JP3546086B2 - Heat pipe radiator - Google Patents

Description

[0001]
[Industrial applications]
The present invention relates to an improvement of a heat pipe radiator manufactured using, for example, a roll bond panel.
[0002]
[Prior art]
2. Description of the Related Art A radiator that mounts an electronic component on a radiator and radiates heat generated from the electronic component through the radiator is known. Electronic components tend to be higher in performance and smaller in size year by year, but the heat generated also increases accordingly, and radiators that dissipate that heat are also required to have higher performance.
[0003]
In general, a heat pipe type radiator in which flat plate surfaces are bonded together leaving a non-bonded portion, and the non-bonded portions are separated between adjacent flat plate surfaces, and a working fluid is sealed in a space formed separately. Is known (JP-A-5-304384).
[0004]
In this type, a heat radiating fin is provided, for example, on the low-temperature side (condensing section) of the heat pipe, and electronic components, for example, are provided on the high-temperature side (evaporating section). Since the heat is transferred to the side and radiated through the radiating fins, this is an extremely effective means as a radiating means.
[0005]
[Problems to be solved by the invention]
However, in the conventional configuration, even if the shape of the radiation fin is improved or the performance on the low temperature side is improved, the surface area (heat transfer area) inside the heat pipe cannot be widened in the first place. It is difficult to improve the thermal performance, and there is a limit in improving the thermal performance of the radiator as a whole.
[0006]
For example, in a radiator using a roll bond panel manufactured by a roll bond manufacturing method, a bulging portion is a circuit, but according to this manufacturing method, a crimping portion is always required, so the entire surface of the panel is a heat pipe circuit. Therefore, the surface area (heat transfer area) inside the heat pipe cannot be widened.
[0007]
Accordingly, an object of the present invention is to provide a heat pipe radiator that can solve the above-mentioned problems of the conventional technology and can improve thermal performance.
[0008]
[Means for Solving the Problems]
According to the first aspect of the present invention, a plurality of spaces formed by joining three or more flat plate surfaces while leaving a non-joined portion, separating adjacent flat plate surfaces at the non-joined portion, and forming a space. In a heat pipe type radiator in which a working fluid is sealed in a portion, a hole for communicating each space portion is provided in a flat plate sandwiched in the middle.
According to a second aspect of the present invention, in the first aspect, a joining portion of each flat plate is shifted on both sides of a flat plate sandwiched therebetween.
According to a third aspect of the present invention, in the first aspect, a joining portion of each flat plate is matched on both sides of a flat plate sandwiched in the middle.
[0009]
[Action]
According to the present invention, when an electronic component or the like is attached to a radiator, heat generated from the electronic component moves to a radiator according to the principle of a heat pipe and is radiated to the outside from there. In this radiator, a flat plate is provided in the middle, and a hole for communicating each space portion is provided in the flat plate sandwiched in the middle, so when the working fluid is sealed in that space, the flat plate sandwiched in the middle The working fluid also comes into contact with the surface of the hole and around the hole. According to this, the surface area (heat transfer area) inside the heat pipe is increased by the surface area of the flat plate sandwiched in the middle and the area around the hole, so that the thermal performance of the radiator is improved.
[0010]
【Example】
Hereinafter, an embodiment of a heat pipe radiator according to the present invention will be described with reference to the accompanying drawings.
[0011]
In FIG. 1, reference numeral 1 denotes a heat pipe radiator. An electronic component (not shown) is fixed to the high-temperature side (evaporating section) of the radiator 1 through a bolt hole 3, and a radiating fin 5 is provided on the low-temperature side (condensing section) of the radiator 1. The high heat generated from the parts is transferred to the low temperature side (condensing section) by a heat pipe described later, and is radiated from the low temperature side through the radiation fins 5.
[0012]
Referring to FIG. 2, radiator 1 is manufactured by a roll bonding method by laminating three aluminum flat plates 10. Here, the term aluminum includes an aluminum alloy in addition to pure aluminum.
[0013]
To explain this manufacturing method, first, a circuit is formed by applying an anti-pressure bonding agent to both surfaces of the intermediate flat plate 10b, the upper and lower flat plates 10a and 10c are overlapped, rolled and pressed, and between the flat plates 10a and 10b, and between the flat plates 10a and 10b. High pressure air is introduced between 10b and 10c to inflate the portion of the circuit as shown. Then, a working fluid having a heat pipe function is sealed in the expanded portion (space), and the circuit is closed.
[0014]
According to this embodiment, a perforated plate having a plurality of perforations 20 is used as the intermediate flat plate 10b.
[0015]
