JP3504453B2 - Power distribution combiner - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power divider / combiner having wide-band frequency characteristics mainly in a microwave band and a millimeter wave band.

[0002]

2. Description of the Related Art FIG. 9 is a block diagram showing a conventional power distribution / combining device shown in, for example, Proceedings C-719 of the 1988 Spring National Convention of the Institute of Electronics, Information and Communication Engineers, and FIG. It is aa 'sectional drawing of a container. It should be noted that FIG. 9 shows a diagram in which the dielectric substrate 1b is removed for the sake of easy understanding of the configuration. In the figure, 1a and 1b are dielectric substrates, 2a and
Reference numeral 2b is a ground conductor pattern formed on the outer surface of the dielectric substrates 1a and 1b (the surface opposite to the facing surfaces of the two dielectric substrates 1a and 1b). 3 is an input line pattern formed on the inner surface of the dielectric substrate 1a (opposing surface of the two dielectric substrates 1a and 1b), and 4a to 4c are output line patterns 5a to 5c formed on the inner surface of the dielectric substrate 1a. Is a taper line type impedance transformer pattern formed on the inner surface of the dielectric substrate 1a, one end of which is connected to the input line pattern 3 at the branch portion 6 and the other end of which is connected to the output line patterns 4a to 4c. The taper line type impedance transformer patterns 5a to 5c have a characteristic impedance Zin of the input line pattern 3 and output line patterns 4a to 4c.
When the characteristic impedance of is Zout,
The impedance on the side of the branch portion 6 is 3Zin and the impedance on the side of the output line patterns 4a to 4c is Zout, and the shapes thereof are designed so as to match such different impedances.

Reference numeral 7a denotes an input terminal connected to the input line pattern 3 at the end of the dielectric substrate 1a, and 7b to 7d denote output line patterns 4a to 4 at the end of the dielectric substrate 1a.
It is a distribution terminal connected to c. Reference numeral 8 denotes an isolation resistance film which is covered with three taper line type impedance transformer patterns 5a to 5c and separates between the output line patterns. The isolation resistance film 8 has three taper line type impedance transformers. Pattern 5a-5c
Is designed to be overlapped with the dielectric substrate 1b, and is sandwiched between the tapered line type impedance transformer patterns 5a to 5c and the dielectric substrate 1b. In this way, by connecting the adjacent taper line type impedance transformer patterns 5a and 5b and the taper line type impedance transformer patterns 5b and 5c by the isolation resistance film 8, the taper line type impedance transformer pattern is formed. It has a circuit configuration in which all of 5a to 5c are connected.

As described above, the dielectric substrates 1a and 1b are
An input line pattern 3, output line patterns 4a to 4c, taper line type impedance transformer patterns 5a to 5c formed between the dielectric substrates 1a and 1b, and a ground provided on the outer surfaces of the dielectric substrates 1a and 1b. Conductor pattern 2a,
The circuit 2b forms a triplate line type circuit.

Next, the operation will be described. First, the case where a high frequency signal is applied to the input terminal 7a will be described. When a high-frequency signal is input from the input terminal 7a, the high-frequency signal is branched into three at the branching portion 6 via the input line pattern 3 and has equal amplitude to the three taper line type impedance transformer patterns 5a to 5c connected in parallel. Is entered. At this time, the taper line type impedance transformer pattern 5a
Since the input impedances of the input line patterns 3 to 5c are 3 Zin, the input line pattern 3 includes three taper line type impedance transformer patterns 5a to 5 connected in parallel.
The impedance seen at c becomes equal to the characteristic impedance Zin of the input line pattern 3, and the high frequency signal is branched into three without reflection. The high frequency signals input to the taper line type impedance transformer patterns 5a to 5c are converted into the characteristic impedances Zout of the output line patterns 4a to 4c, respectively, and the output line patterns 4a to 4c.
4c, is distributed to the distribution terminals 7b to 7d with equal amplitude, and is output.

