JP3531021B2 - Plastic composition for card molding and plastic card using the same - Google Patents

Plastic composition for card molding and plastic card using the same

Info

Publication number
JP3531021B2
JP3531021B2 JP27113195A JP27113195A JP3531021B2 JP 3531021 B2 JP3531021 B2 JP 3531021B2 JP 27113195 A JP27113195 A JP 27113195A JP 27113195 A JP27113195 A JP 27113195A JP 3531021 B2 JP3531021 B2 JP 3531021B2
Authority
JP
Japan
Prior art keywords
card
plastic
infrared
molding
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP27113195A
Other languages
Japanese (ja)
Other versions
JPH09111091A (en
Inventor
政義 関山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Plastics Inc
Original Assignee
Mitsubishi Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc
Priority to JP27113195A priority Critical patent/JP3531021B2/en
Publication of JPH09111091A publication Critical patent/JPH09111091A/en
Application granted granted Critical
Publication of JP3531021B2 publication Critical patent/JP3531021B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は近赤外線にてカード
挿入の検出を行う銀行カード、ICカード等のプラスチ
ックカードの成形に用いられるプラスチック組成物及び
それを用いたプラスチックカードに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plastic composition used for molding a plastic card such as a bank card or an IC card which detects card insertion with near infrared rays, and a plastic card using the same.

【0002】[0002]

【従来の技術】銀行カード等の内部情報の読み取り、書
き込みに用いられるリーダ・ライタは、挿入されたカー
ドの検出方法として、一般的に特定の波長の近赤外線の
領域の光線を利用し、その受光素子側のフォトトランジ
スタが赤外発光素子側の発光ダイオードからの光の受光
が挿入したカードにより受光されない状態、即ち、近赤
外線の遮蔽、あるいは吸収されることを信号としてスイ
ッチのON−OFFを行う。赤外発光ダイオードとして
は波長940nmの半導体レーザが多く用いられてい
る。
2. Description of the Related Art A reader / writer used for reading and writing internal information of a bank card or the like generally uses a light beam in a near infrared region of a specific wavelength as a method of detecting an inserted card. The phototransistor on the side of the light receiving element receives the light from the light emitting diode on the side of the infrared light emitting element and is not received by the inserted card. To do. A semiconductor laser with a wavelength of 940 nm is often used as an infrared light emitting diode.

【0003】従来、この特定の波長の光線を受光させな
い方法として、ポリ塩化ビニル樹脂シートを貼合せた塩
ビシート貼合せ品の場合は、貼合せるシートの中間に近
赤外線を反射し、遮蔽する金属被膜等を挟む方法やカー
ド芯材とオーバーレイフィルムの間に吸収する色(黒、
金色等)を印刷し、近赤外線を吸収する方法がある。
又、両方を用いる場合もある。
Conventionally, as a method for preventing the reception of light of this specific wavelength, in the case of a PVC sheet laminated product obtained by laminating a polyvinyl chloride resin sheet, a metal that reflects and shields near infrared rays in the middle of the sheets to be laminated. The method of sandwiching the film, etc., and the color to be absorbed between the card core material and the overlay film (black,
There is a method to print near-infrared rays by printing (gold etc.).
Also, both may be used.

【0004】しかし、最近は特にヨーロッパ等で問題と
なっている塩ビの廃棄物問題やICカードのようにIC
モジュール搭載のため凹部を加工する費用の削減、及び
ポリ塩化ビニールシート貼合せ品の耐熱性向上を目的と
してアクリルトリル成分とブタジエン成分とスチレン
成分とからなる樹脂(ABS樹脂)やアクリルトリル
成分とアクリルゴム成分とスチレン成分とからなる樹脂
(AAS樹脂)を用い射出成形でICモジュール搭載の
ための凹部を有したカード用基材を一体成形することが
考えられているが、この場合ABS、AAS樹脂ともに
近赤外線が透過するため遮蔽効果が得られず、カードが
使用できなくなるという問題点があった。
However, recently, especially in Europe and elsewhere, the problem of PVC waste and IC such as IC cards
Reduction of cost of machining a recess for module mounting, and poly consisting of acrylic nitrile component and the butadiene and the styrene component of the vinyl sheet lamination article chloride heat resistance improving purposes resin (ABS resin), acrylic nitrile component It has been considered to integrally mold a card base material having a recess for mounting an IC module by injection molding using a resin (AAS resin) composed of an acrylic rubber component and a styrene component. In this case, ABS, Since both AAS resin transmits near-infrared rays, the shielding effect cannot be obtained and the card cannot be used.

