JP3514150B2 - Enclosure - Google Patents

Enclosure

Info

Publication number
JP3514150B2
JP3514150B2 JP02516399A JP2516399A JP3514150B2 JP 3514150 B2 JP3514150 B2 JP 3514150B2 JP 02516399 A JP02516399 A JP 02516399A JP 2516399 A JP2516399 A JP 2516399A JP 3514150 B2 JP3514150 B2 JP 3514150B2
Authority
JP
Japan
Prior art keywords
panel
light
hole
wall surface
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP02516399A
Other languages
Japanese (ja)
Other versions
JP2000222926A (en
Inventor
征真 舟杉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP02516399A priority Critical patent/JP3514150B2/en
Publication of JP2000222926A publication Critical patent/JP2000222926A/en
Application granted granted Critical
Publication of JP3514150B2 publication Critical patent/JP3514150B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Casings For Electric Apparatus (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、筐体に関し、特に
光源を保護し、かつ前記光源から照射された光を利用者
にとって適切な強さに変換した上で良好な視認性を得る
筐体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing, and more particularly to a housing for protecting a light source and converting light emitted from the light source into an intensity suitable for a user and obtaining good visibility. Regarding

【0002】[0002]

【従来の技術】図4は、従来の筐体の一例として、電子
機器筐体のLEDカバー部を説明するための正面図、図
5は、図4で示されるB−B線で切断したときの断面図
である。電子機器筐体として、例えば合成樹脂の射出成
型部品であるパネル401の内部には、前記電子機器の
電気回路の一部として、例えば電源ON、OFFなどの
動作状態を表示する光源、例えばLED402が収めら
れている。また、前記パネル401の前記LED402
に離間対向する部分には貫通孔が穿設されており、前記
貫通孔の開口部には、前記LED402の保護、及び前
記LED402の輝度の低減や光を拡散するため、ある
いは電子機器のデザイン上の要請から透明或いは半透明
の部品として、例えば合成樹脂の射出成型部品であるL
EDカバー403が取り付けられる。さらに、前記LE
Dカバー403は、前記パネル401と溶着点401b
で溶着され固定されている。
2. Description of the Related Art FIG. 4 is a front view for explaining an LED cover portion of an electronic equipment housing as an example of a conventional housing, and FIG. 5 is a sectional view taken along line BB shown in FIG. FIG. As a housing of an electronic device, inside a panel 401, which is an injection molded part of a synthetic resin, for example, a light source for displaying an operating state such as power ON and OFF, for example, an LED 402 is provided as a part of an electric circuit of the electronic device. It is contained. In addition, the LED 402 of the panel 401
A through hole is formed in a portion facing away from the LED. The through hole has an opening portion for protecting the LED 402, reducing the brightness of the LED 402 and diffusing light, or in designing an electronic device. As a transparent or translucent part, for example, a synthetic resin injection molded part L
The ED cover 403 is attached. Further, the LE
The D cover 403 is attached to the panel 401 and the welding point 401b.
It is welded and fixed in.

【0003】次に、従来の筐体の一例として、電子機器
の動作状態を表示するLED402の光Lの伝達過程を
図5を参照して説明する。LED402は、電子機器の
動作状態として、例えば電源ON状態のとき発光し、前
記LED402からの光Lはパネル401の内壁面に伝
達される。前記パネル401の前記内壁面に伝達された
光Lは、LEDカバー403を透過して前記パネル40
1の外壁面側に伝達され、電子機器の利用者は、前記L
EDカバー403を透過した光Lを目視することで前記
電子機器の動作状態として、例えば電源ON状態を知る
ことができる。このように、従来の筐体の一例として、
電子機器のパネル401は、該パネル401に溶着され
たLEDカバー403により動作状態などを表示する光
源LED402を保護し、また、前記LED402から
の光Lを透過させる際に適切な強さに和らげることで利
用者の目に刺激を与えることを防いでいた。
Next, as an example of a conventional case, a transmission process of the light L of the LED 402 for displaying the operation state of the electronic device will be described with reference to FIG. The LED 402 emits light when the electronic device is in the power-on state, for example, and the light L from the LED 402 is transmitted to the inner wall surface of the panel 401. The light L transmitted to the inner wall surface of the panel 401 is transmitted through the LED cover 403 and the panel 40.
1 is transmitted to the outer wall surface side, and the user of the electronic device
By visually observing the light L transmitted through the ED cover 403, for example, the power-on state can be known as the operation state of the electronic device. Thus, as an example of a conventional housing,
The panel 401 of the electronic device protects the light source LED 402 for displaying an operating state and the like by the LED cover 403 welded to the panel 401, and moderates the light intensity when transmitting the light L from the LED 402. It prevented the user's eyes from being stimulated.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、従来の
筐体には次に列挙するような課題があった。すなわち、
従来の筐体、例えば電子機器のパネル401とLEDカ
バー403とは異なる材質の部品であり、前記LEDカ
バー403の部品コスト及び溶着点401bで溶着を行
なうための作業工数が生じていた。さらに、異なる材質
の部品を溶着することは、前記電子機器を将来リサイク
ルする際に分離回収する工数を要するので、前記電子機
器の製品アセスメントを評価する上で改善が望まれてい
た。
However, the conventional housing has the following problems. That is,
The conventional housing, for example, the panel 401 of the electronic device and the LED cover 403 are parts made of different materials, and the part cost of the LED cover 403 and the number of man-hours required for welding at the welding point 401b are generated. Further, welding of parts made of different materials requires man-hours for separating and recovering the electronic device when it is recycled in the future, and therefore improvement has been desired in evaluating the product assessment of the electronic device.

【0005】よって本発明の目的は、光源を保護し、か
つ前記光源から照射された光を利用者にとって適切な強
さに変え、また、光源カバーを用いる従来の筐体のよう
に、パネルとは材質の異なる透明或いは半透明の光源カ
バーを溶着する必要を無くして製造や分離回収の作業を
容易にし、さらに、金型の製作コストを抑えた筐体を提
供することである。
Therefore, an object of the present invention is to protect a light source and to change the light emitted from the light source to an intensity suitable for a user, and to use a panel such as a conventional case using a light source cover. Is to provide a housing in which it is not necessary to weld transparent or translucent light source covers made of different materials to facilitate the manufacturing and separation / collection work, and further to reduce the manufacturing cost of the mold.

【0006】[0006]

【課題を解決するための手段】本発明による筐体は、光
軸に沿って光を照射する光源に対して離間対向するパネ
ルを備えた筐体であって、前記パネルが、該光源から照
射された前記光軸を中心とする所定径の光束からなる直
接光を遮光する直接光遮光壁と、該直接光遮光壁の周囲
に前記光軸とは斜交する方向に穿設され、前記光源から
照射された前記光束以外の直接光の少なくとも一部を間
接光に変えて外部に導出する貫通孔とを含むことを特徴
とする。また、前記貫通孔は、前記直接光遮光壁を囲繞
するパネル内壁面に台形状に開口しており、かつ該開口
形状と同じ断面形状をもって連通し、前記パネル内壁面
よりも光軸に近い位置でパネル外壁面に開口することを
特徴とする。また、前記貫通孔は、前記パネルに対して
垂直な面で、かつ前記パネルの外壁面開口部から内壁面
開口部に至る金型接合面により分割可能であり、該金型
接合面で接合する一対の金型により成型することを特徴
とする。かかる手段により、光源と対向する部分を直接
光遮光壁で覆って保護し、また、前記光源からの照射さ
れた光を前記直接光遮光壁の周囲に光軸に斜交する方向
に穿設した貫通孔を介して間接光に変えて導出すること
で利用者の目に刺激を与えるといった不都合をなくし、
さらに、光源カバーを用いた従来の筐体のように、パネ
ルとは材質の異なる透明或いは半透明の部品を開口部に
溶着する必要をなくして製造を容易にするとともに分離
回収時の作業負担を軽減し、さらにまた、前記貫通孔を
成型する金型の製作コストの増加を極力抑えた筐体を実
現した。
A housing according to the present invention is a housing provided with a panel facing away from a light source for irradiating light along an optical axis, the panel irradiating from the light source. A direct light blocking wall for blocking direct light composed of a light beam having a predetermined diameter centered on the optical axis, and the direct light blocking wall is provided around the direct light blocking wall in a direction oblique to the optical axis, A through hole for converting at least a part of the direct light other than the light flux emitted from the outside into indirect light and leading it to the outside. Further, the through hole has a trapezoidal opening in the inner wall surface of the panel that surrounds the direct light shielding wall, communicates with the same cross-sectional shape as the opening shape, and is located closer to the optical axis than the inner wall surface of the panel. It is characterized by opening to the outer wall surface of the panel. Further, the through-hole is a surface perpendicular to the panel and can be divided by a mold joining surface extending from an outer wall surface opening portion of the panel to an inner wall surface opening portion, and is joined at the mold joining surface. It is characterized by being molded by a pair of molds. By such means, the portion facing the light source is directly covered with the light shielding wall to protect it, and the light emitted from the light source is provided around the direct light shielding wall in a direction oblique to the optical axis. Eliminating the inconvenience of stimulating the user's eyes by converting to indirect light through the through hole and deriving,
Further, unlike a conventional case using a light source cover, it is not necessary to weld a transparent or translucent part made of a material different from that of the panel to the opening to facilitate the manufacturing and reduce the work load at the time of separation and collection. Further, the housing has been realized by reducing the cost and further suppressing the increase of the manufacturing cost of the mold for molding the through hole.

【0007】[0007]

【本発明の実施の形態】次に、本発明の一実施の形態に
よる筐体について、電子機器筐体に適用した場合を例に
とり、図面を参照して説明する。図1は、本発明の一実
施の形態による筐体について、電子機器筐体のLEDカ
バー部を説明するための正面図、図2は、図1で示され
るA−A線で切断したときの断面図である。本実施の形
態による筐体は、例えば合成樹脂の射出成型により製造
され、電子機器の筐体に適用したものであって、前記電
子機器の電気回路の一部として例えば電源ON、OFF
などの動作状態を表示する光軸に沿って光を照射する光
源の一例としてのLED102に対して離間対向するパ
ネル101を備えた筐体である。このパネル101は、
前記LED102を物理的に隔離して保護し、前記LE
D102からの光が直接利用者の目に入って刺激を与え
るといった不都合を無くすため、前記光源LED102
から照射された前記光軸を中心とする所定径の光束から
なる直接光を遮光する直接光遮光壁の一例としての遮光
壁101bと、該遮光壁101bの周囲4箇所に前記光
軸とは斜交する方向に穿設され、前記光源LED102
から照射された前記光束以外の直接光の少なくとも一部
を間接光に変えて前記パネル101の外壁面側に導出す
る貫通孔101aとを含んでいる。
BEST MODE FOR CARRYING OUT THE INVENTION Next, a case according to an embodiment of the present invention will be described with reference to the drawings, taking as an example a case where the case is applied to an electronic apparatus case. FIG. 1 is a front view for explaining an LED cover portion of an electronic device housing in a housing according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line AA shown in FIG. FIG. The housing according to the present embodiment is manufactured by injection molding of synthetic resin, for example, and is applied to a housing of an electronic device. For example, power is turned on and off as a part of an electric circuit of the electronic device.
It is a case including a panel 101 facing away from an LED 102 as an example of a light source that emits light along an optical axis that displays an operating state such as. This panel 101
The LED 102 is physically isolated and protected, and the LE
In order to eliminate the inconvenience that the light from D102 directly enters the eyes of the user to give a stimulus, the light source LED102
A light blocking wall 101b as an example of a direct light blocking wall that blocks direct light composed of a light beam of a predetermined diameter centered on the optical axis, and the optical axis is oblique to four locations around the light blocking wall 101b. The light source LED 102 is provided in the intersecting direction.
A through hole 101a for converting at least a part of the direct light other than the light beam emitted from the panel into indirect light and leading the light to the outer wall surface side of the panel 101.

【0008】さらに、前記貫通孔101aは、前記直接
光遮光壁101bを囲繞する前記パネル101bに台形
状に開口しており、かつ該開口形状と同じ断面形状をも
って連通し、前記パネル101内壁面よりも光軸に近い
位置で前記パネル101外壁面に開口している。
Further, the through hole 101a is trapezoidally opened to the panel 101b surrounding the direct light shielding wall 101b, and communicates with the same sectional shape as the opening shape, Also has an opening on the outer wall surface of the panel 101 at a position close to the optical axis.

【0009】図3は、本発明の一実施の形態による筐体
について、電子機器のパネル101の製造に用いる金型
構造を説明するための部分断面図である。筐体の一例と
して、電子機器筐体のパネル101は、例えば合成樹脂
の射出成型により製造される。該パネル101に穿設さ
れた貫通孔101aは、前記パネル101の外壁面開口
部から内壁面開口部に至る前記パネル101に対して垂
直な面を金型接合面とする一対の金型により成型され
る。すなわち、前記垂直な面を、金型のキャビティCa
の貫通孔101a成型部Ca’及び金型のコアCoの貫
通孔101a成型部Co’の金型接合面とし、前記貫通
孔101aを該金型接合面で接合する一対の金型により
成型できる構造とすることで、前記パネル101は、成
型時に前記金型のキャビティCaと前記金型のコアCo
との前記パネル101に対して垂直方向(図中の矢印の
方向)の相対直線運動によって金型から抜ける構造とな
る。
FIG. 3 is a partial cross-sectional view for explaining the mold structure used for manufacturing the panel 101 of the electronic device for the housing according to the embodiment of the present invention. As an example of the housing, the panel 101 of the electronic equipment housing is manufactured by injection molding of synthetic resin, for example. The through-hole 101a formed in the panel 101 is formed by a pair of molds whose surfaces, which extend from the outer wall surface opening portion of the panel 101 to the inner wall surface opening portion and are perpendicular to the panel 101, are used as mold bonding surfaces. To be done. That is, the vertical surface is referred to as the cavity Ca of the mold.
Of the through-hole 101a molding portion Ca ′ and the through-hole 101a molding portion Co ′ of the core Co of the mold are joined to each other by a die, and the through-hole 101a is joined at the die joining surface. Thus, the panel 101 is configured such that the cavity Ca of the mold and the core Co of the mold are molded at the time of molding.
With respect to the panel 101, relative linear motion in a direction perpendicular to the panel 101 (the direction of the arrow in the drawing) causes the structure to be removed from the mold.

【0010】次に、本発明の一実施の形態による筐体に
ついて、電子機器の動作状態を表示するLED102の
光Lの伝達過程を図2を参照して説明する。光源LED
102は、電子機器の動作状態として、例えば電源ON
状態のとき発光し、前記LED102からの光Lは、前
記LED102に対して離間対向するパネル101の一
主表面として例えば内壁面に照射される。前記パネル1
01の前記内壁面に照射された光Lの一部は、前記LE
D102に対して離間対向する前記パネル101の光軸
を中心とする所定径の光束からなる直接光を遮光する遮
光壁101bを囲む4箇所の前記光軸に斜交する方向に
穿設された貫通孔101aに入射する。
Next, with respect to the housing according to the embodiment of the present invention, the process of transmitting the light L of the LED 102 for displaying the operating state of the electronic device will be described with reference to FIG. Light source LED
102 is an operating state of the electronic device, for example, power ON
Light is emitted in the state, and the light L from the LED 102 is applied to, for example, an inner wall surface as one main surface of the panel 101 facing the LED 102 with a space therebetween. Panel 1
A part of the light L radiated to the inner wall surface of 01 is LE
A penetrating hole is formed at four positions in a direction oblique to the optical axis, which surrounds a light shielding wall 101b that shields direct light composed of a light beam of a predetermined diameter centered on the optical axis of the panel 101 facing away from D102. It is incident on the hole 101a.

【0011】前記貫通孔101aは、前記遮光壁101
bを囲む4箇所に前記パネル101の前記内壁面に台形
状に開口しており、かつ該開口形状と同じ断面形状をも
って連通し、前記パネル内壁面101よりも前記LED
102の光軸に近い位置で前記パネル101の外壁面に
開口しているので、前記貫通孔101aに入射した光L
は平行な2面間で主に反射し、反射するつど光量が減少
するので、前記貫通孔102から出射するときには利用
者にとって適切な強さの光とすることができ、また台形
状開口の上辺部分を光軸側にして光軸を囲む4箇所に前
記貫通孔101aを穿設することで、前記貫通孔101
aの内壁面を反射して導出された光が四方から集光して
視認性が向上するため、光源カバーを用いる従来の筐体
と同等以上の視認性を得ることができる。よって、電子
機器の利用者は、前記貫通孔101aの内壁面を反射し
て通過した光Lを目視することで前記電子機器の動作状
態として、例えば電源ON状態を知ることができる。
The through hole 101a is formed in the light shielding wall 101.
The LED has a trapezoidal opening in the inner wall surface of the panel 101 at four locations surrounding b, and communicates with the same cross-sectional shape as the opening shape, rather than the panel inner wall surface 101.
Since the light is incident on the outer wall surface of the panel 101 at a position close to the optical axis of 102, the light L incident on the through hole 101a is
Is mainly reflected between two parallel surfaces, and the amount of light decreases each time it is reflected. Therefore, when the light is emitted from the through-hole 102, the light can have an intensity suitable for the user, and the upper side of the trapezoidal opening. The through-hole 101a is formed by forming the through-holes 101a at four positions surrounding the optical axis with the portion on the optical axis side.
The light reflected by the inner wall surface of a is condensed from four directions and the visibility is improved. Therefore, the visibility equal to or higher than that of the conventional case using the light source cover can be obtained. Therefore, the user of the electronic device can know, for example, the power-on state as the operation state of the electronic device by visually observing the light L reflected and passed through the inner wall surface of the through hole 101a.

【0012】このように本発明の一実施の形態による筐
体によれば、LED102から照射された光Lが、前記
LED102に対し離間対向するパネル101の前記L
ED102の光軸を中心とする所定径の光束からなる直
接光を遮光する遮光壁101bによって覆われるため、
前記LED102を前記パネル101の外部の空間から
物理的に隔離して保護することができる。また、光源カ
バーを用いた従来の筐体のように、パネルとは材質が異
なる透明或いは半透明のLEDカバーを溶着する必要も
無くなることで、製造や分離回収時の作業を容易に行う
ことができる。
As described above, according to the housing according to the embodiment of the present invention, the light L emitted from the LED 102 is the L of the panel 101 facing the LED 102 at a distance.
Since the ED 102 is covered with a light shielding wall 101b that shields direct light composed of a light beam having a predetermined diameter around the optical axis of the ED 102,
The LED 102 can be protected by being physically isolated from the space outside the panel 101. Further, unlike the conventional case using a light source cover, it is not necessary to weld a transparent or semi-transparent LED cover made of a material different from that of the panel, which facilitates the work at the time of manufacture and separation / collection. it can.

【0013】さらに、前記LED102から照射された
光Lの一部が前記遮光壁101bを囲む4箇所に前記L
ED102の光軸に斜交する方向に穿設された台形状に
開口した貫通孔101aに入射し、前記貫通孔101a
に入射した光Lが平行な2面間で主に反射し、反射する
つど光量が減少するので、前記貫通孔101aから出射
するときには利用者にとって適切な強さの光とすること
ができ、また、台形状開口の上辺部分を光軸側にして光
軸を囲む4箇所に前記貫通孔101aを穿設すること
で、前記貫通孔101aの内壁面を反射して導出された
光が四方から集光し、視認性が向上するため、光源カバ
ーを用いる従来の筐体と同等以上の視認性を得ることが
できる。
Further, a part of the light L emitted from the LED 102 is distributed to the four locations surrounding the light shielding wall 101b.
The light enters a through hole 101a that is opened in a trapezoidal shape and is formed in a direction oblique to the optical axis of the ED 102, and the through hole 101a is formed.
The light L incident on is mainly reflected between the two parallel surfaces, and the amount of light decreases each time it is reflected. Therefore, when the light L is emitted from the through-hole 101a, the light having an appropriate intensity for the user can be obtained. By arranging the through holes 101a at four locations surrounding the optical axis with the upper side of the trapezoidal opening as the optical axis side, the light reflected by the inner wall surface of the through hole 101a is collected from four directions. Since light is emitted and the visibility is improved, the visibility equal to or higher than that of the conventional case using the light source cover can be obtained.

【0014】また、前記貫通孔101aは、前記パネル
101の外壁面開口部から内壁面開口部に至る前記パネ
ル101に対して垂直な面を金型のキャビティCaの貫
通孔101a成型部Ca’及び金型のコアCoの貫通孔
101a成型部Co’の金型接合面とする一対の金型に
より成型できる構造としたので、前記パネル101は、
成型時に前記金型のキャビティCaと前記金型のコアC
oとの前記パネル101に対して垂直方向の相対直線運
動によって金型から抜くことができる構造となり、金型
の製作コストを抑えることができる。
Further, the through hole 101a has a surface perpendicular to the panel 101 extending from the outer wall surface opening portion to the inner wall surface opening portion of the panel 101, and the through hole 101a molding portion Ca 'of the cavity Ca of the mold and Since the structure is such that molding can be performed by a pair of molds which are the mold bonding surfaces of the through hole 101a molding portion Co ′ of the core Co of the mold, the panel 101 is
Cavity Ca of the mold and core C of the mold during molding
The structure can be removed from the mold by a relative linear motion in the direction perpendicular to the panel 101 with respect to o, and the manufacturing cost of the mold can be suppressed.

【0015】[0015]

【発明の効果】以上説明したように、本発明の筐体によ
れば、光源と対向する部分が直接光遮光壁により覆われ
るため、光源をパネル外部の空間から物理的に隔離して
保護することができ、また光源カバーを用いた従来の筐
体のように、パネルとは材質が異なる透明或いは半透明
の部品を開口部に溶着する必要はなく、従って製造が非
常に容易であり、同時にまた分離回収時の作業負担も軽
減でき、さらに光源から照射された光の一部が、直接光
遮光壁の周囲に光軸とは斜交する方向に穿設した貫通孔
を介して外部に導出されるので、目に優しい間接照明に
より光源光を視認することができ、光源からの光が直接
利用者の目に入って刺激を与えるといった不都合をなく
すといった優れた効果を奏する。また、前記貫通孔が、
前記直接光遮光壁を囲繞するパネル内壁面に台形状に開
口しており、かつ該開口形状と同じ断面形状をもって連
通し、前記パネル内壁面よりも光軸に近い位置でパネル
外壁面に開口するので、貫通孔に入射した光は平行な2
面間で主に反射し、反射するつど光量が減少するので、
貫通孔から出射するときは利用者にとって適切な強さの
光とすることができ、また台形状開口の上辺部分を光軸
側にして光軸を囲む4箇所に貫通孔を穿設することで、
貫通孔の内壁面を反射して導出された光が四方から集光
し、視認性が向上するため、光源カバーを用いる従来の
筐体と同等或いはそれ以上の視認性を得ることができる
といった効果を奏する。さらにまた、前記貫通孔は、前
記パネルに対して垂直な面で、かつ前記パネルの外壁面
開口部から内壁面開口部に至る金型接合面により分割可
能であり、該金型接合面で接合する一対の金型により成
型するようにしたので、一対の金型の相対直線運動によ
って成型品が金型から抜ける構造となり、金型の製作コ
ストを抑えることができるといった効果を奏する。
As described above, according to the housing of the present invention, the portion facing the light source is directly covered with the light shielding wall, so that the light source is physically isolated from the space outside the panel and protected. In addition, unlike the conventional case using a light source cover, it is not necessary to weld a transparent or translucent component whose material is different from that of the panel to the opening, and therefore, the manufacturing is very easy and at the same time. In addition, the work load during separation and collection can be reduced, and part of the light emitted from the light source is guided to the outside through a through hole that is directly formed around the light shielding wall in a direction that intersects the optical axis obliquely. Therefore, the light from the light source can be visually recognized by indirect illumination that is gentle on the eyes, and the excellent effect of eliminating the inconvenience that the light from the light source directly enters the eyes of the user to give a stimulus is exerted. Further, the through hole,
A trapezoidal opening is formed in the inner wall surface of the panel that surrounds the direct light-shielding wall, and communicates with the same cross-sectional shape as the opening shape, and opens to the outer wall surface of the panel at a position closer to the optical axis than the inner wall surface of the panel. Therefore, the light incident on the through-hole is parallel to 2
It mainly reflects between the surfaces, and the amount of light decreases each time it is reflected,
When the light is emitted from the through-hole, the intensity of the light can be appropriate for the user, and by forming the through-holes at four locations surrounding the optical axis with the upper side of the trapezoidal opening as the optical axis side. ,
The light derived by reflecting on the inner wall surface of the through hole is condensed from four directions and the visibility is improved. Therefore, it is possible to obtain the visibility equal to or higher than that of the conventional housing using the light source cover. Play. Furthermore, the through-hole is a surface that is perpendicular to the panel, and can be divided by a mold bonding surface that extends from an outer wall surface opening portion of the panel to an inner wall surface opening portion, and the through hole is bonded at the mold bonding surface. Since the molding is performed by the pair of molds, the molded product comes out of the mold by the relative linear motion of the pair of molds, and the effect of reducing the manufacturing cost of the mold can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施の形態による筐体について、電
子機器筐体のLEDカバー部を説明するための正面図で
ある。
FIG. 1 is a front view for explaining an LED cover portion of an electronic device casing of a casing according to an embodiment of the present invention.

【図2】本発明の一実施の形態による筐体について、図
1で示されるA−A線で切断したときの断面図である。
FIG. 2 is a cross-sectional view of the housing according to the embodiment of the present invention, taken along the line AA shown in FIG.

【図3】本発明の一実施の形態による筐体について、電
子機器のパネルの製造に用いる金型構造を説明するため
の部分断面図である。
FIG. 3 is a partial cross-sectional view for explaining a mold structure used for manufacturing a panel of an electronic device in a housing according to an embodiment of the present invention.

【図4】従来の筐体の一例として、電子機器筐体のLE
Dカバー部を説明するための正面図である。
FIG. 4 shows an LE of an electronic device casing as an example of a conventional casing.
It is a front view for explaining a D cover part.

【図5】従来の筐体の一例として、図4で示されるB−
B線で切断したときの断面図である。
FIG. 5 shows an example of a conventional housing, which is B- shown in FIG.
It is sectional drawing when it cut | disconnects by the B line.

【符号の説明】[Explanation of symbols]

101 パネル 101a 貫通孔 101b 遮光壁 102 LED L 光 Ca 金型のキャビティ Ca’ 金型のキャビティの貫通孔成型部 Co 金型のコア Co’ 金型のコアの貫通孔成型部 101 panel 101a through hole 101b light shielding wall 102 LED L light Ca mold cavity Ca 'Mold cavity through-hole molding part Co mold core Co ′ Mold core through-hole molding part

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 光軸に沿って光を照射する光源に対して
離間対向するパネルを備えた筐体であって、前記パネル
が、該光源から照射された前記光軸を中心とする所定径
の光束からなる直接光を遮光する直接光遮光壁と、該直
接光遮光壁の周囲に前記光軸とは斜交する方向に穿設さ
れ、前記光源から照射された前記光束以外の直接光の少
なくとも一部を間接光に変えて外部に導出する貫通孔と
を含むことを特徴とする筐体。
1. A housing provided with a panel facing away from a light source that emits light along an optical axis, wherein the panel has a predetermined diameter centered on the optical axis emitted from the light source. Direct light shielding wall that shields the direct light composed of the light flux, and the direct light shielding wall surrounding the direct light shielding wall is formed in a direction oblique to the optical axis. A housing including: a through hole for converting at least a part of the light into indirect light and leading the light to the outside.
【請求項2】 前記貫通孔は、前記直接光遮光壁を囲繞
するパネル内壁面に台形状に開口しており、かつ該開口
形状と同じ断面形状をもって連通し、前記パネル内壁面
よりも光軸に近い位置でパネル外壁面に開口することを
特徴とする請求項1記載の筐体。
2. The through hole has a trapezoidal opening in a panel inner wall surface surrounding the direct light shielding wall, and communicates with the same cross-sectional shape as the opening shape, and the optical axis is larger than the panel inner wall surface. The housing according to claim 1, wherein the housing is opened to the outer wall surface of the panel at a position close to.
【請求項3】 前記貫通孔は、前記パネルに対して垂直
な面で、かつ前記パネルの外壁面開口部から内壁面開口
部に至る金型接合面により分割可能であり、該金型接合
面で接合する一対の金型により成型することを特徴とす
る請求項1または請求項2記載の筐体。
3. The through hole is a surface perpendicular to the panel, and is divisible by a mold bonding surface extending from an outer wall surface opening portion of the panel to an inner wall surface opening portion of the panel. The housing according to claim 1 or 2, wherein the housing is molded by a pair of dies that are joined together by.
JP02516399A 1999-02-02 1999-02-02 Enclosure Expired - Fee Related JP3514150B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP02516399A JP3514150B2 (en) 1999-02-02 1999-02-02 Enclosure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02516399A JP3514150B2 (en) 1999-02-02 1999-02-02 Enclosure

Publications (2)

Publication Number Publication Date
JP2000222926A JP2000222926A (en) 2000-08-11
JP3514150B2 true JP3514150B2 (en) 2004-03-31

Family

ID=12158356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP02516399A Expired - Fee Related JP3514150B2 (en) 1999-02-02 1999-02-02 Enclosure

Country Status (1)

Country Link
JP (1) JP3514150B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4491540B2 (en) * 2007-07-23 2010-06-30 株式会社オプトデザイン Optical reflector, surface illumination light source device, and surface illumination device
JP5515002B2 (en) * 2009-09-18 2014-06-11 株式会社オプトデザイン Surface illumination light source device and surface illumination device using the surface illumination light source device

Also Published As

Publication number Publication date
JP2000222926A (en) 2000-08-11

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