Since high-frequency signals of equal amplitude and phase are propagated to the three tapered line impedance transformer patterns 5a to 5c, no potential difference occurs between the adjacent tapered line impedance transformer patterns. Therefore, the tapered line type impedance transformer pattern 5a-
The isolation resistance film 8 provided on the upper portion of 5c includes
Tapered line type impedance transformer patterns 5a to 5c
No current flows in the direction orthogonal to, and no power is consumed by the isolation resistance film 8. Since the taper line type impedance transformer patterns 5a to 5c can perform impedance matching over a wide frequency band, power can be distributed without reflection over a wide frequency band.

Next, the case where a high frequency signal is applied to the distribution terminals 7b to 7c will be described. Output line pattern 4a-
When a high-frequency signal of equal amplitude and equal phase is input from the distribution terminals 7b to 7d on the 4c side, the high-frequency signal propagates in the direction opposite to that when the high-frequency signal is applied to the input terminal 7a due to the reversibility of the circuit, All high frequency signals are combined and input terminal 7a
Is output from. At this time, since the high frequency signals propagating through the three taper line type impedance transformer patterns 5a to 5c have the same amplitude and the same phase, the isolation resistance film 8 does not consume power.

Next, a case where a high frequency signal is applied only to the distribution terminal 7b among the distribution terminals 7b to 7d will be described.
When a high frequency signal is input from the distribution terminal 7b, the high frequency signal is fed to the taper line type impedance transformer pattern 5
a is propagated and is transmitted to the branching portion 6, and is input from the branching portion 6 to the input line pattern 3 and other tapered line type impedance transformer patterns 5b and 5c. The high frequency signal input to the input line pattern 3 is output from the input terminal 7a. On the other hand, the high-frequency signal component input to the other taper line type impedance transformer patterns 5b and 5c has a difference in amplitude and phase from the high frequency signal propagating in the taper line type impedance transformer pattern 5a.
Tapered line type impedance transformer patterns 5a to 5c
In the isolation resistance film 8 provided on the upper portion, a current flows in a direction orthogonal to the tapered line type impedance transformer patterns 5a to 5c, and the isolation resistance film 8 absorbs electric power.

The spacing between the three taper line type impedance transformer patterns 5a to 5c and the isolation resistance film 8
If the area resistivity and shape of the are designed optimally, all the high frequency signals applied to the tapered line type impedance transformer patterns 5b and 5c are absorbed by the isolation resistance film 8 and the distribution terminals 7c and 7d have no effect. Is not output. That is, isolation is secured between the distribution terminals connected to the output line patterns 4a to 4c. Normal,
In the power distributor / combiner having an input / output impedance of 50 ohms, the areal resistivity of the isolation resistance film 8 with which good characteristics are obtained is a value of about 500 (ohm / □).

As described above, when a high-frequency signal having a deviation in amplitude or phase is input from each of the distribution terminals 7b to 7d, an imbalance component corresponding to the deviation in amplitude or phase is input to the isolation resistance film 8. The in-phase components are absorbed, combined, and output to the input terminal 7a on the input line pattern 3 side. Although the power distribution combiner having three distribution terminals has been described above, a similar operation principle holds true for a power distribution combiner having two or more distribution terminals.

[0011]

Since the conventional power divider / combiner is constructed as described above, the isolation resistance film 8 is processed into a shape overlapping the tapered line type impedance transformer patterns 5a-5c. However, since it is necessary to perform alignment and sandwich the pattern between the pattern and the dielectric substrate 1b, there is a problem that the assembly process is troublesome and the characteristics of the power distribution combiner vary depending on the assembly method.

An isolation resistance film having a structure different from that of the isolation resistance film 8 shown in FIGS. 9 and 10 can be considered. 11 and 12 are configuration diagrams for explaining a power distribution / combining device configured by using isolation resistance films having such different structures. In the drawings, 9 is a conductor film, 10 is a resistance film, and 11 is a resistance film. It is an isolation resistance film. This isolation resistance film 11 mounting method uses a dielectric substrate with a resistance film in which a resistance film 10 is previously inserted between the dielectric substrate 1a and the conductor film 9 as shown in FIG.
The conductor film 9 and the resistance film 10 are patterned by etching to form an isolation resistance film 11 structure as shown in FIG.

