JP3514992B2 - Biodegradable foam sheet for IC card, non-contact type IC card and method for manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a biodegradable foam sheet for an IC card, a non-contact type IC card and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, various plastic cards have been used in a wide range, but most of them are used for a relatively short period of time and burned or discarded. Therefore, from the viewpoint of environmental problems, various cards made of biodegradable plastic have been proposed. This flow also applies to a so-called "IC card" that has an IC chip, which has recently been drawing attention.

IC cards are roughly classified into a "contact type IC card" in which contacts with a reader / writer for reading and writing information from the IC chip are exposed on the surface of the card, and an antenna coil and an IC chip are built in the card. There are two types of "non-contact type IC card" in which the information of the IC chip can be read and further rewritten by the induced current generated in the coil when the card passes through the magnetic field.

The conventional manufacturing method of the non-contact type IC card is mainly an injection molding method in which an IC chip and a lube coil for an antenna are fixed in a card-shaped mold and then resin is injected to integrate them. It was manufactured. However, when the IC card is manufactured by this method, the IC chip is damaged by the pressure and temperature at the time of resin injection, and the cost increase due to the necessity of printing each IC card after molding becomes a problem. ing.

When a non-foamed sheet is used, IC
In order to avoid damage to the chips and the like, the recesses for loading the IC chips and the like are cut (hereinafter referred to as "scribbing"), and then the IC chips are loaded into the recesses, or a window portion having the size of the IC chip is punched out. After that, the punching window is loaded with an IC chip, a sheet for hiding the IC chip is stacked on one or both sides of the core sheet, and heat fusion is integrated by heat pressing to form a sheet in which the IC chip and the like are embedded. The way to do is taken. These methods also require a lot of work, and in order to load the IC chip or the like, it is necessary to form a recess slightly larger than the size of the IC chip or punch out the window. Occurs and the smoothness of the card deteriorates. If the non-foamed sheet is not subjected to the zigzag process or the like, the IC chip or the like will be crushed in the hot pressing process and the IC chip or the like will be damaged.

On the other hand, many vinyl-based magnetic cards currently used are printed on one or both sides of a core sheet if necessary, and a magnetic tape is sandwiched between transparent oversheets temporarily attached to the front surface. A method is used in which a large-sized laminated sheet hot-pressed at 100 to 180 ° C. is produced and then cut into a required size. A similar method can be used for manufacturing a non-contact type IC card, and if the PVC card manufacturing facility can be used as it is, the cost for manufacturing can be suppressed without installing a new manufacturing apparatus.

[0007]

As described above, an IC which can be manufactured without damaging the IC chip or the like incorporated therein, and which can be used as it is in the manufacturing equipment for a PVC card.
There has been a demand for biodegradable foam sheets for cards.

[0008]

Means for Solving the Problems The present inventors have completed the present invention as a result of intensive studies to solve the above problems. That is, the gist of the present invention is a biodegradable foamed sheet containing crystalline polylactic acid and an aliphatic polyester having a glass transition temperature of 0 ° C. or lower and a melting point of 80 ° C. or higher , wherein
I characterized by being used for embedding a C chip
It exists in a biodegradable foam sheet for C cards.

In a preferred embodiment of the present invention , the crystalline polylactic acid and the glass transition temperature are 0 ° C. or lower and 80 ° C.
The ratio of the aliphatic polyester having the above melting point is crystalline polylactic acid: aliphatic polyester = 90: 10 to 0: 1.
The biodegradable foamed sheet for an IC card as described above, which is characterized in that it is 00.

As another embodiment of the present invention, a non-contact type IC card in which the antenna loop coil and the IC chip are embedded in the biodegradable foam sheet (A); the antenna loop coil and the IC chip A non-contact type IC card in which the above-mentioned biodegradable foam sheet (A) in which is embedded is used as a core layer, and a biodegradable oversheet (B) is laminated on one or both sides thereof; an antenna loop coil and an IC chip. Is disposed on a biodegradable sheet, the non-contact type IC card described above; the biodegradable oversheet (B) is a crystalline polylactic acid or an aliphatic polyester.
A non-contact type IC card, characterized by containing crystalline polylactic acid mixed with
Mixed with crystalline polylactic acid or aliphatic polyester
Contains crystalline polylactic acid and has a glass transition temperature of 0 ° C
The non-contact type IC card, characterized in that it comprises the following aliphatic polyester 0-40% by weight; biodegradable foam sheet
The glass transition temperature is 0 ° C or less with crystalline polylactic acid
Containing an aliphatic polyester of crystalline polylactic acid and glass
Ratio with aliphatic polyester whose transition temperature is 0 ° C or less
However, crystalline polylactic acid: aliphatic polyester = 90: 10
~ 0: 100 said non-contact type I characterized in that
C card; (a) / (c) / (a), (b) / (a) /
(C) / (a), (b) / (a) / (c) / (a) /
(B), (b) / (c) / (a), (b) / (c) /
(A) / (a), (b) / (c) / (a) / (b),
(B) / (c) / (a) / (a) / (b), (c ') /
(A), (c ') / (a) / (a), (c') / (a)
/ (B) or (c ') / (a) / (a) / (b) layered non-contact type IC card ((a): biodegradable foam sheet (A), (b) ): Biodegradable oversheet (B), (c): Biodegradable sheet on which antenna loop coil and IC chip, or antenna loop coil and IC chip are arranged, (c '): antenna loop coil Biodegradable sheet on which the IC chip and the IC chip are arranged)
Is mentioned.

