JP3538287B2 - Adhesive for building boards - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to architectural boards,
In particular, the present invention relates to an adhesive for bonding architectural boards whose surfaces are covered with paper, such as gypsum board, which is frequently used as an interior material in recent years.

[0002]

2. Description of the Related Art Conventionally, in the interior construction work of a building structure,
2. Description of the Related Art It is widely practiced to improve fire resistance and fire resistance by overlapping construction boards such as gypsum boards, and to improve sound insulation. For example, thickness 15mm
The wall in which two gypsum boards are laminated on both sides is a fireproof structure wall for one hour, and is also recognized as a sound insulation structure wall.

[0003] When a gypsum board is bonded as described above, a bonding treatment is performed using a polyvinyl acetate emulsion-based adhesive, a so-called woodwork bond and staple. Needless to say, screws and nails are also used for attaching the gypsum board, but in many cases, adhesives and staples are used together in terms of workability and cost.

[0004] In addition, when the unevenness of the wall surface is large, a rubber-based adhesive may be used instead of the emulsion-based adhesive, or an inorganic-based putty or the like used for ordinary wall joint treatment may be used. Can be seen. Of course, on fire prevention and fire resistance performance,
It is not preferable to use a large amount of an organic substance as a main material of the adhesive, and a water glass-based adhesive may be used in some cases.

[0005]

When the gypsum board is stored in a place that is wet with water or humid, or when the storage state is poor, the gypsum board bends and has a habit, resulting in poor smoothness. May be used as is.
In such a case, when the gypsum board is bonded with an emulsion adhesive, the emulsion adhesive drips on the gypsum board surface due to its low viscosity, and the gypsum board does not adhere sufficiently, which is more than necessary. It is necessary to use many emulsion adhesives.

On the other hand, the rubber-based adhesive is viscous and has little dripping on the surface of the gypsum board. However, the adhesive is expensive and contains a solvent, which is not preferable in the working environment. In addition, there is a disadvantage that the open time is short and fine adjustment at the time of bonding cannot be performed.

In addition, many inorganic putties used for joint treatment do not drip on the gypsum board surface and do not contain a solvent in many cases. In recent years, water-glass adhesives may be used instead of organic adhesives due to fire protection and fire resistance problems.However, water-glass adhesives change over time after use, However, there is a problem that the workability is poor.

Accordingly, an object of the present invention is to solve the above-mentioned problems of the prior art, that is, it is applicable to a construction board such as a gypsum board which does not sag on the surface of the construction board and has a large unevenness. It is an object of the present invention to provide an adhesive for architectural boards, which has good workability, is water-soluble, is preferable in working environment, is inexpensive, and has good fireproofing and fireproof performance.

[0009]

The above objects are achieved by the present invention described below. That is, the present invention mainly comprises (i) 55 to 65% by weight of an inorganic powder and (ii) 2 to 7% by weight of a liquid or solid organic resin adhesive, and the inorganic powder comprises:
A mixture of calcium carbonate and mica,
Weight ratio of Um and mica 10: an adhesive for buildings Boards, wherein 0.5-2 der Rukoto.

According to the present invention, there is no droop on the surface of a construction board such as a gypsum board, and it can be applied to a construction board having a large unevenness. It is possible to provide an adhesive for architectural boards which is preferable in terms of work environment, is inexpensive, and has good fire protection and fire resistance.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Next, the present invention will be described in more detail with reference to embodiments of the present invention. One of the main material in the adhesive of the present invention are inorganic powders, and mainly of calcium carbonate fine powder as the inorganic powder is obtained by mixing mica powder thereto. If necessary, clay, talc, and other mineral fine powders can be added to the inorganic powder.

By mixing mica with calcium carbonate, a thixotropic property is imparted to the obtained adhesive, preventing dripping at the time of applying the adhesive,
Shrinkage of the adhesive during drying of the adhesive is suppressed. The amount of the mica used is 5 to 20 parts by weight, preferably 10 parts by weight, based on 100 parts by weight of calcium carbonate.
Further, the above-mentioned mixed inorganic powder is used after being pulverized to a particle size of 100 μm or less, preferably 1 to 70 μm. If the particle size of the inorganic powder exceeds 100 μm, the workability of the adhesive on the surface of a building board such as a gypsum board during use of the adhesive is poor, and the adhesive is undesirably sagged.

The inorganic powder as described above is used in a range occupying 55 to 65% by weight of the whole adhesive of the present invention. When the amount of the inorganic powder is less than the above range, the content of the organic adhesive is relatively large, and the adhesive is sagged, which is insufficient in that it has an adverse effect on fire prevention and fire resistance performance. If the amount of the powder exceeds the above range, the amount of the organic adhesive is relatively reduced, and the adhesive performance of the adhesive is deteriorated, the water retention is deteriorated, and workability is impaired. It is enough.