【0005】[0005]

【発明が解決しようとする課題】本発明は、近赤外線に
てカード挿入の検出を行う銀行カード、ICカード等の
プラスチックカードの成形に用いられるプラスチック組
成物及びそれを用いたプラスチックカードを提供するこ
とを目的とする。
DISCLOSURE OF THE INVENTION The present invention provides a plastic composition used for molding a plastic card such as a bank card or an IC card which detects card insertion by near infrared rays, and a plastic card using the same. The purpose is to

【0006】[0006]

【問題を解決するための手段】本発明は、上記従来の問
題点を解決するためのものであって、請求項1の発明
は、アクリルニトリル−ブタジエン−スチレン共重合体
樹脂に赤外線吸収剤を添加したことを特徴とするカード
成形用プラスチック組成物とすることを特徴とする。請
求項2の発明は、アクリルニトリル−アクリルゴム−ス
チレン共重合体樹脂に赤外線吸収剤を添加したことを特
徴とするカード成形用プラスチック組成物とすることを
特徴とする。請求項3の発明は、請求項1〜2に記載の
プラスチック組成物を射出成形法により成形したプラス
チックカードとすることを特徴とする。
The present invention is to solve the above-mentioned conventional problems, and the invention of claim 1 provides an acrylonitrile-butadiene-styrene copolymer resin with an infrared absorber. A plastics composition for card molding characterized by being added. The invention of claim 2 is a plastic composition for card molding, characterized in that an infrared absorbing agent is added to an acrylonitrile-acrylic rubber-styrene copolymer resin. The invention of claim 3 is a plastic card obtained by molding the plastic composition of claims 1 and 2 by an injection molding method.

【0007】[0007]

【発明の実施の形態】以下、本発明の実施例に基づき詳
細に説明する。本発明で使用される近赤外線吸収剤は、
カードのリーダ・ライタに用いられている波長940n
mの波長を吸収し、遮蔽効果の有る市販の近赤外線吸収
剤を用いる。市販の近赤外線吸収剤としては、金属錯体
系、アルミニウム系化合物又はアントラキノン系の近赤
外線吸収剤を使用することができ、SIR−128、S
IR−130、SIR−132、SIR−152、SI
R−159、SIR−162(以上、三井東圧化学株式
会社製)、Kayasorb IR−750、IRG−
002、IR−820B、IRG−022、CY−2、
CY−4、CY−9(以上、日本化薬株式会社製)等を
用いることができる。
BEST MODE FOR CARRYING OUT THE INVENTION In the following, a detailed description will be given based on embodiments of the present invention. Near-infrared absorber used in the present invention,
Wavelength 940n used for card reader / writer
A commercially available near-infrared absorber that absorbs the wavelength of m and has a shielding effect is used. As a commercially available near-infrared absorber, a metal complex-based, aluminum-based compound, or anthraquinone-based near-infrared absorber can be used. SIR-128, S
IR-130, SIR-132, SIR-152, SI
R-159, SIR-162 (above, Mitsui Toatsu Chemicals, Inc.), Kayasorb IR-750, IRG-
002, IR-820B, IRG-022, CY-2,
CY-4, CY-9 (above, Nippon Kayaku Co., Ltd. make) etc. can be used.