Furthermore, another as the exemplary embodiment, the antenna loop coil and IC chip or a biodegradable sheet and a loop coil and an IC chip antenna is disposed, crystalline polylactic acid, the glass transition temperature of the present invention Is less than 0 ℃
Glass transition with aliphatic polyester or crystalline polylactic acid
The biodegradable foam is sandwiched between biodegradable foamed sheets (A) containing an aliphatic polyester having a temperature of 0 ° C. or lower , heated and pressurized in an atmosphere sucked to a vacuum state to crush the bubbles, and then the biodegradable foamed product. A method for manufacturing a non-contact type IC card, which is characterized in that the sheet (A) is cooled while keeping the air bubbles crushed; an antenna loop coil and an IC chip, or an antenna loop coil and an IC chip are arranged. Biodegradable sheet with crystalline polylactic acid and glass transition temperature
Aliphatic polyester at 0 ° C or lower, or crystalline polylactic acid
And an aliphatic polyester having a glass transition temperature of 0 ° C. or less
It is sandwiched between the biodegradable foam sheet (A) containing the biodegradable foam sheet (A) and the biodegradable oversheet (B) is provided on one side or both sides of the biodegradable foam sheet (A), and heated and pressed in an atmosphere sucked to a vacuum state. The method for producing a non-contact type IC card, which comprises cooling the biodegradable foam sheet while maintaining the collapsed state of the biodegradable foam sheet; A biodegradable sheet on which an antenna loop coil and an IC chip are arranged is made of crystalline polylactic acid and fat having a glass transition temperature of 0 ° C. or less.
Group polyester or crystalline polylactic acid and glass transition temperature
Sandwiched between a biodegradable foam sheet (A) containing an aliphatic polyester having a degree of 0 ° C. or less and a biodegradable oversheet (B), and heated and pressurized in an atmosphere sucked to a vacuum state to generate air bubbles. After crushing, the biodegradable foam sheet (A) is cooled while maintaining the crushed state of air bubbles; manufacturing method for non-contact type IC card; loop coil for antenna and IC chip, or for antenna the biodegradable sheet and the loop coil and IC chip are disposed, forming
Crystalline polylactic acid, aliphatic poly with a glass transition temperature of 0 ° C or less
Ester or crystalline polylactic acid and glass transition temperature 0
Sandwiched between a biodegradable foam sheet (A) containing an aliphatic polyester having a temperature of ℃ or below and a biodegradable oversheet (B),
A biodegradable oversheet (B) is provided on the remaining surface of the biodegradable foamed sheet (A), and is heated and pressurized in an atmosphere sucked to a vacuum state to crush air bubbles, and then the biodegradation is performed. Method for producing a non-contact type IC card, characterized in that the foamed sheet (A) is cooled while keeping the air bubbles crushed; a biodegradable sheet on which an antenna loop coil and an IC chip are arranged; Crystalline polylactic acid, glass transition
Aliphatic polyester whose temperature is 0 ° C or lower, or crystalline polyester
Polylactic acid with polylactic acid and glass transition temperature below 0 ° C
And a biodegradable foam sheet (A) containing the same, and after heating and pressurizing in an atmosphere sucked to a vacuum state to crush the bubbles, the bubbles of the biodegradable foam sheet (A) are removed. Non-contact type IC card manufacturing method characterized by cooling while maintaining a crushed state; crystalline polylactic acid, glass roll
Aliphatic polyester with a transfer temperature of 0 ° C or less, or crystalline
Polylactic acid and aliphatic polyester with glass transition temperature below 0 ℃
A biodegradable foam sheet (A) containing tell is sandwiched between a biodegradable sheet on which an antenna loop coil and an IC chip are arranged and a biodegradable oversheet (B), and in an atmosphere sucked to a vacuum state. The method for producing a non-contact type IC card is characterized in that after heating and pressurizing the cells to crush air bubbles, the biodegradable foam sheet (A) is cooled while maintaining the air crushed state. To be

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION A foamed aliphatic polyester is used in the biodegradable foam sheet for an IC card of the present invention. Aliphatic polyesters include polylactic acid (60 ° C.) and polyglycolic acid (37 ° C.) having a glass transition temperature of 0 ° C. or higher, specifically room temperature or higher, and a glass transition temperature of 0 ° C.
The following aliphatic polyesters include polyhydroxybutyrate and polyhydroxybutyrate / valilate (copolymers) biosynthesized by microorganisms, and polyesters that can be produced by dehydration-internal polymerization of aliphatic dicarboxylic acids and aliphatic diols. , For example, polybutylene succinate (a host polymer of 1,4-butanediol and succinic acid). The biodegradable foam sheet for an IC card of the present invention preferably contains crystalline polylactic acid or an aliphatic polyester having a glass transition temperature of 0 ° C. or less as a main component.

When the biodegradable foamed sheet for an IC card of the present invention is hot pressed during card molding, most of the foamed portion of the card becomes a layer that disappears or shrinks. However, since the hot pressing is not performed below the thickness of the antenna loop coil and the IC chip, the foamed portion remains in the thickness portion. That is, the biodegradable foam sheet (A) of the non-contact type IC card of the present invention is also in the above-mentioned state when hot pressed. Since the physical properties of the card are derived from the core layer after the disappearance or reduction of the foam together with the overlayer, the disappearance of the foamed portion or the physical properties of the reduced core sheet are important.

When polylactic acid is the only polymer constituting the biodegradable foamed sheet for an IC card according to the present invention, which is the core sheet, the rigidity of the polylactic acid that does not crystallize sharply decreases when it exceeds the glass transition point. However, it begins to flow, which is a drawback in using the card. In order to eliminate this, it is preferable that the polylactic acid component be crystallized. Even if the crystallized polylactic acid becomes slightly soft in the temperature range exceeding the glass transition point, it retains its rigidity and does not flow.
This crystallinity varies depending on the type and proportion of lactic acid that constitutes polylactic acid. Polylactic acid is a poly-L-lactic acid whose structural unit is L-lactic acid, poly-D-lactic acid whose structural unit is D-lactic acid,
There are copolymers that include both L-lactic acid and D-lactic acid.
Poly L-lactic acid or poly D-lactic acid has high crystallinity. In the copolymer, there are amorphous polymers to crystalline polymers depending on the ratio of L-lactic acid and D-lactic acid, and the crystallinity also changes.

The ratio of L-lactic acid and D-lactic acid in the polylactic acid polymer is 100: 0 to 94: 6 or 6:94 to 0: 1.
Outside the range of 00, crystallization does not occur even if heat treatment is performed. Therefore, the crystalline polylactic acid is one in which the ratio of lactic acid constituting the crystalline polylactic acid falls within the above range. A sheet having excellent heat resistance can be obtained by using crystalline polylactic acid.