Since a photolithography technique can be used for such a mounting method, the positional relationship between the isolation resistance film 11 and the tapered line type impedance transformer patterns 5a to 5c can be accurately determined. As a result, variations in performance can be suppressed and assembly processing can be facilitated. However, a resistance film having a high sheet resistivity of several hundreds (ohms / square) has a problem in reliability and workability because the film thickness is very thin. Moreover, a dielectric film with a resistance film having such a structure has a problem. Area resistance of the body substrate is 25 (ohm /
Only those having a thickness of about □) are commercially available, and there is a problem that it is difficult to realize good characteristics when using a dielectric substrate with a resistance film having such a thickness.

Further, in the conventional power divider / combiner, since the isolation resistance film 8 exists on the entire surface between the adjacent taper line type impedance transformer patterns, even when a high frequency signal is applied from the input terminal 7a, the taper line type is formed. A part of the current flowing through the impedance transformer patterns 5a to 5c flows in the isolation resistance film 8 in a direction parallel to the taper line type impedance transformer patterns 5a to 5c. There was also a problem that the insertion loss increased.

Further, in the conventional power divider / combiner, the isolation resistance film 8 has only freedom in shape and area resistivity, and the shape is almost determined by the design of the taper line type impedance transformer patterns 5a to 5c. It will be decided. Therefore, in the design of the isolation resistance film 8, the area resistivity of the resistance film is determined so that the best isolation characteristics can be obtained, and there is also a problem that the optimum design is difficult.

The present invention has been made to solve the above problems, and an object thereof is to obtain a power distribution / combining device which is easy to assemble and has a small variation in characteristics and which can be easily optimally designed. And

[0017]

According to a first aspect of the present invention, there is provided a power distributor / combiner comprising: an input line patterned on a dielectric substrate; and a plurality of output lines patterned on the dielectric substrate. A taper line type impedance transformer formed on the dielectric substrate, one end of which is connected to the input line at a branch portion and the other end of which is connected to the output line,
They are arranged in a ladder shape so as to connect adjacent tapered line type impedance transformer, a tapered line type impedance
In a power distribution combiner including a plurality of resistors formed in a direction substantially orthogonal to the length direction of the transformer , the resistors are
It consists of a trip-shaped isolation resistor,
Keep the distance between the isolation resistors close to the output line.
The side is wide, and it becomes narrower as it approaches the bifurcation.
It is obtained by forming.

[0018]

[0019]

[0020]

[0021]

According to a second aspect of the power distribution combiner of the present invention, the resistor is a strip-shaped isolation resistor.
It is made up of chip resistors instead of the body .

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below. Embodiment 1. 1 is a configuration diagram showing a power distribution combiner according to Embodiment 1 of the present invention, and FIG. 2 is a sectional view taken along the line aa 'of the power distribution combiner shown in FIG. It should be noted that FIG. 1 shows a diagram in which the dielectric substrate 1b is removed for the sake of easy understanding of the configuration. In the figure, 1a and 1b are dielectric substrates, 2a and
Reference numeral 2b is a ground conductor pattern formed on the outer surface of the dielectric substrates 1a and 1b (the surface opposite to the facing surfaces of the two dielectric substrates 1a and 1b). 3 is an input line pattern (input line) formed on the inner surface of the dielectric substrate 1a (opposing surface of the two dielectric substrates 1a and 1b), and 4a to 4c are output line patterns formed on the inner surface of the dielectric substrate 1a. (Output lines) 5a to 5c have one end connected to the input line pattern 3 at the branch portion 6 and the other end to the output line patterns 4a to 4c.
It is a taper line type impedance transformer pattern (taper line type impedance transformer) connected to c and formed on the inner surface of the dielectric substrate 1a. When the characteristic impedance of the input line pattern 3 is Zin and the characteristic impedance of the output line patterns 4a to 4c is Zout, the tapered line type impedance transformer patterns 5a to 5c have impedances of 3Zin on the side of the branch portion 6, respectively.
The impedance of the output line patterns 4a to 4c is Zou
t, and its shape is designed to match between these different impedances.