【0008】使用する近赤外線吸収剤の配合量は近赤外
線吸収剤の種類、近赤外線遮蔽の要求レベルによって異
なるが、ABS、AAS樹脂100重量部に対し、10
-5〜10重量部、好ましくは10-4〜1重量部、より好
ましくは10-3〜10-1重量部を添加する。添加量が過
度に多くなると、樹脂の耐熱性、成形性が低下し、更
に、コスト面で不利となる。逆に過度に少ないと、近赤
外吸収剤を添加する効果が得られない。
The amount of the near-infrared absorbing agent used varies depending on the type of the near-infrared absorbing agent and the required level of near-infrared shielding, but it is 10 per 100 parts by weight of ABS and AAS resin.
-5 to 10 parts by weight, preferably 10 -4 to 1 part by weight, more preferably 10 -3 to 10 -1 part by weight are added. If the amount added is excessively large, the heat resistance and moldability of the resin will be deteriorated, and further, it will be disadvantageous in terms of cost. On the other hand, if the amount is too small, the effect of adding the near infrared absorber cannot be obtained.

【0009】[0009]

【実施例】以下本発明の実施例を詳細に説明するが、A
BS樹脂とAAS樹脂とも必要な近赤外線の添加量が同
じであること、及び上記三井東圧化学製近赤外線吸収剤
と日本化薬株式会社製の近赤外吸収剤ともグレードを加
味すると同じ添加量となるため、ABS樹脂と三井東圧
化学株式会社製近赤外線吸収剤を用い、三井東圧化学株
式会社製赤外線吸収剤の各グレード別吸収効果の高い波
長域が表1のようになるため、用いる近赤外線波長94
0nmと吸収波長ピークが近いSIR−130グレー
ド、及び最も吸収効果の高い波長域が離れているSIR
−132グレードの2グレードについて説明し、その中
間の吸収波長グレードの説明は省略する。また、本発明
はこれら実施例に限定されるものではない。
EXAMPLES Examples of the present invention will be described in detail below.
The required addition amount of near-infrared rays is the same for both the BS resin and the AAS resin, and the same addition amount for both the near-infrared absorber manufactured by Mitsui Toatsu Chemicals and the near-infrared absorber manufactured by Nippon Kayaku Co., Ltd. Since the ABS resin and near-infrared absorber manufactured by Mitsui Toatsu Chemicals, Inc. are used, the wavelength range with high absorption effect for each grade of infrared absorbers manufactured by Mitsui Toatsu Chemicals is as shown in Table 1. , Near infrared wavelength 94 used
SIR-130 grade with an absorption wavelength peak close to 0 nm, and SIR with the wavelength region with the highest absorption effect distant
Two grades of -132 grade will be explained, and explanation of the absorption wavelength grade in between will be omitted. Further, the present invention is not limited to these examples.

【0010】[0010]

【表1】 ABS樹脂100重量部に対して近赤外線吸収剤グレー
ドSIR−130の添加量を10-6、10-5、10-4
10-3、10-2重量部と変化させた組成物を射出成形機
により加熱混練して、射出成形することにより約0.8
mmの厚みのカードを成形し、成形性及びリーダ・ライ
タを用いて、カード挿入が明らかと判断される検出電圧
が得られるか否かで評価したところ、いずれも成形性は
問題ないものの、添加量が10-6重量部のものは所定の
検出電圧以下であり赤外吸収効果が十分でないが、添加
量が10-5、10-4、10-3、10-2重量部のものはカ
ード挿入が明らかと判断される検出電圧が得られた。
[Table 1] The addition amount of near-infrared absorber grade SIR-130 was 10 -6 , 10 -5 , 10 -4 with respect to 100 parts by weight of ABS resin,
About 0.8 is obtained by heating and kneading the composition changed to 10 -3 and 10 -2 parts by weight with an injection molding machine and injection molding.
A card with a thickness of mm was molded, and the moldability and the reader / writer were used to evaluate whether or not a detection voltage at which the card was inserted can be determined is obtained. The amount of 10 -6 parts by weight is below the predetermined detection voltage and the infrared absorption effect is not sufficient, but the amount of addition is 10 -5 , 10 -4 , 10 -3 , 10 -2 parts by weight is a card. A detection voltage was obtained at which the insertion was judged to be obvious.