When the working fluid is sealed in the expanded portion (space) by using the flat plate 10b made of the perforated plate, the two circuits A and B formed above and below the intermediate flat plate 10b communicate with each other through the perforation 20. , The two circuits A and B become one circuit, and the circuits A and B are filled with the working fluid.
[0016]
According to this, the surface area (heat transfer area) inside the heat pipe increases by the surface area 10b of the flat plate sandwiched in the middle and the area around the hole 20 so that the heat performance of the radiator 1 is reduced. It can be improved as compared with the conventional one.
[0017]
Further, according to this embodiment, as shown in FIG. 3, since the crimping portions a of the flat plates 10a, 10b, 10c are shifted above and below the flat plate 10b, the entire surface of the panel can be used as a wall of the heat pipe circuit. Therefore, there is an advantage that the surface area (heat transfer area) of the heat pipe can be increased by that much as compared with the conventional one, and the thermal performance of the radiator 1 can be improved.
[0018]
Referring to FIG. 4, the crimping portions a of the flat plates 10a, 10b, and 10c may be aligned above and below the flat plate 10b.
[0019]
According to this manufacturing method, the surface area (heat transfer area) inside the heat pipe can be increased by the surface area 10b of the flat plate interposed therebetween and the area around the hole 20. However, the entire surface of the panel is heated. It cannot be used as a wall for pipe circuits. In this regard, it can be said that the manufacturing method shown in FIG. 4 is inferior to the manufacturing method shown in FIG.
[0020]
Although the radiator 1 manufactured by the roll bond manufacturing method has been described above, the present invention is not limited to the manufacturing method. For example, a perforated plate 10b bent in a rectangular wave shape may be prepared, and flat plates 10a and 10c may be joined to the upper and lower sides of the perforated plate 10b by, for example, brazing.
[0021]
Further, the radiator 1 using three flat plates 10 has been described, but the present invention is not limited to this, and is applicable to the radiator 1 having a multilayer circuit using four or more flat plates 10. May be.
[0022]
Next, another embodiment will be described.
[0023]
Referring to FIG. 5, when the heat radiator 1 is manufactured by the roll bonding method, a pressure-resistant agent is first applied to a portion to be expanded (hatched portion in the figure).
[0024]
Thus, according to this embodiment, of the portion 100 to which the anti-pressing agent is not applied, a portion (for example, an area is increased) 100a which is to be surely pressed after manufacturing, and a portion which does not need to be pressed or pressed. (For example, to reduce the area) 100b. When high-pressure air is introduced into the circuit in this state, as shown in FIG. 6, the portion 100a is securely pressed. However, the portion 100b is deformed halfway in an attempt to compress, but the compressive force is weak due to the small area, so that the portion 100b cannot withstand the bulging pressure and is deformed in an incomplete state, and as a result does not compress.
[0025]
According to this, the crimping force is weak, and the portion 100b that does not need to be crimped or crimped is deformed in a halfway state and protrudes into the circuit, so that the heat transfer area inside the heat pipe increases, In addition, the flow of the working fluid in the circuit is obstructed and disturbed by the portion 100b, and as a result, the flow becomes turbulent. Performance can be improved.
[0026]
Further, the means for projecting the portion 100b into the circuit is very simple because it is merely a bulging process.
[0028]
【The invention's effect】
As is apparent from the above description, according to the present invention, the flat plate sandwiched in the middle is provided with holes for communicating the respective space portions, so that when the working fluid is sealed in the space, the above-described holes are formed. The working fluid also comes into contact with the surrounding area, and the surface area inside the heat pipe (heat transfer area) increases by the surface area of the flat plate sandwiched in the middle and the area around the hole. , Can be improved as compared with the conventional one.
[Brief description of the drawings]
FIG. 1 is a perspective view showing one embodiment of a heat pipe radiator according to the present invention.
FIG. 2 is a partially sectional perspective view showing a section of a heat pipe type radiator.
FIG. 3 is a cross-sectional view of a heat pipe radiator.
FIG. 4 is a view corresponding to FIG. 3, showing another embodiment.
FIG. 5 is a plan view showing still another embodiment.
FIG. 6 is a sectional view taken along line VI-VI of FIG. 5;
[Explanation of symbols]
Reference Signs List 1 radiator 5 radiating fins 10, 10a, 10b, 10c Aluminum flat plate 10b Intermediate flat plate 20 holes

Claims (3)

A heat in which three or more flat plates are bonded together leaving a non-bonded portion, and the non-bonded portions are separated between adjacent flat plate surfaces, and a working fluid is sealed in a plurality of spaces formed separately. In a pipe type radiator,
A heat pipe type radiator characterized in that a hole is provided in a flat plate sandwiched in the middle to communicate each space portion. 2. The heat pipe type radiator according to claim 1, wherein the joining portions of the flat plates are shifted on both sides of the flat plate sandwiched in the middle. 2. The heat pipe type radiator according to claim 1, wherein the joints of the respective flat plates are aligned on both sides of the flat plate sandwiched therebetween.

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