Further, from the viewpoint of impact resistance, it is preferable to mix a biodegradable aliphatic polyester having a glass transition temperature of 0 ° C. or less with the above-mentioned sheet made of crystalline polylactic acid. In order to improve brittleness, it is necessary to have a flexible component at least at room temperature, and in order to suppress the decrease in rigidity due to the components mixed even if the glass transition temperature of polylactic acid is exceeded, a melting point of at least 80 ° C or higher is required. The aliphatic polyester having is more preferable. A crystalline aliphatic polyester can be mentioned as a material which induces such an effect.

From the viewpoint of impact resistance, the amount of the above-mentioned aliphatic polyester having a glass transition temperature of 0 ° C. or lower is crystalline polylactic acid: aliphatic polyester having a glass transition temperature of 0 ° C. or lower =
It is preferable that the ratio is 90:10 to 0: 100 (weight ratio). That is, an aliphatic polyester having a glass transition temperature of 0 ° C. or lower may be the main component of the biodegradable foam sheet for IC cards. If the content is too small, the effect of impact resistance cannot be sufficiently exerted.

As described above, it has been described that the biodegradable foam sheet for an IC card of the present invention contains polylactic acid.
It is not particularly limited and may be composed only of an aliphatic polyester having a glass transition temperature of 0 ° C. or lower. However, since the aliphatic polyester having these properties generally has a low elastic modulus and lowers the rigidity of the card as a whole,
It is necessary to consider this point. Furthermore, as will be described later, when a transparent oversheet is attached to the surface of the core sheet, it is preferable that this oversheet contains polylactic acid as a main component from the viewpoint of transparency, unless an adhesive is used. It is necessary to heat bond with a hot press. Therefore, since the main component of the oversheet is polylactic acid, it is advantageous that the core sheet (the biodegradable foamed sheet for an IC card of the present invention) also contains a polylactic acid component from the viewpoint of heat fusion, and at least It is preferable to contain 20% by weight or more. If it is less than this, a sufficient heat fusion strength cannot be obtained, and it cannot be bonded only by hot pressing. In that case, it is recommended to use an adhesive or the like.

The biodegradable foam sheet for an IC card of the present invention incorporates an antenna loop coil, an IC chip and the like. Therefore, the foaming ratio of the foamed sheet is set so that the antenna loop coil, the IC chip and the like can be embedded. The value of the foaming ratio is specifically, as long as foaming is performed so that the thickness of the foamed sheet is equal to or greater than the thickness of the antenna loop coil, the chip, etc., but is not particularly limited.
Usually, it is 1.5 or more, preferably 2 times or more. If the expansion ratio of the sheet is low, the sheet is hard and there is a risk of damaging the IC chip or the like during pressing when the thickness of the IC chip or the like used is large. In addition, the IC chip may distort the surface of the card, resulting in poor smoothness. Although the upper limit is not particularly limited, it is determined depending on the type of the aliphatic polyester used, the melt viscosity thereof, the type and amount of the foaming agent, etc. within a range in which the physical properties are not particularly deteriorated.

The type of foaming agent added is not particularly limited, and any compound used in ordinary resin processing can be used. The addition amount of the foaming agent is selected so that a desired expansion ratio can be obtained. Pyrolysis-type blowing agents include ammonium carbonate, azodicarboxylic acid amide compounds, dinitrosopentamethylenetetramine, and the like, and volatile blowing agents include lower alkanes such as propane, butane, n-pentane, and isopentane, and dichlorodifluoromethane. Methane, tetrafluoroethane, trichlorofluoromethane, halogenated hydrocarbons such as methyl chloride, and carbon dioxide and nitrogen can be used. Alternatively, the sheet may be foamed by forcedly injecting an inert gas into the molten resin with an extruder. In addition, it is also possible to use a foaming aid such as a metal oxide or a bubble control agent such as calcium silicate.

In addition, a plasticizer, a heat stabilizer, an anti-blocking agent, a UV absorber, a masking material, a filler and the like may be contained within a range not impairing the characteristics of the sheet of the present invention.
The non-contact type IC card of the present invention is the above biodegradable foam sheet for an IC card in which an antenna loop coil and an IC chip are embedded.

The antenna loop and the IC chip or the like may be embedded according to a known method. For example, the IC chip or the like is temporarily fixed on a biodegradable sheet or a biodegradable foam sheet for an IC card by an adhesive agent. Then, the biodegradable foamed sheet for an IC card and / or the oversheet is overlaid thereon and hot pressed. The adhesive is not particularly limited as long as it can be temporarily fixed, but considering biodegradability, it is biodegradable from natural rubber-based, starch-based and protein-based natural products. A synthetic polymer such as polyvinyl alcohol is preferable. The structure of the heat press and the card will be described later.

In the present invention, the antenna loop and I
The C chip and the like may be directly incorporated in the biodegradable foam sheet for IC cards, but they are adhered to or pre-assembled in the biodegradable sheet, and this biodegradable sheet and the biodegradable foam sheet for IC cards are combined. You may. When the antenna loop, the IC chip, etc. are bonded to the biodegradable sheet, the antenna loop, the IC chip, etc.
It is preferable to combine them so as to come into contact with the biodegradable foam sheet for C card.

Further, in the present invention, the foamed sheet may have one layer, but may have two or more layers. For two or more layers,
The biodegradable sheet on which the antenna loop and the IC chip or the like, or the antenna loop and the IC chip and the like are arranged may be incorporated between two layers or two or more layers of the biodegradable foam sheet for an IC card. The non-contact type IC card of the present invention may be provided with an over sheet on the outside of the foam sheet. The oversheet may be provided on one side or both sides of the foamed sheet.