Reference numeral 7a denotes an input terminal connected to the input line pattern 3 at the end of the dielectric substrate 1a, and 7b to 7d denote output line patterns 4a to 4 at the end of the dielectric substrate 1a.
It is a distribution terminal connected to c. Reference numeral 12 is a strip-shaped isolation resistance pattern (resistor, isolation resistor) for separating the output line patterns. The strip-shaped isolation resistance pattern 12 is adjacent to the taper line type impedance transformer pattern 5.
a and 5b and taper line type impedance transformer patterns 5b and 5c are connected to each other at equal intervals in a direction substantially orthogonal to the length direction of the taper line type impedance transformer patterns 5a to 5c ( Like a ladder)
It is provided. This strip-shaped isolation resistance pattern 12 is realized by pattern etching a dielectric substrate with a resistance film having a structure in which the resistance film 10 is inserted in advance between the dielectric substrate 1a and the conductor film 9 as shown in FIG. It Therefore, the photolithography technique can be used, the positional relationship between the strip-shaped isolation resistance pattern 12 and the tapered line type impedance transformer patterns 5a to 5c can be accurately determined, and variation in performance can be suppressed. Assembly processing is also easy.

When a plurality of strip-shaped isolation resistance patterns 12 are thus arranged between the tapered line impedance transformer patterns, as shown in FIG.
When the area resistivity of the resistance film of the strip-shaped isolation resistance pattern 12 is R (ohm / □), the width of the strip-shaped isolation resistance pattern 12 is W, and the interval of the strip-shaped isolation resistance pattern 12 is d, it is approximate. Is equivalent to the case where a full-area resistance film having a sheet resistance R × (W + d) / d (ohm / □) is used. Therefore, by using the resistance film as the slip-like isolation resistance pattern 12, it is possible to approximately increase the area resistivity, and it is also used in a dielectric substrate with a resistance film having a large resistance film thickness and a low area resistivity. can do. The distance d between the strip-shaped isolation resistance patterns 12 is usually formed to be ¼ or less of the wavelength of the high-frequency signal used (input to each of the terminals 7a to 7d). With such an interval, the isolation characteristic of the strip-shaped isolation resistance pattern 12 (separation characteristic between the output line patterns) and the reflection characteristic on the distribution terminals 7b to 7d side become good.

As described above, the dielectric substrates 1a and 1b are
An input line pattern 3, output line patterns 4a to 4c, taper line type impedance transformer patterns 5a to 5c formed between the dielectric substrates 1a and 1b, and a ground provided on the outer surfaces of the dielectric substrates 1a and 1b. Conductor pattern 2a,
The circuit 2b forms a triplate line type circuit.

Next, the operation will be described. First, the case where a high frequency signal is applied to the input terminal 7a will be described. When a high-frequency signal is input from the input terminal 7a, the high-frequency signal is branched into three at the branching portion 6 via the input line pattern 3 and has equal amplitude to the three taper line type impedance transformer patterns 5a to 5c connected in parallel. Is entered. At this time, the taper line type impedance transformer pattern 5a
Since the input impedances of the input line patterns 3 to 5c are 3 Zin, the input line pattern 3 includes three taper line type impedance transformer patterns 5a to 5 connected in parallel.
The impedance seen at c becomes equal to the characteristic impedance Zin of the input line pattern 3, and the high frequency signal is branched into three without reflection. The high frequency signals input to the taper line type impedance transformer patterns 5a to 5c are converted into the characteristic impedances Zout of the output line patterns 4a to 4c, respectively, and the output line patterns 4a to 4c.
4c, is distributed to the distribution terminals 7b to 7d with equal amplitude, and is output.

Since high-frequency signals of equal amplitude and phase are propagated through the three tapered line impedance transformer patterns 5a to 5c, no potential difference occurs between the adjacent tapered line impedance transformer patterns. Therefore, no current flows through the strip-shaped isolation resistance pattern 12 that connects the adjacent taper line type impedance transformer patterns, and no power is consumed by the strip-shaped isolation resistance pattern 12. Also, the tapered line type impedance transformer pattern 5a-
Since the resistance film is not continuous in the length direction (parallel direction) of 5c, the taper line type impedance transformer patterns 5a to 5c like the whole surface resistance film (the conventional isolation resistance film 8 in FIG. 9). A part of the current flowing through the strip-shaped isolation resistance pattern 12 does not flow in parallel with the taper line type impedance transformer patterns 5a to 5c and the power is not consumed.

