direction via two rods 42, 42 so as to be vertically movable. In this case, the intermittent rotation of the rotary table 12 has a twelve intermittent cycle for one rotation according to the number of the mounting heads 13, and the mounting heads 13 revolving by this intermittent rotation stop at the shared 12 places. Stop at each position.
[0018]
A plurality of (six in the embodiment) suction nozzles 43 arranged at equal intervals in the circumferential direction are respectively attached to each mounting head 13 so as to be able to protrude and retract, and as a whole, can revolve around a vertical axis. . Six suction nozzles 43 are used, and one suitable suction nozzle 43 can be selected according to the size of the electronic component A or the like. This selection is performed by revolving and moving the selected one suction nozzle 43 to the nozzle set position of the mounting head 13.
[0019]
The above-mentioned two rods 42, 42 extend upward through the rotary table 12, and are disposed below the support base 16 via a pair of upper and lower cam followers 44a, 44b attached to the upper end thereof. It is engaged with the cylindrical rib cam 46 of the fixed cylindrical body 45. When the mounting head 13 and the rod 42 rotate with the intermittent rotation of the rotary table 12, the cam followers 44a and 44b roll against the cylindrical rib cam 46, and the mounting head 13 moves up and down according to the contour curve of the cylindrical rib cam 46. Specifically, since the mounting point on the mounting side is at a lower position than the suction point on the suction side, the mounting head 13 revolving toward the suction side slowly moves upward and revolves toward the mounting side. The head 13 moves down slowly.
[0020]
On the other hand, various devices for accessing the mounting head 13 are installed at the twelve stop positions including the suction position and the mounting position accompanying the intermittent rotation of the rotary table 12 so as to be mounted on the support base 16. .
[0021]
At the suction position, the cam followers 44a, 44b attached to the rod 42 are engaged to disengage the cam followers 44a, 44b from the cylindrical rib cam 46, and the mounting head 13 is lowered for suction of the electronic component A. Similarly, a mounting head elevating device 52 for lowering the mounting head 13 for mounting the electronic component A is incorporated in the head elevating device 51 at the mounting position. Note that the two mounting head elevating devices 51 and 52 have the same basic structure except for the arm length.
[0022]
At the next stop position next to the mounting position in a clockwise direction, a nozzle selection device 53 that revolves the suction nozzle 43 and moves the selected one suction nozzle 43 to a nozzle set position located outside is provided by a nozzle selection device 53. In the stop position, the nozzle retracting device 54 for lowering the mounting head 13 to abut against the abutment table to immerse the unnecessary suction nozzles 43 and protruding the selected suction nozzle 43 while raising the mounting head 13 includes: Further, a nozzle length adjusting device 55 for adjusting the protruding length of the protruding suction nozzle 43 is incorporated in the next stop position.
[0023]
Similarly, a nozzle that revolves the suction nozzle 43 and corrects the position of the suction nozzle 43 facing the suction position in the left-right direction (the direction orthogonal to the direction of movement of the supply table) at the stop position immediately before the subsequent suction position. At the position next to the suction position, the position correcting device 56 revolves the suction nozzle 43 to return the suction nozzle 43 to the original nozzle set position. The component recognition device 58 for recognizing the posture of the sucked electronic component A (posture in the horizontal plane) moves the suction nozzle 43 to the next stop position based on the recognition result of the component recognition device 58. And a component angle correction device 59 for correcting the sucked electronic component A so as to be in a posture at the time of mounting. A plurality of camshafts are connected to the output shaft of the above-mentioned index unit 11, and each of these devices uses an intermittent cycle of the rotary table 12 by a cam provided on each camshaft corresponding to each device. It is operated in synchronization with.