The biodegradable sheet on which the antenna loop coil and the IC chip are arranged preferably contains crystalline polylactic acid or an aliphatic polyester having a glass transition temperature of 0 ° C. or less as a main component. Further, the ratio of the crystalline polylactic acid and the aliphatic polyester having a glass transition temperature of 0 ° C. or lower is such that the crystalline polylactic acid: the aliphatic polyester having a glass transition temperature of 0 ° C. or lower = 80: 20 to 0: 100 (weight ratio ) Is more preferable. That is, an aliphatic polyester having a glass transition temperature of 0 ° C. or lower may be the main component of the biodegradable sheet. If the content of the aliphatic polyester resin is too small, the impact resistance is not excellent, and cracks and cracks easily occur due to the impact.

From the viewpoint of transparency, the oversheet is preferably polylactic acid, and particularly preferably crystalline polylactic acid. Further, it is preferable to mix the aliphatic polyester contained in the core sheet from the viewpoint of increasing the thermal adhesive strength with the core sheet. By the mixing, the polylactic acid contained in the over layer and the core layer is fused together with the aliphatic polyester contained in the over layer and the core layer, so that the fusion strength can be enhanced. When the polylactic acid is not stretched (orientated), it is preferable to mix the aliphatic polyester from the viewpoint of improving impact resistance as described above.
The mixing amount of the aliphatic polyester is 0 to 40% by weight.
When it exceeds 40% by weight, transparency is lost.

It is preferable that the polylactic acid is oriented and crystallized when the aliphatic polyester is not contained in the oversheet or in a small area. Polylactic acid, as disclosed in JP-A-7-205278,
Stretching increases the strength of the sheet and improves its brittleness. Further crystallization improves the heat resistance and results in a film with a small heat shrinkage, which is advantageous in the process of bonding by hot pressing. Furthermore, it is not necessary to include other aliphatic polyester, or the amount thereof can be suppressed to a small amount, so that a sheet having excellent transparency can be obtained.

The biodegradable foamed sheet for the IC card of the present invention, the biodegradable sheet (the biodegradable sheet for disposing the antenna loop coil and the IC chip) and the polylactic acid used for the oversheet in the present invention are not particularly limited. However, there is an arbitrary method such as an indwelling polymerization method and a ring-opening polymerization method. As the monomer, L-lactic acid, D-lactic acid or a mixture thereof is used in the indwelling polymerization method and a cyclic dimer of lactic acid. The body L-lactide, D-lactide, DL-lactide or a mixture thereof is used in the ring-opening polymerization method. Also, for the purpose of increasing the molecular weight, a small amount of chain extender during polymerization,
For example, a diisocyanate compound, an epoxy compound, an acid anhydride, etc. can also be used.

The preferred weight average molecular weight of polylactic acid is 6
If it is too small, it will be difficult to exhibit practical physical properties, and if it is too large, the melt viscosity will increase and the moldability will be poor. The glass transition temperature of polylactic acid is 60 ° C., and the melting point varies depending on the ratio of L-lactic acid and D-lactic acid, but it has no melting point or is in the range of 100 to 200 ° C.

The crystalline aliphatic polyester having a low glass transition temperature, which is another component constituting the core layer or the overlayer in the non-contact type IC card of the present invention, can improve the impact resistance of polylactic acid, 60 ° C. There is no particular limitation as long as the rigidity is maintained over the range, and two or more kinds may be mixed. Usually, the glass transition temperature is 0 ° C. or lower, preferably −
Those having a temperature of 20 ° C. or lower are used. In order to maintain rigidity above 60 ° C, the melting point (flow start temperature) is 80 ° C.
It has the above effects and is effective.

The above-mentioned aliphatic polyesters currently under development are polyhydroxybutyrate and polyhydroxybutyrate / which are biosynthesized by microorganisms.
There are valilates (copolymers). Further, there is a polyester which can be produced by dehydration-internal polymerization of an aliphatic dicarboxylic acid and an aliphatic diol, for example, polybutylene succinate (an in-polymer of 1,4-butanediol and succinic acid).

Microbial aliphatic polyesters typified by polyhydroxybutyrate are known to be aliphatic polyesters biosynthesized by acetylcoenzyme A (acetyl CoA) in cells such as Alcaligenes eutrophus. There is. This aliphatic polyester is
Mainly poly-β-hydroxybutyric acid (poly3HB), in order to improve the practical properties as a plastic, devised a fermentation process, usually valeric acid unit (H
V), and the copolymerization ratio of poly (3HB-co-3HV) is generally 0 to 40%, and Tm is 1 in this range.
It is 30 to 165 ° C. Instead of HV, 4HB may be copolymerized, or a long chain hydroxyalkanoate may be copolymerized.

A polymer composed of an aliphatic carboxylic acid component and an aliphatic alcohol component represented by polybutylene succinate is composed of the following units. The aliphatic diol unit, which is one of the structural units of the indwelling polymer, is selected from ethylene glycol, propylene glycol, 1,4-butanediol, 1,4-cyclohexanedimethanol and the like. One structural unit, an aliphatic dicarboxylic acid unit, includes succinic acid, adipic acid, suberic acid, sebacic acid,
It is selected from dodecanedioic acid and the like.

There is no particular limitation on the method for producing the inn-containing polymer composed of the aliphatic diol unit and the aliphatic dicarboxylic acid unit.
Any method such as an indwelling polymerization method, a ring-opening polymerization method, or a biological method can be performed. As a monomer, a mixture of at least one or more of each of the above-mentioned diols and dicarbic acid is used in the indwelling polymerization method. In addition, a mixture of at least one kind of diol and at least one kind of dicarboxylic acid is used in the in-house polymerization method,
Examples of oxiranes which are ring-closing compounds of diols and carboxylic acids include ethylene oxide, propylene oxide and tetrahydrofuran.
Examples of the acid anhydride include succinic anhydride and adipic anhydride. It is possible to obtain a crystalline aliphatic polyester having an arbitrary composition by selecting the mixing ratio of the monomers during the polymerization. Further, for the purpose of increasing the molecular weight, a small amount of a chain extender such as a diisocyanate compound, an epoxy compound or an acid anhydride may be used during the polymerization.