Another main component of the adhesive of the present invention is a liquid or solid organic resin adhesive. Organic resin adhesives useful in the present invention include ethylene vinyl acetate copolymer, polyvinyl acetate, starch, polyvinyl alcohol, and the like, and these organic resin adhesives are used as aqueous emulsions or aqueous solutions. The amount of these organic resin adhesives used is 2% as solid content in the total amount of the adhesive of the present invention.
Preferably, it is used in a range occupying 〜7% by weight. If the amount used is less than the above range, the adhesive strength of the obtained adhesive is weak and not suitable for practical use, while if the amount used exceeds the above range,
The resulting adhesive is not preferred in terms of fire protection and fire resistance after use.

The adhesive of the present invention includes a liquid medium in which the above-mentioned main material is dispersed or dissolved. When the organic resin adhesive is an aqueous emulsion or an aqueous solution, the liquid medium may be water in the emulsion or the aqueous solution. The amount of the liquid medium used is in the range of 100% by weight in total with the essential components (that is, about 28 to 43% by weight).
The adhesive of the present invention contains the above-mentioned components as essential components. However, if necessary, other adhesives, thickeners, antifreezing agents, antifungal agents, pigments and the like can be mixed and used.

The thickener is preferably used when the organic resin adhesive used has a low viscosity, such as an aqueous emulsion. As the thickener, for example, methyl cellulose,
Cellulose derivatives such as hydroxyethylcellulose, carboxycellulose and carboxymethylethylcellulose are exemplified. These thickeners are preferably used at a ratio of 0 to 2.0 parts by weight per 100 parts by weight of the adhesive of the present invention.

Further, in order to preserve the adhesive when stored for a long period of time and to prevent the occurrence of mold before the adhesive dries after construction, a fungicide such as a benzimidazole compound is added. can do. These antifungal agents are preferably used at a ratio of 0 to 0.5 part by weight per 100 parts by weight of the adhesive of the present invention.

In order to prevent the adhesive from freezing in the cold season, an antifreezing agent such as ethylene glycol or propylene glycol can be added. These antifreezing agents are preferably used at a ratio of 0 to 0.3 parts by weight per 100 parts by weight of the adhesive of the present invention. Further, a coloring pigment can be added to color the adhesive. These pigments are preferably used at a ratio of 0 to 0.1 part by weight per 100 parts by weight of the adhesive of the present invention.

The adhesive of the present invention is prepared into a paste by kneading the above components. The kneading method may be any known method as long as the components are uniformly mixed. Further, at the time of use, the adhesive may be used at a desired softness by further adding water to the adhesive at the time of use. The above adhesive of the present invention is particularly excellent as a bonding adhesive for gypsum board, but is not limited to gypsum board, for example, fiber gypsum board, slag gypsum board, other building boards such as calcium silicate board It is also useful for some types of bonding.

[0020]

Next, the present invention will be described more specifically with reference to examples and comparative examples. Table 1 shows configuration examples of the adhesives of Examples and Comparative Examples, and Table 2 describes the evaluation results of the properties of those adhesives. The ethylene-vinyl acetate copolymer emulsion used in Examples and Comparative Examples had a solid content of about 55%.
It is a commercial product by weight.

[0021]

[Table 1] Adhesive formulation

[0022]

[Table 2] Characteristics of adhesive As shown in the above table, the adhesive of the present invention has no problem in bonding architectural boards such as gypsum board, not only workability but also all other characteristics are equal to or higher than those of the comparative examples, and inexpensive. And an adhesive suitable for bonding architectural boards such as gypsum board.

[0023]

As described above, according to the present invention, there is no sagging on the surface of architectural boards such as gypsum board.
It can also be applied to architectural boards with large irregularities,
It is possible to provide an adhesive for architectural boards that has good workability, is water-based, is preferable in a work environment, is inexpensive, and has good fire prevention and fire resistance.

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-4-89988 (JP, A) JP-A-49-25036 (JP, A) JP-A-57-108173 (JP, A) JP-A-57-108173 108175 (JP, A) JP-A-3-45570 (JP, A) JP-A-7-102226 (JP, A) JP-A-5-25460 (JP, A) JP-A-61-2779 (JP, A) JP-A-7-300576 (JP, A) Japanese Utility Model Showa 50-57214 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) C09J 1/00-201/10

Claims (3)

(57) [Claims] (I) 55 to 65% by weight of an inorganic powder;
(Ii) a liquid or solid organic resin adhesive of 2 to 7% by weight as a main material , wherein the inorganic powder comprises calcium carbonate and mica;
Mixture with calcium carbonate and mica by weight
There 10: 0.5 to 2 der Building boards such adhesive agent characterized Rukoto. 2. The adhesive according to claim 1, wherein the particle size of the inorganic powder is 1 to 100 μm. 3. The adhesive according to claim 1, wherein the organic resin adhesive comprises at least one selected from ethylene vinyl acetate copolymer, polyvinyl acetate, starch and polyvinyl alcohol.