[0024]
Here, a series of operations of the apparatus main body 2 will be briefly described by taking an example of an operation of an arbitrary mounting head 13 as an example. The mounting head 13 having the electronic component A mounted on the substrate B at the mounting position is publicly transferred toward the suction position by the intermittently rotating rotary table 12, and the selection of the suction nozzle 43 and the selection of the suction nozzle 43 based on the control command. The projection position is reached while the projection / immersion, the projection length adjustment, and the position correction are sequentially performed. On the other hand, in the suction system 3, while the mounting head 13 is moving from the stop position immediately before the suction position to the suction position, the supply table 23 is moved forward and backward based on the control command, and the corresponding electronic component parts are moved. The supply device 21 is brought to the suction position.
[0025]
Here, the mounting head 13 that has sucked the electronic component A is publicly transferred to the mounting position, and returns to the nozzle set position of the suction nozzle 43 based on the control command. In addition, the electronic component A reaches the mounting position while the angle correction of the electronic component A is sequentially performed based thereon. On the other hand, in the mounting system 4, while the mounting head 13 is moving from the stop position immediately before the mounting position to the mounting position, the XY table 31 is operated based on the control command, and the component mounting portion of the board B is moved. To the mounting position. Then, the mounting head 13 is lowered by the mounting head elevating device 52, and the electronic component A is mounted on the substrate B.
[0026]
Next, the substrate transfer device 34 will be described in detail with reference to FIGS. As described above, the board transfer device 34 transfers the board B, which has been transferred to the downstream end of the transfer path 32, from the transfer path 32 to the XY table 31, and at the same time, mounts the electronic component A on the XY table 31. The upper substrate B is transferred to the unloading transport path 33. As shown in FIG. 3 and FIG. 4, the substrate B is held in an appropriate posture on the loading transport path 32, the XY table 31, and the unloading transport path 33. In this state, a pair of board rails 31a, 31a, 32a, 32a, 33a, 33a for guiding the movement of the board B are provided so that the board B can be transferred.
[0027]
Each of the board rails 31a, 32a, and 33a has an inward "U" shaped rail groove formed therein, and both side ends of the board B are inserted and guided. On one board rail 31a provided on the XY table 34, a number of rollers 61 facing the rail groove are arranged in a row, and the rollers 61 are urged toward the board B by a spring 62. Thus, the board B introduced into the XY table 31 is pressed from one board rail 31a side to the other board rail 31a side, and is immovably held on the XY table 31.
[0028]
The substrate transfer device 34 is disposed along the XY table 31, and as shown in FIG. 5, a sending member 71 applied to the substrate B and directly moving the same, and the sending member 71 in the transfer direction. And a belt mechanism 72 for moving. The feeding member 71 includes a member main body 71a attached to the guide rail 73 so as to be able to advance and retreat, a pair of feed arms 71b, 71b extending from the member main body 71a to the XY table 31, and a connecting portion 71c fixed to the belt mechanism 72. When the timing belt 81 of the belt mechanism 72 described later travels, the two substrates B, B which advance and retreat along the guide rail 73 and are respectively applied to the feed arms 71b, 71b are simultaneously moved forward. Transfer to
[0029]
The belt mechanism 72 removes slack in the timing belt 81 to which the connecting portion 71 c of the feeding member 71 is fixed, a pair of front and rear drive pulleys 82 and a driven pulley 83 around which the timing belt 81 is stretched, and the timing belt 81. A pair of front and rear tension pulleys 84a and 84b are provided, and the driving and driven pulleys 82 and 83 are rotatably attached to rocking plates 85a and 85b at support shafts 82a and 83a, respectively. They are attached to the frame side via plates 85a and 85b, respectively. Coil springs 86a, 86b each having one end fixed to the frame side are hung on the support shafts 82a, 83a of these pulleys 82, 83, and both the driving and driven pulleys 82, 83 are controlled by the coil springs 86a, 86b. , Are mutually biased in the tensioning direction of the timing belt 81. That is, the pulleys 82 and 83 are configured to be urged outward by the coil springs 86a and 86b, and to be finely movable in the front-rear direction via the rocking plates 85a and 85b.