The preferred weight average molecular weight of the above aliphatic polyester is 50,000 to 1,000,000. If it is too small, the melt tension will be low, and the sheet when melt extruded will be difficult to pick up, and if it is too large, the melt viscosity will be too high. Inferior in workability.
The glass transition point and melting temperature of the aliphatic polyester are
Although it depends on the composition and the molecular weight, it is usually -60 to 0 ° C.
And about 80 to 170 ° C.

The method for forming a sheet to be the core layer or overlayer of the non-contact type IC card of the present invention is carried out by using polylactic acid and / or an aliphatic polyester having a glass transition point of 0 ° C. or less and other polymers as necessary. Or with additive ingredients,
It may be carried out by a method in which it is put into an extruder to directly produce a sheet, or may be once extruded into a strand shape and cut into pellets, and then put into an extruder again to produce a sheet. Actually, in consideration of the decrease in molecular weight due to decomposition in the extruder, the polylactic acid and the aliphatic polyester are sufficiently dried in advance to remove water, and then melted in the extruder. The melt extrusion temperature is appropriately selected in consideration of the melt temperature and composition of the polymer in the composition, but is usually 100 to
It is selected from the range of 250 ° C. The manufacturing method of the foam sheet is
As described above, a predetermined amount of the foaming agent is mixed and melted in the extruder to simultaneously generate an inert gas. Since bubbles are suppressed and small in the extruder because it is under high pressure, it is kept at atmospheric pressure where molten resin is discharged from the die, the bubbles become large in the molten resin, and a foam can be obtained.

The polymer composition melt-molded into a sheet shape including the foamed sheet is brought into contact with a rotating casting drum to be cooled. Although the temperature of the casting drum varies depending on the kind and composition of the polymer in the composition, usually 60 ° C. or lower is suitable. At higher temperatures, the polymer sticks to the casting drum and cannot be removed. When the sheet is stretched, it is preferable that the polylactic acid portion is made substantially amorphous by quenching so that crystallization of the polylactic acid portion is promoted and spherulites do not develop.

Next, the case where the sheet is stretched and heat-treated will be described. The stretching ratio of the sheet is, for example, longitudinal (longitudinal)
The stretching temperature is appropriately selected in the range of 1.5 to 5 times, preferably 2 to 4 times in the transverse direction and the transverse (width) direction, and the stretching temperature is selected in the range of 50 to 90 ° C, preferably 55 to 80 ° C. The stretching step is roll stretching in which the sheet is stretched between two rolls having different peripheral speeds, and / or tenter stretching in which the sheet spacing is extended while gripping the sheet with clips using a tenter. Done by In the case of biaxial stretching, either simultaneous or sequential stretching method may be used. In the case of the sequential biaxial stretching method, the in-plane orientation degree Δn of the sheet after the first stage stretching is 3.0 × 10 ⁻³ to 30.
× 10 ⁻³ , preferably 5.0 × 10 ⁻³ to 30 × 10
It is preferably ⁻³ . If smaller than this range,
If the tensile strength and elongation are insufficient, and if the tensile strength and elongation are too large, problems such as breakage of the sheet during the second stage stretching occur.

The tenter stretching method is advantageous because it can be heat-set in the tenter after the sheet is stretched by the tenter. In the heat setting, for example, the heat shrinkability of the sheet can be controlled (suppressed) by performing heat treatment for 3 seconds or more within the temperature range of the glass transition point to the melting point (Tm).

The non-contact type IC card of the present invention comprises (1) two or more biodegradable sheets each having a biodegradable sheet on which an antenna loop coil and an IC chip or an antenna loop coil and an IC chip are arranged. (2) Antenna loop coil and IC chip, or antenna, sandwiched between foam sheets, evacuated in a vacuum state by applying heat and pressure to crush bubbles in the foam sheet, cooled to room temperature, and punched into a card shape. Biodegradable sheet on which the loop coil for application and the IC chip are arranged is sandwiched between two or more biodegradable foam sheets, and a biodegradable oversheet is provided on one side or both sides of the biodegradable foam sheet, and a vacuum is applied. In the aspirated state,
(3) Biodegradation in which antenna loop coil and IC chip or antenna loop coil and IC chip are arranged by heating and applying pressure to crush air bubbles in the foam sheet, cooling to room temperature, and punching into a card shape. Sandwich the biodegradable foam sheet and biodegradable oversheet,
(4) Antenna loop coil and IC chip, or antenna loop coil and IC, after heating in a vacuum and applying pressure to crush air bubbles in the foam sheet, cooling to room temperature, and punching into a card shape. The biodegradable sheet on which the chip is arranged is sandwiched between the biodegradable foam sheet and the biodegradable oversheet, the biodegradable oversheet is provided on the remaining surface of the biodegradable foam sheet, and the sheet is sucked into a vacuum. In this state, heat and apply pressure to crush the bubbles in the foam sheet, cool to room temperature, and punch into a card shape. (5)
The biodegradable sheet on which the antenna loop coil and the IC chip are arranged and the biodegradable foam sheet are overlapped, and in a state of being sucked in a vacuum, heat and pressure are applied to crush air bubbles in the foam sheet, and the temperature is kept at room temperature. After cooling down, punch into a card shape,
Alternatively, (6) the biodegradable foam sheet is sandwiched between the biodegradable sheet on which the antenna loop coil and the IC chip are arranged and the biodegradable oversheet, and heated and pressure is applied in a state of being vacuumed. Crush air bubbles in the foam sheet,
It is obtained by punching into a card shape after cooling to room temperature.

The loop coil for the antenna, the IC chip, etc. are set as one set, and a large number of sets of IC chips, etc. may be arranged at equal intervals on the polymer layer in consideration of the desired card size and the like. The loop coil for the antenna can have the wire diameter and the number of turns of the coil appropriately selected according to the usage of the card.

The thickness of the card base material of the present invention varies depending on the use, but in the case of cash cards and credit cards, thick ones of about 500 μm to 900 μm, and in the case of telephone cards and prepaid cards. For this, a thin one having a thickness of about 50 to 350 μm is used.
The thickness of the over layer is 20 to 140 μm for a thick one,
Even a thin one is preferably about 20 to 100 μm, but there is no particular limitation.

