JP3475345B2 - Wire plating method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for plating a wire, such as an iron wire or a steel wire, in a safe and efficient manner. 2. Description of the Related Art When hot dip galvanizing an iron wire, the following steps are performed as a continuous operation. <1> Cleaning step The wire is cleaned to remove the lubricant, oil, and other dirt used during the wire drawing operation. As a cleaning method, the wire is continuously supplied into a cleaning tank containing an aqueous solution of an alkali such as caustic alkali or sodium orthosilicate for cleaning. Thereafter, the wire is sufficiently washed with water to remove the alkaline aqueous solution. <2> Annealing process Next, the wire is guided into a heating furnace at a furnace temperature of about 700 degrees Celsius,
After heating for a few minutes, cool with water. An oxide film is formed on the surface of the wire by annealing. <3> Pickling / Washing Step In order to remove an oxide film on the surface of the wire, the wire is continuously supplied into a hydrochloric acid tank and the wire is pickled. After passing through the hydrochloric acid tank, the wire is thoroughly washed with water and neutralized. Washing is performed with a water shower or an overflowing washing tank or hot water washing tank. <4> Flux treatment step In order to further clean the surface of the wire, the wire is immersed in a flux tank containing a flux aqueous solution to form a flux coating on the wire surface. The wire that has passed through the flux tank is dried to improve the adhesion of the flux. <5> Drying Step The wire rod that has passed through the flux tank is dried to improve the adhesion of the flux. Thus, the pretreatment for plating is completed. <6> Plating Step Next, a wire layer is immersed in a plating bath to form an alloy (plating) coating layer on the wire surface while eliminating the flux coating on the wire surface. <7> Cooling / winding process The plated wire passed through the plating tank is washed with water, washed and cooled, and then wound. [0003] The above-mentioned conventional wire plating technique has the following problems. <B> There are many washing steps in the whole process, and a large amount of water is required. Particularly in the step of washing with water immediately after passing through the pickling step, it is necessary to keep supplying approximately the same amount of water as the passing wire. <B> The water used for washing contains harmful substances. Therefore, it is necessary to install a large-scale wastewater treatment facility to treat a large amount of collected wastewater. <C> Since many steps are required until plating is completed, the line becomes long and a large installation space is required. The present invention has been made to solve the above problems, and an object of the present invention is to provide the following wire plating technology. Wire plating technology that can significantly reduce water consumption. Wire plating technology that can reduce the number of processes and shorten the process line. Wire plating technology that can avoid pollution problems. [0005] The present invention relates to a method for plating a wire, which comprises forming a plating film on the surface of a cleaned wire.
A first step of degreasing the wire, and a second step of annealing the degreased wire in a non-oxidizing environment filled with an inert gas;
A third method for guiding a wire maintained at a high temperature of 200 ° C. to 700 ° C. to a flux bath to remove and clean an oxide film on the surface of the wire and to form a flux film on the surface of the cleaned wire.
And a fourth step of forming a plating film on the surface of the wire by guiding the wire into a plating bath. Embodiment 1 of the present invention will be described below with reference to the drawings. <1> Degreasing Step FIG. 1 shows a step diagram of the plating method according to the present invention. The wire 2 pulled out from the swift 1 is mechanically washed and degreased.
As a degreasing means, the rotary brush 3 removes lubricant, oil, and other stains adhering to the peripheral surface of the wire 2. <2> Annealing Step Next, the wire 2 is supplied into an annealing furnace 4 and annealed in a non-oxidizing atmosphere. As a method of annealing in a non-oxidizing atmosphere, for example, as shown in the drawing, a tube 5 for inserting a wire is placed in an annealing furnace 4 and an inert gas 6 is filled in the tube 5 heated to a high temperature. Under the atmosphere
A method of passing the wire 2 can be adopted. As the inert gas 6, hydrogen gas, nitrogen gas, water vapor, liquefied gas or the like can be used. The reason for performing the annealing is to recover the distortion of the wire 2. <3> Flux Treatment Step In the conventional plating treatment step, an acid pickling step and a water washing step had to be performed between the annealing step and the flux treatment step. In the present invention, the wire 2 at a high temperature (about 200 ° C. to 700 ° C.) is immediately immersed in the flux tank 7 through an annealing step. By guiding the wire 2 to the flux tank 7 at a high temperature, the oxide film on the surface of the wire 2 formed by annealing is removed, and the dirt on the exposed surface of the wire 2 is removed cleanly. The flux coating 8 is formed on the surface of the wire 2 that has been cleaned in this way. FIG. 2 is an enlarged view of the flux coating 8 formed on the surface of the wire 2. In addition, the adhesion of flux
Since the wire 2 is guided to the flux tank 7 at a high temperature as in the present invention, the adherence of the flux is extremely improved. As the flux, for example, ammonium chloride, zinc ammonium chloride, a mixture thereof, or a fluorine-based flux can be used.
Is desirable. <4> Plating Step After the wire 2 passing through the flux tank 7 and having the flux coating 8 formed thereon is continuously dried, the wire 2 is passed through the plating tank 9.
The plating tank 9 is a well-known galvanizing tank and reacts in hot-dip plating at 430 to 470 ° C. to form a plating film 10 shown in FIG. The disappearance of the flux coating 8 (FIG. 2) prior to the plating coating 10 is the same as in the conventional case. The wire 2 taken out of the plating tank 9 is washed, dried, and continuously wound. Second Embodiment In the first embodiment described above, the case where a mechanical cleaning means is employed as the degreasing means has been described. However, the same electrolytic cleaning means as the conventional one is applied as the degreasing means. Of course, it may be possible. As described above, the present invention has the following effects. <B> Until now, many steps (an acid pickling step, a water washing step, and a neutralizing step) had to be performed from the annealing step to the flux treatment step. On the other hand, in the present invention, by shifting the wire rod after the annealing step to the flux treatment step while maintaining the high temperature state,
The surface of the wire can be cleaned to form a highly adherent flux coating. Therefore, a series of pickling, water washing, and neutralization steps in the conventional method can be omitted, and the number of steps can be greatly reduced. <B> With a significant reduction in the number of processes, the process line length can be shortened. Therefore, there is no need to secure a vast land for the installation of the process line, and plating can be performed even on a small land. <C> Since no harmful acid is used, the working environment is good. <D> Since there is no washing step immediately after pickling, which consumes a large amount of water, the amount of water consumption can be significantly reduced, and the conventional pollution control equipment is not required. <E> There is no risk of adversely affecting the workers and the surrounding environment, and plating can be performed with low pollution.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a conceptual diagram of a plating process according to the present invention. FIG. 2 is an enlarged cross-sectional view of a surface portion of a wire on which a flux film is formed. FIG. 3 is a view of a surface portion of a wire on which a plating film is formed. Enlarged sectional view [Explanation of reference numerals] 1 ... Swift, 2 ... Wire, 3 ... Rotating brush, 4 ... Annealing furnace, 5 ... Cylinder in annealing furnace, 6 ... Inert gas 7 ... Flux Tank, 8: flux coating, 9: plating tank, 10: plating coating.

Continuing on the front page (72) Inventor Tsuyoshi Sugawara 4-17-14 Shiratori, Katsushika-ku, Tokyo Inside Koiwa Wire Mesh Co., Ltd. (72) Inventor Takashi Taniguchi 4-17-14 Shiratori, Katsushika-ku, Tokyo Inside Koiwa Wire Mesh Co., Ltd. (56 References JP-A-61-210168 (JP, A) JP-A-53-89834 (JP, A) JP-B-50-29429 (JP, B1) JP-B-42-22842 (JP, B1) (58) Field surveyed (Int. Cl. ⁷ , DB name) C23C 2/00-2/40

Claims (1)

(57) [Claims] [Claim 1] In a plating method of a wire for forming a plating film on the surface of a washed wire, a first step of degreasing the wire, and filling the degreased wire with an inert gas. A second step of annealing in a non-oxidizing environment; and guiding the wire maintained at a high temperature of 200 ° C. to 700 ° C. to a flux tank to remove an oxide film on the surface of the wire and to clean the wire. Forming the third
And a fourth step of guiding the wire into a plating bath to form a plating film on the surface of the wire.