[0030]
On the other hand, stoppers 87a and 87b are provided on the base sides of the rocking plates 85a and 85b to restrict the rocking plates 85a and 85b from rocking outward, respectively, against the coil springs 86a and 86b. Further, sensors 88a and 88b for detecting inward swings of the swing plates 85a and 85b, respectively, are provided on the distal end sides of the swing plates 85a and 85b. Each of the sensors 88a and 88b is constituted by a photo interrupter or the like, and when the swing plates 85a and 85b are largely swung inward by being pulled by the timing belt 81, the tips of the swing plates 85a and 85b are sensors 88a and 88b. Is blocked, and a transfer failure of the substrate B described later is detected. A control device 74 is connected to the sensors 88a and 88b, and the control device 74 can stop the rotation of the drive pulley 82 based on the detection results of the sensors 88a and 88b.
[0031]
Next, with reference to FIGS. 6 and 7, the operation of the substrate transfer device 34 configured as described above will be described based on the standard specification for sending the substrate B from the rear to the front (left to right in the drawing) and the front to the rear ( The description is divided into special specifications that are sent from right to left in the figure. FIG. 6 shows a standard specification, in which the driving pulley 82 rotates clockwise, the feeding member 71 moves from the rear to the front, and the two substrates B, B are simultaneously transferred to the front. Here, it is assumed that one substrate B is supported by the XY table 31 or the unloading conveyance path 33 (transfer failure). As shown in the figure, when the substrate B supports, a braking force acts on the timing belt 81, and the timing belt 81 is strongly stretched on the front side and largely loosened on the rear side across the fixing point of the feeding member 71. The slack on the rear side of the timing belt 81 is absorbed by the tension pulley 84b on the rear side, and the tension on the front side pulls the driven pulley 83 in the slack direction of the timing belt 81, that is, inward, and the swing plate 85a is moved by the coil spring 86a. Swings large inward against This swing is detected by the front sensor 88a as a transfer failure of the substrate B.
[0032]
On the other hand, FIG. 7 shows a special specification. In this case, the driving pulley 82 rotates counterclockwise, the feeding member 71 moves from the front to the rear, and the two substrates B and B are simultaneously moved rearward. Is transferred to In this case, when a transfer failure occurs, as shown in the drawing, the timing belt 81 is strongly stretched on the rear side and greatly slackened on the front side across the fixing point of the feeding member 71. The slack on the front side of the timing belt 81 is absorbed by the tension pulley 84a on the front side, and the tension on the rear side pulls the drive pulley 82 inward and pushes the swing plate 85b inward against the coil spring 86b. Swing greatly. This swing is detected as a transfer failure of the substrate B via the rear sensor 88b.
[0033]
As described above, according to the present embodiment, the swing plates 85a and 85b, the coil springs 86a and 86b, and the sensors 88a and 88b are symmetrically disposed with respect to the pair of front and rear pulleys 82 and 83, respectively. By doing so, it is possible to detect a transfer failure of the substrate B with a simple structure without taking a complicated structure as in the related art, and it is possible to easily cope with a specification in which the transfer direction is reversed. it can.
[0034]
Next, referring to FIG. 8 to FIG. Embodiment of the present invention Will be described. As shown in FIG. 8, in the substrate transfer device 34, both the tension pulleys 84a and 84b of the substrate transfer device 34 of the first embodiment are omitted, and a coil spring 89b positioned in front (rear) of the transfer direction is provided. , The coil spring 89a located on the front side (front side) is configured with a large spring force. The second embodiment has the same structure as the first embodiment except that the positions of these elements and the stoppers 87a and 87b are different.
[0035]
FIG. 9 shows a standard specification for transferring the substrate B forward. As shown in FIG. 9, the slack on the rear side of the timing belt 81 is controlled by the coil spring 89b on the drive pulley 82 side via the rocking plate 85b. The front pulling pulls the driven pulley 83 inward, causing the swing plate 85a to largely swing inward against the coil spring 89a. This swing is detected by the sensor 88a as a transfer failure of the substrate B.