[0043]

EXAMPLES The present invention will be described in detail below with reference to examples. The measurement and evaluation shown in the examples were carried out under the following conditions. (1) Measurement of glass transition temperature Tg and melting point Tm of polylactic acid and aliphatic polyester It was measured using a differential scanning calorimeter DSC-7 manufactured by Perkin Elmer. Set 10 mg of sample and raise temperature 10
The temperature was raised to 200 ° C at a rate of ° C / min, and the temperature was maintained for 2 minutes to completely melt the sample. Temperature drop rate at that time 10 ℃
The melting endothermic peak temperature appearing in the DSC curve when the temperature was lowered at 1 / min was defined as the melting point Tm, and the melting point was determined based on JISK7122. Further, the temperature is continuously lowered, and once lowered to -60 ° C and held for 2 minutes, the temperature is raised again at 10 ° C / min, and JISK71 is used.
21 based on the glass transition temperature T
It was calculated as g. Liquid nitrogen was used as the cooling medium for the measurement at 0 ° C or lower.

(2) Damage to IC chip, etc. Check if the IC chip, etc. in the card laminated and stuck by a heat press is installed correctly, is not bent or bent, and visually observes it. did. When it was good, it was marked with O, and when it was damaged, it was marked with X.

(3) Sharpness of Printed Part It was visually observed whether the letters / designs printed on the surface (back surface) of the over layer contacting with the core layer can be clearly seen through the over layer after forming a card. The ones that looked clear were marked with a circle, and those that looked cloudy were marked with a cross.

(4) JIS X63 credit card standard with heat resistant magnetic stripe
In accordance with No. 10, when immersed in warm water of 60 ° C. for 5 minutes, the surface of the card was observed to show change and shrinkage. Furthermore, the same evaluation was performed in hot water at 80 ° C. This test gives an indication of the heat resistance of the card. Those that gave good results were marked with a circle, and if there was a problem, they were marked with a cross.

(5) Impact strength Credit card standard with magnetic stripe JISX63
According to 10, the impact strength was measured. When a card was placed on a solid horizontal plate and a 500 g steel ball was dropped onto it from a height of 30 cm, the card was not cracked or cracked, and was marked as ◯, and when it was marked as x.

(6) Fusing of the over layer and the core layer with a fusible heat press, a cut is made in a card which is laminated and bonded, and the card is peeled by hooking with a nail, and then pulled with both hands.
The peeling condition was checked. Those that are strongly fused are indicated by ◯, those that are slightly weak are indicated by Δ, and those that can be easily peeled off are indicated by x.

(7) Comprehensive Evaluation From the evaluation results of the above (2) to (6), one having at least one item marked with x is marked with x, and other than that marked with o. Those marked with "X" have low practical utility, and those with "○" have high practicality.

[Production of Sheet] Production Example 1: Sheet No. Preparation of 1 Polylactic acid obtained by ring-opening polymerization of lactide of L-lactic acid (D-lactic acid content of 1% or less) (trade name: Lacty 100
0, manufactured by Shimadzu Corporation, was thoroughly dried to remove water, and then the cylinder temperature was 210 ° C and the die temperature was 200 ° C.
Was extruded onto a cooling roll having a surface temperature of 58 ° C. using a T-die extruder to obtain a sheet having a thickness of 100 μm.

Production Examples 2 and 3: Sheet No. Preparation of a few Polylactic acid (Lacty 1000) and polybutylene succinate / adipate copolymer (trade name: Bionole # 30)
No. 01, Showa High Polymer Co., Ltd.) to 20% by weight and 50% by weight, and extruded into a strand shape while melt-kneading with a twin-screw extruder in the same direction at a cylinder temperature of 210 ° C. and a die temperature of 200 ° C. and rotated. It was cut into chips with a blade. After sufficiently drying this chip to remove water,
Using a T-die extruder at a cylinder temperature of 210 ° C. and a die temperature of 200 ° C., it was extruded onto a cooling roll having a surface temperature of 58 ° C. to obtain a sheet having a thickness of 100 μm.

Production Example 4: Sheet No. Production Sheet No. 4 A transparent sheet made of polylactic acid and having a thickness of about 700 μm was obtained in the same manner as in the production of 1. This sheet was preheated with a metal roll and then stretched 2.5 times in the machine direction between the rolls having different peripheral speeds while being heated with an infrared heater. Subsequently, it was laterally stretched 3.0 times with a tenter and subsequently heat-treated in the tenter to obtain a stretched and heat-fixed sheet having a thickness of 100 μm. The conditions for stretching and heat treatment were as follows. Longitudinal stretching: stretching temperature of 75 ° C., stretching ratio of 2.5 times Horizontal stretching: stretching temperature of 72 ° C., stretching ratio of 3.0 times Heat treatment: heat treatment temperature of 130 ° C., heat treatment time of 20 seconds

Comparative Example 1: Sheet No. Preparation of 5 Polylactic acid (Lacty 1000) 80% by weight and Bionole # 3001 20% by weight, and further rutile titanium dioxide (trade name: TR-700) Fuji Titanium Industry Co., Ltd.
Was mixed into a strand shape while melt-kneading with a twin-screw extruder in the same direction at a cylinder temperature of 210 ° C. and a die temperature of 200 ° C., and was cut into chips with a rotary blade. The chips were sufficiently dried to remove water, and then extruded onto a cooling roll having a surface temperature of 50 ° C at a cylinder temperature of 210 ° C and a die temperature of 200 ° C to obtain a sheet having a thickness of 280 µm. It was

Examples 1 to 4: Sheet No. Production of 6-9 Polylactic acid (Lacty 1000) and Bionore # 300
1, and titanium oxide were mixed in the ratios shown in Table 2, and were extruded into a strand shape while being melt-kneaded with a twin-screw extruder in the same direction at a cylinder temperature of 210 ° C and a die temperature of 200 ° C, and cut into chips with a rotary blade. did. After the chips were sufficiently dried to remove water, the chips were put into an extruder together with the blowing agent in the amounts shown in Table 2, and the cylinder temperature was set to 200.
℃, the die temperature 190 ℃, using a T-die, surface temperature 4
It was extruded on a 5 ° C. cooling roll to obtain a sheet having a thickness of 550 μm. The expansion ratios were all set to be approximately twice.

