JP3514479B2 - Gap amount detection device for laser processing machine - Google Patents

Gap amount detection device for laser processing machine

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Publication number
JP3514479B2
JP3514479B2 JP34549392A JP34549392A JP3514479B2 JP 3514479 B2 JP3514479 B2 JP 3514479B2 JP 34549392 A JP34549392 A JP 34549392A JP 34549392 A JP34549392 A JP 34549392A JP 3514479 B2 JP3514479 B2 JP 3514479B2
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Prior art keywords
sensor
workpiece
holding member
machining
laser
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JPH06170572A (en
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勇一 森田
明夫 島田
和裕 森川
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株式会社日平トヤマ
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  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 【0001】 【産業上の利用分野】この発明は、レーザ加工において
加工ノズル先端と被加工物との間隔を制御するために、
そのギャップ量を検知するレーザ加工機のギャップ量検
出装置に関する。 【0002】 【従来技術】従来、金属を切断するレ−ザ加工に際して
は、加工ノズル先端と被加工物であるワーク間の間隔を
一定に保つために、加工ノズル先端にギャップセンサを
設け、このセンサからの信号により加工ヘッドの位置を
制御していた。通常このギャップセンサは、被加工物に
検知部を接触させて上記ギャップを検出するタッチセン
サが用いられているが、材質によってはこのタッチセン
サにより傷がつき易いものがあるため、そのような場
合、被加工物とは被接触のギャップセンサ用いられてい
る。このギャップセンサには、特開昭61−18288
0号や特開昭62−156090号公報に開示されてい
る様に、加工ノズルの周囲に設けられた電極とワークと
の間の静電容量を測り、その静電容量の変化を検知して
加工ノズルの高さを制御しているものがある。そして、
この静電容量の測定に際しては、加工時の熱やプラズマ
の発生等によって、電極とワークとの間隔にかかわらず
静電容量が変動する場合がある。そこで、上記各公報に
開示されたギャップセンサのように、これらの測定誤差
やノイズ成分を除去するための、補償用のセンサ電極が
設けられているものがある。 【0003】 【発明が解決しようとする課題】しかし、上記従来の技
術の場合、加工ヘッド先端部に、測定用のセンサ電極と
補償用のセンサ電極とを設けることはセンサ部全体の構
成が大きくなってしまうという問題があった。しかも、
測定用センサ電極と補償用センサ電極とは、理想的には
同一の条件で取りつけられるべきであり、位置ができる
だけ近接していることが好ましいが、上記従来の技術の
場合、測定用センサ電極と補償用センサ電極は、形状や
位置が大きく異なる状態で取りつけられており、補償用
センサ電極の機能が十分に生かされないものであった。 【0004】この発明は上記従来の技術の問題点に鑑み
てなされたもので、小型で簡単な構成であり、正確なギ
ャップ検出が可能なレ−ザ加工機のギャップ量検出装置
を提供することを目的とする。 【0005】 【課題を解決するための手段】この発明は、レーザ光を
被加工物に照射して所定の加工を行うレーザ加工装置の
加工ヘッドに設けられるレーザ加工機のギャップ量検出
装置であって、この加工ヘッドとともに移動可能なセン
サ取付部材が設けられ、このセンサ取付部材に、リング
状の絶縁部材上面全周に補償用センサ電極が形成され下
面全周に上記被加工物との間の静電容量を検知する測定
用センサ電極が形成されたセンサ部材が設けられたレー
ザ加工機のギャップ量検出装置である。 【0006】さらに、上記センサ取付部材に上記加工ヘ
ッドに対して相対的に移動自在に設けられたセンサ保持
部材を設け、このセンサ保持部材の移動を検知する偏位
検知手段を設けるとともに、このセンサ保持部材を上記
加工ヘッドに対して所定位置に固定する固定手段を取り
付け、この固定手段により上記センサ保持部材を固定し
た状態で、上記被加工物との間に所定間隔を空けて上記
静電容量を検知するセンサ部材を取り付け、上記固定手
段による固定を解除してセンサ保持部材を移動自在にし
た状態で、上記偏位検知手段を作動させ上記被加工物に
先端部が当接する検知部材を上記センサ保持部材に取り
付けたレーザ加工機のギャップ量検出装置である。 【0007】 【作用】この発明のレーザ加工機のギャップ量検出装置
は、リング状の絶縁部材の両面に補償用センサ電極と測
定用センサ電極とが形成されたセンサ部材を設け、この
リング中央部に加工ノズルを挿通させて取り付けたの
で、補償用センサ電極と測定用センサ電極とがほぼ同じ
条件で取り付けられ、補償用センサ電極によって正確に
測定用センサ電極による測定値の補償が可能になり、構
造も簡単なものにすることができるものである。 【0008】またこの発明のレーザ加工機のギャップ量
検出加工装置は、静電容量を検知するセンサ部材と上記
被加工物に先端部が当接する検知部材とを、同一のセン
サ保持部材に対して着脱可能に設け、選択的に使用する
ことができ、加工条件や被加工物に合わせて、加工ノズ
ルの位置の適切な制御を可能にするものである。 【0009】 【実施例】以下、この発明の実施例について図面に基づ
いて説明する。この実施例のレ−ザ加工機のギャップ量
検出装置は、図1に示すように、図示しないレーザ発振
器から出射したレーザ光が導かれ、被加工物であるワー
ク10に対面して設けられる加工ヘッド12に取り付け
られている。加工ヘッド12の先端部には、レーザ光を
被加工物10に照射する加工ノズル14が設けられてい
る。この加工ヘッド12は、位置制御機構16に取り付
けられ、位置制御機構16のX軸モータ17、Y軸モー
タ18、Z軸モータ19により、X,Y,Z軸の3軸方