Since the taper line type impedance transformer patterns 5a to 5c can perform impedance matching over a wide frequency band, power distribution can be performed over a wide frequency band without reflection.

Next, a case where a high frequency signal is applied to the distribution terminals 7b to 7c will be described. Output line pattern 4a-
When a high-frequency signal of equal amplitude and equal phase is input from the distribution terminals 7b to 7d on the 4c side, the high-frequency signal propagates in the direction opposite to that when the high-frequency signal is applied to the input terminal 7a due to the reversibility of the circuit, All high frequency signals are combined and input terminal 7a
Is output from. At this time, since the high-frequency signals propagating through the three taper line type impedance transformer patterns 5a to 5c have the same amplitude and the same phase, no current flows in the isolation resistance pattern 12, and the strip-shaped isolation resistance pattern is formed. At 12, no power is consumed.
Also, the tapered line type impedance transformer pattern 5a
Since the resistance film is not continuous in the length direction (parallel direction) of 5a to 5c, a part of the current flowing through the tapered line impedance transformer patterns 5a to 5c flows in the strip isolation resistance pattern 12. No power is consumed.

Next, a case where a high frequency signal is applied only to the distribution terminal 7b among the distribution terminals 7b to 7d will be described.
When a high frequency signal is input from the distribution terminal 7b, the high frequency signal is fed to the taper line type impedance transformer pattern 5
a is propagated and is transmitted to the branching portion 6, and is input from the branching portion 6 to the input line pattern 3 and other tapered line type impedance transformer patterns 5b and 5c. The high frequency signal input to the input line pattern 3 is output from the input terminal 7a. On the other hand, the high-frequency signal component input to the other taper line type impedance transformer patterns 5b and 5c has a difference in amplitude and phase from the high frequency signal propagating in the taper line type impedance transformer pattern 5a.
In the strip-shaped isolation resistance pattern 12 that connects between the adjacent taper line-type impedance transformer patterns, a current flows in a direction orthogonal to the taper-line-type impedance transformer patterns 5a to 5c, and Electric power is absorbed.

If the intervals between the three taper line type impedance transformer patterns 5a to 5c and the area resistivity and shape of the strip-shaped isolation resistance pattern 12 are optimally designed, the taper line type impedance transformer pattern 5b is formed. , 5c are absorbed by the strip-shaped isolation resistance pattern 12, and nothing is output to the distribution terminals 7c and 7d. That is, isolation is ensured between the distribution terminals connected to the output line patterns 4a to 4c. Also, in the design of the strip-shaped isolation resistance pattern 12, the approximate area resistivity can be changed by changing the width and the interval of the strip-shaped isolation resistance pattern 12, so that the best isolation characteristics can be obtained. The optimum design as described above can be easily performed.

As described above, according to the first embodiment, since a plurality of strip-shaped isolation resistance patterns 12 are formed as the isolation resistance, the area resistivity is equivalently obtained even when the resistance resistivity of the resistive film is low. It is possible to use a commercially available dielectric substrate with a resistance film, which has good isolation characteristics as when a high resistance film with high resistance is placed between the tapered line type impedance transformer patterns and has a thick resistance film. it can.

Further, when such a strip-shaped isolation resistance pattern 12 is used, the resistance film does not continuously exist in the direction (parallel direction) along the taper line type impedance transformer patterns 5a to 5c. ,
Unlike the case of the full-surface resistance film, the current does not flow along the tapered line type impedance transformer patterns 5a to 5c to consume the power, and the insertion loss of the power distribution / combining circuit can be reduced.

In the first embodiment described above, the power distribution combiner having three distribution terminals has been described, but the present invention is not limited to this, and any power distribution combiner having two or more distribution terminals may be used. Similarly, good isolation characteristics can be obtained, a commercially available dielectric substrate with a resistance film can be used, and the insertion loss of the power distribution / combining circuit can be reduced. For example, FIG. 4 is a configuration diagram showing a power distribution combiner having two distribution terminals, and such a power distribution combiner has the same effect.