[0036]
FIG. 10 shows a special specification for transferring the substrate B backward. In this case, the front and rear coil springs 89a and 89b are replaced with each other, and the positions of the stoppers 87a and 87b are changed to the rocking plates 85a and 85b, respectively. It has been changed upside down. As a result, the tension of the timing belt 81 is maintained by the coil spring 89b on the driven pulley 83 side, and the transfer failure of the substrate is detected by the sensor 88b on the driving pulley 82, as in the standard specification.
[0037]
As described above, according to the second embodiment, it is possible to easily cope with the specification in which the transfer direction is reversed only by replacing the coil springs 89a and 89b and the stoppers 87a and 87b having different spring forces. . Further, the tension pulleys 84a and 84b can be omitted, and the structure can be simplified. The sensors 88a and 88b may be replaced together with the replacement of the coil springs 89a and 89b and the stoppers 87a and 87b. In such a case, one of the sensors 88a and 88b can be omitted.
[0038]
In the present embodiment, the coil spring is hung on the support shaft of each pulley, but may be hung on the swing plate. Further, a slide plate that slides in the transfer direction may be used instead of the swing plate. Further, the structure of the detection means is arbitrary as long as it has the above-described function.
[0039]
【The invention's effect】
As described above, according to the substrate transfer apparatus of the present invention, a substrate transfer failure can be detected with a simple structure, and the structure can easily cope with the specification of reversing the transfer direction of the substrate. Can respond quickly to the needs of Further, the urging means provided on the front side of the substrate is constituted by the urging means provided on the front side with a large urging force with respect to the urging means provided on the front side in the transfer direction. Of the belt can be detected, and the slack generated on the belt can be absorbed by the urging means arranged in front of the belt. Can be prevented from falling off .
[Brief description of the drawings]
FIG. 1 is a front view of an electronic component mounting apparatus equipped with a board transfer device according to one embodiment of the present invention.
FIG. 2 is a plan view of an electronic component mounting apparatus on which the board transfer device of the embodiment is mounted.
FIG. 3 is a perspective view around the substrate transfer device of the embodiment.
FIG. 4 is a plan view around the substrate transfer device of the embodiment.
FIG. 5 Substrate transfer device FIG.
FIG. 6 Substrate transfer device FIG. 3 is a structural diagram showing a standard specification of FIG.
FIG. 7 Substrate transfer device FIG. 2 is a structural view showing a special specification of FIG.
FIG. 8 Example FIG. 2 is a structural view of the substrate transfer device of FIG.
FIG. 9 Example FIG. 2 is a structural view showing standard specifications of the substrate transfer device of FIG.
FIG. 10 Example FIG. 2 is a structural view showing a special specification of the substrate transfer device of FIG.
FIG. 11 is a plan view of a conventional substrate transfer device.
[Explanation of symbols]
1 Electronic component mounting device
31 XY table
32 Loading transport path
33 Unloading transport path
34 Substrate transfer device
71 Feeding member
72 Belt mechanism
81 Timing Belt
82 Drive pulley
83 driven pulley
86a, 86b coil spring
88a, 88b Sensor
B board

Claims (2)

A feeding member configured to be able to move forward and backward in the transfer direction, and a belt mechanism for moving the sending member forward and backward are provided. In a substrate transfer device for transferring from one machine to another machine,
The belt mechanism, a belt to which the feeding member is fixed,
A pair of pulleys that are configured to be able to move minutely in the extending direction of the belt while the belt is stretched,
A pair of urging means for urging each of the pulleys in the belt tension direction,
A pair of detection means for detecting that each of the pulleys has moved in the slack direction of the belt against each of the urging means ,
A substrate transfer device , wherein the urging means disposed on the front side of the substrate is provided with a larger urging force than the urging means disposed on the front side in the transfer direction . The pair of biasing means are each configured by a coil spring, and the coil spring disposed in front of the coil spring disposed in front of the transfer direction is configured by a spring having a large spring force. The substrate transfer device according to claim 1, wherein:

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