向に位置制御可能に設けられている。位置制御機構16
の各モータ17,18,19は、サーボ制御部20に接
続され、加工ヘッド12の移動方向制御を行うものであ
る。さらに、このサーボ制御部20は、加工ヘッド12
の位置を制御するギャップコントローラ23と、レーザ
発振を制御するレーザコントローラ24とから成る制御
装置22に接続されている。 【0010】加工ヘッド12には、ブラケット26が固
定され、このブラケット26に、偏位検知手段であるリ
ニアエンコーダ28が取り付けられている。さらに、ブ
ラケット26に対し、加工ヘッド12のレーザ光軸と平
行な方向に移動自在に設けられたセンサ取付部材30が
設けられ、センサ取付部材30の垂直部32に、このセ
ンサ取付部材30を加工ヘッド12に対して所定位置に
固定する固定手段であるエアシリンダ等のロック部材3
4が設けられている。このロック部材34は、垂直部3
2の被係合部36に係合する係合部38を有し、この係
合部38が、センサ取付部材30の移動方向に、ロック
位置と解除位置との間で移動可能に設けられている。こ
のロック位置は、センサ作動位置での所定位置と、さら
にセンサ取付部材30を上昇させた退避位置との2位置
にロック可能に設けられている。そして、ロック部材3
4は、保持部材39により加工ヘッドに固定されてい
る。 【0011】センサ取付部材30には、先端にセンサ部
材40が取り付けられたセンサ保持部材42が着脱自在
に取り付けられている。センサ部材40は、図4に示す
ように、リング状に形成され、セラミックス等の絶縁部
材44が、金属製の固定部材46に固定されているもの
で、絶縁部材44の両面には、それぞれ全周にわたって
金属膜が形成され、下面が測定用センサ電極50、上面
が補償用センサ電極52となっている。各センサ電極5
0,52には、各々図示しないリード線が接続され、ギ
ャップコントローラ23に接続されている。この測定用
センサ電極50は、ワーク10との間の空隙による静電
容量を検知するためのもので、ギャップコントローラ2
3によってこの静電容量をもとに間隔を算出するもので
ある。また、補償用センサ電極52は、絶縁部材44を
挟んで測定用センサ電極50と同様に形成され、測定用
センサ電極50との間の静電容量をもとに、ギャップコ
ントローラ23によって、測定用センサ電極50の誤差
分をキャンセルするものである。 【0012】固定部材46は、図4に示すようにリング
状部47と、取付部48とからなり、取付部48が、セ
ラミックス等の絶縁部材54を介して、センサ保持部材
42にボルト56により固定されている。 【0013】センサ保持部材42には、測定用センサ電
極50と補償用センサ電極52から各々伸びた各リード
線が接続された図示しないコネクタ部が設けられ、セン
サ取付部材30にこのセンサ保持部材42を差し込み、
ギャップコントローラ23に接続された他方のコネクタ
部と結合して検知可能となる。この各リード線は、各々
絶縁状態で別々にギャップセンサ23に接続されるもの
である。 【0014】さらに、センサ取付部材30には、センサ
保持部材42を係止する係止部材60及び支点ピン61
が設けられ、この係止部材60と支点ピン61は、バネ
部材62,63により各々突出方向下方に付勢され、各
々センサ保持部材42に形成された凹部64,65に係
合している。また、センサ取付部材30には近接センサ
68が設けられ、センサ保持部材42に形成された透孔
66に対面して取り付けられている。そして、このセン
サ保持部材42は、係止部材60,61により所定の付
勢力で係止されているのみであり、この係止力以上の力
がX,Y軸方向に加わると、この係止状態から位置がず
れるように取り付けられている。この係止位置のずれ
は、支点ピン61と凹部65を中心にセンサ保持部材4
2が回動する場合、凹部64に沿ってセンサ保持部材4
2が直線移動する場合及び、係止部材60と支点ピン6
1ともに凹部64,65から外れる場合の3通りがあ
り、何れの方向の力に対しても確実に位置ずれを生じ、
近接センサ68により検知可能に設けられている。 【0015】この実施例のレーザ加工機のギャップ量検
出装置の使用方法は、先ず、ワーク10とのギャップの
静電容量を測定するセンサ部材40が固定されたセンサ
保持部材42をセンサ取付部材30の取付部分に差し込
み、係止部材60,61と凹部64,65を係合させ
る。さらに、この前後において、ロック部材34を作動
させ、センサ取付部材30の垂直部32の被係合部36
に、係合部38を係合させて引き上げ、センサ取付部材
30を、図1に示す所定位置にロックする。この状態
で、所定の加工プログラムにより加工ヘッド12を移動
させ、ワーク10の加工を行う。この時、ワーク10の
表面のうねり等により加工ノズル14とワーク10との
間隔を微妙に制御する必要があり、この制御を、センサ
部材40の測定用センサ電極50とワーク10との間の
静電容量を測定することにより行っている。さらに、加
工時には、センサ部材40自体が高温になったりして測
定用センサ電極50による静電容量に変化が生じるが、
この誤差成分である変化を、補償用センサ電極52によ
りキャンセルするようにしている。即ち、測定用センサ
電極50と補償用センサ電極52は、各々ギャップコン
トローラ19に接続され、測定用センサ電極50による
可変容量と、測定用センサ電極50と補償用センサ電極
52との間の固定容量とにより、測定用センサ電極50
による静電容量測定時の変動成分を補償するようにして
いる。 【0016】また、加工ノズル14とワーク10との間
隔の制御を、ワーク10に検知部材を接触させて制御す
る場合、図6に示すように、センサ保持部材42を外
し、接触式の検知部材70を有したセンサ保持部材72
に差し替えて使用することもできる。この時、ロック部
材34を解除して、センサ取付部材30を加工ヘッド1
2に対して自由に上下動可能な状態にし、加工ノズル1
4とワーク10との間隔変動をリニアエンコーダ28に
伝達可能な状態にする。これによって、リニアエンコー
ダ28からのデータにより加工ヘッド12の位置をZ軸
モータ19が制御して、所定の間隔を維持する。 【0017】また、このセンサ部材40や検知部材70
が加工中に加工片等に接触し、センサ保持部材42,7
2に、係止部材60,61による係止力以上の力がX軸
またはY軸方向に加わると、この係止状態からセンサ保
持部材42,72の位置がずれる。これによって、透孔
66は、近接センサ68と対面しない位置にずれ、この
ずれを検知してレーザコントローラ24に伝達し、レー
ザ出力及び加工動作を停止させる。また、被加工物の端
面やセンサ部材40をOFFにした場合には、加工ノズ
ル12が急激に降下するの防止するため、エアシリンダ
34により、センサ取付部材30を最上昇位置の退避位
置に固定する。 【0018】この実施例のレーザ加工機のギャップ量検
出加工装置によれば、センサ部材40の構造が簡単であ
り、センサ保持部材42を差し替えるだけで簡単にギャ
ップ制御の方式を異なるものに替えることができ、何れ
のギャップ制御によっても正確に加工ノズル14の位置
を制御することができるものである。 【0019】さらに、この発明のセンサ部材は、図7に
示すように、測定用センサ電極50と補償用センサ電極
52とを有したセンサ部材40の下面に、金属製の接触
検知部材74を固定したものである。これによって、加
工ノズル14とワーク10との間隔を、静電容量検知ま
たは接触式の検知何れの方法でも、ロック部材34の操
作のみで、センサ保持部材42を差し替える必要がな
く、容易に切り替えてして用いることができる。 【0020】また。加工ノズルとセンサ取付部材とを一
体に固定せず、加工ノズルとセンサ取付部材とはレーザ
光の光軸方向にのみ一体的に連動し、他の加工軸に対し
ては加工ヘッドまたは加工ノズルを、センサ取付部材に
対して自由に移動可能に設けても良い。これにより、所
定位置で加工ヘッドの光軸方向高さを一定にして、開先
加工や微小な円加工等を行うことができる。また、セン
サ取付部材に接続したリード線も加工ヘッド等に巻きつ
くことがない。 【0021】 【発明の効果】この発明によれば、リング状の絶縁部材
の両面に補償用センサ電極と測定用センサ電極とが形成
されたセンサ部材を設け、このリング中央部に加工ノズ
ルを挿通させて取り付けたので、簡単な構成で、誤差の
少ない測定が可能であり、レーザ加工機の加工ノズルの
ギャップ制御を正確に行うことができるものである。特
に、加工ノズルをセンサ部材に対して所定の加工軸につ
いて移動可能にすることにより、センサ用のケーブルに
かかわりなく加工ノズルを移動させて加工を行うことが
できる。 【0022】さらに、この発明のレーザ加工機のギャッ
プ量検出加工装置は、静電容量を検知するセンサ部材と
上記被加工物に先端部が当接する検知部材とを、同一の
センサ保持部材に対して選択的に設け、加工条件や被加
工物に合わせた切り替えが容易であり、適切な制御が可
能になるものである。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser machining method for controlling the distance between a machining nozzle tip and a workpiece.
The present invention relates to a gap amount detection device for a laser processing machine that detects the gap amount. Conventionally, in laser processing for cutting metal, a gap sensor is provided at the tip of the processing nozzle in order to keep a constant distance between the tip of the processing nozzle and the workpiece as a workpiece. The position of the machining head was controlled by a signal from the sensor. Normally, this gap sensor is a touch sensor that detects the gap by bringing the sensing part into contact with the work piece. However, depending on the material, this touch sensor can easily be damaged. A contact gap sensor is used as the workpiece. This gap sensor is disclosed in Japanese Patent Laid-Open No. 61-18288.
As disclosed in No. 0 and JP-A-62-156090, the capacitance between the electrode provided around the processing nozzle and the workpiece is measured, and the change in the capacitance is detected. Some control the height of the processing nozzle. And
When measuring this capacitance, the capacitance may fluctuate regardless of the distance between the electrode and the workpiece due to heat during processing, generation of plasma, or the like. In view of this, some of the gap sensors disclosed in the above publications are provided with a compensation sensor electrode for removing these measurement errors and noise components. However, in the case of the above-described conventional technique, providing the sensor electrode for measurement and the sensor electrode for compensation at the tip of the machining head greatly increases the configuration of the sensor unit. There was a problem of becoming. Moreover,
The sensor electrode for measurement and the sensor electrode for compensation should ideally be mounted under the same conditions, and it is preferable that the positions are as close as possible. The compensation sensor electrode is mounted in a state in which the shape and position are greatly different, and the function of the compensation sensor electrode cannot be fully utilized. The present invention has been made in view of the above-mentioned problems of the prior art, and provides a gap amount detection device for a laser processing machine, which has a small and simple configuration and can accurately detect a gap. With the goal. The present invention is a gap amount detection device for a laser processing machine provided in a processing head of a laser processing apparatus for performing predetermined processing by irradiating a workpiece with laser light. A sensor mounting member movable with the machining head is provided. The sensor mounting member is formed with a compensation sensor electrode on the entire upper surface of the ring-shaped insulating member, and between the workpiece on the entire lower surface. It is a gap amount detection device of a laser processing machine provided with a sensor member on which a measurement sensor electrode for detecting capacitance is formed. Further , the sensor mounting member is provided with a sensor holding member provided so as to be relatively movable with respect to the machining head, and is provided with a displacement detecting means for detecting the movement of the sensor holding member. A fixing means for fixing the holding member to the processing head at a predetermined position is attached, and the electrostatic capacity is provided with a predetermined interval between the workpiece and the sensor holding member fixed by the fixing means. In the state where the sensor member for detecting the movement is attached and the fixing by the fixing means is released and the sensor holding member is movable, the displacement detecting means is operated and the detection member whose tip is in contact with the workpiece is It is the gap amount detection apparatus of the laser processing machine attached to the sensor holding member. The gap amount detecting device for a laser beam machine according to the present invention is provided with a sensor member in which a compensation sensor electrode and a measurement sensor electrode are formed on both sides of a ring-shaped insulating member. Since the processing nozzle is inserted and attached, the compensation sensor electrode and the measurement sensor electrode are attached under almost the same conditions, and the compensation sensor electrode can accurately compensate the measurement value by the measurement sensor electrode, The structure can also be simplified. The gap amount detection processing apparatus for a laser beam machine according to the present invention includes a sensor member for detecting electrostatic capacitance and a detection member whose tip is in contact with the workpiece, with respect to the same sensor holding member. It can be detachably provided and can be used selectively, and enables appropriate control of the position of the machining nozzle in accordance with the machining conditions and the workpiece. DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the laser amount detecting device of the laser processing machine of this embodiment is a processing in which a laser beam emitted from a laser oscillator (not shown) is guided and provided facing a workpiece 10 that is a workpiece. It is attached to the head 12. A processing nozzle 14 that irradiates the workpiece 10 with laser light is provided at the tip of the processing head 12. The machining head 12 is attached to the position control mechanism 16 and can be controlled in the X, Y, and Z axis directions by the X axis motor 17, the Y axis motor 18, and the Z axis motor 19 of the position control mechanism 16. Is provided. Position control mechanism 16
The motors 17, 18, and 19 are connected to the servo control unit 20 to control the movement direction of the machining head 12. Further, the servo control unit 20 includes a machining head 12.
Are connected to a control device 22 comprising a gap controller 23 for controlling the position of the laser and a laser controller 24 for controlling laser oscillation. A bracket 26 is fixed to the machining head 12, and a linear encoder 28 serving as a displacement detecting means is attached to the bracket 26. Further, a sensor mounting member 30 is provided on the bracket 26 so as to be movable in a direction parallel to the laser optical axis of the processing head 12. The sensor mounting member 30 is processed in the vertical portion 32 of the sensor mounting member 30. A lock member 3 such as an air cylinder which is a fixing means for fixing the head 12 at a predetermined position.
4 is provided. This locking member 34 is provided with the vertical portion 3
The engaging portion 38 is engaged with the second engaged portion 36, and the engaging portion 38 is provided so as to be movable between the lock position and the release position in the moving direction of the sensor mounting member 30. Yes. This lock position is provided so that it can be locked at two positions: a predetermined position at the sensor operating position, and a retracted position where the sensor mounting member 30 is raised. And the lock member 3
4 is fixed to the machining head by a holding member 39. A sensor holding member 42 having a sensor member 40 attached to the tip is detachably attached to the sensor attachment member 30. As shown in FIG. 4, the sensor member 40 is formed in a ring shape, and an insulating member 44 such as ceramics is fixed to a metal fixing member 46. A metal film is formed over the circumference, and the lower surface is a measurement sensor electrode 50 and the upper surface is a compensation sensor electrode 52. Each sensor electrode 5
Lead wires (not shown) are connected to 0 and 52, respectively, and are connected to the gap controller 23. The measurement sensor electrode 50 is for detecting the capacitance due to the gap between the workpiece 10 and the gap controller 2.
3 is used to calculate the interval based on this capacitance. The compensation sensor electrode 52 is formed in the same manner as the measurement sensor electrode 50 with the insulating member 44 interposed therebetween, and is measured by the gap controller 23 based on the capacitance between the measurement sensor electrode 50 and the measurement sensor electrode 50. The error amount of the sensor electrode 50 is canceled. As shown in FIG. 4, the fixing member 46 includes a ring-shaped portion 47 and an attachment portion 48. The attachment portion 48 is attached to the sensor holding member 42 by bolts 56 via an insulating member 54 such as ceramics. It is fixed. The sensor holding member 42 is provided with a connector portion (not shown) to which the respective lead wires extending from the measuring sensor electrode 50 and the compensating sensor electrode 52 are connected, and the sensor holding member 42 is provided with the sensor holding member 42. Plug in
It can be detected by being combined with the other connector portion connected to the gap controller 23. Each lead wire is separately connected to the gap sensor 23 in an insulated state. Further, the sensor mounting member 30 includes a locking member 60 for locking the sensor holding member 42 and a fulcrum pin 61.
The locking member 60 and the fulcrum pin 61 are urged downward in the protruding direction by the spring members 62 and 63, respectively, and engage with the recesses 64 and 65 formed in the sensor holding member 42, respectively. Further, the sensor attachment member 30 is provided with a proximity sensor 68 and attached to face the through hole 66 formed in the sensor holding member 42. The sensor holding member 42 is only locked with a predetermined urging force by the locking members 60 and 61. When a force greater than the locking force is applied in the X and Y axis directions, It is attached so that the position shifts from the state. The shift of the locking position is caused by the sensor holding member 4 centering on the fulcrum pin 61 and the recess 65.
When 2 rotates, the sensor holding member 4 is moved along the recess 64.
When 2 moves linearly, the locking member 60 and the fulcrum pin 6
There are three ways in which both of them are disengaged from the recesses 64 and 65, and the displacement is surely generated with respect to the force in any direction,
The proximity sensor 68 can be detected. In the method of using the gap amount detecting device of the laser processing machine of this embodiment, first, the sensor holding member 42 to which the sensor member 40 for measuring the capacitance of the gap with the workpiece 10 is fixed is attached to the sensor mounting member 30. The engaging members 60, 61 and the recesses 64, 65 are engaged with each other. Further, before and after this, the lock member 34 is operated to engage the engaged portion 36 of the vertical portion 32 of the sensor mounting member 30.
Then, the engaging portion 38 is engaged and pulled up, and the sensor mounting member 30 is locked at a predetermined position shown in FIG. In this state, the machining head 12 is moved by a predetermined machining program, and the workpiece 10 is machined. At this time, it is necessary to finely control the distance between the machining nozzle 14 and the workpiece 10 by the undulation of the surface of the workpiece 10, and this control is performed by the static between the sensor electrode 50 for measurement of the sensor member 40 and the workpiece 10. This is done by measuring the capacitance. Furthermore, at the time of processing, the sensor member 40 itself becomes a high temperature and the capacitance of the measurement sensor electrode 50 changes,
This change which is an error component is canceled by the compensation sensor electrode 52. That is, the measurement sensor electrode 50 and the compensation sensor electrode 52 are connected to the gap controller 19, respectively, and the variable capacitance by the measurement sensor electrode 50 and the fixed capacitance between the measurement sensor electrode 50 and the compensation sensor electrode 52. And the sensor electrode 50 for measurement
It compensates for the fluctuation component at the time of capacitance measurement due to. When the control of the distance between the machining nozzle 14 and the workpiece 10 is controlled by bringing a detection member into contact with the workpiece 10, the sensor holding member 42 is removed as shown in FIG. Sensor holding member 72 having 70
It can also be used in place of. At this time, the lock member 34 is released and the sensor mounting member 30 is moved to the machining head 1.
2 can be moved up and down freely, processing nozzle 1
4 and the workpiece 10 can be transmitted to the linear encoder 28. As a result, the Z-axis motor 19 controls the position of the machining head 12 based on the data from the linear encoder 28 to maintain a predetermined interval. The sensor member 40 and the detection member 70 are also used.
Contacts the workpiece during processing, and the sensor holding members 42, 7
2, when a force greater than the locking force by the locking members 60 and 61 is applied in the X-axis or Y-axis direction, the positions of the sensor holding members 42 and 72 are shifted from this locked state. As a result, the through-hole 66 shifts to a position not facing the proximity sensor 68, detects this shift, transmits it to the laser controller 24, and stops the laser output and processing operation. Further, when the end surface of the workpiece or the sensor member 40 is turned off, the sensor mounting member 30 is fixed to the retreat position at the highest position by the air cylinder 34 in order to prevent the machining nozzle 12 from dropping rapidly. To do. According to the gap amount detection processing apparatus of the laser processing machine of this embodiment, the structure of the sensor member 40 is simple, and the gap control method can be easily changed to a different one by simply replacing the sensor holding member 42. The position of the machining nozzle 14 can be accurately controlled by any gap control. Further , in the sensor member of the present invention, as shown in FIG. 7, a metal contact detection member 74 is fixed to the lower surface of the sensor member 40 having the measurement sensor electrode 50 and the compensation sensor electrode 52. It is a thing. As a result, the distance between the machining nozzle 14 and the workpiece 10 can be easily switched without changing the sensor holding member 42 only by operating the lock member 34, regardless of the capacitance detection method or the contact detection method. Can be used. Also, The processing nozzle and the sensor mounting member are not fixed integrally, but the processing nozzle and the sensor mounting member are integrally linked only in the optical axis direction of the laser beam, and a processing head or processing nozzle is connected to the other processing axes. The sensor mounting member may be freely movable. This makes it possible to perform groove processing, minute circular processing, and the like while keeping the height in the optical axis direction of the processing head constant at a predetermined position. Further, the lead wire connected to the sensor mounting member does not wrap around the processing head or the like. According to the present invention, a sensor member having a compensation sensor electrode and a measurement sensor electrode formed on both sides of a ring-shaped insulating member is provided, and a machining nozzle is inserted through the center of the ring. Therefore, the measurement can be performed with a simple configuration and with a small error, and the gap control of the processing nozzle of the laser processing machine can be accurately performed. In particular, by allowing the machining nozzle to move with respect to the sensor member about a predetermined machining axis, the machining nozzle can be moved to perform machining regardless of the sensor cable. Furthermore , the gap amount detecting and processing apparatus for a laser beam machine according to the present invention provides a sensor member for detecting electrostatic capacitance and a detecting member whose tip is in contact with the workpiece to the same sensor holding member. Therefore, it is easy to switch according to the processing conditions and the workpiece, and appropriate control is possible.

【図面の簡単な説明】 【図1】この発明のレーザ加工機のギャップ量検出加工
装置の一実施例を示す概略説明図である。 【図2】この実施例のセンサ保持部材の平面図である。 【図3】図2のA−A断面図である。 【図4】この実施例のセンサ固定部材の平面図である。 【図5】図4のB−B断面図である。 【図6】この実施例のレーザ加工機のギャップ量検出加
工装置に他のセンサ保持部材を取り付けた状態の部分破
断正面図である。 【図7】この発明のレーザ加工機のギャップ量検出加工
装置の他の実施例のセンサ部材を示す縦断面図である。 【符号の説明】 10 ワーク 12 加工ヘッド 14 加工ノズル 28 リニアエンコーダ 30 センサ取付部材 34 ロック部材 40 センサ部材 42 センサ保持部材 50 測定用センサ電極 52 補償用センサ電極
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic explanatory view showing an embodiment of a gap amount detection processing apparatus for a laser processing machine according to the present invention. FIG. 2 is a plan view of a sensor holding member of this embodiment. 3 is a cross-sectional view taken along the line AA in FIG. FIG. 4 is a plan view of a sensor fixing member of this embodiment. 5 is a cross-sectional view taken along the line BB in FIG. FIG. 6 is a partially broken front view of a state in which another sensor holding member is attached to the gap amount detection processing apparatus of the laser processing machine of this embodiment. FIG. 7 is a longitudinal sectional view showing a sensor member of another embodiment of the gap amount detection processing apparatus of the laser processing machine according to the present invention. [Explanation of Symbols] 10 Work 12 Processing Head 14 Processing Nozzle 28 Linear Encoder 30 Sensor Mounting Member 34 Lock Member 40 Sensor Member 42 Sensor Holding Member 50 Sensor Electrode for Measurement 52 Sensor Electrode for Compensation

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) B23K 26/00 - 26/42 ──────────────────────────────────────────────────── ─── Continued from front page (58) Fields surveyed (Int.Cl. 7 , DB name) B23K 26/00-26/42

Claims (1)

(57)【特許請求の範囲】 【請求項1】 レーザ光を被加工物に照射して所定の加
工を行うレーザ加工装置の加工ヘッドとともに移動可能
なセンサ取付部材を設け、上記加工ヘッドに対して相対
的に移動自在に設けられたセンサ保持部材を上記センサ
取付部材に設け、このセンサ保持部材またはセンサ取付
部材の移動を検知する偏位検知手段を設けたレ−ザ加工
機のギャップ量検出装置において、上記センサ保持部材を上記加工ヘッドに対して所定位置
に固定する固定手段と、 上記センサ保持部材に設けられ 、リング状の絶縁部材の
上面全周に補償用センサ電極が形成され、下面全周に上
記被加工物との間の静電容量を検知する測定用センサ電
極が形成され、上記固定手段により上記センサ保持部材
を固定した状態で、上記被加工物との間で所定間隔を空
けて静電容量を検知するセンサ部材と、 上記センサ部材の下面で上記測定用センサ電極と一体的
に設けられ、上記被加工物に接触して摺動可能に設けら
れ、上記固定手段による固定を解除して上記センサ保持
部材を移動自在にした状態で、上記偏位検知手段を作動
させ上記被加工物に先端部が当接する検知部材を備え、 上記固定手段を切り替えて静電容量の測定による検知
と、上記被加工物への接触による検知とを切り替え可能
に設け て成ることを特徴とするレーザ加工機のギャップ
量検出装置。
(57) [Claims] [Claims] [Claim 1] Moveable together with a machining head of a laser machining apparatus that performs predetermined machining by irradiating a workpiece with laser light
A sensor mounting member is provided and relative to the machining head
The sensor holding member provided so as to be freely movable is connected to the sensor.
Provided on the mounting member, this sensor holding member or sensor mounting
In a gap amount detection device of a laser processing machine provided with a displacement detection means for detecting movement of a member, the sensor holding member is positioned at a predetermined position with respect to the processing head.
A sensor for compensation is formed on the entire upper surface of the ring-shaped insulating member, and the capacitance between the workpiece and the workpiece is detected on the entire lower surface. Sensor electrode for measurement is formed, and the sensor holding member is formed by the fixing means.
With a fixed gap between the workpiece and the workpiece.
And a sensor member for detecting capacitance, and a lower surface of the sensor member integrated with the sensor electrode for measurement.
Provided to be slidable in contact with the workpiece.
The sensor is held by releasing the fixing by the fixing means.
Operates the displacement detection means with the member movable.
A detecting member whose tip is in contact with the workpiece, and detecting by measuring capacitance by switching the fixing means
And detection by contact with the workpiece
Laser processing machine of the gap amount detection apparatus characterized by comprising provided.
JP34549392A 1992-11-30 1992-11-30 Gap amount detection device for laser processing machine Expired - Fee Related JP3514479B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34549392A JP3514479B2 (en) 1992-11-30 1992-11-30 Gap amount detection device for laser processing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34549392A JP3514479B2 (en) 1992-11-30 1992-11-30 Gap amount detection device for laser processing machine

Publications (2)

Publication Number Publication Date
JPH06170572A JPH06170572A (en) 1994-06-21
JP3514479B2 true JP3514479B2 (en) 2004-03-31

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Country Link
JP (1) JP3514479B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4536602B2 (en) * 2005-06-09 2010-09-01 三菱電機株式会社 Gap detection device
JP5312537B2 (en) * 2011-08-01 2013-10-09 三菱電機株式会社 Status detection device and laser processing device
CN107621575B (en) * 2017-08-25 2018-11-20 西南交通大学 A kind of dielectric properties experimental method of tractive transformer insulating materials
CN110823283A (en) * 2019-09-29 2020-02-21 大族激光科技产业集团股份有限公司 Capacitance and temperature signal sensor
CN114578753B (en) * 2022-01-20 2024-06-07 西门子(中国)有限公司 Workpiece processing control method and device, computer equipment and computer readable medium

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