Embodiment 2. FIG. 5 is a configuration diagram showing a power distribution / combining device according to a second embodiment of the present invention. In order to make the configuration easy to understand, an input terminal 7a and a distribution terminal 7b,
7c (connector thereof) is omitted, and a power distribution / combiner having two distribution terminals is shown. In the figure, 13 is a strip-shaped isolation resistance pattern (resistor, isolation resistor) that separates the output line patterns 4a and 4b. The strip-shaped isolation resistance pattern 13 is formed on the output line patterns 4a and 4b. The space on the near side is wide, and the space is narrowed toward the branch portion 6. Other points are the same as those of the strip-shaped isolation resistance pattern 12 shown in the first embodiment. In addition, in FIG.
The parts denoted by the same reference numerals as are the same or corresponding parts, and the duplicate description thereof will be omitted.

As described above, the distance between the strip-shaped isolation resistance patterns 13 is set to the output line pattern 4a,
The output line pattern 4 is formed such that the side close to 4b is wide and the side close to the branch 6 is narrower.
The area resistance is high on the side close to a and 4b, and is equivalent to the case of using a full-surface resistance film whose area resistance decreases as it approaches the input line pattern 3 side. Normally, the distribution terminals 7b, 7
When a high-frequency signal is input from the c side, if incident on the taper line type impedance transformer patterns 5a and 5b and an isolation resistor having a low resistance value is connected immediately, reflection occurs due to impedance mismatch. Therefore, if the resistance values (area resistivity) are distributed so that the distribution terminals 7b and 7c are sufficiently high and become lower toward the input terminals, the reflection characteristics of the distribution terminals 7b and 7c can be improved. You can

As described above, according to the second embodiment, the distance between the strip-shaped isolation resistance patterns 13 is widened on the side close to the output line patterns 4a and 4b.
Since it is formed so as to become narrower as it approaches the branch portion 6, the area resistivity of the overall resistance film is equivalently equivalent to that of the distribution terminal 7b,
It is possible to make the value 7c higher and decrease the value closer to the input line pattern 3 side, and it is possible to improve the reflection characteristics on the distribution terminals 7b and 7c side.

Embodiment 3. 6 is a block diagram showing a power distribution / combining device according to a third embodiment of the present invention. In order to make the structure easy to understand, an input terminal 7a and a distribution terminal 7b,
7c (connector thereof) is omitted, and a power distribution / combiner having two distribution terminals is shown. In the figure, 14 is a strip-shaped isolation resistance pattern (resistor, isolation resistor) for separating the output line patterns 4a and 4b. The width of the strip-shaped isolation resistance pattern 14 is equal to the width of the output line patterns 4a and 4b. It is configured such that the side closer to 4b is narrower and the closer it is to the branch portion 6, the wider. Other points are the same as those of the strip-shaped isolation resistance pattern 12 shown in the first embodiment. Incidentally, in FIG. 6, the portions denoted by the same reference numerals as those in FIG. 1 are the same or corresponding portions,
The duplicate description will be omitted.

As described above, the width of the strip-shaped isolation resistance pattern 14 is set to the output line patterns 4a, 4
By forming so that the side closer to b is narrower and the width is wider as it approaches the branching portion 6, the area resistivity is closer to the output line patterns 4a and 4b, as in the strip-shaped isolation resistance pattern 13 shown in FIG. This is equivalent to the case of using a full-surface resistance film that is high and the area resistivity decreases as it approaches the input line pattern 3 side. Therefore, by designing the resistance values (area resistivity) to be distributed so that the distribution terminals 7b and 7c are sufficiently high and become lower toward the input terminals, the reflection characteristics on the distribution terminals 7b and 7c side can be improved. can do.

As described above, according to the third embodiment, the width of the strip-shaped isolation resistance pattern 14 is made narrower on the side closer to the output line patterns 4a and 4b and wider as it approaches the branch portion 6. Because it was formed
Equivalently, the sheet resistance of the entire surface resistance film is the distribution terminals 7b, 7c.
The side can be made higher and the value can be made lower as it gets closer to the input line pattern 3 side, and there is an effect that the reflection characteristics on the side of the distribution terminals 7b, 7c can be improved.