【0011】また、ABS樹脂100重量部に対して近
赤外線吸収剤グレードSIR−132の添加量を1
-3、10-2、10-1、1、10、15重量部と変化さ
せた組成物を射出成形機により加熱混練して、射出成形
することにより約0.8mmの厚みのカードを成形し、
成形性及びリーダ・ライタを用いて、カード挿入が明ら
かと判断される検出電圧が得られるか否かで評価したと
ころ、SIR−132を15重量部添加したものは成形
性が悪いが、10-3、10-2、10-1、1、10重量部
添加したものは成形性良好であった。10-3及び15重
量部添加したものは所定の検出電圧以下であり赤外吸収
効果が十分でないが、10-2、10-1、1、10重量部
添加したものはカード挿入が明らかと判断される検出電
圧が得られた。 以上のことから、リーダ・ライタの赤
外発光ダイオードに用いる半導体レーザの波長に近いと
ころの吸収波長をもつ近赤外線吸収剤であれば、ABS
樹脂100重量部に対し、添加量10-5重量部以上添加
すれば、吸収効果があり、成形性も問題がないこと、
又、半導体レーザの波長から離れたところに吸収波長を
もつ近赤外線吸収剤であっても、樹脂100重量部に対
し10-2重量部以上添加すれば吸収効果見られ、添加量
10重量部までは成形性も問題ないことが分かる。
Further, the addition amount of the near-infrared absorbent grade SIR-132 is 1 with respect to 100 parts by weight of the ABS resin.
A composition having a composition of 0 -3 , 10 -2 , 10 -1 , 1 , 10, 15 parts by weight was kneaded by heating with an injection molding machine and injection molded to form a card having a thickness of about 0.8 mm. Then
With formability and writer, it was evaluated by whether or not detection voltage card insertion is determined to clearly obtained, although the SIR-132 has poor formability made by adding 15 parts by weight, 10 - Those having added 3 , 10 -2 , 10 -1 , 1, 10 parts by weight had good moldability. When 10 -3 and 15 parts by weight were added, the infrared absorption effect was not sufficient because the voltage was below the specified detection voltage, but when 10 -2 , 10 -1 , 1, 10 parts by weight were added, it was judged that the card insertion was clear. The detected voltage obtained was obtained. From the above, if a near infrared absorber having an absorption wavelength near the wavelength of the semiconductor laser used for the infrared light emitting diode of the reader / writer, ABS is used.
If the addition amount of 10 −5 parts by weight or more is added to 100 parts by weight of the resin, there is an absorption effect and there is no problem in moldability.
In addition, even with a near-infrared absorber having an absorption wavelength far from the wavelength of the semiconductor laser, if 10 -2 parts by weight or more is added to 100 parts by weight of the resin, the absorption effect is observed, and the addition amount is up to 10 parts by weight. It can be seen that there is no problem in moldability.

【0012】[0012]

【発明の効果】以上の通り、本発明のプラスチック組成
物を用いたカードは、近赤外線の吸収が優れ、近赤外線
にてカード挿入の検出を行う銀行等のキャッシュディス
ペンサー用カードとして用いることができると共に、成
形性が優れる等の利点がある。
INDUSTRIAL APPLICABILITY As described above, the card using the plastic composition of the present invention has excellent absorption of near infrared rays and can be used as a card for a cash dispenser of a bank or the like which detects the insertion of the card by the near infrared rays. At the same time, there are advantages such as excellent moldability.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−270765(JP,A) 特開 平2−80486(JP,A) 特開 平3−284994(JP,A) 特開 平5−306285(JP,A) 特開 平6−172609(JP,A) 特開 平7−179656(JP,A) 特開 平8−92458(JP,A) (58)調査した分野(Int.Cl.7,DB名) C08L 55/02 B42D 15/10 ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-63-270765 (JP, A) JP-A-2-80486 (JP, A) JP-A-3-284994 (JP, A) JP-A-5- 306285 (JP, A) JP-A-6-172609 (JP, A) JP-A-7-179656 (JP, A) JP-A-8-92458 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) C08L 55/02 B42D 15/10