Example 5: Sheet No. In place of Production Lacty 1000 of No. 10, as shown in Table 1, polylactic acid containing 8% of D-lactic acid in the polymer component was used. A foamed sheet was produced in the same manner as in 6. This polylactic acid is a polymer that does not crystallize.

Examples 6 to 13 and Comparative Example 2: Card molding (lamination) The obtained foam core sheet was cut into a width of 30 cm and a length of 40 cm, and a copper wire having a wire diameter of 0.15 mm was circulated 4 times 4 times. A loop coil for a winding antenna and IC chips having a size of 5 m x 5 mm and a thickness of 0.35 mm are arranged at equal intervals in consideration of a desired card size, and temporarily fixed with a cyanoacrylate-based instant adhesive. , Foamed core sheets of similar size were stacked so as to sandwich the IC chip and the like. Furthermore, the image was printed on the back side using a silk printing machine, 30 cm x 4
These foam core sheets were sandwiched between two 0 cm oversheets, one on each side of the foam core sheets, and a total of two chromium-plated steel sheets. Then, under an atmosphere sucked in a vacuum, the temperature and the pressure shown in Table 3 and the pressure are 10 kg / c.
This state was maintained under the condition of m ² until the bubbles in the foamed sheet were completely collapsed.

Thereafter, while keeping the air bubbles crushed, it was cooled to room temperature and cut out into a card shape to obtain a non-contact type IC card shown in Table 3 having a three-layer structure of over layer / core layer / over layer. It was The polylactic acid of the over layer and the core layer undergoes crystallization in this hot pressing step, and becomes a card with substantially improved heat resistance. The combination of the oversheet and the core sheet is as shown in Table 3. Table 3 also shows the respective evaluation results of the obtained cards.

However, in Examples 7 and 9, an adhesive was used for laminating the oversheet and the core sheet. In the core sheet used in Example 7, the main component resin is bionore #
A sheet made of 3001 alone melts at a temperature exceeding 100 ° C., and the core layer begins to flow, so the temperature cannot be raised. In addition, an adhesive was used because sufficient fusion strength could not be obtained at a temperature of 100 ° C. or lower. Furthermore, in Example 9, when the temperature at which fusion can be performed is raised to 160 ° C., the heat shrinkage of the oversheet increases, and a card with large distortion is obtained, so the same adhesive was used.

On both sides of the core layer, 100 parts by weight of a copolyester type hot melt adhesive Byron 300 (manufactured by Toyobo Co., Ltd.) and 8 parts by weight of a polyisocyanate compound Desmodur L-75 (manufactured by Bayer) are mixed. The toluene / MEK solution prepared above was applied and sufficiently dried at room temperature to volatilize the solvent, and the adhesive was adjusted to have a thickness of about 3 μm. Then, it was sandwiched between two overlayers shown in Examples 2 and 4, and the press temperature was set to 90 ° C. and 110 ° C., respectively, and a card was obtained at a pressure of 5 kg / cm ² .

[0060]

[Table 1]

[0061]

[Table 2]

* 1: Polylactic acid (C) containing about 8% D-lactic acid and Bionole # 3001 (B) at a ratio of 80/20. * 2: Biaxially stretched and oriented sheet Product Nos. 1 to 4, Ratio 1, Ex 1 to 5 in Table 2 mean Production Examples 1 to 4, Comparative Example 1 and Examples 1 to 5, respectively. The blowing agent in Table 2 is azodicarboxylic acid amide.

[0063]

[Table 3]

The solids 6 to 13 in Table 3 represent Examples 6 to 13, and the ratio 2 represents Comparative Example 2. As shown in Table 3, in Comparative Example 2, since the IC chip and the like were sandwiched between the hard core sheets, the IC chip and the like in the finished card were bent and damaged. When the foamed sheet was used, the IC chip and the like were not damaged. From the above results, it was proved that the biodegradable foam sheet for an IC card of the present invention can be manufactured without damaging the IC chip and the like.

[0065]

The biodegradable foam sheet for an IC card according to the present invention enables the IC card to be manufactured without damaging the IC chip and the like, and the PVC card manufacturing equipment can be used as it is.

Front page continuation (51) Int.Cl. ⁷ Identification code FI B32B 27/36 C08L 101/16 C08L 101/16 67:04 C08L 67:04 G06K 19/00 K (58) Fields investigated (Int.Cl. ⁷ , DB name) C08J 9/04 G06K 19/00 B42D 15/10 B32B 5/18

Claims (16)

(57) [Claims] 1. A crystalline polylactic acid having a glass transition temperature of 0.
A biodegradable foamed sheet containing an aliphatic polyester having a melting point of 80 ° C or lower and having an IC chip
A biodegradable foam sheet for an IC card, which is used for embedding . 2. An aliphatic polyester is a crystalline aliphatic polyester.
I according to claim 1, characterized in that it is a reester.
Biodegradable foam sheet for C cards. 3. A crystalline polylactic acid and a glass transition temperature of 0.
An aliphatic polyester having a melting point of 80 ° C. or higher and crystalline polylactic acid: aliphatic polyester = 90:
The biodegradable foam sheet for an IC card according to claim 1 or 2, wherein the biodegradable foam sheet is contained in a ratio of 10 to 0: 100. 4. A crystalline polylactic acid having a glass transition temperature of 0 ° C.
The following aliphatic polyester or crystalline polylactic acid and
A non-contact type IC card in which a loop coil for an antenna and an IC chip are embedded in a biodegradable foam sheet (A) containing an aliphatic polyester having a lath transition temperature of 0 ° C. or lower . 5. Crystalline polylactic acid having a glass transition temperature of 0 ° C.
The following aliphatic polyester or crystalline polylactic acid and
Including an aliphatic polyester having a lath transition temperature of 0 ° C. or less
A non-contact type IC card in which a biodegradable foam sheet (A) having an antenna loop coil and an IC chip embedded therein is used as a core layer, and a biodegradable oversheet (B) is laminated on one or both sides of the core layer. 6. The non-contact type IC card according to claim 4, wherein the antenna loop coil and the IC chip are arranged on a biodegradable sheet. 7. The non-contact type IC according to claim 5, wherein the biodegradable oversheet (B) contains crystalline polylactic acid or crystalline polylactic acid mixed with an aliphatic polyester. card. 8. The biodegradable oversheet (B) contains crystalline polylactic acid or crystalline polylactic acid mixed with an aliphatic polyester, and the aliphatic polyester having a glass transition temperature of 0 ° C. or lower is 0 to 40. The non-contact type IC card according to claim 5 or 6 , wherein the non-contact type IC card is contained in a weight percentage. 9. The biodegradable foam sheet is crystalline polylactic acid.
And an aliphatic polyester having a glass transition temperature of 0 ° C. or less
Contains crystalline polylactic acid and fats with a glass transition temperature of 0 ° C or less
The ratio with the aliphatic polyester is crystalline polylactic acid: aliphatic
Polyester = 90:10 to 0: 100
The non-contact type IC according to any one of claims 4 to 8.
card. 10. (a) / (c) / (a), (b) /
(A) / (c) / (a), (b) / (a) / (c) /
(A) / (b), (b) / (c) / (a), (b) /
(C) / (a) / (a), (b) / (c) / (a) /
(B), (b) / (c) / (a) / (a) / (b),
(C ') / (a), (c') / (a) / (a),
(C ') / (a) / (b) or (c') / (a) /
The non-contact type IC card according to claim 4, which has a layer structure of (a) / (b). (A): Biodegradable foamed sheet (A) (b): Biodegradable oversheet (B) (c): Antenna loop coil and IC chip, or antenna loop coil and IC chip raw Decomposable sheet (c '): Antenna loop coil and IC chip
Placed biodegradable sheet. 11. A biodegradable sheet on which an antenna loop coil and an IC chip, or an antenna loop coil and an IC chip are arranged, is made of crystalline polylactic acid or glass roll.
Aliphatic polyester with a transfer temperature of 0 ° C or less, or crystalline
Polylactic acid and aliphatic polyester with glass transition temperature below 0 ℃
It is sandwiched between biodegradable foam sheets (A) containing tellurium, heated and pressurized in an atmosphere sucked to a vacuum state to crush the bubbles, and then crushed the bubbles of the biodegradable foam sheet (A). A method for manufacturing a non-contact type IC card, which comprises cooling while maintaining the above state. 12. A biodegradable sheet on which an antenna loop coil and an IC chip, or an antenna loop coil and an IC chip are arranged, is made of crystalline polylactic acid or glass roll.
Aliphatic polyester with a transfer temperature of 0 ° C or less, or crystalline
Polylactic acid and aliphatic polyester with glass transition temperature below 0 ℃
It is sandwiched between biodegradable foam sheets (A) containing tellurium, and a biodegradable oversheet (B) is provided on one side or both sides of the biodegradable foam sheet (A), and heated in a vacuumed atmosphere. And a method for manufacturing a non-contact type IC card, which comprises applying pressure to crush air bubbles, and then cooling the biodegradable foam sheet while maintaining the air crushed state. 13. A biodegradable sheet on which an antenna loop coil and an IC chip, or an antenna loop coil and an IC chip are arranged, is made of crystalline polylactic acid or glass roll.
Aliphatic polyester with a transfer temperature of 0 ° C or less, or crystalline
Polylactic acid and aliphatic polyester with glass transition temperature below 0 ℃
It is sandwiched between a biodegradable foam sheet (A) containing tellurium and a biodegradable oversheet (B), heated and pressed in an atmosphere sucked to a vacuum state to crush air bubbles, and then the biodegradability is obtained. A method for manufacturing a non-contact type IC card, which comprises cooling the foamed sheet (A) while maintaining the crushed state of bubbles. 14. A biodegradable sheet having an antenna loop coil and an IC chip, or an antenna loop coil and an IC chip disposed on a crystalline polylactic acid or glass roll.
Aliphatic polyester with a transfer temperature of 0 ° C or less, or crystalline
Polylactic acid and aliphatic polyester with glass transition temperature below 0 ℃
It is sandwiched between a biodegradable foam sheet (A) containing tellurium and a biodegradable oversheet (B), a biodegradable oversheet (B) is provided on the remaining surface of the biodegradable foam sheet (A), and a vacuum is provided. Non-contact type, characterized in that after heating and pressurizing in an atmosphere sucked up to a state to crush the bubbles, the biodegradable foam sheet (A) is cooled while maintaining the crushed state of the bubbles. IC card manufacturing method. 15. A biodegradable sheet on which an antenna loop coil and an IC chip are arranged, and crystalline polylactic acid,
Aliphatic polyester having a glass transition temperature of 0 ° C. or lower, or
Is crystalline polylactic acid and fat with a glass transition temperature of 0 ° C or lower.
A biodegradable foam sheet (A) containing a group polyester is superposed on the biodegradable foam sheet (A), which is then heated and pressed in an atmosphere sucked to a vacuum state to crush the air bubbles. A method for manufacturing a non-contact type IC card, which comprises cooling while maintaining a crushed state. 16. A crystalline polylactic acid having a glass transition temperature of 0.
℃ or less aliphatic polyester or crystalline polylactic acid
Containing an aliphatic polyester having a glass transition temperature of 0 ° C. or less
The biodegradable foam sheet (A) is sandwiched between the biodegradable sheet having the antenna loop coil and the IC chip and the biodegradable oversheet (B), and heated in an atmosphere sucked to a vacuum state. A method for manufacturing a non-contact type IC card, which comprises applying pressure to crush air bubbles and then cooling the biodegradable foam sheet (A) while maintaining the air crushed state.