Fourth Embodiment FIG. 7 is a configuration diagram showing a power distribution combiner according to a fourth embodiment of the present invention. In order to make the configuration easy to understand, an input terminal 7a and a distribution terminal 7b,
7c (connector thereof) is omitted, and a power distribution / combiner having two distribution terminals is shown. In the figure, 5a1, 5
b1 has one end connected to the input line pattern 3 at the branch portion 6 and the other end connected to the output line patterns 4a and 4b. The taper line type impedance transformer pattern (tapered line) formed on the inner surface of the dielectric substrate 1a. The tapered line impedance transformer patterns 5a1 and 5b1 are arranged in parallel so that the distance between the two tapered line impedance transformer patterns 5a1 and 5b1 is substantially constant. 15 is 2
Taper line type impedance transformer pattern 5a
Chip resistors (resistors), which are attached at equal intervals by soldering or the like so as to connect between 1 and 5b1, separate the output line patterns. In FIG. 7, the parts denoted by the same reference numerals as those in FIG. 1 are the same or corresponding parts, and the duplicated description thereof will be omitted.

In the first to third embodiments described above, the strip-shaped isolation resistance patterns 12, 13 and 14 are used as the isolation resistance, but in the fourth embodiment, the chip resistance 15 is used. It is a thing. The chip resistor 15 has various resistance values, and also has a higher power resistance than the strip-shaped isolation resistance patterns 12, 13, 14 using a resistance film. Therefore, according to the fourth embodiment, since the chip resistor 15 having an arbitrary resistance value can be selected, the degree of freedom in design can be increased, the optimum design can be performed, and the chip resistor with high power resistance can be obtained. Since 15 can be used, there is an effect that it is possible to perform distribution and combination of higher power.

Embodiment 5. FIG. 8 is a configuration diagram showing a power distribution / combining device according to a fifth embodiment of the present invention. In order to make the configuration easy to understand, an input terminal 7a and a distribution terminal 7b,
7c (connector thereof) is omitted, and a power distribution / combiner having two distribution terminals is shown. Note that, in FIG. 8, the portions denoted by the same reference numerals as those in FIG.

In the fourth embodiment, the chip resistors 15 are attached at equal intervals, but in the fifth embodiment,
The chip resistor 15 is attached such that the distance between the output line patterns 4a and 4b is large and the distance becomes narrower as it approaches the branch portion 6. Other points are the same as those of the chip resistor 15 shown in the fourth embodiment. Therefore, according to the fifth embodiment, since the interval between the chip resistors 15 is changed depending on the location, even if a chip resistor 15 having a commercially available standard resistance value is used, an arbitrary resistance value distribution can be equivalently obtained. Therefore, the optimum isolation characteristics can be obtained, and the optimum design of the power distribution combiner can be easily performed. Also, chip resistance 1
As if 5 were installed at equal intervals, the chip resistor 15
The effect that the reflected wave generated by the discontinuous structure of the connection part of the above does not become out of phase at a specific frequency, and the reflection characteristic of the power distribution combiner viewed from the input terminal 7a and the distribution terminals 7b and 7c can be improved. Play.

[0046]