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】アクリルニトリル−ブタジエン−スチレン
共重合体樹脂に赤外線吸収剤を添加したことを特徴とす
るカード成形用プラスチック組成物。
1. A plastic composition for card molding, which comprises an acrylonitrile-butadiene-styrene copolymer resin and an infrared absorber added thereto.
【請求項2】アクリルニトリル−アクリルゴム−スチレ
ン共重合体樹脂に赤外線吸収剤を添加したことを特徴と
するカード成形用プラスチック組成物。
2. A plastic composition for card molding, which is obtained by adding an infrared absorbing agent to an acrylonitrile-acrylic rubber-styrene copolymer resin.
【請求項3】 請求項1〜2に記載の組成物を射出成形
法により成形したプラスチックカード。
3. A plastic card obtained by molding the composition according to claim 1 or 2 by an injection molding method.
JP27113195A 1995-10-19 1995-10-19 Plastic composition for card molding and plastic card using the same Expired - Fee Related JP3531021B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27113195A JP3531021B2 (en) 1995-10-19 1995-10-19 Plastic composition for card molding and plastic card using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27113195A JP3531021B2 (en) 1995-10-19 1995-10-19 Plastic composition for card molding and plastic card using the same

Publications (2)

Publication Number Publication Date
JPH09111091A JPH09111091A (en) 1997-04-28
JP3531021B2 true JP3531021B2 (en) 2004-05-24

Family

ID=17495760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27113195A Expired - Fee Related JP3531021B2 (en) 1995-10-19 1995-10-19 Plastic composition for card molding and plastic card using the same

Country Status (1)

Country Link
JP (1) JP3531021B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1222620B1 (en) * 1999-09-07 2005-11-30 American Express Travel Related Services Company Inc. Transparent transaction card with infrared blocking layer
ATE428993T1 (en) * 2000-07-07 2009-05-15 Gemalto Sa CLEAR DATA CARD
JP2002274087A (en) * 2001-03-15 2002-09-25 Dainippon Printing Co Ltd Transparent card

Also Published As

Publication number Publication date
JPH09111091A (en) 1997-04-28

Similar Documents

Publication Publication Date Title
JP4453162B2 (en) Transparent magnetic card and manufacturing method thereof
US9636857B2 (en) Label for in-mold forming
CA2470547C (en) Laser etched security features for identification documents and methods of making same
EP2374602B1 (en) PET-C based security laminates, method for their manufacture and documents containing said laminates
US20100181754A1 (en) Increasing Thermal Conductivity of Host Polymer Used With Laser Engraving Methods and Compositions
WO2003022574A1 (en) Plastic card
JP3531021B2 (en) Plastic composition for card molding and plastic card using the same
MXPA02005429A (en) Device, system and method for conducting a transaction using a translucent, transparent or semitransparent transaction card.
JP3529919B2 (en) Plastic composition for card molding and plastic card using the same
JP4373169B2 (en) Transparent card
JP5152427B2 (en) Transparent card
JP2013052579A (en) Laser marking sheet for cards
JP3896766B2 (en) Transparent magnetic card
JPH11189708A (en) Resin composition for card
CN1812882A (en) Synthetic resin card and method of producing the same
JP2001180162A (en) Card
JP2000246858A (en) Card
JP5919741B2 (en) Booklet with contactless information media
JPH09123647A (en) Card-shaped storage carrier
JP5445098B2 (en) Card with excellent whiteness and method for producing the same
JP4572659B2 (en) Anti-counterfeit card and reading method thereof
JP2003237266A (en) Card
JP2000062360A (en) Card
JP2003034009A (en) Resin sheet for card and ic card
US20220134708A1 (en) Information security paper

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20031217

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20040209

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20040212

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20040217

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees