JP3513770B2 - Electrophotographic photosensitive member substrate surface processing apparatus and surface processing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface processing method for an electrophotographic photosensitive member substrate, and more particularly to a surface processing apparatus and a surface processing method for an electrophotographic photosensitive member substrate made of an aluminum material.

[0002]

2. Description of the Related Art In an electrophotographic copying machine, a digital copier, a laser printer, etc., an electrophotographic photosensitive member having a photosensitive layer provided on a rotating drum-shaped electrophotographic photosensitive member substrate (hereinafter appropriately referred to as "substrate"). Is widely used. Aluminum-based materials are preferably used as the material of the substrate that constitutes such an electrophotographic photosensitive member because of their advantages such as low cost, light weight, and easy processing. The rotary drum-shaped substrate made of this aluminum-based material is generally finished by cutting the surface of a tubular material, and a cutting fluid is usually used during this cutting. This cutting fluid is used for the purpose of cooling action, lubrication action, cleaning action, etc. Specifically, petroleum-based, polybutene-based, kerosene-based,
White kerosene is used. Further, in order to prevent the occurrence of image defects, it is also practiced to clean the surface of the substrate by a contact type cleaning means using a brush, an abrasive or the like after cutting the substrate.

Conventionally, the following techniques have been proposed as specific techniques relating to the method of processing the surface of the electrophotographic photosensitive member substrate.

(1) A technique for processing an electrophotographic photoreceptor substrate by using a cutting oil containing an oiliness improver and / or an extreme pressure additive in an amount of 1.0% by weight or less (JP-A-63-307463).

(2) A technique for finishing the surface of an electrophotographic photoreceptor substrate made of an aluminum alloy containing magnesium, silicon, copper and titanium in a specific range of ratios with a cutting tool having a rounded cutting portion (Japanese Patent Laid-Open Publication No. Sho. 64-86151).

(3) A technique using an electrophotographic photosensitive member substrate made of an aluminum alloy containing silicon and iron in a specific range of ratio (Japanese Patent Laid-Open No. 64-86152).

(4) A technique for finishing the surface of an electrophotographic photoreceptor substrate made of an aluminum alloy containing magnesium, silicon and copper in a specific range by a cutting tool having a rounded cutting portion (JP-A-64- No. 86153).

(5) A technique using an electrophotographic photoreceptor substrate made of an aluminum alloy containing silicon, magnesium and iron in a specific range of ratio (Japanese Patent Laid-Open No. 64-86154).

(6) A technique using an electrophotographic photoreceptor substrate made of an aluminum alloy containing magnesium, silicon, copper and titanium in a specific range of ratio (Japanese Patent Laid-Open No. 64-86155).

(7) A technique of using an electrophotographic photoreceptor substrate made of an aluminum alloy containing silicon, iron and magnesium in a specific ratio and other metals in a specific ratio or less (Japanese Patent Laid-Open No. 1-123245). .

(8) A surface processing apparatus comprising a lathe unit, a high-pressure liquid jet processing unit, and a transfer unit for the electrophotographic photosensitive member substrate, which is capable of continuously and automatically performing lathe processing and high-pressure jet processing. (Japanese Patent Application Laid-Open No. 1-1725
73 publication).

(9) While jetting high-pressure water onto the surface of the electrophotographic photosensitive substrate from the jet holes of the nozzle connected to the high-pressure water supply source, the nozzle is made to scan along the surface of the substrate. A technique for roughening the surface of the substrate to a predetermined surface roughness (Japanese Patent Laid-Open No. 63-264764).

(10) A technique of cutting the surface of an electrophotographic photosensitive member substrate made of an aluminum-based material with a cutting tool made of a polycrystalline diamond sintered body while supplying a cutting liquid made of water to the surface (special feature: Wishhei 2-417448
issue).

(11) The surface of the electrophotographic photosensitive member substrate made of an aluminum-based material is supplied from a polycrystalline diamond sintered body while supplying a cutting liquid made of an aqueous solution of a surfactant or a water-soluble organic solvent. Technology for cutting with a cutting tool (Japanese Patent Application No. 2-417449) (12) While supplying a cutting fluid containing a water-free water-soluble organic solvent to the surface of an electrophotographic photoreceptor substrate made of an aluminum-based material Technology for cutting the surface of diamond with a cutting tool made of polycrystalline diamond sintered body (Japanese Patent Application No. 2-41)
No. 7447).

[0015]

In the prior arts (1) to (8) above, the surface of the substrate made of an aluminum-based material which has been surface-treated with cutting oil has aluminum cutting powder, dust or dust on the surface. There is a case where environmental foreign matter such as rust and rust etc. are firmly adhered to the substrate in a state taken in by the cutting oil, and if this state is left for a long time of, for example, one month or more, especially under high temperature and high humidity in summer. The above-mentioned deposits become more firmly fixed and partial corrosion (rust) occurs on the surface of the substrate, and this corrosion may not be visually recognizable.

Such corrosion may be caused by immersion in an organic solvent or a surfactant solution, ultrasonic cleaning or ultraviolet / O ₃
It cannot be completely removed by non-contact cleaning such as irradiation cleaning. Therefore, if a photosensitive layer is provided on the surface of the substrate where such corrosion exists, an electrophotographic photosensitive member is formed, and image defects occur in the corroded portion. To do.

Partial corrosion on the surface of the substrate can be removed to some extent by contact cleaning the surface of the substrate with a brush or an abrasive, but depending on the aluminum material, the surface of the substrate is rather scratched. Since the thickness of the photosensitive layer formed on the scratched portion, particularly the thickness of the carrier generation layer, is likely to change, the photosensitivity of the photosensitive layer is changed, resulting in a contrast in a halftone image, resulting in an image defect.

Further, in the case of the base body made of an aluminum material surface-treated with cutting oil as in the prior arts (1) to (8), in order to remove the cutting oil sufficiently, the flon 11, 112 is used. , 113 etc. Freon, trichlorethylene, 1,1,
It must be washed with a chlorine-based solvent such as 1-trichloroethane, perchlorethylene, methylene chloride, etc. Therefore, using a large amount of such a solvent will cause ozone layer depletion and carcinogenicity. Therefore, there are problems with environmental pollution and work safety.

Further, in the above technique (9), the surface of the substrate is processed while jetting high-pressure water, but it is difficult to uniformly process the metal surface with only high-pressure water. There's a problem.

The above-mentioned techniques (10) to (12) are techniques developed to solve the above problems. According to them, the image defects are caused by the cutting powder generated during the surface processing of the substrate. , Environmental foreign matters adhere to the substrate surface using cutting oil as a binder, or the cutting oil itself decomposes and firmly adheres,
Furthermore, it has been found that the cause is that the chemical reaction causes strong adhesion. The above techniques (10) to (12) use a cutting fluid composed of water or an aqueous solution of a surfactant or a water-soluble or water-free water-soluble organic solvent instead of the cutting oil. The above problems are solved by cutting with a cutting tool made of a crystal diamond sintered body.

As a method of processing the surface of the electrophotographic photosensitive member base, it is generally known to use a single crystal diamond as a material of the cutting tool and a polycrystalline diamond sintered body. The above techniques (10) to (12) use a polycrystalline diamond sintered body, and the inventors of the present invention have proposed a method for processing a surface of an electrophotographic photoreceptor substrate using single crystal diamond of this technique. After considering the application,
Many scratches were generated on the surface, and the desired substrate surface could not be obtained. This is because in surface processing using a bite made of single crystal diamond, the surface of the substrate is mirror-finished due to the vanishing action of the cutting edge of the bite, so the lubricating action is insufficient with a water-based cutting fluid or a water-soluble organic solvent cutting fluid. Therefore, it is considered that the surface could not be mirror-finished without using the oil-based cutting fluid. Therefore, it is necessary to use an oil-based cutting fluid for the electrophotographic photoreceptor substrate that is surface-treated with a bite made of single crystal diamond. Therefore, as described above, the cutting powder or circulating foreign matter due to the cutting oil on the substrate surface is used. There is a high possibility that image defects may occur due to the sticking of the cutting oil or the sticking of the cutting oil itself.

Therefore, the present inventor has conducted extensive studies on the functions of the cutting fluid in the surface processing of the substrate, the cutting fluid supply method, the cutting fluid supply amount, and the processing conditions such as the bite shape to be used. Using a water-based cutting fluid or a water-free water-soluble organic solvent cutting fluid, or a water-based cutting fluid containing a rust preventive agent or a water-free water-soluble organic solvent cutting fluid, cutting with a bite made of single crystal diamond By doing so, there are few image defects, the subsequent cleaning is easy, and even a small amount of fluorocarbon or chlorine-based solvent can be used, or a small amount even if used, and a technology for providing an electrophotographic photoreceptor substrate of excellent quality Successful development.

Furthermore, the inventors of the present application have proposed the prior art (10).
Since the electrophotographic photosensitive member substrate processed by the method (12) and the above method is easy to clean, after cutting the photosensitive substrate with a machine tool while applying a cutting liquid, it is attached to the same machine tool. To complete the present invention, it was found that by performing cleaning while spraying the cleaning liquid from the nozzle of the cleaning device onto the processed surface, the cleaning which is usually performed in a separate device after the processing step can be omitted or simplified. I arrived.

An object of the present invention is to provide a surface processing apparatus and a surface processing method capable of obtaining an electrophotographic photosensitive member substrate having a surface having good cleaning properties and few image defects with high productivity.

[0025]

This object is achieved by the following technical means a or b.

(A) While supplying a water-based cutting liquid or a water-free water-soluble organic solvent as a cutting liquid to the surface of an electrophotographic photoreceptor substrate made of an aluminum-based material, the surface of the substrate is made of single crystal diamond or polycrystal. A cutting device that performs cutting with a cutting tool made of diamond, moves in the same direction as the cutting tool advances, moves while spraying a cleaning liquid onto the surface of the substrate, and cleans the surface of the substrate on a processing machine. An apparatus for processing a surface of an electrophotographic photosensitive member base, which is provided.

(B) A method of processing a surface of an electrophotographic photosensitive member substrate, which uses the processing apparatus described in item a).

[0028]

[Function] By using a water-based cutting fluid or a water-free water-soluble organic solvent as the cutting fluid, it is possible to effectively prevent aluminum cutting powder, environmental foreign matter such as dust and dust from adhering to and adhering to the substrate surface. . Even if deposits are generated, they do not adhere strongly, so cleaning is easy, and by using a cleaning device installed on the same machine tool that has been used for machining, it has been possible to use conventional methods after the machining process. Since the cleaning performed by the separate cleaning device can be omitted or simplified, the productivity is improved due to a large reduction in the number of cleaning steps. Further, in the surface processing method of the present invention, even in the case where contact cleaning using a brush or an abrasive is performed in the cleaning step performed after processing, since the rubbing force may be small, scratches may occur on the substrate surface. Few.

Moreover, since it is less necessary to use chlorofluorocarbon or a chlorine-based solvent for cleaning, environmental pollution and work safety problems do not occur. Furthermore, since the water-based cutting fluid has a higher cooling effect than the oil-based cutting fluid, the life of the cutting tool can be extended. Examples of the water-based cutting fluid include tap water, water such as ion exchanged water and pure water, an aqueous solution of a surfactant or an aqueous solution of a water-soluble organic solvent, and an aqueous emulsion solution. When water is used as the cutting fluid, the cost of the cutting fluid can be reduced. Also, when an aqueous solution of a surfactant or a water-soluble organic solvent is used as the cutting fluid, a good film is formed by the aqueous solution at the contact interface between the cutting tool and the substrate, so a better lubrication effect is exhibited compared to simple water. To be done. When a water-soluble organic solvent (not containing water) is used as the cutting fluid, it has a higher cooling effect than the water-based cutting fluid, so that the tool life can be extended. When an aqueous emulsion solution is used as the cutting fluid, a good film is formed by the aqueous solution at the contact interface between the cutting tool and the substrate, so that a good lubricating action is exhibited as compared with simple water.

A water-based cutting fluid or a water-soluble organic solvent containing an anticorrosive agent is effective in preventing pitting corrosion of the substrate and rustproofing of the machine tool, and particularly facilitates maintenance of the machine tool. .

[0031] Also, as the cleaning after processing, how we washed while chasing continue to part processing is completed during processing
Is considered, efficiency better quality of cleaning can be achieved.

[0032]

EXAMPLES In the surface processing method of the present invention, a water-based cutting fluid or a water-free water-soluble organic solvent containing aluminum or a rust preventive agent is added to the surface of an electrophotographic photoreceptor substrate made of an aluminum material. The surface of the substrate is finished by cutting with a cutting tool made of single crystal diamond or polycrystalline diamond while supplying a cutting fluid made of.

Aluminum-based materials include A1070, A1100, A3003, A5005, A580 defined by JIS.
5, A6063, etc. are used. The form of the substrate is not particularly limited, and may be in the form of a rotating drum or an endless seat belt.

As the cutting fluid, a water-based cutting fluid or a water-free water-soluble organic solvent or a mixture thereof containing an anticorrosive agent is used. The supply of these cutting fluid to the surface of the substrate is, for example, Fuso Seiki. It is preferable to make it into a mist using "Magic Cut" manufactured by the company. By using these mists, the solid adhesion of cutting powder and environmental foreign matter generated during cutting to the substrate surface is effectively prevented. Further, since cutting powder and the like do not adhere strongly to the surface of the substrate, cleaning is easy. Therefore, not only when cleaning is performed on the machine tool by the processing apparatus of the present invention, but also by a separate apparatus after the processing step. When performing, it is not necessary to use CFCs or chlorine-based solvents, and there is no risk of environmental hygiene. Also,
Even when a contact type cleaning such as a brush is applied in a cleaning process performed by a separate device after the processing process, it is possible to sufficiently clean with a small rubbing force, which causes an image defect on the substrate surface. There is no risk of scratches. Further, even if it is left for a long time, there is no possibility that cutting powder or environmental foreign matter will firmly adhere to the substrate surface.

Specific examples of using only water as the cutting fluid include pure water, ion exchange water, tap water, well water, and mixed water thereof.

From the viewpoint of making water mist exhibit a good buffering effect and preventing pitting corrosion and nodular pitting corrosion caused by the reaction of aluminum and added metal with water mist during surface processing of the substrate, the specific resistance of water mist Is 2 kΩ / cm
~ 10MΩ / cm is preferable, conductivity of water mist is 0.05 ~ 500
μS / cm is preferable, and the electrolyte concentration of water mist is 0.05 to 250
ppm is preferred.

From the viewpoint of preventing nodular pitting corrosion caused by water mist and preventing general corrosion accompanied by needle-like pitting corrosion, the total hardness of water mist is preferably 50 ppm or less, and the chloride ion concentration of water mist is 20 ppm or less. preferable. Particularly, when the total hardness and the chlorine ion concentration are 1: 1, general corrosion is caused and an image defect does not occur, which is preferable.

As another water-based cutting fluid, an aqueous solution of a surfactant or a water-soluble organic solvent is used.

As the surfactant, anionic surfactants such as higher alkyl sulfonate, higher alcohol sulfate ester salt, phosphate ester salt, carboxylate salt, benzalkonium chloride, sabamin type quaternary ammonium salt, Examples thereof include cationic surfactants such as pyridinium salts and amine salts, amphoteric surfactants such as amino acid type and betaine type, nonionic surfactants such as polyethylene glycol type and polyhydric alcohol type.

Examples of water-soluble organic solvents include linear alcohols such as methanol, ethanol and 1-propanol, alcohols such as branched alcohols such as isopropanol, ketones such as acetone and methyl ethyl ketone.

An emulsion aqueous solution is used as the other water-based cutting fluid. Examples of the emulsion aqueous solution include an aqueous solution of polyoxyethers.

A water-soluble organic solvent (not containing water) is used as another cutting fluid. Examples of such water-soluble organic solvent (not containing water) include alcohols such as methanol, ethanol, isopropanol, butanol, acetone,
Examples include ketones such as methyl ethyl ketone.

Furthermore, cutting fluids containing an anticorrosive agent in these cutting fluids are also used. Examples of the rust preventive agent include volatile rust preventive agents such as dicyclohexyl ammonium nitrite and water-soluble rust preventive agents such as sodium nitrite.

As the emulsion aqueous solution containing a rust preventive agent, a cutting oil agent commercially available as a water-soluble cutting oil agent W1 type 3 defined in JIS K2241 can be used.

Here, the supply amount of these cutting fluids is 2 ml / min from the viewpoint of obtaining good cooling action, lubrication action and cleaning action.
The above is preferable. When the supply amount is 2 ml / min or less, the lubricating action becomes insufficient and stick-slip-like scratches occur on the surface of the substrate.

In the present invention, these cutting fluids are used, and as a cutting tool, a polycrystalline diamond sintered body is usually used for roughing and a single crystal diamond or a polycrystalline diamond sintered body is used for finishing. Use a bite. As the cutting tool made of single crystal diamond, either a flat nose or a round nose may be used. In the case of the R shape, it is preferable to use a rounded radius R of the nose of about 10 to 30 mm. As the cutting tool made of a polycrystalline diamond sintered body, either a flat nose shape or a rounded nose shape may be used, but it is preferable to use one having a particle size of about 0.5 μm. Further, the shape is easy to set up. From
It is preferable to use a cutting tool having an R shape and a radius R of roundness of the nose of 20 mm or more. By using a tool with a large radius of nose, the maximum height Rmax within the feed pitch of the cutting tool is reduced, resulting in a smooth shape and a machined surface that is easy to clean. Also, by increasing the radius R of the roundness of the nose, the maximum height
If Rmax is the same, the feed pitch of the cutting tool can be increased, which is also effective for takt time.

Here, the maximum height Rmax is JIS B-0601.
-Measured according to 1982. The measuring instrument used is the "Surface roughness measuring instrument SE-30H" (made by Kosaka Laboratory), which is a stylus type surface roughness measuring instrument specified in JIS B0651.
And the nominal radius of curvature of the tip of the stylus used is 2 μm
Is.

As the conditions of the surface processing, the spindle rotational speed is 2000 to 6000 rpm, the cutting depth is 0.1 to 0.2 mm and the feed pitch is 0.2 mm / rev in the rough processing, and the spindle rotational speed is 2000 to 2000 in the finishing processing. 6000 rpm, depth of cut is 20 μm, and feed pitch is preferably about 0.2 mm / rev for flat-shaped cutting tool and about 0.1 to 0.2 mm / rev for R-shaped cutting tool. In addition,
The main shaft rotation speed cannot be unconditionally specified because it depends on the outer diameter of the tubular base body.

The machine tool that can be used for the surface processing of the substrate is not particularly limited, but examples include a lathe for substrate processing shown in FIG. In FIG. 1, 1 is a drum-shaped substrate, 2 is a magnet base, 3 is a holder, 4 is an atomizer, 5 is a spray nozzle, 6 is a cutting fluid container, 7 is an operating air valve, and 8 is a cutting tool. The members 2 to 7 form a water mist spraying device as shown in the perspective view of FIG. When the operator steps on the operation air valve 7 with air, air is sent to the atomizer 4, and the cutting fluid is sprayed from the spray nozzle 5 of the cutting fluid container 6 in the form of mist on the contact portion between the cutting tool 8 and the base 1. It As a specific example of the cutting liquid spraying device, "Magic Cut" (manufactured by Fuso Seiki Co., Ltd.) can be mentioned.

The surface-treated substrate is then washed, but since the surface of the substrate to which the surface processing apparatus of the present invention and the surface processing method using the same is applied is easy to clean,
Cutting and cleaning were done in the same machine tool. That is, the cleaning apparatus 9 as shown in the side sectional view of FIG. 3 is attached to the substrate processing lathe shown in FIG. 1 by the surface processing of the present invention shown in the side sectional view of FIG. 4 and the partial front view of FIG. It is a device.

The cleaning device 9 includes a pump 61 in the cleaning liquid tank.
The cleaning liquid supplied by means of the upper nozzle 10a is sprayed by the upper nozzle 10a between the main shaft 72 of the lathe and the tailstock (not shown), and is sprayed onto the surface of the photosensitive body 1 which is fixedly attached, and is sucked by the lower nozzle 10b. Then, the liquid is collected from the liquid reservoir 9b into the dust collecting container by a dust collecting pump.

The photoconductor substrate 1 is fitted to the chuck 73 and a chuck mounted on a tailstock (not shown) with an inner diameter, and the tailstock (not shown) is moved hydraulically or pneumatically to the right of the spindle shaft. Fixed and spindle head
The main shaft 71 of 71 and the tailstock on the opposite side are supported by both ends and rotation is transmitted. Then, the cutting amount of the cutting tool 8 attached to the tool rest 80 is determined in the direction perpendicular to the axial direction and is fed in the axial direction of the photoconductor substrate, whereby the outer periphery of the photoconductor substrate 1 is turned.

When turning, the mist of cutting fluid is the tool post.
The surface of the substrate 1 is finished by being supplied to the 80 by the spray nozzle fixed by the magnet base 2, and the cleaning device 9 also fixed to the tool rest 80 at an appropriate interval is set in the advancing direction of the cutting tool 8. It is designed to go in the same direction and wash the area where turning has ended. Then, when the turning is completed, the cleaning is also completed at a fixed interval and a fixed time.

Instead of fixing the cleaning device to the tool rest, it is also possible to provide a moving base that independently moves in the axial direction and fix it on the moving base so that it moves independently of the movement of the tool rest.

The upper nozzle 10a and the lower nozzle 10b are designed to be replaced depending on the outer diameter of the photoconductor substrate 1 by preparing some of them.

Examples of the washing liquid used for washing include not only organic solvents which are usually used, but also pure water and aqueous solutions of nonionic surfactants because the substrate prepared by the processing method of the present invention is easy to wash.

In the substrate whose surface is processed and washed in this way, the adhesion of cutting powder and the like to the substrate surface is sufficiently prevented. Next, the substrate processed by the processing method of the present invention is subjected to a drying process via a cleaning process when cleaning is performed in a separate device, and as the drying means, for example, steam or the like is used.

The electrophotographic photosensitive member substrate surface-treated by the method of the present invention is used for constituting an electrophotographic photosensitive member used in an electrophotographic copying machine, a digital copier, a laser printer, etc. The photoreceptor is constituted by providing an organic photosensitive layer including a carrier generating layer and a carrier transporting layer on the surface of the substrate, for example.

Hereinafter, more specific examples will be described, but the present invention is not limited to these examples.

First, the formation of the base will be described.

Substrate No. 1 According to the following conditions, the surface of the substrate is cut with a cutting tool while supplying a cutting fluid to the surface of the substrate, and further,
It was washed on the processing machine with an aqueous cleaning liquid to obtain a surface-processed electrophotographic photoreceptor substrate. The surface roughness of this substrate was 0.09 μm Rmax.

(1) Substrate A substrate made of an aluminum material having an outer diameter of 80 mm
A rotating drum-shaped substrate made of A5805 (5000 series) made by Nippon Light Metal Co., Ltd. having a length of 360 mm was used. This A5805 is
In addition to aluminum, magnesium is contained in an amount of 0.6 to 1.0% by weight, silicon is 0.06% by weight or less, iron is 0.09% by weight or less, and copper is 0.1% by weight or less.

(2) Cutting fluid Tap water having a specific resistance of 5 kΩ / cm was used.

(3) Supply of cutting fluid It was supplied at 2 ml / min.

(4) Machine tool cutting fluid spraying device shown in FIGS. 4 and 5 equipped with "Magic Cut" (manufactured by Fuso Seiki Co., Ltd.) shown in FIG. 2 and cleaning device 9 shown in FIG. A lathe for substrate processing was used.

(5) In the roughing of the cutting tool, a cutting tool made of a polycrystalline diamond sintered body having a nose R of 3 mm and a grain size of 5 μm was used.

In the finishing process, a cutting tool made of flat single crystal diamond was used.

(6) Machining conditions In rough machining, the spindle speed is 3000 rpm and the feed pitch is 0.2 mm.
/ Rev, the cut was 0.2 mm.

In the finishing process, the spindle speed is 3000 rpm,
The feed pitch was 0.2 mm / rev and the cut was 20 μm.

As the cleaning liquid, a 10 wt% aqueous solution of nonionic surfactant SE 115 manufactured by Sonic Fellow was used, and 3 liters thereof were used.
Cleaning was performed while supplying to the cleaning device 9 at a flow rate of / min.

Substrate Nos. 2 to 7 Electrophotographic photosensitive substrate Nos. 2 to 7 which were surface-treated in the same manner as the substrate No. 1 except for the conditions shown in Table 1 below were obtained. The surface roughness of each of the obtained substrates was as shown in Table 1.

Substrate No. 8 As a comparative example, an electrophotographic photosensitive substrate No. 8 surface-treated in the same manner as the substrate No. 1 except that the cutting fluid supply rate was 1.8 ml / min. The surface roughness of the obtained substrate is 0.20 μm Rm
ax and fine scratches were observed on the surface of the substrate.

Substrate Nos. 9 to 10 As a comparative example, an electrophotographic photoreceptor substrate No. 9 was surface-treated in the same manner as the substrate No. 1 except that the cutting fluid was oil-based "D110" (manufactured by Esso Corporation). Got ~ 10.

Substrate Nos. 11 to 12 As comparative examples, the electrophotographic photoreceptor substrate No. surface-treated in the same manner as the substrate No. 1 except that the cutting fluid was oily "6930 Kai (made by Idemitsu Kosan Co., Ltd.)" I got .11-12.

Table 1 shows the processing conditions of these substrate Nos. 1 to 12 and the results of the finished surface roughness.

[0076]

[Table 1]

Next, the production of a photoconductor for a copying machine will be described.

Using the above electrophotographic photosensitive member substrates Nos. 1 to 12, the undercoat layer, the carrier generating layer, and the
The carrier transport layers were laminated in order to prepare electrophotographic photoreceptors Nos. 1 to 12 each having a function-separated two-layer organic photosensitive layer.

(1) Subbing layer Polyamide resin "X-1874M" (manufactured by Daicel Hüls) was dissolved in methanol / 1-butanol (= 4/1) to obtain a film thickness on an aluminum substrate. An undercoat layer of 0.3 μm was provided.

(2) Carrier generation layer CGM represented by the following chemical structural formula as a charge generation material
-2; 2.5 parts, 1 part of polyvinyl butyral resin "Elex BX-1" (manufactured by Sekisui Chemical Co., Ltd.) as a binder resin was dispersed together with 143 parts of MIPK (methyl isopropyl ketone) using a sand mill, and the coating liquid was uniformly dispersed. Was applied onto the undercoat layer by dip coating to form a carrier generation layer having a film thickness of 0.7 μm.

[0081]

[Chemical 1]

(3) Carrier Transport Layer CTM represented by the following chemical structural formula as a charge transport material
-2; 75 parts and polycarbonate resin "Iupilon Z300"
(Viscosity average molecular weight: 30,000) (Mitsubishi Gas Chemical Co., Ltd.) 100
Part, antioxidant "SANOL LS-2626" (manufactured by Sankyosha) 7
Part and a small amount of silicon oil "KF-54" (manufactured by Shin-Etsu Chemical Co., Ltd.) dissolved in 500 parts of dichloromethane is applied onto the carrier generation layer by dip coating, and after drying, a carrier transport layer having a film thickness of 25 μm is formed. did.

[0083]

[Chemical 2]

As Examples 1 to 7 and Comparative Examples 1 to 5, the electrophotographic photosensitive members Nos. 1 to 12 were used as copying machines Ubix manufactured by Konica Corporation.
It was mounted on U3035, and a live-shooting test was conducted to form an image on A4 size plain paper, and the image quality, black dots, and black streaks were evaluated. The image quality was evaluated as ⊚ when black dots and fog did not occur, ◯ when black dots and slight fog did not occur, and x when black dots and fog occurred.

The results are shown in Table 2.

[0086]

[Table 2]

Next, the production of a photoconductor for a laser printer will be described. Using the electrophotographic photosensitive member substrates Nos. 1 to 12, an undercoat layer, a carrier generating layer, and a carrier transport layer are sequentially laminated in the following manner to form a function-separated two-layer organic photosensitive layer. Electrophotographic photoreceptors Nos. 13 to 24 equipped with were prepared.

(1) Toluene and 2-butanone (MEK) were used as the solvent for coating the undercoat layer, and Elvacs 4260 (ethylene-based copolymer) was used as the binder, after drying on the electrophotographic photoreceptor substrate. An undercoat layer having a thickness of 0.2 μm was provided.

(2) 2-butanone (MEK) was used as the solvent for coating the carrier generating layer, KR-5240 (silicone resin) was used as the binder (solvent), and τ-type metal-free phthalocyanine was used as the carrier generating substance. Adhesion amount after drying on the above subbing layer is 4 mg / dm
^Two carrier generation layers were provided.

(3) Carrier Transport Layer 1,2-Dichloroethane was used as a coating solvent, Iupilon Z-200 (polycarbonate BPZ) was used as a binder, and ED-485 (styryltriphenylamine type) was used as a carrier transport material. Irganox-1010 (pentaerythryl-tetrakis [3- (3,5-di-
-Tert-butyl-4-hydroxyphenyl) propionate]) as a silicone oil, KF-54 (1/10
Diluted solution) was used to provide a carrier transport layer having a thickness of 20 μm after drying on the carrier generation layer.

Examples 8 to 14 and Comparative Examples 6 to 10 The above electrophotographic photosensitive members Nos. 13 to 24 were mounted on a laser printer "LP3115" manufactured by Konica Corporation, and images were printed on A4 size plain paper by a reversal development method. The image quality, the black spots, and the black streaks were evaluated as follows.
The charging voltage was set to V _H = 450 V so that black spots, black streaks, and fogging easily occur. The image quality was evaluated as ⊚ when black spots and fog did not occur, as ◯ when black spots and fog did not occur, and as x when black spots and fog occurred.

The above results are shown in Table 3 below.

[0093]

[Table 3]

Examples 15 to 30 and Comparative Examples 11 to 18 An electrophotographic photosensitive member surface-treated in the same manner as the substrate No. 1 except that the cutting fluid, the material of the cutting tool, and the shape of the cutting tool were changed as shown in Table 4 below. Body substrates No. 13 to 20 were obtained.

Substrates No. 13 to 15 are water-soluble organic solvent aqueous solution, N
o.16 to 17 are examples of surface treatment using a surfactant aqueous solution, and Nos. 18 to 20 are surface treatment using an emulsion aqueous solution as a cutting fluid.

Further, as a comparative example, the electrophotographic photosensitive member surface-treated in the same manner as the substrate No. 1 except that the cutting fluid shown in Table 4 was changed to supply the cutting fluid at 1.8 ml / min. Body substrates No. 21 to 24 were obtained. In the bases Nos. 21 to 24, scratches were observed on the surface of the base as in the case of the base No. 8.

[0097]

[Table 4]

Next, using these electrophotographic photoconductor substrates, photoconductors Nos. 25 to 36 and Nos. 37 to 48 were prepared in the same manner as the photoconductor substrates No. 1 and No. 13, respectively. 5 and Table 6, Examples 15 to 22, Comparative Examples 11 to 14 and Examples 23 to
When 30 and Comparative Examples 15 to 18 were evaluated, the results shown in Tables 5 and 6 were obtained.

[0099]

[Table 5]

[0100]

[Table 6]

Examples 31 to 42 and Comparative Examples 19 to 22 Electrophotographic photosensitive members surface-treated in the same manner as the substrate No. 1 except that the cutting fluid, the material of the cutting tool, and the shape of the cutting tool were changed as shown in Table 7 below. Body substrates No. 25 to 30 were obtained. As a comparative example, the electrophotographic photoreceptor substrate No. surface-treated in the same manner as the substrate No. 1 except that the cutting liquid shown in Table 7 was changed and the cutting liquid supply rate was 1.8 ml / min. I got .31-32. In the case of substrate Nos. 31 to 32, scratches were observed on the surface of the substrate as in substrate No. 8.

[0102]

[Table 7]

Using these electrophotographic photosensitive member substrates, in the same manner as the photosensitive members No. 1 and No. 13, respectively, photosensitive members Nos. 49 to 5 were obtained.
6 and Nos. 57 to 64 were prepared, and as shown in Tables 8 and 9, Examples 31 to 36, Comparative Examples 19 to 20 and Examples 37 to 42, respectively.
When Comparative Examples 21 to 22 were evaluated, the results shown in Table 8 and Table 9 were obtained.

[0104]

[Table 8]

[0105]

[Table 9]

Examples 43 to 74 The cutting liquid was changed to the cutting liquid shown in Table 10 containing 1% by weight of sodium sulfite, which is a water-soluble rust preventive, and the cutting tool material and the cutting tool shape were changed as shown in Table 10. , Electrophotographic photoconductor substrate Nos. 33 to 42 and 45 which are surface-treated in the same manner as the substrate No. 1.
Got ~ 48. In addition, the cutting liquid was changed to a 1 wt% aqueous solution of Yushiroken EZ-20, which is an emulsion aqueous solution containing a rust preventive, and the cutting tool material and cutting tool shape were changed as shown in Table 10. Processed electrophotographic photosensitive member substrates Nos. 43 to 44 were obtained.

[0107]

[Table 10]

Photosensitive members 65 to 80 and No. 81 to 96 were prepared in the same manner as the photosensitive members No. 1 and No. 13, respectively.
When Examples 43 to 58 and Examples 59 to 74 were evaluated as shown in Table 1, the results shown in Table 11 and Table 12 were obtained.

[0109]

[Table 11]

[0110]

[Table 12]

[0111]

Since the cleaning can be completed on the same machine tool immediately after finishing the cutting on the machine tool, the large-scale cleaning step which has been separately provided conventionally can be eliminated or simplified.
Greater productivity and efficiency.

Further, since cleaning is carried out immediately after processing, the adhered substances such as cutting fluid cutting chips can be removed efficiently and easily, and a high-quality photoconductor substrate and a photoconductor based on it can be obtained.

Since cleaning after processing is unnecessary or can be simplified, an electrophotographic photosensitive member substrate having few black spots, black streaks, black stripes, and local fog can be obtained.

Since the cleaning after the processing is easy, it is not necessary to use a CFC or a chlorine-based solvent as the cleaning liquid, the problem of environmental pollution does not occur, and the safety of work is not impaired.

Since the water-based cutting fluid has a higher cooling effect than the oil-based cutting fluid, the life of the cutting tool can be extended.

In particular, when a water-soluble organic solvent (not containing water) is used as the cutting fluid, the cooling action is further enhanced, which is effective for extending the life of the cutting tool.

Further, in the case where a rust preventive agent is added to each of the above cutting agents, the rust preventive agent is contained in addition to the above-mentioned effect, which is effective in preventing pitting corrosion of the substrate after processing. There is.

Further, since the cutting fluid contains a rust preventive agent, the machine tool is prevented from rusting and maintenance is facilitated.

[Brief description of drawings]

FIG. 1 is a side sectional view of a lathe for processing a substrate.

FIG. 2 is a perspective view of a cutting fluid spraying device.

FIG. 3 is a side sectional view of the cleaning device.

FIG. 4 is a side sectional view of a lathe for processing a substrate, which is equipped with a cleaning device.

FIG. 5 is a partial front view of a substrate processing apparatus including a cleaning device.

[Explanation of symbols]

1 base 2 magnet base 3 holder 4 atomizer 5 spray nozzles 6 cutting fluid container 7 Air valve for operation 8 bytes 9 Cleaning device 10a upper nozzle 10b lower nozzle 71 Spindle head 72 Spindle shaft 73 Chuck 80 Turret

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toyoji Ito, 2970 Ishikawa-cho, Hachioji, Tokyo Konica stock company (72) Inventor Takami Hashimoto 2970 Ishikawa-cho, Hachioji, Tokyo Konica stock company (72) ) Inventor Akira Ohira 2970 Ishikawa-cho, Hachioji-shi, Tokyo Konica Co., Ltd. (56) References Japanese Patent Laid-Open No. 4-242748 (JP, A) Actual Development 5-5347 (JP, U) (58) Field (Int.Cl. ⁷ , DB name) B23B 1/00 B23Q 11/00 G03G 5/00 101

Claims (2)

(57) [Claims] 1. A single crystal diamond or a polycrystal diamond is formed on the surface of an electrophotographic photosensitive member substrate made of an aluminum-based material while the surface of the substrate is supplied with a water-based cutting liquid or a water-free water-soluble organic solvent as a cutting liquid. And a cleaning device for cleaning the surface of the substrate on a processing machine by moving the cleaning liquid onto the surface of the substrate while advancing in the same direction as that of the cutting tool. An apparatus for processing a surface of an electrophotographic photoconductor substrate, which is characterized in that 2. A method of processing a surface of an electrophotographic photosensitive member substrate, wherein the processing apparatus according to claim 1 is used.