As described above, according to the first aspect of the invention, the input line patterned on the dielectric substrate,
A plurality of output lines patterned on the dielectric substrate; and an impedance formed on the dielectric substrate, one end of which is connected to the input line at a branch portion and the other end of which is connected to the output line. a tapered line type impedance transformer matching, are arranged in a ladder shape so as to connect adjacent tapered line type impedance transformer, a tapered line type b
Formed in a direction substantially orthogonal to the length direction of the impedance transformer
In a power divider / combiner with multiple resistors
The resistor into a strip-shaped isolation resistor.
The isolation resistor spacing is
The side close to the force line is wide, and becomes narrower as it approaches the bifurcation.
Since it is configured to so that to form a so that a good, such as when a high entire resistive membrane area resistivity of equivalently sheet resistivity or low resistive film was disposed between the tapered line type impedance transformer It is effective in obtaining isolation characteristics. Moreover, since the resistance film does not continuously exist in the direction (parallel direction) along the taper line type impedance transformer, current flows along the taper line type impedance transformer as in the case of the full resistance film. Power is no longer consumed, and the insertion loss of the power distribution / combining circuit can be reduced. Especially on the side close to the output line
Is wide and narrows as it approaches the bifurcation.
Since the interval between the resistance resistors is formed,
The sheet resistance film has a higher sheet resistivity on the distribution terminal side and the input terminal side
The distribution terminals can be lowered as they get closer to
There is an effect that the reflection characteristics on the side can be improved. Well
In addition, it is possible to use photolithography technology.
Isolation resistor and taper line type impeder
It is possible to accurately determine the positional relationship between the transformers.
It suppresses variations in performance and facilitates assembly processing.
There is an effect.

[0047]

[0048]

[0049]

[0050]

According to the invention of claim 2 , the resistor
Instead of a strip-shaped isolation resistor
Since it is composed of chip resistors, it is possible to equivalently obtain an arbitrary resistance value distribution even when using a commercially available standard resistance value as the chip resistor, and obtain the optimum isolation characteristics. There is an effect that the optimum design of can be easily performed. Also, as when the chip resistors are attached at equal intervals, the reflected waves generated by the discontinuous structure of the connection part of the chip resistors will not be out of phase at a specific frequency, and the power distribution seen from the input terminals and distribution terminals There is an effect that the reflection characteristic of the combiner can be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a power distribution combiner according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line aa ′ of the power distribution combiner shown in FIG.

FIG. 3 is a diagram for explaining that a plurality of strip-shaped isolation resistance patterns and a full-surface resistance pattern are approximately equivalent.

FIG. 4 is a configuration diagram showing a power distribution combiner having two distribution terminals.

FIG. 5 is a configuration diagram showing a power distribution combiner according to a second embodiment of the present invention.

FIG. 6 is a configuration diagram showing a power distribution combiner according to a third embodiment of the present invention.

FIG. 7 is a configuration diagram showing a power distribution combiner according to a fourth embodiment of the present invention.

FIG. 8 is a configuration diagram showing a power distribution combiner according to a fifth embodiment of the present invention.

FIG. 9 is a configuration diagram showing a conventional power distribution combiner.

10 is a sectional view taken along the line aa 'of the power distribution combiner shown in FIG.

FIG. 11 is a configuration diagram for explaining a power distribution / combining device configured by using an isolation resistance film having a structure different from that of the isolation resistance film shown in FIGS. 9 and 10;

12 is a configuration diagram for explaining a power distribution / combining device configured by using an isolation resistance film having a different structure from the isolation resistance film shown in FIGS. 9 and 10. FIG.

[Explanation of symbols]

1a, 1b Dielectric substrate, 3 Input line pattern (input line), 4a, 4b, 4c Output line pattern (output line), 5a, 5b, 5c, 5a1, 5b1 Tapered line type impedance transformer pattern (Tapered line type impedance) Transformer), 6 branches, 12, 13, 14 strip-shaped isolation resistance patterns (resistors, isolation resistors), 15 chip resistors (resistors).

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-142201 (JP, A) JP-A-7-321515 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01P 5/19

Claims (2)

(57) [Claims] 1. An input line patterned on a dielectric substrate, a plurality of output lines patterned on the dielectric substrate, and an output line formed on the dielectric substrate, one end of which branches from the input line. are connected by section, the other end is arranged in a ladder shape so as to connect the connected tapered line type impedance transformer and the output line, the tapered line type impedance transformer adjacent the tapered line type impedance
A power distribution combiner comprising a plurality of resistors formed in a direction substantially orthogonal to the length direction of the transformer, wherein the resistors are
Is composed of strip-shaped isolation resistors
The isolation resistor spacing above the output line
The side near the road is wide, and the width becomes narrower as it approaches the above branch.
An electric power distribution / combining device, which is characterized in that 2. The resistor is a strip-shaped isolator.
2. The power distributor / combiner according to claim 1 , wherein the resistor is a chip resistor instead of the resistor .